KR101248496B1 - Apparatus and method for manufacturing laminated electronic component - Google Patents

Abstract

[PROBLEMS] To provide a laminated electronic component manufacturing apparatus and a method for manufacturing a laminated electronic component, which can improve the production efficiency (manufacturing speed) of the laminated electronic component by suppressing the occurrence of poor quality of the electronic component and operating at low cost and continuously. to provide.
[Solution] An endless continuous film-forming substrate 12 having a releasing treatment on the outer circumference, and a film-forming portion 16 for continuously forming a ceramic sheet S by applying and drying a ceramic slurry on the film-forming substrate 12. ), The electrode circuit forming portion for forming the electrode circuit 24 with respect to the ceramic sheet S on the film forming substrate 12, and the ceramic sheet S by contacting the film forming substrate 12 with the ceramic sheet S. ) Is removed from the film-forming substrate 12 and the laminated support 14 which forms the laminated structure S 'of the ceramic sheet S and the electrode circuit 24 is wound by winding the peeled ceramic sheet S around. Have

Description

Apparatus for manufacturing a multilayer electronic component and a method for manufacturing a multilayer electronic component {APPARATUS AND METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component manufacturing apparatus and a method for manufacturing a multilayer electronic component for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

In general, a method of manufacturing a multilayer ceramic capacitor is formed by coating a ceramic film on a long film, printing an internal electrode thereon, cutting the film to a desired size, peeling and laminating it from a film, and repeatedly forming a laminate block. Then, this is cut in parts.

On the other hand, Patent Document 1 described below forms a laminate block by laminating a plurality of ceramic green sheets obtained by forming on a base material, and manufactures a multilayer ceramic electronic component by cutting the formed laminate block in parts. As a method, at least two of the plurality of ceramic green sheets constituting the same laminate block are formed in a predetermined region on the same substrate, and the directions of in-plane directions of each ceramic green sheet and the position of each ceramic green sheet are determined. Disclosed is a method of manufacturing a laminated ceramic electronic component that is substantially aligned and laminated.

The following patent document 2 makes a 1st flexible support run infinitely, apply | coats a ceramic paint on one surface of a 2nd flexible support body, transfers the obtained undried ceramic paint layer to a 1st flexible support body, and transfers While peeling the second flexible support from the ceramic paint layer, the electrode is printed on the surface of the ceramic paint layer transferred onto the first flexible support, the electrode is dried, and this process is repeated on the first flexible support. The technique which makes it is disclosed.

Patent Document 3 below is a laminate manufacturing apparatus for a laminated electronic component comprising a self-standing green sheet containing a ceramic and an organic binder component and having a predetermined pattern for forming an internal electrode layer thereon, wherein a predetermined pattern is formed in advance. The technique of winding up and manufacturing a freestanding green sheet to a columnar roll is disclosed.

In Patent Document 4, a unwinding supply unit for supplying a green sheet, a lamination drum for winding a green sheet to an outer circumferential surface to form a laminate, a rotation angle detection device for detecting a rotation angle of the lamination drum, and a rotation angle The technique which can manufacture a laminated body at high speed is provided by providing the internal electrode printing part which forms an internal electrode on the green sheet wound by the lamination drum, while winding a green sheet based on the information of a detection apparatus.

The following patent document 5 repeats the formation of the ceramic green sheet by a coat roller and the formation of the internal electrode by the transfer apparatus in a predetermined order, while winding the endless belt wound around the polygonal column-shaped wheel. Then, during the circumference of the endless belt, the constant area of the endless belt is set in contact with the planar portion of the polygonal column-shaped wheel, and the target ceramic laminate is punched to a suction head with a size within the range of the area in contact with the planar portion. The manufacturing method of the ceramic laminated body pulled out by this is disclosed.

Here, as a method of forming a laminate in a manufacturing process of a multilayer ceramic capacitor, a means of coating and coating a ceramic coating film on a long film in general, printing an internal electrode thereon, cutting it, peeling from a film, and laminating it Is used. In order to increase the size and capacity of the multilayer capacitor, it is necessary to form a ceramic dielectric layer thinner and increase the number of laminations. However, it has been found that the rate of occurrence of quality defects such as short due to defects caused by projections on the film increases. Can be. Thus, attempts have been made to make the film smoother, but the deterioration in handling properties and the rise in film cost have been a problem, and have been difficult.

As a means of solving this, the method of forming a ceramic green sheet by using the same base material of a flat plate type repeatedly is devised (refer patent document 1). By using the same substrate, since the defect portion is concentrated on a part of the laminated block, even if there are projections on the substrate, defective chips generated by the influence can be minimized.

Japanese Patent Laid-Open No. 2004-296641 Japanese Patent Laid-Open No. 2002-141245 Japanese Patent Laid-Open No. 2000-306766 Japanese Patent Laid-Open No. 2003-217992 Japanese Patent Laid-Open No. 10-32140

However, in the technique of the said patent document 1, since the green sheet needs to be formed intermittently on a flat plate or a cylindrical base material, the area | region of which film thickness is nonuniform arises in a film-forming start part and an end part, and even if it forms a laminated body block, The area | region where quality is obtained is narrow, and a problem in yield is large. Moreover, also in the process of laminating | stacking a ceramic sheet | seat on a flat plate, there existed a drawback that the intermittent operation | movement of one layer is required and a production speed cannot be raised.

Moreover, the technique of the said patent document 2 is devised as a means of efficiently laminating a ceramic sheet | seat. The ceramic is applied on a long film and transferred onto an endless belt to obtain a laminated structure. In this method, high speed can be achieved by not performing intermittent operation. However, since a long substrate is used, an effect of suppressing quality defects at the defective portion of the ceramic layer due to the substrate projection cannot be expected.

Moreover, the same kind of invention is described in the said patent document 3. This is to form a laminated structure on a cylindrical drum, and high-speed lamination by continuous operation is possible, but the ceramic sheet is limited to a high-intensity freestanding green sheet without a support such as a film. Although the frequency of defects inherent in the self-supporting green sheet is unclear, this sheet, which contains a high degree of polymerization resin and has increased strength, makes it difficult to degrease in the firing process and deteriorates the density of the ceramic after firing. Because of its low practicality, it is difficult to use for mass production.

Although the invention of the said patent document 4 is a continuous lamination with a cylinder or a polygonal pillar, and forms an electrode circuit by inkjet, also in this case, the green sheet requires a high strength enough to be able to carry it by itself, and is a thin ceramic which becomes a subject. Practical use is difficult as a means of forming the laminated structure of a layer.

As described in Patent Document 5, the method of applying the slurry on a sheet continuously dried in a wet state is a solvent of the applied slurry dissolves the lower sheet, causing short or IR failure (poor insulation resistance). Cause sheet defects. In particular, the sheet thickness of the multilayer ceramic capacitors has become thin these days, and application in such a method is not suitable.

When sheet molding is a separate process, there is a problem in that inventory generation, storage, and transportation of this process are enormously expensive, and inevitably a long production period. In addition, since the process is divided, an extra sheet such as a conveying path or a laminated number of sheets is required in addition to the sheet length required for the laminated block, resulting in loss of material. On the other hand, when electrode printing is performed on the sheets after lamination of the sheets, sheet attack caused by dissolution of the sheets by the electrode solvent is generated not only on the sheets on which the sheets are printed, but also on the electrodes and sheets of the lower layer, so that short or IR Problems such as defects are caused. This is the cause of poor quality of the electronic components to be manufactured.

Accordingly, an object of the present invention is to provide a laminated electronic component manufacturing apparatus and a laminated electronic component which can suppress the occurrence of poor quality of electronic components and improve the manufacturing efficiency (production speed) of the laminated electronic component at low cost in view of the above problems. It is to provide a method for manufacturing a part.

The present invention relates to an endless continuous film forming substrate having a release treatment applied to an outer periphery, a film forming portion for continuously forming a ceramic sheet by applying and drying a ceramic slurry on the film forming substrate, and the ceramic sheet on the film forming substrate. The ceramic sheet and the electrode are formed by contacting an electrode circuit forming portion for forming an electrode circuit with the film forming substrate through the ceramic sheet to peel the ceramic sheet from the film forming substrate, and winding the peeled ceramic sheet around. It is a laminated electronic component manufacturing apparatus which has a laminated support body which forms the laminated structure of a circuit, It is characterized by the above-mentioned.

According to the present invention, even if there is a defect factor such as a projection on the film forming substrate, the defect portion of the ceramic sheet resulting therefrom is concentrated within a limited range of the laminated structure, so that the occurrence of poor quality of the electronic component obtained by cutting and dividing it is low. can do.

In addition, since the ceramic sheet is continuously formed on the film-forming substrate, the stable region of the film thickness is wider than that of the intermittent coating, and the number that can be divided as an electronic component from the obtained laminated structure can be increased.

Since the process of forming a ceramic sheet on a film-forming base material and the process of forming a laminated structure of a ceramic sheet on a laminated support body are performed by continuous operation, the laminated structure of a ceramic sheet can be formed with high productivity in a short time.

Moreover, it is not necessary to use a long film base material like the conventional one, and the intermediate material cost can be suppressed.

As described above, the production efficiency (production speed) of the laminated electronic component can be improved by suppressing occurrence of poor quality of the electronic component and continuously operating at low cost and not intermittently.

In addition, the present invention provides an endless continuous film forming substrate having a releasing treatment on an outer periphery, a film forming portion for continuously forming a ceramic sheet by applying and drying a ceramic slurry on the film forming substrate, and an electrode circuit for the ceramic sheet. An electrode circuit forming portion for forming a film, a laminate support for forming a laminate structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on an outer periphery, and contacting the film forming substrate and the laminate support with the ceramic sheet. It is a laminated electronic component manufacturing apparatus provided with the conveyance member provided and receiving the said ceramic sheet formed in the said film-forming base material from the said film-forming base material, and conveying this received said ceramic sheet to the said laminated support body. It is characterized by the above-mentioned.

According to this invention, the ceramic sheet formed in the film-forming base material is once received by a conveyance member. Then, a ceramic sheet is conveyed from a conveyance member to a laminated support body. Thereby, peeling of the ceramic sheet | seat from the film-forming base material does not affect the state on the laminated support side, and stable handling is attained. Specifically, when the laminated structure of the ceramic sheet is formed on the laminated support, the size of the laminated support increases, and when the electrode circuit is formed, a state change in the appearance such as irregularities occurs, but the film is formed with the film-forming substrate. The direct contact between the film-forming substrate and the laminated support can be avoided by interposing the transport member between the supports. And the positional relationship, pressure, etc. of a laminated support and a conveyance member can be adjusted suitably according to the state change of a laminated support. Thereby, deterioration of the quality of the laminated structure of the ceramic sheet formed in the laminated support by the state change of a laminated support can be prevented. In addition, by designing the laminated support so as not to directly contact the film forming substrate, it is possible to prevent the state change of the laminated support from deteriorating the quality of the ceramic sheet and, moreover, the electronic component formed on the film forming substrate.

Moreover, since the path | route which a ceramic sheet moves can be lengthened until it conveys to a laminated support body, without increasing a single film-forming base material, the drying time of a ceramic sheet can be long. And since a ceramic slurry is continuously apply | coated to a film-forming base material, the manufacturing speed (manufacturing efficiency) of a ceramic sheet | seat can be improved, and the manufacturing efficiency of the laminated structure of a ceramic sheet, and also an electronic component can be improved.

Moreover, it is preferable that an electrode circuit is formed in the ceramic sheet before winding up by the electrode circuit formation part by the laminated support body. Thus, an electrode circuit is formed on the ceramic sheet before the ceramic sheet is laminated on the laminated support. For example, when the electrode circuit is formed on the ceramic sheet after the ceramic sheet is laminated on the laminated support, an electrode solvent is caused on the electrode circuit formed on the lower ceramic sheet or on the ceramic sheet on which the lower electrode circuit is formed, causing sheet attack. do. As in the present invention, when the electrode circuit is formed in the state of a single-layer ceramic sheet, the influence of the sheet attack can be suppressed to a minimum of only a single layer, so that problems such as shorts or IR defects (poor insulation resistance) can be reduced.

In this invention, it is preferable that the said electrode circuit formation part forms the said electrode circuit with respect to the said ceramic sheet on the said conveyance member.

According to this, an electrode circuit is formed in the ceramic sheet on a conveyance member by an electrode circuit formation part. Thereby, since an electrode circuit is formed with respect to the ceramic sheet dried on the film-forming base material, the positional precision of the formation position of an electrode circuit can be improved further.

Further, a ceramic slurry is applied and dried to an endless continuous film forming substrate having a releasing treatment on the outer circumference, an electrode circuit forming unit for forming an electrode circuit on the film forming substrate, and a film forming substrate having the electrode circuit formed thereon. The film forming portion for continuously forming the ceramic sheet on which the electrode circuit is formed and the ceramic sheet on which the electrode circuit is formed are brought into contact with the film forming substrate through the ceramic sheet on which the electrode circuit is formed. It is a laminated electronic component manufacturing apparatus which has a laminated support body which forms the laminated structure of the said ceramic sheet and the said electrode circuit by winding the said ceramic sheet in which the said electrode circuit was formed in the outer periphery.

Further, a ceramic slurry is applied and dried to an endless continuous film forming substrate having a releasing treatment on the outer circumference, an electrode circuit forming unit for forming an electrode circuit on the film forming substrate, and a film forming substrate having the electrode circuit formed thereon. A film forming portion for continuously forming a ceramic sheet on which an electrode circuit is formed, a laminated support for forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on which the electrode circuit is formed on an outer periphery, the film base material and the The ceramic sheet provided with the laminated support so as to be in contact with the ceramic sheet on which the electrode circuit is formed, and receiving the ceramic sheet on which the electrode circuit formed on the film forming substrate is formed from the film forming substrate, and receiving the ceramic circuit on which the electrode circuit is received. The conveying member which conveys a sheet to the said laminated support body It is a laminated electronic component manufacturing apparatus which has it, It is characterized by the above-mentioned.

The present invention is characterized in that the electrode circuit forming portion is a plateless printing apparatus which performs electrode printing on the ceramic sheet.

According to this, an electrode circuit of a different pattern can be formed for each layer of the ceramic sheet. In addition, even if a change occurs in the expansion or contraction of the ceramic sheet or the size of the laminated support in accordance with the progress of the lamination of the ceramic sheet on the laminated support, the pitch between the electrode circuits can be adjusted to form an electrode circuit without displacement.

In addition, it is preferable that the plateless printing apparatus is constituted by an inkjet printing apparatus and an ink dry curing apparatus.

The present invention is characterized in that the outer circumferential length of the film forming substrate and the outer circumferential length of the laminated support are the same length, or one of the outer circumferential length of the film forming substrate or the outer circumferential length of the laminated support is an integral multiple of the other.

According to this, the defect part of the ceramic sheet | seat which arises by having a defect factor, such as protrusions, on a film-forming base material can be concentrated in the specific area | region of a laminated structure. Specifically, the defects generated in the laminated structure of the ceramic sheet on the laminated structure can be collected on the same circumferential trajectory of the laminated structure (the same row of the laminated structure when the ceramic sheet is viewed from the conveying direction). When the outer circumferential length of the laminated support is longer by an integral number of the outer circumferential length of the film-forming substrate, the defect portion generated in the laminated structure of the ceramic sheet on the laminated structure on the same coordinates of the laminated structure (when the ceramic sheet is viewed from the conveying direction). In the same row and column of the laminate structure).

The present invention is characterized in that the new ceramic sheet is continuously formed on the film formation substrate when the ceramic sheet is wound around the outer periphery of the laminated support to form a laminated structure of the ceramic sheet.

Thereby, since the laminated structure of a ceramic sheet can be formed by continuous operation instead of intermittent operation, the laminated structure of a ceramic sheet can be formed in a very short time. As a result, the manufacturing efficiency of the laminated structure of a ceramic sheet can be improved.

The present invention provides a film forming step of continuously forming a ceramic sheet by applying and drying a ceramic slurry by a film forming forming unit to an endless continuous film forming substrate subjected to a release treatment on an outer circumference thereof, and the ceramic sheet on the film forming substrate. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming unit, and the laminated support body is brought into contact with the film forming substrate via the ceramic sheet to peel the ceramic sheet from the film forming substrate, and the peeled ceramic sheet is removed. It is a manufacturing method of the laminated electronic component which has a laminated structure formation process which forms the laminated structure of the said ceramic sheet and the said electrode circuit by winding up to the outer periphery of the said laminated support body.

The present invention provides a film forming step of continuously forming a ceramic sheet by applying and drying a ceramic slurry to a film forming substrate having an endless continuous shape-forming process on the outer circumference thereof, and an electrode circuit forming unit for the ceramic sheet. After the electrode circuit forming step of forming the electrode circuit, the laminated structure forming step of forming the laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet around the laminate support, and the film forming step It is performed before the said laminated structure formation process, and a conveyance member has the conveyance process which receives the said ceramic sheet formed in the said film-forming base material from the said film-forming base material, and conveys this received ceramic sheet to the said laminated support body by the said conveyance member. It is a manufacturing method of the laminated electronic component The.

It is preferable to form the said electrode circuit with respect to the said ceramic sheet on the said conveyance member in an electrode circuit formation process.

The present invention provides an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming unit on an endless continuous film forming substrate subjected to release processing on an outer circumference thereof, and a film forming unit with respect to the film forming substrate on which the electrode circuit is formed. A film forming process for continuously forming a ceramic sheet having the electrode circuit formed by applying and drying a slurry; and the ceramic sheet having the electrode circuit formed by contacting the laminated support through the ceramic sheet having the electrode circuit formed thereon with respect to the film forming substrate. Of a laminated electronic component having a laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by peeling the film from the film forming substrate and winding the ceramic sheet on which the separated electrode circuit is formed on the outer circumference of the laminated support. It is a manufacturing method All.

The present invention provides an electrode circuit forming step of forming an electrode circuit by an electrode circuit forming unit on an endless continuous film forming substrate subjected to release processing on an outer circumference thereof, and a film forming unit with respect to the film forming substrate on which the electrode circuit is formed. A film forming process for continuously forming a ceramic sheet on which the electrode circuit is formed by applying and drying a slurry, and forming the laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on which the electrode circuit is formed on the outer circumference of the laminate support. Which is carried out after the laminate structure forming step and the film forming step and before the laminate structure forming step, the conveying member receives the ceramic sheet on which the electrode circuit formed on the film forming base material is formed from the film forming base material. The ceramic sheet on which the electrode circuit is formed is It is a manufacturing method of the laminated electronic component which has a conveyance process conveyed to the said laminated support body by a conveyance member, It is characterized by the above-mentioned.

In these cases, it is preferable to use the plateless printing apparatus which performs electrode printing on the said ceramic sheet as said electrode circuit formation part.

It is preferable to use an inkjet printing apparatus and an ink dry curing apparatus as said plateless printing apparatus.

When the ceramic sheet is wound on the outer circumference of the laminated support in the laminated structure forming step and the laminated structure of the ceramic sheet and the electrode circuit is formed, the new ceramic sheet is continuously formed on the film forming substrate in the film forming step. It is preferably formed.

EFFECTS OF THE INVENTION [

According to the present invention, the production efficiency (manufacturing speed) of the laminated electronic component can be improved by suppressing the occurrence of poor quality of the electronic component and continuously operating at low cost and not intermittently.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of the laminated electronic component manufacturing apparatus by 1st Embodiment of this invention.
It is explanatory drawing which shows the position of the defect part on a ceramic sheet | seat.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 2nd Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 3rd Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 4th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 5th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 6th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 7th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 8th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 9th Embodiment of this invention.
It is explanatory drawing of the laminated electronic component manufacturing apparatus by 10th Embodiment of this invention.

EMBODIMENT OF THE INVENTION The laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 1st Embodiment of this invention are demonstrated with reference to drawings. In addition, the "layered electronic component" which this invention makes object includes laminated electronic components, such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component.

First, the laminated electronic component manufacturing apparatus is demonstrated.

As shown in FIG. 1, the laminated electronic component manufacturing apparatus 10 mainly carries out the release process on the surface (outer peripheral surface), and forms the coating roll 12 (film-forming base material) which forms the ceramic sheet S, and the coating roll 12 ), It has the stacking rolls 14 and 15 (lamination support body) which wind up the ceramic sheet | seat S peeled from the () and forms the laminated structure S 'of the ceramic sheet S.

Around the coating roll 12, the film forming means 16 (film forming part) for applying the ceramic slurry which becomes the material of the ceramic sheet S to the surface of the coating roll 12, and the ceramic film to the film forming means 16 The liquid supply means 18 for supplying a slurry, the dry hardening apparatus 20 for dry-solidifying the ceramic slurry on the surface of the coating roll 12, and the outer peripheral surface of the stacking rolls 14 and 15 are wound up (laminated) The electrode circuit forming means 22 (electrode circuit forming part) for forming the electrode circuit 24 (refer FIG. 2) in the ceramic sheet S before, and the dry hardening apparatus for drying the electrode circuit 24 ( 26 and the stacking rolls 14 and 15 are arranged.

In the laminated electronic component manufacturing apparatus 10 of this embodiment, the electrode circuit 24 is formed in the ceramic sheet S before being wound by the outer peripheral surfaces of the stacking rolls 14 and 15, and the electrode circuit 24 is then formed. The formed ceramic sheet S is wound (laminated) on the outer circumferential surfaces of the stacking rolls 14 and 15 to form a laminated structure S 'of the ceramic sheet S.

Further, a dry curing apparatus for drying and solidifying the ceramic slurry on the surface of the coating roll 12 on the downstream side of the coating roll rotation direction (between the film forming means 16 and the electrode circuit forming means 22) of the film forming means 16 ( 20) is arranged. Moreover, the dry hardening apparatus 26 for drying the electrode circuit 24 is arrange | positioned downstream of the coating roll rotation direction (between the electrode circuit forming means 22 and the stacking roll 14) of the electrode circuit forming means 22. It is.

Specifically, the coating roll 12 is a rigid roll (cylindrical shape or cylindrical shape), such as a metal, to which the release process was given to the surface, and is comprised by the base material of an endless continuous shape. The coating roll 12 is comprised so that rotation drive may be carried out by the drive source which is not shown in figure. In addition, a mold release process corresponds to a fluorine-type plating process etc., for example.

The stacking rolls 14 and 15 are comprised by attaching an elastic body (for example, a resin film, an elastic film, rubber | gum, a viscous sheet, etc.) to the outer peripheral surface of the removable cylindrical jig | tool. This cylindrical jig is mounted on a rotating shaft to rotate in synchronism with the coating roll 12. In addition, the stacking rolls 14 and 15 may be comprised so that rotation may be carried out by the drive source which is not shown in figure, and may be comprised so that it may rotate simultaneously with the rotational force of the coating roll 12. FIG. The stacking rolls 14 and 15 are pressed against the coating roll 12 at a predetermined pressure (pressure force) by a pressure applying mechanism (not shown). The stacking rolls 14 and 15 are comprised so that either the stacking roll 14 or the stacking roll 15 may be pressed against the coating roll 12 by the changer mechanism which is not shown in figure.

The surface of the elastic body of the stacking roll 14 holds the ceramic sheet S by a means such as adhesion or electrostatic adsorption. In addition, in the ceramic sheet S wound by the stacking roll 14, the sheet layers overlapping each other are crimped | bonded and hold | maintained. Since the holding force is set larger than the force holding the ceramic sheet S, the ceramic sheet S is peeled off from the coating roll 12 and transferred to the stacking roll 14. The same applies to the stacking roll 15.

In order to reliably transfer the ceramic sheet S from the coating roll 12 to the stacking roll 14, it is preferable to transfer the stacking roll while pressing the coating roll 12 appropriately. For example, if there is a space between the coating roll 12 and the stacking roll 14, the ceramic sheet S being conveyed will make a section which is not supported by another member, and there exists a possibility that sheet breakage may occur in the section. Therefore, the stacking roll 14 is appropriately pressed against the coating roll 12 so as not to create a section in which the ceramic sheet S is not supported. The surface of the stacking roll 14 has elasticity so that mechanical distortion does not occur when pressing.

Here, the outer circumferential length of the coating roll 12 is the same length as the outer circumferential length of the stacking rolls 14 and 15, or one of the outer circumferential length of the coating roll 12 or the outer circumferential length of the stacking rolls 14 and 15 is different. It is preferable that it is an integer multiple with respect to the side.

As the film forming means 16, for example, an extrusion coating method such as a die coater, a doctor blade, a roll coater, an inkjet coater, or the like is adopted. The extrusion coating method refers to a method of extruding and applying a coating liquid from a lip of a die. Moreover, in order to make thinner the film thickness of the ceramic sheet | seat S formed in the outer peripheral surface of the coating roll 12, it is preferable to provide an upstream pressure reduction mechanism in a die coater. The ceramic sheet S is formed by applying the ceramic slurry continuously (nonintermittently) to the coating roll 12 from the film forming means 16. In this way, the ceramic slurry is continuously supplied to the same coating roll 12.

As the liquid supply means 18, for example, a gear pump is employed. In addition, the liquid supply means 18 is not limited to a gear pump, You may employ | adopt a cylindrical dispenser, a diaphragm pump, etc. suitably.

As the electrode circuit forming means 22, for example, an inkjet printing apparatus is employed. The electrode circuit forming means 22 is preferably a plateless printing means, but the electrode circuit 24 after drying may be transferred, and means such as intaglio printing and intaglio offset printing may be used. As the electrode material ink used in the electrode circuit forming means 22, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent is used. What disperse | distributed Ni powder to UV curable resin may be sufficient. In particular, it is preferable to use a solvent with low swelling property with respect to a ceramic coating film. In addition, the solvent may be an aqueous system.

As the dry hardening apparatus 20,26, the method of drying by hot air and the method of heating the outer peripheral surface of the coating roll 12 are employ | adopted, for example. When using UV curable resin, you may irradiate and harden UV. The dry curing apparatuses 20 and 26 are for drying or curing the applied ceramic slurry or electrode material ink. In addition, you may use a vacuum drying means for the dry hardening apparatus 20 for drying the ceramic slurry on the coating roll 12. As shown in FIG.

As a ceramic slurry, what melt | dissolved and disperse | distributed the ceramic powder and resin in the organic solvent is employ | adopted, for example. You may use what disperse | distributed the ceramic powder to UV hardening resin. In addition, the solvent may be aqueous.

Next, the manufacturing method of the laminated structure S 'of the ceramic sheet S using the laminated electronic component manufacturing apparatus 10 is demonstrated.

The coating roll 12 which performed the mold release process is rotated at a predetermined speed, and a ceramic slurry is apply | coated to this outer peripheral surface by the film-forming means 16. FIG. In addition, supply of a ceramic slurry is performed using the gear pump which is a liquid supply means 18. As shown in FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 using the dry curing apparatus 20. Here, hot air of a predetermined temperature is used for drying the ceramic slurry by the dry curing device 20. The temperature is adjusted by heating or cooling with a separate temperature controller so that the outer circumferential surface of the coating roll 12 is an appropriate temperature. In addition, these temperatures are adjusted suitably according to the material of the ceramic sheet S. FIG. In this way, the ceramic slurry is continuously supplied to the coating roll 12 by the film forming means 16 and the liquid supply means 18, and the ceramic sheet S is continuously formed. The ceramic sheet S on which the electrode circuit 24 is not printed is wound by the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '.

Next, the electrode material ink is applied from the electrode circuit forming means 22 to the ceramic sheet S on the coating roll 12, and the electrode circuit (internal electrode circuit) 24 having a predetermined figure pattern is printed. After printing of the electrode circuit 24, the warm air of a predetermined temperature is blown from the dry curing device 26 to dry the electrode circuit 24. Here, in the process of forming the electrode circuit, the electrode printing is performed by changing the figure pattern so that the electrode circuit 24 becomes the counter electrode for each layer (each circumference) when the electrode circuit 24 is wound around the outer circumferential surfaces of the stacking rolls 14 and 15. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the coating roll 12.

Next, the stacking roll 14 is pressed against the coating roll 12 through the ceramic sheet S at a predetermined pressing force. In addition, it is necessary to adjust the said pressing force suitably according to the material of the ceramic sheet S. FIG. And the dried ceramic sheet S (electrode circuit formation completed) formed in the outer peripheral surface of the coating roll 12 is peeled from the outer peripheral surface of the coating roll 12, and it transfers around the outer peripheral surface of the stacking roll 14, and winds up. Here, since the release process is given to the outer peripheral surface of the coating roll 12, and the stacking roll 14 is contacting the coating roll 12 through the ceramic sheet S at predetermined | prescribed pressing force, the coating roll 12 After drying, the ceramic sheet S formed on the outer circumferential surface of the sheet 9 is easily peeled from the outer circumferential surface of the coating roll 12 and transferred to the outer circumferential surface of the stacking roll 14. In the stacking roll 14, an elastic resin film is wound around the outer circumferential surface of the metal cylindrical jig, and the temperature is adjusted so that the temperature of the outer circumferential surface becomes a predetermined temperature. In addition, the temperature of the outer peripheral surface needs to be adjusted appropriately according to the material of the ceramic sheet S. FIG.

After winding the ceramic sheet S by the stacking roll 14 by a predetermined layer, printing of the electrode circuit 24 by the electrode circuit forming means 22 is stopped. Subsequently, the unprinted ceramic sheet S of the electrode circuit 24 is wound around the stacking roll 14 by a predetermined layer to form an outer layer portion of the laminated structure S '. Then, supply of the ceramic slurry to the coating roll 12 is stopped and the formation of the laminated structure S 'of the ceramic sheet S is complete | finished, or instead of the stacking roll 14 by a changer mechanism (15) is brought into pressure contact with the outer circumferential surface of the coating roll 12 to wind up the ceramic sheet S (after forming the electrode circuit 24) on the outer circumferential surface of the coating roll 15. In this way, the laminated structure S 'of the ceramic sheet S is formed.

Further, the laminated structure S 'of the ceramic sheet S formed on the stacking roll 14 is separated together with the cylindrical jig, press-pressed while being cylindrical, and chip-shaped by dicer cutting. Cut. Thereafter, firing, an electrode circuit (external electrode circuit) is formed, and a multilayer ceramic capacitor is manufactured through a normal manufacturing process.

According to the laminated electronic component manufacturing apparatus and manufacturing method of the laminated electronic component of 1st Embodiment, when there exist a micro wound or protrusion on the outer peripheral surface of the coating roll 12, it is repeated in the apply | coated ceramic sheet S to a defect part. (28) occurs, but by using the same coating roll 12 repeatedly, the defective portion 28 can be concentrated in a limited region in the laminated structure S 'wound in a cylindrical shape on the stacking roll 14. . Thus, generation | occurrence | production of a quality defect can be suppressed in the electronic component obtained by cut | disconnecting and dividing | stacking the laminated structure S 'of the ceramic sheet S obtained.

In addition, when the ceramic sheet S is peeled off from the coating roll 12 and wound around the outer circumferential surface of the stacking roll 14 to form the laminated structure S 'of the ceramic sheet S, a new coating roll 12 is applied to the coating roll 12. Since the ceramic sheet S is formed continuously, formation of the ceramic sheet S in the coating roll 12 and formation of the laminated structure S 'of the ceramic sheet S in the stacking roll 14 are performed. Run concurrently. Thereby, the ceramic sheet S can be formed continuously without stopping rotation drive of the coating roll 12 once, and also ceramic sheet S continuously without stopping rotation drive of the stacking roll 14 once. ) Laminated structure (S ') can be produced. Thus, the laminated structure S 'of the ceramic sheet S can be formed by continuous operation instead of intermittent operation. As a result, the laminated structure S 'of the ceramic sheet S can be formed in a very short time, and the manufacturing efficiency of the laminated structure S' of the ceramic sheet S can be improved.

Moreover, since the ceramic sheet S is formed on the coating roll 12 which is a rigid body, and conveys from sheet molding to the sheet | seat lamination process, supporting a sheet surface with the coating conveyance roll 12 or the transfer roll 14, it is thin, Even when the low-strength ceramic sheet S is used, cracking and damage of the ceramic sheet S can be suppressed. As a result, the handling property of the thin, low-strength ceramic sheet S can be improved.

In addition, as shown in FIG. 1, the defect part 28 is specified as shown in FIG. 2 by making the outer periphery length of the coating roll 12 and the stacking roll 14 the same, or making one other the integer ratio. I can concentrate more on a point. When the outer circumferential length is not in the ratio of water, the defect portion 28 generated in the laminated structure S 'of the ceramic sheet S on the stacking roll 14 is on the same circumferential raceway of the stacking roll 14 (ceramic sheet). ) In the same row of the laminated structure as viewed from the conveying direction. In addition, when the outer circumferential length of the stacking roll 14 is longer than the outer circumferential length of the coating roll 12 by the integral number, the defect part which arises in the laminated structure S 'of the ceramic sheet S on the stacking roll 14 ( 28 can be collected on the same coordinates of the stacking roll 14 (same rows and columns of the laminated structure when the ceramic sheet is viewed from the conveying direction).

Moreover, the uniformity and the high productivity of the film thickness of the ceramic sheet S are obtained rather than the method using the intermittent application | coating of a well-known ceramic slurry. That is, since the laminated structure S 'of the ceramic sheet S is continuously formed in cylindrical shape, compared with the intermittent application | coating, the stable area | region of film thickness becomes wider. As a result, the electronic component of stable quality can be acquired from the laminated structure S 'of the ceramic sheet S. FIG. The number of electronic components which can be acquired per unit volume of the laminated structure of the ceramic sheet S increases.

In addition, in this embodiment, since it is not necessary to use the intermediate consumer goods of disposable base materials (PET film etc.), since the intermediate material cost including storage, transportation, etc. can be reduced, the laminated structure S 'of the ceramic sheet S is carried out. Furthermore, the manufacturing cost of an electronic component can be reduced significantly.

In addition, in this embodiment, only the ceramic sheet S which is needed is formed only by connecting a film forming process, a printing process, and a lamination process, and loss, the number of lamination steps, etc. in the conveyance path of a lamination | stacking do not occur like conventionally, The loss can be reduced.

In addition, in this embodiment, since the electrode circuit 24 is formed before the ceramic sheet S is laminated | stacked on the outer peripheral surface of the stacking roll 14, in other words, after the electrode circuit 24 is formed in the ceramic sheet S, The ceramic sheet S on which the electrode circuit 24 is formed is wound and laminated on the outer circumferential surface of the stacking roll 14. For example, when the electrode circuit 24 is formed on the ceramic sheet S after the ceramic sheet S is laminated on the outer circumferential surface of the stacking roll 14, the electrode circuit 24 formed on the lower ceramic sheet S, or An electrode solvent causes a sheet attack to occur in the ceramic sheet S in which lower electrode circuit formation was completed, and a sheet attack occurs. When the electrode circuit is formed in the state of the single-layer ceramic sheet as in the present invention, the influence of the sheet attack can be suppressed to the minimum of the single-layer, so that problems such as short or IR failure (poor insulation resistance) can be reduced. .

In particular, since the formation of the ceramic sheet S and the formation of the electrode circuit 24 on the coating roll 12 are performed at the same time, the whole of a single facility can be made simple and compact, thereby reducing the cost of the facility and making the area small. It can also increase the reliability of the equipment.

Moreover, since the ceramic sheet S is laminated | stacked on the stacking roll 14 which dried the ceramic slurry on the coating roll 12, and separately installed, the ceramic slurry is not apply | coated on the dried ceramic sheet S. No sheet attack due to remelting occurs.

In addition, by using a plateless printing method such as an inkjet for forming the electrode circuit 24, it is possible to form an electrode circuit 24 having a different electrode pattern for each layer of the ceramic sheet S. FIG. Particularly, even if the deformation of the ceramic sheet S or the outer diameter of the stacking roll 14 increases due to the progress of the lamination of the ceramic sheet S, or the peripheral length increases, the pattern and the forming position of the electrode circuit 24 are freely opened. Since it can change, the pitch (interval) between the electrode circuits 24 is adjusted suitably, and the formation of the electrode circuit 24 without a position shift is attained.

In addition, in 1st Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "laminated support body" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 2nd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 3, in 2nd Embodiment, the printing conveyance roller (transport member) 30 is contacting the coating roll 12 via the ceramic sheet | seat S. FIG. In addition, the intermediate conveying roller (conveying member) 32 is in contact with the print conveying roller 30 via the ceramic sheet S. FIG. Two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate transfer roller 32 via the ceramic sheet S. As shown in FIG. The press rolls 34 and 36 are in contact with the two stacking rolls 14 or the stacking rolls 15 through the ceramic sheet S, respectively. Thus, the printing conveyance roller 30 and the intermediate conveyance roller 32 are interposed between the coating roll 12 and each stacking roll 14 and 15. For this reason, the coating roll 12 and each of the stacking rolls 14 and 15 are in an indirectly contacted state (a state in which mechanical power transmission is possible).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. Is arranged. In addition, the electrode circuit forming means 22 for forming the electrode circuit 24 in the ceramic sheet S before being wound (laminated) on the outer circumferential surfaces of the stacking rolls 14 and 15 around the printing conveying roller 30. (Electrode circuit forming portion), a dry curing apparatus 26 for drying the electrode circuit 24 located on the downstream side of the first supply roll rotation direction of the electrode circuit forming means 22, and the above-mentioned intermediate conveying roller ( 32) are arranged.

Here, the printing conveyance roller 30 and the intermediate conveyance roller 32 have a function which receives the ceramic sheet S from a previous process by means of adhesion | attachment, etc., and supplies the received ceramic sheet S to a later process. have. The printing conveyance roller 30 and the intermediate conveyance roller 32 select suitably the rigid roll of a metal or resin, the roll which coated resin on the surface, etc.

The force that the print conveying roller 30 holds the ceramic sheet S is greater than the force that the coating roll 12 holds the ceramic sheet S, and the intermediate conveying roller 32 holds the ceramic sheet S. Since it is set smaller than the force to be made, the ceramic sheet S is peeled from the coating roll 12, it is hold | maintained by the printing conveyance roller 30, and is transferred to the intermediate | middle conveyance roller 32 after that. Since the force which the intermediate conveyance roller 32 hold | maintains the ceramic sheet | seat S is set smaller than the force which the stacking roll 14 hold | maintains the ceramic sheet | seat S, the ceramic sheet | seat S is the intermediate | middle conveyance roller 32 It peels off and is transferred to the stacking roll 14. The surface of the elastic body of the stacking roll 14 holds the ceramic sheet S by a means such as adhesion or electrostatic adsorption. In addition, in the ceramic sheet S wound by the stacking roll 14, the sheet layers overlapping each other are crimped | bonded and hold | maintained. Since the holding force is set larger than the force holding the ceramic sheet S, the ceramic sheet S is peeled off from the intermediate conveying roller 32 and transferred to the stacking roll 14.

In detail, the printing conveyance roller 30 has a function which peels the ceramic sheet S from the coating roll 12, and transfers to the intermediate conveyance roller 32. As shown in FIG. Moreover, the intermediate conveyance roller 32 has a function which peels the ceramic sheet S from the printing conveyance roller 30, and transfers it to the stacking roll 14. As shown in FIG. The printing conveyance roller 30 and the intermediate conveyance roller 32 may be a peeling conveyance roll which adsorb | sucks (suctions or electrostaticssorbs) the ceramic sheet S, and peels and conveys them. At this time, it is preferable that the printing conveyance roller 30 and the intermediate conveyance roller 32 are comprised so that the site | part which adsorbs the ceramic sheet S and the site | part which does not adsorb | suck are controlled. When receiving the ceramic sheet S from the coating roll 12, it has a adsorption function to the predetermined site | part of the printing conveyance roller 30 which contacts the ceramic sheet S, and receives the received ceramic sheet S as an intermediate conveyance roller. Receiving and transferring ceramic sheet S can be performed smoothly by having a non-adsorption area | region in the predetermined site | part of the printing conveyance roller 30 which contacts the ceramic sheet S when transferring to 32. FIG. The same applies to the intermediate transfer roller 32 for the adsorption function and the non-adsorption region. That is, when receiving the ceramic sheet S from the printing conveyance roller 30, it has a adsorption function to the predetermined site | part of the intermediate conveyance roller 32 which contacts the ceramic sheet S, and receives the received ceramic sheet S. Receiving and transferring ceramic sheet S can be performed smoothly by having a non-adsorption area | region in the predetermined site | part of the intermediate | middle conveyance roller 32 which contacts the ceramic sheet S when transferring to the stacking roll 14. FIG.

In the second embodiment, the ceramic slurry is supplied to the outer circumferential surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. In this way, the ceramic sheet S is formed. Moreover, the electrode material ink is apply | coated from the electrode circuit forming means 22 (for example, inkjet printing) with respect to the ceramic sheet | seat S which moved on the printing conveyance roller 30 from the coating roll 12, and predetermined figure pattern The electrode circuit 24 is printed. After printing of the electrode circuit 24, the warm air of a predetermined temperature is sprayed from the dry curing apparatus 26 on the ceramic sheet S on the print conveying roller 30 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the printing conveyance roller 30. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveying roller 32 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. Thus, also in 2nd Embodiment, after the electrode circuit 24 is formed in the ceramic sheet S, the ceramic sheet S in which the electrode circuit 24 formation was completed is wound up and laminated | stacked on the outer peripheral surface of the stacking roll 14, and is laminated | stacked. . The outer peripheral surfaces of the coating roll 12, the printing conveyance roller 30, and the stacking roll 14 are temperature-controlled by a temperature controller so as to be a proper temperature.

According to 2nd Embodiment, peeling of the ceramic sheet | seat S from the coating roll 12 does not affect the state on the stacking roll 14 side, and stable handling is attained. Specifically, when the stacked structure S 'of the ceramic sheet S is formed on the stacking roll 14, the size (outer diameter) including the ceramic sheet of the stacking roll 14 increases, and the electrode circuit 24 The change in the state of the appearance such as irregularities of the formed site. However, by interposing the printing conveying roller 30 and the intermediate conveying roller 32 between the coating roll 12 and the stacking roll 14, the stacking roll 14 and the printing conveyance according to the state change of the said stacking roll 14 are carried out. The positional relationship, pressure, etc. of the roller 30 and the intermediate | middle conveyance roller 32 can be adjusted suitably. Thereby, deterioration of the quality of the laminated structure S 'of the ceramic sheet S formed on the stacking roll 14 by the state change of the stacking roll 14 can be prevented. In addition, the ceramic sheet S in which the stacking roll 14 is formed on the coating roll 12 according to the change of the state of the stacking roll 14 by designing the stacking roll 14 so as not to directly contact the coating roll 12. Damage to the ceramic sheet S can be prevented, and deterioration of the quality of the ceramic sheet S and thus the electronic components can be prevented.

Moreover, by providing the printing conveyance roller 30 and the intermediate conveyance roller 32, the path | route which the ceramic sheet | seat S moves to can be lengthened until it is supplied to the stacking roll 14, without making the coating roll 12 large. Therefore, the drying time of the ceramic sheet S and the electrode circuit 24 can be long. And since the ceramic slurry is continuously apply | coated to the coating roll 12 continuously until it is supplied from the coating roll 12 to the stacking roll 14 through the printing conveyance roller 30 and the intermediate conveyance roller 32, The movement process of the ceramic sheet S can be performed continuously. As a result, the line speed of the equipment can be increased to increase the manufacturing speed (manufacturing efficiency) of the ceramic sheet S, and the manufacturing efficiency of the laminated structure S 'of the ceramic sheet S, and moreover, the electronic component can be improved. have.

In addition, the electrode circuit 24 is formed in the ceramic sheet S on the print conveyance roller 30. Thereby, since the electrode circuit 24 is formed with respect to the ceramic sheet S dried reliably on the coating roll 12, the positional precision of the formation position of the electrode circuit 24 can be improved further. On the contrary, when the electrode circuit 24 is formed with respect to the semi-dry ceramic sheet S, since the ceramic sheet S used as a ground deform | transforms, there exists a possibility that the position of the electrode circuit 24 formed thereon may also shift | deviate. In order to solve this problem, 2nd Embodiment forms the electrode circuit 24 with respect to the ceramic sheet | seat S reliably dried on the coating roll 12. As shown in FIG.

In addition, in 2nd Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "lamination support body" of this invention. In addition, the printing conveyance roller 30 and the intermediate conveyance roller 32 correspond to the "conveying member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 3rd Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of said each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 4, in the third embodiment, the electrode circuit 24 is formed on the ceramic sheet S on the endless conveyance belt (conveying member) 38. That is, the intermediate conveying roller (conveying member) 40 is in contact with the coating roll 12 via the ceramic sheet S. As shown in FIG. In addition, the endless conveyance belt 38 is contacting the intermediate conveyance roller 40 via the ceramic sheet | seat S. FIG. In addition, the intermediate conveyance roller (conveying member) 42 is in contact with the endless conveyance belt 38 via the ceramic sheet S. FIG. Two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate transfer roller 42 via the ceramic sheet S. As shown in FIG. The press rolls 34 and 36 are in contact with the two stacking rolls 14 or the stacking rolls 15 through the ceramic sheet S, respectively. Thus, the intermediate | middle conveyance roller 40, the infinite conveyance belt 38, and the intermediate | middle conveyance roller 42 are interposed between the coating roll 12 and each stacking roll 14 and 15. As shown in FIG. For this reason, the coating roll 12 and each of the stacking rolls 14 and 15 are in an indirectly contacted state (a state in which mechanical power transmission is possible).

Moreover, the film-forming means 16 (film-forming part) and film-forming means 16 for apply | coating the ceramic slurry which becomes a material of ceramic sheet S on the surface of the coating roll 12 around the coating roll 12 are formed. A liquid supply means 18 for supplying a ceramic slurry to the film, and a dry curing apparatus 20 for drying and solidifying the ceramic slurry on the surface of the coating roll 12 located downstream of the coating roll rotational direction of the film forming means 16. And the said intermediate conveyance roller 40 is arrange | positioned. In addition, the electrode circuit forming means 22 for forming the electrode circuit 24 in the ceramic sheet S before being wound (laminated) on the outer circumferential surfaces of the stacking rolls 14 and 15 around the endless conveyance belt 38. And the dry hardening apparatus 26 for drying the electrode circuit 24 located in the endless belt rotation direction downstream of the electrode circuit forming means 22, and the said intermediate conveyance roller 42 are arrange | positioned.

In detail, the intermediate conveyance roller 40 has a function which peels the ceramic sheet | seat S from the coating roll 12, and transfers to the endless conveyance belt 38. As shown in FIG. In the third embodiment, the electrode circuit 24 is not formed in the ceramic sheet S on the intermediate transfer roller 40. The endless conveyance belt 38 has a function of peeling the ceramic sheet S from the intermediate conveying roller 40 and transferring it to the intermediate conveying roller 42. Moreover, the intermediate conveyance roller 42 has a function which peels the ceramic sheet | seat S from the infinite conveyance belt 38, and transfers to the stacking roll 14. As shown in FIG.

In 3rd Embodiment, the ceramic slurry is apply | coated and supplied to the outer peripheral surface of the coating roll 12 by the film-forming means 16 and the liquid supply means 18. As shown in FIG. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. In this way, the ceramic sheet S is formed. Moreover, the electrode material ink from the electrode circuit forming means 22 (for example, inkjet printing) with respect to the ceramic sheet S which moved from the coating roll 12 to the endless conveyance belt 38 on the intermediate conveyance roller 40. Is applied, and the electrode circuit (internal electrode circuit) 24 of a predetermined figure pattern is printed. After printing of the electrode circuit 24, the warm air of a predetermined temperature is blown from the dry curing apparatus 26 to the ceramic sheet S on the endless conveyance belt 38 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the endless conveyance belt 38. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveying roller 42 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. Thus, also in 3rd Embodiment, after the electrode circuit 24 is formed in the ceramic sheet S, the ceramic sheet S in which the electrode circuit 24 formation was completed is wound up and laminated | stacked on the outer peripheral surface of the stacking roll 14, and is laminated | stacked. .

According to the third embodiment, since the outer circumferential length of the endless conveying belt 38, which is a long belt, is longer than the outer circumferential length of the coating roll 12 or the outer circumferential length of the intermediate conveying roller 40, the endless conveying belt 38 The drying area | region (region which can be dried by the dry curing apparatus 26) of the ceramic sheet S on () can be extended. Thereby, the formation speed (including the drying speed) of the electrode circuit 24 of the ceramic sheet S on the ceramic sheet S becomes high, and also the manufacturing speed of an electronic component can be raised.

In particular, when the inkjet method is employed for the electrode circuit forming means 22, the ink is difficult to dry because the amount of the solvent is large. Therefore, by employing the endless conveying belt 38 in the printing portion of the electrode circuit 24, the moving distance of the ceramic sheet S becomes long even when the roll of a large diameter is not employed, thereby providing the electrode circuit 24 on the ceramic sheet S. The time for drying can be lengthened. For this reason, the quality deviation of the electrode circuit 24 formed by the inkjet system is eliminated, and the quality of an electronic component can be maintained at high quality.

In addition, in 3rd Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "laminated support body" of this invention. In addition, the intermediate conveyance roller 40, the infinite conveyance belt 38, and the intermediate conveyance roller 42 correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concern on 4th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of said each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 5, 4th Embodiment comprises the coating roll 12 of 1st Embodiment by the infinite film forming belt 44 which is a long belt. That is, the intermediate conveyance roller (conveying member) 46 is in contact with the endless film forming belt 44 for forming (film forming) the ceramic sheet S through the ceramic sheet S. FIG. In addition, two stacking rolls 14 or stacking rolls 15 are in contact with the intermediate conveying roller 46 via the ceramic sheet S. FIG. The press rolls 34 and 36 are in contact with the two stacking rolls 14 or the stacking rolls 15 through the ceramic sheet S, respectively. In this manner, an intermediate conveying roller 46 is interposed between the endless film forming belt 44 and the stacking rolls 14 and 15. For this reason, the infinite film forming belt 44 and each of the stacking rolls 14 and 15 are in an indirectly contacted state (a state in which mechanical power transmission is possible).

In particular, the film forming means 16 (film forming part) for applying the ceramic slurry, which is a material of the ceramic sheet S, to the surface of the infinite film forming belt 44 around the infinite film forming belt 44, and the film forming means ( A liquid supply means 18 for supplying a ceramic slurry to 16 and a dry hardening apparatus for dry solidifying the ceramic slurry on the surface of the endless film formation belt 44 located on the downstream side of the endless belt rotation direction of the film formation means 16. (20), a film thickness inspection device (CCD camera, etc.) 48 for measuring the film thickness of the ceramic sheet S, and a ceramic sheet before being wound (laminated) on the outer circumferential surfaces of the stacking rolls 14, 15 ( Drying apparatus for drying the electrode circuit 24 located in the electrode circuit forming means 22 for forming the electrode circuit 24 in S, and downstream of the endless belt rotation direction of the electrode circuit forming means 22. (26), the removal roll 50 which removes the defective ceramic sheet S, and an image It is arranged intermediate the conveying roller 46.

In the fourth embodiment, the ceramic slurry is supplied to the outer peripheral surface of the endless film forming belt 44 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified by the dry curing device 20 on the endless film forming belt 44. In this way, the ceramic sheet S is formed. In addition, the film thickness of the ceramic sheet S on the infinite film forming belt 44 is measured by the film thickness inspection apparatus (CCD camera etc.) 48. The electrode material ink is apply | coated to the ceramic sheet S from the electrode circuit formation means 22, and the electrode circuit 24 of a predetermined figure pattern is printed. After printing of the electrode circuit 24, the warm air of a predetermined temperature is blown from the dry curing device 26 to the ceramic sheet S on the endless film forming belt 44 to dry the electrode circuit 24. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the endless film forming belt 44. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveying roller 46 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. Thus, also in 4th Embodiment, after the electrode circuit 24 is formed in the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 formation was completed is wound up and laminated | stacked on the outer peripheral surface of the stacking roll 14, and is laminated | stacked. .

Here, when the ink-jet method is adopted for the electrode circuit forming means 22, the ink becomes difficult to dry because the amount of the solvent of the ink is large. Therefore, by employing the endless film forming belt 44 in the printing portion, the moving distance of the ceramic sheet S becomes long even without employing a large-diameter roll, thereby increasing the time for drying the electrode circuit 24 on the ceramic sheet S. Can be. For this reason, the quality deviation of the electrode circuit 24 formed by the inkjet system is eliminated, and the quality of an electronic component can be maintained at high quality.

In addition, in 4th Embodiment, the endless film-forming belt 44 respond | corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "lamination support body" of this invention. In addition, the intermediate conveyance roller 46 corresponds to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 5th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of said each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 6, 5th Embodiment employ | adopts the gravure offset printing system as a printing means of the electrode circuit 24. As shown in FIG. That is, the intermediate conveying roller (conveying member) 52 is in contact with the coating roll 12 via the ceramic sheet S. As shown in FIG. Moreover, the printing conveyance roller (conveyance member) 54 used when forming the electrode circuit 24 in the ceramic sheet S is in contact with the intermediate conveyance roller 52 via the ceramic sheet S. As shown in FIG. The intermediate conveying roller (conveying member) 56 is in contact with the print conveying roller 54 via the ceramic sheet S. FIG. The stacking roll 14 is in contact with the intermediate transfer roller 56 via the ceramic sheet S. FIG. The press rolls 34 and 36 are in contact with the stacking roll 14 through the ceramic sheet S. As shown in FIG. Thus, the intermediate conveyance roller 52, the printing conveyance roller 54, and the intermediate conveyance roller 56 are interposed between the coating roll 12 and each stacking roll 14. As shown in FIG. For this reason, the coating roll 12 and each stacking roll 14 are in the state which contacted indirectly (the state which enables mechanical power transmission).

Moreover, around the coating roll 12, the film-forming means 16 for apply | coating the ceramic slurry which becomes a material of a ceramic sheet S on the surface of the coating roll 12, and a ceramic slurry are supplied to the film-forming means 16. The liquid supply means 18, the dry hardening apparatus 20 for dry solidifying the ceramic slurry on the surface of the coating roll 12 located in the coating roll rotation direction downstream of the film forming means 16, and an intermediate conveyance roller 52 is arranged. In addition, the electrode circuit forming means 22 for forming the electrode circuit 24 in the ceramic sheet S before being wound (laminated) on the outer circumferential surface of the stacking roll 14 around the printing conveying roller 54; The dry hardening apparatus 26 for drying the electrode circuit 24, the said intermediate | middle conveyance roller 52, and the intermediate | middle conveyance roller 56 are arrange | positioned.

Here, the gravure offset printing method is adopted for the electrode circuit forming means 22. That is, the electrode circuit forming means 22 of the gravure offset printing method includes a pattern forming roll 22A engraved with a groove (a groove filled with a conductive paste) corresponding to the pattern of the conductive paste film to be the electrode circuit 24 on the outer circumferential surface thereof. And the transfer roll 22B to which the pattern formed on the pattern forming roll 22A is transferred. In addition, the pattern transferred on the transfer roll 22B is dried by injecting warm air of a predetermined temperature from the dry curing device 26. The pattern of the electrode circuit 24 transferred on the transfer roll 22B is transferred to the print conveying roller 54 so that the electrode circuit 24 of a predetermined pattern is formed on the ceramic sheet S on the print conveying roller 54. do.

According to the fifth embodiment, the ceramic slurry is supplied to the outer circumferential surface of the coating roll 12 by the film forming means 16 and the liquid supply means 18. Then, the ceramic slurry is dried and solidified on the coating roll 12 by the dry curing device 20. In this way, the ceramic sheet S is formed. The ceramic sheet S on the coating roll 12 moves to the intermediate conveying roller 52 and the printing conveying roller 54. The electrode circuit 24 of a predetermined pattern is transferred and formed from the transfer roll 22B with respect to the ceramic sheet S on the printing conveyance roller 54. In this way, the electrode circuit 24 is formed with respect to the ceramic sheet S on the printing conveyance roller 54. Thereafter, the ceramic sheet S on which the electrode circuit 24 is formed is received by the intermediate conveying roller 56 and wound and laminated on the outer circumferential surface of the stacking roll 14. Thereby, the laminated structure S 'of the ceramic sheet S is formed. Thus, also in 5th Embodiment, after the electrode circuit 24 is formed in the ceramic sheet S, the ceramic sheet S on which the electrode circuit 24 formation was completed is wound up and laminated | stacked on the outer peripheral surface of the stacking roll 14, and is laminated | stacked. .

In addition, in 5th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking roll 14 corresponds to the "laminated support body" of this invention. In addition, the intermediate conveyance roller 52, the printing conveyance roller 54, and the intermediate conveyance roller 56 correspond to the "conveyance member" of this invention.

Next, the manufacturing method of the laminated electronic component manufacturing apparatus and laminated electronic component which concerns on 6th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of said each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 7, the sixth embodiment is based on the configuration of the first embodiment and a part thereof is improved, and is intermediate between the coating roll 12 and the stacking roll 14 or the stacking roll 15. It is the structure through which the conveyance roller (conveyance member) 58 was interposed.

In 6th Embodiment, the electrode circuit 24 is formed in the ceramic sheet S on the coating roll 12, and the ceramic sheet S in which the electrode circuit 24 was formed is received by the intermediate conveyance roller 58. As shown in FIG. And the ceramic sheet S received by the intermediate conveyance roller 58 is wound up and laminated | stacked on the outer peripheral surface of the stacking roll 14, and the laminated structure S 'of the ceramic sheet S is formed.

According to 6th Embodiment, since the intermediate conveyance roller 58 is interposed between the coating roll 12 and the stacking roll 14 or the stacking roll 15, it is the coating roll similarly to the effect of 2nd Embodiment. Peeling of the ceramic sheet S from (12) does not affect the state on the stacking roll 14 side, and stable handling is attained.

In addition, in 6th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "lamination support body" of this invention. In addition, the intermediate conveyance roller 58 corresponds to the "conveyance member" of this invention.

Next, the laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 7th Embodiment of this invention are demonstrated with reference to drawings. In addition, the same code | symbol is attached | subjected to the structure which overlaps with the structure of said each embodiment, and description of the overlapping structure and effect is abbreviate | omitted.

As shown in FIG. 8, 7th Embodiment improved the one part based on the structure of 2nd Embodiment, and is an intermediate conveyance roller which is a separate feed roll between the coating roll 12 and the printing conveyance roller 30. As shown in FIG. It is the structure which interposed (the conveying member) 60.

In the seventh embodiment, the ceramic sheet S formed on the coating roll 12 is supplied to the printing conveying roller 30 through the intermediate conveying roller 60. The electrode circuit 24 is formed in the ceramic sheet S supplied to the printing conveyance roller 30, and the ceramic sheet S in which the electrode circuit 24 was formed is the intermediate conveyance roller 32 from the printing conveyance roller 30. FIG. Received). And the ceramic sheet S received by the 2nd supply roll intermediate conveyance roller 32 is wound and laminated by the outer peripheral surface of the stacking roll 14, and the laminated structure S 'of the ceramic sheet S is formed.

According to 7th Embodiment, since the intermediate conveyance roller 60 is interposed between the coating roll 12 and the printing conveyance roller 30, it carries out from the coating roll 12 similarly to the effect of 2nd Embodiment. Peeling of the ceramic sheet S does not affect the state of the stacking roll 14 side, and stable handling is attained.

In addition, in 7th Embodiment, the coating roll 12 corresponds to the "film-forming base material" of this invention, and the stacking rolls 14 and 15 correspond to the "laminated support body" of this invention. In addition, the intermediate conveyance roller, the printing conveyance roller 30, and the intermediate conveyance roller 32 correspond to the "conveyance member" of this invention.

Next, the laminated electronic component manufacturing apparatus and manufacturing method of a laminated electronic component which concern on 8th-10th embodiment of this invention are demonstrated.

In the eighth embodiment to the tenth embodiment, as shown in FIGS. 9 to 11, the electrode circuit forming means is provided on the coating roll 12 or the endless film forming belt 44 of the endless continuous shape in which the releasing treatment is performed on the outer circumference. The electrode circuit 24 is formed by the reference numeral 22. Subsequently, the ceramic slurry is applied and dried by the film forming means 16 to the coating roll 12 or the endless film forming belt 44 on which the electrode circuit 24 is formed, and the ceramic sheet S on which the electrode circuit is formed is continuously formed. . In addition, the ceramic sheet S on which the electrode circuit is formed is peeled off from the coating roll 12 or the endless film forming belt 44, and the ceramic sheet S on which the peeled electrode circuit is formed is wound around the stacking roll 14. . Thereby, the laminated structure S 'of the ceramic sheet S and the electrode circuit 24 is formed.

10: laminated electronic component manufacturing apparatus 12: coating roll (film formation base material)
14 stacking roll (laminated support) 15 stacking roll (laminated support)
16: film forming means (film forming part)
22: electrode circuit forming means (electrode circuit forming unit)
24: electrode circuit 30: printing conveying roller (conveying member)
32: intermediate conveying roller (conveying member) 38: endless conveying belt (conveying member)
40: intermediate conveying roller (conveying member) 42: intermediate conveying roller (conveying member)
44: endless film forming belt (film forming base material) 46: intermediate conveying roller (conveying member)
52: intermediate conveying roller (conveying member) 54: printing conveying roller (conveying member)
56: intermediate conveying roller (conveying member) 58: intermediate conveying roller (conveying member)
60: intermediate conveying roller (conveying member) S: ceramic sheet
S ': laminated structure of ceramic sheet

Claims (17)

An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
A film forming part which is located near the upstream side in the rotational direction of the film forming substrate, and continuously forms a ceramic sheet by applying and drying a ceramic slurry to the film forming substrate;
An electrode circuit forming portion positioned near a downstream side in the rotational direction of the film forming substrate and forming an electrode circuit with respect to the ceramic sheet on the film forming substrate; And
The ceramic sheet and the electrode, which are in the vicinity after the electrode circuit forming portion, are brought into contact with the film forming substrate through the ceramic sheet to peel the ceramic sheet from the film forming substrate, and the peeled ceramic sheet is wound around the outer periphery. The laminated electronic component manufacturing apparatus which has a laminated support body which forms the laminated structure of a circuit. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
A film forming part which is located near the upstream side in the rotational direction of the film forming substrate, and continuously forms a ceramic sheet by applying and drying a ceramic slurry to the film forming substrate;
An electrode circuit forming portion located near a downstream side in the rotational direction of the film forming substrate and forming an electrode circuit with respect to the ceramic sheet;
A laminated support for forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet around the periphery; And
The ceramic sheet formed on the film forming substrate is provided between the vicinity of the electrode circuit forming portion of the film forming substrate and the vicinity of the upstream side of the film supporting substrate so as to contact the film forming substrate and the laminated support through the ceramic sheet. It has a conveyance member which receives from the said film-forming base material, and conveys this received ceramic sheet to the said laminated support body, The laminated electronic component manufacturing apparatus characterized by the above-mentioned. The method of claim 2,
The electrode circuit forming unit forms the electrode circuit with respect to the ceramic sheet on the conveying member. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming portion positioned near an upstream side in the rotational direction of the film forming substrate and forming an electrode circuit on the film forming substrate;
A film forming part which is located near the downstream side in the rotational direction of the film forming substrate, and continuously forms a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to the film forming substrate on which the electrode circuit is formed; And
In contact with the film forming base material through the ceramic sheet having the electrode circuit formed thereon, and peeling the ceramic sheet having the electrode circuit formed therefrom, from the film forming base material. The laminated electronic component manufacturing apparatus characterized by having a laminated support body which forms the laminated structure of the said ceramic sheet and the said electrode circuit by winding the said ceramic sheet in the outer periphery. An endless continuous shape film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming portion positioned near an upstream side in the rotational direction of the film forming substrate and forming an electrode circuit on the film forming substrate;
A film forming part which is located near the downstream side in the rotational direction of the film forming substrate, and continuously forms a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to the film forming substrate on which the electrode circuit is formed;
A laminated support for forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet having the electrode circuit formed thereon; And
It is provided between the vicinity after the film-forming formation part of the said film-forming base material, and the vicinity of the rotational direction upstream of the said laminated support body so that the said film-forming base material and the said laminated support may contact through the ceramic sheet in which the said electrode circuit was formed, and it is formed in the said film-forming base material. And a conveying member for receiving the ceramic sheet on which the electrode circuit is formed from the film forming substrate and conveying the received ceramic sheet on which the electrode circuit is formed to the laminated support. 6. The method according to any one of claims 1 to 5,
The electrode circuit forming unit is a plateless printing apparatus for performing electrode printing on the ceramic sheet. The method according to claim 6,
Said plateless printing apparatus is comprised with the inkjet printing apparatus and the ink dry hardening apparatus, The laminated electronic component manufacturing apparatus characterized by the above-mentioned. 6. The method according to any one of claims 1 to 5,
The outer peripheral length of the said film-forming base material and the outer peripheral length of the said laminated support body are the same length, or one of the outer peripheral length of the said film-forming base material or the outer peripheral length of the said laminated support body is integer multiple with respect to the other, The laminated electronic component manufacturing apparatus characterized by the above-mentioned. 6. The method according to any one of claims 1 to 5,
When the ceramic sheet is wound on the outer circumference of the laminated support and the laminated structure of the ceramic sheet and the electrode circuit is formed,
The new ceramic sheet is continuously formed on the film forming substrate, characterized in that the laminated electronic component manufacturing apparatus. A film-forming step of continuously forming a ceramic sheet by applying and drying a ceramic slurry by a film-forming forming unit to an endless continuous film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to the ceramic sheet on the film forming substrate; And
Laminating the ceramic sheet and the electrode circuit by peeling the ceramic sheet from the film forming substrate by contacting the laminated support with the film forming substrate through the ceramic sheet, and winding the peeled ceramic sheet around the outer periphery of the laminate support. It has a laminated structure formation process which forms a structure, The manufacturing method of the laminated electronic component characterized by the above-mentioned. A film-forming step of continuously forming a ceramic sheet by applying and drying a ceramic slurry by a film-forming forming unit to an endless continuous film-forming substrate subjected to a release treatment on an outer circumference;
An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion with respect to the ceramic sheet;
A laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on the outer circumference of the laminated support; And
After the film forming step and before the laminated structure forming step, the conveying member receives the ceramic sheet formed on the film forming substrate from the film forming substrate, and the received ceramic sheet is received by the conveying member on the laminated support. It has a conveyance process conveyed to the manufacturing method of the laminated electronic component characterized by the above-mentioned. The method of claim 11,
In the electrode circuit forming step, the electrode circuit is formed with respect to the ceramic sheet on the transfer member. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion on an endless continuous shape film-forming substrate subjected to release processing on an outer circumference;
A film-forming step of continuously forming a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to a film-forming base material on which the electrode circuit is formed by a film forming part; And
By contacting the laminated support through the ceramic sheet on which the electrode circuit is formed with respect to the film forming substrate, the ceramic sheet on which the electrode circuit is formed is peeled from the film forming substrate, and the ceramic sheet on which the electrode circuit is peeled off is formed on the laminated support. It has a laminated structure formation process which forms the laminated structure of the said ceramic sheet and the said electrode circuit by winding up to the outer periphery of the manufacturing method of the laminated electronic component. An electrode circuit forming step of forming an electrode circuit by an electrode circuit forming portion on an endless continuous shape film-forming substrate subjected to release processing on an outer circumference;
A film-forming step of continuously forming a ceramic sheet on which the electrode circuit is formed by applying and drying a ceramic slurry to a film-forming base material on which the electrode circuit is formed by a film forming part;
A laminated structure forming step of forming a laminated structure of the ceramic sheet and the electrode circuit by winding the ceramic sheet on which the electrode circuit is formed on the outer circumference of the laminated support; And
After the film forming step and before the laminated structure forming step, the conveying member receives the ceramic sheet with the electrode circuit formed on the film forming substrate from the film forming substrate, and the ceramic circuit with the electrode circuit received. It has a conveyance process which conveys a sheet | seat to the said laminated body support body by the said conveyance member, The manufacturing method of the laminated electronic component characterized by the above-mentioned. 15. The method according to any one of claims 10 to 14,
A plateless printing apparatus for performing electrode printing on the ceramic sheet as the electrode circuit forming portion is used. The method of claim 15,
An inkjet printing apparatus and an ink dry curing apparatus are used as said plateless printing apparatus, The manufacturing method of the laminated electronic component characterized by the above-mentioned. 15. The method according to any one of claims 10 to 14,
When the ceramic sheet is wound around the outer periphery of the laminated support in the laminated structure forming step, and the laminated structure of the ceramic sheet and the electrode circuit is formed,
In the film forming step, a new ceramic sheet is continuously formed on the film forming substrate.

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