KR101248498B1 - Apparatus and method for manufacturing laminated electronic component - Google Patents

Abstract

[PROBLEMS] To provide a miniaturized electronic component manufacturing apparatus capable of miniaturizing and reducing the cost and producing a high quality laminated electronic component with high efficiency.
[Solving means] The sheet conveying member 12 which continuously conveys the ceramic sheet S in a predetermined direction, the sheet cutting member 14 which cuts the ceramic sheet S to a predetermined length, and the sheet cutting member 14 Sheet laminated member 18 to which the cutting pieces ST1 and ST2 of the ceramic sheet S cut | disconnected by the predetermined length by (), and the ceramic sheet cut | disconnected to predetermined length by the sheet cutting member 14 The plurality of sheet transfer members 16A and 16B which peel the cut pieces ST1 and ST2 from the sheet conveying member 12 and transfer the cut pieces ST1 and ST2 of the ceramic sheet S to the sheet stacking member 18. One sheet transfer member 16A and the other sheet transfer member 16B are laminated by alternately transferring the cut pieces ST1 and ST2 of the ceramic sheet S.

Description

Apparatus for manufacturing a multilayer electronic component and a method for manufacturing a multilayer electronic component {APPARATUS AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component manufacturing apparatus and a method for manufacturing a multilayer electronic component for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

In the prior art of the patent document 1, in the manufacturing method of a multilayer ceramic capacitor, the ceramic green sheet of the mother body supported by the carrier film is supplied, and it is peeled off with a suction roll, and the ceramic green sheet of the mother is applied to a flat stage with high precision by the transfer / compression method. Lamination | stacking is obtained. In the prior art of this patent document 1, long ceramic green sheets cannot be continuously supplied, and it is necessary to supply them intermittently.

The prior art of patent document 2 supplies the ceramic green sheet by which the internal electrode was printed to the ceramic green sheet shape | molded on the roll in the manufacturing method of a laminated ceramic capacitor, laminated | stacked on a flat plate through sheet handling on a roller, and a laminated body Get In the prior art of this Patent Document 2, the formation of the ceramic green sheet and the formation of the internal electrodes cannot be continuously processed, and it is necessary to stop every predetermined size.

Japanese Patent Laid-Open No. 2005-217278 Japanese Patent Laid-Open No. 2004-296641

However, in the prior art of the patent document 1, when laminating the ceramic green sheet on the rectangular lamination stage, the operation of peeling the supplied ceramic green sheet with the suction roll and the lamination stage from the suction roll cannot be performed simultaneously. Each operation becomes an intermittent operation. In order to make the supply of the ceramic green sheet intermittent operation, it is necessary to operate the supply reel itself intermittently, or to have a buffer portion between the continuously rotating supply reel and the peeling part in the suction roll. As a result, the volume increases, and the energy consumption such as electric power also increases. In addition, factors of quality variation due to the intermittent operation (wounds, distortions during the transfer and peeling of the ceramic green sheet, lamination position shift due to handling miss, and contamination due to scattering of cutting debris) are generated. In addition, since the weight of the suction roll is heavy here, the inertia at the time of acceleration / deceleration is large and it is difficult to speed up. And lamination shift | offset | difference occurs.

On the other hand, in the prior art of the said patent document 2, when it is set as the process containing ceramic green sheet formation and internal electrode formation, ceramic green sheet formation in the lamination process in the operation of laminating the ceramic green sheet formation and electrode formation to a rectangular laminated body is carried out. The feeding of the sheet becomes an intermittent operation. As a result, when the ceramic green sheet formation and the internal electrode formation are stopped for each layer, the material loss and quality deviation (starting from the start of formation in each forming step until reaching a continuous stable state) (green sheet film thickness, electrode film Thickness, electrode area variation) and sheet line are generated. In addition, the intermittent operation increases energy consumption such as power. Moreover, since the weight of a roll is heavy, inertia at the time of acceleration / deceleration is large and it is difficult to speed up.

Accordingly, an object of the present invention is to provide a laminated electronic component manufacturing apparatus and a method for manufacturing a laminated electronic component, which are capable of simplifying, miniaturizing, and reducing the cost of equipment and efficiently manufacturing high quality laminated electronic components in view of the above problems. will be.

The present invention provides a sheet conveying member for continuously conveying a ceramic sheet in a predetermined direction, a sheet cutting member for cutting the ceramic sheet to a predetermined length, and cutting of the ceramic sheet cut to a predetermined length by the sheet cutting member. A plurality of sheets for laminating the sheet laminating member on which the pieces are laminated and the cut pieces of the ceramic sheet cut into the predetermined length by the sheet cutting member from the sheet conveying member to transfer the cut pieces of the ceramic sheet to the sheet laminating member. One sheet transfer member and the other sheet transfer member alternately transfer the cut pieces of the ceramic sheet to be laminated.

According to this structure, the cut piece of the ceramic sheet cut | disconnected by the sheet | seat cutting member is peeled from the sheet conveying member, and is transferred to the sheet | seat lamination | stacking member by one sheet transfer member among the some sheet | seat transfer member. And the cut piece of the ceramic sheet cut | disconnected by the sheet cutting member by the other sheet transfer member among the some sheet transfer member is peeled from the sheet conveying member, and is transferred to the cut piece of the ceramic sheet already transferred to the sheet | seat lamination member. do. In this way, the cut pieces of the ceramic sheet are alternately transferred and laminated by the operation of one sheet transfer member and the other sheet transfer member.

According to this invention, a ceramic sheet can be laminated | stacked on one sheet | seat laminated member, without supplying continuously. As a result, the buffer mechanism and the part requiring acceleration / deceleration are unnecessary, so that the device cost can be reduced, and the device size can be reduced, and power consumption such as power can be reduced. Moreover, since each process is performed at substantially constant speed, damage to a ceramic sheet | seat, distortion, handling miss, and cutting debris can be reduced, and the lamination | stacking precision can be improved by reducing the deviation of conveyance positioning. In addition, it is easy to improve the production line speed by reducing the problems in terms of equipment and quality.

Moreover, the electrode circuit is formed in the ceramic sheet by the electrode circuit forming portion while the electrode circuit forming portion is formed in the ceramic sheet to form an electrode circuit and the conveyance of the ceramic sheet by the sheet conveying member is continued. It is preferable.

According to this structure, an electrode circuit is formed in a ceramic sheet by an electrode circuit formation part in the state in which conveyance of a ceramic sheet by a sheet conveyance member is continuing. This enables continuous printing of the electrode circuit.

Moreover, the dielectric coating film formation part which has a dielectric coating film formation part which forms a dielectric coating film in the step part of the said ceramic sheet which arises by formation of the said electrode circuit, is carrying out the conveyance of the said ceramic sheet | seat by the said sheet conveying member is continued. Preferably, the dielectric coating film is formed on the stepped portion.

According to this structure, a dielectric coating film is formed in the step part of a ceramic sheet by the dielectric coating film forming part in the state in which conveyance of a ceramic sheet by a sheet conveying member is continuing. Thereby, since the formation process of a dielectric coating film is performed by the sheet conveyance member in the state which conveyance of a ceramic sheet is continuing, continuous printing of a dielectric coating film is attained. As a result, compared to the case where the dielectric coating film is formed in a separate process and at an independent time, the laminated structure in which the ceramic sheet is laminated, and further, the quality variation of the electronic component can be reduced, the line speed can be improved, and the material loss can be reduced. Done. In addition, the overall device cost can be reduced, and the device size can be reduced, and the energy consumption can be reduced.

The electrode circuit forming portion or the dielectric coating film forming portion is preferably a plateless printing apparatus.

According to this structure, the electrode circuit and dielectric coating film of a different pattern can be formed easily and at high speed for each layer of the cut piece of a ceramic sheet | seat. In addition, even if an error occurs in the positional control of the sheet lamination member, the pitch between the electrode circuits and the dielectric coating film can be freely adjusted to form the electrode circuit and the dielectric coating film without any position shift. As a result, complicated equipment becomes unnecessary, and the cost of new equipment investment can be reduced.

Moreover, it has a film-forming formation part which apply | coats a ceramic slurry to the said sheet conveyance member, and forms the said ceramic sheet, The said ceramic sheet | seat by the said several sheet transfer member in the state in which formation of the said ceramic sheet | seat by the said film-forming formation part is continuing. It is preferable that transfer of the said cutting piece of is performed.

According to this configuration, transfer of the cut pieces of the ceramic sheet by the plurality of sheet transfer members is performed while the formation of the ceramic sheet by the film formation forming portion is continued. This enables continuous formation of the ceramic sheet and continuous transfer of the cut pieces of the ceramic sheet. For this reason, it becomes possible to manufacture the laminated structure of a ceramic sheet by a continuous series of process. As a result, compared with the case where the formation of the ceramic sheet by the film-forming part and the transfer of the cut pieces of the ceramic sheet by the plurality of sheet transfer members are performed in separate processes and at independent times, the laminated structure of the ceramic sheet, It is possible to reduce the quality variation of the electronic components, to improve the line speed, and to reduce the material loss. In addition, the overall device cost can be reduced, and the device size can be reduced, and the energy consumption can be reduced.

The present invention also provides a sheet conveying step of continuously conveying a ceramic sheet in a predetermined direction by a sheet conveying member, a sheet cutting process of cutting the ceramic sheet into a predetermined length by a sheet cutting member, and the sheet cutting member. And a sheet transfer step of peeling the cut piece of the ceramic sheet cut into a predetermined length by the plurality of sheet transfer members from the sheet conveying member and transferring the sheet to the sheet lamination member. The sheet transfer member on the other side of the member is a method of manufacturing a laminated electronic component, wherein the cut pieces of the ceramic sheet are alternately transferred to and laminated on the sheet stacking member.

The electrode sheet has an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming unit in the ceramic sheet, and in the electrode circuit forming step, the electrode circuit is formed while the transfer of the ceramic sheet by the sheet conveying member is continued. Preferably, the electrode circuit is formed on the ceramic sheet.

A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion at a step portion of the ceramic sheet caused by the formation of the electrode circuit, and in the dielectric coating film forming step, is performed by the sheet conveying member. It is preferable that the said dielectric coating film is formed in the said step part by the said dielectric coating film forming part in the state which conveyance of the said ceramic sheet is continuing.

In the electrode circuit forming step or the dielectric coating film forming step, it is preferable to use a plateless printing apparatus as the electrode circuit forming part or the dielectric coating film forming part.

Moreover, it has a film-forming formation process which forms a ceramic sheet by apply | coating a ceramic slurry to the said sheet conveyance member by the film-forming formation part, and the formation of the said ceramic sheet by the said film-forming formation part is continuing in the said film-forming formation process. It is preferable that transfer of the cut pieces of the ceramic sheet by the plurality of sheet transfer members is performed.

EFFECTS OF THE INVENTION [

According to the present invention, it is possible to reduce the size and cost of equipment and to manufacture high quality laminated electronic components efficiently.

1 is a configuration diagram of a laminated electronic component manufacturing apparatus according to a first embodiment of the present invention.
It is a block diagram of the laminated electronic component manufacturing apparatus by 2nd Embodiment of this invention.
3 is an explanatory diagram showing a step portion (concave portion) generated between electrode circuits on a ceramic sheet.
4 is an explanatory diagram showing an electrode circuit and a dielectric coating film on a ceramic sheet.
It is a block diagram of the laminated electronic component manufacturing apparatus by 3rd Embodiment of this invention.
6 is a timing chart when the cut pieces of the ceramic sheet are laminated on the sheet lamination members using the sheet transfer member of the present invention.

EMBODIMENT OF THE INVENTION The laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 1st Embodiment of this invention are demonstrated with reference to drawings. In addition, the "layered electronic component" which this invention makes object includes laminated electronic components, such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component.

First, the laminated electronic component manufacturing apparatus is demonstrated.

Moreover, 1st Embodiment is a form in which the long ceramic sheet in which the electrode circuit (internal electrode) and the dielectric coating film were already formed is conveyed continuously (nonintermittently) to the following sheet conveying roll.

As shown in FIG. 1, the laminated electronic component manufacturing apparatus 10 mainly contains the sheet conveying roll 12 (sheet conveying member) which conveys a ceramic sheet S (ceramic green sheet) and a base film, The cutting mechanism 14 (sheet cutting member) which cuts the ceramic sheet S to predetermined | prescribed length, and the ceramic sheet S conveyed by the sheet conveying roll 12 from the outer peripheral surface of the sheet conveying roll 12 The first peeling roll 16A and the second peeling roll 16B (sheet transfer member) to be peeled off are cut into a predetermined length by the cutting mechanism 14 and further peeled off by the peeling rolls 16A and 16B. The cutting pieces ST1 and ST2 of the ceramic sheet S are laminated | stacked, and it has the flat laminated | stacked stage 18 (sheet laminated member) in which the laminated structure of ceramic sheet S is formed. The mold release process is given to the surface of a base film.

Specifically, the sheet conveying roll 12 is composed of a rigid roll (cylindrical or cylindrical). The sheet conveying roll 12 is comprised so that rotation drive may be carried out by the rotation drive mechanism not shown.

The cutting mechanism 14 attaches a blade to the cutting roller which rotates by a rotation drive mechanism not shown, for example, is close to the sheet conveying roll 12, and rotates at about the same circumferential speed, and the sheet conveying roll 12 is carried out. It is used to cut the ceramic sheet S of the image at a predetermined cutting position. Alternatively, the cutting mechanism 14 may be provided such that the blade is linearly reciprocated by a linear drive mechanism (not shown). In this case, the ceramic sheet S conveyed on the sheet conveying roll 12 is cut | disconnected at a predetermined cutting position by a linear reciprocation of a blade.

The 1st peeling roll 16A and the 2nd peeling roll 16B have the mechanism (means) which hold | maintain cut pieces ST1, ST2 of the ceramic sheet S on a roll. As a mechanism for holding the cut pieces ST1 and ST2 of the ceramic sheet S on a roll, for example, cutting of the ceramic sheet S such as a vacuum suction mechanism, close contact by pressure and temperature, close contact by static electricity (electrostatic adsorption), and the like. It does not matter in particular if it is a means or a mechanism which can adsorb | suck piece ST1, ST2.

In addition, the position which adjoins the lamination stage 18 from the position (peeling position) which adjoins the sheet | seat conveying roll 12 with the moving apparatus which is not shown in figure, the 1st peeling roll 16A and the 2nd peeling roll 16B is carried out. The transfer position) is configured to be freely movable (for example, linear movement). Accordingly, the first peeling roll 16A and the second peeling roll 16B peel off the cut pieces ST1 and ST2 of the ceramic sheet S on the sheet conveying roll 12 to be transferred onto the lamination stage 18. It becomes possible to make it.

In addition, the 1st peeling roll 16A and the 2nd peeling roll 16B are provided so that rotation is possible by the rotation drive mechanism which is not shown in figure. The 1st peeling roll 16A and the 2nd peeling roll 16B press-contact and rotate the cut pieces ST1, ST2 of the ceramic sheet S on the outer peripheral surface of the sheet conveying roll 12, and the The cut pieces ST1 and ST2 of the ceramic sheet S are peeled off from the outer peripheral surface of the base film.

For example, a rigid plate is used for the lamination stage 18. However, it is not limited to a rigid plate, You may use a cylindrical roll or a cylindrical roll. When using a roll, the cut pieces ST1 and ST2 of the ceramic sheet S are wound and laminated on the outer peripheral surface. In addition, the lamination stage 18 is comprised so that it may move along a horizontal direction (refer arrow X in FIG. 1) by the linear drive mechanism which is not shown in figure. Thereby, the lamination stage 18 can reciprocate in a horizontal direction (left-right direction in FIG. 1).

The peeling rolls 16A and 16B hold the ceramic sheet S by means of adsorption (suction, electrostatic adsorption, or adhesion). Moreover, as a means for holding the cut pieces ST1 and ST2 of the ceramic sheet S on the lamination stage 18, it is carried out by the blow static pressure of the 1st peeling roll 16A and the 2nd peeling roll 16B, or pressurization and temperature. By the close contact method. The force that the release rolls 16A and 16B hold the cut pieces ST1 and ST2 is greater than the force that the base film holds the cut pieces ST1 and ST2, and the lamination stage 18 cuts the cut pieces ST1 and ST2. Since the cutting piece ST1, ST2 of the ceramic sheet S is peeled from the base film, it is hold | maintained in the peeling roll 16A, 16B, and after that to the lamination stage 18, since it is set smaller than the force which hold | maintains) Is transferred.

The peeling rolls 16A and 16B may be vacuum suction rolls which suck and peel the ceramic sheet S. At this time, it is preferable that peeling roll 16A, 16B is comprised so that the site | part which adsorb | sucks ceramic sheet S and the site | part which does not adsorb | suck are controlled. When receiving the ceramic sheet S from the base film, it has a adsorption function to predetermined site | parts of the peeling roll 16A, 16B which contact | connects the ceramic sheet S, and the received ceramic sheet S is laminated stage 18 Receiving and transferring of the ceramic sheet S can be performed smoothly by having a non-adsorption area | region in the predetermined site | part of peeling roll 16A, 16B which contacts the ceramic sheet S at the time of transferring.

Next, the manufacturing method of the laminated structure of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 which concerns on 1st Embodiment is demonstrated.

As shown to FIG. 1 and FIG. 2, the ceramic sheet S of the elongate shape in which the electrode circuit and the dielectric coating film were already formed is conveyed continuously and at a constant speed by the sheet conveying roll 12. As shown to FIG. In addition, the sheet conveying roll 12 is rotationally driven by the rotation drive mechanism not shown.

And the ceramic sheet S conveyed by the sheet conveying roll 12 is cut | disconnected by the cutting mechanism 14. The cutting mechanism 14 rotates by the rotation drive mechanism which is not shown in figure, and the blade cut | disconnects the ceramic sheet | seat S at a predetermined site | part. For this reason, one place on the ceramic sheet S is cut | disconnected every time the cutting mechanism 14 rotates. In addition, also in the cutting process by the cutting mechanism 14, conveyance of the ceramic sheet S continues. That is, the ceramic sheet S is continuously supplied without being affected by the cutting process by the cutting mechanism 14. In this way, the ceramic sheets S on the sheet conveying roll 12 are sequentially cut at predetermined intervals, and rectangular cut pieces ST1 and ST2 which are ceramic sheets S on the outer circumferential surface of the sheet conveying roll 12. ) Is generated.

Subsequently, at a predetermined timing, the first peeling roll 16A or the second peeling roll 16B alternately cuts the cut pieces ST1 and ST2 of the ceramic sheet S on the sheet conveying roll 12 to the sheet conveying roll 12. Peel off). That is, the cut piece ST1 of the ceramic sheet S is peeled from the base film on the sheet conveyance roll 12 by the 1st peeling roll 16A, and the cut piece ST2 of the other ceramic sheet S is made It peels from the base film on the sheet conveyance roll 12 by 2 peeling rolls 16B. In this manner, the plurality of cut pieces ST1 and ST2 of the ceramic sheet S on the sheet conveying roll 12 are alternately peeled off by the first peeling roll 16A and the second peeling roll 16B. In addition, the peeling operation | movement by the 1st peeling roll 16A and the 2nd peeling roll 16B does not stop in the middle, but continues the cutting pieces ST1, ST2 of the ceramic sheet S until a predetermined long life is laminated | stacked. .

Here, the peeling speed by 16 A of 1st peeling rolls or the 2nd peeling roll 16B is the speed which is substantially the same as the feed rate of cut pieces ST1 and ST2 of the ceramic sheet S by the sheet conveying roll 12 here. Is controlled. For this reason, the peeling operation | movement by the 1st peeling roll 16A and the 2nd peeling roll 16B can be continued, maintaining the state in which the cutting pieces ST1 and ST2 of the ceramic sheet S were continuously supplied. As a result, the supply speed of the cutting pieces ST1 and ST2 of the ceramic sheet S by the sheet conveying roll 12 is slowed, or the supply of the cutting pieces ST1 and ST2 of the ceramic sheet S is stopped once. Since it is not necessary, manufacturing of the laminated structure of the ceramic sheet S can be speeded up.

In addition, "the peeling speed by the 1st peeling roll 16A or the 2nd peeling roll 16B of this specification is a feed rate of the cutting pieces ST1, ST2 of the ceramic sheet S by the sheet conveying roll 12. Is adjusted at substantially the same speed as that of " " Specifically, the first peeling while the first peeling roll 16A (or the second peeling roll 16B) is close to the sheet conveying roll 12 (while including from the peeling start to the end of one rectangular sheet). It is meant that the peripheral speed of the roll 16A (or the second peeling roll 16B) and the peripheral speed of the sheet conveying roll 12 are approximately the same peripheral speed.

Subsequently, 16 A of 1st peeling rolls which hold | maintained cut piece ST1 of the ceramic sheet S move to a vertical direction (lower direction of FIG. 1) toward a transfer position, and also the edge part of cut piece ST1. Moves toward the lamination stage 18 while rotating downwards. Then, the cutting piece of the ceramic sheet S hold | maintained by the 1st peeling roll 16A by the laminated stage 18 being horizontally moved (the right direction of FIG. 1) toward the transfer position of the 1st peeling roll 16A ( ST1) and the upper surface of the lamination stage 18 contact each other at a predetermined pressure. Even after both contact, the lamination stage 18 moves to the horizontal direction, 1st peeling roll 16A rotates, and the ceramic sheet S peeled from the sheet conveying roll 12 by the 1st peeling roll 16A. Cut pieces ST1 are transferred to the upper surface of the lamination stage 18 (formation of the first layer). The transfer method is as described above. After the transfer of the cut pieces ST1 of the ceramic sheet S to be the first layer, the first peeling roll 16A moves in the vertical direction (the upper direction in FIG. 1) and again the ceramic sheet S on the sheet conveying roll 12. ), The cut piece ST1 is peeled from the sheet conveying roll 12.

And the 2nd peeling which hold | maintained the cut piece ST2 of the ceramic sheet S after the transfer (after formation of the 1st layer) of the cut piece ST1 of the ceramic sheet S by the 1st peeling roll 16A. The roll 16B moves in the vertical direction (lower direction in FIG. 1) toward the transfer position, and moves toward the lamination stage 18 while rotating so that the end of the cutting piece ST2 faces downward. Thereafter, the cutting piece of the ceramic sheet S held on the second peeling roll 16B by the lamination stage 18 being horizontally moved (the left direction in FIG. 1) toward the transfer position of the second peeling roll 16B ( The first-layer cut piece ST1 transferred to ST2) and the lamination | stacking stage 18 contacts at predetermined pressure. Even after both of them are in contact with each other, the lamination stage 18 moves in the horizontal direction so that the second peeling roll 16B rotates, and the ceramic sheet S transferred onto the lamination stage 18 by the first peeling roll 16A. The cut piece ST2 of the ceramic sheet S peeled from the sheet conveying roll 12 by the 2nd peeling roll 16B is transferred to the upper surface of cut piece ST1 of this (formation of 2nd layer). After the transfer of the cut pieces ST2 of the ceramic sheet S to be the second layer, the second peeling roll 16B moves in the vertical direction (the upper direction in FIG. 1) and again the ceramic sheet S on the sheet conveying roll 12. ), The cut piece ST2 is peeled from the sheet conveying roll 12.

Moreover, the 1st peeling which hold | maintained the cut piece ST1 of the ceramic sheet S after the transfer (after formation of the 2nd layer) of the cut piece ST2 of the ceramic sheet S by the 2nd peeling roll 16B. The roll 16A moves in the vertical direction (lower direction in FIG. 1) toward the transfer position, and moves toward the lamination stage 18 while rotating so that the end of the cutting piece ST1 faces downward. Then, the cutting piece of the ceramic sheet S hold | maintained by the 1st peeling roll 16A by the laminated stage 18 being horizontally moved (the right direction of FIG. 1) toward the transfer position of the 1st peeling roll 16A ( ST1) and the cut piece ST2 of the 2nd layer transferred to the lamination | stacking stage 18 contact at predetermined pressure. Even if both contact, the lamination stage 18 moves to a horizontal direction, and the 1st peeling roll 16A rotates, and the 1st peeling roll 16A is on the upper surface of cut piece ST2 of the 2nd-layer ceramic sheet S. FIG. ), The cut pieces ST1 of the ceramic sheet S peeled from the sheet conveying roll 12 are transferred (formation of the third layer). After the transfer of the cut pieces ST1 of the ceramic sheet S to be the third layer, the first peeling roll 16A moves in the vertical direction (the upper direction in FIG. 1) and again the ceramic sheet S on the sheet conveying roll 12. ), The cut piece ST1 is peeled from the sheet conveying roll 12.

Subsequently, the 2nd which hold | maintained the cut piece ST2 of the ceramic sheet S after the transfer (after formation of the 3rd layer) of the cut piece ST1 of the ceramic sheet S by the 1st peeling roll 16A. The release roll 16B moves toward the transfer position in the vertical direction (lower direction in FIG. 1), and moves toward the lamination stage 18 while rotating so that the end of the cutting piece ST2 faces downward. Thereafter, the cutting piece of the ceramic sheet S held on the second peeling roll 16B by the lamination stage 18 being horizontally moved (the left direction in FIG. 1) toward the transfer position of the second peeling roll 16B ( The third-layer cut piece ST1 transferred to ST2) and the lamination | stacking stage 18 contacts at predetermined pressure. Even if both contact, the lamination stage 18 moves to a horizontal direction, and the 2nd peeling roll 16B rotates and the 2nd peeling roll 16B is on the upper surface of cut piece ST1 of the 3rd-layer ceramic sheet S. FIG. ), The cut pieces ST2 of the ceramic sheet S peeled from the sheet conveying roll 12 are transferred (formation of the fourth layer). After the transfer of the cut pieces ST2 of the ceramic sheet S to be the fourth layer, the second peeling roll 16B moves in the vertical direction (the upper direction in FIG. 1) and again the ceramic sheet S on the sheet conveying roll 12. ), The cut piece ST2 is peeled from the sheet conveying roll 12.

In this manner, in the vertical direction of the first peeling roll 16A and the second peeling roll 16B until the cut pieces ST1 and ST2 of the ceramic sheet S of the specified longevity are laminated on the lamination stage 18. Linear reciprocating movement continues, and the linear reciprocating movement of the lamination stage 18 continues in the horizontal direction, and the peeling operation and the transfer operation by the first peeling roll 16A and the second peeling roll 16B are repeated. (The peeling operation and the transfer operation are performed continuously). Then, the peeling / transferring of the cut pieces ST1 of the ceramic sheet S by the first peeling roll 16A and the peeling of the cut pieces ST2 of the ceramic sheet S by the second peeling roll 16B Transfer is carried out alternately, and the cutting pieces ST1 and ST2 of the ceramic sheet S are laminated | stacked. And the laminated structure of the ceramic sheet S is formed.

In addition, the laminated structure of the ceramic sheet S formed in the lamination stage 18 is separated from the lamination stage 18, and cut | disconnected in chip shape by dicer cutting. Thereafter, firing, an electrode circuit (external electrode circuit) is formed, and a multilayer ceramic capacitor is manufactured through a normal manufacturing process.

As described above, according to the first embodiment, the cut pieces ST1 and ST2 of the ceramic sheet S are supplied to the respective peeling rolls 16A and 16B while the long length ceramic sheet S is continuously supplied without being stopped. It peels from the sheet conveyance roll 12 by this, and can laminate | stack continuously on the lamination stage 18. FIG. For this reason, each process of the conveyance process of the ceramic sheet S, the cutting process of the ceramic sheet S, and the peeling / transferring process of the cutting pieces ST1, ST2 of the ceramic sheet S progresses nonstop, and a ceramic The laminated structure of the sheet S is formed. As a result, the buffer mechanism and the part requiring acceleration / deceleration are unnecessary, so that the device cost can be reduced, and the device size can be reduced, and power consumption such as power can be reduced. In addition, since each process is performed at substantially constant speed, damage to the ceramic sheet S, distortion, handling misses, and cutting chips can be reduced, and the cut pieces of the ceramic sheet S by the respective release rolls 16A and 16B can be reduced. Since the deviation of the conveyance positioning of ST1, ST2 is reduced, the lamination | stacking precision of cut pieces ST1, ST2 of the ceramic sheet S is attained. In addition, since the problems in terms of equipment and quality can be reduced, it is easy to improve the production line speed.

Here, it demonstrates based on a time chart. FIG. 6: is a timing chart at the time of laminating | stacking cut pieces ST1, ST2 of a ceramic sheet to the lamination stage 18 using peeling roll 16A, 16B. Lamination | stacking of two sheets of cut pieces ST1, ST2 of a ceramic sheet | seat is shown as one cycle. While laminating | stacking cut piece ST2 by the peeling roll 16B on the upper surface of cut piece ST1 of the ceramic sheet S transferred by the peeling roll 16A to the upper surface of the lamination | stacking stage 18 already. Peeling of cut piece ST1 of the ceramic sheet | seat S which 16 A of peeling rolls transfer is then peeling off. By moving two peeling rolls 16A and 16B alternately, and simultaneously carrying out lamination | stacking and peeling operation | movement of the cutting pieces ST1 and ST2 of a ceramic sheet, time will be spared and the continuous conveyance of the ceramic sheet S will not be stopped. The cut pieces ST1 and ST2 of the ceramic sheet S can be laminated on the lamination stage 18. In addition, the structural diagram at the time of completing each process in the time chart of FIG. 6 is shown in FIG.

In addition, in 1st Embodiment, the sheet conveying roll 12 corresponds to the "sheet conveying member" of this invention, and the lamination stage 18 corresponds to the "sheet laminating member" of this invention. In addition, the 1st peeling roll 16A and the 2nd peeling roll 16B correspond to the "sheet transfer member" of this invention, and the cutting mechanism 14 corresponds to the "sheet cutting member" of this invention.

In the said embodiment, the electrode circuit 24 is applied from application | coating of a ceramic slurry by conveying the ceramic sheet | seat S (the electrode circuit 24 was previously formed) with the carrier film (PET film) by the sheet conveying roll 12. The process up to forming can be deleted. As a result, downsizing and cost reduction of the equipment can be realized.

In addition, a carrier film is conveyed as it is to the sheet conveyance roll 12 as it is. Thus, since the conveyance and lamination object can be extended to the ceramic sheet | seat S with a carrier film, new facility investment cost can be reduced significantly.

In addition, since the thing already attached to the carrier film is used as the ceramic sheet S, the cutting of the ceramic sheet S by the cutting mechanism 14 becomes easy compared with the case where a ceramic sheet is formed by apply | coating a ceramic slurry. Thereby, lamination | stacking of cut pieces ST1, ST2 of the ceramic sheet S can be performed further at high speed. In addition, the loss of the ceramic slurry in the lamination start state can be eliminated from the lamination stop state of the cut pieces ST1 and ST2 of the ceramic sheet S. FIG.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 2nd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

In the second embodiment, the ceramic slurry is coated on a coating conveyance roll (sheet conveying member) to form a ceramic sheet, and after forming an electrode circuit (internal electrode) and a dielectric coating film on the ceramic sheet on the coating conveyance roll, The sheet is cut by a cutting mechanism and the cut piece is transferred onto a lamination stage.

As shown in FIG. 2, the film-forming means 22 for apply | coating the ceramic slurry used as the material of a ceramic sheet S on the surface of the coating conveyance roll 20 around the coating conveyance roll (sheet conveyance member) 20 is carried out. And the liquid supply means 26 for supplying the ceramic slurry to the film forming means 22 and the ceramic on the surface of the coating conveying roll 20 located on the downstream side of the coating conveying roll rotational direction on the basis of the film forming means 22. Electrode circuit forming means 30 (electrode circuit forming portion) for forming the electrode circuit 24 on the dry curing apparatus 28 for drying and solidifying the slurry and the ceramic sheet S on the coating conveying roll 20. And the dielectric coating film 36 on the stepped portions 34 (see FIGS. 3 and 4) generated on the surfaces of the cut pieces ST1 and ST2 of the ceramic sheet S by the formation of the electrode circuit 24. Dielectric coating film forming means 32 (dielectric coating film forming portion), electrode circuit 24 and dielectric Drying and curing device 38 for drying the coating film body 36 is disposed.

In addition, similarly to 1st Embodiment, also in 2nd Embodiment, the 1st peeling roll 16A, the 2nd peeling roll 16B, and the lamination | stacking stage 18 are provided.

The coating conveyance roll 20 is comprised from the rigid roll (cylindrical shape or cylindrical shape), such as metal in which the mold release process was given to the surface. The coating conveyance roll 20 is comprised so that rotation drive may be carried out by the rotation drive mechanism not shown. The ceramic sheet S formed in the outer peripheral surface is conveyed by the rotation of the coating conveyance roll 20. In addition, a mold release process corresponds to a fluorine-type plating process etc., for example.

As the film forming means 22, for example, a die coater, a doctor blade, a roll coater, or the like is appropriately employed. Moreover, in order to make thinner the film thickness of the ceramic sheet | seat S formed in the outer peripheral surface of the coating conveyance roll 20, it is preferable to provide an upstream pressure reduction mechanism in a die coater. The ceramic sheet S is formed by continuously applying a ceramic slurry to the coating conveyance roll 20 from the film-forming means 22. In this way, the ceramic slurry is continuously supplied to the same coating conveyance roll 20. In addition, as a ceramic slurry, what melt | dissolved and disperse | distributed the ceramic powder and the resin component to the organic solvent is employ | adopted, for example. You may use what disperse | distributed the ceramic powder to UV hardening resin. In addition, the solvent may be an aqueous system.

As the liquid supply means 26, for example, a cylindrical dispenser is employed. In addition, the liquid supply means 26 is not limited to a cylindrical dispenser, You may employ | adopt a gear pump, a diaphragm pump, etc. suitably.

As the electrode circuit forming means 30, for example, an inkjet printing apparatus is employed. The electrode circuit forming means 30 is preferably a plateless printing means, but may be transferred to the electrode circuit 24 after drying, and means such as intaglio printing and intaglio offset printing may be used. As the electrode material ink used in the electrode circuit forming means 30, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent is used. What disperse | distributed Ni powder to UV curable resin may be sufficient. In particular, it is preferable to use a solvent with low swelling property with respect to a ceramic coating film. In addition, the solvent may be aqueous.

As the dielectric coating film forming means 32, for example, an inkjet printing apparatus is employed. The dielectric coating film forming means 32 is preferably a plateless printing means. However, the dielectric coating film after drying may be transferred, and any means such as intaglio printing, intaglio offset printing, gravure printing, gravure offset printing, or rotary screen printing may be used. The dielectric material used in the dielectric coating film forming means 32 is obtained by dissolving and dissolving the ceramic powder and resin in a ceramic ink, for example, an organic solvent. You may use what disperse | distributed the ceramic powder to UV hardening resin. In particular, it is preferable to use a solvent with low swelling property with respect to a ceramic coating film. In addition, the solvent may be aqueous.

As the dry hardening apparatus 28 and 38, the method of drying by hot air and the method of heating the outer peripheral surface of the coating conveyance roll 20 are employ | adopted, for example. When using UV curable resin, you may irradiate and harden UV. The dry curing apparatuses 28 and 38 are for drying or curing the ceramic slurry applied on the coating conveyance roll 20 to form the ceramic sheet S. FIG.

Next, the manufacturing method of the laminated structure of the ceramic sheet S using the laminated electronic component manufacturing apparatus of 2nd Embodiment is demonstrated. In addition, description is abbreviate | omitted suitably about the effect that overlaps with the effect of the laminated electronic component manufacturing apparatus of 1st Embodiment.

As shown in FIG. 2, the coating conveyance roll 20 which performed the mold release process is rotated at a predetermined speed, and a ceramic slurry is apply | coated to this outer peripheral surface by the film-forming means 22. As shown in FIG. In addition, the supply of the ceramic slurry is performed using the cylindrical dispenser which is the liquid supply means 26. And the ceramic slurry is dried and solidified using the dry curing apparatus 38 on the coating conveyance roll 20. As shown in FIG. Here, hot air of a predetermined temperature is used for drying the ceramic slurry by the dry curing device 38. Temperature control is performed separately so that the outer peripheral surface of the coating conveyance roll 20 may be a suitable temperature. In addition, these temperatures are adjusted suitably with the material of the ceramic sheet S. FIG. In this way, the ceramic slurry is continuously supplied to the coating conveying roll 20 by the film forming means 22 and the liquid feeding means 26, and the ceramic sheet S is continuously formed on the coating conveying roll 20.

Next, electrode material ink is applied to the formed ceramic sheet S, and an electrode circuit (internal electrode circuit) 24 having a predetermined figure pattern is printed. Moreover, the ceramic material (dielectric material) from the dielectric coating film forming means 32 (for example, inkjet printing) with respect to the step portion 34 (concave portion) generated by the electrode circuit 24 formed in the ceramic sheet S. Is applied to print the dielectric coating film 36 having a predetermined figure pattern.

Here, the forming speed of the electrode circuit 24 by the electrode circuit forming means 30 and the forming speed of the dielectric coating film 36 by the dielectric coating film forming means 32 are the ceramic sheet by the coating conveyance roll 20. It is adjusted at the speed | rate similar to the formation speed of (S) and the peeling speed by 16A of 1st peeling rolls, and the 2nd peeling roll 16B. For this reason, the formation work of the electrode circuit 24 and the dielectric coating film 36 is performed, maintaining the state in which the ceramic sheet S is continuously formed, and the 1st peeling roll 16A and the 2nd peeling roll 16B are performed. The peeling operation | movement by can be continued. That is, nonstop from the formation process of the ceramic sheet S to the formation process of the electrode circuit 24 and the dielectric coating film 36, the cutting process of the ceramic sheet S, and the peeling transfer process of the cutting pieces ST1 and ST2. You can run As a result, it is not necessary to slow down the conveyance speed of the ceramic sheet S by the coating conveyance roll 20, or to stop conveyance of the ceramic sheet S once, and to speed up manufacture of the laminated structure of the ceramic sheet S. Can be.

The dielectric coating film 36 and the electrode circuit 24 formed on the ceramic sheet S are dried by blowing hot air from the dry curing apparatus 38. In addition, the formation order of the dielectric coating film 36 and the electrode circuit 24 does not matter in particular. In this manner, subsequent to the formation of the ceramic sheet S, the formation of the electrode circuit 24 and the dielectric coating film 36 is performed. For this reason, formation of the ceramic sheet S and formation of the electrode circuit 24 and the dielectric coating film 36 are performed continuously. In addition, since the formation of the ceramic sheet S is continued even when the electrode circuit 24 and the dielectric coating film 36 are formed (including drying by the dry curing apparatus 38), the ceramic sheet S formed on the outer circumferential surface is formed. Formation of the electrode circuit 24 and the dielectric coating film 36 is performed in the state where the conveyance by the coating conveyance roll 20 of the () is continued.

Subsequently, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is cut at a predetermined site by the cutting mechanism 14. In addition, since the cutting method of the ceramic sheet S by the cutting mechanism 14 is the same as that of 1st Embodiment, description is abbreviate | omitted. After the cutting by the cutting mechanism 14, the cutting pieces ST1, ST2 of the ceramic sheet S are sequentially removed from the coating conveyance roll 20 by the 1st peeling roll 16A and the 2nd peeling roll 16B. It is peeled off and laminated on the lamination stage 18. Also in 2nd Embodiment, the cut piece ST1 of the ceramic sheet S by the 1st peeling roll 16A, and the cut piece ST2 of the ceramic sheet S by the 2nd peeling roll 16B alternately. Overlapping and the laminated structure of the ceramic sheet S is formed.

According to the second embodiment, in the case where the molding of the ceramic sheet S, the printing of the electrode circuit 24 and the dielectric coating film 36 are carried out consistently, the continuous formation and continuous formation together with the formation of the ceramic sheet S are performed. Since printing becomes possible, the quality deviation can be reduced, the line speed can be improved, and the material loss can be reduced.

In particular, the ceramic sheet S by the 1st peeling roll 16A and the 2nd peeling roll 16B in the state in which formation of the ceramic sheet S by the film-forming means 22 is continuing on the coating conveyance roll 20 is carried out. Transfer of the cut pieces ST1 and ST2. Thereby, the continuous molding of the ceramic sheet S and the continuous transfer of the cutting pieces ST1 and ST2 of the ceramic sheet S are attained. Moreover, the formation of the electrode circuit 24 by the electrode circuit forming means 30 and the dielectric coating film forming means in the state in which the formation of the ceramic sheet S by the film forming means 22 is continued on the coating conveyance roll 20. The dielectric coating film 36 is formed by (32). Thereby, the continuous formation of the ceramic sheet S and the continuous formation of the electrode circuit 24 and the dielectric coating film 36 are attained. For this reason, the formation process of the ceramic sheet S, the formation process of the electrode circuit 24 and the dielectric coating film 36, the cutting process of the ceramic sheet S, and the cut pieces ST1, ST2 of the ceramic sheet S are Each process of the peeling and the transfer process of is progressed nonstop, and the laminated structure of the ceramic sheet S is formed. Thereby, it becomes possible to manufacture the laminated structure of the ceramic sheet | seat S by making a series of process in which all the processes are continuous. As a result, it is possible to reduce the quality variation of the laminated structure of the ceramic sheet S, and furthermore, the electronic components, the line speed, and the material loss. In addition, the overall device cost can be reduced, and the device size can be reduced, and the energy consumption can be reduced.

3 and 4, when the electrode circuit 24 is formed in the ceramic sheet S, a recess is formed between the electrode circuits 24 and the stepped portion 34 (concave) is formed on the ceramic sheet S. B) is generated, but the stepped portion 34 can be reduced by printing the dielectric coating film 36 on the stepped portion 34. In this way, by filling the step portion 34 between the electrode circuits with the dielectric coating film 36, lamination shifts and poor adhesion which tend to occur when the number of laminated sheets of the ceramic sheet S increase can be prevented, The structural defect resulting from the presence of the stepped portion 34 can be suppressed. As a result, the quality defect of the electronic component manufactured can be prevented.

In particular, since the electrode circuit 24 and the dielectric coating film 36 are formed on the coating conveyance roll 20 at substantially the same timing, the positional accuracy of the electrode circuit 24 and the dielectric coating film 36 can be improved. Thereby, the laminated structure of the high precision ceramic sheet S can be manufactured, without providing a detection means, such as a CCD camera.

Moreover, since the ceramic sheet S is formed on the coating conveyance roll 20 which is a rigid body, and conveys a sheet surface to a sheet lamination process, supporting the sheet surface with the coating conveyance roll 20 or the transfer roll 14, Even when the thin, low-strength ceramic sheet S is used, cracking or damage of the ceramic sheet S can be suppressed. As a result, the handling property of the thin, low-strength ceramic sheet S can be improved. In addition, since the lamination stage 18 is made of a metal which is rigid, the position shift occurs even when a thin and low-strength ceramic sheet S is used in the lamination process of the cut pieces ST1 and ST2 of the ceramic sheet S. Misalignment).

In addition, the formation of the electrode circuit 24 and the dielectric coating film 36 can be speeded up by using a plateless printing method such as inkjet for forming the electrode circuit 24 and the dielectric coating film 36. In addition, it is possible to form the electrode circuit 24 and the dielectric coating film 36 each having a different electrode pattern in each layer of the ceramic sheet S. FIG. In particular, even if the deformation of the ceramic sheet S or the height of the lamination stage 18 changes with the progress of the lamination of the ceramic sheet S, the pattern and the formation position of the electrode circuit 24 and the dielectric coating film 36 can be freely changed. Therefore, the pitch (interval) between the electrode circuit 24 and the dielectric coating film 36 can be adjusted appropriately, and the formation of the electrode circuit 24 and the dielectric coating film 36 without position shift is attained. .

In addition, in 2nd Embodiment, the coating conveyance roll 20 respond | corresponds to the "sheet conveyance member" of this invention, and the lamination stage 18 corresponds to the "sheet lamination member" of this invention. In addition, the 1st peeling roll 16A and the 2nd peeling roll 16B correspond to the "sheet transfer member" of this invention, and the cutting mechanism 14 corresponds to the "sheet cutting member" of this invention. The electrode circuit forming means 30 corresponds to the "electrode circuit forming portion" of the present invention, and the dielectric coating film forming means 32 corresponds to the "dielectric coating film forming portion" of the present invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 3rd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure overlapping with the structure of 1st Embodiment and 2nd Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

3rd Embodiment forms a ceramic sheet by apply | coating a ceramic slurry on a coating conveyance roll, cut | disconnects a ceramic sheet with a cutting mechanism, and transfers the cut piece to a lamination | stacking stage, and then electrode circuit (internal electrode) with respect to a ceramic sheet | seat. And a dielectric coating film.

As shown in FIG. 5, an electrode circuit forming means 30, a dielectric coating film forming means 32, and a dry curing apparatus 38 for drying the electrode circuit 24 and the dielectric coating film 36 are laminated stages. It is arrange | positioned in the vicinity of the movement trace of 18.

According to 3rd Embodiment, the ceramic sheet S formed by apply | coating a ceramic slurry on the coating conveyance roll 20 is cut | disconnected by the cutting mechanism 14. As shown in FIG. And the cutting pieces ST1 and ST2 of the ceramic sheet S are peeled from the coating conveyance roll 20 by the 1st peeling roll 16A and the 2nd peeling roll 16B, and are alternated on the lamination stage 18. FIG. Is transferred to.

Here, the electrode circuit 24 is formed by the electrode circuit forming means 30 with respect to the cut pieces ST1 and ST2 of the ceramic sheet S transferred onto the lamination stage 18, and the dielectric coating film forming means ( 32 forms a dielectric coating film 36. The electrode circuit 24 and the dielectric coating film 36 are dried by the dry curing device 38. In this manner, the electrode circuit 24 and the dielectric coating film 36 are formed each time the cut pieces ST1 and ST2 of one layer of the ceramic sheet S are transferred to the lamination stage 18. After the electrode circuit 24 and the dielectric coating film 36 are formed, the cut pieces ST2 of the ceramic sheet S to be the second layer are transferred so as to overlap the cut pieces ST1 of the first layer. This is repeated to form a laminated structure of the ceramic sheet S.

In addition, in 3rd Embodiment, the coating conveyance roll 20 respond | corresponds to the "sheet conveyance member" of this invention, and the lamination stage 18 corresponds to the "sheet lamination member" of this invention. In addition, the 1st peeling roll 16A and the 2nd peeling roll 16B correspond to the "sheet transfer member" of this invention, and the cutting mechanism 14 corresponds to the "sheet cutting member" of this invention. The electrode circuit forming means 30 corresponds to the "electrode circuit forming portion" of the present invention, and the dielectric coating film forming means 32 corresponds to the "dielectric coating film forming portion" of the present invention.

10: laminated electronic component manufacturing apparatus 12: sheet conveying roll (sheet conveying member)
14: Cutting Mechanism (Sheet Cutting Member) 16A: First Peeling Roll (Sheet Transfer Member)
16B: 2nd peeling roll (sheet transfer member) 18: Lamination stage (sheet lamination member)
20: Coating conveyance roll (sheet conveying member) 22: Film-forming means (film-forming part)
24: electrode circuit
30: electrode circuit forming means (electrode circuit forming portion)
32: dielectric coating film forming means (dielectric coating film forming portion)
34: stepped portion 36: dielectric coating film
S: Ceramic Sheet ST1: Cut Piece of Ceramic Sheet
ST2: Cutting Piece of Ceramic Sheet

Claims (10)

A sheet conveying member for continuously conveying the ceramic sheet in a predetermined direction,
A sheet cutting member for cutting the ceramic sheet into a predetermined length;
A sheet lamination member in which cut pieces of the ceramic sheet cut to a predetermined length by the sheet cutting member are laminated;
A plurality of sheet transfer members for peeling a cut piece of the ceramic sheet cut into a predetermined length by the sheet cutting member from the sheet conveying member to transfer the cut piece of the ceramic sheet to the sheet stacking member;
The sheet transfer member on one side and the sheet transfer member on the other side alternately transfer the cut pieces of the ceramic sheet to alternately stack them. The method of claim 1,
An electrode circuit forming portion for forming an electrode circuit in the ceramic sheet;
The electrode circuit is formed on the ceramic sheet by the electrode circuit forming portion in a state where the transfer of the ceramic sheet by the sheet conveying member is continued. The method of claim 2,
A dielectric coating film forming portion for forming a dielectric coating film on the stepped portion of the ceramic sheet caused by the formation of the electrode circuit;
The dielectric coating film is formed in the stepped portion by the dielectric coating film forming portion while the transfer of the ceramic sheet by the sheet conveying member is continued. The method according to claim 2 or 3,
And said electrode circuit forming portion or dielectric coating film forming portion is a plateless printing apparatus. The method according to claim 2 or 3,
A film forming portion for applying the ceramic slurry to the sheet conveying member to form the ceramic sheet;
Transfer of the cut pieces of the ceramic sheet by a plurality of the sheet transfer members is carried out while the formation of the ceramic sheet by the film forming portion is continued. A sheet conveying step of continuously conveying the ceramic sheet in a predetermined direction by the sheet conveying member,
A sheet cutting step of cutting the ceramic sheet into a predetermined length by a sheet cutting member;
A sheet transfer step of peeling a cut piece of the ceramic sheet cut into a predetermined length by the sheet cutting member from the sheet conveying member by a plurality of sheet transfer members and transferring it to the sheet lamination member;
In the sheet transfer step, the sheet transfer member on the one side and the sheet transfer member on the other side alternately transfer the cut pieces of the ceramic sheet to the sheet stacking member so as to be laminated. The method according to claim 6,
An electrode circuit forming step of forming an electrode circuit in the ceramic sheet by an electrode circuit forming portion;
In the electrode circuit forming step, the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit in a state where the conveyance of the ceramic sheet by the sheet conveying member is continued. The method of claim 7, wherein
A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion at a step portion of the ceramic sheet caused by the formation of the electrode circuit;
In the dielectric coating film forming step, the dielectric coating film is formed in the stepped portion by the dielectric coating film forming portion while the transfer of the ceramic sheet by the sheet conveying member is continued. Way. 9. The method according to claim 7 or 8,
In the electrode circuit forming step or the dielectric coating film forming step, a plateless printing apparatus is used as the electrode circuit forming part or the dielectric coating film forming part. 9. The method according to claim 7 or 8,
A film forming step of applying the ceramic slurry to the sheet conveying member by a film forming forming unit to form the ceramic sheet;
In the film-forming step, the transfer of the cut pieces of the ceramic sheet by the plurality of sheet transfer members is performed while the formation of the ceramic sheet by the film-forming part is continued. Way.

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