KR100991756B1 - Manufacturing method of double-sided flexible printed circuit board - Google Patents

Abstract

The present invention provides a method for manufacturing a double-sided flexible printed circuit board comprising a copper foil laminated plate preparation step, through hole forming step, copper plating step, circuit pattern forming step, coverlay film welding and laminating step, surface treatment step and post-process step. In the preparing of the copper foil laminated plate, the step of preparing a copper foil on either side of a bond fly supply step, a release step, a copper foil selection step of an electrolytic copper foil or a rolled copper foil, a selected copper foil supply step, and a release ply detached bond ply is formed. A method of manufacturing a double-sided flexible printed circuit board characterized in that.

According to the present invention, there is no need to purchase the copper clad laminate raw materials while paying a high unit cost, and it is economical, and it is possible to manufacture the copper clad laminate using an existing laminate machine without using an expensive copper clad laminate manufacturing apparatus, and use either an electrolytic copper foil or a rolled copper foil. Since the thickness can be adjusted according to the bond fly, it is possible to prepare a double-sided flexible printed circuit board by preparing an optimal copper clad laminate according to the product use.

Duplex Flexible Printed Circuit Board, Copper Clad Laminate, Bond Ply

Description

Manufacturing method of double-sided flexible printed circuit board {Manufacturing method of double-sided flexible printed circuit board}

The present invention is economical by using a flexible copper clad laminate (FCCL) in which copper foil layers are laminated on both sides of the bond ply, and can be used by selecting an electrolytic copper foil or a rolled copper foil, and the thickness can be adjusted according to the bond ply. The present invention relates to a method for manufacturing a double-sided flexible printed circuit board capable of selecting an optimal combination according to the present invention, and to an apparatus for manufacturing a double-sided copper foil laminated board used in the double-sided flexible printed circuit board.

Recently, with the development of the degree of integration of semiconductor integrated circuits, the development of surface-mount technology for directly mounting small chip components, and the miniaturization of electronic equipments, the necessity of a printed circuit board that can be easily embedded in a more complicated and narrow space has been developed. Increasingly, flexible printed circuit boards (FPCBs) have been developed to meet these demands.

Such flexible printed circuit boards are rapidly increasing in demand due to the development of electronic devices such as portable terminals, LCDs, PDPs, cameras, printer heads, and the demands thereof are increasing. In addition, the use of a flexible printed circuit board is rapidly increasing in order to achieve higher density of circuit patterns.

To manufacture a double-sided flexible printed circuit board of the flexible printed circuit board, laminating a dry film on a flexible copper clad laminate (FCCL) having a copper foil layer formed on both sides of an insulating film such as polyimide resin (Polyimide) resin After the circuit pattern is sequentially formed by exposure, development, and etching, the coverlay film is welded to the outside of the copper-clad laminate and laminated using a hot press.

FCCL, a raw material of FPCB, is a laminating method for attaching an insulating film and a copper foil with an adhesive, a casting method for coating and curing a polyimide varnish on the copper foil, and vacuum depositing a copper seed layer on the insulating film. Then, it is manufactured by three types of processes, such as sputtering and electroplating mixing method of electroplating.

As electronic and electronic products are miniaturized and components are integrated, miniaturization of circuit line widths of wirings and flexible printed circuit boards is required. Therefore, the thickness of the copper foil of FCCL, which is a raw material, needs to be gradually thinned.

On the other hand, there are two types of copper foil for flexible printed circuit boards. One is the rolled copper foil which roll-processed the copper ingot manufactured by casting, and made it into the metal foil shape, and the other is the electrolytic copper foil.

The electrolytic copper foil is filled with an electrolytic solution containing copper sulfate as a main component in an electrolytic cell provided with an anode, and precipitates copper in a metal foil shape on the rotating cathode by electroplating from the electrolytic solution. Then, this precipitated copper foil-shaped copper is stripped off continuously, an untreated copper foil is manufactured, and it is obtained by surface-treating this untreated copper foil.

In the flexible printed circuit board copper foil requires excellent flexibility, conventionally, the ratio of using a rolled copper foil was high. The reason for this is that the rolled copper foil is annealed at a relatively low temperature of 120 to 160 ° C. when it is heated in the process of adhering the copper foil and polyimide in the manufacture of the flexible printed circuit board, so that softening and elongation increase.

However, the rolled copper foil is more expensive than the electrolytic copper foil, and in particular, the thinner the thickness of 12 µm and 9 µm, the greater the cost. This is because a thick copper foil is repeatedly rolled several times to produce a thin one.

In addition, the width of the copper foil produced by rolling is usually narrow to about 600 mm, so that there is a drawback that the productivity at the time of producing a flexible printed circuit board is poor.

On the other hand, electrolytic copper foil is inexpensive compared with rolled copper foil, and since it is possible to manufacture it with width 1000mm or more normally, there exists an advantage that the productivity at the time of manufacturing a flexible printed circuit board is excellent.

However, the electrolytic copper foil manufactured by the conventional manufacturing method is not annealed or softened even when heated to 200 ° C. or more, compared to the rolled copper foil, so that its flexibility is poor. Therefore, the copper foil for flexible printed circuit boards is used only for limited applications. Did.

Therefore, in the manufacturing of FCCL, where flexibility is required is rolled copper foil, and where flexibility is not required, each part is laminated by electrolytic copper foil, which is not only economical and flexible, but also FCCL which can control the thickness of FCCL according to the product use. The need for a manufacturing process has been industrially requested.

The present invention was created in order to solve the above problems, it is economical without having to purchase the copper clad laminate raw materials while paying a high unit cost, it is possible to manufacture copper clad laminate using an existing laminate machine without expensive copper foil laminated plate manufacturing apparatus It is possible to use either an electrolytic copper foil or a rolled copper foil, and the thickness can be adjusted according to the bond ply to provide a method for manufacturing a double-sided flexible printed circuit board that can produce an optimal copper foil laminated board according to the product use. There is this.

In addition, the present invention can be used for either electrolytic copper foil or rolled copper foil, it is possible to adjust the thickness according to the bond ply, and to provide an apparatus for producing a double-sided copper foil laminated plate that can produce an optimal copper foil laminated plate according to the product use There is a purpose.

To achieve these and other advantages and in accordance with the purpose of the present invention,

In the method for manufacturing a double-sided flexible printed circuit board comprising a copper foil laminated plate preparation step, through hole forming step, copper plating step, circuit pattern forming step, coverlay film welding and laminating step, surface treatment step and post-process step,

The copper foil laminated plate preparation step comprises a bonding ply step of laminating the copper foil on both sides of the bond fly supply step of the bond ply supply step, the release step, the electrolytic copper foil or rolled copper foil, the selected copper foil supply step and the release paper is detached. It provides a method for manufacturing a double-sided flexible printed circuit board.

The bond fly is an adhesive layer formed on both sides of the polyimide resin, the lamination step is a roll to roll (roll to roll) method to the bond fly and copper foil at a temperature of 50-150 ℃, pressure of 2-10 mpa and 0.5- It is preferable to harden after welding at a speed | rate of 2.0 m / min.

In addition, the curing is preferably left at room temperature or cured at 100-200 ° C. for 60-120 minutes.

In addition, the present invention is a bond ply supply roll for supplying a bond ply bonded to the release paper after storing the bond ply formed on both sides of the polyimide resin and the release paper formed on the upper surface of the adhesive layer at the same time;

A release paper release roller which is formed on one side of the bond fly supply roll and releases the release paper from the bond fly supplied from the bond fly supply roll;

A release paper winding roll positioned on upper and lower sides of the release paper release roller to wind and store the release paper released from the release paper release roller;

Copper foil supply rolls positioned on upper and lower sides of the release roller and supplying rolled copper foil or electrolytic copper foil to the bond fly side passing through the release roller;

Located on one side of the release roller, and the bonding roller for bonding the copper foil supplied from the copper foil feed roll and the bond ply passed through the release roller;

It is located on one side of the paper roller, and provides a double-sided copper-clad laminate manufacturing apparatus comprising a copper foil laminated plate winding roll for winding and storing the double-sided copper foil laminated plate formed through the paper roller.

As described above, using the double-sided copper-clad laminate manufacturing apparatus according to the present invention, there is no need to purchase the copper-clad laminate raw materials used in the prior art, economical, roll-to-roll using an existing laminate machine without expensive copper-clad laminate manufacturing apparatus In this way, the copper clad laminate can be manufactured to facilitate mass production while simplifying the work process.

In addition, any one of electrolytic copper foil or rolled copper foil can be used, and since the thickness can be adjusted according to the bond ply, it is possible to manufacture an optimal copper foil laminated plate according to the product use.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to explain their invention in the best way. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiments of the present invention and do not represent all of the technical idea of the present invention, various equivalents that may be substituted for them at the time of the present application It should be understood that there may be water and variations.

1 is a flowchart illustrating a method of manufacturing a double-sided flexible printed circuit board according to an exemplary embodiment of the present invention, and prepares a copper clad laminate (FCCL) having copper foil layers formed on both sides of a polyimide resin (S110). At this time, the copper foil laminated board is prepared using the bond ply in which the adhesive bond layer was formed on both surfaces of the polyimide resin. Copper clad laminate preparation step will be described in more detail below.

The copper-clad laminate thus prepared is cut to meet the required panel size, and the cut copper-clad laminate is formed by through-hole machining through CNC machining or laser processing (S120), followed by copper plating (S130). Ensure both sides are conducting as a whole.

Next, after laminating and laminating a photosensitive dry film on both sides of the copper-clad laminate, the circuit pattern is formed by sequentially exposing, developing and etching (S140). Next, after removing unnecessary parts, the cut coverlay film is welded to the outer surface of the copper-clad laminate with the circuit pattern formed thereon, and then laminated them using heat and pressure of a hot press (S150).

Next, after the surface treatment of washing, gold plating, etc. (S160), and after the post-process (S170), such as circuit inspection and outline processing to complete the double-sided printed circuit board.

2 is a block diagram of a double-side copper clad laminate manufacturing apparatus according to an embodiment of the present invention.

As shown in Figure 2, the double-sided copper clad laminate manufacturing apparatus according to an embodiment of the present invention, a bond fly feed roll 10, a release paper release roller 12, a release paper winding roll 14, a copper foil supply roll 20 ), A lamination roller 24 and a copper clad laminated sheet winding roll 28.

In the bond ply supply roll 10, adhesive layers are formed on both sides of the polyimide resin, and the bond ply 1 to which the release paper 3 is bonded by the adhesive layer is stored in a wound state.

The bond ply supply roll 10 rotates and sequentially supplies the bond ply 1 with the rolled-up stored release paper 3 to the rear side (left side in the drawing).

Accordingly, the user can easily obtain a product having a desired specification simply by replacing only the bond fly feed roll 10 according to the specification. That is, in the case of manufacturing FCCL thickly, a bond fly supply roll 10 in which a thick bond fly product is wound is mounted, and in the case of manufacturing FCCL thinly, the bond fly supply roll 10 in which a thin bond fly product is wound is replaced. By installing it, the user can easily produce a product that fits their needs.

The bond ply 1 with the release paper 3 supplied from the bond ply supply roll 10 is transferred to the release roller 12.

The release roller 12 is formed on one side of the bond ply supply roll 10, and consists of a pair of rollers 12a and 12b which are formed to face each other, and the bond ply is formed by these rollers 12a and 12b. Pass through.

The release paper 3 formed on the upper and lower surfaces of the bond ply 1 passing through the release paper release roller 12 is transferred to the upper and lower sides simultaneously with the release of the bond ply 1 and mounted on the upper and lower sides of the release paper release roller 12, respectively. It is conveyed to the release paper winding rolls 14, respectively.

The release paper winding roll 14 is rotated by a motor (not shown) and winds up the release paper 3.

And a pair of copper foil supply rolls 20 are formed in the upper and lower sides of the back of the said release roller 12, and supply copper foil 5 to both surfaces of the bond ply 1, respectively.

The copper foil supply roll 20 is supplied with a roll rolled with a rolled copper foil or a roll wound with an electrolytic copper foil according to a specification of a product to be manufactured.

Accordingly, the user can easily obtain a product having a desired specification simply by exchanging only the copper foil supply roll 20 according to the specification.

More specifically, when manufacturing FCCL requiring flexibility, the copper foil supply roll 20 wound with rolled copper foil is mounted, and if flexibility is not required, the copper foil supply roll 20 wound with electrolytic copper foil is replaced. By doing so, the user can easily produce a product that fits their needs.

In addition, a lamination roller 24 formed of a pair of rollers 24a and 24b is formed on the rear side of the release roller 12. The lamination roller 24 passes through the bond ply 1 passing through the release roller 12 and the copper foil 5 supplied from the copper foil supply roll 20 between the pair of rollers 24a and 24b. When the high temperature and high pressure are applied, the bond ply 1 and the copper foil 5 are laminated.

Then, the copper foil laminated sheet laminated by the lamination roller 24 is transferred to the copper foil laminated sheet winding roll 28 and wound up.

The copper-clad laminate winding roll 28 is located at the rear side of the lamination roller 24, rotates at a constant speed, and sequentially laminates the copper lamination plates transferred from the lamination roller 24.

Hereinafter, the operation sequence by the double-sided copper-clad laminate manufacturing apparatus will be described in detail.

The bond ply 1 wound around the bond ply supply roll 10 supplies the bond ply while moving through the release roller 12 (bond ply supply step; S210), and the release paper 3 adhered to the bond ply is It is wound on the release paper winding roll 14 (release step; S220).

On the other hand, the copper foil 5 selects any one of the electrolytic copper foil or rolled copper foil according to the product use, such as the demand for flexibility (copper foil selection step; S230), the selected copper foil (5) wound on the copper foil feed roll 20 is copper foil It is provided through the guide roller 22 (copper foil supply step; S240).

Both sides of the bond ply 1 with the release paper 3 removed and the adhesive layer exposed are laminated to the selected copper foil 5 by the lamination roller 24 (lamination step; S250).

The bond ply 1 in which the copper foil 5 is laminated is moved through the guide roller 26 and is wound on the copper foil laminated sheet winding roll 28 to produce the copper foil laminated sheet of the present invention.

As described above, the copper-clad laminate of the present invention is manufactured in a roll-to-roll (roll to roll) method, the bond fly 1 and the copper foil (5) 50-150 ℃ temperature, 2-10 mpa pressure and 0.5-2.0 It is preferable to harden after temporally joining at the speed of m / min.

At this time, the temporary welding temperature is better, but the higher the temperature, the higher the temperature is difficult to exceed 150 ℃ by the specification of the equipment, and the change in the physical properties of the adhesive occurs at 50-80 ℃, it does not need to be about that high temperature, if less than 50 ℃ The change in the physical properties of the adhesive does not occur may cause a problem of poor adhesion.

In addition, the higher the pressure is the better the pressure, but there is a limit of equipment specifications, when the pressure is low may cause a problem in the generation of bubbles or heat transfer between the bond fly and the copper foil may cause a problem that the adhesion decreases accordingly. .

In addition, the slower the connection, the better, but if it is too slow, it will be a problem for productivity. If the speed is too fast, the hot roll should be able to transfer heat well to the adhesive of the bond ply. Can be.

In addition, the curing is preferably left at room temperature or cured at 100-200 ° C. for 60-120 minutes.

If curing is out of the above conditions, adhesive bonding of the bond ply may not be performed properly, which may cause problems in adhesion.

As described above, according to the embodiment of the present invention, it is economical because there is no need to purchase the copper clad laminate raw materials while paying a high unit cost, and the work process is simplified by a roll-to-roll method using an existing laminate machine without an expensive copper clad laminate manufacturing apparatus. While the copper foil laminated plate can be manufactured for easy mass production, either an electrolytic copper foil or a rolled copper foil can be used, and the thickness can be adjusted according to the bond ply to produce an optimum copper foil laminated plate according to the product use.

1 is a flowchart illustrating a method of manufacturing a double-sided flexible printed circuit board according to an embodiment of the present invention.

2 is a block diagram of a double-side copper clad laminate manufacturing apparatus according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1 ... bond fly 3 ... release paper

5 ... copper 10 ... bond fly feed roll

12 Release roller 14 Release paper take-up roll

20 ... copper feed roll 22 ... copper guide roller

24 ... Lamination Roller 26 ... Guide Roller

28.Copper laminated sheet winding roll

Claims (5)

Copper foil laminated plate preparation step (S110), through hole forming step (S120), copper plating step (S130), circuit pattern forming step (S140), coverlay film welding and laminating step (S150), surface treatment step (S160) and post-process In the method for manufacturing a double-sided flexible printed circuit board comprising a step (S170), The copper foil laminated plate preparation step (S110) is a bond fly supply step (S210), a release step (S220), any one of the copper foil selection step (S230) of the electrolytic copper foil or rolled copper foil, the selected copper foil supply step (S240) and the release paper is detached Bonding step (S250) made of laminating copper foil on both sides of the bond fly, The lamination step (S250) is a roll to roll (bond to roll) method (1) and the copper foil (5) at a temperature of 50-150 ℃, a pressure of 2-10 mpa and a speed of 0.5-2.0 m / min Harden after hardening, The bond ply (1) is an adhesive layer is formed on both sides of the polyimide resin, The curing is a method for manufacturing a double-sided flexible printed circuit board, characterized in that the curing at room temperature or 100-200 ℃ 60-120 minutes. delete delete delete An adhesive layer is formed on both sides of the polyimide resin, and the bond ply 1 to which the release paper 3 is bonded is wound by the adhesive layer, and the bond ply 1 to which the release paper 3 is bonded by a release paper release roller 12. Bond ply supply roll 10 for supplying; A release paper release roller 12 formed on one side of the bond ply supply roll 10 and releasing the release paper 3 from the bond ply furnace 1 supplied from the bond ply supply roll 10; Release paper take-up roll 14 is located on the upper and lower sides of the release paper release roller 12, the release paper take-up roll 14 winding and storing the release paper (3) released from the release paper release roller 12; Copper foil supply roll 20 which is located above and below the release roller 12, and supplies a rolled copper foil or an electrolytic copper foil to the bond ply 1 side which passed through the release roller 12; Located on one side of the release roller 12, and the bonding roller (24) for coupling the bond ply (1) passed through the release roller 12 and the copper foil (5) supplied from the copper foil supply roll (20) and ; Located on one side of the lamination roller 24, comprising a copper lamination roll winding roll 28 for winding up and storing the double-sided copper laminated sheet formed through the lamination roller 24, The lamination roller 24 is a roll-to-roll (bond to roll) 1 and copper foil (5) 50-150 ℃ temperature, 2-10 mpa pressure and 0.5-2.0 m / min speed It is bonded to the left and then allowed to stand at room temperature or cured at 100-200 ℃ for 60-120 minutes, The bond ply (1) is a double-sided copper-clad laminate manufacturing apparatus, characterized in that the adhesive layer is formed on both sides of the polyimide resin.

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