KR101152765B1 - Apparatus and method for manufacturing laminated electronic component - Google Patents

Abstract

DISCLOSURE OF THE INVENTION Provided is a laminated electronic component manufacturing apparatus and a method for manufacturing a laminated electronic component that can eliminate a stepped portion between electrode circuits and manufacture a high quality laminated electronic component.
[Solution] An endless continuous film-forming substrate 12 having a releasing treatment on the outer circumference, a film-forming portion 16 for applying a ceramic slurry to the film-forming substrate 12 and drying to form a ceramic sheet, and a ceramic The dielectric coating film 36 is formed on the electrode circuit forming portion 22 that forms the electrode circuit 24 on the sheet S and the step portion 34 on the ceramic sheet S formed by the formation of the electrode circuit 24. A dielectric coating film forming portion 38 for forming a film, and a laminated support 14 for forming a laminated structure S 'of the ceramic sheet S.

Description

Apparatus for manufacturing a multilayer electronic component and a method for manufacturing a multilayer electronic component {APPARATUS AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component manufacturing apparatus and a method for manufacturing a multilayer electronic component for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

The following patent document 1 repeats the formation of the ceramic green sheet by a coat roller and formation of the internal electrode by the transfer apparatus in a predetermined order, while winding the endless conveyance belt wound around the polygonal column-shaped wheel. Then, during the circumference of the endless conveying belt, the constant region of the endless conveying belt is set to contact the planar portion of the polygonal column-shaped wheel, and the target ceramic laminate is punched and adsorbed to a size within the range of the region contacting the planar portion. The manufacturing method of the ceramic laminated body pulled out by a head is disclosed.

Patent Literature 2 below requires a first printing portion and a second printing portion, and forms a conductive paste film in the first printing portion, and forms a ceramic slurry for step removal in a region where the conductive paste film is not formed in the second printing portion. The manufacturing method of the laminated electronic component which has a function which can eliminate the step | step, and the effect which can shorten the time of a lamination process and can form an electrically conductive paste film with high precision is disclosed.

Japanese Patent Laid-Open No. 10-32140 Japanese Patent Laid-Open No. 2006-302932

As described in Patent Document 1, the method of applying the slurry on a sheet continuously dried in a wet state causes the solvent of the applied slurry to dissolve the sheet below, causing short or IR defects (poor insulation resistance). Cause sheet defects. In particular, the sheet thickness of multilayer ceramic capacitors these days has become thin, and coating by such a method is not suitable.

Although the said patent document 2 forms a laminated structure on a cylindrical drum, a ceramic sheet is limited to the high strength freestanding green sheet which does not have support bodies, such as a film. This sheet, which contains a high degree of polymerization resin and has increased strength, makes it difficult to degrease in the firing step and inhibits the compactness of the ceramics after firing.

Accordingly, it is an object of the present invention to provide a laminated electronic component manufacturing apparatus and a method for manufacturing a laminated electronic component capable of manufacturing a high quality laminated electronic component by eliminating the step between electrode circuits in view of the above problems.

The present invention relates to an endless continuous film-forming substrate having a release treatment on an outer circumference thereof, a film-forming portion for forming a ceramic sheet by coating and drying a ceramic slurry on the film-forming substrate, and the ceramic sheet. An electrode circuit forming portion for forming an electrode circuit, a dielectric coating film forming portion for forming a dielectric coating film on a stepped portion on the ceramic sheet resulting from the formation of the electrode circuit, and a laminated support for forming a laminated structure of the ceramic sheet. It is a laminated electronic component manufacturing apparatus characterized by having.

The present invention provides an endless continuous shape film forming substrate subjected to release treatment on an outer circumference, an electrode circuit forming portion for forming an electrode circuit on the film forming substrate, a dielectric coating film forming portion for forming a dielectric coating film on the film forming substrate, and A deposition support for forming a ceramic sheet on which the electrode circuit and the dielectric coating film are formed by applying and drying a ceramic slurry on the film forming substrate to cover an electrode circuit and the dielectric coating film, and a laminated support for forming a laminated structure of the ceramic sheet. It is a laminated electronic component manufacturing apparatus which has.

The present invention provides an endless continuous film forming substrate having a releasing treatment on an outer circumference, an electrode circuit forming unit for forming an electrode circuit on the film forming substrate, and a ceramic slurry is coated and dried on the film forming substrate to cover the electrode circuit. A film forming portion for forming a ceramic sheet on which the electrode circuit is formed, a dielectric coating film forming portion for forming a dielectric coating film on a stepped portion on the ceramic sheet formed by the formation of the electrode circuit, and a laminated structure of the ceramic sheet. It is a laminated electronic component manufacturing apparatus which has a laminated support body.

The present invention provides an endless continuous film forming substrate having a releasing treatment on an outer circumference, a dielectric coating film forming unit for forming a dielectric coating film on the film forming substrate, and a ceramic slurry is applied to the film forming substrate so as to cover the dielectric coating film, and dried. A film forming portion for forming a ceramic sheet on which the dielectric coating film is formed, an electrode circuit forming portion for forming an electrode circuit on the ceramic sheet at a different position from the dielectric coating film on the ceramic sheet, and a stack of the ceramic sheet. It is a laminated electronic component manufacturing apparatus which has a laminated support body which forms a structure.

In this case, it is preferable that the laminated support body is brought into contact with the film forming substrate through the ceramic sheet to peel the ceramic sheet from the film forming substrate and wound around the film to form a laminated structure of the ceramic sheet.

The present invention is characterized in that the new ceramic sheet is continuously formed on the film-forming substrate when the laminated structure of the ceramic sheet is formed by the laminated support.

The conveyance member which is provided so as to be interposed between the said film-forming base material and the said laminated support body, receives the said ceramic sheet formed in the said film-forming base material from the said film-forming base material, and conveys this received ceramic sheet to the said laminated | multilayer support body. It is characterized by having.

The present invention is characterized in that the electrode circuit forming portion forms the electrode circuit on the ceramic sheet on the conveying member, and the dielectric coating film forming portion forms the dielectric coating film on the stepped portion of the ceramic sheet on the conveying member. It is done.

The present invention is characterized in that the electrode circuit forming portion and the dielectric coating film forming portion form the electric circuit and the dielectric coating film at approximately the same timing with respect to the ceramic sheet on the same conveying member.

The present invention is characterized in that the electrode circuit forming portion and the dielectric coating film forming portion are a plateless printing apparatus. In particular, the plateless printing apparatus is preferably an inkjet printing apparatus.

Moreover, this invention can also solve the said subject by the manufacturing method of the laminated electronic component shown below.

That is, according to the present invention, a film forming step of continuously forming a ceramic sheet by coating and drying a ceramic slurry with a film forming forming unit on an endless continuous film forming substrate subjected to a releasing treatment on an outer circumference thereof, and by the electrode circuit forming unit, An electrode circuit forming step of forming an electrode circuit in a ceramic sheet, a dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion in a step portion on the ceramic sheet formed by the formation of the electrode circuit, and the ceramic It has a laminated structure formation process which forms the laminated structure of a sheet | seat, It is a manufacturing method of the laminated electronic component characterized by the above-mentioned.

The present invention provides an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film forming substrate subjected to release treatment on an outer circumference thereof, and a dielectric coating film on the film forming substrate by a dielectric coating film forming portion. Forming a dielectric coating film, and coating and drying a ceramic slurry on the film-forming substrate to form the ceramic sheet on which the electrode circuit and the dielectric coating film are formed so as to cover the electrode circuit and the dielectric coating film. It is a manufacturing method of the laminated electronic component which has a film-forming formation process and the laminated structure formation process which forms the laminated structure of the said ceramic sheet | seat.

The present invention provides an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film forming substrate subjected to a release treatment on an outer circumference, and a film forming portion with respect to the film forming substrate so as to cover the electrode circuit. A dielectric film is formed by a film forming step of coating and drying a ceramic slurry to form a ceramic sheet on which the electrode circuit is formed, and a dielectric coating film forming portion with respect to a step portion on the ceramic sheet caused by the formation of the electrode circuit. It is a manufacturing method of the laminated electronic component which has a dielectric coating film formation process and the laminated structure formation process which forms the laminated structure of the said ceramic sheet.

The present invention provides a dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on an endless continuous film forming substrate subjected to release treatment on an outer circumference thereof, and the film formation by the film forming portion to cover the dielectric coating film. An electrode circuit is formed by applying and drying a ceramic slurry on a substrate to form a ceramic sheet on which the dielectric coating film is formed, and an electrode circuit forming portion on the ceramic sheet at a location different from the dielectric coating film on the ceramic sheet. It is a manufacturing method of the laminated electronic component which has an electrode circuit formation process of forming the structure, and the laminated structure formation process of forming the laminated structure of the said ceramic sheet | seat.

The present invention provides an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film forming substrate subjected to a release treatment on an outer circumference, and a film forming portion with respect to the film forming substrate so as to cover the electrode circuit. To form a ceramic sheet in which the electrode circuit is formed by applying and drying a ceramic slurry, a laminate structure forming step of forming a laminated structure of the ceramic sheet, and the ceramic sheet formed by the formation of the electrode circuit. It is a manufacturing method of the laminated electronic component which has a dielectric coating film formation process which forms a dielectric coating film with a dielectric coating film formation part with respect to the step part on a laminated structure.

The present invention provides a dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on an endless continuous film forming substrate subjected to release treatment on an outer circumference thereof, and the film formation by the film forming portion to cover the dielectric coating film. A film forming step of coating and drying a ceramic slurry on a substrate to form a ceramic sheet on which the dielectric coating film is formed, a laminate structure forming step of forming a laminated structure of the ceramic sheet, and the dielectric coating film on the laminate structure of the ceramic sheet. It is a manufacturing method of the laminated electronic component which has an electrode circuit formation process which forms an electrode circuit by an electrode circuit formation part on the laminated structure of the said ceramic sheet in a different place.

In this case, when the laminated structure of the ceramic sheet is formed by the laminated support in the laminated structure forming step, it is preferable that the new ceramic sheet is continuously formed on the film forming substrate in the film forming step.

In this case, in the laminated structure forming step, the laminated support is brought into contact with the film forming substrate via the ceramic sheet to peel the ceramic sheet from the film forming substrate, and the peeled ceramic sheet is formed on the outer circumference of the laminated support. It is preferable to form the laminated structure of the said ceramic sheet | seat by winding up.

In this case, it has a conveying member provided so that it may be interposed between the said film-forming base material and the said laminated support, and the said conveyance member receives the said ceramic sheet formed in the said film-forming base material from the said film-forming base material, and this received said ceramic sheet | seat is carried out to the said laminated | stacked support body. It is preferable to have a conveyance process to convey.

In this case, in the electrode circuit forming step and the dielectric coating film forming step, a plateless printing apparatus is used as the electrode circuit forming portion and the dielectric coating film forming portion, and the electrode circuit and the dielectric coating are applied by the plateless printing apparatus. It is preferable that a film is formed. In particular, it is preferable to use an inkjet printing apparatus as a plateless printing apparatus.

EFFECTS OF THE INVENTION [

According to the present invention, a high quality laminated electronic component can be manufactured by eliminating the step between the electrode circuits. Moreover, the manufacturing efficiency (manufacturing speed) of a laminated electronic component can be improved by continuous operation instead of intermittent operation.

In other words, the stepped portion between the electrode circuits can be eliminated by filling the stepped portion between the electrode circuits on the ceramic sheet with a dielectric coating film (dielectric material). Thereby, the lamination | stacking shift | offset | difference and adhesion defect which become easy to generate | occur | produce when the number of laminated sheets of a ceramic sheet is increased can be prevented, and defects, such as a structural defect resulting from having the said step part, can be suppressed.

In addition, since the ceramic sheet is continuously formed on the film-forming substrate, the number of parts that can be divided as electronic components from the laminated structure obtained by expanding the stable region of the film thickness compared to the intermittent coating can be increased.

The process of forming a ceramic sheet on a film-forming base material, the process of forming an electrode circuit and a dielectric coating film on a ceramic sheet, and the process of forming a laminated structure of a ceramic sheet on a laminated support body by continuous operation are performed for a shorter time. It is possible to form a laminated structure of a ceramic sheet with high productivity.

Moreover, it is not necessary to use a long film base material like the conventional one, and the intermediate material cost can be suppressed.

As described above, the production efficiency (production speed) of the laminated electronic component can be improved by suppressing the occurrence of poor quality of the electronic component and continuously operating at low cost and not intermittently.

Further, in the present invention, when the laminated structure of the ceramic sheet is formed by the laminated support, the new ceramic sheet is continuously formed on the film-forming substrate, so that the laminated structure of the ceramic sheet is formed by continuous operation instead of intermittent operation. can do. Thereby, the laminated structure of a ceramic sheet can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of a ceramic sheet can be improved.

Moreover, in this invention, a dielectric coating film is formed in the step part of the ceramic sheet on a conveyance member by the dielectric coating film forming part. Thereby, since a dielectric coating film is formed with respect to the stepped part of the ceramic sheet dried on the film-forming base material, the positional accuracy of the formation position of a dielectric coating film can be improved further. As a result, the step portion generated on the ceramic sheet can be reliably eliminated.

Further, in the present invention, since the electrode circuit forming portion and the dielectric coating film forming portion are plateless printing apparatuses, it is possible to form electrode circuits and dielectric coating films of different patterns for each layer of the ceramic sheet. In addition, even when the ceramic sheet is stretched or stretched in accordance with the progress of lamination of the ceramic sheet on the laminated support, the pitch between the electrode circuit and the dielectric coating film is adjusted to adjust the pitch between the electrode circuit and the dielectric coating film. Can be formed.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of the laminated electronic component manufacturing apparatus by 1st Embodiment of this invention.
It is explanatory drawing which shows the position of the defect part on a ceramic sheet | seat.
3 is an explanatory view showing step portions (grooves, recesses) generated between electrode circuits on a ceramic sheet.
4 is an explanatory diagram showing an electrode circuit and a dielectric coating film on a ceramic sheet.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 2nd Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 3rd Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 4th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 5th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 6th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 7th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 8th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 9th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 10th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 11th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 12th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 13th Embodiment of this invention.

EMBODIMENT OF THE INVENTION The laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 1st Embodiment of this invention are demonstrated with reference to drawings. In addition, the "layered electronic component" which this invention makes object includes laminated electronic components, such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component.

First, the laminated electronic component manufacturing apparatus is demonstrated.

As shown in FIG. 1, the laminated electronic component manufacturing apparatus 10 mainly carries out the release process on the surface (outer peripheral surface), and forms the coating roll 12 (film-forming base material) which forms the ceramic sheet S, and the coating roll 12 ), It has a stacking roll 14 (laminated support) which winds up the ceramic sheet S peeled off from and forms a laminated structure S 'of the ceramic sheet S.

Around the coating roll 12, the film forming means 16 (film forming part) for applying the ceramic slurry which becomes the material of the ceramic sheet S to the surface of the coating roll 12, and the ceramic film to the film forming means 16 The liquid supply means 18 for supplying a slurry, the dry hardening apparatus 20 for dry-solidifying the ceramic slurry on the surface of the coating roll 12, and the coating roll 12 contacted through the ceramic sheet S, The intermediate conveyance roller (conveying member) 30 for conveying the ceramic sheet S on the coating roll 12 to the printing conveyance roller (conveying member) 32 is arrange | positioned. In addition, the printing conveyance roller 32 is contacting the intermediate conveyance roller 30 through the ceramic sheet | seat S. FIG. Around the printing conveyance roller 32, the electrode circuit forming means 22 (electrode circuit forming portion) for forming the electrode circuit 24 (see FIG. 2) on the ceramic sheet S and the electrode circuit 24 Dielectric coating film forming means 38 (dielectric coating film formation) for forming dielectric coating film 36 on stepped portion 34 (see FIGS. 3 and 4) generated on the surface of ceramic sheet S by formation. And the dry curing apparatus 26 for drying the electrode circuit 24 and the dielectric coating film 36, and the stacking roll 14 which contacted the printing conveyance roller 32 via the ceramic sheet S. It is arranged.

The laminated electronic component manufacturing apparatus 10 of this embodiment forms the electrode circuit 24 in the ceramic sheet S to form the stepped portion 34 (concave portions generated between the electrode circuits or irregularities on the ceramic sheet S). The dielectric coating film 36 is formed to reduce the step 34, and the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is wound on the outer circumferential surface of the stacking roll 14 ( It is a characteristic that the laminated structure S 'of the ceramic sheet S is formed by laminating).

Here, a dry curing apparatus for drying and solidifying the ceramic slurry on the surface of the coating roll 12 on the downstream side of the coating roll rotation direction (between the film forming means 16 and the electrode circuit forming means 22) of the film forming means 16 ( 20) is arranged. Moreover, the dielectric coating film forming means 38 is arrange | positioned at the downstream side of the printing conveyance roller rotation direction of the electrode circuit forming means 22. As shown in FIG. Moreover, the dry hardening apparatus 26 for drying the electrode circuit 24 and the dielectric coating film 36 is arrange | positioned downstream of the printing conveyance roller rotation direction of the dielectric coating film forming means 38. As shown in FIG. Moreover, the stacking roll 14 is arrange | positioned at the printing conveyance roller rotation direction downstream side of the dry hardening apparatus 26. As shown in FIG.

Specifically, the coating roll 12 is comprised by rigid rolls (cylindrical shape or cylindrical shape), such as a metal, to which the release process was given to the surface. The coating roll 12 is comprised so that rotation drive may be carried out by the drive source which is not shown in figure. In addition, a mold release process corresponds to a fluorine-type plating process etc., for example.

The stacking roll 14 is comprised by attaching an elastic body (for example, a resin film, an elastic film, rubber | gum, a viscous sheet, etc.) to the outer peripheral surface of the removable metal cylindrical jig | tool. This cylindrical jig is mounted on a rotating shaft to rotate in synchronism with the coating roll 12. In addition, the stacking roll 14 may be comprised so that rotation driving may be carried out by the drive source which is not shown in figure, and may be comprised so that it may rotate simultaneously with the rotational force of the coating roll 12. FIG. The stacking roll 14 is pressed by the predetermined pressure (pressure force) with respect to the printing conveyance roller 32 by the pressure provision mechanism not shown.

Here, the outer circumferential length of the coating roll 12 is the same length as the outer circumferential length of the stacking roll 14, or one of the outer circumferential length of the coating roll 12 or the outer circumferential length of the stacking roll 14 is an integral multiple of the other. It is preferable.

As the film forming means 16, for example, an extrusion coating method such as a die coater, a doctor blade, a roll coater, an inkjet coater, or the like is adopted. Moreover, in order to make thinner the film thickness of the ceramic sheet | seat S formed in the outer peripheral surface of the coating roll 12, it is preferable to provide an upstream pressure reduction mechanism in a die coater. The ceramic sheet S is formed by applying the ceramic slurry continuously (non intermittently) to the coating roll 12 from the film forming means 16. As such, the ceramic slurry is continuously supplied to the same coating roll 12.

As the liquid supply means 18, for example, a gear pump is employed. In addition, the liquid supply means 18 is not limited to a gear pump, You may employ | adopt a cylindrical dispenser, a diaphragm pump, etc. suitably.

The intermediate conveyance roller 30 and the printing conveyance roller 32 have a function which receives the ceramic sheet S from a previous process by means of adhesion | attachment, etc., and conveys the received ceramic sheet S to a later process. The intermediate | middle conveyance roller 30 and the printing conveyance roller 32 select the rigid roll of metal or resin, the roll which coated resin on the surface, etc. suitably.

The force that the intermediate transfer roller 30 holds the ceramic sheet S is greater than the force that the coating roll 12 holds the ceramic sheet S, and the print transfer roller 32 holds the ceramic sheet S. Since it is set smaller than the force to be made, the ceramic sheet S is peeled from the coating roll 12, it is hold | maintained by the intermediate conveyance roller 30, and is then transferred to the printing conveyance roller 32. Since the force which the printing conveyance roll 32 hold | maintains the ceramic sheet | seat S is set smaller than the force which the stacking roll 14 hold | maintains the ceramic sheet | seat S, the ceramic sheet | seat S is the printing conveyance roller 32 It peels off and is transferred to the stacking roll 14. The surface of the elastic body of the stacking roll 14 holds the ceramic sheet S by means of adhesion, electrostatic adsorption, or the like. In addition, in the ceramic sheet S wound by the stacking roll 14, the sheet layers overlapping each other are crimped | bonded and hold | maintained. Since the holding force is set larger than the force that the printing conveying roller 32 holds the ceramic sheet S, the ceramic sheet S is peeled off from the printing conveying roller 32 and transferred to the stacking roll 14. .

In detail, the intermediate conveyance roller 30 has a function which peels the ceramic sheet S from the coating roll 12, and transfers to the printing conveyance roller 32. As shown in FIG. Moreover, the printing conveyance roller 32 has a function which peels the ceramic sheet S from the intermediate conveyance roller 30, and transfers it to the stacking roll 14. As shown in FIG. In addition, the intermediate | middle conveyance roller 30 and the printing conveyance roller 32 may be a peeling conveyance roll which adsorbs (suctions or electrostaticssorbs) the ceramic sheet S, and peels and conveys them. At this time, it is preferable that the intermediate conveyance roller 30 and the printing conveyance roller 32 are comprised so that the site | part which adsorbs a ceramic sheet S and the site | part which does not adsorb | suck are controlled. When receiving the ceramic sheet S from the coating roll 12, it has a adsorption function to the predetermined site | part of the intermediate | middle conveyance roller 30 which contacts the ceramic sheet S, and receives the received ceramic sheet S in a printing conveyance roller. Receiving and transferring ceramic sheet S can be performed smoothly by having a non-adsorption area | region in the predetermined site | part of the intermediate | middle conveyance roller 30 which contacts the ceramic sheet S at the time of transferring to 32. FIG. The same applies to the print conveying roller 32 for the adsorption function and the non-adsorption area. That is, when receiving the ceramic sheet S from the intermediate conveyance roller 30, it has a adsorption function to the predetermined site | part of the printing conveyance roller 32 which contacts the ceramic sheet S, and receives the received ceramic sheet S. Receiving and transferring ceramic sheet S can be performed smoothly by having a non-adsorption area | region in the predetermined site | part of the printing conveyance roller 32 which contacts the ceramic sheet S when transferring to the stacking roll 14. FIG.

In addition, in this embodiment, the electrode circuit 24 and the dielectric coating film 36 are formed with respect to the ceramic sheet S on the printing conveyance roller 32.

As the electrode circuit forming means 22, for example, an inkjet printing apparatus is employed. The electrode circuit forming means 22 is preferably a plateless printing means, but the electrode circuit 24 after drying may be transferred, and means such as intaglio printing and intaglio offset printing may be used. As the electrode material ink used in the electrode circuit forming means 22, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent is used. What disperse | distributed Ni powder to UV curable resin may be sufficient. In particular, it is preferable to use a solvent with low swelling property with respect to a ceramic coating film. In addition, the solvent may be an aqueous system.

As the dielectric coating film forming means 38, for example, an inkjet printing apparatus is employed. The dielectric coating film forming means 38 is preferably a plateless printing means. However, the dielectric coating film after drying may be transferred, and any means such as intaglio printing, intaglio offset printing, gravure printing, gravure offset printing, or rotary screen printing may be used. The dielectric material used in the dielectric coating film forming means 38 is obtained by dissolving and dissolving ceramic powder and resin in a ceramic ink, for example, an organic solvent. You may use what disperse | distributed the ceramic powder to UV hardening resin. In particular, it is preferable to use a solvent with low swelling property with respect to a ceramic coating film. In addition, the solvent may be aqueous.

As the dry hardening apparatus 20,26, the method of drying by hot air and the method of heating the outer peripheral surface of the coating roll 12 are employ | adopted, for example. When using UV curable resin, you may irradiate and harden UV. The dry curing apparatuses 20 and 26 are for drying or curing the applied ceramic slurry or electrode material ink. In addition, you may use a vacuum drying means for the dry hardening apparatus 20 for dry hardening the ceramic slurry on the coating roll 12. As shown in FIG. The dry curing apparatus 26 is for drying the electrode circuit 24 and the dielectric coating film 36 formed on the ceramic sheet S on the print conveying roller 32.

As a ceramic slurry, what melt | dissolved and disperse | distributed the ceramic powder and resin in the organic solvent is employ | adopted, for example. You may use what disperse | distributed the ceramic powder to UV hardening resin. In addition, the solvent may be aqueous.

Next, the manufacturing method of the laminated structure S 'of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 is demonstrated.

The coating roll 12 which performed the mold release process is rotated at a predetermined speed, and a ceramic slurry is apply | coated to this outer peripheral surface by the film-forming means 16. FIG. In addition, supply of a ceramic slurry is performed using the gear pump which is a liquid supply means 18. As shown in FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the dry curing apparatus 20. Here, hot air of a predetermined temperature is used for drying the ceramic slurry by the dry curing device 20. The temperature is adjusted by heating or cooling with a separate temperature controller so that the outer circumferential surface of the coating roll 12 is an appropriate temperature. In addition, these temperatures are adjusted suitably according to the material of the ceramic sheet S. FIG. In this way, the ceramic slurry is continuously supplied to the coating roll 12 by the film forming means 16 and the liquid supply means 18 so that the ceramic sheet S is continuously formed. The ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are not printed is wound by the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '.

Next, the ceramic sheet S on the coating roll 12 is peeled from the coating roll 12 on the intermediate conveying roller 30, and is conveyed to the printing conveying roller 32. As a result, the ceramic sheet S moves on the print conveyance roller 32. The ceramic sheet S moved onto the print conveyance roller 32 moves with the rotation of the print conveyance roller 32 to reach just below the electrode circuit forming means 22 (for example, inkjet printing). And the electrode material ink is apply | coated from the electrode circuit formation means 22 to the ceramic sheet S on the coating roll 12, and the electrode circuit (internal electrode circuit) 24 of a predetermined figure pattern is printed. The outer peripheral surface of the printing conveyance roller 32 is temperature-controlled by the temperature controller so that it may become a suitable temperature.

Subsequently, the ceramic sheet S on which the electrode circuit 24 is formed moves together with the rotation of the print conveying roller 32 to reach just below the dielectric coating film forming means 38 (for example, inkjet printing). Then, ceramic ink is applied from the dielectric coating film forming means 38 to the stepped portion of the ceramic sheet S on the coating roll 12, and the dielectric coating film 36 having a predetermined figure pattern is printed. Here, the formation position of the dielectric coating film 36 becomes a recess formed between the electrode circuits 24 on the ceramic sheet S. As shown in FIG. That is, as shown in FIG. 3, when the electrode circuit 24 is formed on the ceramic sheet S, an unevenness | corrugation will arise on the ceramic sheet S, and what is called a step part 34 is produced. As shown in FIG. 4, the stepped portion (concave portion) 34 is reduced by printing the dielectric coating film 36 on the stepped portion 34 formed between the electrode circuits 24, thereby reducing the surface of the ceramic sheet S. This flat shape is obtained.

Subsequently, after printing of the electrode circuit (inner electrode circuit) 24 and the dielectric coating film 36, hot air of a predetermined temperature is sprayed from the dry curing device 26 onto the electrode circuit 24 and the dielectric coating film 36. The electrode circuit 24 and the dielectric coating film 36 are dried. Here, in the formation process of the electrode circuit 24, when it is wound by the outer peripheral surface of the stacking roll 14, electrode printing is performed by changing a figure pattern and a shape so that the electrode circuit 24 may become a counter electrode for each layer (each perimeter). . In addition, in the formation process of the dielectric coating film 36, printing is performed by changing a figure pattern and a shape so that the dielectric coating film 36 may become a counter electrode for each layer when it is wound up on the outer peripheral surface of the stacking roll 14. As shown in FIG. In this way, the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S on the coating roll 12.

Next, the stacking roll 14 is pressed against the coating roll 12 at a predetermined pressing force. In addition, it is necessary to adjust the said pressing force suitably with the material of the ceramic sheet S. FIG. Then, the dried ceramic sheet S (completely formed electrode circuit and dielectric coating film) formed on the outer circumferential surface of the coating roll 12 is peeled from the outer circumferential surface of the coating roll 12 and transferred onto the outer circumferential surface of the stacking roll 14. Wind up. Here, since the mold release process is given to the outer peripheral surface of the coating roll 12, and the stacking roll 14 is contacting with respect to the coating roll 12 by predetermined pressure, after drying formed in the outer peripheral surface of the coating roll 12, The ceramic sheet S is easily peeled from the outer circumferential surface of the coating roll 12 and transferred to the outer circumferential surface side of the stacking roll 14. In the stacking roll 14, a resin film is wound around the outer circumferential surface of the metal cylindrical jig, and the temperature is adjusted so that the temperature of the outer circumferential surface becomes a predetermined temperature. In addition, the temperature of the outer peripheral surface needs to be adjusted appropriately according to the material of the ceramic sheet S. FIG.

After winding the ceramic sheet S with the stacking roll 14 by a predetermined layer, printing the electrode circuit 24 by the electrode circuit forming means 22 and the dielectric coating film by the dielectric coating film forming means 38. Printing of 36 is stopped. Subsequently, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are not printed is wound on the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '. . Thereafter, the supply of the ceramic slurry to the coating roll 12 is stopped to terminate the formation of the laminated structure S 'of the ceramic sheet S, or alternatively to the stacking roll 14 by a changer mechanism. The stacking roll is brought into pressure contact with the outer circumferential surface of the coating roll 12 to wind the ceramic sheet S (after forming the electrode circuit 24 and the dielectric coating film) on the outer circumferential surface of the coating roll. In this way, the laminated structure S 'of the ceramic sheet S is formed.

Moreover, the laminated structure S 'of the ceramic sheet S formed in the stacking roll 14 (or stacking roll 15) is isolate | separated with a cylindrical jig, a press press is carried out with cylindrical shape, and dicer cutting ( cut into chip shape by dicer cutting). Thereafter, firing, an electrode circuit (external electrode circuit) is formed, and a multilayer ceramic capacitor is manufactured through a normal manufacturing process.

In particular, as shown in FIG. 3 and FIG. 4, when the electrode circuit 24 is formed in the ceramic sheet S, a recess is formed between the electrode circuits 24 and the step portion 34 (concave) is formed on the ceramic sheet S. Part), but the step part 34 can be reduced by printing the dielectric coating film 36 (ceramic material) on the step part 34. FIG. In this way, by filling the step portion 34 between the electrode circuits with the dielectric coating film 36, lamination shifts and poor adhesion which tend to occur when the number of laminated sheets of the ceramic sheet S increase can be prevented, The structural defect resulting from the presence of the stepped portion 34 can be suppressed. As a result, the quality defect of the electronic component manufactured can be prevented. In addition, the formation order of the dielectric coating film 36 and the electrode circuit 24 does not have a problem in particular. The installation position of the dielectric coating film forming means 38 and the installation position of the electrode circuit forming means 22 are not particularly problematic.

In particular, since the electric circuit 24 and the dielectric coating film 36 are formed on the printing conveyance roller 32 at substantially the same timing, the positional accuracy of the electric circuit 24 and the dielectric coating film 36 can be improved. Thereby, the laminated structure S 'of the high precision ceramic sheet S can be manufactured, without providing a detection means, such as a CCD camera.

In addition, when the ceramic sheet S is peeled off from the coating roll 12 and wound around the outer circumferential surface of the stacking roll 14 to form the laminated structure S 'of the ceramic sheet S, a new coating roll 12 is applied to the coating roll 12. Since the ceramic sheet S is formed continuously, formation of the ceramic sheet S in the coating roll 12 and formation of the laminated structure S 'of the ceramic sheet S in the stacking roll 14 are performed. Run concurrently. Thereby, the ceramic sheet S can be formed continuously without stopping rotation drive of the coating roll 12 once, and also ceramic sheet S continuously without stopping rotation drive of the stacking roll 14 once. ) Laminated structure (S ') can be produced. Thus, the laminated structure S 'of the ceramic sheet S can be formed by continuous operation instead of intermittent operation. As a result, the laminated structure S 'of the ceramic sheet S can be formed in a very short time, and the manufacturing efficiency of the laminated structure S' of the ceramic sheet S can be improved.

Moreover, since the ceramic sheet S is formed on the coating roll 12 which is a rigid body, and conveys from sheet molding to the sheet | seat lamination process, supporting a sheet surface with the coating conveyance roll 12 or the transfer roll 14, it is thin, Even when the low-strength ceramic sheet S is used, cracking and damage of the ceramic sheet S can be suppressed. As a result, the handling property of the thin, low-strength ceramic sheet S can be improved.

Moreover, the uniformity and the high productivity of the film thickness of the ceramic sheet S are obtained rather than the method using the intermittent application | coating of a well-known ceramic slurry. That is, since the laminated structure S 'of the ceramic sheet S continuously forms the sheet, the stable region of the film thickness is wider than the intermittent coating. As a result, the electronic component of stable quality can be acquired from the laminated structure S 'of the ceramic sheet S. FIG. The number of electronic components which can be acquired per unit volume of the laminated structure of the ceramic sheet S increases.

In addition, in this embodiment, since it is not necessary to use the intermediate consumer goods of disposable base materials (PET film etc.), and the intermediate material cost including storage, transportation, etc. can be reduced, the laminated structure S 'of the ceramic sheet S, Furthermore, the manufacturing cost of an electronic component can be reduced significantly.

In addition, in this embodiment, only the ceramic sheet S which is necessary is formed by connecting a film forming process, a printing process, a step | step difference elimination process, and a lamination | stacking process, and the loss of the conveyance path of a lamination | stacking and lamination | stacking number ), Etc., are eliminated, so that material loss can be reduced.

In addition, in this embodiment, since the electrode circuit 24 and the dielectric coating film 36 are formed before the ceramic sheet S is laminated | stacked on the outer peripheral surface of the stacking roll 14, in other words, an electrode circuit in the ceramic sheet S is carried out. After the 24 and the dielectric coating film 36 are formed, the ceramic sheet S on which the electrode circuit and the dielectric coating film formation are completed is wound and laminated on the outer circumferential surface of the stacking roll 14. Accordingly, when the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S after the ceramic sheet S is laminated on the outer circumferential surface of the stacking roll 14, the ceramic sheet S is formed on the lower ceramic sheet S. Sheet attack occurs due to the electrode solvent and the dielectric coating film solvent in the electrode sheet 24 and the dielectric coating film 36 or the ceramic sheet S on which the lower electrode circuit and the dielectric coating film are completed. do. When the electrode circuit is formed in the state of the single-layer ceramic sheet as in the present invention, the influence of the sheet attack can be suppressed to the minimum of the single layer, so that problems such as short or poor IR (poor insulation resistance) can be reduced.

In particular, since the formation of the ceramic sheet S and the formation of the electrode circuit 24 and the dielectric coating film 36 on the coating roll 12 are performed at the same time, it is possible to make the whole of a single facility simple and compact. Can be made low, the area can be made small, and the reliability of the equipment can be improved.

In addition, since the ceramic slurry is dried on the coating roll 12 and the ceramic sheet S is laminated on the stacking roll 14 separately installed, the ceramic slurry is applied on the dried ceramic sheet S. There is no sheet attack by remelting.

Further, by using a plateless printing method such as inkjet for forming the electrode circuit 24 and the dielectric coating film 36, the electrode circuit 24 and the dielectric having different electrode patterns for each layer of the ceramic sheet S are provided. The coating film 36 can be formed. In particular, even when the deformation of the ceramic sheet S or the outer diameter of the stacking roll 14 increases or the peripheral length increases due to the progress of the stacking of the ceramic sheet S, the electrode circuit 24 and the dielectric coating film 36 are generated. Since the pattern and the formation position of can be freely changed, the pitch (spacing) between the electrode circuits 24 and the dielectric coating film 36 is appropriately adjusted so that the electrode circuit 24 and the dielectric coating film (without position shift) 36) becomes possible.

In particular, since the intermediate | middle conveyance roller 30 and the printing conveyance roller 32 are interposed between the coating roll 12 and the stacking roll 14, peeling of the ceramic sheet S from the coating roll 12 is a stacking roll. It does not affect the state of the (14) side, and stable handling is attained. Specifically, when the laminated structure S 'of the ceramic sheet S is formed on the stacking roll 14, the state change of the appearance such as the size (outer diameter) including the ceramic sheet of the stacking roll 14 increases. . However, by interposing the intermediate conveying roller 30 and the printing conveying roller 32 between the coating roll 12 and the stacking roll 14, the stacking roll 14 and the intermediate | middle in accordance with the state change of the stacking roll 14 mentioned above. The positional relationship, the pressure, etc. of the conveyance roller 30 and the printing conveyance roller 32 can be adjusted suitably. Thereby, deterioration of the quality of the laminated structure S 'of the ceramic sheet S formed on the stacking roll 14 by the state change of the stacking roll 14 can be prevented. In addition, the ceramic sheet S in which the stacking roll 14 is formed on the coating roll 12 according to the change of the state of the stacking roll 14 by designing the stacking roll 14 so as not to directly contact the coating roll 12. Damage to the ceramic sheet S can be prevented, and deterioration of the quality of the ceramic sheet S and thus the electronic components can be prevented.

Moreover, by providing the intermediate conveyance roller 30 and the printing conveyance roller 32, the path | route which the ceramic sheet | seat S moves to can be lengthened until it conveys to the stacking roll 14, without making the coating roll 12 large. Therefore, the drying time of the ceramic sheet S may be long. And since the ceramic slurry is continuously apply | coated to the coating roll 12 continuously from the coating roll 12 to the stacking roll 14 through the intermediate conveyance roller 30 and the printing conveyance roller 32, The movement process of the ceramic sheet S can be performed continuously. As a result, the line speed of the equipment can be increased to increase the manufacturing speed (manufacturing efficiency) of the ceramic sheet S, and the manufacturing efficiency of the laminated structure S 'of the ceramic sheet S, and moreover, the electronic component can be improved. have.

4, the electrode circuit 24 and the dielectric coating film 36 are formed in the ceramic sheet S on the printing conveyance roller 32. As shown in FIG. Thereby, since the electrode circuit 24 and the dielectric coating film 36 are formed with respect to the ceramic sheet S dried on the coating roll 12, formation of the electrode circuit 24 and the dielectric coating film 36 is carried out. The positional accuracy of the position can be further improved. On the contrary, when the electrode circuit 24 and the dielectric coating film 36 are formed on the semi-dry ceramic sheet S, the electrode circuit 24 and the dielectric formed thereon are deformed because the ceramic sheet S to be ground is deformed. There exists a possibility that the position of the coating film 36 may shift. In this embodiment, in order to solve such a problem, the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S which is reliably dried on the coating roll 12.

In particular, when the ink-jet method is adopted for the electrode circuit forming means 22 and the dielectric coating film forming means 38, the amount of solvent of the ink is large, so that the ink becomes difficult to dry. Therefore, by forming the electrode circuit 24 and the dielectric coating film 36 on the printing conveyance roller 32, the moving distance of the ceramic sheet S becomes long even if a large diameter roll is not employ | adopted, and the electrode circuit on the ceramic sheet S is carried out. (24) and the time for drying the dielectric coating film 36 can be lengthened. For this reason, the quality variation of the electrode circuit 24 and the dielectric coating film 36 formed by the inkjet method is eliminated, and the quality of an electronic component can be maintained at high quality.

In addition, in 1st Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the first embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the first embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 30 and the printing conveyance roller 32 of 1st Embodiment correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 2nd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 3, FIG. 4, and FIG. 5, 2nd Embodiment is the electrode circuit 24 and the dielectric coating film 36 (FIG. 4) on the ceramic sheet S on the infinite conveyance belt (conveying member) 40. As shown in FIG. Is formed). That is, the intermediate conveying roller (conveying member) 42 is in contact with the coating roll 12 via the ceramic sheet S. FIG. In addition, the endless conveyance belt 40 is in contact with the intermediate conveyance roller 42 through the ceramic sheet S. As shown in FIG. In addition, the intermediate conveyance roller (conveying member) 44 is in contact with the endless conveyance belt 40 via the ceramic sheet S. FIG. Two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate transfer roller 44 via the ceramic sheet S. As shown in FIG. Two press rolls 46 and 48 are in contact with the two stacking rolls 14 or the stacking rolls 15 through the ceramic sheet S. FIG. Thus, the intermediate | middle conveyance roller roll 42, the infinite conveyance belt 40, and the intermediate | middle conveyance roller 44 are interposed between the coating roll 12 and each stacking roll 14 and 15. As shown in FIG. For this reason, the coating roll 12 and each of the stacking rolls 14 and 15 are in an indirectly contacted state (a state in which mechanical power transmission is possible).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. And the said intermediate conveyance roller 42 is arrange | positioned. In addition, the electrode circuit forming means 22 for forming the electrode circuit 24 in the ceramic sheet S before being wound (laminated) on the outer circumferential surfaces of the stacking rolls 14 and 15 around the endless conveyance belt 40. (Electrode circuit forming portion), a dry curing apparatus 26 for drying the electrode circuit 24 located on the downstream side of the endless conveying belt rotation direction of the electrode circuit forming means 22, and the intermediate conveying roller 44 described above. ) Is arranged.

In detail, the intermediate conveyance roller 42 has a function which peels the ceramic sheet S from the coating roll 12, and transfers (conveys) to the infinite conveyance belt 40. As shown in FIG. The endless conveyance belt 40 has a function of peeling the ceramic sheet S from the intermediate conveying roller 42 and transferring it to the intermediate conveying roller 44. Moreover, the intermediate conveyance roller 44 has a function which peels the ceramic sheet | seat S from the endless conveyance belt 40, and transfers to the stacking roll 14 (or stacking roll 15).

In particular, in the second embodiment, the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S on the endless conveyance belt 40 which is the conveying member.

In the second embodiment, the ceramic slurry is supplied to the outer circumferential surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. In this way, the ceramic sheet S is formed. Moreover, the electrode material ink from the electrode circuit forming means 22 (for example, inkjet printing) with respect to the ceramic sheet | seat S which moved from the coating roll 12 to the infinite conveyance belt 40 on the intermediate conveyance roller 42. Is applied, and the electrode circuit 24 of a predetermined figure pattern is printed. Subsequently, a ceramic ink (ceramic material) is applied from the dielectric coating film forming means 38 to the ceramic sheet S on which the electrode circuit 24 is formed, and predetermined to the stepped portion 34 formed between the electrode circuits 24. The dielectric coating film 36 of the figure pattern is printed. After printing of the electrode circuit 24 and the dielectric coating film 36, the warm air of a predetermined temperature is sprayed from the dry curing apparatus 26 onto the ceramic sheet S on the endless conveying belt 40 to thereby form the electrode circuit 24 and the dielectric. The coating film 36 is dried. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the endless conveyance belt 40, and the dielectric coating film 36 is formed on the stepped portion 34 generated by the formation of the electrode circuit 24. Is formed. Thereafter, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is received by the intermediate conveying roller 44 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. As described above, also in the second embodiment, after the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit and the dielectric coating film are completed is finally stacked. It is wound up and laminated on the outer peripheral surface of the roll 14.

According to 2nd Embodiment, since the outer periphery length of the endless conveyance belt 40 which is a long length belt becomes longer than the outer periphery length of the coating roll 12, the drying area | region of the ceramic sheet S on the endless conveyance belt 40 (drying) Region that can be dried by the curing device 26] can be expanded. As a result, the formation speed (including the drying speed) of the electrode circuit 24 and the dielectric coating film 36 of the ceramic sheet S on the ceramic sheet S is increased, thereby increasing the manufacturing speed of the electronic component. It can increase.

In particular, when the ink-jet method is adopted for the electrode circuit forming means 22 and the dielectric coating film forming means 38, the amount of solvent of the ink is large, so that the ink becomes difficult to dry. Therefore, by employing the endless conveying belt 40 in the printing portion of the electrode circuit 24 and the dielectric coating film 36, the moving distance of the ceramic sheet S is increased even when a large diameter roll is not employed. The time for drying the electrode circuit 24 and the dielectric coating film 36 can be lengthened. For this reason, the quality variation of the electrode circuit 24 and the dielectric coating film 36 formed by the inkjet method is eliminated, and the quality of an electronic component can be maintained at high quality.

In addition, in 2nd Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "lamination support body" of this invention. In addition, the electrode circuit forming means 22 of the second embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the second embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 42 of the 2nd embodiment, the infinite conveyance belt 40, and the intermediate conveyance roller correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 3rd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown to FIG. 3, FIG. 4 and FIG. 6, the laminated electronic component manufacturing apparatus of 3rd Embodiment mainly carries out the release process to the surface (outer peripheral surface), and forms the coating roll 12 (film formation) which forms a ceramic sheet S. FIG. Base material) and the stacking rolls 14 and 15 (laminated support body) which wind up the ceramic sheet S peeled from the coating roll 12, and form the laminated structure S 'of the ceramic sheet S.

Around the coating roll 12, the film forming means 16 (film forming part) for applying the ceramic slurry which becomes the material of the ceramic sheet S to the surface of the coating roll 12, and the ceramic film to the film forming means 16 The liquid supply means 18 for supplying a slurry, the dry hardening apparatus 20 for dry-solidifying the ceramic slurry on the surface of the coating roll 12, and the outer peripheral surface of the stacking rolls 14 and 15 are wound up (laminated) ) Of the ceramic sheet S on which the electrode circuit forming means 22 (electrode circuit forming portion) for forming the electrode circuit 24 (see FIG. 2) on the ceramic sheet S is formed. Dielectric coating film forming means 38 (dielectric coating film forming portion) for forming dielectric coating film 36 (see Fig. 4) in step portion 34 (see Fig. 3), electrode circuit 24 and dielectric The dry curing apparatus 26 for drying the coating film 36 and the above-mentioned stacking rolls 14 and 15 are arrange | positioned.

In the laminated electronic component manufacturing apparatus of this embodiment, the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S before being wound on the outer circumferential surfaces of the stacking rolls 14 and 15, and then the electrode circuit The ceramic sheet S on which the 24 and the dielectric coating film 36 are formed is wound on the outer circumferential surfaces of the stacking rolls 14 and 15 to form a laminated structure S 'of the ceramic sheet S.

Next, the manufacturing method of the laminated structure S 'of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 is demonstrated.

The coating roll 12 which performed the mold release process is rotated at a predetermined speed, and a ceramic slurry is apply | coated to this outer peripheral surface by the film-forming means 16. FIG. In addition, supply of a ceramic slurry is performed using the gear pump which is a liquid supply means 18. As shown in FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the dry curing apparatus 20. The ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are not printed is wound by the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '.

Next, the electrode material ink is applied to the ceramic sheet S on the coating roll 12 from the electrode circuit forming means 22 (for example, inkjet printing), and the electrode circuit (internal electrode circuit) 24 having a predetermined figure pattern is applied. ). Subsequently, the stepped portion 34 (concave) formed between the electrode circuit 24 by applying ceramic ink (ceramic material) from the dielectric coating film forming means 38 to the ceramic sheet S on which the electrode circuit 24 is formed. A dielectric coating film 36 of a predetermined figure pattern is printed (see Figs. 3 and 4). After printing the electrode circuit 24 and the dielectric coating film 36, the warm air of a predetermined temperature is blown from the dry curing apparatus 26 to dry the electrode circuit 24 and the dielectric coating film 36. Here, each forming process of the electrode circuit 24 and the dielectric coating film 36 is carried out on the outer circumferential surfaces of the stacking rolls 14 and 15, and the electrode circuit 24 and the dielectric coating film 36 for each layer (each circumference). Printing is performed by changing the figure pattern so that)) becomes the counter electrode. In this way, the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S on the coating roll 12.

Subsequently, the dried ceramic sheet S (completely formed electrode circuit and dielectric coating film) formed on the outer circumferential surface of the coating roll 12 is peeled from the outer circumferential surface of the coating roll 12 and transferred onto the outer circumferential surface of the stacking roll 14. Wind up. Here, since the mold release process is given to the outer peripheral surface of the coating roll 12, and the stacking roll 14 is contacting with respect to the coating roll 12 by predetermined pressing force, the drying formed in the outer peripheral surface of the coating roll 12 was carried out. The later ceramic sheet S is easily peeled from the outer circumferential surface of the coating roll 12 and transferred to the outer circumferential surface of the stacking roll 14.

After winding the ceramic sheet S by a predetermined layer with the stacking roll 14, the electrode circuit forming means 22 prints the electrode circuit 24, and the dielectric coating film forming means 38 (for example, inkjet printing). Printing of the dielectric coating film 36 is stopped. Subsequently, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are not printed is wound on the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '. . Then, supply of the ceramic slurry to the coating roll 12 is stopped and the formation of the laminated structure S 'of the ceramic sheet S is complete | finished, or instead of the stacking roll 14 by a changer mechanism (15) is brought into pressure contact with the outer circumferential surface of the coating roll 12 to wind the ceramic sheet S (after forming the electrode circuit 24 and the dielectric coating film 36) on the outer circumferential surface of the coating roll 15. In this way, the laminated structure S 'of the ceramic sheet S is formed.

Moreover, the laminated structure S 'of the ceramic sheet S formed in the stacking roll 14 is isolate | separated with a cylindrical jig, press press is carried out with cylindrical shape, and it cuts to chip shape by dicer cutting. Thereafter, firing, an electrode circuit (external electrode circuit) is formed, and a multilayer ceramic capacitor is manufactured through a normal manufacturing process.

According to 3rd Embodiment, especially conveyance members, such as a conveyance roller, are not needed at all, and it can aim at miniaturization of facilities. As a result, the manufacturing cost of an electronic component can be reduced. In addition, since the movement distance of the ceramic sheet S from the formation of the ceramic sheet S until the winding of the stacking roll 14 becomes short, the structure S 'of the ceramic sheet S can be manufactured in a short time. Furthermore, the manufacturing speed (manufacturing efficiency) of an electronic component can be raised.

In addition, in 3rd Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the third embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the third embodiment corresponds to the "dielectric coating film forming part" of the present invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 4th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 3, FIG. 4, and FIG. 7, the intermediate | middle conveyance roller (conveyance member) 50 is contacting through the ceramic sheet | seat S with the coating roll 12 of 4th Embodiment. Moreover, the printing conveyance roller (conveying member) 52 in which the dielectric coating film 36 is formed in the ceramic sheet S on the outer peripheral surface is in contact with the intermediate conveyance roller 50 via the ceramic sheet S. As shown in FIG. The intermediate conveying roller (conveying member) 54 is in contact with the printing conveying roller 52 via the ceramic sheet S. FIG. The printing conveyance roller (conveying member) 56 in which the electrode circuit 24 is formed in the ceramic sheet S on the outer peripheral surface is in contact with the intermediate conveyance roller 54 via the ceramic sheet S. As shown in FIG. The intermediate conveying roller (conveying member) 58 is in contact with the printing conveying roller (conveying member) 56 via the ceramic sheet S. FIG. The stacking roll 14 is in contact with the intermediate transfer roller 58 via the ceramic sheet S. FIG. Two press rolls 46 and 48 are in contact with the stacking roll 14 through the ceramic sheet S. FIG. Thus, between the coating roll 12 and each stacking roll 14, the intermediate conveying roller 50, the printing conveying roller 52, the intermediate conveying roller 54, the printing conveying roller (conveying member) 56, and the intermediate | middle The conveyance roller 58 is interposed. For this reason, the coating roll 12 and each stacking roll 14 are in the state which contacted indirectly (the state which enables mechanical power transmission).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. And the intermediate conveyance roller 50 is arrange | positioned. Further, the dielectric coating film forming means 38 for forming the dielectric coating film 36 on the ceramic sheet S before being wound (laminated) on the outer circumferential surface of the stacking roll 14 around the printing conveying roller 52. (Dielectric coating film forming part), 26 A of dry hardening apparatuses for drying the dielectric coating film 36, and the said intermediate conveyance roller 50 and the intermediate conveyance roller 54 are arrange | positioned. Moreover, the electrode circuit forming means 22 (electrode) for forming the electrode circuit 24 in the ceramic sheet S before being wound on the outer peripheral surface of the stacking roll 14 around the printing conveyance roller (conveying member) 56. Circuit formation part), the dry hardening apparatus 26B for drying the electrode circuit 24, and the said intermediate | middle conveyance roller 54 and the intermediate | middle conveyance roller 58 are arrange | positioned.

In 4th Embodiment, a ceramic slurry is supplied to the outer peripheral surface of the coating roll 12 by the film-forming means 16 and the liquid supply means 18. As shown in FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. In this way, the ceramic sheet S is formed. The ceramic sheet S on the coating roll 12 moves to the printing conveying roller 52 via the intermediate conveying roller 50. The dielectric coating film 36 of a predetermined pattern is formed (printed) by the dielectric coating film forming means 38 (dielectric coating film forming part) with respect to the ceramic sheet S on the printing conveyance roller 52. In addition, the site | part in which the dielectric coating film 36 is formed is position-controlled so that it may become the step part 34 generate | occur | produced between the electrode circuits 24 formed in a later process. This dielectric coating film 36 is dried by the dry curing device 26A on the print conveying roller 52. In this way, the ceramic sheet S on which the dielectric coating film 36 is formed moves to the printing conveying roller (conveying member) 56 via the intermediate conveying roller 54. The electrode circuit 24 of a predetermined pattern is formed (printed) by the electrode circuit forming means 22 (electrode circuit forming portion) with respect to the ceramic sheet S on the print conveying roller (conveying member) 56. This electrode circuit 24 is dried by the dry curing apparatus 26B on the printing conveyance roller (conveying member) 56. Thereafter, the ceramic sheet S on which the electrode circuit (inner electrode circuit) 24 and the dielectric coating film 36 are formed is received by the intermediate conveying roller 58 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. In this manner, also in the fourth embodiment, after the dielectric coating film 36 and the electrode circuit 24 are formed on the ceramic sheet S, the ceramic sheet S on which the dielectric coating film and the electrode circuit formation are completed is stacked. ) Is wound and laminated on the outer circumferential surface.

According to the fourth embodiment, the dielectric coating film 36 and the electrode circuit 24 are formed at each conveying roller. For this reason, since the electrode circuit 24 is formed after the dielectric coating film 36 is reliably dried and solidified, both the inks concerned when the dielectric coating film 36 and the electrode circuit 24 are simultaneously formed are mixed. This can solve the problem. As a result, since the quality of the dielectric coating film 36 and the electrode circuit 24 can be kept favorable, the quality defect of the electronic component manufactured can be prevented.

In addition, since the dielectric coating film 36 and the electrode circuit 24 are formed at the respective conveying rollers, time for drying the dielectric coating film 36 and time for drying the electrode circuit 24 can be ensured. . Thereby, since the dielectric coating film 36 and the electrode circuit 24 can be reliably dried, the manufacturing speed of the laminated structure S 'of the ceramic sheet S can be raised.

In the present embodiment, the dielectric coating film 36 is formed before the electrode circuit 24, but the electrode circuit 24 may be formed before the dielectric coating film 36. That is, the electrode circuit 24 is formed with respect to the ceramic sheet S on the printing conveyance roller 52, the electrode circuit 24 is reliably dried and solidified, and then on the printing conveyance roller (transport member) 56 is formed. The dielectric coating film 36 may be formed for the ceramic sheet S. FIG.

In addition, in 4th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the fourth embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the fourth embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 50, the print conveyance roller 52, the intermediate conveyance roller 54, the print conveyance roller (conveyance member) 56, and the intermediate conveyance roller 58 of 4th Embodiment are the " Conveying member ”.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 5th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 3, FIG. 4, and FIG. 8, the intermediate | middle conveyance roller (conveyance member) 60 is contacting through the ceramic sheet S to the coating roll 12 of 5th Embodiment. In addition, the printing conveyance roller (conveying member) 62 is in contact with the intermediate conveyance roller 60 via the ceramic sheet S. FIG. The intermediate conveying roller (conveying member) 64 is in contact with the printing conveying roller 62 via the ceramic sheet S. FIG. The intermediate conveyance roller 64 conveys the laminated structure S 'of the ceramic sheet S to the flat laminated stage 66. In the stacking stage 66, a stack structure S ′ of the ceramic sheet S is stacked. In addition, the lamination stage 66 is not limited to the thing of flat form, The thing of cylindrical shape (roll shape) may be sufficient. Thus, the intermediate conveyance roller 60, the printing conveyance roller 62, and the intermediate conveyance roller 64 are interposed between the coating roll 12 and the lamination stage 66. As shown in FIG.

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. A dielectric coating film forming means 38 (dielectric coating film forming portion) for forming the dielectric coating film 36 on the ceramic sheet S before being conveyed on the lamination stage 66, and the dielectric coating film 36. ), The drying curing apparatus 26A and the intermediate conveyance roller 60 are arranged. Moreover, around the printing conveyance roller 62, the electrode circuit forming means 22 (electrode circuit forming part) for forming the electrode circuit 24 in the ceramic sheet S before conveying on the lamination stage 66, and The dry curing device 26B for drying the electrode circuit 24 and the intermediate transfer roller 64 are arranged.

In addition, in this embodiment, the dielectric coating film 36 was formed in the ceramic sheet S on the coating roll 12, and the example which formed the electrode circuit 24 in the ceramic sheet S on the printing conveyance roller 62 was carried out. Although the electrode circuit 24 is first formed in the ceramic sheet S on the coating roll 12 after that, the dielectric coating film 36 is formed in the ceramic sheet S on the printing conveyance roller 62 after that. The configuration may be.

In 5th Embodiment, a ceramic slurry is conveyed by the film-forming means 16 and the liquid supply means 18 to the outer peripheral surface of the coating roll 12. FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. Then, the dielectric coating film 36 having a predetermined pattern is formed (printed) on the ceramic sheet S on the coating roll 12 by the dielectric coating film forming means 38 (dielectric coating film forming portion). In addition, the site | part in which the dielectric coating film 36 is formed is position-controlled so that it may become the step part 34 generate | occur | produced between the electrode circuits 24 formed in a later process. This dielectric coating film 36 is dried by a dry curing device 26A on the coating roll 12. In this way, the ceramic sheet S on which the dielectric coating film 36 is formed moves to the printing conveying roller 62 via the intermediate conveying roller 60. The electrode circuit 24 of a predetermined pattern is formed (printed) by the electrode circuit forming means 22 (electrode circuit forming part) with respect to the ceramic sheet S on the printing conveyance roller 62. This electrode circuit 24 is dried by the dry curing device 26B on the print conveying roller 62. Thereafter, the ceramic sheet S on which the electrode circuit (internal electrode circuit) 24 and the dielectric coating film 36 are formed is received by the intermediate conveying roller 64 and conveyed to the lamination stage 66 to form the lamination stage 66. Stacked on. Thereby, the laminated structure S 'of the ceramic sheet S is formed. Thus, also in the fifth embodiment, after the dielectric coating film 36 and the electrode circuit 24 are formed in the ceramic sheet S, the ceramic sheet S on which the dielectric coating film and the electrode circuit formation are completed is laminated stage 6 Stacked). In particular, in the fifth embodiment, the ceramic sheet S is laminated on the flat lamination stage 66 to form the laminated structure S '.

In addition, in 5th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the lamination stage 66 corresponds to the "lamination support body" of this invention. In addition, the electrode circuit forming means 22 of the fifth embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the fifth embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 60, the printing conveyance roller 62, and the intermediate conveyance roller 64 of 5th Embodiment correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 6th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown to FIG. 3, FIG. 4 and FIG. 9, the intermediate | middle conveyance roller (conveyance member) 68 is contacting through the ceramic sheet S to the coating roll 12 of 6th Embodiment. Further, a print conveying roller (conveying member) 70 in which the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S on the outer circumferential surface of the intermediate conveying roller 68 through the ceramic sheet S. I'm in contact. The intermediate conveying roller (conveying member) 72 is in contact with the printing conveying roller 70 via the ceramic sheet S. FIG. The stacking roll 14 is in contact with the intermediate transfer roller 72 via the ceramic sheet S. As shown in FIG. Two press rolls 46 and 48 are in contact with the stacking roll 14 through the ceramic sheet S. FIG. Thus, the intermediate conveyance roller 68, the printing conveyance roller 70, and the intermediate conveyance roller 72 are interposed between the coating roll 12 and each stacking roll 14. As shown in FIG. For this reason, the coating roll 12 and each stacking roll 14 are in the state which contacted indirectly (the state which enables mechanical power transmission).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. And the intermediate conveyance roller 68 is arrange | positioned. Moreover, the electrode circuit forming means 22 (electrode) for forming the electrode circuit 24 in the ceramic sheet S before winding (laminating) on the outer peripheral surface of the stacking roll 14 around the printing conveyance roller 70 A circuit forming portion), dielectric coating film forming means 38 (dielectric coating film forming portion) for forming the dielectric coating film 36 on the ceramic sheet S before being wound on the outer circumferential surface of the stacking roll 14; The dry hardening apparatus 26 for drying the electrode circuit 24 and the dielectric coating film 36, the said intermediate | middle conveyance roller 68, and the intermediate | middle conveyance roller 72 are arrange | positioned.

Here, the gravure offset printing method is adopted for the electrode circuit forming means 22. That is, the electrode circuit forming means 22 of the gravure offset printing method has a pattern forming roll (gravure roll) engraved with a groove (a groove filled with a conductive paste) corresponding to the pattern of the conductive paste film to be the electrode circuit 24 on the outer circumferential surface thereof. 22A and the transfer roll (offset roll) 22B with which the pattern formed in 22 A of pattern formation rolls is transferred. The pattern of the electrode circuit 24 transferred on the transfer roll 22B is transferred to the print conveying roller 70 so that the electrode circuit 24 of a predetermined pattern is formed on the ceramic sheet S on the print conveying roller 70. .

According to the sixth embodiment, the ceramic slurry is supplied to the outer circumferential surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. The ceramic sheet S on the coating roll 12 moves to the printing conveying roller 70 via the intermediate conveying roller 68. The electrode circuit 24 of a predetermined pattern is transferred and formed from the transfer roll 22B with respect to the ceramic sheet S on the printing conveyance roller 70. Thereafter, a dielectric coating film 36 having a predetermined pattern is formed on the stepped portion 34 of the ceramic sheet S on which the electrode circuit (internal electrode circuit) 24 is formed. The electrode circuit 24 and the dielectric coating film 36 are dried and solidified by the dry curing device 26. Thereafter, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is wound and laminated on the outer circumferential surface of the stacking roll 14 via the intermediate transfer roller 72. Thereby, the laminated structure S 'of the ceramic sheet S is formed. As described above, in the sixth embodiment, after the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit and the dielectric coating film are formed is stacked. ) Is wound and laminated on the outer circumferential surface.

In addition, in 6th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the sixth embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the sixth embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 68, the printing conveyance roller 70, and the intermediate conveyance roller 72 of 6th Embodiment respond | correspond to the "conveyance member" of this invention.

Next, the laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 7th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown to FIG. 3, FIG. 4 and FIG. 10, the intermediate | middle conveyance roller (conveyance member) 74 is contacting through the ceramic sheet | seat S with the coating roll 12 of 7th Embodiment. Moreover, the printing conveyance roller (conveying member) 76 in which the electrode circuit 24 is formed in the ceramic sheet S on the outer peripheral surface is in contact with the intermediate conveyance roller 74 via the ceramic sheet S. FIG. In the printing conveyance roller 76, the electrode circuit forming means 22 (electrode circuit formation part) for forming the electrode circuit 24 in the ceramic sheet S, and the intermediate conveyance roller (conveying member) 78 are a ceramic sheet | seat. Contact is made via (S). The stacking roll 14 is in contact with the intermediate transfer roller 78 via the ceramic sheet S. FIG. The stacking roll 14 is in contact with the dielectric coating film forming means 38 (dielectric coating film forming portion) for forming the dielectric coating film 36 and the press roll 46 through the ceramic sheet S. FIG. Thus, the intermediate conveyance roller 74, the printing conveyance roller 76, and the intermediate conveyance roller 78 are interposed between the coating roll 12 and each stacking roll 14. As shown in FIG. For this reason, the coating roll 12 and each stacking roll 14 are in the state which contacted indirectly (the state which enables mechanical power transmission).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. And the intermediate conveyance roller 74 is arrange | positioned. Moreover, the electrode circuit forming means 22 (electrode) for forming the electrode circuit 24 in the ceramic sheet S before winding (laminating) on the outer peripheral surface of the stacking roll 14 around the printing conveyance roller 76 Circuit formation part), the said intermediate | middle conveyance roller 74, and the intermediate | middle conveyance roller 78 are arrange | positioned. In addition, the dielectric coating film forming means 38 (dielectric coating film) for forming the dielectric coating film 36 in the step 34 of the ceramic sheet S on the stacking roll 14 around the stacking roll 14. Formation part), the said intermediate | middle conveyance roller 78, and the press roll 46 are arrange | positioned.

Here, the gravure offset printing method is adopted for the electrode circuit forming means 22. That is, the electrode circuit forming means 22 of the gravure offset printing method has a pattern forming roll (gravure roll) engraved with a groove (a groove filled with a conductive paste) corresponding to the pattern of the conductive paste film to be the electrode circuit 24 on the outer circumferential surface thereof. 22A and the transfer roll (offset roll) 22B with which the pattern formed in 22 A of pattern formation rolls is transferred. The pattern of the electrode circuit 24 transferred on the transfer roll 22B is transferred to the print conveying roller 76 so that the electrode circuit 24 of a predetermined pattern is formed on the ceramic sheet S on the print conveying roller 76. . Moreover, around the transfer roll 22B, the dry hardening apparatus 26B for drying the electrode circuit 24 transferred on the transfer roll 22B is arrange | positioned. For this reason, the electrode circuit 24 transferred onto the transfer roll 22B is dried and solidified by the dry curing device 26B.

Here, the gravure offset printing method is adopted for the dielectric coating film forming means 38. That is, the gravure offset printing type dielectric coating film forming means 38 has a pattern forming roll (gravure) in which a groove (a groove filled with a conductive paste) corresponding to the pattern of the conductive paste film to be the dielectric coating film 36 is formed on the outer circumferential surface thereof. Roll) 38A and a transfer roll (offset roll) 38B to which the pattern formed on the pattern forming roll 38A is transferred. The pattern of the dielectric coating film 36 transferred onto the transfer roll 38B is transferred to the ceramic sheet S on the stacking roll 14 to the step 34 of the ceramic sheet S on the stacking roll 14. A dielectric coating film 36 of a predetermined pattern is formed. In addition, around the transfer roll 38B, a dry curing apparatus 26A for drying the dielectric coating film 36 transferred onto the transfer roll 38B is disposed. For this reason, the dielectric coating film 36 transferred onto the transfer roll 38B is dried and solidified by the dry curing device 26A. In this way, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. As described above, in the seventh embodiment, after the electrode circuit 24 and the dielectric coating film 36 are formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit and the dielectric coating film are formed is stacked. ) Is wound and laminated on the outer circumferential surface.

In addition, in 7th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the seventh embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the seventh embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 74, the printing conveyance roller 76, and the intermediate conveyance roller 78 of 7th Embodiment respond | correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 8th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 3, FIG. 4, and FIG. 11, the laminated electronic component manufacturing apparatus of 8th Embodiment improved the one part based on the structure of 7th Embodiment, and the dielectric coating film forming means 38 is It is arrange | positioned around the printing conveyance roller 76. FIG. That is, the gravure offset printing type dielectric coating film forming means 38 has a pattern forming roll (gravure) in which a groove (a groove filled with a conductive paste) corresponding to the pattern of the conductive paste film to be the dielectric coating film 36 is formed on the outer circumferential surface thereof. Roll) 38A and a transfer roll (offset roll) 38B to which the pattern formed on the pattern forming roll 38A is transferred. The pattern of the dielectric coating film 36 transferred from the pattern forming roll 38A onto the transfer roll 38B is transferred to the ceramic sheet S on the print conveying roller 76 to form a ceramic sheet on the print conveying roller 76 ( The dielectric coating film 36 of a predetermined pattern is formed in the step portion 34 of S). In addition, a dry curing device 26A for drying the dielectric coating film 36 transferred onto the transfer roll 38B is disposed around the transfer roll 38B. For this reason, the dielectric coating film 36 transferred onto the transfer roll 38B is dried and solidified by the dry curing device 26A. In this way, the electrode circuit 24 and the dielectric coating film 36 are formed in the ceramic sheet S on the printing conveyance roller 76. The ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is wound and laminated on the outer circumferential surface of the stacking roll 14 via the intermediate transfer roller 78. Thereby, the laminated structure S 'of the ceramic sheet S is formed. As described above, in the eighth embodiment, after the electrode circuit 24 and the dielectric coating film 36 are formed in the ceramic sheet S, the ceramic sheet S on which the electrode circuit and the dielectric coating film are formed is stacked. ) Is wound and laminated on the outer circumferential surface.

In addition, in 8th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the electrode circuit forming means 22 of the eighth embodiment corresponds to the "electrode circuit forming portion" of the present invention. The dielectric coating film forming means 38 of the eighth embodiment corresponds to the "dielectric coating film forming part" of the present invention. In addition, the intermediate conveyance roller 74, the printing conveyance roller 76, and the intermediate conveyance roller 78 of 8th Embodiment correspond to the "conveyance member" of this invention.

In the present invention, it is preferable that printing of the electrode circuit 24 and the dielectric coating film 36 is performed at any one of the coating roll 12, each conveying roller constituting the conveying member, and the endless conveying belt. In particular, the printing place is not limited. In addition, the printing place of the electrode circuit 24 and the printing place of the dielectric coating film 36 may be the same place, and each place may be sufficient as it. The electrode circuit 24 and the dielectric coating film 38 printed by the inkjet method may be dried and then transferred to the ceramic sheet S. FIG.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 9th Embodiment of this invention are demonstrated with reference to drawings. In addition, since 9th Embodiment is positioned as a modification of 3rd Embodiment, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 3rd Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the ninth embodiment, the electrode circuit 24, the dielectric coating film 36, the ceramic sheet S, and the stacked structure S 'of the ceramic sheet are formed in this order. That is, as shown in FIG. 12, the electrode circuit 24 is formed by the electrode circuit formation means 22 about the coating roll 12 of the continuous continuous shape in which the mold release process was performed to the outer periphery first. Subsequently, the dielectric coating film 36 is formed on the coating roll 12 by the dielectric coating film forming means 38. The dielectric coating film 36 is formed in the stepped portion 34 of the electrode circuit 24. Subsequently, a ceramic slurry is applied by the film forming means 16 to the coating roll 12 so as to cover the electrode circuit 24 and the dielectric coating film 36, which are dried to form an electrode circuit and the dielectric coating film. (S) is formed. In addition, the ceramic sheet S on which the electrode circuit and the dielectric coating film are formed is wound on the outer circumferential surface of the stacking roll 14 to form a laminated structure S 'of the ceramic sheet.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 10th Embodiment of this invention are demonstrated with reference to drawings. In addition, since 10th Embodiment is positioned as a modification of 5th Embodiment, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 5th Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the tenth embodiment, the electrode circuit 24, the ceramic sheet S, the dielectric coating film 36, and the stacked structure S 'of the ceramic sheet are formed in this order. That is, as shown in FIG. 13, the electrode circuit 24 is formed by the electrode circuit formation means 22 about the coating roll 12 of the continuous continuous shape in which the mold release process was performed to the outer periphery first. Subsequently, a ceramic slurry is applied to the coating roll 12 by the film forming means so as to cover the electrode circuit 24, and it is dried to form a ceramic sheet S on which the electrode circuit is formed. The dielectric coating film (not shown in FIG. 13) is formed by the dielectric coating film forming means 38 with respect to the step portion 34 on the ceramic sheet formed by the formation of the electrode circuit 24. And the laminated structure S 'of a ceramic sheet | seat is formed on the lamination stage 66. FIG.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 11th Embodiment of this invention are demonstrated with reference to drawings. In addition, since 11th Embodiment is positioned as a modification of 5th Embodiment, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 5th Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the eleventh embodiment, the dielectric coating film 36, the ceramic sheet S, the electrode circuit 24, and the stacked structure S 'of the ceramic sheet are formed in this order. That is, as shown in FIG. 14, the dielectric coating film 36 is first formed by the dielectric coating film forming means 38 with respect to the endless continuous coating roll 12 to which the mold release process was performed to the outer periphery. Subsequently, a ceramic slurry is applied to the coating roll 12 by the film forming means 16 so as to cover the dielectric coating film 36, which is dried to form a ceramic sheet S on which the dielectric coating film is formed. In addition, the electrode circuit (not shown in FIG. 14) is formed by the electrode circuit forming means 22 at a location different from the dielectric coating film 36 on the ceramic sheet S. As shown in FIG. And the laminated structure S 'of a ceramic sheet | seat is formed on the lamination stage 66. FIG.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 12th Embodiment of this invention are demonstrated with reference to drawings. In addition, since 12th Embodiment is positioned as a modification of 10th Embodiment, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 10th Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the twelfth embodiment, the electrode circuit 24, the ceramic sheet S, the laminated structure S 'of the ceramic sheet, and the dielectric coating film 36 are formed in this order. That is, as shown in FIG. 15, the electrode circuit 24 is formed by the electrode circuit formation means 22 about the coating roll 12 of the continuous continuous shape in which the mold release process was performed to the outer periphery first. Subsequently, a ceramic slurry is applied to the coating roll 12 by the film forming means so as to cover the electrode circuit 24, and it is dried to form a ceramic sheet S on which the electrode circuit is formed. And this ceramic sheet S is wound around the outer periphery of the stacking roll 14, and the laminated structure S 'of a ceramic sheet is formed. Then, the dielectric coating film (not shown in FIG. 15) by the dielectric coating film forming means 38 with respect to the step 34 on the laminated structure S 'of the ceramic sheet wound around the stacking roll 14. Is formed.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 13th Embodiment of this invention are demonstrated with reference to drawings. In addition, since 13th Embodiment is positioned as a modification of 11th Embodiment, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 11th Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the thirteenth embodiment, the dielectric coating film 36, the ceramic sheet S, the laminated structure S 'of the ceramic sheet, and the electrode circuit 24 are formed in this order. That is, as shown in FIG. 16, the dielectric coating film 36 is first formed by the dielectric coating film forming means 38 with respect to the endless continuous coating roll 12 to which the mold release process was performed to the outer periphery. Subsequently, a ceramic slurry is applied to the coating roll 12 by the film forming means 16 so as to cover the dielectric coating film 36, which is dried to form a ceramic sheet S on which the dielectric coating film is formed. And this ceramic sheet S is wound around the outer periphery of the stacking roll 14, and the laminated structure S 'of a ceramic sheet is formed. Thereafter, the electrode circuit (not shown in FIG. 16) is formed by the electrode circuit forming means 22 at a location different from the dielectric coating film 36 on the laminated structure S 'of the ceramic sheet.

10: laminated electronic component manufacturing apparatus 12: coating roll (film formation base material)
14 stacking roll (laminated support) 15 stacking roll (laminated support)
16: film forming means (film forming part)
22: electrode circuit forming means (electrode circuit forming unit)
24: electrode circuit 30: intermediate conveying roller (conveying member)
32: printing conveying roller (conveying member) 34: stepped portion
36: dielectric coating film
38: dielectric coating film forming means (dielectric coating film forming section)
40: endless conveying belt (conveying member) 42: intermediate conveying roller (conveying member)
44: intermediate conveying roller (conveying member) 50: intermediate conveying roller (conveying member)
52: Printing conveying roller (conveying member) 54: Intermediate conveying roller (conveying member)
56: printing conveying roller (conveying member) 58: intermediate conveying roller (conveying member)
60: intermediate conveying roller (conveying member) 62: printing conveying roller (conveying member)
64: intermediate conveying roller (conveying member) 66: lamination stage (lamination support)
68: intermediate conveying roller (conveying member) 70: printing conveying roller (conveying member)
72: intermediate conveying roller (conveying member) 74: intermediate conveying roller (conveying member)
76: printing conveying roller (conveying member) 78: intermediate conveying roller (conveying member)
S: ceramic sheet S ': laminated structure of ceramic sheet

Claims (21)

An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
A film forming part for coating and drying a ceramic slurry on the film forming substrate to form a ceramic sheet;
An electrode circuit forming unit forming an electrode circuit on the ceramic sheet;
A dielectric coating film forming portion for forming a dielectric coating film on the stepped portion on the ceramic sheet caused by the formation of the electrode circuit; And
The laminated electronic component manufacturing apparatus characterized by having the laminated support body which forms the laminated structure of the said ceramic sheet | seat. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming unit forming an electrode circuit on the film forming substrate;
A dielectric coating film forming unit for forming a dielectric coating film on the film forming substrate;
A film forming part to form a ceramic sheet on which the electrode circuit and the dielectric coating film are formed by coating and drying a ceramic slurry on the film forming substrate to cover the electrode circuit and the dielectric coating film; And
The laminated electronic component manufacturing apparatus characterized by having the laminated support body which forms the laminated structure of the said ceramic sheet | seat. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming unit forming an electrode circuit on the film forming substrate;
A film forming part to form a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry on the film forming substrate to cover the electrode circuit;
A dielectric coating film forming portion for forming a dielectric coating film on the stepped portion on the ceramic sheet caused by the formation of the electrode circuit; And
The laminated electronic component manufacturing apparatus characterized by having the laminated support body which forms the laminated structure of the said ceramic sheet | seat. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
A dielectric coating film forming unit for forming a dielectric coating film on the film forming substrate;
A film forming part to form a ceramic sheet on which the dielectric coating film is formed by coating and drying a ceramic slurry on the film forming substrate to cover the dielectric coating film;
An electrode circuit forming portion for forming an electrode circuit on the ceramic sheet at a location different from the dielectric coating film on the ceramic sheet; And
The laminated electronic component manufacturing apparatus characterized by having the laminated support body which forms the laminated structure of the said ceramic sheet | seat. The method according to any one of claims 1 to 4,
When the laminated structure of the ceramic sheet is formed by the laminated support,
The new ceramic sheet is continuously formed on the film forming substrate, characterized in that the laminated electronic component manufacturing apparatus. The method according to claim 1 or 2,
The laminated support is in contact with the film forming substrate through the ceramic sheet to peel the ceramic sheet from the film forming substrate and wound around the outer periphery to form a laminated structure of the ceramic sheet. The method according to any one of claims 1, 3 or 4,
It is provided so that it may be interposed between the said film-forming base material and the said laminated support body,
And a conveying member for receiving the ceramic sheet formed on the film forming substrate from the film forming substrate and conveying the received ceramic sheet to the laminated support. The method of claim 1,
The electrode circuit forming portion forms the electrode circuit in the ceramic sheet on the conveying member;
The dielectric coating film forming portion forms the dielectric coating film on the stepped portion of the ceramic sheet on the transfer member. The method according to any one of claims 1 to 4,
And said electrode circuit forming portion and said dielectric coating film forming portion are plateless printing apparatuses. The method of claim 9,
The plateless printing apparatus is an inkjet printing apparatus, characterized in that the laminated electronic component manufacturing apparatus. A film-forming step of continuously forming a ceramic sheet by applying and drying a ceramic slurry by a film-forming forming unit to an endless continuous film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming step of forming an electrode circuit in the ceramic sheet by an electrode circuit forming portion;
A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion in a step portion on the ceramic sheet caused by the formation of the electrode circuit; And
It has a laminated structure formation process which forms the laminated structure of the said ceramic sheet, The manufacturing method of the laminated electronic component characterized by the above-mentioned. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film-forming substrate on which an releasing treatment is performed on an outer circumference;
A dielectric coating film forming step of forming a dielectric coating film on the film forming substrate by a dielectric coating film forming portion;
A film-forming step of forming a ceramic sheet on which the electrode circuit and the dielectric-coated film are formed by applying and drying a ceramic slurry to the film-forming base material by a film forming part to cover the electrode circuit and the dielectric coating film; And
It has a laminated structure formation process which forms the laminated structure of the said ceramic sheet, The manufacturing method of the laminated electronic component characterized by the above-mentioned. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film-forming substrate on which an releasing treatment is performed on an outer circumference;
A film-forming step of forming a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to the film-forming base material by a film-forming forming part so as to cover the electrode circuit;
A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion with respect to the stepped portion on the ceramic sheet caused by the formation of the electrode circuit; And
It has a laminated structure formation process which forms the laminated structure of the said ceramic sheet, The manufacturing method of the laminated electronic component characterized by the above-mentioned. A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on an endless continuous film forming substrate subjected to a release treatment on an outer circumference;
A film forming step of forming a ceramic sheet on which the dielectric coating film is formed by applying and drying a ceramic slurry on the film forming substrate by a film forming portion to cover the dielectric coating film;
An electrode circuit forming step of forming an electrode circuit on the ceramic sheet at a portion different from the dielectric coating film on the ceramic sheet by an electrode circuit forming portion; And
It has a laminated structure formation process which forms the laminated structure of the said ceramic sheet, The manufacturing method of the laminated electronic component characterized by the above-mentioned. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to an endless continuous film-forming substrate on which an releasing treatment is performed on an outer circumference;
A film-forming step of forming a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to the film-forming base material by a film-forming forming part so as to cover the electrode circuit;
A laminated structure forming step of forming a laminated structure of the ceramic sheet; And
And a dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion with respect to the stepped portion on the laminated structure of the ceramic sheet caused by the formation of the electrode circuit. A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on an endless continuous film forming substrate subjected to a release treatment on an outer circumference;
A film forming step of forming a ceramic sheet on which the dielectric coating film is formed by applying and drying a ceramic slurry on the film forming substrate by a film forming portion to cover the dielectric coating film;
A laminated structure forming step of forming a laminated structure of the ceramic sheet; And
And an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion on a layered structure of the ceramic sheet at a location different from the dielectric coating film on the layered structure of the ceramic sheet. Manufacturing method. 17. The method according to any one of claims 11 to 16,
When the laminated structure of the ceramic sheet is formed by the laminated support in the laminated structure forming step,
In the film forming step, a new ceramic sheet is continuously formed on the film forming substrate. The method according to claim 11 or 12,
In the laminated structure forming step, the ceramic support sheet is peeled from the film forming substrate by contacting the laminated support with the film forming substrate through the ceramic sheet, and the wound ceramic sheet is wound around the laminated support. A method for manufacturing a laminated electronic component, comprising forming a laminated structure of a ceramic sheet. The method according to any one of claims 11, 13, 14, 15 or 16,
It has a conveyance member provided so that it may be interposed between the said film-forming base material and the said laminated support body;
The said conveyance member has a conveyance process which receives the said ceramic sheet formed in the said film-forming base material from the said film-forming base material, and conveys this received ceramic sheet to the said laminated support body, The manufacturing method of the laminated electronic component characterized by the above-mentioned. 17. The method according to any one of claims 11 to 16,
In the electrode circuit forming step and the dielectric coating film forming step, a plateless printing apparatus is used as the electrode circuit forming portion and the dielectric coating film forming portion, and the electrode circuit and the dielectric coating film are formed by the plateless printing apparatus. The manufacturing method of the laminated electronic component characterized by the above-mentioned. 21. The method of claim 20,
An inkjet printing apparatus is used as the plateless printing apparatus.

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