TWI486982B - Laminated metal parts manufacturing apparatus and laminated type electronic parts manufacturing method - Google Patents

Description

Multilayer electronic component manufacturing apparatus and manufacturing method of laminated electronic component

The present invention relates to a laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component for manufacturing a laminated electronic component such as a laminated ceramic capacitor.

In general, a method for manufacturing a multilayer ceramic capacitor is to form a ceramic film on a long film, to form an internal electrode thereon, to cut it into a desired size, to peel off and stack from the film, and to repeat the process. A layered body block is formed and cut in units of parts.

On the other hand, Patent Document 1 discloses a method of manufacturing a laminated ceramic electronic component in which a plurality of ceramic green sheets obtained by forming a substrate are laminated to form a laminated body block. The component unit is formed by cutting the laminated body block to form a laminated ceramic electronic component. In the method, at least two of the plurality of ceramic green sheets constituting the laminated body block are formed on the same substrate. A specific region is formed, and the orientation of the in-plane direction of each ceramic green sheet and the position of each ceramic green sheet are substantially identical to each other.

Patent Document 2 listed below discloses a technique of continuously moving a first flexible support, coating a ceramic coating on one side of a second flexible support, and transferring the obtained undried ceramic coating layer. To the first flexible support, after the transfer, the second flexible support is peeled off from the ceramic coating layer, and the electrode is printed on the surface of the ceramic coating layer transferred onto the first flexible support to make the electrode Dry and repeat this step on the first flexible support.

Patent Document 3 listed below discloses a technique for manufacturing a laminated body for a laminated electronic component comprising a ceramic and an organic bonding material component and having a specific electrode layer formed thereon. The pattern consists of an independent green sheet which is produced by winding a separate green sheet in which a specific pattern is formed in advance on a columnar roll.

Patent Document 4 listed below discloses a technique comprising: winding a supply portion for supplying a green sheet; winding a green sheet on an outer peripheral surface to form a laminated drum of the laminated body; and detecting a rotation angle of the rotation angle of the laminated drum According to the information of the rotation angle detecting device, the internal electrode printing portion that forms the internal electrode on the green sheet wound around the laminated drum while winding the green sheet can produce the laminated body at a high speed.

Here, as a method of forming a layered body in the manufacturing process of a laminated ceramic capacitor, generally, a method is employed in which a ceramic coating film is applied onto a long film, and an internal electrode is printed thereon to be cut. Stripped from the film and stacked. In order to reduce the size and capacity of the multilayer capacitor, it is necessary to form the ceramic dielectric layer to be thinner and to increase the number of laminated layers. However, the quality of the short circuit caused by the influence of the defects on the film is caused. The proportion of bad causes will increase. Therefore, efforts are being made to make the film smoother, but this causes a problem of deterioration in operability and an increase in film cost, and it is difficult to make progress.

As a method for solving the above problems, a method of forming a ceramic green sheet by repeating the same substrate of a flat type is considered (refer to Patent Document 1). Since the defective portion is concentrated on one portion of the laminated block by using the same substrate, even if there is a projection on the substrate, the defective wafer due to the influence can be suppressed to a minimum.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-296641

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-141245

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2000-306766

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2003-217992

However, in the technique of Patent Document 1, since it is necessary to form a green sheet intermittently on a flat plate or a cylindrical substrate, a film thickness unevenness occurs in the film forming start portion and the end portion, even if a laminate is formed. Body mass, but the area where the desired quality is obtained is also narrow, and the problem of yield is large. In addition, in the step of laminating the ceramic sheets on the flat plate, each layer also requires intermittent operation, which may have the disadvantage that the production speed cannot be increased.

Further, as a method of efficiently laminating a ceramic sheet, the technique of Patent Document 2 described above is considered. The ceramic was coated on the long film and transferred to a continuous belt to obtain a laminated structure. In this method of operation, the speed can be increased without performing the intermittent operation. However, since the long substrate is used, the effect of suppressing the quality defect of the defective portion of the ceramic layer due to the substrate protrusion cannot be obtained.

Further, the above Patent Document 3 discloses the same kind of invention. This is a laminated structure formed on a cylindrical drum, and high-speed lamination can be performed by continuous operation, but the ceramic sheet is limited to a high-strength independent green sheet having no support such as a film. Although the frequency of the defective portion inherent in the independent green sheet is unknown, the sheet containing a high degree of polymerization and increasing the strength of the sheet is difficult to degrease in the firing step, thereby hindering the compactness of the ceramic after firing. The reason is therefore less practical and difficult to use in mass production.

The invention of the above-mentioned Patent Document 4 is a continuous lamination on a cylinder or a polygonal column, and an electrode circuit is formed by inkjet. However, in this case, the green sheet needs to be capable of being independently transported with high strength, and is formed as a thinner problem. The method of laminating a structure of a ceramic layer is difficult to practically apply.

Therefore, in view of the above problems, an object of the present invention is to provide a laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component, which can suppress quality defects caused by electronic components, and can be improved at low cost and by continuous operation. Manufacturing efficiency (production speed) of laminated electronic parts.

The present invention relates to a laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate having a mold release treatment on an outer circumference; and a film formation portion for coating a ceramic film on the film formation substrate a slurry which is dried to continuously form a ceramic sheet; and a build-up support which is in contact with the film formation substrate via the ceramic sheet, and the ceramic sheet is peeled off from the film formation substrate The ceramic sheet is wound around the outer circumference, thereby forming a laminated structure of the above ceramic sheet.

According to the present invention, even if a defect factor such as a protrusion is formed on the film-forming substrate, since the defect portion of the ceramic sheet thus produced is concentrated in a limited range of the laminated structure, it can be cut and divided. The quality of the electronic parts produced is less suppressed.

Further, since the ceramic sheet is continuously formed on the film-forming substrate, the stable region of the film thickness is wider than that of the batch coating, and the number of the electronic component that can be divided from the obtained laminated structure can be increased.

Since the process of forming a ceramic sheet on a film-forming substrate and the process of forming a laminated body of a ceramic sheet on a build-up support by continuous operation, ceramics can be formed with high productivity in a shorter time. A laminated structure of sheets.

In addition, it is not necessary to use a film substrate as in the past, and the intermediate material cost can be suppressed.

As described above, it is possible to suppress the quality defect of the electronic component, and it is possible to improve the manufacturing efficiency (production speed) of the laminated electronic component at a low cost and without continuous operation.

The present invention relates to a device for manufacturing a laminated electronic component, comprising: a continuous film-forming substrate having a continuous shape, wherein a release process is performed on the outer periphery; and a film formation portion for applying a ceramic slurry to the film formation substrate And drying, continuously forming a ceramic sheet; a build-up support, wherein the ceramic sheet is wound around the outer circumference to form a laminated structure of the ceramic sheet; and an intermediate peeling portion for interposing the above The ceramic sheet is provided in contact with the film formation substrate and the buildup support, and the ceramic sheet formed on the film formation substrate is peeled off from the film formation substrate, and the peeled ceramic sheet is conveyed. To the above laminated support.

According to the present invention, the peeling of the ceramic sheet from the film-forming substrate does not affect the state of the build-up support side, and stable treatment can be performed. Specifically, when the laminated support is formed into a laminated structure of a ceramic sheet, the size of the build-up support increases, and when the electrode circuit is formed, a state change in the shape such as unevenness occurs in the portion. However, since the intermediate peeling portion exists between the film-forming substrate and the build-up support, the positional relationship, pressure, and the like of the build-up support and the intermediate peeling portion can be appropriately adjusted according to the state change of the build-up support. Thereby, it is possible to prevent deterioration of the quality of the laminated structure of the ceramic sheet formed on the build-up support due to a change in the state of the build-up support. Further, since the laminated support is designed not to be in direct contact with the film-forming substrate, the contact pressure of the roll of the film-forming substrate can be reduced, so that damage of the film-forming substrate can be suppressed.

The present invention is characterized in that the outer circumference of the film formation substrate is the same length as the outer circumference of the laminate support, or the outer circumference of the film formation substrate or one of the outer circumferences of the laminate support is opposite to the other The number is an integer multiple.

In the present invention, the defective portion of the ceramic sheet due to the defect factor such as protrusions on the film-forming substrate can be concentrated in a specific region of the laminated structure. Specifically, the defective portion generated by the laminated structure of the ceramic sheet on the laminated structure can be concentrated on the same circumferential track of the laminated structure (the same row of the laminated structure when the ceramic sheet is observed from the conveying direction) . Further, when the outer circumference of the laminated support is only an integral multiple of the outer circumference of the film formation substrate, the defective portion generated by the laminated structure of the ceramic sheet on the laminated structure can be concentrated on the laminated structure. On the same coordinate (the same column and row of the laminated structure when the ceramic sheet is observed from the conveying direction).

According to the present invention, when the ceramic sheet is wound around the outer periphery of the buildup support and the laminated structure of the ceramic sheet is formed, a new ceramic sheet is continuously formed on the film formation substrate.

According to the present invention, since the laminated structure of the ceramic sheet can be formed by continuous operation instead of intermittent operation, the laminated structure of the ceramic sheet can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of the ceramic sheet can be improved.

The present invention is characterized in that the ceramic sheet is wound around the outer periphery of the buildup support to form an electrode circuit forming portion of the electrode circuit.

According to the present invention, since the ceramic sheet is wound around the laminated support, and the electrode circuit is formed on the ceramic sheet by the electrode circuit forming portion, the deformation can be prevented, and the interlayer positional accuracy of the electrode circuit can be improved. On the other hand, if the electrode circuit is formed before the ceramic sheet is laminated on the build-up support, the position of the electrode circuit between the layers is deviated due to the expansion or contraction of the ceramic sheet during winding or the change in the size of the build-up support. Hey. As a result, the mechanism involved in the lamination of the device can be omitted, the device price can be kept low, and the device can be miniaturized, and the installation area can be set small.

According to the invention, the electrode circuit forming portion is a plateless printing device that performs electrode printing on the ceramic sheet wound around the outer periphery of the buildup support.

According to the present invention, an electrode circuit which can be formed in a pattern in which each layer of the ceramic sheet is different can be formed. Further, even if the ceramic sheet is laminated on the build-up support, the expansion or contraction of the ceramic sheet or the size of the build-up support is changed, and the distance between the electrode circuits can be adjusted to form an electrode circuit having no positional deviation.

The present invention relates to a method for producing a laminated electronic component, comprising: a film forming step of applying a film to a film forming substrate having a film-forming forming portion in a ring-shaped continuous film-forming substrate having a mold release treatment on the outer periphery; a slurry which is dried to continuously form a ceramic sheet; and a laminated structure forming step of bringing the build-up support into contact with the film-forming substrate by interposing the ceramic sheet, so that the ceramic sheet is formed from the film-forming substrate The material is peeled off, and the peeled ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet.

The present invention relates to a method for producing a laminated electronic component, comprising: a film forming step of applying a film to a film forming substrate having a film-forming forming portion in a ring-shaped continuous film-forming substrate having a mold release treatment on the outer periphery; a slurry, which is continuously dried to form a ceramic sheet; a laminated structure forming step of forming the laminated structure of the ceramic sheet by winding the ceramic sheet around the outer periphery of the buildup support; and a transporting step This is performed after the film formation step and before the laminated structure forming step, and the intermediate peeling portion peels the ceramic sheet formed on the film formation substrate from the film formation substrate, and the peeled ceramic sheet is peeled off. The intermediate support portion is transported to the buildup support.

In the above-mentioned laminated structure forming step, in the case where the ceramic sheet is wound around the outer periphery of the buildup support to form the laminated body of the ceramic sheet, in the film formation step, the above-described formation The film substrate continues to form a new ceramic sheet as described above.

According to the present invention, since the laminated structure of the ceramic sheet can be formed by continuous operation instead of intermittent operation, the laminated structure of the ceramic sheet can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of the ceramic sheet can be improved.

In particular, an electrode circuit forming step of forming an electrode circuit on the ceramic sheet on the build-up support by the electrode circuit forming portion while winding the ceramic sheet on the build-up support is provided.

According to the present invention, in the electrode circuit forming step, since the ceramic sheet is wound by the build-up support, after the layer is formed, the electrode circuit is formed on the ceramic sheet by the electrode circuit forming portion, so that the deformation of the layer can be prevented, and the electrode circuit can be improved. Inter-layer positional accuracy. On the other hand, if the electrode circuit is formed before the ceramic sheet is laminated on the build-up support, the position of the electrode circuit between the layers may be deviated due to the expansion or contraction of the ceramic sheet at the time of winding or the change in the size of the build-up support. As a result, the mechanism involved in the lamination of the device can be omitted, the device price can be kept low, and the device can be miniaturized, and the installation area can be set small.

Furthermore, it is preferable to use a plateless printing apparatus that performs electrode printing on the ceramic sheet wound around the outer periphery of the buildup support as the electrode circuit forming portion.

According to the present invention, it is possible to suppress the quality defect of the electronic component, and it is possible to improve the manufacturing efficiency (production speed) of the laminated electronic component by low-cost operation without continuous operation.

A laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component according to a first embodiment of the present invention will be described with reference to the drawings. In addition, the "layered electronic component" which is a target of the present invention includes a laminated electronic component such as a laminated ceramic capacitor or a laminated ceramic inductor. Hereinafter, a laminated ceramic capacitor will be described as an example of a laminated electronic component.

First, a laminated electronic component manufacturing apparatus will be described.

As shown in Fig. 1, the laminated electronic component manufacturing apparatus 10 mainly includes a coating roll 12 (film forming substrate) on which a mold release treatment is performed on a surface (outer peripheral surface) to form a ceramic sheet S; and self-coating The ceramic sheet S from which the roll 12 is peeled off is wound to form a stacking roll 14 (layered support) of the laminated structure S' of the ceramic sheet S.

A film forming mechanism 16 (film forming portion) for applying a ceramic slurry which is a material of the ceramic sheet S to the surface of the coating roller 12 is disposed in the vicinity of the coating roller 12; 16 a liquid supply mechanism 18 for supplying a ceramic slurry; and a drying and hardening device 20 for drying and solidifying the ceramic slurry on the surface of the coating roller 12. The functions of the constituent members are for forming a ceramic sheet S on the surface of the coating roller 12.

In the vicinity of the stacking roller 14, an electrode circuit forming mechanism 22 (electrode circuit forming portion) for forming the electrode circuit 24 on the ceramic sheet S wound on the surface of the stacking roller 14 is disposed; and for making the electrode circuit 24 Dry drying and hardening device 26. The functions of the constituent members are for forming the electrode circuit 24 on the ceramic sheet S wound around the stacking roller 14.

Specifically, the application roller 12 is a rigid body roller (cylindrical or cylindrical) made of a metal having a release treatment on the surface thereof, and is composed of a substrate having a continuous annular shape. The coating roller 12 is configured to be rotationally driven by a driving source (not shown). In addition, the mold release treatment corresponds to, for example, a fluorine plating treatment.

The stacking roller 14 is formed by adhering an elastic body (for example, an elastic film, a rubber, a viscous sheet, or the like) to a peripheral surface of a detachable metal cylindrical jig. The cylinder jig is attached to the rotating shaft to rotate in synchronization with the coating roller 12. Further, the stacking roller 14 may be configured to be rotationally driven by a driving source (not shown), or may be configured to be rotated by the rotational force of the coating roller 12. The stacking roller 14 is pressed against the coating roller 12 by a specific pressure (pressing force) by a pressure applying mechanism (not shown). The surface of the elastomer holds the ceramic sheet S by adhesion, electrostatic adsorption or the like. Further, the mutually overlapping sheet layers of the ceramic sheets S wound by the stacking rolls 14 are crimped to each other and held to each other. Since the force of the holding is set larger than the force by which the coating roller 12 holds the ceramic sheet S, the ceramic sheet S is peeled off from the coating roller 12 and transferred to the stacking roller 14.

In order to reliably transfer the ceramic sheet S from the coating roller 12 to the stacking roller 14, it is preferable to transfer the stacking roller 14 while appropriately pressing the stacking roller 14 to the coating roller 12. It is assumed that if there is a space between the coating roller 12 and the stacking roller 14, a section in which the ceramic sheet S being conveyed is not supported by other members is formed, and the sheet may be broken in this section. Therefore, the stacking roller 14 is appropriately pressed toward the coating roller 12 so that a section in which the ceramic sheet S is not supported is not formed. The surface of the stacking roller 14 is elastic so that mechanical distortion is not generated when pressed.

Here, it is preferable that the outer circumference of the coating roller 12 is the same length as the outer circumference of the stacking roller 14, or the outer circumference of the coating roller 12 or one of the outer circumferences of the stacking roller 14 is an integer relative to the other one. Times.

As the film forming mechanism 16, for example, a die coater, a doctor blade, a roll coater, an inkjet type coater or the like can be suitably used. Further, in order to make the thickness of the ceramic sheet S formed on the outer peripheral surface of the coating roll 12 thinner, it is preferable to provide an upstream pressure reducing mechanism to the die coater. The ceramic slurry is applied to the coating roller 12 continuously (non-intermittently) from the film forming mechanism 16 to form a ceramic sheet S. In this manner, the ceramic slurry is continuously supplied to the same coating roll 12.

As the liquid supply mechanism 18, for example, a cylinder type dispenser is employed. Further, the liquid supply mechanism 18 is not limited to the cylinder type distributor, and a gear pump, a diaphragm pump, or the like may be suitably used.

As the electrode circuit forming mechanism 22, for example, an inkjet printing device is employed. The electrode circuit forming mechanism 22 is preferably a plateless printing mechanism, but may be a transfer of the dried electrode circuit 24, or a gravure printing or a gravure offset printing. The electrode material ink used in the electrode circuit forming mechanism 22 can be, for example, a material for dissolving and dispersing Ni powder (nickel powder) and a resin in an organic solvent. It is also possible to use a material in which a Ni powder is dispersed in a UV curable resin. In particular, it is preferred to use a solvent having a low swelling wettability with respect to the ceramic coating film. Further, the solvent may be water.

As the drying and hardening devices 20 and 26, for example, a method of drying by hot air, a method of heating the outer circumferential surface of the coating roll 12 or the stacking roll 14, or vacuum drying may be employed. In the case of using a UV curable resin, it may be irradiated with UV to harden it. The drying and hardening devices 20, 26 are used to dry or harden the coated ceramic paste or electrode material ink.

As the ceramic slurry, for example, a material in which a ceramic powder and a resin are dissolved and dissolved in an organic solvent can be used. It is also possible to use a material in which a ceramic powder is dispersed in a UV hardening resin. Further, the solvent may be water.

Next, a method of manufacturing the laminated structure S' of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 will be described.

The coating roll 12 subjected to the release treatment is rotated at a specific speed, and the ceramic slurry is applied to the outer peripheral surface thereof by the film forming mechanism 16. Further, the supply of the ceramic slurry is performed using the liquid supply mechanism 18. Then, the ceramic slurry on the coating roll 12 is dried and hardened using the drying and hardening device 20. Here, in order to dry the ceramic slurry by the drying and hardening device 20, the temperature is adjusted using hot air of a specific temperature so that the outer peripheral surface of the coating roller 12 becomes an appropriate temperature. Further, the temperatures can be appropriately adjusted according to the material of the ceramic sheet S.

Next, the stacking roller 14 is brought into pressure contact with the coating roller 12 via the ceramic sheet S with a specific applied pressure. Further, the above-described pressing force needs to be appropriately adjusted in accordance with the material of the ceramic sheet S. Then, the dried ceramic sheet S formed on the outer peripheral surface of the coating roll 12 is peeled off from the outer peripheral surface of the coating roll 12, transferred, and wound onto the outer peripheral surface of the stacking roll 14. Here, since the release treatment is performed on the outer peripheral surface of the coating roller 12, and the stacking roller 14 is in contact with the coating roller 12 with a specific pressing force to block the ceramic sheet S, it is formed on the outer circumference of the coating roller 12. The dried ceramic sheet S is easily peeled off from the outer peripheral surface of the coating roll 12 and transferred to the outer peripheral surface of the stacking roll 14. The stacking roller 14 is wound with an elastic resin film on the outer peripheral surface of the cylindrical jig made of metal, and the temperature of the outer peripheral surface thereof is temperature-adjusted by a heating and cooling mechanism to have a specific temperature. Further, the temperature of the outer peripheral surface needs to be appropriately adjusted in accordance with the material of the ceramic sheet S.

After the ceramic sheet S of the specific layer is wound by the stacking roller 14, the electrode material forming means 22 applies the electrode material ink to the ceramic sheet S, and the electrode circuit (internal electrode circuit) 24 of the specific pattern is printed. After the electrode circuit 24 is printed, warm air is blown from the drying and hardening device 26, and the electrode circuit 24 is dried. Thereby, the electrode circuit 24 is formed in a plurality of layers (a plurality of layers overlapping in the radial direction) of the ceramic sheet S wound around the stacking roller 14. At this time, in the manufacture of the multilayer capacitor, the pattern pattern is changed to perform electrode printing, so that the electrode circuits 24 of the respective layers (each circumference) are opposed electrodes. In this manner, the electrode circuit layer of the specific layer is formed, and then the electrode printing by the electrode circuit forming mechanism 22 is stopped, and then the ceramic sheet S of the specific layer is wound around the stacking roller 14. Thereafter, the ceramic sheet S is wound around the stacking roller 14 to form a laminated structure S' of the ceramic sheet S.

Further, the laminated structure S' of the ceramic sheet S formed on the stacking roll 14 is removed together with the cylindrical jig, held in a cylindrical shape, pressed and pressed, and cut into a wafer shape by a cutter. Thereafter, a multilayer ceramic capacitor is produced by a usual manufacturing process such as firing and forming an electrode circuit (external electrode circuit).

According to the laminated electronic component manufacturing apparatus and the method of manufacturing a laminated electronic component according to the first embodiment, when the outer surface of the coating roller 12 has minute scratches or protrusions, the applied ceramic sheet S is produced. The defective portion 28 is repeated, but by repeatedly using the same coating roller 12, the laminated structure S' wound in the cylindrical shape on the stacking roller 14 allows the defective portion 28 to be concentrated in a limited region. In the electronic component obtained by cutting and dividing the laminated structure S' of the ceramic sheet S thus obtained, quality defects can be suppressed.

In addition, when the ceramic sheet S is peeled off from the coating roll 12 and wound around the stacking roll 14 to form the laminated structure S' of the ceramic sheet S, since the coating roll 12 is continuously formed with the new ceramic sheet S, Therefore, the ceramic sheet S is formed on the coating roller 12, and the laminated structure S' in which the ceramic sheet S is formed in the stacking roller 14 is simultaneously performed. By this, the ceramic sheet S can be continuously formed without temporarily stopping the rotational driving of the coating roller 12, and the laminated structure S' of the ceramic sheet S can be continuously produced without temporarily stopping the rotational driving of the stacking roller 14. In this manner, the laminated structure S' of the ceramic sheet S can be formed by continuous operation instead of intermittent operation. As a result, the laminated structure S' of the ceramic sheet S can be formed in a very short time, and the manufacturing efficiency of the laminated structure S' of the ceramic sheet S can be improved.

Further, since the ceramic sheet S is formed on the coating roll 12 as a rigid body and held to the laminated portion, even if a thin, low-strength ceramic sheet S is used, cracking or damage of the ceramic sheet S can be suppressed. . As a result, the operability of the thin, low-strength ceramic sheet S can be improved.

Further, as shown in FIG. 1, by making the circumference of the coating roller 12 and the stacking roller 14 the same or one of the other, as shown in FIG. 2, the defect portion 28 can be further concentrated on a specific portion. . When the outer circumference does not become an integer ratio, the defective portion 28 generated by the laminated structure S' of the ceramic sheet S on the stacking roller 14 is concentrated on the same circumferential track of the stacking roller 14 (the ceramic sheet S is observed from the conveying direction) The same row of the layered structure at the time). Further, when the outer circumference of the stacking roller 14 is an integral multiple of the outer circumference of the coating roller 12, the defective portion 28 generated by the laminated structure S' of the ceramic sheet S on the stacking roller 14 can be concentrated on the stack. The same column of the roller 14 (the same column and row of the laminated structure when the ceramic sheet S is observed from the conveying direction).

Further, the film thickness of the ceramic sheet S can be made uniform as compared with the known method of intermittent coating using a ceramic slurry, and a high productivity can be obtained. In other words, since the laminated structure S' of the ceramic sheet S is continuously formed into a cylindrical shape, the stable region of the film thickness is wider than that of the intermittent coating. As a result, stable electronic parts can be obtained from the laminated structure S' of the ceramic sheet S. The number of electronic parts that can be obtained per unit volume of the laminated structure of the ceramic sheet S is increased.

Further, in the present embodiment, it is not necessary to use an intermediate consumable material of a base material (PET (polyethylene terephthalate) film or the like) which is discarded after use, and the lamination of the ceramic sheet S can be greatly reduced. The manufacturing cost of the structure S' and further electronic parts.

Further, in the present embodiment, since the ceramic sheet S is formed without using a film, the operation of the film required by the prior art is not required, and the electrode sheet is formed after the ceramic sheet S is laminated on the stacking roller 14. Therefore, it is not necessary to laminate the positioning, and the equipment of the laminated electronic component manufacturing apparatus 10 can be made compact (the positioning mechanism is omitted), and the price of the equipment can be drastically reduced.

Further, the formation of the electrode circuit 24 is performed by a plateless printing operation method such as inkjet, whereby the electrode circuit 24 including the different electrode patterns in each layer of the ceramic sheet S can be formed. In particular, since the electrode sheet 24 is formed after the ceramic sheet S is laminated on the stacking roller 14, even if the lamination of the ceramic sheet S is performed, the ceramic sheet S is deformed or the outer diameter of the stacking roller S is increased, and the circumference is increased. Increasing, but the distance (interval) between the electrode circuits 24 can be appropriately adjusted to form the electrode circuit 24 without positional deviation.

Next, a laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component according to a second embodiment of the present invention will be described with reference to the drawings. The same components as those in the first embodiment are denoted by the same reference numerals, and the description of the overlapping structures and the effects will be omitted.

As shown in Fig. 3, in the second embodiment, the application roller 12 and the stacking roller 14 are indirectly connected via the intermediate peeling roller 30 (intermediate peeling portion). That is, the application roller 12 is in contact with the intermediate peeling roller 30, and the intermediate peeling roller 30 is in contact with the stacking roller 14.

The intermediate peeling roller 30 has a function of peeling the ceramic sheet S from the coating roller 12 by a method such as adhesion and transferring it to the stacking roller 14. The material of the intermediate peeling roller 30 may be resin or metal, and is not particularly limited. Since the force of the intermediate peeling roller 30 to hold the ceramic sheet S is set larger than the force of the coating roller 12 to hold the ceramic sheet S, and is smaller than the force by which the stacking roller 14 holds the ceramic sheet S, the ceramic sheet S is self-coated roller 12 It is peeled off and held by the intermediate peeling roller 30, and then transferred to the stacking roller 14. Further, the intermediate peeling roller 30 may be a peeling holding roller that adsorbs (sucks or electrostatically adsorbs) the ceramic sheet S from the coating roller 12 and peels and holds it. At this time, it is preferable that the intermediate peeling roller 30 is configured to control the arc portion to be adsorbed and the arc portion not to be adsorbed. When the ceramic sheet S is peeled off from the coating roller 12, a specific portion of the intermediate peeling roller 30 that is in contact with the ceramic sheet S has an adsorption function, and when the peeled ceramic sheet S is transferred to the stacking roller 14, The specific portion of the intermediate peeling roller 30 that is in contact with the ceramic sheet S has a region that is not adsorbed, whereby the peeling and transfer of the ceramic sheet S can be smoothly performed.

According to the second embodiment, the peeling of the ceramic sheet S from the coating roller 12 does not affect the state of the stacking roller 14 side, and stable operation can be performed. Specifically, when the laminated structure S' of the ceramic sheet S is formed in the stacking roller 14, the size (outer diameter) of the ceramic sheet including the stacking roller 14 is increased, and in the case of forming the electrode circuit 24, There will be a state change in the shape of the portion such as unevenness. However, by inserting the intermediate peeling roller 30 between the coating roller 12 and the stacking roller 14, the positional relationship, pressure, and the like of the stacking roller 14 and the intermediate peeling roller 30 can be appropriately adjusted according to the state change of the stacking roller 14 described above. Thereby, deterioration of the quality of the laminated structure S' of the ceramic sheet S formed on the stacking roller 14 due to the state change of the stacking roller 14 can be prevented. Further, by designing the stacking roller 14 and the coating roller 12 not to be in direct contact with each other, it is possible to prevent the coating roller 12 from being damaged by the pressurization of the stacking roller 14, and it is possible to prevent deterioration of the quality of the ceramic sheet S and further the electronic component.

Next, a laminated electronic component manufacturing apparatus and a method of manufacturing a laminated electronic component according to a third embodiment of the present invention will be described with reference to the drawings. The same components as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and the description of the overlapping structure and operation will be omitted.

As shown in Fig. 4, in the third embodiment, a metal strip 32 is used instead of the cylindrical jig of the stacking roller 14 of the second embodiment. The outer circumference of the long strip 32 is longer than the outer circumference of the coating roll 12. A laminated structure S' of the ceramic sheet S is laminated on the long strip 32. Further, the intermediate peeling roller 30 may be provided as needed, and a metal long strip 32 may be used instead of the cylindrical jig of the stacking roller 14 of the first embodiment which does not employ the intermediate peeling roller 30.

According to the third embodiment, since the outer circumference of the long strip 32 is longer than the outer circumference of the application roller 12, the electrode circuit forming mechanism 22 can be additionally provided, and the drying hardening device 26 can be extended on the long strip 32. Dry area. Thereby, the forming speed (including the drying speed) of the electrode circuit 24 of the ceramic sheet S laminated on the long strip 32 is increased, and the manufacturing speed of the electronic component can be improved.

10. . . Laminated electronic component manufacturing device

12. . . Coating roll (film forming substrate)

14. . . Stacking roll (layered support)

16. . . Film forming mechanism (film forming portion)

18. . . Liquid supply mechanism

20. . . Drying and hardening device

twenty two. . . Electrode circuit forming mechanism (electrode circuit forming portion)

twenty four. . . Electrode circuit

26. . . Drying and hardening device

30. . . Intermediate peeling roller (intermediate peeling part)

S. . . Ceramic sheet

S'. . . Laminated structure of ceramic sheet

1 is an explanatory view of a laminated electronic component manufacturing apparatus according to a first embodiment of the present invention.

Fig. 2 is an explanatory view showing the position of a defective portion on a ceramic sheet.

FIG. 3 is an explanatory view of a laminated electronic component manufacturing apparatus according to a second embodiment of the present invention.

FIG. 4 is an explanatory view of a laminated electronic component manufacturing apparatus according to a third embodiment of the present invention.

10. . . Laminated electronic component manufacturing device

12. . . Coating roll (film forming substrate)

14. . . Stacking roll (layered support)

16. . . Film forming mechanism (film forming portion)

18. . . Liquid supply mechanism

20. . . Drying and hardening device

twenty two. . . Electrode circuit forming mechanism (electrode circuit forming portion)

twenty four. . . Electrode circuit

26. . . Drying and hardening device

S. . . Ceramic sheet

S'. . . Laminated structure of ceramic sheet

Claims (13)

A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate which is subjected to a mold release treatment on an outer peripheral surface; and a film formation portion which coats a surface of the film formation substrate a ceramic slurry which is dried to continuously form a ceramic sheet; and a build-up support which is in contact with the film-forming substrate via the ceramic sheet, so that the dried ceramic sheet is continuous from the film-forming substrate The peeling is performed by winding the ceramic sheet continuous from the film forming portion on the outer circumference to form a laminated structure of the ceramic sheet, wherein the surface of the film forming substrate from which the ceramic sheet has been peeled off is formed over the surface. Ceramic sheet. A laminated electronic component manufacturing apparatus comprising: a continuous annular film-forming substrate which is subjected to a mold release treatment on an outer peripheral surface; and a film formation portion which coats a surface of the film formation substrate The ceramic slurry is dried to continuously form a ceramic sheet; and the build-up support is formed by winding the ceramic sheet continuous from the film formation portion on the outer circumference to form a laminated structure of the ceramic sheet. And an intermediate peeling portion which is provided in contact with the film formation substrate and the buildup support body, and the ceramic sheet formed on the film formation substrate is continuously peeled off from the film formation substrate And maintaining, transporting the peeled and held ceramic sheet to the laminated support, The ceramic sheet is repeatedly formed on the surface of the film-forming substrate from which the ceramic sheet has been peeled off. The apparatus for manufacturing a laminated electronic component according to claim 1, wherein the outer circumference of the film formation substrate is the same length as the outer circumference of the buildup support, or the outer circumference of the film formation substrate or the outer circumference of the laminate support One is an integer multiple of the other. The apparatus for manufacturing a laminated electronic component according to claim 2, wherein the outer circumference of the film formation substrate is the same length as the outer circumference of the laminate support, or the outer circumference of the film formation substrate or the outer circumference of the laminate support One is an integer multiple of the other. The laminated electronic component manufacturing apparatus according to any one of claims 1 to 4, wherein, when the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet, the film forming substrate is formed. A new ceramic sheet as described above is continuously formed. The laminated electronic component manufacturing apparatus according to any one of claims 1 to 4, comprising an electrode circuit forming portion of the ceramic sheet forming electrode circuit wound around the outer periphery of the buildup support. The apparatus for manufacturing a laminated electronic component according to claim 6, wherein the electrode circuit forming portion is a plateless printing device that performs electrode printing on the ceramic sheet wound around the outer periphery of the buildup support. A method for producing a laminated electronic component, comprising: a film forming step of applying a ceramic to a surface of a film-forming substrate having a ring-shaped continuous shape having a release treatment on an outer peripheral surface; Slurry, drying it to continuously form a ceramic sheet; a laminated structure forming step of continuously contacting the dried ceramic sheet from the film forming substrate by contacting the laminated support with the ceramic substrate to form the laminated support from the film forming substrate The ceramic sheet continuous in the film forming portion is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet, wherein the ceramic sheet is repeatedly formed on the surface of the film-forming substrate from which the ceramic sheet has been peeled off. material. A method for producing a laminated electronic component, comprising: a film forming step of applying a ceramic to a surface of a film-forming substrate having a ring-shaped continuous shape having a release treatment on an outer peripheral surface; The slurry is dried to continuously form a ceramic sheet; and the laminated structure is formed by winding the ceramic sheet continuous from the film forming portion around the outer periphery of the buildup support to form the ceramic sheet a laminated structure; and a transporting step performed after the film forming step and before the laminated structure forming step, wherein the intermediate peeling portion continuously forms the ceramic sheet formed on the film forming substrate from the film forming substrate After peeling and holding, the ceramic sheet which is peeled off and held is transported to the buildup support by the intermediate peeling portion. The method of manufacturing a laminated electronic component according to claim 8, wherein in the step of forming the laminated structure, when the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet, In the film formation step described above, a new ceramic sheet is continuously formed on the film formation substrate. The method of manufacturing a laminated electronic component according to claim 9, wherein in the step of forming the laminated structure, when the ceramic sheet is wound around the outer periphery of the buildup support to form a laminated structure of the ceramic sheet, In the film formation step described above, a new ceramic sheet is continuously formed on the film formation substrate. The method for producing a laminated electronic component according to any one of claims 8 to 11, comprising: winding the ceramic sheet on the build-up support, and the ceramic on the build-up support by an electrode circuit forming portion; The sheet forms an electrode circuit forming step of the electrode circuit. The method of manufacturing a laminated electronic component according to claim 12, wherein the electrode circuit forming portion is a plateless printing device that performs electrode printing on the ceramic sheet wound around the outer periphery of the buildup support.