WO2013191026A1 - Printed circuit board, and manufacturing device and manufacturing method therefor - Google Patents

Printed circuit board, and manufacturing device and manufacturing method therefor Download PDF

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Publication number
WO2013191026A1
WO2013191026A1 PCT/JP2013/066018 JP2013066018W WO2013191026A1 WO 2013191026 A1 WO2013191026 A1 WO 2013191026A1 JP 2013066018 W JP2013066018 W JP 2013066018W WO 2013191026 A1 WO2013191026 A1 WO 2013191026A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
pattern
plating
pressure
Prior art date
Application number
PCT/JP2013/066018
Other languages
French (fr)
Japanese (ja)
Inventor
重田　龍男
Original Assignee
株式会社シンク・ラボラトリー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社シンク・ラボラトリー filed Critical 株式会社シンク・ラボラトリー
Priority to KR1020147022616A priority Critical patent/KR101603964B1/en
Priority to JP2014521330A priority patent/JPWO2013191026A1/en
Priority to CN201380011045.2A priority patent/CN104137657A/en
Publication of WO2013191026A1 publication Critical patent/WO2013191026A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier

Definitions

  • the present invention relates to a printed circuit board, particularly a double-sided printed circuit board, a manufacturing apparatus suitable for manufacturing the same, and a manufacturing method.
  • any circuit pattern forming method is based on etching and plating. . That is, both of them are appropriately used to meet various required properties and economic conditions of the substrate (Patent Documents 2 to 4).
  • Patent Documents 2 to 4 the quality of the circuit pattern is determined by the quality of the etching, and it is necessary to perform very precise etching, which requires time and cost for the etching. It was a thing. Therefore, there is a need for a circuit pattern forming method that forms a circuit pattern only by plating and does not require etching.
  • a printed circuit board manufacturing apparatus and method that does not require etching by patterning only by plating have been developed. There is no current situation.
  • the double-sided printed circuit board manufacturing apparatus of the present invention is A first plating unit including a first plating tank containing a plating solution; A first DLC pattern belt that is dipped in the plating solution of the first plating tank to form a first circuit pattern plating layer on the surface thereof and is rotatably provided; A first pattern belt rotating means including a first pressure transfer roller for rotating the first DLC pattern belt and pressure-transferring the first circuit pattern plating layer on one surface of a printed circuit board substrate; A first pattern belt plating mechanism having: A second plating unit containing a plating solution and including a second plating tank installed at a predetermined interval from the first plating tank; A second DLC pattern belt that is dipped in the plating solution of the second plating tank and has a second circuit pattern plating layer formed on the surface thereof, and is rotatably provided; A second pressure-transfer roller that rotates the second DLC pattern belt and faces the first pressure-transfer transfer roller, and that pressure-transfers the second circuit
  • the substrate for substrate is supplied, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the substrate for printed circuit board by the first and second pressure transfer rollers.
  • a double-sided printed circuit board is formed by pressure transfer onto both sides, and the double-sided printed circuit board on which the circuit pattern is formed is stored by the printed circuit board forming and storing mechanism.
  • the first and second plating units are subjected to a pretreatment that is immersed in a release agent and then washed with water. It is preferable that the first and second release treatment agent tanks containing the release treatment agent and the first and second water tanks for washing with water are respectively installed in front of the first and second plating tanks.
  • the double-sided printed circuit board of the present invention is a double-sided printed circuit board manufactured using the apparatus of the present invention, Forming first and second circuit pattern plating layers on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms;
  • the printed circuit board base material is supplied between first and second pressure transfer rollers, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the first and second circuit pattern plating layers. It is manufactured by pressure-transferring both surfaces of the substrate for a printed circuit board with a second pressure-transfer roller.
  • a pretreatment for immersing in a mold release treatment agent is performed, and then, in order to perform washing with water, a mold release treatment agent is stored in the plating unit before the plating tank. It is preferable to install a mold treatment agent tank and a water tank for washing with water.
  • the substrate for a printed circuit board is coated with an ultraviolet curable adhesive on one surface, and an ultraviolet irradiation device is provided between the pressure-transfer transfer roller and the printed circuit board storage mechanism, and the printed circuit board substrate After the circuit pattern plating layer is pressure-transferred and transferred onto one surface of the material via the ultraviolet curable adhesive, the ultraviolet curable adhesive is cured by irradiating ultraviolet rays with the ultraviolet irradiation device, and the circuit pattern plating is performed. It is preferable to form the printed circuit board by firmly bonding the layers.
  • the printed circuit board manufacturing method of the present invention is a method using the printed circuit board manufacturing apparatus of the present invention, Forming a circuit pattern plating layer on the surface of the DLC pattern belt by the pattern belt plating mechanism;
  • the printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller.
  • Forming a printed circuit board by crimping and transferring to one side of the material It is characterized by having.
  • the printed circuit board of the present invention is a printed circuit board manufactured using the apparatus of the present invention, A circuit pattern plating layer is formed on the surface of the DLC pattern belt by the pattern belt plating mechanism, The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. It was manufactured by crimping and transferring to one side of the material.
  • FIG. 2 is a schematic explanatory view showing a procedure for forming a circuit pattern on a printed circuit board using a first DLC pattern belt, where (a) shows a state in which a plating solution is accommodated in a recess of the DLC pattern belt, and (b) shows a formation in the recess of the DLC pattern belt. A state in which the plated layer is transferred onto the printed circuit board substrate and (c) shows a state in which the printed circuit board is manufactured by transferring the circuit pattern plating layer onto the printed circuit board substrate. It is an explanatory drawing of the principal part which shows the overflow part of a plating tank.
  • FIG. 4C is a cross-sectional view of a main part in a state in which a resist pattern is formed
  • 5C is a cross-sectional view of a main part in a state in which a DLC coating film is formed on the surface of the pattern belt substrate and the resist pattern, It is principal part sectional drawing which shows the state which removed the DLC coating film of the pattern surface and made the DLC pattern remain on the pattern belt base material. It is a flowchart which shows the manufacturing process of a DLC pattern belt.
  • reference numeral 10 denotes a double-sided printed circuit board manufacturing apparatus according to the present invention, which includes a first pattern belt plating mechanism 12A, a second pattern belt plating mechanism 12B, and a printed circuit board formation storage mechanism 14 that are installed opposite to each other.
  • first pattern belt plating mechanism 12A a first pattern belt plating mechanism 12A
  • second pattern belt plating mechanism 12B a second pattern belt plating mechanism 12B
  • printed circuit board formation storage mechanism 14 that are installed opposite to each other.
  • a first DLC pattern belt 26A has a convex DLC pattern 28A formed by a method described later on the surface thereof, and a surface portion other than the DLC pattern 28A is a concave portion 30A in which the plating solution M can be accommodated. .
  • the first DLC pattern belt 26A is rotatably provided, and when immersed in the plating solution M of the first plating tank 20A, the plating solution M is accommodated in the recess 30A, which is well shown in FIGS. As will be described later, the first circuit pattern plating layer MA is formed on the surface thereof.
  • Reference numeral 32A denotes a first pattern belt rotating means, which includes a pair of rotating rollers 34A and 36A and a first pressure transfer roller 38A that are provided on both sides of the first plating tank 20A and that are opposed to each other.
  • the first DLC pattern belt 26A is rotated by winding the first DLC pattern belt 26A around 36A and 38A and rotating these rollers 34A, 36A, and 38A.
  • the first pressure transfer roller 38A acts to pressure transfer the first circuit pattern plating layer MA onto one surface of a printed circuit board base 40 to be described later.
  • Reference numeral 37A denotes a first drying unit, which is installed so as to surround the first DLC pattern belt 26A rotating from the rotating roller 36A in the direction of the first pressure transfer roller 38A, and is formed on the first DLC pattern belt 26A. It acts to promote drying of the first circuit pattern plating layer MA.
  • the second pattern belt plating mechanism 12B includes a second plating unit 22B that contains a plating solution M and includes a second plating tank 20B that is installed at a predetermined interval from the first plating tank 20A. Although not shown, the second plating tank 20B has an overflow portion as in the configuration of the first plating tank 20A. During the plating process, the plating solution M is always overflowed, and the plating solution M is liquidized. The surface is always held at a predetermined height.
  • Reference numeral 26B denotes a second DLC pattern belt, and a convex DLC pattern 28B formed by a method described later is provided on the surface thereof, and the surface portion other than the DLC pattern 28B is a concave portion 30B in which the plating solution M can be accommodated.
  • the second DLC pattern belt 26B is rotatably provided, and when immersed in the plating solution M of the second plating tank 20B, the plating solution M is accommodated in the recess 30B, and a second circuit pattern plating layer is formed on the surface thereof. MB is formed.
  • Reference numeral 32B denotes a second pattern belt rotating means, which includes a pair of rotating rollers 34B and 36B and a second pressure-transfer roller 38B which are provided on both sides of the second plating tank 20B and which are opposed to each other.
  • the second DLC pattern belt 26B is rotated by winding the second DLC pattern belt 26B around 36B and 38B and rotating these rollers 34B, 36B, and 38B.
  • the second pressure-transfer roller 38B acts to pressure-transfer the second circuit pattern plating layer MB to one surface of a printed circuit board substrate 40 to be described later.
  • Reference numeral 37B denotes a second drying unit, which is installed so as to surround the second DLC pattern belt 26B that rotates in the direction from the rotation roller 36B to the second pressure transfer roller 38B, and is formed on the second DLC pattern belt 26B. It acts to promote drying of the second circuit pattern plating layer MB.
  • the printed circuit board forming and storing mechanism 14 includes a printed circuit board base material supply means 42 that is provided between the first plating tank 20A and the second plating tank 20B and supplies the printed circuit board base material 40. is doing.
  • Reference numeral 44 denotes a circuit pattern pressure transfer unit having the first pressure transfer roller 38A and the second pressure transfer roller 38B, and the first pressure transfer roller 38A and the second pressure transfer transfer from the printed circuit board base material supply unit 42.
  • the first and second circuit pattern plating layers MA and MB are pressure-transferred onto both surfaces of the printed circuit board base material 40 supplied between the rollers 38B, and act to form a circuit pattern.
  • a printed circuit board storage mechanism 46 winds and stores the printed circuit board 40M on which the circuit pattern is formed. In the illustrated example of FIG.
  • a mechanism for winding and storing the printed circuit board 40M is shown.
  • a flexible printed circuit board can be wound, but in the case of a rigid type or a rigid-flexible type Needless to say, there are cases where winding is difficult, and in that case, it is not necessary to have a winding structure.
  • the operation is explained by the above configuration.
  • the first circuit pattern plating layer MA and the second circuit pattern plating layer MB are formed on the surfaces of the first DLC pattern belt 26A and the second DLC pattern belt 26B by the first pattern belt plating mechanism 12A and the second pattern belt plating mechanism 12B.
  • the printed circuit board substrate 40 is supplied between the first pressure transfer roller 38A and the second pressure transfer roller 38B.
  • the first circuit pattern plating layer MA and the second circuit pattern plating layer MB formed on the surfaces of the first DLC pattern belt 26A and the second DLC pattern belt 26B are used as the first pressure transfer roller 38A and the first DLC pattern belt 26A.
  • the printed circuit board 40M is formed by pressure-transferring both surfaces of the printed circuit board base material 40 by the two pressure transfer roller 38B.
  • the circuit pattern plating layers MA and MB described above are formed on the printed circuit board base material.
  • 54A is a first washing tank for washing the first DLC pattern belt 26A on which the first circuit pattern plating layer MA discharged from the first plating layer 20A is formed, and 54B is discharged from the second plating layer 20B. It is the 2nd washing tank for washing 2nd DLC pattern belt 26B in which 2nd circuit pattern plating layer MB was formed.
  • a front / back positioning sensor 55 is installed between the first and second pressure transfer rollers 38A and 38B and the printed circuit board storage mechanism 46, and a first circuit pattern plating layer MA is formed on both surfaces of the printed circuit board substrate 40.
  • the other surface of the material 40 (for example, the first pattern) with respect to a reference mark (not shown) formed in advance on one surface of the material 40 (for example, the surface on the second pattern belt plating mechanism 12B side).
  • Belt rotation means e.g., first pattern belt rotating means 32A it is preferable to be able to correct the position of the.
  • an ultraviolet curable adhesive is applied to both surfaces of the printed circuit board substrate 40, and as shown in FIG. 1, the first and second pressure transfer rollers 38A and 38B and the printed circuit board storage mechanism 46 are arranged.
  • An ultraviolet irradiation device 60 is provided between the first and second circuit pattern plating layers MA and MB on both surfaces of the printed circuit board base material 40 via the ultraviolet curable adhesive.
  • the ultraviolet curable adhesive is cured by irradiating ultraviolet rays with an ultraviolet irradiating device 60, and the first and second circuit pattern plating layers MA and MB are firmly adhered to both surfaces of the printed circuit board substrate 40. It is preferable to form the printed circuit board 40M.
  • a conventionally well-known thing can be used about the ultraviolet curable adhesive and the ultraviolet irradiation device 60.
  • a release paper is pasted on the application surface of the printed circuit board base material 40 to which the ultraviolet curable adhesive is applied, and before reaching the first and second pressure transfer rollers 38A and 38B, If the release paper is peeled off, the application surface of the ultraviolet curable adhesive can be prevented from adhering to an unintended place or the like.
  • the printed circuit board 40M is formed as described above, if the release circuit is pasted on the surface of the printed circuit board 40M and then stored by the printed circuit board storage mechanism 46, The surface of the printed circuit board 40M can be protected.
  • the double-sided printed circuit board manufacturing method of the present invention is A method of using the double-sided printed circuit board manufacturing apparatus 10 of the present invention, Forming first and second circuit pattern plating layers MA and MB on the surfaces of the first and second DLC pattern belts 26A and 26B by the first and second pattern belt plating mechanisms 12A and 12B;
  • the printed circuit board substrate 40 is supplied between the first and second pressure transfer rollers 38A and 38B, and the first and second circuit patterns formed on the surfaces of the first and second DLC pattern belts 26A and 26B.
  • Forming the double-sided printed circuit board 40M by pressure-transferring the plating layers MA and MB onto both sides of the printed circuit board substrate 40 by the first and second pressure-transfer rollers 38A and 38B; It is what has.
  • reference numeral 110 denotes a printed circuit board manufacturing apparatus according to the present invention.
  • the printed circuit board manufacturing apparatus 110 manufactures a single-sided printed circuit board.
  • one pattern belt plating mechanism for example, the second pattern belt plating mechanism 12B. ) Is removed.
  • the pattern belt plating mechanism 112 has a plating unit 122 including a plating tank 120 containing a plating solution M.
  • the plating tank 120 has an overflow portion (not shown) similar to the overflow portion shown in FIG. 3, and the plating solution M is always overflowed during the plating process so that the surface of the plating solution M is maintained. It is configured to be held at a predetermined height at all times.
  • a DLC pattern belt 126 is provided with a convex DLC pattern 128 formed by a method to be described later on its surface, and a surface portion other than the DLC pattern 128 is a recess 130 in which the plating solution M can be stored.
  • the DLC pattern belt 126 is rotatably provided. When the DLC pattern belt 126 is immersed in the plating solution M in the plating tank 120, the plating solution M is accommodated in the recess 130, and a circuit pattern plating layer MA is formed on the surface thereof. Is.
  • Reference numeral 132 denotes a pattern belt rotating means, which includes a pair of rotating rollers 134 and 136 and a pressure-transfer roller 138 which are provided on both sides of the plating tank 120 and are opposed to each other. These rollers 134, 136 and 138 are connected to the DLC.
  • the DLC pattern belt 126 is rotated by winding the pattern belt 126 and rotating these rollers 134, 136 and 138.
  • the pressure transfer roller 138 acts to pressure transfer the circuit pattern plating layer MA onto one surface of a printed circuit board substrate 140 described later.
  • Reference numeral 141 denotes a pressing roller installed to face the pressure-transfer transfer roller.
  • the printed circuit board forming and storing mechanism 114 is provided on the side of the plating tank 120 (the side on which the pressure-transfer transfer roller 138 is located) and supplies the printed circuit board base material 140. 142.
  • Reference numeral 144 denotes a circuit pattern pressure transfer unit, which has the pressure transfer roller 138 and is supplied between the pressure transfer roller 138 and the pressure roller 141 from the printed circuit board base material supply unit 142.
  • the circuit pattern plating layer MA is pressure-transferred on one side of 140 to act to form a circuit pattern.
  • Reference numeral 146 denotes a printed circuit board housing mechanism that houses the printed circuit board 140M on which the circuit pattern is formed.
  • a release paper is affixed to the application surface of the printed circuit board substrate 140 to which the ultraviolet curable adhesive is applied, and the release paper is peeled off before reaching the pressure-transfer roller 138.
  • the application surface of the ultraviolet curable adhesive can be prevented from adhering to an unintended place.
  • the release circuit is pasted on the surface of the printed circuit board 140M and then stored by the printed circuit board storage mechanism 146, The surface of the printed circuit board 140M can be protected.
  • reference numeral 156 denotes an insoluble anode for copper plating installed in the plating tank 120.
  • Reference numeral 158 denotes a rectifier connected to the copper plating insoluble anode 156 and the rotating roller 134, respectively.
  • the printed circuit board manufacturing method of the present invention is a method using the printed circuit board manufacturing apparatus of the present invention, Forming a circuit pattern plating layer on the surface of the DLC pattern belt by the pattern belt plating mechanism;
  • the printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller.
  • a DLC coating film 218 is formed on the surface of the base material belt 212 and the resist pattern 216 (step 304 in FIG. 5C and FIG. 6).
  • the DLC coating film may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.
  • the DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form the convex DLC pattern 220 and the concave portion 222 on the surface of the substrate (steps of FIGS. 5D and 6). 306).
  • the DLC pattern belt 224 can be manufactured.
  • the manufactured DLC pattern belt can be used as the DLC pattern belts 26A, 26B, and 126 in the present invention.
  • 10 double-sided printed circuit board manufacturing apparatus
  • 12A first pattern belt plating mechanism
  • 12B second pattern belt plating mechanism
  • 14 printed circuit board formation and storage mechanism
  • 20A first plating tank
  • 20B second plating tank
  • 22A first plating unit
  • 22B second plating unit
  • 24 overflow portion
  • 26A first DLC pattern belt
  • 26B second DLC pattern belt
  • 28A first DLC pattern
  • 28B second DLC pattern
  • 30A first recess
  • 30B second recess
  • 32A first pattern belt rotating means
  • 32B second pattern belt rotating means
  • 34A, 36A, 34B, 36B rotating roller
  • 37A first drying unit
  • 37B second Drying unit
  • 38A first pressure transfer roller
  • 38B second pressure transfer roller
  • 4 0 base material for printed circuit board
  • 40M printed circuit board
  • 42 base material supply means for printed circuit board
  • 44 circuit pattern pressure transfer means
  • 46 printed circuit board storage mechanism
  • 50A first release treatment agent Tank
  • 50B second release treatment agent

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided are a printed circuit board, and a manufacturing device and manufacturing method therefor wherein patterning is applied by only plating to remove the need for etching. First and second circuit pattern plated layers are formed on the surfaces of first and second DLC pattern belts by first and second pattern belt plating mechanisms. A base material for the printed circuit board is supplied between first and second crimping transfer rollers. The first and second circuit pattern plated layers formed on the surfaces of the first and second DLC pattern belts are pressed and transferred onto both surfaces of the base material for the printed circuit board by the first and second crimping transfer rollers. Thereby a double-sided printed circuit board is formed, and thus the double-sided printed circuit board on which the circuit pattern is formed is housed in a printed circuit board forming and housing mechanism.

Description

プリント回路基板及びその製造装置並びに製造方法Printed circuit board, manufacturing apparatus and manufacturing method thereof
 　本発明は、プリント回路基板、特に両面プリント回路基板及びその製造に適した製造装置並びに製造方法に関する。 The present invention relates to a printed circuit board, particularly a double-sided printed circuit board, a manufacturing apparatus suitable for manufacturing the same, and a manufacturing method.
 　プリント回路基板は、その層数によって、絶縁基板の片面にのみ回路を形成した片面プリント回路基板、両面に回路を形成した両面プリント回路基板、及び多層に回路形成した多層プリント回路基板に大別される。従来は部品素子が単純で回路パターンも簡単であって片面プリント回路基板を使用していたが、最近は回路の複雑度が増してきて高密度化及び小型化回路に対する要求も増加して両面プリント回路基板や多層プリント回路基板を使用することが一般的である。両面プリント回路基板の材料として最も多く用いられるものは、絶縁物の両側に薄く銅メッキ層を形成した銅張積層板である（特許文献１）。 Printed circuit boards are roughly classified into single-sided printed circuit boards in which circuits are formed only on one side of an insulating substrate, double-sided printed circuit boards in which circuits are formed on both sides, and multilayer printed circuit boards in which circuits are formed in multiple layers, depending on the number of layers. The Conventionally, the component elements were simple and the circuit pattern was simple, and single-sided printed circuit boards were used. Recently, however, the complexity of circuits has increased, and the demand for higher density and smaller circuits has also increased. It is common to use a circuit board or a multilayer printed circuit board. The most frequently used material for a double-sided printed circuit board is a copper clad laminate in which a thin copper plating layer is formed on both sides of an insulator (Patent Document 1).
 　プリント回路基板は、基材の材質によって、リジッド型、フレキシブル型及びこれら２つを混合したリジッドーフレキシブル型に分類される。リジッド型プリント回路基板とは、公知の固定されたプリント回路基板をさす。一方で、フレキシブル型プリント回路基板は、柔軟性があり、電子機器等の中で屈曲又は折曲状態でプリント回路基板を取り付ける必要がある場合に使用される。さらに、プリンタのヘッドのように駆動される部分で、電気的連結が必要な場合、一種のコネクタとしても使用される。 プ リ ン ト Printed circuit boards are classified into rigid types, flexible types, and rigid-flexible types that are a mixture of these two, depending on the material of the base material. A rigid printed circuit board refers to a known fixed printed circuit board. On the other hand, the flexible printed circuit board is flexible and is used when it is necessary to attach the printed circuit board in a bent or bent state in an electronic device or the like. Further, when electrical connection is required at a portion driven like a printer head, it is also used as a kind of connector.
 　リジッドーフレキシブル型プリント回路基板は、リジッド型プリント回路基板がフレキシブル型プリント回路基板によって連結されている形のプリント回路基板であって、より精巧な回路の製作が可能で電気的接続が減少でき、信頼性が高い。そのため、航空宇宙、軍事用装備に多く使用される。さらに、最近では折り畳み型携帯電話の折られる部分の電気接続のためにも使用されている。リジッドーフレキシブル型プリント回路基板は、互いに異なる材質の原板を結合させて製作するため、生産効率が低く、特殊な技術が求められるという難しさがあったが、電子製品の機能の多様化及び小型化に伴って使用の頻度が増加しつつある。 The rigid-flexible printed circuit board is a printed circuit board in which the rigid printed circuit board is connected by the flexible printed circuit board, and more elaborate circuits can be manufactured and electrical connection can be reduced. High reliability. Therefore, it is often used for aerospace and military equipment. Furthermore, recently, it is also used for electrical connection of a folded portion of a foldable mobile phone. Rigid-flexible printed circuit boards are manufactured by combining original plates made of different materials, so there is a difficulty in that production efficiency is low and special technologies are required. The frequency of use is increasing along with the shift to commercialization.
 　プリント回路基板の製造の際、回路パターンの設計を済ませた後、この設計済の回路パターンを基板上に形成する方法にはいろいろあるが、いずれの回路パターン形成方法もエッチングとメッキを基本とする。すなわち、この両者を適切に使用して、求められる種々の基板の性質及び経済条件に適合させるものであった（特許文献２～４）。しかしながら、メッキを行った後にエッチングを行う場合にはエッチングの良否によって回路パターンの良否が決定されてしまうもので、非常に精密なエッチングを行う必要があり、エッチングを行う分だけ時間やコストがかかるものであった。そこでメッキのみで回路パターンを形成しエッチングを不要とする回路パターン形成方法が待望されているが、いまだメッキのみでパターニングを行ってエッチングを不要とするプリント回路基板の製造装置や方法は開発されていないのが現状である。 There are various methods for forming the designed circuit pattern on the substrate after designing the circuit pattern when manufacturing the printed circuit board, and any circuit pattern forming method is based on etching and plating. . That is, both of them are appropriately used to meet various required properties and economic conditions of the substrate (Patent Documents 2 to 4). However, when etching is performed after plating, the quality of the circuit pattern is determined by the quality of the etching, and it is necessary to perform very precise etching, which requires time and cost for the etching. It was a thing. Therefore, there is a need for a circuit pattern forming method that forms a circuit pattern only by plating and does not require etching. However, a printed circuit board manufacturing apparatus and method that does not require etching by patterning only by plating have been developed. There is no current situation.
特開２００２－１７１０３２号公報JP 2002-171032 A 特開２００４－２１４５９０号公報JP 2004-214590 A 特開２００４－２７３９１５号公報JP 2004-273915 A 特開２００９－１５８７０７号公報JP 2009-158707 A
 　本発明は、上記した従来技術の問題点に鑑みなされたもので、メッキのみでパターニングを行ってエッチングを不要とするプリント回路基板及びその製造装置並びに製造方法を提供することを目的とする。
 　本願出願人は、ＤＬＣ（ダイヤモンドライクカーボン）によってグラビア製版ロール等にパターニングを行う方法についての研究開発を行っており、ＤＬＣを用いることによって非常に精度がよく微細なパターニングを実現することが可能となり、例えば特願２０１１－１１１４１及び特願２０１２－１２００５８として提案しているが、そのＤＬＣを用いてパターニングを行う技術をプリント回路基板の製造に適用することに着眼し、鋭意研究を重ねて、本発明を完成したものである。 The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a printed circuit board, a manufacturing apparatus thereof, and a manufacturing method that do not require etching by performing patterning only by plating.
The applicant of the present application has been conducting research and development on a method for patterning gravure plate rolls using DLC (diamond-like carbon), and by using DLC, it is possible to achieve very precise and fine patterning. Have been proposed as, for example, Japanese Patent Application No. 2011-11141 and Japanese Patent Application No. 2012-120058. However, this technique has been studied by applying a technique for patterning using the DLC to the manufacture of printed circuit boards. The invention has been completed.
 　上記課題を解決するため、本発明の両面プリント回路基板製造装置は、
 　メッキ液を収容した第１メッキ槽を含む第１メッキユニットと、
 　該第１メッキ槽のメッキ液に浸漬されてその表面に第１回路パターンメッキ層が形成されるとともに回動可能に設けられた第１ＤＬＣパターンベルトと、
 　該第１ＤＬＣパターンベルトを回動させかつプリント回路基板用基材の一面に前記第１回路パターンメッキ層を圧着転写する第１圧着転写ローラーを含む第１パターンベルト回動手段と、
 を有する第１パターンベルトメッキ機構と；
 　メッキ液を収容しかつ前記第１メッキ槽から所定間隔を介して設置された第２メッキ槽を含む第２メッキユニットと、
 　該第２メッキ槽のメッキ液に浸漬されてその表面に第２回路パターンメッキ層が形成されるとともに回転可能に設けられた第２ＤＬＣパターンベルトと、
 　該第２ＤＬＣパターンベルトを回動させるとともに前記第１圧着転写ローラーに対向して設置されかつプリント回路基板用基材の他面に前記第２回路パターンメッキ層を圧着転写する第２圧着転写ローラーを含む第２パターンベルト回動手段と、
 を有する第２パターンベルトメッキ機構と；
 　前記第１メッキ槽と第２メッキ槽との間に設けられかつプリント回路基板用基材を供給するプリント回路基板用基材供給手段と、
 　前記第１及び第２圧着転写ローラーを有しかつ前記プリント回路基板用基材供給手段から該第１及び第２圧着転写ローラーの間に供給されるプリント回路基板用基材の両面に回路パターンを圧着転写せしめる回路パターン圧着転写手段と、
 　該回路パターンが形成されたプリント回路基板を収納するプリント回路基板収納機構と、
 を有するプリント回路基板形成収納機構と；
 を含み、
 　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成し、前記第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって両面プリント回路基板を形成し、前記プリント回路基板形成収納機構によって該回路パターンが形成された両面プリント回路基板を収納するようにしたことを特徴とする。 In order to solve the above problems, the double-sided printed circuit board manufacturing apparatus of the present invention is
A first plating unit including a first plating tank containing a plating solution;
A first DLC pattern belt that is dipped in the plating solution of the first plating tank to form a first circuit pattern plating layer on the surface thereof and is rotatably provided;
A first pattern belt rotating means including a first pressure transfer roller for rotating the first DLC pattern belt and pressure-transferring the first circuit pattern plating layer on one surface of a printed circuit board substrate;
A first pattern belt plating mechanism having:
A second plating unit containing a plating solution and including a second plating tank installed at a predetermined interval from the first plating tank;
A second DLC pattern belt that is dipped in the plating solution of the second plating tank and has a second circuit pattern plating layer formed on the surface thereof, and is rotatably provided;
A second pressure-transfer roller that rotates the second DLC pattern belt and faces the first pressure-transfer transfer roller, and that pressure-transfers the second circuit pattern plating layer to the other surface of the printed circuit board substrate. Including second pattern belt rotating means;
A second pattern belt plating mechanism having:
A printed circuit board base material supply means that is provided between the first plating tank and the second plating tank and supplies a printed circuit board base material;
Circuit patterns are formed on both sides of the printed circuit board substrate having the first and second pressure transfer rollers and supplied between the first and second pressure transfer rollers from the printed circuit board substrate supply means. A circuit pattern pressure transfer means for pressure transfer;
A printed circuit board storage mechanism for storing a printed circuit board on which the circuit pattern is formed;
A printed circuit board forming and storing mechanism having:
Including
First and second circuit pattern plating layers are formed on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms, and the printed circuit is interposed between the first and second pressure transfer rollers. The substrate for substrate is supplied, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the substrate for printed circuit board by the first and second pressure transfer rollers. A double-sided printed circuit board is formed by pressure transfer onto both sides, and the double-sided printed circuit board on which the circuit pattern is formed is stored by the printed circuit board forming and storing mechanism.
 　前記第１及び第２メッキ液に前記第１及び第２ＤＬＣパターンベルトを浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記第１及び第２メッキユニットにおいて第１及び第２メッキ槽の前に離型処理剤を収容する第１及び第２離型処理剤槽並びに水洗するための第１及び第２水槽をそれぞれ設置する構成とするのが好ましい。 Before the first and second DLC pattern belts are immersed in the first and second plating solutions, the first and second plating units are subjected to a pretreatment that is immersed in a release agent and then washed with water. It is preferable that the first and second release treatment agent tanks containing the release treatment agent and the first and second water tanks for washing with water are respectively installed in front of the first and second plating tanks.
 　前記第１及び第２圧着転写ローラーとプリント回路基板収納機構の間に表裏位置決めセンサーを設置し、前記プリント回路基板用基材の両面に第１及び第２回路パターンメッキ層が圧着転写せしめることによってプリント回路基板が形成された後に、該第１及び第２回路パターンメッキ層が形成された前記プリント回路基板用基材の両面の一方の面に予め形成された基準マークに対して該両面の他方の面の位置検出信号により、該他方の面に対してパターンベルトメッキ層を圧着転写したパターンベルト回動手段の位置補正を行うことができるようにするのが好適である。 A front and back positioning sensor is installed between the first and second pressure transfer rollers and the printed circuit board storage mechanism, and the first and second circuit pattern plating layers are pressure transferred onto both sides of the printed circuit board substrate. After the printed circuit board is formed, the other of the two surfaces of the printed circuit board substrate on which the first and second circuit pattern plating layers are formed with respect to a reference mark previously formed on one surface of the printed circuit board substrate. It is preferable that the position correction of the pattern belt rotating means obtained by pressure-transferring the pattern belt plating layer to the other surface can be performed by the position detection signal of the other surface.
　また、前記プリント回路基板用基材が、その両面に紫外線硬化性接着剤が塗布されてなり、前記第１及び第２圧着転写ローラーとプリント回路基板収納機構の間に紫外線照射装置を設け、前記プリント回路基板用基材の両面に第１及び第２回路パターンメッキ層が前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、前記第１及び第２回路パターンメッキ層を強固に接着せしめて前記両面プリント回路基板を形成してなるように構成するのが好ましい。 Further, the substrate for a printed circuit board is coated with an ultraviolet curable adhesive on both surfaces thereof, and an ultraviolet irradiation device is provided between the first and second pressure-transfer transfer rollers and the printed circuit board storage mechanism, After the first and second circuit pattern plating layers are pressure-transferred onto both surfaces of the printed circuit board base material via the ultraviolet curable adhesive, the ultraviolet curable composition is irradiated with ultraviolet rays by the ultraviolet irradiation device. Preferably, the adhesive is cured, and the first and second circuit pattern plating layers are firmly adhered to form the double-sided printed circuit board.
 　本発明の両面プリント回路基板製造方法は、
 　本発明の両面プリント回路基板装置を用いる方法であって、
 　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成する工程と、
 　第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって両面プリント回路基板を形成する工程と、
 を有することを特徴とする。 The double-sided printed circuit board manufacturing method of the present invention is
A method using the double-sided printed circuit board device of the present invention,
Forming first and second circuit pattern plating layers on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms;
The printed circuit board base material is supplied between first and second pressure transfer rollers, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the first and second circuit pattern plating layers. Forming a double-sided printed circuit board by pressure-transferring both sides of the printed circuit board base material by a second pressure-transfer roller;
It is characterized by having.
 　本発明の両面プリント回路基板は、本発明装置を用いて製造された両面プリント回路基板であって、
 　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成し、
 　第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって製造されたことを特徴とする。 The double-sided printed circuit board of the present invention is a double-sided printed circuit board manufactured using the apparatus of the present invention,
Forming first and second circuit pattern plating layers on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms;
The printed circuit board base material is supplied between first and second pressure transfer rollers, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the first and second circuit pattern plating layers. It is manufactured by pressure-transferring both surfaces of the substrate for a printed circuit board with a second pressure-transfer roller.
 　本発明のプリント回路基板製造装置は、
 　メッキ液を収容したメッキ槽を含むメッキユニットと、
 　該メッキ槽のメッキ液に浸漬されてその表面に回路パターンメッキ層が形成されるとともに回動可能に設けられたＤＬＣパターンベルトと、
 　該ＤＬＣパターンベルトを回動させかつプリント回路基板用基材の一面に前記回路パターンメッキ層を圧着転写する圧着転写ローラーを含むパターンベルト回動手段と、
 　該圧着転写ローラーに対向して設置された押圧ローラーと、
 を有するパターンベルトメッキ機構と；
 　前記メッキ槽の側方に設けられかつプリント回路基板用基材を供給するプリント回路基板用基材供給手段と、
 　前記圧着転写ローラー及び押圧ローラーを有しかつ前記プリント回路基板用基材供給手段から該圧着転写ローラー及び押圧ローラーの間に供給されるプリント回路基板用基材の片面に回路パターンを圧着転写せしめる回路パターン圧着転写手段と、
 　該回路パターンが形成されたプリント回路基板を収納するプリント回路基板収納機構と、
 を有するプリント回路基板形成収納機構と；
 を含み、
 　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成し、前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラによって該プリント回路基板用基材の片面に圧着転写せしめることによってプリント回路基板を形成し、前記プリント回路基板形成収納機構によって該回路パターンが形成されたプリント回路基板を収納するようにしたことを特徴とする。 The printed circuit board manufacturing apparatus of the present invention is
A plating unit including a plating tank containing a plating solution;
A DLC pattern belt that is dipped in the plating solution of the plating tank to form a circuit pattern plating layer on its surface and is rotatably provided;
A pattern belt rotating means including a pressure transfer roller for rotating the DLC pattern belt and pressure-transferring the circuit pattern plating layer onto one surface of a printed circuit board substrate;
A pressing roller installed opposite the pressure-transfer roller,
A pattern belt plating mechanism having:
Printed circuit board base material supply means provided on the side of the plating tank and supplying the printed circuit board base material;
A circuit that has the pressure transfer roller and the pressure roller and that pressure-transfers the circuit pattern onto one side of the printed circuit board substrate supplied from the printed circuit board base material supply means between the pressure transfer roller and the pressure roller. Pattern crimping transfer means;
A printed circuit board storage mechanism for storing a printed circuit board on which the circuit pattern is formed;
A printed circuit board forming and storing mechanism having:
Including
A circuit pattern plating layer is formed on the surface of the DLC pattern belt by the pattern belt plating mechanism, the substrate for the printed circuit board is supplied between the pressure transfer roller and the pressure roller, and formed on the surface of the DLC pattern belt. A printed circuit board is formed by pressure-transferring the printed circuit pattern plating layer onto one side of the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller, and the circuit pattern is formed by the printed-circuit board forming and storing mechanism. The printed circuit board is accommodated.
 　前記メッキ液に前記ＤＬＣパターンベルトを浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記メッキユニットにおいてメッキ槽の前に離型処理剤を収容する離型処理剤槽及び水洗するための水槽を設置するのが好適である。 Before immersing the DLC pattern belt in the plating solution, a pretreatment for immersing in a mold release treatment agent is performed, and then, in order to perform washing with water, a mold release treatment agent is stored in the plating unit before the plating tank. It is preferable to install a mold treatment agent tank and a water tank for washing with water.
　また、前記プリント回路基板用基材が、その一面に紫外線硬化性接着剤が塗布されてなり、前記圧着転写ローラーとプリント回路基板収納機構の間に紫外線照射装置を設け、前記プリント回路基板用基材の片面に回路パターンメッキ層が前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、前記回路パターンメッキ層を強固に接着せしめて前記プリント回路基板を形成してなるのが好適である。 Further, the substrate for a printed circuit board is coated with an ultraviolet curable adhesive on one surface, and an ultraviolet irradiation device is provided between the pressure-transfer transfer roller and the printed circuit board storage mechanism, and the printed circuit board substrate After the circuit pattern plating layer is pressure-transferred and transferred onto one surface of the material via the ultraviolet curable adhesive, the ultraviolet curable adhesive is cured by irradiating ultraviolet rays with the ultraviolet irradiation device, and the circuit pattern plating is performed. It is preferable to form the printed circuit board by firmly bonding the layers.
 　本発明のプリント回路基板製造方法は、本発明のプリント回路基板製造装置を用いる方法であって、
 　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成する工程と、
 　前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラーによって該プリント回路基板用基材の片面に圧着転写せしめることによってプリント回路基板を形成する工程と、
 を有することを特徴とする。 The printed circuit board manufacturing method of the present invention is a method using the printed circuit board manufacturing apparatus of the present invention,
Forming a circuit pattern plating layer on the surface of the DLC pattern belt by the pattern belt plating mechanism;
The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. Forming a printed circuit board by crimping and transferring to one side of the material;
It is characterized by having.
 　本発明のプリント回路基板は、本発明装置を用いて製造されたプリント回路基板であって、
 　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成し、
 　前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラーによって該プリント回路基板用基材の片面に圧着転写せしめることによって製造されたことを特徴とする。 The printed circuit board of the present invention is a printed circuit board manufactured using the apparatus of the present invention,
A circuit pattern plating layer is formed on the surface of the DLC pattern belt by the pattern belt plating mechanism,
The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. It was manufactured by crimping and transferring to one side of the material.
 　本発明によれば、プリント回路基板の製造に際し、メッキのみでパターニングを行ってエッチングを不要とすることが可能となり、従来の製造方法に比して時間の節約及びコストの低減を大幅に図ることができ、かつパターンの精度にも優れたプリント回路基板をえることができるという大きな効果を奏し、特に両面プリント回路基板の製造に効適である。 According to the present invention, in the production of a printed circuit board, it is possible to perform patterning only by plating and eliminate the need for etching, thereby greatly saving time and reducing costs as compared with conventional manufacturing methods. The printed circuit board having excellent pattern accuracy can be obtained, and is particularly effective for the production of double-sided printed circuit boards.
本発明の両面プリント回路基板製造装置を示す概略側面的説明図である。It is a schematic side view showing a double-sided printed circuit board manufacturing apparatus of the present invention. 第１ＤＬＣパターンベルトによるプリント回路基板の回路パターンの形成手順を示す模式的説明図で、（ａ）はＤＬＣパターンベルトの凹部にメッキ液を収容した状態、（ｂ）はＤＬＣパターンベルトの凹部に形成されたメッキ層をプリント回路基板基材上に転写する状態、及び（ｃ）はプリント回路基板基材上に回路パターンメッキ層を転写してプリント回路基板を製造した状態をそれぞれ示す。FIG. 2 is a schematic explanatory view showing a procedure for forming a circuit pattern on a printed circuit board using a first DLC pattern belt, where (a) shows a state in which a plating solution is accommodated in a recess of the DLC pattern belt, and (b) shows a formation in the recess of the DLC pattern belt. A state in which the plated layer is transferred onto the printed circuit board substrate and (c) shows a state in which the printed circuit board is manufactured by transferring the circuit pattern plating layer onto the printed circuit board substrate. メッキ槽のオーバーフロー部を示す要部の摘示説明図である。It is an explanatory drawing of the principal part which shows the overflow part of a plating tank. 本発明の片面プリント回路基板製造装置を示す概略側面的説明図である。It is a schematic side view showing a single-sided printed circuit board manufacturing apparatus of the present invention. 本発明に用いられるＤＬＣパターンベルトの製造工程を模式的に示す説明図で、（ａ）はパターンベルト基材の表面に感光剤を塗布した状態の要部断面図、（ｂ）は露光・現像せしめてレジストパターンを形成した状態の要部断面図、（ｃ）はパターンベルト基材及びレジストパターンの表面にＤＬＣ被覆膜を形成した状態の要部断面図、（ｄ）はレジストパターン及びレジストパターン表面のＤＬＣ被覆膜を除去しパターンベルト基材上にＤＬＣパターンを残存形成せしめた状態を示す要部断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the manufacturing process of the DLC pattern belt used for this invention, (a) is principal part sectional drawing of the state which apply | coated the photosensitive agent to the surface of the pattern belt base material, (b) is exposure and development. FIG. 4C is a cross-sectional view of a main part in a state in which a resist pattern is formed, FIG. 5C is a cross-sectional view of a main part in a state in which a DLC coating film is formed on the surface of the pattern belt substrate and the resist pattern, It is principal part sectional drawing which shows the state which removed the DLC coating film of the pattern surface and made the DLC pattern remain on the pattern belt base material. ＤＬＣパターンベルトの製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of a DLC pattern belt.
 　以下に本発明の実施の形態を説明するが、これら実施の形態は例示的に示されるもので、本発明の技術思想から逸脱しない限り種々の変形が可能なことはいうまでもない。 実 施 Hereinafter, embodiments of the present invention will be described, but these embodiments are exemplarily shown, and it goes without saying that various modifications are possible without departing from the technical idea of the present invention.
 　図１において、符号１０は本発明に係る両面プリント回路基板製造装置で、相対向して設置された第１パターンベルトメッキ機構１２Ａ、第２パターンベルトメッキ機構１２Ｂ及びプリント回路基板形成収納機構１４を有している。 In FIG. 1, reference numeral 10 denotes a double-sided printed circuit board manufacturing apparatus according to the present invention, which includes a first pattern belt plating mechanism 12A, a second pattern belt plating mechanism 12B, and a printed circuit board formation storage mechanism 14 that are installed opposite to each other. Have.
 　前記第１パターンベルトメッキ機構１２Ａはメッキ液Ｍを収容した第１メッキ槽２０Ａを含む第１メッキユニット２２Ａを有している。該第１メッキ槽２０Ａはオーバーフロー部２４を有しており（図３）、メッキ処理中はメッキ液Ｍを常時オーバーフローさせておいて、メッキ液Ｍの液面を常時所定の高さに保持するように構成されている。 前 記 The first pattern belt plating mechanism 12A has a first plating unit 22A including a first plating tank 20A containing a plating solution M. The first plating tank 20A has an overflow portion 24 (FIG. 3), and the plating solution M is always overflowed during the plating process so that the surface of the plating solution M is always kept at a predetermined height. It is configured as follows.
 　２６Ａは第１ＤＬＣパターンベルトで、その表面には後述する方法によって形成された凸状のＤＬＣパターン２８Ａが設けられ、該ＤＬＣパターン２８Ａ以外の表面部分はメッキ液Ｍを収容できる凹部３０Ａとなっている。該第１ＤＬＣパターンベルト２６Ａは回動可能に設けられるとともに、該第１メッキ槽２０Ａのメッキ液Ｍに浸漬されると上記凹部３０Ａにメッキ液Ｍが収容され、図１及び図２によく示されかつ後述するように、その表面に第１回路パターンメッキ層ＭＡが形成されるものである。 A first DLC pattern belt 26A has a convex DLC pattern 28A formed by a method described later on the surface thereof, and a surface portion other than the DLC pattern 28A is a concave portion 30A in which the plating solution M can be accommodated. . The first DLC pattern belt 26A is rotatably provided, and when immersed in the plating solution M of the first plating tank 20A, the plating solution M is accommodated in the recess 30A, which is well shown in FIGS. As will be described later, the first circuit pattern plating layer MA is formed on the surface thereof.
 　３２Ａは第１パターンベルト回動手段で、該第１メッキ槽２０Ａの両側部に設けられた相対向する一対の回動ローラー３４Ａ，３６Ａ及び第１圧着転写ローラー３８Ａからなり、これらのローラー３４Ａ，３６Ａ，３８Ａに該第１ＤＬＣパターンベルト２６Ａを捲回しこれらのローラー３４Ａ，３６Ａ，３８Ａを回動することによって該第１ＤＬＣパターンベルト２６Ａを回動させる。該第１圧着転写ローラー３８Ａは後述するプリント回路基板用基材４０の一面に前記第１回路パターンメッキ層ＭＡを圧着転写するように作用する。なお、３７Ａは第１乾燥ユニットで、該回動ローラー３６Ａから第１圧着転写ローラー３８Ａ方向に回動する第１ＤＬＣパターンベルト２６Ａを包囲するように設置されており、該第１ＤＬＣパターンベルト２６Ａに形成されている第１回路パターンメッキ層ＭＡの乾燥を促進するように作用する。 Reference numeral 32A denotes a first pattern belt rotating means, which includes a pair of rotating rollers 34A and 36A and a first pressure transfer roller 38A that are provided on both sides of the first plating tank 20A and that are opposed to each other. The first DLC pattern belt 26A is rotated by winding the first DLC pattern belt 26A around 36A and 38A and rotating these rollers 34A, 36A, and 38A. The first pressure transfer roller 38A acts to pressure transfer the first circuit pattern plating layer MA onto one surface of a printed circuit board base 40 to be described later. Reference numeral 37A denotes a first drying unit, which is installed so as to surround the first DLC pattern belt 26A rotating from the rotating roller 36A in the direction of the first pressure transfer roller 38A, and is formed on the first DLC pattern belt 26A. It acts to promote drying of the first circuit pattern plating layer MA.
 　前記第２パターンベルトメッキ機構１２Ｂは、メッキ液Ｍを収容しかつ前記第１メッキ槽２０Ａから所定間隔を介して設置された第２メッキ槽２０Ｂを含む第２メッキユニット２２Ｂを有している。該第２メッキ槽２０Ｂは、図示しないが第１メッキ槽２０Ａの構成と同様に、オーバーフロー部を有しており、メッキ処理中はメッキ液Ｍを常時オーバーフローさせておいて、メッキ液Ｍの液面を常時所定の高さに保持するように構成されている。２６Ｂは第２ＤＬＣパターンベルトで、その表面には後述する方法によって形成された凸状のＤＬＣパターン２８Ｂが設けられ、該ＤＬＣパターン２８Ｂ以外の表面部分はメッキ液Ｍを収容できる凹部３０Ｂとなっている。該第２ＤＬＣパターンベルト２６Ｂは回動可能に設けられるとともに、該第２メッキ槽２０Ｂのメッキ液Ｍに浸漬されると上記凹部３０Ｂにメッキ液Ｍが収容され、その表面に第２回路パターンメッキ層ＭＢが形成されるものである。 前 記 The second pattern belt plating mechanism 12B includes a second plating unit 22B that contains a plating solution M and includes a second plating tank 20B that is installed at a predetermined interval from the first plating tank 20A. Although not shown, the second plating tank 20B has an overflow portion as in the configuration of the first plating tank 20A. During the plating process, the plating solution M is always overflowed, and the plating solution M is liquidized. The surface is always held at a predetermined height. Reference numeral 26B denotes a second DLC pattern belt, and a convex DLC pattern 28B formed by a method described later is provided on the surface thereof, and the surface portion other than the DLC pattern 28B is a concave portion 30B in which the plating solution M can be accommodated. . The second DLC pattern belt 26B is rotatably provided, and when immersed in the plating solution M of the second plating tank 20B, the plating solution M is accommodated in the recess 30B, and a second circuit pattern plating layer is formed on the surface thereof. MB is formed.
 　３２Ｂは第２パターンベルト回動手段で、該第２メッキ槽２０Ｂの両側部に設けられた相対向する一対の回動ローラー３４Ｂ，３６Ｂ及び第２圧着転写ローラー３８Ｂからなり、これらのローラー３４Ｂ，３６Ｂ，３８Ｂに該第２ＤＬＣパターンベルト２６Ｂを捲回しこれらのローラー３４Ｂ，３６Ｂ，３８Ｂを回動することによって該第２ＤＬＣパターンベルト２６Ｂを回動させる。該第２圧着転写ローラー３８Ｂは後述するプリント回路基板用基材４０の一面に前記第２回路パターンメッキ層ＭＢを圧着転写するように作用する。なお、３７Ｂは第２乾燥ユニットで、該回動ローラー３６Ｂから第２圧着転写ローラー３８Ｂ方向に回動する第２ＤＬＣパターンベルト２６Ｂを包囲するように設置されており、該第２ＤＬＣパターンベルト２６Ｂに形成されている第２回路パターンメッキ層ＭＢの乾燥を促進するように作用する。 Reference numeral 32B denotes a second pattern belt rotating means, which includes a pair of rotating rollers 34B and 36B and a second pressure-transfer roller 38B which are provided on both sides of the second plating tank 20B and which are opposed to each other. The second DLC pattern belt 26B is rotated by winding the second DLC pattern belt 26B around 36B and 38B and rotating these rollers 34B, 36B, and 38B. The second pressure-transfer roller 38B acts to pressure-transfer the second circuit pattern plating layer MB to one surface of a printed circuit board substrate 40 to be described later. Reference numeral 37B denotes a second drying unit, which is installed so as to surround the second DLC pattern belt 26B that rotates in the direction from the rotation roller 36B to the second pressure transfer roller 38B, and is formed on the second DLC pattern belt 26B. It acts to promote drying of the second circuit pattern plating layer MB.
 　前記プリント回路基板形成収納機構１４は、前記第１メッキ槽２０Ａと第２メッキ槽２０Ｂとの間に設けられかつプリント回路基板用基材４０を供給するプリント回路基板用基材供給手段４２を有している。４４は回路パターン圧着転写手段で、前記第１圧着転写ローラー３８Ａ及び第２圧着転写ローラー３８Ｂを有しかつ前記プリント回路基板用基材供給手段４２から該第１圧着転写ローラー３８Ａ及び第２圧着転写ローラー３８Ｂの間に供給されるプリント回路基板用基材４０の両面に第１及び第２回路パターンメッキ層ＭＡ、ＭＢを圧着転写せしめ、回路パターンを形成するように作用する。４６はプリント回路基板収納機構で、該回路パターンが形成されたプリント回路基板４０Ｍを巻取り収納する。図１の図示例では、プリント回路基板４０Ｍを巻取って収納する機構が示されているが、フレキシブル型のプリント回路基板であれば巻取り可能であるが、リジッド型やリジッドーフレキシブル型の場合には巻取りが困難の場合があり、その場合には巻取り構造とする必要がないことはいうまでもない。 The printed circuit board forming and storing mechanism 14 includes a printed circuit board base material supply means 42 that is provided between the first plating tank 20A and the second plating tank 20B and supplies the printed circuit board base material 40. is doing. Reference numeral 44 denotes a circuit pattern pressure transfer unit having the first pressure transfer roller 38A and the second pressure transfer roller 38B, and the first pressure transfer roller 38A and the second pressure transfer transfer from the printed circuit board base material supply unit 42. The first and second circuit pattern plating layers MA and MB are pressure-transferred onto both surfaces of the printed circuit board base material 40 supplied between the rollers 38B, and act to form a circuit pattern. A printed circuit board storage mechanism 46 winds and stores the printed circuit board 40M on which the circuit pattern is formed. In the illustrated example of FIG. 1, a mechanism for winding and storing the printed circuit board 40M is shown. However, a flexible printed circuit board can be wound, but in the case of a rigid type or a rigid-flexible type Needless to say, there are cases where winding is difficult, and in that case, it is not necessary to have a winding structure.
 　上記の構成により、その作用を説明する。まず、前記第１パターンベルトメッキ機構１２Ａ及び第２パターンベルトメッキ機構１２Ｂによって前記第１ＤＬＣパターンベルト２６Ａ及び第２ＤＬＣパターンベルト２６Ｂの表面に第１回路パターンメッキ層ＭＡ及び第２回路パターンメッキ層ＭＢを形成する。次いで、前記第１圧着転写ローラー３８Ａ及び第２圧着転写ローラー３８Ｂの間に前記プリント回路基板用基材４０を供給する。 The operation is explained by the above configuration. First, the first circuit pattern plating layer MA and the second circuit pattern plating layer MB are formed on the surfaces of the first DLC pattern belt 26A and the second DLC pattern belt 26B by the first pattern belt plating mechanism 12A and the second pattern belt plating mechanism 12B. Form. Next, the printed circuit board substrate 40 is supplied between the first pressure transfer roller 38A and the second pressure transfer roller 38B.
 　該第１ＤＬＣパターンベルト２６Ａ及び第２ＤＬＣパターンベルト２６Ｂの表面に形成された第１回路パターンメッキ層ＭＡ及び第２回路パターンメッキ層ＭＢを前記第１圧着転写ローラー３８Ａ及び第２圧着転写ローラー３８Ｂによって該プリント回路基板用基材４０の両面に圧着転写せしめることによってプリント回路基板４０Ｍを形成する。前記プリント回路基板形成収納機構１４によって該回路パターンが形成された両面プリント回路基板４０Ｍを収納する。 The first circuit pattern plating layer MA and the second circuit pattern plating layer MB formed on the surfaces of the first DLC pattern belt 26A and the second DLC pattern belt 26B are transferred to the first pressure transfer roller 38A and the second pressure transfer roller 38B. The printed circuit board 40M is formed by pressure transfer onto both surfaces of the printed circuit board substrate 40. The printed circuit board forming and storing mechanism 14 stores the double-sided printed circuit board 40M on which the circuit pattern is formed.
 　なお、本発明においては、該第１ＤＬＣパターンベルト２６Ａ及び第２ＤＬＣパターンベルト２６Ｂの表面に形成された第１回路パターンメッキ層ＭＡ及び第２回路パターンメッキ層ＭＢを前記第１圧着転写ローラー３８Ａ及び第２圧着転写ローラー３８Ｂによって該プリント回路基板用基材４０の両面に圧着転写せしめることによってプリント回路基板４０Ｍを形成するものであるが、上記した回路パターンメッキ層ＭＡ，ＭＢをプリント回路基板用基材４０に圧着転写するに際して、当該回路パターンメッキ層ＭＡ，ＭＢが円滑に転写されるためには該前記第１及び第２ＤＬＣパターンベルト２６Ａ，２６Ｂに予め離型処理剤によって処理しておくのが好ましい。そこで、前記第１及び第２メッキ液Ｍ，Ｍに前記第１及び第２ＤＬＣパターンベルト２６Ａ，２６Ｂを浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記第１及び第２メッキユニット２２Ａ，２２Ｂにおいて第１及び第２メッキ槽２０Ａ，２０Ｂの前に離型処理剤を収容する第１離型処理剤槽５０Ａ及び第２離型処理剤槽５０Ｂ並びに水洗するための第１水槽５２Ａ及び第２水槽５２Ｂをそれぞれ設置する構成とするのが好ましい。５４Ａは第１メッキ層２０Ａから排出される第１回路パターンメッキ層ＭＡが形成された第１ＤＬＣパターンベルト２６Ａを水洗するための第１水洗槽であり、５４Ｂは第２メッキ層２０Ｂから排出される第２回路パターンメッキ層ＭＢが形成された第２ＤＬＣパターンベルト２６Ｂを水洗するための第２水洗槽である。 In the present invention, the first circuit pattern plating layer MA and the second circuit pattern plating layer MB formed on the surfaces of the first DLC pattern belt 26A and the second DLC pattern belt 26B are used as the first pressure transfer roller 38A and the first DLC pattern belt 26A. The printed circuit board 40M is formed by pressure-transferring both surfaces of the printed circuit board base material 40 by the two pressure transfer roller 38B. The circuit pattern plating layers MA and MB described above are formed on the printed circuit board base material. In order to transfer the circuit pattern plating layers MA and MB smoothly when pressure-transferred to 40, it is preferable that the first and second DLC pattern belts 26A and 26B be preliminarily treated with a release treatment agent. . Therefore, before immersing the first and second DLC pattern belts 26A and 26B in the first and second plating solutions M and M, in order to perform a pre-treatment of immersing in a mold release treatment agent, and then washing with water, In the first and second plating units 22A and 22B, a first release treatment agent tank 50A and a second release treatment agent tank 50B for accommodating a release treatment agent before the first and second plating tanks 20A and 20B, and It is preferable that the first water tank 52A and the second water tank 52B for washing are respectively installed. 54A is a first washing tank for washing the first DLC pattern belt 26A on which the first circuit pattern plating layer MA discharged from the first plating layer 20A is formed, and 54B is discharged from the second plating layer 20B. It is the 2nd washing tank for washing 2nd DLC pattern belt 26B in which 2nd circuit pattern plating layer MB was formed.
 　また、前記第１及び第２圧着転写ローラー３８Ａ，３８Ｂとプリント回路基板収納機構４６の間に表裏位置決めセンサー５５を設置し、前記プリント回路基板用基材４０の両面に第１回路パターンメッキ層ＭＡ及び第２回路パターンメッキ層ＭＢを圧着転写せしめることによってプリント回路基板４０Ｍが形成された後に、該第１回路パターンメッキ層ＭＡ及び第２回路パターンメッキ層ＭＢが形成された前記プリント回路基板用基材４０の両面の一方の面（例えば、第２パターンベルトメッキ機構１２Ｂの側の面）に予め形成された基準マーク（図示せず）に対して該両面の他方の面（例えば、第１パターンベルトメッキ機構１２Ａの側の面）の位置検出信号により、該他方の面に対してパターンベルトメッキ層を圧着転写したパターンベルト回動手段（例えば、第１パターンベルト回動手段３２Ａ）の位置補正を行うことができるようにするのが好適である。 Further, a front / back positioning sensor 55 is installed between the first and second pressure transfer rollers 38A and 38B and the printed circuit board storage mechanism 46, and a first circuit pattern plating layer MA is formed on both surfaces of the printed circuit board substrate 40. The printed circuit board base on which the first circuit pattern plating layer MA and the second circuit pattern plating layer MB are formed after the printed circuit board 40M is formed by pressure transfer of the second circuit pattern plating layer MB. The other surface of the material 40 (for example, the first pattern) with respect to a reference mark (not shown) formed in advance on one surface of the material 40 (for example, the surface on the second pattern belt plating mechanism 12B side). A pattern obtained by pressure-transferring the pattern belt plating layer to the other surface by a position detection signal of the belt plating mechanism 12A side surface) Belt rotation means (e.g., first pattern belt rotating means 32A) it is preferable to be able to correct the position of the.
　さらに、プリント回路基板用基材４０の両面に紫外線硬化性接着剤が塗布しておき、図１に示すように、前記第１及び第２圧着転写ローラー３８Ａ，３８Ｂとプリント回路基板収納機構４６の間に紫外線照射装置６０を設け、前記プリント回路基板用基材４０の両面に第１及び第２回路パターンメッキ層ＭＡ，ＭＢが前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置６０によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、前記第１及び第２回路パターンメッキ層ＭＡ，ＭＢを強固に接着せしめて前記プリント回路基板用基材４０の両面にプリント回路基板４０Ｍを形成するのが好適である。なお、紫外線硬化性接着剤及び紫外線照射装置６０については従来公知のものが使用できる。 Further, an ultraviolet curable adhesive is applied to both surfaces of the printed circuit board substrate 40, and as shown in FIG. 1, the first and second pressure transfer rollers 38A and 38B and the printed circuit board storage mechanism 46 are arranged. An ultraviolet irradiation device 60 is provided between the first and second circuit pattern plating layers MA and MB on both surfaces of the printed circuit board base material 40 via the ultraviolet curable adhesive. The ultraviolet curable adhesive is cured by irradiating ultraviolet rays with an ultraviolet irradiating device 60, and the first and second circuit pattern plating layers MA and MB are firmly adhered to both surfaces of the printed circuit board substrate 40. It is preferable to form the printed circuit board 40M. In addition, a conventionally well-known thing can be used about the ultraviolet curable adhesive and the ultraviolet irradiation device 60. FIG.
　またさらに、前記紫外線硬化性接着剤が塗布されたプリント回路基板用基材４０の塗布面に離型紙を貼付しておき、前記第１及び第２圧着転写ローラー３８Ａ，３８Ｂに到達する前に前記離型紙を剥がすようにすれば、前記紫外線硬化性接着剤の塗布面が、意図していない場所などに付着することを防ぐことが出来る。 Furthermore, a release paper is pasted on the application surface of the printed circuit board base material 40 to which the ultraviolet curable adhesive is applied, and before reaching the first and second pressure transfer rollers 38A and 38B, If the release paper is peeled off, the application surface of the ultraviolet curable adhesive can be prevented from adhering to an unintended place or the like.
　また、上述のようにしてプリント回路基板４０Ｍを形成した後も、前記プリント回路基板４０Ｍの表面上に離型紙を貼付せしめてから前記プリント回路基板収納機構４６によって収納されるようにすれば、前記プリント回路基板４０Ｍの表面を保護することができる。 Further, even after the printed circuit board 40M is formed as described above, if the release circuit is pasted on the surface of the printed circuit board 40M and then stored by the printed circuit board storage mechanism 46, The surface of the printed circuit board 40M can be protected.
 　図１において、５６Ａは第１メッキ槽２０Ａ内に設置された第１銅メッキ用不溶性陽極であり、５６Ｂは第２メッキ槽２０Ｂ内に設置された第２銅メッキ用不溶性陽極である。５８Ａは該第１銅メッキ用不溶性陽極５６Ａ及び回動ローラー３４Ａにそれぞれ接続する第１整流器であり、５８Ｂは該第２銅メッキ用不溶性陽極５６Ｂ及び回動ローラー３４Ｂにそれぞれ接続する第２整流器である。 In FIG. 1, 56A is the first copper plating insoluble anode installed in the first plating tank 20A, and 56B is the second copper plating insoluble anode installed in the second plating tank 20B. 58A is a first rectifier connected to the insoluble anode 56A for the first copper plating and the rotating roller 34A, and 58B is a second rectifier connected to the insoluble anode 56B for the second copper plating and the rotating roller 34B, respectively. is there.
 　本発明の両面プリント回路基板製造方法は、
 　本発明の両面プリント回路基板製造装置１０を用いる方法であって、
 　前記第１及び第２パターンベルトメッキ機構１２Ａ，１２Ｂによって前記第１及び第２ＤＬＣパターンベルト２６Ａ，２６Ｂの表面に第１及び第２回路パターンメッキ層ＭＡ，ＭＢを形成する工程と、
 　第１及び第２圧着転写ローラー３８Ａ，３８Ｂの間に前記プリント回路基板用基材４０を供給し、該第１及び第２ＤＬＣパターンベルト２６Ａ，２６Ｂの表面に形成された第１及び第２回路パターンメッキ層ＭＡ，ＭＢを前記第１及び第２圧着転写ローラー３８Ａ，３８Ｂによって該プリント回路基板用基材４０の両面に圧着転写せしめることによって両面プリント回路基板４０Ｍを形成する工程と、
 を有するものである。 The double-sided printed circuit board manufacturing method of the present invention is
A method of using the double-sided printed circuit board manufacturing apparatus 10 of the present invention,
Forming first and second circuit pattern plating layers MA and MB on the surfaces of the first and second DLC pattern belts 26A and 26B by the first and second pattern belt plating mechanisms 12A and 12B;
The printed circuit board substrate 40 is supplied between the first and second pressure transfer rollers 38A and 38B, and the first and second circuit patterns formed on the surfaces of the first and second DLC pattern belts 26A and 26B. Forming the double-sided printed circuit board 40M by pressure-transferring the plating layers MA and MB onto both sides of the printed circuit board substrate 40 by the first and second pressure- transfer rollers 38A and 38B;
It is what has.
 　続いて、図４を用いて本発明のプリント回路基板製造装置について説明する。
 　図４において、１１０は本発明のプリント回路基板製造装置である。該プリント回路基板製造装置１１０は、片面プリント回路基板を製造するものであり、図１に示した両面プリント回路基板製造装置１０において、一方のパターンベルトメッキ機構（例えば、第２パターンベルトメッキ機構１２Ｂ）を取り外した構成を有するものである。 Then, the printed circuit board manufacturing apparatus of this invention is demonstrated using FIG.
In FIG. 4, reference numeral 110 denotes a printed circuit board manufacturing apparatus according to the present invention. The printed circuit board manufacturing apparatus 110 manufactures a single-sided printed circuit board. In the double-sided printed circuit board manufacturing apparatus 10 shown in FIG. 1, one pattern belt plating mechanism (for example, the second pattern belt plating mechanism 12B). ) Is removed.
 　該プリント回路基板製造装置１１０はパターンベルトメッキ機構１１２及びプリント回路基板形成収納機構１１４を有している。 該 The printed circuit board manufacturing apparatus 110 has a pattern belt plating mechanism 112 and a printed circuit board forming and storing mechanism 114.
 　前記パターンベルトメッキ機構１１２はメッキ液Ｍを収容したメッキ槽１２０を含むメッキユニット１２２を有している。該メッキ槽１２０は図３に示したオーバーフロー部と同様のオーバーフロー部（図示せず）を有しており、メッキ処理中はメッキ液Ｍを常時オーバーフローさせておいて、メッキ液Ｍの液面を常時所定の高さに保持するように構成されている。１２６はＤＬＣパターンベルトで、その表面には後述する方法によって形成された凸状のＤＬＣパターン１２８が設けられ、該ＤＬＣパターン１２８以外の表面部分はメッキ液Ｍを収容できる凹部１３０となっている。該ＤＬＣパターンベルト１２６は回動可能に設けられるとともに、該メッキ槽１２０のメッキ液Ｍに浸漬されると上記凹部１３０にメッキ液Ｍが収容され、その表面に回路パターンメッキ層ＭＡが形成されるものである。 パ タ ー ン The pattern belt plating mechanism 112 has a plating unit 122 including a plating tank 120 containing a plating solution M. The plating tank 120 has an overflow portion (not shown) similar to the overflow portion shown in FIG. 3, and the plating solution M is always overflowed during the plating process so that the surface of the plating solution M is maintained. It is configured to be held at a predetermined height at all times. A DLC pattern belt 126 is provided with a convex DLC pattern 128 formed by a method to be described later on its surface, and a surface portion other than the DLC pattern 128 is a recess 130 in which the plating solution M can be stored. The DLC pattern belt 126 is rotatably provided. When the DLC pattern belt 126 is immersed in the plating solution M in the plating tank 120, the plating solution M is accommodated in the recess 130, and a circuit pattern plating layer MA is formed on the surface thereof. Is.
 　１３２はパターンベルト回動手段で、該メッキ槽１２０の両側部に設けられた相対向する一対の回動ローラー１３４，１３６及び圧着転写ローラー１３８からなり、これらのローラー１３４，１３６，１３８に該ＤＬＣパターンベルト１２６を捲回しこれらのローラー１３４，１３６，１３８を回動することによって該ＤＬＣパターンベルト１２６を回動させる。該圧着転写ローラー１３８は後述するプリント回路基板用基材１４０の一面に前記回路パターンメッキ層ＭＡを圧着転写するように作用する。１４１は該圧着転写ローラーに対向して設置された押圧ローラーである。 Reference numeral 132 denotes a pattern belt rotating means, which includes a pair of rotating rollers 134 and 136 and a pressure-transfer roller 138 which are provided on both sides of the plating tank 120 and are opposed to each other. These rollers 134, 136 and 138 are connected to the DLC. The DLC pattern belt 126 is rotated by winding the pattern belt 126 and rotating these rollers 134, 136 and 138. The pressure transfer roller 138 acts to pressure transfer the circuit pattern plating layer MA onto one surface of a printed circuit board substrate 140 described later. Reference numeral 141 denotes a pressing roller installed to face the pressure-transfer transfer roller.
 　前記プリント回路基板形成収納機構１１４は、前記メッキ槽１２０の側方（前記圧着転写ローラー１３８が位置する側）に設けられかつプリント回路基板用基材１４０を供給するプリント回路基板用基材供給手段１４２を有している。１４４は回路パターン圧着転写手段で、前記圧着転写ローラー１３８を有しかつ前記プリント回路基板用基材供給手段１４２から該圧着転写ローラー１３８及び押圧ローラー１４１の間に供給されるプリント回路基板用基材１４０の片面に回路パターンメッキ層ＭＡを圧着転写せしめ、回路パターンを形成するように作用する。１４６はプリント回路基板収納機構で、該回路パターンが形成されたプリント回路基板１４０Ｍを収納する。 The printed circuit board forming and storing mechanism 114 is provided on the side of the plating tank 120 (the side on which the pressure-transfer transfer roller 138 is located) and supplies the printed circuit board base material 140. 142. Reference numeral 144 denotes a circuit pattern pressure transfer unit, which has the pressure transfer roller 138 and is supplied between the pressure transfer roller 138 and the pressure roller 141 from the printed circuit board base material supply unit 142. The circuit pattern plating layer MA is pressure-transferred on one side of 140 to act to form a circuit pattern. Reference numeral 146 denotes a printed circuit board housing mechanism that houses the printed circuit board 140M on which the circuit pattern is formed.
 　上記構成によりその作用を説明する。前記パターンベルトメッキ機構１１２によって前記ＤＬＣパターンベルト１２６の表面に回路パターンメッキ層ＭＡを形成し、前記圧着転写ローラー１３８及び押圧ローラー１４１の間に前記プリント回路基板用基材１４０を供給し、該ＤＬＣパターンベルト１２６の表面に形成された回路パターンメッキ層ＭＡを前記圧着転写ローラー１３８及び押圧ローラー１４１によって該プリント回路基板用基材１４０の片面に圧着転写せしめることによってプリント回路基板１４０Ｍを形成し、前記プリント回路基板形成収納機構１１４によって該回路パターンが形成されたプリント回路基板１４０Ｍを収納するようにしたことを特徴とする。 The operation is explained by the above configuration. A circuit pattern plating layer MA is formed on the surface of the DLC pattern belt 126 by the pattern belt plating mechanism 112, and the printed circuit board substrate 140 is supplied between the pressure-transfer roller 138 and the pressure roller 141, and the DLC The printed circuit board 140M is formed by pressure-transferring the circuit pattern plating layer MA formed on the surface of the pattern belt 126 onto one surface of the printed circuit board substrate 140 by the pressure transfer roller 138 and the pressure roller 141, and A printed circuit board 140M on which the circuit pattern is formed is stored by the printed circuit board forming and storing mechanism 114.
 　なお、前記メッキ液Ｍに前記ＤＬＣパターンベルト１２６を浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記メッキユニット１２２においてメッキ槽の前に離型処理剤を収容する離型処理剤槽１５０及び水洗するための水槽１５２を設置するのが好適である。１５４はメッキ槽１２０から排出される回路パターンメッキ層ＭＡが形成されたＤＬＣパターンベルト１２６を水洗するための水洗槽である。 In addition, before the DLC pattern belt 126 is immersed in the plating solution M, a pre-treatment for immersing in a mold release treatment agent is performed, and then a water release is performed in the plating unit 122 before the plating tank. It is preferable to install a release agent tank 150 for storing the agent and a water tank 152 for washing with water. Reference numeral 154 denotes a washing tank for washing the DLC pattern belt 126 on which the circuit pattern plating layer MA discharged from the plating tank 120 is formed.
　さらに、プリント回路基板用基材１４０の一面に紫外線硬化性接着剤が塗布しておき、図４に示すように、前記圧着転写ローラー１３８とプリント回路基板収納機構１４６の間に紫外線照射装置６０を設け、前記プリント回路基板用基材１４０の一面に回路パターンメッキ層ＭＡが前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置６０によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、回路パターンメッキ層ＭＡを強固に接着せしめて前記プリント回路基板用基材１４０の片面にプリント回路基板１４０Ｍを形成するのが好適である。なお、紫外線硬化性接着剤及び紫外線照射装置６０については従来公知のものが使用できる。 Further, an ultraviolet curable adhesive is applied to one surface of the printed circuit board substrate 140, and an ultraviolet irradiation device 60 is provided between the pressure-transfer transfer roller 138 and the printed circuit board storage mechanism 146 as shown in FIG. After the circuit pattern plating layer MA is pressure-transferred onto the one surface of the printed circuit board substrate 140 via the ultraviolet curable adhesive, the ultraviolet curing is performed by irradiating the ultraviolet rays with the ultraviolet irradiation device 60. It is preferable that the printed circuit board 140M is formed on one side of the printed circuit board substrate 140 by curing the adhesive and firmly bonding the circuit pattern plating layer MA. In addition, a conventionally well-known thing can be used about the ultraviolet curable adhesive and the ultraviolet irradiation device 60. FIG.
　またさらに、前記紫外線硬化性接着剤が塗布されたプリント回路基板用基材１４０の塗布面に離型紙を貼付しておき、前記圧着転写ローラー１３８に到達する前に前記離型紙を剥がすようにすれば、前記紫外線硬化性接着剤の塗布面が、意図していない場所などに付着することを防ぐことが出来る。 Still further, a release paper is affixed to the application surface of the printed circuit board substrate 140 to which the ultraviolet curable adhesive is applied, and the release paper is peeled off before reaching the pressure-transfer roller 138. For example, the application surface of the ultraviolet curable adhesive can be prevented from adhering to an unintended place.
　また、上述のようにしてプリント回路基板１４０Ｍを形成した後も、前記プリント回路基板１４０Ｍの表面上に離型紙を貼付せしめてから前記プリント回路基板収納機構１４６によって収納されるようにすれば、前記プリント回路基板１４０Ｍの表面を保護することができる。 Further, even after the printed circuit board 140M is formed as described above, if the release circuit is pasted on the surface of the printed circuit board 140M and then stored by the printed circuit board storage mechanism 146, The surface of the printed circuit board 140M can be protected.
 　図４において、１５６はメッキ槽１２０内に設置された銅メッキ用不溶性陽極である。１５８は該銅メッキ用不溶性陽極１５６及び回動ローラー１３４にそれぞれ接続する整流器である。 に お い て In FIG. 4, reference numeral 156 denotes an insoluble anode for copper plating installed in the plating tank 120. Reference numeral 158 denotes a rectifier connected to the copper plating insoluble anode 156 and the rotating roller 134, respectively.
 　本発明のプリント回路基板製造方法は、本発明のプリント回路基板製造装置を用いる方法であって、
 　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成する工程と、
 　前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラーによって該プリント回路基板用基材の片面に圧着転写せしめることによってプリント回路基板を形成する工程と、
 を有するものである。 The printed circuit board manufacturing method of the present invention is a method using the printed circuit board manufacturing apparatus of the present invention,
Forming a circuit pattern plating layer on the surface of the DLC pattern belt by the pattern belt plating mechanism;
The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. Forming a printed circuit board by crimping and transferring to one side of the material;
It is what has.
 　本発明において使用されるＤＬＣパターンベルトの製造方法について図５及び図６によって以下に説明する。
 　まず、基材ベルト２１２の表面に感光材２１４を塗布する（図５（ａ）及び図６のステップ３００）。露光・現像せしめてレジストパターン２１６を形成する（図５（ｂ）及び図６のステップ３０２）。感光材として用いる感光性組成物はネガ型及びポジ型のいずれでも使用可能であるが、ネガ型感光性組成物を用いるのが好ましい。 The manufacturing method of the DLC pattern belt used in the present invention will be described below with reference to FIGS.
First, the photosensitive material 214 is applied to the surface of the base belt 212 (step 300 in FIG. 5A and FIG. 6). The resist pattern 216 is formed by exposure and development (step 302 in FIG. 5B and FIG. 6). The photosensitive composition used as the photosensitive material can be either a negative type or a positive type, but it is preferable to use a negative photosensitive composition.
 　次に、該基材ベルト２１２及びレジストパターン２１６の表面にＤＬＣ被覆膜２１８を形成する（図５（ｃ）及び図６のステップ３０４）。ＤＬＣ被覆膜はＣＶＤ（Chemical Vapor Deposition）法やスパッタ法によって形成すればよい。 Next, a DLC coating film 218 is formed on the surface of the base material belt 212 and the resist pattern 216 (step 304 in FIG. 5C and FIG. 6). The DLC coating film may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.
 　次いで、該レジストパターン上に形成されたＤＬＣ被覆膜を該レジストパターンごと剥離せしめ、基材の表面に凸条のＤＬＣパターン２２０及び凹部２２２を形成する（図５（ｄ）及び図６のステップ３０６）。このようにしてＤＬＣパターンベルト２２４を製造することができる。この製造されたＤＬＣパターンベルトを本発明におけるＤＬＣパターンベルト２６Ａ，２６Ｂ，１２６として用いることができる。 Next, the DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form the convex DLC pattern 220 and the concave portion 222 on the surface of the substrate (steps of FIGS. 5D and 6). 306). In this way, the DLC pattern belt 224 can be manufactured. The manufactured DLC pattern belt can be used as the DLC pattern belts 26A, 26B, and 126 in the present invention.
 １０： 両面プリント回路基板製造装置、１２Ａ：第１パターンベルトメッキ機構、１２Ｂ：第２パターンベルトメッキ機構、１４：プリント回路基板形成収納機構、２０Ａ：第１メッキ槽、２０Ｂ：第２メッキ槽、２２Ａ：第１メッキユニット，２２Ｂ：第２メッキユニット、２４：オーバーフロー部、２６Ａ：第１ＤＬＣパターンベルト，２６Ｂ：第２ＤＬＣパターンベルト、２８Ａ：第１ＤＬＣパターン、２８Ｂ：第２ＤＬＣパターン、３０Ａ：第１凹部、３０Ｂ：第２凹部、３２Ａ：第１パターンベルト回動手段、３２Ｂ：第２パターンベルト回動手段、３４Ａ、３６Ａ、３４Ｂ、３６Ｂ：回動ローラー、３７Ａ：第１乾燥ユニット、３７Ｂ：第２乾燥ユニット、３８Ａ：第１圧着転写ローラー，３８Ｂ：第２圧着転写ローラー、４０：プリント回路基板用基材、４０Ｍ：プリント回路基板、４２：プリント回路基板用基材供給手段、４４：回路パターン圧着転写手段、４６：プリント回路基板収納機構、５０Ａ：第１離型処理剤槽、５０Ｂ：第２離型処理剤槽、５２Ａ：第１水槽、５２Ｂ：第２水槽、５４Ａ：第１水洗槽，５４Ｂ：第２水洗槽、５５：表裏位置決めセンサー、５６Ａ：第１銅メッキ用不溶性陽極、５６Ｂ：第２銅メッキ用不溶性陽極、５８Ａ：第１整流器、５８Ｂ：第２整流器、６０：紫外線照射装置、１１２：パターンベルトメッキ機構、１１４：プリント回路基板形成収納機構、１２０：メッキ槽、１２２：メッキユニット、１２４：オーバーフロー部、１２６：ＤＬＣパターンベルト、１２８：ＤＬＣパターン、１３０：凹部、１３４，１３６：回動ローラー、１３８：圧着転写ローラー、１４０：プリント回路基板用基材、１４０Ｍ：プリント回路基板、１４１：押圧ローラー、１４２：プリント回路基板用基材供給手段、１４６：プリント回路基板収納機構、１５０：離型処理剤槽、１５２：水槽、１５６：銅メッキ用不溶性陽極、２１２：基材ベルト、２１４：感光材、２１６：レジストパターン、２１８：ＤＬＣ被覆膜、２２０：ＤＬＣパターン、２２２：凹部、２２４：ＤＬＣパターンベルト、Ｍ：メッキ液、ＭＡ，ＭＢ：回路パターンメッキ層。 10: double-sided printed circuit board manufacturing apparatus, 12A: first pattern belt plating mechanism, 12B: second pattern belt plating mechanism, 14: printed circuit board formation and storage mechanism, 20A: first plating tank, 20B: second plating tank, 22A: first plating unit, 22B: second plating unit, 24: overflow portion, 26A: first DLC pattern belt, 26B: second DLC pattern belt, 28A: first DLC pattern, 28B: second DLC pattern, 30A: first recess , 30B: second recess, 32A: first pattern belt rotating means, 32B: second pattern belt rotating means, 34A, 36A, 34B, 36B: rotating roller, 37A: first drying unit, 37B: second Drying unit, 38A: first pressure transfer roller, 38B: second pressure transfer roller, 4 0: base material for printed circuit board, 40M: printed circuit board, 42: base material supply means for printed circuit board, 44: circuit pattern pressure transfer means, 46: printed circuit board storage mechanism, 50A: first release treatment agent Tank, 50B: second release treatment agent tank, 52A: first water tank, 52B: second water tank, 54A: first water washing tank, 54B: second water washing tank, 55: front / back positioning sensor, 56A: first copper plating Insoluble Anode, 56B: Insoluble Anode for Second Copper Plating, 58A: First Rectifier, 58B: Second Rectifier, 60: Ultraviolet Irradiator, 112: Pattern Belt Plating Mechanism, 114: Printed Circuit Board Forming and Storage Mechanism, 120: Plating tank, 122: plating unit, 124: overflow portion, 126: DLC pattern belt, 128: DLC pattern, 130: recess, 134, 136: Moving roller, 138: pressure transfer roller, 140: base material for printed circuit board, 140M: printed circuit board, 141: pressure roller, 142: base material supply means for printed circuit board, 146: printed circuit board storage mechanism, 150: Release agent tank, 152: water tank, 156: insoluble anode for copper plating, 212: substrate belt, 214: photosensitive material, 216: resist pattern, 218: DLC coating film, 220: DLC pattern, 222: recess, 224: DLC pattern belt, M: plating solution, MA, MB: circuit pattern plating layer.

Claims (11)

  1.  　メッキ液を収容した第１メッキ槽を含む第１メッキユニットと、
     　該第１メッキ槽のメッキ液に浸漬されてその表面に第１回路パターンメッキ層が形成されるとともに回動可能に設けられた第１ＤＬＣパターンベルトと、
     　該第１ＤＬＣパターンベルトを回動させかつプリント回路基板用基材の一面に前記第１回路パターンメッキ層を圧着転写する第１圧着転写ローラーを含む第１パターンベルト回動手段と、
     を有する第１パターンベルトメッキ機構と；
     　メッキ液を収容しかつ前記第１メッキ槽から所定間隔を介して設置された第２メッキ槽を含む第２メッキユニットと、
     　該第２メッキ槽のメッキ液に浸漬されてその表面に第２回路パターンメッキ層が形成されるとともに回転可能に設けられた第２ＤＬＣパターンベルトと、
     　該第２ＤＬＣパターンベルトを回動させるとともに前記第１圧着転写ローラーに対向して設置されかつプリント回路基板用基材の他面に前記第２回路パターンメッキ層を圧着転写する第２圧着転写ローラーを含む第２パターンベルト回動手段と、
     を有する第２パターンベルトメッキ機構と；
     　前記第１メッキ槽と第２メッキ槽との間に設けられかつプリント回路基板用基材を供給するプリント回路基板用基材供給手段と、
     　前記第１及び第２圧着転写ローラーを有しかつ前記プリント回路基板用基材供給手段から該第１及び第２圧着転写ローラーの間に供給されるプリント回路基板用基材の両面に回路パターンを圧着転写せしめる回路パターン圧着転写手段と、
     　該回路パターンが形成されたプリント回路基板を収納するプリント回路基板収納機構と、
     を有するプリント回路基板形成収納機構と；
     を含み、
     　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成し、前記第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって両面プリント回路基板を形成し、前記プリント回路基板形成収納機構によって該回路パターンが形成された両面プリント回路基板を収納するようにしたことを特徴とする両面プリント回路基板製造装置。     A first plating unit including a first plating tank containing a plating solution;
    A first DLC pattern belt that is dipped in the plating solution of the first plating tank to form a first circuit pattern plating layer on the surface thereof and is rotatably provided;
    A first pattern belt rotating means including a first pressure transfer roller for rotating the first DLC pattern belt and pressure-transferring the first circuit pattern plating layer on one surface of a printed circuit board substrate;
    A first pattern belt plating mechanism having:
    A second plating unit containing a plating solution and including a second plating tank installed at a predetermined interval from the first plating tank;
    A second DLC pattern belt that is dipped in the plating solution of the second plating tank and has a second circuit pattern plating layer formed on the surface thereof, and is rotatably provided;
    A second pressure-transfer roller that rotates the second DLC pattern belt and faces the first pressure-transfer transfer roller, and that pressure-transfers the second circuit pattern plating layer to the other surface of the printed circuit board substrate. Including second pattern belt rotating means;
    A second pattern belt plating mechanism having:
    A printed circuit board base material supply means that is provided between the first plating tank and the second plating tank and supplies a printed circuit board base material;
    Circuit patterns are formed on both sides of the printed circuit board substrate having the first and second pressure transfer rollers and supplied between the first and second pressure transfer rollers from the printed circuit board substrate supply means. A circuit pattern pressure transfer means for pressure transfer;
    A printed circuit board storage mechanism for storing a printed circuit board on which the circuit pattern is formed;
    A printed circuit board forming and storing mechanism having:
    Including
    First and second circuit pattern plating layers are formed on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms, and the printed circuit is interposed between the first and second pressure transfer rollers. The substrate for substrate is supplied, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the substrate for printed circuit board by the first and second pressure transfer rollers. A double-sided printed circuit board manufactured by forming a double-sided printed circuit board by pressure-transferring on both sides and storing the double-sided printed circuit board on which the circuit pattern is formed by the printed circuit board forming and storing mechanism apparatus.
  2.  　前記第１及び第２メッキ液に前記第１及び第２ＤＬＣパターンベルトを浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記第１及び第２メッキユニットにおいて第１及び第２メッキ槽の前に離型処理剤を収容する第１及び第２離型処理剤槽並びに水洗するための第１及び第２水槽をそれぞれ設置することを特徴とする請求項１記載の両面プリント回路基板製造装置。 Before the first and second DLC pattern belts are immersed in the first and second plating solutions, the first and second plating units are subjected to a pretreatment that is immersed in a release agent and then washed with water. The first and second release treatment agent tanks for storing the release treatment agent and the first and second water tanks for washing with water are respectively installed in front of the first and second plating tanks. 2. The double-sided printed circuit board manufacturing apparatus according to 1.
  3.  　前記第１及び第２圧着転写ローラーとプリント回路基板収納機構の間に表裏位置決めセンサーを設置し、前記プリント回路基板用基材の両面に第１及び第２回路パターンメッキ層が圧着転写せしめることによってプリント回路基板が形成された後に、該第１及び第２回路パターンメッキ層が形成された前記プリント回路基板用基材の両面の一方の面に予め形成された基準マークに対して該両面の他方の面の位置検出信号により、該他方の面に対してパターンベルトメッキ層を圧着転写したパターンベルト回動手段の位置補正を行うことができるようにしたことを特徴とする請求項１又は２記載の両面プリント回路基板製造装置。 By installing front and back positioning sensors between the first and second pressure transfer rollers and the printed circuit board storage mechanism, the first and second circuit pattern plating layers are pressure transferred on both sides of the printed circuit board base material. After the printed circuit board is formed, the other of the two surfaces of the printed circuit board base material on which the first and second circuit pattern plating layers are formed with respect to a reference mark previously formed on one surface of the printed circuit board substrate. 3. The position of the pattern belt rotating means obtained by pressure-transferring the pattern belt plating layer to the other surface can be corrected by the position detection signal of the surface. Double-sided printed circuit board manufacturing equipment.
  4. 　前記プリント回路基板用基材が、その両面に紫外線硬化性接着剤が塗布されてなり、前記第１及び第２圧着転写ローラーとプリント回路基板収納機構の間に紫外線照射装置を設け、前記プリント回路基板用基材の両面に第１及び第２回路パターンメッキ層が前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、前記第１及び第２回路パターンメッキ層を強固に接着せしめて前記両面プリント回路基板を形成してなることを特徴とする請求項１～３いずれか１項記載の両面プリント回路基板製造装置。 The printed circuit board base material is coated with an ultraviolet curable adhesive on both sides thereof, and an ultraviolet irradiation device is provided between the first and second pressure transfer rollers and the printed circuit board storage mechanism, and the printed circuit After the first and second circuit pattern plating layers are pressure-transferred onto both surfaces of the substrate substrate via the ultraviolet curable adhesive, the ultraviolet curable adhesive is irradiated with ultraviolet rays by the ultraviolet irradiation device. 4. The double-sided printed circuit board according to claim 1, wherein the double-sided printed circuit board is formed by curing the first and second circuit pattern plating layers to form a double-sided printed circuit board. Manufacturing equipment.
  5.  　請求項１～４のいずれか１項記載の装置を用いる両面プリント回路基板製造方法であって、
     　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成する工程と、
     　第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって両面プリント回路基板を形成する工程と、
     を有することを特徴とする両面プリント回路基板製造方法。     A method for producing a double-sided printed circuit board using the apparatus according to any one of claims 1 to 4,
    Forming first and second circuit pattern plating layers on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms;
    The printed circuit board base material is supplied between first and second pressure transfer rollers, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the first and second circuit pattern plating layers. Forming a double-sided printed circuit board by pressure-transferring both sides of the printed circuit board base material by a second pressure-transfer roller;
    A method for producing a double-sided printed circuit board, comprising:
  6.  　請求項１～４のいずれか１項記載の装置を用いて製造された両面プリント回路基板であって、
     　前記第１及び第２パターンベルトメッキ機構によって前記第１及び第２ＤＬＣパターンベルトの表面に第１及び第２回路パターンメッキ層を形成し、
     　第１及び第２圧着転写ローラーの間に前記プリント回路基板用基材を供給し、該第１及び第２ＤＬＣパターンベルトの表面に形成された第１及び第２回路パターンメッキ層を前記第１及び第２圧着転写ローラーによって該プリント回路基板用基材の両面に圧着転写せしめることによって製造されたことを特徴とする両面プリント回路基板。     A double-sided printed circuit board manufactured using the apparatus according to any one of claims 1 to 4,
    Forming first and second circuit pattern plating layers on the surfaces of the first and second DLC pattern belts by the first and second pattern belt plating mechanisms;
    The printed circuit board base material is supplied between first and second pressure transfer rollers, and the first and second circuit pattern plating layers formed on the surfaces of the first and second DLC pattern belts are formed on the first and second circuit pattern plating layers. A double-sided printed circuit board manufactured by pressure-transferring both sides of the substrate for a printed circuit board with a second pressure-transfer roller.
  7.  　メッキ液を収容したメッキ槽を含むメッキユニットと、
     　該メッキ槽のメッキ液に浸漬されてその表面に回路パターンメッキ層が形成されるとともに回動可能に設けられたＤＬＣパターンベルトと、
     　該ＤＬＣパターンベルトを回動させかつプリント回路基板用基材の一面に前記回路パターンメッキ層を圧着転写する圧着転写ローラーを含むパターンベルト回動手段と、
     　該圧着転写ローラーに対向して設置された押圧ローラーと、
     を有するパターンベルトメッキ機構と；
     　前記メッキ槽の側方に設けられかつプリント回路基板用基材を供給するプリント回路基板用基材供給手段と、
     　前記圧着転写ローラー及び押圧ローラーを有しかつ前記プリント回路基板用基材供給手段から該圧着転写ローラー及び押圧ローラーの間に供給されるプリント回路基板用基材の片面に回路パターンを圧着転写せしめる回路パターン圧着転写手段と、
     　該回路パターンが形成されたプリント回路基板を収納するプリント回路基板収納機構と、
     を有するプリント回路基板形成収納機構と；
     を含み、
     　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成し、前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラによって該プリント回路基板用基材の片面に圧着転写せしめることによってプリント回路基板を形成し、前記プリント回路基板形成収納機構によって該回路パターンが形成されたプリント回路基板を収納するようにしたことを特徴とするプリント回路基板製造装置。     A plating unit including a plating tank containing a plating solution;
    A DLC pattern belt that is dipped in the plating solution of the plating tank to form a circuit pattern plating layer on its surface and is rotatably provided;
    A pattern belt rotating means including a pressure transfer roller for rotating the DLC pattern belt and pressure-transferring the circuit pattern plating layer onto one surface of a printed circuit board substrate;
    A pressing roller installed opposite the pressure-transfer roller,
    A pattern belt plating mechanism having:
    Printed circuit board base material supply means provided on the side of the plating tank and supplying the printed circuit board base material;
    A circuit that has the pressure transfer roller and the pressure roller and that pressure-transfers the circuit pattern onto one side of the printed circuit board substrate supplied from the printed circuit board base material supply means between the pressure transfer roller and the pressure roller. Pattern crimping transfer means;
    A printed circuit board storage mechanism for storing a printed circuit board on which the circuit pattern is formed;
    A printed circuit board forming and storing mechanism having:
    Including
    A circuit pattern plating layer is formed on the surface of the DLC pattern belt by the pattern belt plating mechanism, the substrate for the printed circuit board is supplied between the pressure transfer roller and the pressure roller, and formed on the surface of the DLC pattern belt. A printed circuit board is formed by pressure-transferring the printed circuit pattern plating layer onto one side of the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller, and the circuit pattern is formed by the printed-circuit board forming and storing mechanism. An apparatus for manufacturing a printed circuit board, wherein the printed circuit board is stored.
  8.  　前記メッキ液に前記ＤＬＣパターンベルトを浸漬する前に、離型処理剤に浸漬する前処理を行い、ついで水洗を行うために、前記メッキユニットにおいてメッキ槽の前に離型処理剤を収容する離型処理剤槽及び水洗するための水槽を設置することを特徴とする請求項７記載のプリント回路基板製造装置。 Before immersing the DLC pattern belt in the plating solution, a pretreatment for immersing in a mold release treatment agent is performed, and then, in order to perform washing with water, a mold release treatment agent is stored in the plating unit before the plating tank. 8. The printed circuit board manufacturing apparatus according to claim 7, wherein a mold processing agent tank and a water tank for washing are installed.
  9. 　前記プリント回路基板用基材が、その一面に紫外線硬化性接着剤が塗布されてなり、前記圧着転写ローラーとプリント回路基板収納機構の間に紫外線照射装置を設け、前記プリント回路基板用基材の片面に回路パターンメッキ層が前記紫外線硬化性接着剤を介して圧着転写せしめられた後に、前記紫外線照射装置によって紫外線を照射することで前記紫外線硬化性接着剤を硬化せしめ、前記回路パターンメッキ層を強固に接着せしめて前記プリント回路基板を形成してなることを特徴とする請求項７又は８記載のプリント回路基板製造装置。 The printed circuit board base material is coated with an ultraviolet curable adhesive on one surface, and an ultraviolet irradiation device is provided between the pressure-transfer transfer roller and the printed circuit board storage mechanism. After the circuit pattern plating layer is pressure-transferred and transferred on one side via the ultraviolet curable adhesive, the ultraviolet curable adhesive is cured by irradiating ultraviolet rays with the ultraviolet irradiation device, and the circuit pattern plating layer is formed. 9. The printed circuit board manufacturing apparatus according to claim 7, wherein the printed circuit board is formed by firmly bonding.
  10.  　請求項７～９のいずれか１項記載の装置を用いるプリント回路基板製造方法であって、
     　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成する工程と、
     　前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラーによって該プリント回路基板用基材の片面に圧着転写せしめることによってプリント回路基板を形成する工程と、
     を有することを特徴とするプリント回路基板製造方法。     A printed circuit board manufacturing method using the apparatus according to any one of claims 7 to 9,
    Forming a circuit pattern plating layer on the surface of the DLC pattern belt by the pattern belt plating mechanism;
    The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. Forming a printed circuit board by crimping and transferring to one side of the material;
    A printed circuit board manufacturing method comprising:
  11.  　請求項７～９のいずれか１項記載の装置を用いて製造されたプリント回路基板であって、
     　前記パターンベルトメッキ機構によって前記ＤＬＣパターンベルトの表面に回路パターンメッキ層を形成し、
     　前記圧着転写ローラー及び押圧ローラーの間に前記プリント回路基板用基材を供給し、該ＤＬＣパターンベルトの表面に形成された回路パターンメッキ層を前記圧着転写ローラー及び押圧ローラーによって該プリント回路基板用基材の片面に圧着転写せしめること
    によって製造されたことを特徴とするプリント回路基板。     A printed circuit board manufactured using the apparatus according to any one of claims 7 to 9,
    A circuit pattern plating layer is formed on the surface of the DLC pattern belt by the pattern belt plating mechanism,
    The printed circuit board substrate is supplied between the pressure-transfer roller and the pressure roller, and the circuit pattern plating layer formed on the surface of the DLC pattern belt is transferred to the substrate for the printed circuit board by the pressure-transfer roller and the pressure roller. A printed circuit board manufactured by pressure transfer onto one side of a material.
PCT/JP2013/066018 2012-06-22 2013-06-11 Printed circuit board, and manufacturing device and manufacturing method therefor WO2013191026A1 (en)

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