CN104137657A - Printed circuit board, and manufacturing device and manufacturing method therefor - Google Patents
Printed circuit board, and manufacturing device and manufacturing method therefor Download PDFInfo
- Publication number
- CN104137657A CN104137657A CN201380011045.2A CN201380011045A CN104137657A CN 104137657 A CN104137657 A CN 104137657A CN 201380011045 A CN201380011045 A CN 201380011045A CN 104137657 A CN104137657 A CN 104137657A
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- China
- Prior art keywords
- tellite
- pattern
- plating
- crimping
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Provided are a printed circuit board, and a manufacturing device and manufacturing method therefor wherein patterning is applied by only plating to remove the need for etching. First and second circuit pattern plated layers are formed on the surfaces of first and second DLC pattern belts by first and second pattern belt plating mechanisms. A base material for the printed circuit board is supplied between first and second crimping transfer rollers. The first and second circuit pattern plated layers formed on the surfaces of the first and second DLC pattern belts are pressed and transferred onto both surfaces of the base material for the printed circuit board by the first and second crimping transfer rollers. Thereby a double-sided printed circuit board is formed, and thus the double-sided printed circuit board on which the circuit pattern is formed is housed in a printed circuit board forming and housing mechanism.
Description
Technical field
The present invention relates to a kind of tellite, the manufacturing installation and the manufacture method that relate in particular to a kind of circuitron substrate and be suitable for the manufacture of this circuitron substrate.
Background technology
Tellite, according to its number of plies, be only roughly divided at the one side of insulated substrate, formed the circuit substrate that is printed on one side of circuit, at the two-sided circuitron substrate of circuit and the multilayer printed board that has formed circuit in multilayer of having formed.Part member was simple and easy and circuit pattern is also simple in the past, thereby use the circuit substrate that is printed on one side, but recently, the complexity of circuit increases, requirement to densification and miniaturized circuit also increases, thereby uses the situation of circuitron substrate or multilayer printed board comparatively general.Materials'use as circuitron substrate is maximum, has formed thinly the copper clad laminate (patent documentation 1) of copper plate in the both sides of insulant.
Tellite, according to the material of base material, be categorized as firm type, soft type and firm type and soft type are mixed just-soft type.Just type tellite, refers to the known tellite being fixed.On the other hand, soft type tellite has flexibility, be used in electronic equipment etc. need to be under bending or warpage state the situation of mounted printed circuit board.And then, in driven part as the printhead of printer, need to carry out, in the situation of electrical ties, being also used as a kind of connector.
Just-soft type tellite, is the tellite of the form that links by soft type tellite of a kind of firm type tellite, can realize the making of more exquisite circuit, can reduce electrical connection, and reliability is high.Therefore, be used in aerospace, military with in equipment more.And then, recently, be also used in the electrical connection of part of the bending of folder-type portable telephone.Just-soft type tellite, because raw sheet that material is differed from one another is in conjunction with making, therefore exist production efficiency low, require this difficulty of special technology, but along with variation and the miniaturization of the function of electronic products, the frequency of use is increasing.
During the manufacture of tellite, after the design that makes circuit pattern completes, the circuit pattern that this design is completed be formed on method on substrate have varied, but any circuit pattern formation method all to take etching and plating be basis.That is, suitably use these both, to make it to meet character and the economic condition (patent documentation 2～4) of the various substrates that are required.Yet, after carrying out plating, carry out in etched situation, due to according to etched whether good decision-making circuit pattern well whether, therefore need to carry out very accurate etching, expend and carry out needed corresponding time of etching and cost.Thereby, expect only by plating, to form circuit pattern, and do not need etched circuit pattern formation method, but present situation is not yet to develop only by plating, to carry out pattern formation, and do not need manufacturing installation, the method for etched tellite.
Technical literature formerly
Patent documentation
Patent documentation 1: TOHKEMY 2002-171032 communique
Patent documentation 2: TOHKEMY 2004-214590 communique
Patent documentation 3: TOHKEMY 2004-273915 communique
Patent documentation 4: TOHKEMY 2009-158707 communique
Summary of the invention
The technical task that invention will solve
The present invention is in view of the problem points of above-mentioned prior art and make, and its object is to provide a kind of and only by plating, is carried out pattern formation and do not needed etched tellite and manufacturing installation and manufacture method.
The application's applicant, for the method for gravure engraving roll etc. being carried out to pattern formation by DLC (diamond like carbon), carried out developmental research, by adopting DLC can realize the pattern that precision is very high and fine, form, and propose as Japanese Patent Application 2011-11141 for example and Japanese Patent Application 2012-120058, be conceived to the technology that adopts this DLC to enter pattern formation to be applied to the manufacture of tellite, repeatedly study intensively, completed the present invention.
For solving the technological means of problem
In order to solve above-mentioned problem, circuitron apparatus for manufacturing substrate of the present invention, is characterized in that, comprises:
The 1st pattern band plating mechanism, it has: the 1st plating unit, the 1st plating unit comprises the 1st plating coating groove of having taken in plating solution; 1DLC pattern band, this 1DLC pattern band is immersed in the plating solution of the 1st plating coating groove, come to form the 1st circuit pattern plating layer on the surface of this 1DLC pattern band, and this 1DLC pattern band is set to rotatably; With the 1st pattern band rotating unit, the 1st pattern band rotating unit comprises the 1st crimping transfer roll, and the 1st crimping transfer roll rotates described 1DLC pattern band, and at the 1st circuit pattern plating layer described in a face crimping transfer printing of base material for tellite;
The 2nd pattern band plating mechanism, it has: the 2nd plating unit, the 2nd plating unit comprises to be taken in plating solution and separates predetermined distance and the 2nd plating coating groove that arranges from described the 1st plating coating groove; 2DLC pattern band, this 2DLC pattern band is immersed in the plating solution of the 2nd plating coating groove, come to form the 2nd circuit pattern plating layer on the surface of this 2DLC pattern band, and this 2DLC pattern band is set to rotatably; With the 2nd pattern band rotating unit, the 2nd pattern band rotating unit comprises the 2nd crimping transfer roll, the 2nd crimping transfer roll this 2DLC pattern band is rotated and with described the 1st crimping transfer roll opposite disposed, and at the 2nd circuit pattern plating layer described in another face crimping transfer printing of base material for tellite;
Tellite forms accommodating mechanism, and it has: tellite base material feed unit, and this tellite is arranged between described the 1st plating coating groove and described the 2nd plating coating groove with base material feed unit, and supplies with tellite base material; Circuit pattern crimping transfer printing unit, this circuit pattern crimping transfer printing unit has described the 1st crimping transfer roll and described the 2nd crimping transfer roll, and makes circuit pattern crimping be transferred in from described tellite with base material feed unit to the tellite supplied with between described the 1st crimping transfer roll and described the 2nd crimping transfer roll two-sided with base material; With tellite accommodating mechanism, it is taken in having formed the tellite of described circuit pattern,
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer, to supplying with described tellite base material between described the 1st crimping transfer roll and described the 2nd crimping transfer roll, by described the 1st crimping transfer roll and described the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, thereby form circuitron substrate, by described tellite, forming accommodating mechanism takes in having formed the circuitron substrate of described circuit pattern.
Preferably adopt following formation: for flood described 1DLC pattern band and described 2DLC pattern band in described the 1st plating solution and described the 2nd plating solution before, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, and in described the 1st plating unit and described the 2nd plating unit, the 1st demoulding inorganic agent groove and the 2nd demoulding inorganic agent groove and the 1st tank and the 2nd tank for washing that demoulding inorganic agent is taken in were set respectively before the 1st plating coating groove and the 2nd plating coating groove.。
Be preferably between described the 1st crimping transfer roll and described the 2nd crimping transfer roll and tellite accommodating mechanism and arrange and show back of the body alignment sensor, make by the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping are transferred in after thereby described tellite formed tellite with base material two-sided, can be with respect to a preformed reference mark of face in base material two-sided for the described tellite having formed described the 1st circuit pattern plating layer and described the 2nd circuit pattern plating layer, the position detection signal of another face in two-sided according to this, carried out to this another face crimping transfer printing the position revisal of the pattern band rotating unit of pattern band plating layer.
In addition, preferably at described tellite, use the UV cured property of the double spread adhesive of base material, between described the 1st crimping transfer roll and described the 2nd crimping transfer roll and tellite accommodating mechanism, ultraviolet lamp is set, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer be transferred in described tellite with after base material two-sided across the crimping of described UV cured property adhesive, by described ultraviolet lamp irradiation ultraviolet radiation, thereby make described UV cured property adhesive sclerosis, make described the 1st circuit pattern plating layer and described the 2nd circuit pattern plating layer adhere securely to form described circuitron substrate.
Circuitron manufacture of substrates of the present invention is the method that adopts circuitron board device of the present invention, it is characterized in that, comprising:
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the operation of the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer; And
To supplying with described tellite base material between the 1st crimping transfer roll and the 2nd crimping transfer roll, by described the 1st crimping transfer roll and described the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, thereby form the operation of circuitron substrate.
Circuitron substrate of the present invention, is the circuitron substrate that adopts apparatus of the present invention to manufacture, it is characterized in that,
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer,
To supplying with described tellite base material between the 1st crimping transfer roll and the 2nd crimping transfer roll, by described the 1st crimping transfer roll and the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, produce thus described circuitron substrate.
Tellite manufacturing installation of the present invention, is characterized in that, comprises:
Pattern band plating mechanism, it has: plating unit, this plating unit comprises the plating coating groove of having taken in plating solution; DLC pattern band, this DLC pattern band is immersed in the plating solution of described plating coating groove, carry out the circuit forming surface pattern plating layer at this DLC pattern band, and this DLC pattern band is set to rotatably; Pattern band rotating unit, this pattern band rotating unit comprises crimping transfer roll, and this crimping transfer roll rotates described DLC pattern band, and the crimping of described circuit pattern plating layer is transferred in to a face of base material for tellite; With press pressure roller, should press pressure roller and described crimping transfer roll opposite disposed; With
Tellite forms accommodating mechanism, and it has: tellite base material feed unit, and this tellite is arranged on the side of described plating coating groove with base material feed unit, and tellite is supplied with base material; Circuit pattern crimping transfer printing unit, this circuit pattern crimping transfer printing unit has described crimping transfer roll and by pressure roller, and make circuit pattern crimping be transferred in from described tellite with base material feed unit to described crimping transfer roll and by the tellite of supplying with between pressure roller the one side with base material; With tellite accommodating mechanism, this tellite accommodating mechanism is taken in having formed the tellite of described circuit pattern,
Circuit forming surface pattern plating layer by described pattern band plating mechanism at described DLC pattern band, to described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, thereby formation tellite, forms accommodating mechanism by described tellite and takes in having formed the tellite of described circuit pattern.
Preferably for flood described DLC pattern band in described plating solution before, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, and demoulding inorganic agent groove and the tank for washing that demoulding inorganic agent is taken in was set in described plating unit before plating coating groove.
In addition, be preferably in described tellite and be coated with UV cured property adhesive with a face of base material, between described crimping transfer roll and tellite accommodating mechanism, ultraviolet lamp is set, make circuit pattern plating layer be transferred in described tellite with after the one side of base material across the crimping of described UV cured property adhesive, by described ultraviolet lamp irradiation ultraviolet radiation, thereby make described UV cured property adhesive sclerosis, make described circuit pattern plating layer adhere securely to form described tellite.
Tellite manufacture method of the present invention, is the method that adopts tellite manufacturing installation of the present invention, it is characterized in that, comprising:
Operation by described pattern band plating mechanism at the circuit forming surface pattern plating layer of described DLC pattern band; With
To described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, thereby form the operation of tellite.
Tellite of the present invention, is the tellite that adopts apparatus of the present invention to manufacture, it is characterized in that,
Circuit forming surface pattern plating layer by described pattern band plating mechanism at described DLC pattern band,
To described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, produce thus described tellite.
Invention effect
According to the present invention, when the manufacture of tellite, can only by plating, carry out pattern formation and not need etching, compare with existing manufacture method, can significantly realize the saving of time and the reduction of cost, and realize the also excellent effect of good tellite of precision can access pattern, be particularly suited for the manufacture of circuitron substrate.
Accompanying drawing explanation
Fig. 1 means the key diagram of the concise and to the point side of circuitron apparatus for manufacturing substrate of the present invention.
Fig. 2 means the schematic illustration of formation step of the circuit pattern of the tellite based on 1DLC pattern band (pattern belt), (a) recess that is illustrated in DLC pattern band has been taken in the state of plating solution, (b) represent that the plating layer that the recess at DLC pattern band is formed is transferred in the state on tellite base material, and Cc) be illustrated in the state that transfer printing circuit pattern plating layer on tellite base material is manufactured tellite.
Fig. 3 means the general description figure of major part of the portion of overflowing of plating coating groove.
Fig. 4 means the key diagram of the concise and to the point side of the circuit substrate manufacturing installation that is printed on one side of the present invention.
Fig. 5 is the key diagram that schematically shows the manufacturing process of the DLC pattern band adopting in the present invention, (a) be at the surface-coated of pattern band base material the major part profile of state of emulsion, (b) be the major part profile of the state that makes emulsion expose/develop to have formed corrosion-resisting pattern, (c) be on the surface of pattern band base material and corrosion-resisting pattern, to have formed DLC by the major part profile of the state of overlay film, (d) mean the DLC on corrosion-resisting pattern and corrosion-resisting pattern surface is removed by overlay film, make the residual major part profile that is formed on the state on pattern band base material of DLC pattern.
Fig. 6 means the flow chart of the manufacturing process of DLC pattern band.
Embodiment
Below embodiments of the present invention are described, but these execution modes are the execution modes that illustrate illustratively, certainly, only otherwise depart from technological thought of the present invention, also can carry out various distortion.
In Fig. 1, symbol 10 is the circuitron apparatus for manufacturing substrate that the present invention relates to, and has: the 1st pattern band plating 12A of mechanism, the 2nd pattern band plating 12B of mechanism of opposite disposed and tellite form accommodating mechanism 14.
Above-mentioned the 1st pattern band plating 12A of mechanism, has the 1st plating unit 22A that comprises the 1st plating coating groove 20A that has taken in plating solution M.The 1st plating coating groove 20A has the portion of overflowing 24 (Fig. 3), is configured to, and in the process of processing, makes all the time plating solution M overflow at plating, the liquid level of plating solution M is remained to the height of regulation.
26A is 1DLC pattern band, and the DLC pattern 28A of the convex forming by method described later is set on its surface, and the surperficial part beyond this DLC pattern 28A, becomes the recess 30A that can take in plating solution M.This 1DLC pattern band 26A is configured to rotatably, if and be immersed in the plating solution M of the 1st plating coating groove 20A, plating solution M is incorporated in above-mentioned recess 30A, as Fig. 1 and Fig. 2 know illustrate and aftermentioned, on the surface of 1DLC pattern band 26A, form the 1st circuit pattern plating layer MA.
32A is the 1st pattern band rotating unit, opposed a pair of live-rollers 34A, the 36A and the 1st crimping transfer roll 38A that by the both sides at the 1st plating coating groove 20A, are arranged form, at these rollers 34A, 36A, 38A this 1DLC pattern band 26A that reels, by these rollers 34A, 36A, 38A are rotated, thereby this 1DLC pattern band 26A is rotated.The 1st crimping transfer roll 38A plays a role and makes aforementioned the 1st circuit pattern plating layer MA of a face crimping transfer printing with base material 40 at tellite described later.In addition, 37A is the 1st drying unit, be configured to the 1DLC pattern band 26A rotating to the 1st crimping transfer roll 38A direction from this live-rollers 36A to surround, and play a role and make dry promotion of the 1st circuit pattern plating layer MA to forming at this 1DLC pattern band 26A.
Aforementioned the 2nd pattern band plating 12B of mechanism, has the 2nd plating unit 22B, and the 2nd plating unit 22B comprises the 2nd plating coating groove 20B that takes in plating solution M and arrange across predetermined distance from aforementioned the 1st plating coating groove 20A.The 2nd plating coating groove 20B, is constituted as, with the structure of the 1st plating coating groove 20A similarly, there is the portion of overflowing, but not shown, in plating processing procedure, make all the time plating solution M overflow, the liquid level of plating solution M is remained to the height of regulation.26B is 2DLC pattern band, and the DLC pattern 28B of the convex forming by method described later is set on its surface, and the surperficial part beyond this DLC pattern 28B, becomes the recess 30B that can take in plating solution M.This 2DLC pattern band 26B is configured to rotatably, and if be submerged in the plating solution M of the 2nd plating coating groove 20B, plating solution M is accommodated in above-mentioned recess 30B, and forms the 2nd circuit pattern plating layer MB on its surface.
32B is the 2nd pattern band rotating unit, opposed a pair of live-rollers 34B, the 36B and the 2nd crimping transfer roll 38B that by the both sides at the 2nd plating coating groove 20B, are arranged form, at these rollers 34B, 36B, 38B this 2DLC pattern band 26B that reels, by these rollers 34B, 36B, 38B are rotated, thereby this 2DLC pattern band 26B is rotated.The 2nd crimping transfer roll 38B, plays a role and makes aforementioned the 2nd circuit pattern plating layer MB of a face crimping transfer printing with base material 40 at tellite described later.In addition, 37B is the 2nd drying unit, the 2DLC pattern band 26B being set to rotating to the 2nd crimping transfer roll 38B direction from this live-rollers 36B surrounds, and plays a role and make dry promotion of the 2nd circuit pattern plating layer MB to forming at this 2DLC pattern band 26B.
Aforementioned tellite forms accommodating mechanism 14, has: be arranged between aforementioned the 1st plating coating groove 20A and the 2nd plating coating groove 20B, and supply with the base material feed unit 42 for tellite of base material 40 for tellite.The 44th, circuit pattern crimping transfer printing unit, there is aforementioned the 1st crimping transfer roll 38A and the 2nd crimping transfer roll 38B, and play a role and make two-sided crimping transfer printing the 1st and the 2nd circuit pattern plating layer MA, the MB with base material 40 at the tellite of supplying with between with 42 couples of the 1st crimping transfer roll 38A of base material feed unit and the 2nd crimping transfer roll 38B from aforementioned tellite, and form circuit pattern.The 46th, tellite accommodating mechanism, is wound around and takes in having formed the tellite 40M of this circuit pattern.In the illustrated example of Fig. 1, show the mechanism that tellite 40M is wound around to take in, although so long as the tellite of soft type just can be wound around, but in just type or just-and be sometimes difficult to be wound around soft type in the situation that, certainly just needn't be set to winding arrangement in this case.
According to above-mentioned structure, its effect is described.First, by aforementioned the 1st pattern band plating 12A of mechanism and the 2nd pattern band plating 12B of mechanism, on the surface of aforementioned 1DLC pattern band 26A and 2DLC pattern band 26B, form the 1st circuit pattern plating layer MA and the 2nd circuit pattern plating layer MB.Then, to supplying with aforementioned base material 40 for tellite between aforementioned the 1st crimping transfer roll 38A and the 2nd crimping transfer roll 38B.
The 1st circuit pattern plating layer MA that surface at this 1DLC pattern band 26A and 2DLC pattern band 26B is formed and the 2nd circuit pattern plating layer MB are transferred in this tellite by aforementioned the 1st crimping transfer roll 38A and the 2nd crimping transfer roll 38B crimping and use the two-sided of base material 40, thereby form tellite 40M.The circuitron substrate 40M that has formed this circuit pattern by aforementioned 14 pairs of accommodating mechanisms of tellite formation takes in.
In addition, in the present invention, although the 1st circuit pattern plating layer MA that the surface at this 1DLC pattern band 26A and 2DLC pattern band 26B is formed and the 2nd circuit pattern plating layer MB are transferred in this tellite by aforementioned the 1st crimping transfer roll 38A and the 2nd crimping transfer roll 38B crimping and use the two-sided of base material 40, thereby form tellite 40M, but by above-mentioned circuit pattern plating layer MA, when MB crimping is transferred in tellite with base material 40, for this circuit pattern plating layer MA, MB is transferred swimmingly, preferably in advance to this aforementioned the 1st and 2DLC pattern band 26A, 26B processes by demoulding inorganic agent.Thereby, for in the aforementioned the 1st and the 2nd plating solution M, M, flood the aforementioned the 1st and 2DLC pattern band 26A, 26B before, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, preferably adopt following formation: in the aforementioned the 1st and the 2nd plating unit 22A, 22B, before the 1st and the 2nd plating coating groove 20A, 20B, the 1st demoulding inorganic agent groove 50A and the 2nd demoulding inorganic agent groove 50B and the 1st tank 52A and the 2nd tank 52B for washing that demoulding inorganic agent is taken in are set respectively.54A be for to the formation of discharging from the 1st plating layer 20A the 1st rinsing bowl washed of the 1DLC pattern band 26A of the 1st circuit pattern plating layer MA, 54B be for to the formation of discharging from the 2nd plating layer 20B the 2nd rinsing bowl washed of the 2DLC pattern band 26B of the 2nd circuit pattern plating layer MB.
In addition, be preferably in the aforementioned the 1st and the 2nd crimping transfer roll 38A, table back of the body alignment sensor 55 is set between 38B and tellite accommodating mechanism 46, make by the 1st circuit pattern plating layer MA and the 2nd circuit pattern plating layer MB crimping are transferred in after thereby aforementioned tellite formed tellite 40M with base material 40 two-sided, can be with respect to the aforementioned tellite having formed the 1st circuit pattern plating layer MA and the 2nd circuit pattern plating layer MB with a face in base material 40 two-sided (for example, the face of the 2nd pattern band plating 12B of mechanism side) upper preformed reference mark (not shown), another face in two-sided according to this (for example, the face of the 1st pattern band plating 12A of mechanism side) position detection signal, carried out to this another face crimping transfer printing the position revisal of the pattern band rotating unit of pattern band plating layer (for example the 1st pattern band rotating unit 32A).
And then, be preferably in tellite and be coated with in advance UV cured property adhesive with base material 40 two-sided, and as shown in Figure 1, at the aforementioned the 1st and the 2nd crimping transfer roll 38A, between 38B and tellite accommodating mechanism 46, ultraviolet lamp 60 is set, make the 1st and the 2nd circuit pattern plating layer MA, MB is transferred in aforementioned tellite with after base material 40 two-sided across the crimping of aforementioned UV cured property adhesive, by aforementioned ultraviolet lamp 60 irradiation ultraviolet radiations, thereby make aforementioned UV cured property adhesive sclerosis, make the aforementioned the 1st and the 2nd circuit pattern plating layer MA, MB adheres the two-sided formation tellite 40M with base material 40 at aforementioned tellite securely.In addition, about UV cured property adhesive and ultraviolet lamp 60, can use existing known device.
In addition, further, if paste processing release paper at the tellite that has been coated with aforementioned UV cured property adhesive with the coated face of base material 40 in advance, and before arriving the aforementioned the 1st and the 2nd crimping transfer roll 38A, 38B, aforementioned processing release paper is peeled off, can prevent that the coated face of aforementioned UV cured property adhesive is attached to undesirable place etc.
In addition; if after being formed as described above tellite 40M; after also pasting processing release paper on the surface of aforementioned tellite 40M, by aforementioned tellite accommodating mechanism 46, take in, can protect the surface of aforementioned tellite 40M.
In Fig. 1,56A is arranged on the 1st copper facing insoluble anode in the 1st plating coating groove 20A, and 56B is arranged on the 2nd copper facing insoluble anode in the 2nd plating coating groove 20B.58A is the 1st rectifier being connected with insoluble anode 56A and live-rollers 34A with the 1st copper facing respectively, and 58B is the 2nd rectifier being connected with insoluble anode 56B and live-rollers 34B with the 2nd copper facing respectively.
Circuitron manufacture of substrates of the present invention, is the method that adopts circuitron apparatus for manufacturing substrate 10 of the present invention, comprising:
By the aforementioned the 1st and the 2nd pattern band plating 12A of mechanism, 12B the aforementioned the 1st and the surface of 2DLC pattern band 26A, 26B form the operation of the 1st and the 2nd circuit pattern plating layer MA, MB; And
To supplying with aforementioned base material 40 for tellite between the 1st and the 2nd crimping transfer roll 38A, 38B, make the 1st and the surface of 2DLC pattern band 26A, 26B the 1st and the 2nd circuit pattern plating layer MA, the MB that form by the aforementioned the 1st and the 2nd crimping transfer roll 38A, 38B crimping is transferred in this tellite and uses the two-sided of base material 40, thereby forms the operation of circuitron substrate 40M.
Then, adopt Fig. 4 to describe for tellite manufacturing installation of the present invention.
In Fig. 4, the 110th, tellite manufacturing installation of the present invention.This tellite manufacturing installation 110, the manufacture circuit substrate that is printed on one side, there is for example, structure after a side pattern band plating mechanism (, the 2nd pattern band plating 12B of mechanism) being unloaded in circuitron apparatus for manufacturing substrate 10 as shown in Figure 1.
This tellite manufacturing installation 110, has pattern band plating mechanism 112 and tellite and forms accommodating mechanism 114.
Aforementioned pattern band plating mechanism 112, have comprise taken in plating solution M plating coating groove 120 in interior plating unit 122.This plating coating groove 120, is configured to and has the overflow portion (not shown) same with the portion of overflowing as shown in Figure 3, and in plating processing procedure, makes all the time plating solution M overflow, and the liquid level of plating solution M is remained to the height of regulation.The 126th, DLC pattern band, is provided with the DLC pattern 128 of the convex forming by method described later on its surface, the surperficial part beyond this DLC pattern 128, becomes the recess 130 that can take in plating solution M.This DLC pattern band 126 is set to rotatably, and if be immersed in the plating solution M of this plating coating groove 120, plating solution M is accommodated in above-mentioned recess 130, at the circuit forming surface pattern plating layer MA of this DLC pattern band 126.
The 132nd, pattern band rotating unit, the opposed a pair of live-rollers 134,136 and the crimping transfer roll 138 that by the both sides at this plating coating groove 120, are arranged form, by this DLC pattern band 126 of reeling at these rollers 134,136,138, and rotate these rollers 134,136,138, thereby this DLC pattern band 126 is rotated.This crimping transfer roll 138, plays a role and makes a face crimping transfer printing aforementioned circuit pattern plating layer MA with base material 140 at tellite described later.The 141st, with this crimping transfer roll opposite disposed by pressure roller.
Aforementioned tellite forms accommodating mechanism 114, has the side (side that aforementioned crimping transfer roll 138 is positioned at) that is arranged on said plated groove 120, and supplies with the base material feed unit 142 for tellite of base material 140 for tellite.The 144th, circuit pattern crimping transfer printing unit, there is aforementioned crimping transfer roll 138, and play a role and make circuit pattern plating layer MA crimping be transferred in the one side of using 142 pairs of these crimping transfer rolls 138 of base material feed unit and using base material 140 by the tellite of supplying with between pressure roller 141 from aforementioned tellite, and form circuit pattern.The 146th, tellite accommodating mechanism, takes in having formed the tellite 140M of this circuit pattern.
According to above-mentioned formation, its effect is described.It is characterized in that, circuit forming surface pattern plating layer MA by aforementioned pattern band plating mechanism 112 at aforementioned DLC pattern band 126, to aforementioned crimping transfer roll 138 and by supplying with aforementioned base material 140 for tellite between pressure roller 141, by the circuit pattern plating layer MA that makes to form on the surface of this DLC pattern band 126, by aforementioned crimping transfer roll 138 and by pressure roller 141 crimping, be transferred in the one side of base material 140 for this tellite, thereby form tellite 140M, the tellite 140M that has formed this circuit pattern by aforementioned 114 pairs of accommodating mechanisms of tellite formation takes in.
In addition, for before aforementioned DLC pattern band 126 be impregnated in to said plated liquid M, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, be preferably in demoulding inorganic agent groove 150 and the tank 152 for washing that demoulding inorganic agent is taken in was set in said plated unit 122 before plating coating groove 120.The 154th, for to the formation of discharging from plating coating groove 120 rinsing bowl washed of the DLC pattern band 126 of circuit pattern plating layer MA.
And then, be preferably in tellite and be coated with in advance UV cured property adhesive with a face of base material 140, as shown in Figure 4, between aforementioned crimping transfer roll 138 and tellite accommodating mechanism 146, ultraviolet lamp 60 is set, make circuit pattern plating layer MA be transferred in aforementioned tellite with after a face of base material 140 across the crimping of aforementioned UV cured property adhesive, by aforementioned ultraviolet lamp 60 irradiation ultraviolet radiations, thereby make aforementioned UV cured property adhesive sclerosis, circuit pattern plating layer MA is adhered securely, come with the one side of base material 140, to form tellite 140M at aforementioned tellite.In addition, about UV cured property adhesive and ultraviolet lamp 60, use existing known device.
In addition, further, if paste processing release paper at the tellite that has been coated with aforementioned UV cured property adhesive with the coated face of base material 140 in advance, and before arriving aforementioned crimping transfer roll 138, aforementioned processing release paper is peeled off, can prevent that the coated face of aforementioned UV cured property adhesive is attached to undesirable place etc.
In addition; if after forming as described above tellite 140M; after also pasting processing release paper on the surface of aforementioned tellite 140M, by aforementioned tellite accommodating mechanism 146, take in, can protect the surface of aforementioned tellite 140M.
In Fig. 4,156 are arranged on the copper facing insoluble anode in plating coating groove 120.The 158th, the rectifier being connected with insoluble anode 156 and live-rollers 134 with this copper facing respectively.
Tellite manufacture method of the present invention, is the method that adopts tellite manufacturing installation of the present invention, comprising:
Operation by aforementioned pattern band plating mechanism at the circuit forming surface pattern plating layer of aforementioned DLC pattern band; And
To aforementioned crimping transfer roll and by supplying with aforementioned tellite base material between pressure roller, make the circuit pattern plating layer that forms on the surface of this DLC pattern band by aforementioned crimping transfer roll and press roll-in and switch through and be imprinted on the one side of base material for this tellite, thereby forming the operation of tellite.
Manufacture method about the DLC pattern band that uses in the present invention, describes below by Fig. 5 and Fig. 6.
First, at the surface-coated photosensitive material 214 (step 300 of Fig. 5 (a) and Fig. 6) of base material band 212.Make photosensitive material 214 expose/develop and form corrosion-resisting pattern 216 (step 302 of Fig. 5 (b) and Fig. 6).The photosensitive composite adopting as photosensitive material, can be used any in minus and eurymeric, but preferably adopt negative photosensitive composition.
Then, on the surface of this base material band 212 and corrosion-resisting pattern 216, form DLC by overlay film 218 (step 304 of Fig. 5 (c) and Fig. 6).As long as DLC is by overlay film by CVD (Chemical Vapor Deposition, chemical vapour deposition (CVD)) method or sputtering method formation.
Then, make the DLC forming on this corrosion-resisting pattern by each this corrosion-resisting pattern, be shelled From by overlay film, on the surface of base material, form DLC pattern 220 and the recess 222 (step 306 of Fig. 5 (d) and Fig. 6) of convex.So just, can manufacture DLC pattern band 224.This manufactured DLC pattern band can be used by DLC pattern band 26A, the 26B, 126 in the present invention.
Symbol description
10: circuitron apparatus for manufacturing substrate, 12A: the 1st pattern band plating mechanism, 12B: the 2nd pattern band plating mechanism, 14: tellite forms accommodating mechanism, 20A: the 1st plating coating groove, 20B: the 2nd plating coating groove, 22A: the 1st plating unit, 22B: the 2nd plating unit, 24: overflow portion, 26A: 1DLC pattern band, 26B: 2DLC pattern band, 28A: 1DLC pattern, 28B: 2DLC pattern, 30A: the 1st recess, 30B: the 2nd recess, 32A: the 1st pattern band rotating unit, 32B: the 2nd pattern band rotating unit, 34A, 36A, 34B, 36B: live-rollers, 37A: the 1st drying unit, 37B: the 2nd drying unit, 38A: the 1st crimping transfer roll, 38B: the 2nd crimping transfer roll, 40: tellite base material, 40M: tellite, 42: tellite base material feed unit, 44: circuit pattern crimping transfer printing unit, 46: tellite accommodating mechanism, 50A: the 1st demoulding inorganic agent groove, 50B: the 2nd demoulding inorganic agent groove, 52A: the 1st tank, 52B: the 2nd tank, 54A: the 1st rinsing bowl, 54B: the 2nd rinsing bowl, 55: table back of the body alignment sensor, 56A: the 1st copper facing insoluble anode, 56B: the 2nd copper facing insoluble anode, 58A: the 1st rectifier, 58B: the 2nd rectifier, 60: ultraviolet lamp, 112: pattern band plating mechanism, 114: tellite forms accommodating mechanism, 120: plating coating groove, 122: plating unit, 124: overflow portion, 126:DLC pattern band, 128:DLC pattern, 130: recess, 134,136: live-rollers, 138: crimping transfer roll, 140: tellite base material, 140M: tellite, 141: press pressure roller, 142: tellite base material feed unit, 146: tellite accommodating mechanism, 150: demoulding inorganic agent groove, 152: tank, 156: copper facing insoluble anode, 212: base material band, 214: photosensitive material, 216: corrosion-resisting pattern, 218:DLC is by overlay film, 220:DLC pattern, 222: recess, 224:DLC pattern band, M: plating solution, MA, MB: circuit pattern plating layer.
Claims (11)
1. a circuitron apparatus for manufacturing substrate, is characterized in that, comprises:
The 1st pattern band plating mechanism, it has: the 1st plating unit, the 1st plating unit comprises the 1st plating coating groove of having taken in plating solution; 1DLC pattern band, this 1DLC pattern band is immersed in the plating solution of the 1st plating coating groove, come to form the 1st circuit pattern plating layer on the surface of this 1DLC pattern band, and this 1DLC pattern band is set to rotatably; With the 1st pattern band rotating unit, the 1st pattern band rotating unit comprises the 1st crimping transfer roll, and the 1st crimping transfer roll rotates described 1DLC pattern band, and at the 1st circuit pattern plating layer described in a face crimping transfer printing of base material for tellite;
The 2nd pattern band plating mechanism, it has: the 2nd plating unit, the 2nd plating unit comprises to be taken in plating solution and separates predetermined distance and the 2nd plating coating groove that arranges from described the 1st plating coating groove; 2DLC pattern band, this 2DLC pattern band is immersed in the plating solution of the 2nd plating coating groove, come to form the 2nd circuit pattern plating layer on the surface of this 2DLC pattern band, and this 2DLC pattern band is set to rotatably; With the 2nd pattern band rotating unit, the 2nd pattern band rotating unit comprises the 2nd crimping transfer roll, the 2nd crimping transfer roll this 2DLC pattern band is rotated and with described the 1st crimping transfer roll opposite disposed, and at the 2nd circuit pattern plating layer described in another face crimping transfer printing of base material for tellite; And
Tellite forms accommodating mechanism, and it has: tellite base material feed unit, and this tellite is arranged between described the 1st plating coating groove and described the 2nd plating coating groove with base material feed unit, and supplies with tellite base material; Circuit pattern crimping transfer printing unit, this circuit pattern crimping transfer printing unit has described the 1st crimping transfer roll and described the 2nd crimping transfer roll, and makes circuit pattern crimping be transferred in from described tellite with base material feed unit to the tellite supplied with between described the 1st crimping transfer roll and described the 2nd crimping transfer roll two-sided with base material; With tellite accommodating mechanism, this tellite accommodating mechanism is taken in having formed the tellite of described circuit pattern,
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer, to supplying with described tellite base material between described the 1st crimping transfer roll and described the 2nd crimping transfer roll, by described the 1st crimping transfer roll and described the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, thereby form circuitron substrate, by described tellite, forming accommodating mechanism takes in having formed the circuitron substrate of described circuit pattern.
2. circuitron apparatus for manufacturing substrate according to claim 1, is characterized in that,
For flood described 1DLC pattern band and described 2DLC pattern band in described the 1st plating solution and described the 2nd plating solution before, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, and in described the 1st plating unit and described the 2nd plating unit, the 1st demoulding inorganic agent groove and the 2nd demoulding inorganic agent groove and the 1st tank and the 2nd tank for washing that demoulding inorganic agent is taken in were set respectively before the 1st plating coating groove and the 2nd plating coating groove.
3. circuitron apparatus for manufacturing substrate according to claim 1 and 2, is characterized in that,
Table back of the body alignment sensor is set between described the 1st crimping transfer roll and described the 2nd crimping transfer roll and tellite accommodating mechanism, make by the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping are transferred in after thereby described tellite formed tellite with base material two-sided, can be with respect to a preformed reference mark of face in base material two-sided for the described tellite having formed described the 1st circuit pattern plating layer and described the 2nd circuit pattern plating layer, the position detection signal of another face in two-sided according to this, carried out to this another face crimping transfer printing the position revisal of the pattern band rotating unit of pattern band plating layer.
4. according to the circuitron apparatus for manufacturing substrate described in any one in claim 1-3, it is characterized in that,
The UV cured property of double spread adhesive at described tellite with base material, between described the 1st crimping transfer roll and described the 2nd crimping transfer roll and tellite accommodating mechanism, ultraviolet lamp is set, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer be transferred in described tellite with after base material two-sided across the crimping of described UV cured property adhesive, by described ultraviolet lamp irradiation ultraviolet radiation, thereby make described UV cured property adhesive sclerosis, make described the 1st circuit pattern plating layer and described the 2nd circuit pattern plating layer adhere securely to form described circuitron substrate.
5. a circuitron manufacture of substrates, is the circuitron manufacture of substrates that adopts the circuitron apparatus for manufacturing substrate described in any one in claim 1-4, it is characterized in that, comprising:
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the operation of the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer; And
To supplying with described tellite base material between the 1st crimping transfer roll and the 2nd crimping transfer roll, by described the 1st crimping transfer roll and described the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, thereby form the operation of circuitron substrate.
6. a circuitron substrate, is to adopt the circuitron substrate that in claim 1-4, the circuitron apparatus for manufacturing substrate described in any one is manufactured, it is characterized in that,
By described the 1st pattern band plating mechanism and described the 2nd pattern band plating mechanism, on the surface of described 1DLC pattern band and described 2DLC pattern band, form the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer,
To supplying with described tellite base material between the 1st crimping transfer roll and the 2nd crimping transfer roll, by described the 1st crimping transfer roll and the 2nd crimping transfer roll, make the 1st circuit pattern plating layer and the 2nd circuit pattern plating layer crimping that on the surface of described 1DLC pattern band and described 2DLC pattern band, form be transferred in the two-sided of described tellite use base material, produce thus described circuitron substrate.
7. a tellite manufacturing installation, is characterized in that, comprises:
Pattern band plating mechanism, it has: plating unit, this plating unit comprises the plating coating groove of having taken in plating solution; DLC pattern band, this DLC pattern band is immersed in the plating solution of described plating coating groove, carry out the circuit forming surface pattern plating layer at this DLC pattern band, and this DLC pattern band is set to rotatably; Pattern band rotating unit, this pattern band rotating unit comprises crimping transfer roll, and this crimping transfer roll rotates described DLC pattern band, and the crimping of described circuit pattern plating layer is transferred in to a face of base material for tellite; With press pressure roller, should press pressure roller and described crimping transfer roll opposite disposed; With
Tellite forms accommodating mechanism, and it has: tellite base material feed unit, and this tellite is arranged on the side of described plating coating groove with base material feed unit, and tellite is supplied with base material; Circuit pattern crimping transfer printing unit, this circuit pattern crimping transfer printing unit has described crimping transfer roll and by pressure roller, and make circuit pattern crimping be transferred in from described tellite with base material feed unit to described crimping transfer roll and by the tellite of supplying with between pressure roller the one side with base material; With tellite accommodating mechanism, this tellite accommodating mechanism is taken in having formed the tellite of described circuit pattern,
Circuit forming surface pattern plating layer by described pattern band plating mechanism at described DLC pattern band, to described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, thereby formation tellite, forms accommodating mechanism by described tellite and takes in having formed the tellite of described circuit pattern.
8. tellite manufacturing installation according to claim 7, is characterized in that,
For flood described DLC pattern band in described plating solution before, be immersed in the pre-treatment in demoulding inorganic agent, and then wash, and demoulding inorganic agent groove and the tank for washing that demoulding inorganic agent is taken in was set in described plating unit before plating coating groove.
9. according to the tellite manufacturing installation described in claim 7 or 8, it is characterized in that,
At described tellite, with a face of base material, be coated with UV cured property adhesive, between described crimping transfer roll and tellite accommodating mechanism, ultraviolet lamp is set, make circuit pattern plating layer be transferred in described tellite with after the one side of base material across the crimping of described UV cured property adhesive, by described ultraviolet lamp irradiation ultraviolet radiation, thereby make described UV cured property adhesive sclerosis, make described circuit pattern plating layer adhere securely to form described tellite.
10. a tellite manufacture method, is the tellite manufacture method that adopts the tellite manufacturing installation described in any one in claim 7-9, it is characterized in that, comprising:
Operation by described pattern band plating mechanism at the circuit forming surface pattern plating layer of described DLC pattern band; With
To described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, thereby form the operation of tellite.
11. 1 kinds of tellites, are to adopt the tellite that in claim 7-9, the tellite manufacturing installation described in any one is manufactured, it is characterized in that,
Circuit forming surface pattern plating layer by described pattern band plating mechanism at described DLC pattern band,
To described crimping transfer roll and by supplying with described tellite base material between pressure roller, by described crimping transfer roll and by pressure roller, make the circuit pattern plating layer crimping forming on the surface of described DLC pattern band be transferred in the one side of base material for described tellite, produce thus described tellite.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-141235 | 2012-06-22 | ||
| JP2012141235 | 2012-06-22 | ||
| PCT/JP2013/066018 WO2013191026A1 (en) | 2012-06-22 | 2013-06-11 | Printed circuit board, and manufacturing device and manufacturing method therefor |
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| Publication Number | Publication Date |
|---|---|
| CN104137657A true CN104137657A (en) | 2014-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380011045.2A Pending CN104137657A (en) | 2012-06-22 | 2013-06-11 | Printed circuit board, and manufacturing device and manufacturing method therefor |
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| Country | Link |
|---|---|
| JP (1) | JPWO2013191026A1 (en) |
| KR (1) | KR101603964B1 (en) |
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| WO (1) | WO2013191026A1 (en) |
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| JP2012154964A (en) * | 2011-01-21 | 2012-08-16 | Think Laboratory Co Ltd | Roll with pattern and method for manufacturing the same |
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- 2013-06-11 JP JP2014521330A patent/JPWO2013191026A1/en active Pending
- 2013-06-11 WO PCT/JP2013/066018 patent/WO2013191026A1/en active Application Filing
- 2013-06-11 KR KR1020147022616A patent/KR101603964B1/en active IP Right Grant
- 2013-06-11 CN CN201380011045.2A patent/CN104137657A/en active Pending
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| JPS57132390A (en) * | 1981-02-07 | 1982-08-16 | Matsushita Electric Works Ltd | Method of producing printed circuit board |
| JPS6196795A (en) * | 1984-10-17 | 1986-05-15 | 日本写真印刷株式会社 | Manufacture of printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013191026A1 (en) | 2013-12-27 |
| JPWO2013191026A1 (en) | 2016-05-26 |
| KR101603964B1 (en) | 2016-03-16 |
| KR20140119118A (en) | 2014-10-08 |
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