JP5516996B2 - Multilayer electronic component manufacturing apparatus and multilayer electronic component manufacturing method - Google Patents

Description

  The present invention relates to a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

A general method of manufacturing a multilayer ceramic capacitor is to form a ceramic film on a long film, print an internal electrode on it, cut it to a desired size, peel it off from the film, and stack it. A laminated body block is formed repeatedly, and this is cut into parts.

  On the other hand, in the following Patent Document 1, a laminated body block is formed by laminating a plurality of ceramic green sheets formed on a base material, and the formed laminated body block is cut in parts. A method of manufacturing a multilayer ceramic electronic component, wherein at least two of the plurality of ceramic green sheets constituting the same multilayer block are formed in a predetermined region on the same substrate, And the manufacturing method of the multilayer ceramic electronic component which laminates | stacks by making the direction of the in-plane direction of each ceramic green sheet and the position of each ceramic green sheet substantially correspond is disclosed.

  In the following Patent Document 2, the first flexible support is run endlessly, a ceramic paint is applied on one surface of the second flexible support, and the resulting undried ceramic paint layer is Transfer to the first flexible support, peel off the second flexible support from the ceramic paint layer after transfer, and onto the surface of the ceramic paint layer transferred onto the first flexible support A technique is disclosed in which an electrode is printed, the electrode is dried, and such a process is repeated on a first flexible support.

  Patent Document 3 listed below discloses a multilayer body for a multilayer electronic component comprising a self-supporting green sheet containing a ceramic and an organic binder component and having a predetermined pattern for forming an internal electrode layer thereon. There is disclosed a technology for manufacturing a device by winding a self-supporting green sheet on which a predetermined pattern is formed in advance on a columnar roll.

  Patent Document 4 listed below includes an unwinding supply unit that supplies a green sheet, a lamination drum that forms a laminate by winding the green sheet around an outer peripheral surface, a rotation angle detection device that detects a rotation angle of the lamination drum, and a rotation Based on the information of the angle detection device, a technique is disclosed in which a laminate can be manufactured at a high speed by including an internal electrode printing unit that forms an internal electrode on a green sheet wound around a lamination drum while winding the green sheet. .

  In Patent Document 5 below, while an endless belt wound around a polygonal column-shaped wheel is circulated, formation of a ceramic green sheet by a coating roller and formation of an internal electrode by a transfer device are repeated on the endless belt in a predetermined order. Then, during the circulation of the endless belt, a certain region of the endless belt is set to contact the flat portion of the polygonal columnar wheel, and the target ceramic laminate has a size within the range of the region contacting the flat portion. A method for manufacturing a ceramic laminate is disclosed in which a body is punched out and picked up by a suction head.

  Here, as a laminated body formation method in the production process of a multilayer ceramic capacitor, generally, a ceramic coating film is applied and formed on a long film, an internal electrode is printed on it, and this is cut from the film. The means of peeling and stacking is used. In order to reduce the size and capacity of multilayer capacitors, it is necessary to form a thinner ceramic dielectric layer and increase the number of laminated layers, which can cause short circuits due to the effects of defects on the film. It has been found that the occurrence rate of quality defects increases. Therefore, efforts have been made to make the film smoother, but it is difficult to handle due to the deterioration in handling properties and the increase in film cost.

  As means for solving this problem, a method of forming a ceramic green sheet by repeatedly using a flat plate-like base material has been devised (see Patent Document 1). By using the same base material, defective portions are concentrated on one part of the laminated block, so that even if there are protrusions on the base material, defective chips caused by the influence can be minimized.

Japanese Patent Application Laid-Open No. 2004-296641 JP 2002-141245 A JP 2000-306766 A JP 2003-217992 A Japanese Patent Laid-Open No. 10-32140

  However, in the technique of the above-mentioned Patent Document 1, since it is necessary to intermittently form a green sheet on a flat plate or a cylindrical base material, non-uniform areas of film thickness are generated at the film formation start part and the film end part, and the laminate block Even if the film is formed, a region where desired quality can be obtained is narrow, and a problem in yield is large. Further, even in the process of laminating the ceramic sheets on the flat plate, there is a drawback that the intermittent operation is required one by one and the production speed cannot be increased.

  Moreover, as a means for efficiently laminating ceramic sheets, the technique of Patent Document 2 has been devised. A ceramic is applied on a long film, and this is transferred onto an endless belt to obtain a laminated structure. In this method, it is possible to increase the speed by not performing the intermittent operation. However, since a long base material is used, the effect of suppressing the quality defect cannot be expected at the defective portion of the ceramic layer due to the base material protrusion.

  The same kind of invention is described in Patent Document 3 described above. In this method, a laminated structure is formed on a cylindrical drum and high-speed lamination is possible by continuous operation. However, the ceramic sheet is limited to a high-strength self-supporting green sheet having no support such as a film. The frequency of defects inherent in this self-supporting green sheet is unknown, but this sheet, which contains a resin with a high degree of polymerization and has increased strength, makes it difficult to degrease in the firing process, and the denseness of the ceramic after firing Therefore, it is difficult to use for mass production because its practicality is low.

  The invention of the above-mentioned Patent Document 4 is one in which a cylindrical or polygonal column is continuously laminated and an electrode circuit is formed by ink jetting. In this case as well, the green sheet needs to have high strength that can be conveyed independently, As a means for forming a laminated structure of thin ceramic layers, which is a problem, it is difficult to put it to practical use.

  As in the above-mentioned Patent Document 5, the method of applying the slurry onto a sheet that has been continuously dried in a wet state causes the solvent of the applied slurry to dissolve the lower sheet, resulting in a short circuit or IR failure (insulation). A sheet defect that causes a resistance failure) is generated. In particular, the sheet thickness of recent multilayer ceramic capacitors is becoming thinner, and coating by this method is not suitable.

  In the case where sheet forming is a separate process, there is a problem in that the production of inventory in this process and the storage and transportation of the sheet are very expensive, which inevitably increases the production period. In addition, since the process is divided, an extra sheet such as a conveyance path and a lamination fraction is required in addition to the sheet length necessary for the lamination block, and material loss occurs. On the other hand, when electrode printing is performed on a sheet after stacking the sheets, the sheet attack that occurs when the sheet is dissolved by an electrode solvent occurs not only on the printed sheet but also on the underlying electrode and sheet. In addition, problems such as short circuit and IR failure occur. This is a cause of poor quality of manufactured electronic components.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a multilayer electronic component capable of suppressing the occurrence of defective quality of an electronic component, increasing the manufacturing efficiency (production speed) of the multilayer electronic component at low cost. It is to provide a manufacturing apparatus and a manufacturing method of a multilayer electronic component.

The present invention provides an endless continuous film-forming substrate having a mold release treatment on the outer peripheral surface , and a film forming method in which a ceramic slurry is applied to the outer peripheral surface of the film-forming substrate and dried to continuously form a ceramic sheet. and forming unit, the said electrode circuit forming section for forming an electrode circuit of the ceramic sheet on the deposition substrate, said electrode circuit in contact through the ceramic sheet against the deposition substrate formed is was continuously peeled off the ceramic sheet from the outer circumferential surface of the formed membrane base, a laminated base material to form a laminated structure of the ceramic sheet and the electrode circuit by winding peeled the ceramic sheet on the outer periphery has, the deposition forming section, especially in that the outer peripheral surface of the deposition substrate ceramic sheet is peeled, a laminated electronic component manufacturing apparatus for applying the ceramic slurry To.

According to the present invention, even if there is a defect factor such as a protrusion on the outer peripheral surface of the film forming substrate , the defective portion of the ceramic sheet caused by the concentration concentrates within a limited range of the laminated structure. The occurrence of defective quality of electronic parts obtained by cutting and dividing this can be kept low.

In addition, since the ceramic sheet is continuously formed on the outer peripheral surface of the film-forming substrate , the stable region of the film thickness becomes wider compared to intermittent coating, and the number of electronic components that can be divided from the obtained laminated structure is increased. Can do.

Since the process of forming the ceramic sheet on the outer peripheral surface of the film forming substrate and the process of forming the laminated structure of the ceramic sheet on the laminated support are executed by continuous operation, the productivity is increased in a shorter time, A laminated structure of ceramic sheets can be formed.

  Moreover, it is not necessary to use a long film base material as in the prior art, and the intermediate material cost can be suppressed.

  As described above, it is possible to increase the manufacturing efficiency (production speed) of the multilayer electronic component by suppressing the occurrence of defective quality of the electronic component, operating at a low cost, and continuously rather than intermittently.

Further, the present invention is an endless continuous form of the film forming substrate to release treatment is applied on the outer peripheral surface, a ceramic slurry is applied to the outer peripheral surface of the deposition substrate, and dried to continuously form a ceramic sheet and the deposition forming section, and the electrode circuit forming section for forming an electrode circuit to the ceramic sheet which is continuous from the deposition forming section, by winding the ceramic sheet in which the electrode circuit is formed on the outer circumference, the ceramic A laminated support that forms a laminated structure of the sheet and the electrode circuit, and is formed on the film-forming substrate, provided in contact with the film-forming substrate and the layered support via the ceramic sheet. has been received the ceramic sheets continuously detached from the outer peripheral surface of the formed membrane base, a conveying member for conveying the ceramic sheet received the said stack support, the And, the film forming forming portion, an outer peripheral surface of the deposition substrate in which the ceramic sheet is peeled off, characterized in that it is a multilayer electronic component manufacturing apparatus for applying the ceramic slurry.

According to the present invention, the ceramic sheet formed on the outer peripheral surface of the film forming substrate is once received by the transport member. Thereafter, the ceramic sheet is conveyed from the conveying member to the laminated support. Thereby, peeling of the ceramic sheet from the outer peripheral surface of the film-forming substrate is not affected by the state on the laminated support side, and stable handling is possible. Specifically, when a laminated structure of ceramic sheets is formed on the laminated support, the size of the laminated support increases, and when an electrode circuit is formed, the portion is uneven. However, direct contact between the film forming substrate and the laminated support can be avoided by interposing a conveying member between the film forming substrate and the laminated support. And according to the state change of a laminated support body, the positional relationship of a laminated support body and a conveyance member, a pressure, etc. can be adjusted suitably. Thereby, it can prevent that the quality of the laminated structure of the ceramic sheet formed in a laminated support body deteriorates by the state change of a laminated support body. In addition, by designing the laminated support so that it does not come into direct contact with the film-forming substrate, a change in the state of the laminated support deteriorates the quality of the ceramic sheet and thus electronic components formed on the outer peripheral surface of the film-forming substrate. Can be prevented.

Moreover, since the path | route which a ceramic sheet moves before it conveys to a lamination | stacking support body can be lengthened, without enlarging a single film-forming base material, the drying time of a ceramic sheet can be taken long. Since the ceramic slurry is continuously applied to the outer peripheral surface of the film forming substrate , the production rate (production efficiency) of the ceramic sheet can be increased, and the production efficiency of the laminated structure of the ceramic sheet, and thus the electronic component, can be increased. Can be increased.

  Furthermore, the electrode circuit is preferably formed on the ceramic sheet before being wound around the laminated support by the electrode circuit forming portion. Thereby, before a ceramic sheet is laminated | stacked on a lamination | stacking support body, an electrode circuit is formed in a ceramic sheet. If an electrode circuit is formed on the ceramic sheet after the ceramic sheet is laminated on the laminated support, the electrode solvent is caused by the electrode circuit formed on the lower ceramic sheet or the ceramic sheet on which the lower electrode circuit is formed. Thus, a sheet attack occurs. If the electrode circuit is formed in the state of a single-layer ceramic sheet as in the present invention, it is possible to minimize the effect of sheet attack only on a single layer, such as a short circuit or an IR failure (insulation resistance failure). Can be reduced.

  In the present invention, it is preferable that the electrode circuit forming unit forms the electrode circuit on the ceramic sheet on the transport member.

  According to this, an electrode circuit is formed in the ceramic sheet on a conveyance member by the electrode circuit formation part. Thereby, since an electrode circuit is formed with respect to the ceramic sheet dried on the film-forming base material, the position accuracy of the formation position of an electrode circuit can be improved further.

Further, an endless continuous form of the film forming substrate release treatment on the outer circumferential surface has been subjected, it said electrode circuit forming section for forming an electrode circuit on the outer peripheral surface of the formed membrane substrate, formed of the electrode circuit is formed A film forming part for continuously forming the ceramic sheet with the electrode circuit by applying a ceramic slurry to the outer peripheral surface of the film substrate and drying; and the ceramic sheet with the electrode circuit with respect to the film forming substrate. The ceramic sheet with the electrode circuit is continuously peeled off from the outer peripheral surface of the film-forming substrate by contacting through, and the ceramic sheet with the electrode circuit is wound around the outer periphery, and the ceramic sheet and the A laminated support for forming a laminated structure of the electrode circuit, and the electrode circuit forming portion has the electrode circuit on an outer peripheral surface of the film-forming substrate from which the ceramic sheet with the electrode circuit is peeled off. Formation Characterized in that it is a that multilayer electronic component manufacturing apparatus.

Further, an endless continuous form of the film forming substrate release treatment on the outer circumferential surface has been subjected, it said electrode circuit forming section for forming an electrode circuit on the outer peripheral surface of the formed membrane substrate, formed of the electrode circuit is formed A ceramic slurry is applied to the outer peripheral surface of the membrane base material and dried to continuously form the ceramic sheet with the electrode circuit, and the ceramic sheet with the electrode circuit is wound around the outer periphery to form the ceramic A laminated support for forming a laminated structure of the sheet and the electrode circuit, and the film forming substrate and the laminated support so as to be in contact with each other via the ceramic sheet with the electrode circuit; receiving said ceramic sheet with the electrode circuit formed on the film substrate by continuously detached from the outer peripheral surface of the formed membrane substrate, wherein said ceramic sheet with the electrode circuit that has received the It includes a conveying member for conveying the layer support, wherein the electrode circuit forming portion, an outer peripheral surface of the deposition substrate ceramic sheets with the electrodes circuit is peeled, stacked to form the electrode circuit It is an electronic component manufacturing apparatus.

  The present invention is characterized in that the electrode circuit forming unit is a plateless printing apparatus that performs electrode printing on the ceramic sheet.

  According to this, an electrode circuit having a different pattern can be formed for each layer of the ceramic sheet. Also, even if the ceramic sheet expands or contracts or the size of the laminated support changes as the ceramic sheet is laminated on the laminated support, the pitch between the electrode circuits is adjusted so that there is no displacement. An electrode circuit can be formed.

  The plateless printing apparatus is preferably composed of an inkjet printing apparatus and an ink drying and curing apparatus.

  In the present invention, the outer peripheral length of the film-forming substrate and the outer peripheral length of the laminated support are the same length, or one of the outer peripheral length of the film-forming substrate and the outer peripheral length of the laminated support is the other. In contrast, it is an integral multiple.

  According to this, the defect part of the ceramic sheet which arises when there exists defect factors, such as a protrusion, on a film-forming base material can be concentrated on the specific area | region of a laminated structure. Specifically, defects generated in the multilayer structure of the ceramic sheet on the multilayer structure are collected on the same circumferential track of the multilayer structure (the same row of the multilayer structure when the ceramic sheet is viewed from the feeding direction). be able to. Furthermore, when the outer peripheral length of the laminated support is an integral multiple of the outer peripheral length of the film-forming substrate, the defects occurring in the laminated structure of the ceramic sheet on the laminated structure are identified with the same coordinates of the laminated structure. (The same row and column of the laminated structure when the ceramic sheet is viewed from the feeding direction).

In the present invention, when the ceramic sheet is wound around the outer periphery of the laminated support body to form a laminated structure of the ceramic sheet and the electrode circuit, the new outer peripheral surface of the film-forming substrate The ceramic sheet is continuously formed.

  Thereby, since the laminated structure of ceramic sheets can be formed not in intermittent operation but in continuous operation, the laminated structure of ceramic sheets can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of ceramic sheets can be increased.

The present invention is a film forming method in which a ceramic slurry is applied to the outer peripheral surface of an endless continuous film forming substrate whose outer peripheral surface has been subjected to a release treatment by a film forming unit and dried to continuously form a ceramic sheet. An electrode circuit forming step of forming an electrode circuit with an electrode circuit forming unit on the ceramic sheet on the film-forming substrate, and an outer peripheral surface of the film-forming substrate via the ceramic sheet. The ceramic sheet on which the electrode circuit is formed is continuously peeled from the outer peripheral surface of the film-forming substrate by contacting the laminated support , and the peeled ceramic sheet is wound around the outer circumference of the laminated support. wherein the ceramic sheet and the laminated structure forming step of forming a laminated structure of the electrode circuit, have a, in the film forming step of forming, the ceramic sheet is peeled off by The outer peripheral surface of the deposition substrate, characterized in that it is a production method of a multilayer electronic device for applying the ceramic slurry.

The present invention is a film forming method in which a ceramic slurry is applied to the outer peripheral surface of an endless continuous film forming substrate whose outer peripheral surface has been subjected to a release treatment by a film forming unit and dried to continuously form a ceramic sheet. and forming step, the outer periphery of the electrode circuit forming step of forming an electrode circuit by the electrode circuit forming portions with respect to the ceramic sheet, stacking support the ceramic sheet in which the electrode circuit is formed continuous from the deposition forming section A laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit, and after the film forming step and before the laminated structure forming step. receiving said ceramic sheet formed on the deposition substrate by continuously detached from the outer peripheral surface of the formed film substrate, the transfer of the ceramic sheet received the Have a, a conveying step of conveying the stacked support by wood, in the film forming step of forming, on the outer peripheral surface of the deposition substrate in which the ceramic sheet is peeled off, the multilayer electronic of applying the ceramic slurry It is the manufacturing method of components.

  In the electrode circuit forming step, the electrode circuit is preferably formed on the ceramic sheet on the transport member.

The present invention includes an electrode circuit forming step of forming an electrode circuit by the electrode circuit forming portion on the outer peripheral surface of the endless continuous shaped deposition substrate release treatment is applied on an outer peripheral surface, the electrode circuit is formed A film forming step of applying a ceramic slurry to the outer peripheral surface of the film forming substrate by a film forming unit and drying to continuously form the ceramic sheet with the electrode circuit; The ceramic sheet with the electrode circuit is continuously peeled off from the outer peripheral surface of the film-forming substrate by contacting the laminated support through the ceramic sheet with the electrode circuit, and the peeled-off electrode circuit with the electrode circuit is peeled off. ceramic sheets have a, a laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by winding the outer periphery of the laminated support, in the electrode circuit forming step The outer peripheral surface of the deposition substrate ceramic sheets with the electrodes circuit is peeled, characterized in that it is a method of manufacturing a multilayer electronic component forming the electrode circuit.

The present invention includes an electrode circuit forming step of forming an electrode circuit by the electrode circuit forming portion on the outer peripheral surface of the endless continuous shaped deposition substrate release treatment is applied on an outer peripheral surface, the electrode circuit is formed A film forming step of applying a ceramic slurry to the outer peripheral surface of the film forming substrate by a film forming unit and drying to continuously form the ceramic sheet with the electrode circuit; and the ceramic sheet with the electrode circuit A laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by wrapping around the outer periphery of the laminated support, and executed after the film forming step and before the laminated structure forming step is receiving the transport member continuously peeled off the ceramic sheets with the formed in said film-forming substrate electrode circuit from the outer peripheral surface of the formed membrane base, dated the electrode circuit that has received the The serial ceramic sheets have a, a conveying step of conveying the stacked support by the conveying member, in the electrode circuit forming step, the outer peripheral surface of the deposition substrate ceramic sheets with the electrodes circuit is peeled A method of manufacturing a multilayer electronic component for forming the electrode circuit .

  In these cases, it is preferable to use a plateless printing apparatus that performs electrode printing on the ceramic sheet as the electrode circuit forming portion.

  As the plateless printing apparatus, it is preferable to use an inkjet printing apparatus and an ink drying and curing apparatus.

In the laminated structure forming step, when the ceramic sheet is wound around the outer periphery of the laminated support to form the laminated structure of the ceramic sheet and the electrode circuit, A new ceramic sheet is continuously formed on the outer peripheral surface of the membrane substrate.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the quality defect of an electronic component can be suppressed, and the manufacturing efficiency (manufacturing speed) of a multilayer electronic component can be improved by carrying out continuous operation instead of intermittent operation at low cost.

It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing which showed the position of the defect part on a ceramic sheet. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 3rd Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 4th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 5th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 6th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 7th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 8th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 9th Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 10th Embodiment of this invention.

  A multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a first embodiment of the present invention will be described with reference to the drawings. The “multilayer electronic component” to be manufactured in the present invention includes multilayer electronic components such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component.

  First, a multilayer electronic component manufacturing apparatus will be described.

  As shown in FIG. 1, the multilayer electronic component manufacturing apparatus 10 mainly includes a coating roll 12 (film forming substrate) on which a surface (outer peripheral surface) is subjected to a release treatment to form a ceramic sheet S, and a coating roll 12. And stacking rolls 14 and 15 (laminated support) for forming the laminated structure S ′ of the ceramic sheet S by winding up the ceramic sheet S peeled off from the substrate.

  Around the coating roll 12, a film forming unit 16 (film forming unit) for applying a ceramic slurry to be a material of the ceramic sheet S on the surface of the coating roll 12, and the ceramic slurry is supplied to the film forming unit 16. Liquid supply means 18, a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12, and the ceramic sheet S before being wound (laminated) on the outer peripheral surfaces of the stacking rolls 14 and 15. An electrode circuit forming means 22 (electrode circuit forming portion) for forming an electrode circuit 24 (see FIG. 2), a drying and curing device 26 for drying the electrode circuit 24, the stacking rolls 14 and 15 described above, Is arranged.

  The multilayer electronic component manufacturing apparatus 10 of the present embodiment forms the electrode circuit 24 on the ceramic sheet S before being wound around the outer peripheral surfaces of the stacking rolls 14 and 15, and then stacks the ceramic sheet S on which the electrode circuit 24 is formed. It is characterized in that a laminated structure S ′ of ceramic sheets S is formed by winding (stacking) around the outer peripheral surfaces of the rolls 14 and 15.

  A drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 is provided downstream of the film forming unit 16 in the rotation direction of the coating roll (between the film forming unit 16 and the electrode circuit forming unit 22). Has been placed. In addition, a drying and curing device 26 for drying the electrode circuit 24 is disposed on the downstream side of the electrode circuit forming unit 22 in the rotation direction of the coating roll (between the electrode circuit forming unit 22 and the stacking roll 14).

  Specifically, the coating roll 12 is a rigid roll (columnar or cylindrical) made of metal or the like whose surface has been subjected to a mold release process, and is made of an endless continuous base material. The coating roll 12 is configured to be rotationally driven by a driving source (not shown). The mold release treatment corresponds to, for example, fluorine plating treatment.

  The stacking rolls 14 and 15 are configured by attaching an elastic body (for example, a resin film, an elastic film, rubber, a viscous sheet, etc.) to the outer peripheral surface of a removable metal cylindrical jig. This cylindrical jig is mounted on the rotating shaft and rotated in synchronization with the coating roll 12. The stacking rolls 14 and 15 may be configured to be rotationally driven by a driving source (not shown), or may be configured to rotate with the rotational force of the coating roll 12. The stacking rolls 14 and 15 are pressed against the coating roll 12 with a predetermined pressure (pressing force) by a pressure applying mechanism (not shown). The stacking rolls 14 and 15 are configured such that either the stacking roll 14 or the stacking roll 15 can be brought into pressure contact with the coating roll 12 by a changer mechanism (not shown).

  The surface of the elastic body of the stacking roll 14 holds the ceramic sheet S by means such as adhesion or electrostatic adsorption. In addition, the ceramic sheets S wound up by the stacking roll 14 are held together by pressure-bonding the overlapping sheet layers. Since these holding forces are set larger than the force with which the coating roll 12 holds the ceramic sheet S, the ceramic sheet S is peeled off from the coating roll 12 and transferred to the stacking roll 14. The same applies to the stacking roll 15.

  In order to reliably transfer the ceramic sheet S from the coating roll 12 to the stacking roll 14, it is preferable to transfer the ceramic sheet S while appropriately pressing the stacking roll against the coating roll 12. If there is a space between the coating roll 12 and the stacking roll 14, a section where the ceramic sheet S being transported is not supported by another member is created, and there is a possibility that sheet tearing occurs in that section. . Therefore, the stacking roll 14 is appropriately pressed against the coating roll 12 so as not to create an unsupported section of the ceramic sheet S. The surface of the stacking roll 14 has elasticity so that mechanical twisting does not occur when pressing.

  Here, the outer peripheral length of the coating roll 12 is the same as the outer peripheral length of the stacking rolls 14, 15, or one of the outer peripheral length of the coating roll 12 or the outer peripheral length of the stacking rolls 14, 15 is relative to the other. It is preferably an integer multiple.

  As the film forming means 16, for example, an extrusion coating method such as a die coater, a doctor blade, a roll coater, an ink jet type coater or the like is employed. The extrusion coating method refers to a method in which a coating liquid is extruded from a lip of a die and applied. In order to reduce the thickness of the ceramic sheet S formed on the outer peripheral surface of the coating roll 12, it is preferable to provide an upstream pressure reducing mechanism in the die coater. The ceramic slurry is applied continuously (non-intermittently) from the film forming means 16 to the coating roll 12 to form the ceramic sheet S. Thus, the ceramic slurry is continuously supplied to the same coating roll 12.

  As the liquid supply means 18, for example, a gear pump is employed. The liquid supply means 18 is not limited to a gear pump, and may be a cylinder-type dispenser, a diaphragm pump, or the like as appropriate.

  As the electrode circuit forming means 22, for example, an ink jet printing apparatus is employed. The electrode circuit forming means 22 is preferably plateless printing means, but the electrode circuit 24 after drying may be transferred, and any means such as intaglio printing or intaglio offset printing may be used. The electrode material ink used in the electrode circuit forming means 22 is, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent. A material in which Ni powder is dispersed in a UV curable resin may be used. In particular, it is preferable to use a low swelling solvent for the ceramic coating. The solvent may be aqueous.

  As the drying and curing devices 20 and 26, for example, a method of drying with hot air or a method of heating the outer peripheral surface of the coating roll 12 is employed. When a UV curable resin is used, it may be cured by UV irradiation. The drying and curing devices 20 and 26 are for drying or curing the applied ceramic slurry and electrode material ink. Note that a vacuum drying means may be used for the drying and curing device 20 for drying the ceramic rally on the coating roll 12.

  As the ceramic slurry, for example, a solution obtained by dissolving and dispersing ceramic powder and resin in an organic solvent is used. You may use what disperse | distributed ceramic powder to UV hardening resin. The solvent may be aqueous.

  Next, a method for manufacturing the multilayer structure S ′ of the ceramic sheets S using the multilayer electronic component manufacturing apparatus 10 will be described.

  The coating roll 12 subjected to the mold release treatment is rotated at a predetermined speed, and the ceramic slurry is applied to the outer peripheral surface by the film forming means 16. The ceramic slurry is supplied using a gear pump which is the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the drying and curing device 20. Here, hot air of a predetermined temperature is used for drying the ceramic slurry by the drying and curing device 20. The temperature is adjusted by heating or cooling with a separate temperature controller so that the outer peripheral surface of the coating roll 12 has an appropriate temperature. Note that these temperatures are appropriately adjusted depending on the material of the ceramic sheet S. In this way, the ceramic slurry is continuously supplied to the coating roll 12 by the film forming unit 16 and the liquid supply unit 18, and the ceramic sheet S is continuously formed. The ceramic sheet S on which the electrode circuit 24 is not printed is wound up by a predetermined layer with the stacking roll 14 to form the outer layer portion of the laminated structure S ′.

  Next, electrode material ink is applied from the electrode circuit forming means 22 to the ceramic sheet S on the coating roll 12 to print an electrode circuit (internal electrode circuit) 24 having a predetermined graphic pattern. After the electrode circuit 24 is printed, warm air at a predetermined temperature is blown from the drying and curing device 26 to dry the electrode circuit 24. Here, the electrode circuit forming process is performed by changing the graphic pattern so that the electrode circuit 24 becomes a counter electrode for each layer (each circumference) when wound around the outer peripheral surface of the stacking rolls 14 and 15. Done. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the coating roll 12.

  Next, the stacking roll 14 is brought into pressure contact with the coating roll 12 through the ceramic sheet S with a predetermined pressure. In addition, it is necessary to adjust the said pressurizing force suitably with the material of the ceramic sheet S. Then, the dried ceramic sheet S (electrode circuit formed) formed on the outer peripheral surface of the coating roll 12 is peeled off from the outer peripheral surface of the coating roll 12, transferred onto the outer peripheral surface of the stacking roll 14, and wound. Here, the outer peripheral surface of the coating roll 12 is subjected to a mold release process, and the stacking roll 14 is in contact with the coating roll 12 through the ceramic sheet S with a predetermined pressing force. The dried ceramic sheet S formed on the outer peripheral surface of 12 is easily peeled off from the outer peripheral surface of the coating roll 12 and transferred to the outer peripheral surface of the stacking roll 14. In the stacking roll 14, an elastic resin film is wound around the outer peripheral surface of a metal cylindrical jig, and the temperature is adjusted so that the temperature of the outer peripheral surface becomes a predetermined temperature. In addition, it is necessary to adjust the temperature of an outer peripheral surface suitably with the material of the ceramic sheet S. FIG.

  After winding up the ceramic sheet S by the stacking roll 14 by a predetermined layer, the printing of the electrode circuit 24 by the electrode circuit forming means 22 is stopped. Subsequently, the ceramic sheet S on which the electrode circuit 24 is not printed is wound around the stacking roll 14 by a predetermined layer to form the outer layer portion of the laminated structure S ′. Thereafter, the supply of the ceramic slurry to the coating roll 12 is stopped, and the formation of the laminated structure S ′ of the ceramic sheets S is completed, or the stacking roll 15 is replaced with the stacking roll 14 by the changer mechanism. The ceramic sheet S (the one after the formation of the electrode circuit 24) is wound around the outer peripheral surface of the coating roll 15 by making pressure contact with the outer peripheral surface. In this way, the laminated structure S ′ of the ceramic sheets S is formed.

  Further, the laminated structure S ′ of the ceramic sheets S formed on the stacking roll 14 is removed together with the cylindrical jig, pressed with the cylindrical shape, and cut into chips by dicer cutting. Thereafter, the multilayer ceramic capacitor is manufactured through a normal manufacturing process such as firing and forming an electrode circuit (external electrode circuit).

  According to the multilayer electronic component manufacturing apparatus and the multilayer electronic component manufacturing method of the first embodiment, if there are minute scratches or protrusions on the outer peripheral surface of the coating roll 12, the applied ceramic sheet S is repeatedly defective. Although the portion 28 is generated, by repeatedly using the same coating roll 12, the defect portion 28 can be concentrated in a limited area in the laminated structure S ′ wound in a cylindrical shape on the stacking roll 14. it can. It is possible to suppress the occurrence of poor quality in the electronic component obtained by cutting and dividing the multilayer structure S ′ of the ceramic sheets S thus obtained.

  When the ceramic sheet S is peeled off from the coating roll 12 and wound around the outer peripheral surface of the stacking roll 14 to form a laminated structure S ′ of the ceramic sheet S, the coating roll 12 has a new ceramic sheet. Since S continues to be formed, the formation of the ceramic sheet S on the coating roll 12 and the formation of the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 are performed simultaneously. As a result, the ceramic sheet S can be continuously formed without temporarily stopping the rotational driving of the coating roll 12, and the ceramic sheet S can be continuously formed without temporarily stopping the rotational driving of the stacking roll 14. The laminated structure S ′ can be manufactured. As described above, the laminated structure S ′ of the ceramic sheets S can be formed not by intermittent operation but by continuous operation. As a result, the multilayer structure S ′ of the ceramic sheet S can be formed in a very short time, and the production efficiency of the multilayer structure S ′ of the ceramic sheet S can be increased.

  Further, since the ceramic sheet S is formed on the coating roll 12 which is a rigid body and the sheet surface is supported by the coating conveyance roll 12 and the transfer roll 14 from the sheet forming to the sheet lamination process, the ceramic sheet S is thin and has low strength. Even if the sheet S is used, the ceramic sheet S can be prevented from being broken or damaged. As a result, the handling property of the thin and low strength ceramic sheet S can be enhanced.

  Further, as shown in FIG. 1, by setting the outer peripheral lengths of the coating roll 12 and the stacking roll 14 to be the same or one being an integer ratio of the other, the defect portion 28 is further concentrated at a specific location as shown in FIG. Can do. When the outer peripheral length is not an integer ratio, the defective portion 28 generated in the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 is on the same peripheral track of the stacking roll 14 (see the ceramic sheet from the feeding direction). Gathered in the same row of laminated structures). Further, when the outer peripheral length of the stacking roll 14 is longer than the outer peripheral length of the coating roll 12 by an integral multiple, the defective portion 28 generated in the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 is removed. On the same coordinates (the same row and column of the laminated structure when the ceramic sheet is viewed from the feeding direction).

  Moreover, the uniformity of the film thickness of the ceramic sheet S and high productivity are obtained rather than the method using the intermittent application of the known ceramic slurry. That is, since the laminated structure S ′ of the ceramic sheets S is continuously formed in a cylindrical shape, the stable region of the film thickness is wide compared to intermittent application. As a result, a stable quality electronic component can be obtained from the laminated structure S ′ of the ceramic sheets S. The number of electronic components that can be acquired per unit volume of the laminated structure of the ceramic sheet S increases.

  Moreover, in this embodiment, since it is not necessary to use the intermediate consumption material of a disposable base material (PET film etc.), and intermediate material cost including storage, conveyance, etc. can be reduced, the laminated structure S ′ of the ceramic sheet S As a result, the manufacturing cost of the electronic component can be significantly reduced.

  Further, in this embodiment, by connecting the film forming process, the printing process, and the laminating process, it is only necessary to form the ceramic sheet S as much as necessary. Therefore, the loss of material can be reduced.

  In the present embodiment, the electrode circuit 24 is formed before the ceramic sheet S is laminated on the outer peripheral surface of the stacking roll 14. In other words, after the electrode circuit 24 is formed on the ceramic sheet S, the electrode circuit is formed. 24. The formed ceramic sheet S is wound around the outer peripheral surface of the stacking roll 14 and laminated. If the electrode circuit 24 is formed on the ceramic sheet S after the ceramic sheet S is laminated on the outer peripheral surface of the stacking roll 14, the electrode circuit 24 formed on the lower ceramic sheet S or the lower electrode circuit has been formed. The sheet attack occurs in the ceramic sheet S due to the electrode solvent. If the electrode circuit is formed in the state of a single-layer ceramic sheet as in the present invention, it is possible to minimize the effect of sheet attack only on a single layer, such as a short circuit or an IR failure (insulation resistance failure). Can be reduced.

  In particular, since the ceramic sheet S and the electrode circuit 24 are simultaneously formed on the coating roll 12, the entire equipment can be made simple and compact, the equipment price can be reduced, the area can be reduced, and the equipment can be trusted. Can raise the sex.

  Further, since the ceramic slurry is dried on the coating roll 12 and the ceramic sheet S is laminated on the separately provided stacking roll 14, the ceramic slurry is not applied on the dried ceramic sheet S, and the sheet is remelted. Attack does not occur.

  In addition, by using a plateless printing method such as ink jet for forming the electrode circuit 24, it is possible to form the electrode circuit 24 having a different electrode pattern for each layer of the ceramic sheet S. In particular, even when the peripheral length increases due to the distortion of the ceramic sheets S or the increase in the outer diameter of the stacking roll S with the progress of the lamination of the ceramic sheets S, the pattern and formation position of the electrode circuit 24 can be freely changed. Therefore, it is possible to appropriately adjust the pitch (interval) between the electrode circuits 24 to form the electrode circuits 24 without misalignment.

  In the first embodiment, the coating roll 12 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a second embodiment of the present invention will be described with reference to the drawings. In addition, while the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 3, in the second embodiment, a printing conveyance roller (conveyance member) 30 is in contact with the coating roll 12 via a ceramic sheet S. Further, an intermediate conveyance roller (conveyance member) 32 is in contact with the print conveyance roller 30 via the ceramic sheet S. Two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate conveyance roller 32 via the ceramic sheet S. Press rolls 34 and 36 are in contact with the two stacking rolls 14 or 15 via the ceramic sheet S, respectively. As described above, the print transport roller 30 and the intermediate transport roller 32 are interposed between the coating roll 12 and the stacking rolls 14 and 15. For this reason, the coating roll 12 and each stacking roll 14 and 15 will be in the state contacted indirectly (state in which mechanical power transmission is possible).

  Further, around the coating roll 12, a film forming unit 16 (film forming unit) for applying a ceramic slurry to be a material of the ceramic sheet S on the surface of the coating roll 12, and a ceramic slurry on the film forming unit 16 A liquid supply means 18 for supplying and a drying / curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the film forming means 16 in the rotation direction of the coating roll are arranged. . Further, around the print conveying roller 30, an electrode circuit forming means 22 (electrode circuit formation) for forming an electrode circuit 24 on the ceramic sheet S before being wound (stacked) around the outer peripheral surfaces of the stacking rolls 14 and 15 Part), a drying / curing device 26 for drying the electrode circuit 24 located downstream of the electrode circuit forming means 22 in the first supply roll rotation direction, and the intermediate conveying roller 32 described above.

  Here, the printing conveyance roller 30 and the intermediate conveyance roller 32 have a function of receiving the ceramic sheet S from the previous process and supplying the received ceramic sheet S to the subsequent process by means such as adhesion. As the print conveyance roller 30 and the intermediate conveyance roller 32, a metal or resin rigid roll, a roll whose surface is coated with resin, or the like is appropriately selected.

  Since the force that the printing conveyance roll 30 holds the ceramic sheet S is set to be larger than the force that the coating roll 12 holds the ceramic sheet S, and further, the force that the intermediate conveyance roller 32 holds the ceramic sheet S is set. S is peeled off from the coating roll 12 and is held by the printing conveyance roller 30 and then transferred to the intermediate conveyance roller 32. Since the force with which the intermediate conveyance roll 32 holds the ceramic sheet S is set smaller than the force with which the stacking roll 14 holds the ceramic sheet S, the ceramic sheet S is peeled off from the intermediate conveyance roller 32 and transferred to the stacking roll 14. The The surface of the elastic body of the stacking roll 14 holds the ceramic sheet S by means such as adhesion or electrostatic adsorption. In addition, the ceramic sheets S wound up by the stacking roll 14 are held together by pressure-bonding the overlapping sheet layers. Since the holding force is set to be larger than the force with which the intermediate conveyance roller 32 holds the ceramic sheet S, the ceramic sheet S is peeled off from the intermediate conveyance roller 32 and transferred to the stacking roll 14.

  Specifically, the print transport roller 30 has a function of peeling the ceramic sheet S from the coating roll 12 and transferring it to the intermediate transport roller 32. The intermediate conveyance roller 32 has a function of peeling the ceramic sheet S from the printing conveyance roller 30 and transferring it to the stacking roll 14. The print conveyance roller 30 and the intermediate conveyance roller 32 may be a separation conveyance roll that adsorbs (sucks or electrostatically adsorbs) the ceramic sheet S and separates and conveys the ceramic sheet S. At this time, it is preferable that the printing conveyance roller 30 and the intermediate conveyance roller 32 are configured to control a portion that adsorbs the ceramic sheet S and a portion that does not adsorb the ceramic sheet S. When a ceramic sheet S is received from the coating roll 12, an adsorbing function is provided at a predetermined portion of the printing conveyance roller 30 that contacts the ceramic sheet S, and the ceramic sheet S is contacted when the received ceramic sheet S is transferred to the intermediate conveyance roller 32. The ceramic sheet S can be received and transferred smoothly by providing a non-adsorption region at a predetermined portion of the print transport roller 30 to be performed. The same applies to the intermediate conveyance roller 32 with respect to the suction function and the non-suction area. That is, when a ceramic sheet S is received from the printing conveyance roller 30, a predetermined portion of the intermediate conveyance roller 32 that contacts the ceramic sheet S is provided with a suction function, and the ceramic sheet S is transferred when the received ceramic sheet S is transferred to the stacking roll 14. The ceramic sheet S can be received and transferred smoothly by providing a non-adsorption region at a predetermined portion of the intermediate conveyance roller 32 that contacts the substrate.

  In the second embodiment, the ceramic slurry is supplied to the outer peripheral surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified by the drying and curing device 20 on the coating roll 12. In this way, the ceramic sheet S is formed. Further, the electrode material ink is applied from the electrode circuit forming means 22 (for example, ink jet printing) to the ceramic sheet S moved from the coating roll 12 onto the print conveying roller 30, and the electrode circuit 24 having a predetermined graphic pattern is printed. To do. After the electrode circuit 24 is printed, hot air at a predetermined temperature is blown from the drying and curing device 26 to the ceramic sheet S on the print conveying roller 30 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the print conveyance roller 30. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveyance roller 32 and wound around the outer peripheral surface of the stacking roll 14 and laminated. Thereby, the laminated structure S ′ of the ceramic sheets S is formed. As described above, also in the second embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 and laminated. The temperature of the outer peripheral surfaces of the coating roll 12, the printing conveyance roller 30, and the stacking roll 14 is adjusted with a temperature controller so as to have an appropriate temperature.

  According to the second embodiment, the peeling of the ceramic sheet S from the coating roll 12 is not affected by the state on the stacking roll 14 side, and stable handling is possible. Specifically, when the stacked structure S ′ of the ceramic sheets S is formed on the stacking roll 14, the size (outer diameter) including the ceramic sheets of the stacking roll 14 increases, and the electrode circuit A change in the state of the outer shape occurs such that the portion where 24 is formed is uneven. However, by interposing the printing conveyance roller 30 and the intermediate conveyance roller 32 between the coating roll 12 and the stacking roll 14, the stacking roll 14, the printing conveyance roller 30, and the intermediate are arranged in accordance with the state change of the stacking roll 14 described above. The positional relationship with the conveying roller 32, the pressure, and the like can be adjusted as appropriate. Thereby, it is possible to prevent the quality of the laminated structure S ′ of the ceramic sheets S formed on the stacking roll 14 from being deteriorated due to the state change of the stacking roll 14. Further, by designing the stacking roll 14 so as not to directly contact the coating roll 12, the stacking roll 14 damages the ceramic sheet S formed on the coating roll 12 in accordance with a change in the state of the stacking roll 14. This can prevent the deterioration of the quality of the ceramic sheet S and thus the electronic component.

  Further, by providing the printing conveyance roller 30 and the intermediate conveyance roller 32, the path of the ceramic sheet S to be moved before being supplied to the stacking roll 14 can be lengthened without increasing the size of the coating roll 12, The drying time of the ceramic sheet S and the electrode circuit 24 can be increased. Since the ceramic rally is continuously applied to the coating roll 12, the process of moving the ceramic sheet S from the coating roll 12 until it is supplied to the stacking roll 14 via the printing conveyance roller 30 and the intermediate conveyance roller 32 is performed. Can be done continuously. As a result, the line speed of the equipment can be increased, the manufacturing speed (manufacturing efficiency) of the ceramic sheet S can be increased, and the manufacturing efficiency of the laminated structure S ′ of the ceramic sheet S and thus the electronic component can be increased.

  Further, an electrode circuit 24 is formed on the ceramic sheet S on the print conveying roller 30. Thereby, since the electrode circuit 24 is formed with respect to the ceramic sheet S reliably dried on the coating roll 12, the position accuracy of the formation position of the electrode circuit 24 can be further improved. On the other hand, when the electrode circuit 24 is formed on the semi-dry ceramic sheet S, the ceramic sheet S serving as the ground is deformed and the electrode circuit 24 formed thereon may be displaced. In the second embodiment, in order to solve this problem, the electrode circuit 24 is formed on the ceramic sheet S that is surely dried on the coating roll 12.

  In the second embodiment, the coating roll 12 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention. Further, the print conveyance roller 30 and the intermediate conveyance roller 32 correspond to the “conveyance member” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a third embodiment of the present invention will be described with reference to the drawings. In addition, while overlapping with the structure of each said embodiment, while attaching | subjecting a same sign, the description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 4, in the third embodiment, the electrode circuit 24 is formed on the ceramic sheet S on the endless conveyance belt (conveyance member) 38. That is, the intermediate conveying roller (conveying member) 40 is in contact with the coating roll 12 via the ceramic sheet S. Further, an endless conveyance belt 38 is in contact with the intermediate conveyance roller 40 via the ceramic sheet S. Further, an intermediate conveyance roller (conveyance member) 42 is in contact with the endless conveyance belt 38 via the ceramic sheet S. Two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate conveyance roller 42 via the ceramic sheet S. Press rolls 34 and 36 are in contact with the two stacking rolls 14 or 15 via the ceramic sheet S, respectively. As described above, the intermediate conveyance roller 40, the endless conveyance belt 38, and the intermediate conveyance roller 42 are interposed between the coating roll 12 and the stacking rolls 14 and 15. For this reason, the coating roll 12 and each stacking roll 14 and 15 will be in the state contacted indirectly (state in which mechanical power transmission is possible).

  Further, around the coating roll 12, a film forming unit 16 (film forming unit) for applying a ceramic slurry to be a material of the ceramic sheet S on the surface of the coating roll 12, and a ceramic slurry on the film forming unit 16 A liquid supply means 18 for supplying, a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the film forming means 16 in the rotation direction of the coating roll, and the intermediate conveying roller described above 40 are arranged. Further, around the endless conveying belt 38, an electrode circuit forming means 22 for forming the electrode circuit 24 on the ceramic sheet S before being wound (stacked) around the outer peripheral surfaces of the stacking rolls 14 and 15, and an electrode circuit A drying and curing device 26 for drying the electrode circuit 24 located downstream of the forming means 22 in the rotation direction of the endless belt, and the above-described intermediate conveyance roller 42 are disposed.

  Specifically, the intermediate conveyance roller 40 has a function of peeling the ceramic sheet S from the coating roll 12 and transferring it to the endless conveyance belt 38. In the third embodiment, the electrode circuit 24 is not formed on the ceramic sheet S on the intermediate conveyance roller 40. The endless conveyance belt 38 has a function of peeling the ceramic sheet S from the intermediate conveyance roller 40 and transferring it to the intermediate conveyance roller 42. The intermediate transport roller 42 has a function of peeling the ceramic sheet S from the endless transport belt 38 and transferring it to the stacking roll 14.

  In the third embodiment, the ceramic slurry is applied and supplied to the outer peripheral surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified by the drying and curing device 20 on the coating roll 12. In this way, the ceramic sheet S is formed. Further, the electrode material ink is applied from the electrode circuit forming means 22 (for example, ink jet printing) to the ceramic sheet S which has moved from the coating roll 12 to the endless conveyance belt 38 via the intermediate conveyance roller 40, and has a predetermined graphic pattern. The electrode circuit (internal electrode circuit) 24 is printed. After the electrode circuit 24 is printed, hot air at a predetermined temperature is blown from the drying and curing device 26 to the ceramic sheet S on the endless conveyance belt 38 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the endless conveyance belt 38. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveyance roller 42 and wound around the outer peripheral surface of the stacking roll 14 and laminated. Thereby, the laminated structure S ′ of the ceramic sheets S is formed. As described above, also in the third embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 and laminated.

  According to the third embodiment, since the outer peripheral length of the endless transport belt 38 which is a long belt is longer than the outer peripheral length of the coating roll 12 or the intermediate transport roller 40, the ceramic sheet S on the endless transport belt 38 is used. The drying area (area that can be dried by the drying and curing device 26) can be expanded. Thereby, the formation speed (including the drying speed) of the electrode circuit 24 of the ceramic sheet S on the ceramic sheet S is increased, and as a result, the manufacturing speed of the electronic component can be increased.

  In particular, when the ink jet method is adopted for the electrode circuit forming means 22, the ink is difficult to dry because the amount of the solvent of the ink is large. Therefore, by adopting the endless conveyance belt 38 in the printing part of the electrode circuit 24, the moving distance of the ceramic sheet S becomes long without adopting a large-diameter roll, and the electrode circuit 24 on the ceramic sheet S becomes longer. The time for drying can be lengthened. For this reason, the quality variation of the electrode circuit 24 formed by the ink jet method is eliminated, and the quality of the electronic component can be maintained at a high quality.

  In the third embodiment, the coating roll 12 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention. Further, the intermediate conveyance roller 40, the endless conveyance belt 38, and the intermediate conveyance roller 42 correspond to the “conveyance member” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a fourth embodiment of the present invention will be described with reference to the drawings. In addition, while overlapping with the structure of each said embodiment, while attaching | subjecting a same sign, the description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 5, in the fourth embodiment, the coating roll 12 of the first embodiment is configured by an endless film forming belt 44 that is a long belt. That is, the intermediate conveyance roller (conveyance member) 46 is in contact with the endless film formation belt 44 for forming (film formation) the ceramic sheet S via the ceramic sheet S. Further, the two stacking rolls 14 or the stacking roll 15 are in contact with the intermediate conveyance roller 46 via the ceramic sheet S. Press rolls 34 and 36 are in contact with the two stacking rolls 14 or 15 via the ceramic sheet S, respectively. As described above, the intermediate transport roller 46 is interposed between the endless film forming belt 44 and the stacking rolls 14 and 15. For this reason, the endless film forming belt 44 and the stacking rolls 14 and 15 are in an indirect contact state (a state where mechanical power transmission is possible).

  In particular, around the endless film forming belt 44, a film forming unit 16 (film forming unit) for applying a ceramic slurry as a material of the ceramic sheet S to the surface of the endless film forming belt 44, and a film forming unit 16 A liquid supply means 18 for supplying the ceramic slurry to the film; and a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the endless film forming belt 44 located downstream of the film forming means 16 in the rotation direction of the endless belt; The electrode circuit 24 is formed on the ceramic sheet S before being wound (laminated) on the outer peripheral surface of the stacking rolls 14 and 15 and the film thickness inspection device (CCD camera or the like) 48 for measuring the film thickness of the ceramic sheet S. Electrode circuit forming means 22 for the electrode circuit 24 and the electrode circuit 24 located downstream of the electrode circuit forming means 22 in the endless belt rotation direction. And drying and curing device 26 for drying, and removing roll 50 for removing the ceramic sheet S defective, the intermediate feed roller 46 described above, are arranged.

  In the fourth embodiment, the ceramic slurry is supplied to the outer peripheral surface of the endless film forming belt 44 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified by the drying and curing device 20 on the endless film forming belt 44. In this way, the ceramic sheet S is formed. Further, the film thickness of the ceramic sheet S on the endless film forming belt 44 is measured by a film thickness inspection device (CCD camera or the like) 48. Electrode material ink is applied to the ceramic sheet S from the electrode circuit forming means 22 to print an electrode circuit 24 having a predetermined graphic pattern. After the electrode circuit 24 is printed, hot air at a predetermined temperature is blown from the drying and curing device 26 to the ceramic sheet S on the endless film forming belt 44 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the endless film forming belt 44. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveyance roller 46 and wound around the outer peripheral surface of the stacking roll 14 and laminated. Thereby, the laminated structure S ′ of the ceramic sheets S is formed. As described above, also in the fourth embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 and laminated.

  Here, when the ink jet system is adopted for the electrode circuit forming means 22, the ink is difficult to dry because the amount of the solvent of the ink is large. Therefore, by adopting the endless film forming belt 44 in the printing section, the moving distance of the ceramic sheet S becomes long without using a large-diameter roll, and the electrode circuit 24 on the ceramic sheet S is dried. Can be lengthened. For this reason, the quality variation of the electrode circuit 24 formed by the ink jet method is eliminated, and the quality of the electronic component can be maintained at a high quality.

  In the fourth embodiment, the endless film forming belt 44 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention. Further, the intermediate conveyance roller 46 corresponds to the “conveyance member” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a fifth embodiment of the present invention will be described with reference to the drawings. In addition, while overlapping with the structure of each said embodiment, while attaching | subjecting a same sign, the description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 6, the fifth embodiment employs a gravure offset printing method as the printing means of the electrode circuit 24. That is, the intermediate conveying roller (conveying member) 52 is in contact with the coating roll 12 via the ceramic sheet S. In addition, a printing conveyance roller (conveying member) 54 used when forming the electrode circuit 24 on the ceramic sheet S is in contact with the intermediate conveyance roller 52 via the ceramic sheet S. An intermediate conveyance roller (conveyance member) 56 is in contact with the print conveyance roller 54 via the ceramic sheet S. The stacking roll 14 is in contact with the intermediate conveyance roller 56 via the ceramic sheet S. Press rolls 34 and 36 are in contact with the stacking roll 14 via the ceramic sheet S. As described above, the intermediate transport roller 52, the print transport roller 54, and the intermediate transport roller 56 are interposed between the coating roll 12 and each stacking roll 14. For this reason, the coating roll 12 and each stacking roll 14 will be in the state contacted indirectly (state in which mechanical power transmission is possible).

  Further, around the coating roll 12, a film forming means 16 for applying a ceramic slurry to be the material of the ceramic sheet S on the surface of the coating roll 12, and a liquid supply for supplying the ceramic slurry to the film forming means 16 A means 18, a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 that is located downstream of the film forming means 16 in the rotation direction of the coating roll, and an intermediate conveying roller 52 are arranged. . Further, around the print conveyance roller 54, an electrode circuit forming means 22 for forming the electrode circuit 24 on the ceramic sheet S before being wound (laminated) on the outer peripheral surface of the stacking roll 14 and an electrode circuit 24 are provided. A drying and curing device 26 for drying, and the intermediate conveyance roller 52 and the intermediate conveyance roller 56 described above are arranged.

  Here, the electrode circuit forming means 22 employs a gravure offset printing method. That is, the gravure offset printing type electrode circuit forming means 22 is a pattern forming roll having grooves (grooves filled with conductive paste) corresponding to the pattern of the conductive paste film to be the electrode circuit 24 on the outer peripheral surface. 22A and a transfer roll 22B to which a pattern formed on the pattern forming roll 22A is transferred. Further, the pattern transferred onto the transfer roll 22B is dried by blowing warm air of a predetermined temperature from the drying and curing device 26. The pattern of the electrode circuit 24 transferred onto the transfer roll 22B is transferred to the printing conveyance roller 54, and the electrode circuit 24 having a predetermined pattern is formed on the ceramic sheet S on the printing conveyance roller 54.

  According to the fifth embodiment, the ceramic slurry is supplied to the outer peripheral surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified by the drying and curing device 20 on the coating roll 12. In this way, the ceramic sheet S is formed. The ceramic sheet S moves to the intermediate transport roller 52 and the print transport roller 54 on the coating roll 12. The electrode circuit 24 having a predetermined pattern is transferred from the transfer roll 22 </ b> B to the ceramic sheet S on the print conveying roller 54. In this way, the electrode circuit 24 is formed on the ceramic sheet S on the print conveying roller 54. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveyance roller 56 and wound around the outer peripheral surface of the stacking roll 14 and laminated. Thereby, the laminated structure S ′ of the ceramic sheets S is formed. As described above, also in the fifth embodiment, after the electrode circuit 24 is formed on the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 has been formed is wound around the outer peripheral surface of the stacking roll 14 and laminated.

  In the fifth embodiment, the coating roll 12 corresponds to the “film forming substrate” of the invention, and the stacking roll 14 corresponds to the “laminated support” of the invention. The intermediate conveyance roller 52, the print conveyance roller 54, and the intermediate conveyance roller 56 correspond to the “conveyance member” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a sixth embodiment of the present invention will be described with reference to the drawings. In addition, while overlapping with the structure of each said embodiment, while attaching | subjecting a same sign, the description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 7, the sixth embodiment is a part of the configuration of the first embodiment and is partially improved, and is provided between the coating roll 12 and the stacking roll 14 or the stacking roll 15. The intermediate conveying roller (conveying member) 58 is interposed.

  In the sixth embodiment, the electrode circuit 24 is formed on the ceramic sheet S on the coating roll 12, and the ceramic sheet S on which the electrode circuit 24 has been formed is received by the intermediate conveyance roller 58. Then, the ceramic sheet S received by the intermediate conveying roller 58 is wound around the outer peripheral surface of the stacking roll 14 and laminated, so that a laminated structure S ′ of the ceramic sheets S is formed.

  According to the sixth embodiment, since the intermediate conveyance roller 58 is interposed between the coating roll 12 and the stacking roll 14 or the stacking roll 15, the coating roll is provided in the same manner as the effect of the second embodiment. The peeling of the ceramic sheet S from 12 is not affected by the state on the stacking roll 14 side, and stable handling is possible.

  In the sixth embodiment, the coating roll 12 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention. Further, the intermediate conveyance roller 58 corresponds to the “conveyance member” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a seventh embodiment of the present invention will be described with reference to the drawings. In addition, while overlapping with the structure of each said embodiment, while attaching | subjecting a same sign, the description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 8, the seventh embodiment is based on the configuration of the second embodiment and is partially improved, and another supply is provided between the coating roll 12 and the print conveying roller 30. In this configuration, an intermediate conveyance roller (conveyance member) 60 as a roll is interposed.

  In the seventh embodiment, the ceramic sheet S formed on the coating roll 12 is supplied to the print transport roller 30 via the intermediate transport roller 60. The electrode circuit 24 is formed on the ceramic sheet S supplied to the print conveyance roller 30, and the ceramic sheet S on which the electrode circuit 24 has been formed is received from the print conveyance roller 30 to the intermediate conveyance roller 32. Then, the ceramic sheet S received by the second supply roll intermediate conveyance roller 32 is wound around the outer peripheral surface of the stacking roll 14 and laminated to form a laminated structure S ′ of the ceramic sheets S.

  According to the seventh embodiment, since the intermediate conveyance roller 60 is interposed between the coating roll 12 and the printing conveyance roller 30, the ceramic sheet from the coating roll 12 is obtained in the same manner as the effect of the second embodiment. The peeling of S is not affected by the state on the stacking roll 14 side, and stable handling is possible.

  In the seventh embodiment, the coating roll 12 corresponds to the “film forming substrate” of the present invention, and the stacking rolls 14 and 15 correspond to the “laminated support” of the present invention. Further, the intermediate conveyance roller, the printing conveyance roller 30 and the intermediate conveyance roller 32 correspond to the “conveyance member” of the present invention.

  Next, the multilayer electronic component manufacturing apparatus and the multilayer electronic component manufacturing method according to the eighth to tenth embodiments of the present invention will be described.

  In the eighth to tenth embodiments, as shown in FIGS. 9 to 11, the electrode circuit forming means 22 is formed on the endless continuous coating roll 12 or the endless film forming belt 44 whose outer periphery is subjected to a release treatment. Thus, the electrode circuit 24 is formed. Next, the ceramic slurry is applied to the coating roll 12 or the endless film forming belt 44 on which the electrode circuit 24 is formed by the film forming means 16 and dried to continuously form the ceramic sheet S with the electrode circuit. Further, the ceramic sheet S with electrode circuit is peeled off from the coating roll 12 or the endless film forming belt 44, and the peeled ceramic sheet S with electrode circuit is wound around the outer periphery of the stacking roll 14. Thereby, the laminated structure S ′ of the ceramic sheet S and the electrode circuit 24 is formed.

10 Multilayer Electronic Component Manufacturing Equipment 12 Coating Roll (Deposition Base)
14 Stacking roll (laminated support)
15 Stacking roll (laminated support)
16 Film forming means (film forming section)
22 Electrode circuit forming means (electrode circuit forming part)
24 Electrode circuit 30 Printing conveyance roller (conveyance member)
32 Intermediate transport roller (transport member)
38 Endless conveyor belt (conveying member)
40 Intermediate transport roller (transport member)
42 Intermediate conveying roller (conveying member)
44 Endless film deposition belt (film deposition substrate)
46 Intermediate conveying roller (conveying member)
52 Intermediate transport roller (transport member)
54 Print Conveying Roller (Conveying Member)
56 Intermediate transport roller (transport member)
58 Intermediate transport roller (transport member)
60 Intermediate transport roller (transport member)
S Ceramic sheet S 'Laminate structure of ceramic sheet

Claims (17)

An endless continuous film-forming substrate having a release treatment on the outer peripheral surface ;
A film forming part for continuously forming a ceramic sheet by applying a ceramic slurry to the outer peripheral surface of the film forming substrate and drying;
An electrode circuit forming part for forming an electrode circuit on the ceramic sheet on the film-forming substrate;
The ceramic sheet on which the electrode circuit is formed by contacting the film-forming substrate through the ceramic sheet is continuously peeled from the outer peripheral surface of the film-forming substrate , and the peeled ceramic sheet is A laminated support that forms a laminated structure of the ceramic sheet and the electrode circuit by being wound around,
Have
The film-forming unit applies the ceramic slurry to an outer peripheral surface of the film-forming substrate from which the ceramic sheet has been peeled off . An endless continuous film-forming substrate having a release treatment on the outer peripheral surface ;
A film forming part for continuously forming a ceramic sheet by applying a ceramic slurry to the outer peripheral surface of the film forming substrate and drying;
An electrode circuit forming unit that forms an electrode circuit on the ceramic sheet continuous from the film forming unit ;
A laminated support that forms a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on which the electrode circuit is formed around an outer periphery;
The ceramic sheet provided on the film-forming substrate and the laminated support so as to be in contact with each other via the ceramic sheet and continuously formed from the outer peripheral surface of the film-forming substrate. A conveying member that peels and receives the ceramic sheet, and conveys the received ceramic sheet to the laminated support;
Have
The film-forming unit applies the ceramic slurry to an outer peripheral surface of the film-forming substrate from which the ceramic sheet has been peeled off .   The multilayer electronic component manufacturing apparatus according to claim 2, wherein the electrode circuit forming unit forms the electrode circuit with respect to the ceramic sheet on the conveying member. An endless continuous film-forming substrate having a release treatment on the outer peripheral surface ;
An electrode circuit forming part for forming an electrode circuit on the outer peripheral surface of the film-forming substrate;
A film forming part for continuously forming a ceramic sheet with the electrode circuit by applying a ceramic slurry to the outer peripheral surface of the film forming substrate on which the electrode circuit is formed, and drying;
The said electrode which contacted the said film-forming base material through the said ceramic sheet with an electrode circuit , peeled the said ceramic sheet with an electrode circuit continuously from the outer peripheral surface of the said film-forming base material , and peeled A laminated support that forms a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet with a circuit around an outer periphery;
Have
The electrode circuit forming section forms the electrode circuit on the outer peripheral surface of the film-forming substrate from which the ceramic sheet with the electrode circuit has been peeled off . An endless continuous film-forming substrate having a release treatment on the outer peripheral surface ;
An electrode circuit forming part for forming an electrode circuit on the outer peripheral surface of the film-forming substrate;
A film forming part for continuously forming a ceramic sheet with the electrode circuit by applying a ceramic slurry to the outer peripheral surface of the film forming substrate on which the electrode circuit is formed, and drying;
A laminated support that forms a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet with the electrode circuit around an outer periphery;
The ceramic sheet with the electrode circuit formed on the film-forming substrate is provided so as to be in contact with the film-forming substrate and the laminated support through the ceramic sheet with the electrode circuit. Conveying member that continuously peels and receives from the outer peripheral surface of the film-forming substrate and conveys the received ceramic sheet with the electrode circuit to the laminated support;
Have
The electrode circuit forming section forms the electrode circuit on the outer peripheral surface of the film-forming substrate from which the ceramic sheet with the electrode circuit has been peeled off .   6. The multilayer electronic component manufacturing apparatus according to claim 1, wherein the electrode circuit forming unit is a plateless printing apparatus that performs electrode printing on the ceramic sheet. 7.   The multilayer electronic component manufacturing apparatus according to claim 6, wherein the plateless printing apparatus includes an ink jet printing apparatus and an ink drying and curing apparatus.   The outer peripheral length of the film forming substrate and the outer peripheral length of the laminated support are the same length, or one of the outer peripheral length of the film forming substrate or the outer peripheral length of the laminated support is an integral multiple of the other. The multilayer electronic component manufacturing apparatus according to claim 1, wherein the apparatus is a multilayer electronic component manufacturing apparatus. When the ceramic sheet is wound around the outer periphery of the laminated support to form a laminated structure of the ceramic sheet and the electrode circuit, a new ceramic sheet is formed on the outer peripheral surface of the film-forming substrate. The multilayer electronic component manufacturing apparatus according to any one of claims 1 to 8, wherein the apparatus is continued. The ceramic slurry was applied by a film-forming forming unit with respect to the outer peripheral surface of the endless continuous shaped deposition substrate release treatment on the outer circumferential surface has been subjected, and the deposition formation step for continuously forming a ceramic sheet is dried,
An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming unit with respect to the ceramic sheet on the film-forming substrate;
The ceramic sheet on which the electrode circuit is formed is continuously peeled from the outer peripheral surface of the film-forming substrate by bringing the laminated support into contact with the outer peripheral surface of the film-forming substrate through the ceramic sheet. A laminated structure forming step of forming the laminated structure of the ceramic sheet and the electrode circuit by winding the peeled ceramic sheet around the outer periphery of the laminated support;
I have a,
In the film formation process, the ceramic slurry is applied to an outer peripheral surface of the film formation substrate from which the ceramic sheet has been peeled off . The ceramic slurry was applied by a film-forming forming unit with respect to the outer peripheral surface of the endless continuous shaped deposition substrate release treatment on the outer circumferential surface has been subjected, and the deposition formation step for continuously forming a ceramic sheet is dried,
An electrode circuit forming step of forming an electrode circuit by the electrode circuit forming unit with respect to the ceramic sheet continuous from the film forming unit ;
A laminated structure forming step of forming the laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on which the electrode circuit is formed around the outer periphery of the laminated support;
The ceramic sheet formed on the film-forming substrate is continuously peeled from the outer peripheral surface of the film-forming substrate, which is executed after the film-forming process and before the layered structure forming process. receiving by a conveying step of conveying the ceramic sheet received the said stack support by the conveying member,
I have a,
In the film formation process, the ceramic slurry is applied to an outer peripheral surface of the film formation substrate from which the ceramic sheet has been peeled off .   12. The method of manufacturing a multilayer electronic component according to claim 11, wherein in the electrode circuit forming step, the electrode circuit is formed on the ceramic sheet on the conveying member. An electrode circuit forming step in which an electrode circuit is formed on the outer peripheral surface of an endless continuous film-forming substrate whose outer peripheral surface has been subjected to a mold release treatment; and
A film forming step for continuously forming a ceramic sheet with the electrode circuit by applying a ceramic slurry to the outer peripheral surface of the film forming substrate on which the electrode circuit is formed by a film forming unit and drying the slurry.
The ceramic sheet with the electrode circuit is continuously peeled from the outer peripheral surface of the film-forming substrate by bringing the laminated support into contact with the film-forming substrate through the ceramic sheet with the electrode circuit. A laminated structure forming step of forming the laminated structure of the ceramic sheet and the electrode circuit by winding the peeled ceramic sheet with the electrode circuit around the outer periphery of the laminated support;
I have a,
In the electrode circuit forming step, the electrode circuit is formed on the outer peripheral surface of the film-forming substrate from which the ceramic sheet with the electrode circuit has been peeled off . An electrode circuit forming step in which an electrode circuit is formed on the outer peripheral surface of an endless continuous film-forming substrate whose outer peripheral surface has been subjected to a mold release treatment; and
A film forming step for continuously forming a ceramic sheet with the electrode circuit by applying a ceramic slurry to the outer peripheral surface of the film forming substrate on which the electrode circuit is formed by a film forming unit and drying the slurry.
A laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet with the electrode circuit around an outer periphery of the laminated support;
The ceramic sheet with the electrode circuit, which is executed after the film formation step and before the layered structure formation step, and the conveying member is formed on the film formation substrate, is attached to the outer peripheral surface of the film formation substrate . A conveying step of continuously peeling and receiving the ceramic sheet with the received electrode circuit from the conveying member to the laminated support by the conveying member;
I have a,
In the electrode circuit forming step, the electrode circuit is formed on the outer peripheral surface of the film-forming substrate from which the ceramic sheet with the electrode circuit has been peeled off .   The method for manufacturing a multilayer electronic component according to claim 10, wherein a plateless printing apparatus that performs electrode printing on the ceramic sheet is used as the electrode circuit forming portion.   The method for manufacturing a multilayer electronic component according to claim 15, wherein an ink jet printing apparatus and an ink drying and curing apparatus are used as the plateless printing apparatus. In the laminated structure forming step, when the ceramic sheet is wound around the outer periphery of the laminated support to form a laminated structure of the ceramic sheet and the electrode circuit,
The method for manufacturing a multilayer electronic component according to any one of claims 10 to 16, wherein in the film formation step, a new ceramic sheet is continuously formed on the outer peripheral surface of the film formation substrate. .

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