JP5574118B2 - Multilayer electronic component manufacturing apparatus and multilayer electronic component manufacturing method - Google Patents

Description

  The present invention relates to a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

  A general method of manufacturing a multilayer ceramic capacitor is to form a ceramic film on a long film, print an internal electrode on it, cut it to a desired size, peel it off from the film, and stack it. A laminated body block is formed repeatedly, and this is cut into parts.

  On the other hand, in the following Patent Document 1, a laminated body block is formed by laminating a plurality of ceramic green sheets formed on a base material, and the formed laminated body block is cut in parts. A method of manufacturing a multilayer ceramic electronic component, wherein at least two of the plurality of ceramic green sheets constituting the same multilayer block are formed in a predetermined region on the same substrate, And the manufacturing method of the multilayer ceramic electronic component which laminates | stacks by making the direction of the in-plane direction of each ceramic green sheet and the position of each ceramic green sheet substantially correspond is disclosed.

  In the following Patent Document 2, the first flexible support is run endlessly, a ceramic paint is applied on one surface of the second flexible support, and the resulting undried ceramic paint layer is Transfer to the first flexible support, peel off the second flexible support from the ceramic paint layer after transfer, and onto the surface of the ceramic paint layer transferred onto the first flexible support A technique is disclosed in which an electrode is printed, the electrode is dried, and such a process is repeated on a first flexible support.

  Japanese Patent Application Laid-Open No. H10-228688 discloses a laminate manufacturing for a multilayer electronic component comprising a self-supporting green sheet containing a ceramic and an organic binder component and having a predetermined pattern for forming an internal electrode layer thereon. There is disclosed a technology for manufacturing a device by winding a self-supporting green sheet on which a predetermined pattern is formed in advance on a columnar roll.

  Patent Document 4 listed below includes an unwinding supply unit that supplies a green sheet, a lamination drum that forms a laminate by winding the green sheet around an outer peripheral surface, a rotation angle detection device that detects a rotation angle of the lamination drum, and a rotation Based on the information of the angle detection device, a technique is disclosed in which a laminate can be manufactured at a high speed by including an internal electrode printing unit that forms an internal electrode on a green sheet wound around a lamination drum while winding the green sheet. .

  Here, as a laminated body formation method in the production process of a multilayer ceramic capacitor, generally, a ceramic coating film is applied and formed on a long film, an internal electrode is printed thereon, and this is cut from the film. The means of peeling and stacking is used. In order to reduce the size and capacity of multilayer capacitors, it is necessary to form a thinner ceramic dielectric layer and increase the number of laminated layers, which can cause short-circuits due to defects caused by protrusions on the film. It has been found that the occurrence rate of quality defects increases. Therefore, efforts have been made to make the film smoother, but it is difficult to handle due to the deterioration in handling properties and the increase in film cost.

  As a means for solving this problem, a method of forming a ceramic green sheet by repeatedly using the same flat substrate is devised (see Patent Document 1). By using the same base material, defective portions are concentrated on one part of the laminated block, so that even if there are protrusions on the base material, defective chips caused by the influence can be minimized.

Japanese Patent Application Laid-Open No. 2004-296641 JP 2002-141245 A JP 2000-306766 A JP 2003-217992 A

  However, in the technique of the above-mentioned Patent Document 1, since it is necessary to intermittently form a green sheet on a flat plate or a cylindrical base material, non-uniform areas of film thickness are generated at the film formation start part and the film end part, and the laminate block Even if the film is formed, a region where desired quality can be obtained is narrow, and a problem in yield is large. Further, even in the process of laminating the ceramic sheets on the flat plate, there is a drawback that the intermittent operation is required one by one and the production speed cannot be increased.

  Moreover, as a means for efficiently laminating ceramic sheets, the technique of Patent Document 2 has been devised. A ceramic is applied on a long film, and this is transferred onto an endless belt to obtain a laminated structure. In this method, it is possible to increase the speed by not performing the intermittent operation. However, since a long base material is used, the effect of suppressing the quality defect cannot be expected at the defective portion of the ceramic layer due to the base material protrusion.

  The same kind of invention is described in Patent Document 3 described above. In this method, a laminated structure is formed on a cylindrical drum and high-speed lamination is possible by continuous operation. However, the ceramic sheet is limited to a high-strength self-supporting green sheet having no support such as a film. The frequency of defects inherent in this self-supporting green sheet is unknown, but this sheet, which contains a resin with a high degree of polymerization and has increased strength, makes it difficult to degrease in the firing process, and the denseness of the ceramic after firing Therefore, it is difficult to use for mass production because its practicality is low.

  The invention of the above-mentioned Patent Document 4 is one in which a cylindrical or polygonal column is continuously laminated and an electrode circuit is formed by ink jetting. In this case as well, the green sheet needs to have high strength that can be conveyed independently, As a means for forming a laminated structure of thin ceramic layers, which is a problem, it is difficult to put it to practical use.

  Accordingly, in view of the above problems, an object of the present invention is to suppress the occurrence of poor quality of electronic components, increase the manufacturing efficiency (production speed) of multilayer electronic components by continuously operating at low cost. An object of the present invention is to provide a multilayer electronic component manufacturing apparatus and a method for manufacturing the multilayer electronic component.

The present invention is an endless continuous form of the film forming substrate to release treatment has been applied to the outer periphery, the deposition of the ceramic slurry is applied to the deposition substrate, and dried to continuously form a ceramic sheet outer periphery forming portion, wherein the relative deposition substrate in contact through the ceramic sheet continuously peeled off the ceramic sheet from the film forming substrate, the ceramic sheet which is continuous from the deposition forming section A laminated support that forms a laminated structure of the ceramic sheet by being wound around, and an electrode circuit forming section that forms an electrode circuit on the ceramic sheet that is wound around the outer periphery of the laminated support. This is a multilayer electronic component manufacturing apparatus.

  According to the present invention, even if there is a defect factor such as a protrusion on the film formation substrate, the defective portion of the ceramic sheet caused by the concentration is concentrated within a limited range of the laminated structure. Occurrence of poor quality of electronic parts obtained by cutting and dividing can be suppressed low.

  In addition, since the ceramic sheet is continuously formed on the film formation substrate, the stable region of the film thickness is widened compared to intermittent application, and the number of electronic components that can be divided from the obtained laminated structure can be increased.

  Since the process of forming a ceramic sheet on a film forming substrate and the process of forming a laminated structure of ceramic sheets on a laminated support are executed by continuous operation, the ceramic sheet is highly productive in a shorter time. The laminated structure can be formed.

  Moreover, it is not necessary to use a long film base material as in the prior art, and the intermediate material cost can be suppressed.

  As described above, it is possible to increase the manufacturing efficiency (production speed) of the multilayer electronic component by suppressing the occurrence of defective quality of the electronic component, operating at a low cost, and continuously rather than intermittently.

The present invention is an endless continuous form of the film forming substrate to release treatment has been applied to the outer periphery, the deposition of the ceramic slurry is applied to the deposition substrate, and dried to continuously form a ceramic sheet A winding support that forms a laminated structure of the ceramic sheet by winding the ceramic sheet continuous from the forming portion and the film forming portion, and the film forming substrate and the layered support on the stacking support. The ceramic sheet provided so as to be in contact with the ceramic sheet and formed on the film-forming substrate is continuously peeled from the film-forming substrate , and the peeled ceramic sheet is peeled off from the laminated support. multilayer electronic to the intermediate stripping unit for conveying an electrode circuit forming section for forming an electrode circuit to the ceramic sheet wrapped around the outer periphery of the laminated support, characterized in that it has to It is a goods manufacturing equipment.

  According to the present invention, the peeling of the ceramic sheet from the film forming substrate is not affected by the state on the laminated support side, and stable handling is possible. Specifically, when a laminated structure of ceramic sheets is formed on the laminated support, the size of the laminated support increases, and when an electrode circuit is formed, the portion is uneven. However, when the intermediate peeling part is interposed between the film forming substrate and the laminated support, the laminated support and the intermediate peeling part are matched to the change in the state of the laminated support. The positional relationship, pressure and the like can be adjusted as appropriate. Thereby, it can prevent that the quality of the laminated structure of the ceramic sheet formed in a laminated support body deteriorates by the state change of a laminated support body. In addition, by designing the laminated support so that it does not come into direct contact with the film-forming substrate, the contact pressure of the roller of the film-forming substrate can be reduced, so that the film-forming substrate can be prevented from being damaged.

  In the present invention, the outer peripheral length of the film-forming substrate and the outer peripheral length of the laminated support are the same length, or one of the outer peripheral length of the film-forming substrate and the outer peripheral length of the laminated support is the other. In contrast, it is an integral multiple.

  In the present invention, the defective part of the ceramic sheet caused by the presence of a defect factor such as a protrusion on the film formation substrate can be concentrated in a specific region of the laminated structure. Specifically, defects generated in the multilayer structure of the ceramic sheet on the multilayer structure are collected on the same circumferential track of the multilayer structure (the same row of the multilayer structure when the ceramic sheet is viewed from the feeding direction). be able to. Furthermore, when the outer peripheral length of the laminated support is an integral multiple of the outer peripheral length of the film-forming substrate, the defects occurring in the laminated structure of the ceramic sheet on the laminated structure are identified with the same coordinates of the laminated structure. (The same row and column of the laminated structure when the ceramic sheet is viewed from the feeding direction).

  In the present invention, when the ceramic sheet is wound around the outer periphery of the laminated support to form the laminated structure of the ceramic sheet, the new ceramic sheet is continuously formed on the film-forming substrate. It is characterized by.

  According to the present invention, since the laminated structure of ceramic sheets can be formed not in intermittent operation but in continuous operation, the laminated structure of ceramic sheets can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of ceramic sheets can be increased.

  According to the present invention, after laminating a ceramic sheet around the outer periphery of a laminated support and laminating, an electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit, so that an electrode circuit can be obtained without worrying about distortion during lamination. It is possible to improve the interlayer position accuracy. On the contrary, if the electrode circuit is formed before the ceramic sheet is laminated on the laminated support, the electrode circuit formation position between the layers may be shifted due to expansion / contraction when the ceramic sheet is wound or a change in the size of the laminated support. There is. As a result, a mechanism related to the positioning of the equipment can be omitted, the equipment price can be kept low, the equipment can be downsized, and the installation area can be set small.

  The present invention is characterized in that the electrode circuit forming portion is a plateless printing apparatus that performs electrode printing on the ceramic sheet wound around the outer periphery of the laminated support.

  According to the present invention, an electrode circuit having a different pattern can be formed for each layer of the ceramic sheet. Also, even if the ceramic sheet expands or contracts or the size of the laminated support changes as the ceramic sheet is laminated on the laminated support, the pitch between the electrode circuits is adjusted so that there is no displacement. An electrode circuit can be formed.

The present invention, a ceramic slurry was applied by a film-forming forming unit with respect to the endless continuously shaped deposition substrate release treatment has been applied to the outer periphery, the deposition formation step for continuously forming a ceramic sheet is dried The ceramic sheet is continuously peeled from the film-forming substrate by bringing a laminated support into contact with the film-forming substrate via the ceramic sheet, and is continuously formed from the film-forming part. A laminated structure forming step of forming a laminated structure of the ceramic sheet by winding a sheet around the outer periphery of the laminated support , and the laminated support by the electrode circuit forming unit while winding the ceramic sheet around the laminated support An electrode circuit forming step of forming an electrode circuit on the ceramic sheet .

The present invention, a ceramic slurry was applied by a film-forming forming unit with respect to the endless continuously shaped deposition substrate release treatment has been applied to the outer periphery, the deposition formation step for continuously forming a ceramic sheet is dried And a laminated structure forming step of forming a laminated structure of the ceramic sheet by winding the ceramic sheet continuous from the film forming portion around the outer periphery of the laminated support, and after the film forming step and The ceramic sheet, which is executed before the laminated structure forming step and has an intermediate peeling portion formed on the film forming substrate, is continuously peeled from the film forming substrate , and the peeled ceramic sheet is removed from the intermediate structure. a conveying step of conveying the stacked support by peeling section, while winding the ceramic sheet on the stack support, the canceller on the laminated support by the electrode circuit forming portions An electrode circuit forming step of forming an electrode circuit Kkushito a method of manufacturing a multilayer electronic component and having a.

  In particular, in the laminated structure forming step, when the ceramic sheet is wound around the outer periphery of the laminated support to form the laminated structure of the ceramic sheet, the film forming substrate includes the film forming substrate. It is preferable that new ceramic sheets continue to be formed on the material.

  According to the present invention, since the laminated structure of ceramic sheets can be formed not in intermittent operation but in continuous operation, the laminated structure of ceramic sheets can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of ceramic sheets can be increased.

  According to the present invention, in the electrode circuit forming step, the ceramic sheet is wound around the laminated support, and after laminating, the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit, thereby worrying about distortion during lamination. The interlayer position accuracy of the electrode circuit can be improved without any problem. Conversely, if the electrode circuit is formed before the ceramic sheet is laminated on the laminated support, the electrode circuit formation position between the layers may be shifted due to expansion or contraction when the ceramic sheet is wound or a change in the size of the laminated support. is there. As a result, a mechanism related to the positioning of the equipment can be omitted, the equipment price can be kept low, the equipment can be downsized, and the installation area can be set small.

  Furthermore, it is preferable to use a plateless printing apparatus that performs electrode printing on the ceramic sheet wound around the outer periphery of the laminated support as the electrode circuit forming portion.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the quality defect of an electronic component can be suppressed, and the manufacturing efficiency (production speed) of a multilayer type electronic component can be improved by carrying out continuous operation instead of intermittent operation at low cost.

It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing which showed the position of the defect part on a ceramic sheet. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the multilayer electronic component manufacturing apparatus which concerns on 3rd Embodiment of this invention.

  A multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a first embodiment of the present invention will be described with reference to the drawings. The “multilayer electronic component” to be manufactured in the present invention includes multilayer electronic components such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component.

  First, a multilayer electronic component manufacturing apparatus will be described.

  As shown in FIG. 1, the multilayer electronic component manufacturing apparatus 10 mainly includes a coating roll 12 (film forming substrate) on which a surface (outer peripheral surface) is subjected to a release treatment to form a ceramic sheet S, and a coating roll 12. A stacking roll 14 (laminated support) that winds up the ceramic sheet S peeled off from the ceramic sheet S to form a laminated structure S ′ of the ceramic sheet S.

  In the vicinity of the coating roll 12, a film forming unit 16 (film forming unit) for applying a ceramic slurry to be a material of the ceramic sheet S on the surface of the coating roll 12, and a ceramic slurry is supplied to the film forming unit 16. A liquid supply means 18 for drying and a drying and curing device 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 are disposed. These constituent members function to form the ceramic sheet S on the surface of the coating roll 12.

  In the vicinity of the stacking roll 14, an electrode circuit forming means 22 (electrode circuit forming portion) for forming the electrode circuit 24 on the ceramic sheet S wound around the surface of the stacking roll 14, and for drying the electrode circuit 24 A drying and curing device 26 is arranged. These components function to form the electrode circuit 24 on the ceramic sheet S wound around the stacking roll 14.

  Specifically, the coating roll 12 is a rigid roll (columnar or cylindrical) made of metal or the like whose surface has been subjected to a mold release process, and is made of an endless continuous base material. The coating roll 12 is configured to be rotationally driven by a driving source (not shown). The mold release treatment corresponds to, for example, fluorine plating treatment.

  The stacking roll 14 is configured by attaching an elastic body (for example, an elastic film, rubber, a viscous sheet, etc.) to the outer peripheral surface of a detachable metal cylindrical jig. This cylindrical jig is mounted on the rotating shaft and rotated in synchronization with the coating roll 12. The stacking roll 14 may be configured to be rotationally driven by a driving source (not shown), or may be configured to rotate with the rotational force of the coating roll 12. The stacking roll 14 is pressed against the coating roll 12 with a predetermined pressure (pressing force) by a pressure applying mechanism (not shown). The surface of the elastic body holds the ceramic sheet S by means such as adhesion and electrostatic adsorption. In addition, the ceramic sheets S wound up by the stacking roll 14 are held together by pressure-bonding the overlapping sheet layers. Since these holding forces are set larger than the force with which the coating roll 12 holds the ceramic sheet S, the ceramic sheet S is peeled off from the coating roll 12 and transferred to the stacking roll 14.

  In order to reliably transfer the ceramic sheet S from the coating roll 12 to the stacking roll 14, it is preferable to transfer the ceramic sheet S while appropriately pressing the stacking roll 14 against the coating roll 12. If there is a space between the coating roll 12 and the stacking roll 14, a section where the ceramic sheet S being transported is not supported by another member is created, and there is a possibility that sheet tearing occurs in that section. . Therefore, the stacking roll 14 is appropriately pressed against the coating roll 12 so as not to create an unsupported section of the ceramic sheet S. The surface of the stacking roll 14 has elasticity so that mechanical twisting does not occur when pressing.

  Here, the outer peripheral length of the coating roll 12 is the same as the outer peripheral length of the stacking roll 14, or one of the outer peripheral length of the coating roll 12 or the outer peripheral length of the stacking roll 14 is an integral multiple of the other. It is preferable.

  As the film forming means 16, for example, a die coater, a doctor blade, a roll coater, an ink jet type coater or the like is appropriately employed. In order to reduce the thickness of the ceramic sheet S formed on the outer peripheral surface of the coating roll 12, it is preferable to provide an upstream pressure reducing mechanism in the die coater. The ceramic slurry is applied from the film forming means 16 to the coating roll 12 continuously (non-intermittently), and the ceramic sheet S is formed. Thus, the ceramic slurry is continuously supplied to the same coating roll 12.

  As the liquid supply means 18, for example, a cylinder type dispenser is adopted. The liquid supply means 18 is not limited to the cylinder-type dispenser, and a gear pump, a diaphragm pump, or the like may be appropriately employed.

  As the electrode circuit forming means 22, for example, an ink jet printing apparatus is employed. The electrode circuit forming means 22 is preferably plateless printing means, but any means such as transferring the dried electrode circuit 24, intaglio printing, or intaglio offset printing may be used. The electrode material ink used in the electrode circuit forming means 22 is, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent. A material in which Ni powder is dispersed in a UV curable resin may be used. In particular, it is preferable to use a low swelling solvent for the ceramic coating. The solvent may be aqueous.

  As the drying and curing devices 20 and 26, for example, a method of drying with hot air, a method of heating the outer peripheral surface of the coating roll 12 or the stacking roll 14, and vacuum drying are employed. When a UV curable resin is used, it may be cured by UV irradiation. The drying and curing devices 20 and 26 are for drying or curing the applied ceramic slurry and electrode material ink.

  As the ceramic slurry, for example, a solution obtained by dissolving and dispersing ceramic powder and resin in an organic solvent is used. You may use what disperse | distributed ceramic powder to UV hardening resin. The solvent may be aqueous.

  Next, a method for manufacturing the multilayer structure S ′ of the ceramic sheets S using the multilayer electronic component manufacturing apparatus 10 will be described.

  The coating roll 12 subjected to the mold release treatment is rotated at a predetermined speed, and the ceramic slurry is applied to the outer peripheral surface by the film forming means 16. The supply of the ceramic slurry is performed using the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the drying and curing device 20. Here, for drying the ceramic slurry by the drying and curing device 20, hot air having a predetermined temperature is used, and the temperature is adjusted so that the outer peripheral surface of the coating roll 12 has an appropriate temperature. Note that these temperatures are appropriately adjusted depending on the material of the ceramic sheet S.

  Next, the stacking roll 14 is brought into pressure contact with the coating roll 12 through the ceramic sheet S with a predetermined pressure. In addition, it is necessary to adjust the said pressurizing force suitably with the material of the ceramic sheet S. Then, the dried ceramic sheet S formed on the outer peripheral surface of the coating roll 12 is peeled off from the outer peripheral surface of the coating roll 12, transferred onto the outer peripheral surface of the stacking roll 14, and wound. Here, the outer peripheral surface of the coating roll 12 is subjected to a mold release process, and the stacking roll 14 is in contact with the coating roll 12 through the ceramic sheet S with a predetermined pressing force. The dried ceramic sheet S formed on the outer peripheral surface of 12 is easily peeled off from the outer peripheral surface of the coating roll 12 and transferred to the outer peripheral surface of the stacking roll 14. In the stacking roll 14, an elastic resin film is wound around the outer peripheral surface of a metal cylindrical jig, and the temperature of the outer peripheral surface is adjusted to a predetermined temperature by a heating and cooling means. In addition, it is necessary to adjust the temperature of an outer peripheral surface suitably with the material of the ceramic sheet S. FIG.

  After winding a predetermined layer of the ceramic sheet S with the stacking roll 14, electrode material ink is applied to the ceramic sheet S from the electrode circuit forming means 22, and an electrode circuit (internal electrode circuit) 24 having a predetermined graphic pattern is printed. To do. After the electrode circuit 24 is printed, hot air is blown from the drying and curing device 26 to dry the electrode circuit 24. Thereby, the electrode circuit 24 is formed in a plurality of layers (a plurality of layers stacked in the radial direction) of the ceramic sheet S wound around the stacking roll 14. At this time, in the production of the multilayer capacitor, electrode printing is performed by changing the graphic pattern so that the electrode circuit 24 becomes a counter electrode for each layer (each circumference). In this way, a predetermined number of electrode circuit layers are formed, and then electrode printing by the electrode circuit forming means 22 is stopped. Subsequently, the ceramic sheet S is wound around the stacking roll 14 by a predetermined layer. Thereafter, the winding of the ceramic sheet S by the stacking roll 14 is stopped, and the laminated structure S ′ of the ceramic sheets S is formed.

  Further, the laminated structure S ′ of the ceramic sheets S formed on the stacking roll 14 is removed together with the cylindrical jig, pressed with the cylindrical shape, and cut into chips by dicer cutting. Thereafter, the multilayer ceramic capacitor is manufactured through a normal manufacturing process such as firing and forming an electrode circuit (external electrode circuit).

  According to the multilayer electronic component manufacturing apparatus and the multilayer electronic component manufacturing method of the first embodiment, if there are minute scratches or protrusions on the outer peripheral surface of the coating roll 12, the applied ceramic sheet S is repeatedly defective. Although the portion 28 is generated, by repeatedly using the same coating roll 12, the defect portion 28 can be concentrated in a limited area in the laminated structure S ′ wound in a cylindrical shape on the stacking roll 14. it can. It is possible to suppress the occurrence of poor quality in the electronic component obtained by cutting and dividing the multilayer structure S ′ of the ceramic sheets S thus obtained.

  Further, when the ceramic sheet S is peeled off from the coating roll 12 and wound around the stacking roll 14 to form a laminated structure S ′ of the ceramic sheet S, a new ceramic sheet S is formed on the coating roll 12. Therefore, the formation of the ceramic sheet S on the coating roll 12 and the formation of the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 are performed simultaneously. As a result, the ceramic sheet S can be continuously formed without temporarily stopping the rotational driving of the coating roll 12, and the ceramic sheet S can be continuously formed without temporarily stopping the rotational driving of the stacking roll 14. The laminated structure S ′ can be manufactured. As described above, the laminated structure S ′ of the ceramic sheets S can be formed not by intermittent operation but by continuous operation. As a result, the multilayer structure S ′ of the ceramic sheet S can be formed in a very short time, and the production efficiency of the multilayer structure S ′ of the ceramic sheet S can be increased.

  In addition, since the ceramic sheet S is formed on the rigid coating roll 12 and is held up to the laminated portion, even if a thin and low-strength ceramic sheet S is used, the ceramic sheet S is prevented from being broken or damaged. be able to. As a result, the handling property of the thin and low strength ceramic sheet S can be enhanced.

  Further, as shown in FIG. 1, by setting the outer peripheral lengths of the coating roll 12 and the stacking roll 14 to be the same or one being an integer ratio of the other, as shown in FIG. 2, the defect portion 28 is further concentrated at a specific location. be able to. When the outer peripheral length is not an integer ratio, the defect portion 28 generated in the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 is on the same peripheral track of the stacking roll 14 (from the feeding direction of the ceramic sheet S). Gathered in the same row of laminated structure when viewed). Further, when the outer peripheral length of the stacking roll 14 is longer than the outer peripheral length of the coating roll 12 by an integral multiple, the defective portion 28 generated in the laminated structure S ′ of the ceramic sheets S on the stacking roll 14 is removed. On the same coordinates (the same row and column of the laminated structure when the ceramic sheet S is viewed from the feeding direction).

  Moreover, the uniformity of the film thickness of the ceramic sheet S and high productivity are obtained rather than the method using the intermittent application of the known ceramic slurry. That is, since the laminated structure S ′ of the ceramic sheets S is continuously formed in a cylindrical shape, a stable region of the film thickness is widened compared to intermittent application. As a result, a stable quality electronic component can be obtained from the laminated structure S ′ of the ceramic sheets S. The number of electronic components that can be acquired per unit volume of the laminated structure of the ceramic sheet S increases.

  Further, in this embodiment, it is not necessary to use an intermediate consumption material of a disposable base material (PET film or the like), and it is possible to greatly reduce the manufacturing cost of the laminated structure S ′ of the ceramic sheet S, and thus the electronic component. It is.

  Moreover, in this embodiment, by using the ceramic sheet S without using a film, the handling of the film, which was necessary for the prior art, becomes unnecessary, and the ceramic sheet S is laminated on the stacking roll 14. Since the electrode circuit 24 is formed later, it is not necessary to position and position the stack, and the facilities of the multilayer electronic component manufacturing apparatus 10 can be made compact (positioning mechanism can be omitted), and the equipment cost can be greatly reduced.

  In addition, by using a plateless printing method such as ink jet for forming the electrode circuit 24, it is possible to form the electrode circuit 24 having a different electrode pattern for each layer of the ceramic sheet S. In particular, since the electrode circuit 24 is formed after the ceramic sheet S is laminated on the stacking roll 14, the distortion of the ceramic sheet S and the outer diameter of the stacking roll S increase as the lamination of the ceramic sheet S proceeds. Even when the length is increased, the pitch (interval) between the electrode circuits 24 can be adjusted as appropriate to form the electrode circuits 24 without positional displacement.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a second embodiment of the present invention will be described with reference to the drawings. In addition, while the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, description of the overlapping structure and effect is abbreviate | omitted.

  As shown in FIG. 3, 2nd Embodiment is the structure by which the coating roll 12 and the stacking roll 14 are connected indirectly via the intermediate | middle peeling roll 30 (intermediate peeling part). That is, the intermediate peeling roll 30 is in contact with the coating roll 12, and the stacking roll 14 is in contact with the intermediate peeling roll 30.

  The intermediate peeling roll 30 has a function of peeling the ceramic sheet S from the coating roll 12 by means such as adhesion and transferring it to the stacking roll 14. The material of the intermediate peeling roll 30 is not particularly limited, such as resin or metal. The force with which the intermediate peeling roll 30 holds the ceramic sheet S is set to be larger than the force with which the coating roll 12 holds the ceramic sheet S and further smaller than the force with which the stacking roll 14 holds the ceramic sheet S. Is peeled off from the coating roll 12 and held on the intermediate peeling roll 30 and then transferred to the stacking roll 14. Further, the intermediate peeling roll 30 may be a peeling holding roll that holds the ceramic sheet S by suction (suction or electrostatic adsorption) from the coating roll 12 and holds it. At this time, it is preferable that the intermediate peeling roll 30 is configured to control the adsorbing arc portion and the non-adsorbing arc portion. When the ceramic sheet S is peeled from the coating roll 12, a predetermined portion of the intermediate peeling roll 30 that comes into contact with the ceramic sheet S is provided with an adsorption function, and when the peeled ceramic sheet S is transferred to the stacking roll 14, it contacts the ceramic sheet S By providing a region that is not adsorbed to a predetermined portion of the intermediate peeling roll 30 to be peeled off, the ceramic sheet S can be peeled off and transferred smoothly.

  According to the second embodiment, the peeling of the ceramic sheet S from the coating roll 12 is not affected by the state on the stacking roll 14 side, and stable handling is possible. Specifically, when the stacked structure S ′ of the ceramic sheets S is formed on the stacking roll 14, the size (outer diameter) including the ceramic sheets of the stacking roll 14 increases, and the electrode circuit When 24 is formed, a change in the state of the outer shape occurs, for example, the portion is uneven. However, by interposing the intermediate peeling roll 30 between the coating roll 12 and the stacking roll 14, the positional relationship between the stacking roll 14 and the intermediate peeling roll 30, the pressure, etc. in accordance with the state change of the stacking roll 14 described above. Can be adjusted as appropriate. Thereby, it is possible to prevent the quality of the laminated structure S ′ of the ceramic sheets S formed on the stacking roll 14 from being deteriorated due to the state change of the stacking roll 14. In addition, by designing the stacking roll 14 not to contact the coating roll 12 directly, it is possible to prevent the pressurization of the stacking roll 14 from damaging the coating roll 12, and to deteriorate the quality of the ceramic sheet S and thus the electronic components. Can be prevented.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a third embodiment of the present invention will be described with reference to the drawings. In addition, while the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment and 2nd Embodiment, description of the overlapping structure and an effect is abbreviate | omitted.

  As shown in FIG. 4, the third embodiment uses a long metal belt 32 in place of the cylindrical jig of the stacking roll 14 of the second embodiment. The outer peripheral length of the long belt 32 is longer than the outer peripheral length of the coating roll 12. A laminated structure S ′ of ceramic sheets S is laminated on the long belt 32. The intermediate peeling roll 30 may be provided as necessary, and a metal long belt 32 is used instead of the cylindrical jig of the stacking roll 14 of the first embodiment that does not employ the intermediate peeling roll 30. It may be used.

  According to the third embodiment, since the outer peripheral length of the long belt 32 is longer than the outer peripheral length of the coating roll 12, it is possible to add the electrode circuit forming means 22, and the long belt by the drying and curing device 26. The drying area on 32 can be expanded. Thereby, the formation speed (including the drying speed) of the electrode circuit 24 of the ceramic sheet S laminated on the long belt 32 is increased, and as a result, the manufacturing speed of the electronic component can be increased.

10 Multilayer Electronic Component Manufacturing Equipment 12 Coating Roll (Deposition Base)
14 Stacking roll (laminated support)
16 Film forming means (film forming section)
22 Electrode circuit forming means (electrode circuit forming part)
24 Electrode circuit 30 Intermediate peeling roll (intermediate peeling part)
S Ceramic sheet S 'Laminate structure of ceramic sheet

Claims (9)

An endless continuous film-forming substrate having a mold release treatment on the outer periphery;
A deposition forming section a ceramic slurry was applied, dried for continuously forming ceramic sheets with respect to the deposition substrate,
By contacting the film-forming substrate via the ceramic sheet and continuously peeling the ceramic sheet from the film-forming substrate, and winding the ceramic sheet continuous from the film-forming part around the outer periphery A laminated support for forming a laminated structure of the ceramic sheet;
An electrode circuit forming part for forming an electrode circuit on the ceramic sheet wound around the outer periphery of the laminated support;
A multilayer electronic component manufacturing apparatus characterized by comprising: An endless continuous film-forming substrate having a mold release treatment on the outer periphery;
A deposition forming section a ceramic slurry was applied, dried for continuously forming ceramic sheets with respect to the deposition substrate,
A laminated support that forms a laminated structure of the ceramic sheet by wrapping the ceramic sheet continuous from the film forming portion around an outer periphery;
The ceramic sheet formed on the film-forming substrate is continuously peeled from the film-forming substrate, provided in contact with the film-forming substrate and the laminated support through the ceramic sheet. , An intermediate peeling portion for conveying the peeled ceramic sheet to the laminated support,
An electrode circuit forming part for forming an electrode circuit on the ceramic sheet wound around the outer periphery of the laminated support;
A multilayer electronic component manufacturing apparatus characterized by comprising:   The outer peripheral length of the film forming substrate and the outer peripheral length of the laminated support are the same length, or one of the outer peripheral length of the film forming substrate or the outer peripheral length of the laminated support is an integral multiple of the other. The multilayer electronic component manufacturing apparatus according to claim 1, wherein the apparatus is a multilayer electronic component manufacturing apparatus. When the ceramic sheet is wound around the outer periphery of the laminated support to form a laminated structure of the ceramic sheet,
4. The multilayer electronic component manufacturing apparatus according to claim 1, wherein a new ceramic sheet is continuously formed on the film-forming substrate. 5. Said electrode circuit forming portion, stacked according to any one of claims 1 to 4, wherein the is a non-plate printing apparatus that performs printing electrodes on the ceramic sheet is wound around the outer circumference of the laminated backing layer Type electronic component manufacturing equipment. A film-forming process for continuously forming a ceramic sheet by applying a ceramic slurry to the endless continuous film-forming substrate having a mold release treatment applied to the outer periphery by a film-forming part and drying it;
The ceramic sheet is continuously peeled from the film-forming substrate by bringing a laminated support into contact with the film-forming substrate via the ceramic sheet, and the ceramic sheet continuous from the film-forming part is removed. A laminated structure forming step of forming a laminated structure of the ceramic sheet by winding the outer periphery of the laminated support;
An electrode circuit forming step of forming an electrode circuit on the ceramic sheet on the laminated support by an electrode circuit forming unit while winding the ceramic sheet around the laminated support;
A method for producing a multilayer electronic component, comprising: A film forming step of forming a ceramic slurry was applied, dried for continuously forming ceramic sheets by a deposition forming section with respect to mold release treatment is endless continuous shaped deposition substrate which has been subjected to the outer periphery,
A laminated structure forming step of forming a laminated structure of the ceramic sheet by winding the ceramic sheet continuous from the film forming portion around the outer periphery of the laminated support;
Executed after the film formation step and before the laminated structure formation step, the intermediate release portion is continuously peeled from the film formation substrate, the ceramic sheet formed on the film formation substrate, A transporting step of transporting the peeled ceramic sheet to the laminated support by the intermediate peeling part;
An electrode circuit forming step of forming an electrode circuit on the ceramic sheet on the laminated support by an electrode circuit forming unit while winding the ceramic sheet around the laminated support;
A method for producing a multilayer electronic component, comprising: In the laminated structure forming step, when the ceramic sheet is wound around the outer periphery of the laminated support to form the laminated structure of the ceramic sheet,
The method for manufacturing a multilayer electronic component according to claim 6 or 7, wherein in the film formation step, a new ceramic sheet is continuously formed on the film formation substrate . As the electrode circuit forming portion, according to any one of claims 6 to 8, characterized in that it uses a non-plate printing apparatus that performs printing electrodes on the ceramic sheet wrapped around the outer periphery of the laminated support A method of manufacturing a multilayer electronic component.

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