CN102315022A - Laminated electronic component manufacturing installation and laminated electronic component manufacturing approach - Google Patents
Laminated electronic component manufacturing installation and laminated electronic component manufacturing approach Download PDFInfo
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- CN102315022A CN102315022A CN2011101303351A CN201110130335A CN102315022A CN 102315022 A CN102315022 A CN 102315022A CN 2011101303351 A CN2011101303351 A CN 2011101303351A CN 201110130335 A CN201110130335 A CN 201110130335A CN 102315022 A CN102315022 A CN 102315022A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
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- Condensed Matter Physics & Semiconductors (AREA)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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Abstract
The present invention provides a kind of laminated electronic component manufacturing installation and laminated electronic component manufacturing approach; Can suppress the situation that electronic devices and components take place by the poor quality; Reduce cost; And turn round but not intermittent running through continuous, can improve the manufacturing efficient (manufacturing speed) of laminated electronic component.This laminated electronic component manufacturing installation comprises: periphery has been implemented the annular film forming basis material (12) of shape continuously that the demoulding is handled; To film forming basis material (12) thus coating ceramic size and make its drying form the film forming formation portion (16) of potsherd (S) continuously; Potsherd (S) on the film forming basis material (12) is formed the telegraph circuit formation portion of telegraph circuit (24); And with film forming basis material (12) through the contacted range upon range of supporting mass of potsherd (S) (14); This range upon range of supporting mass (14) strips down potsherd (S) from film forming basis material (12); And the potsherd that strips down (S) is wound in periphery, thereby form the laminate structure (S ') of potsherd (S) and telegraph circuit (24).
Description
Technical field
The present invention relates to a kind of laminated electronic component manufacturing installation and laminated electronic component manufacturing approach that is used to make laminated electronic components such as laminated ceramic capacitor.
Background technology
General laminated ceramic capacitor manufacturing approach is at coating ceramic membrane on the rectangular film and after being shaped; Printing above that forms internal electrode; Be cut to desirable size then; Then peel off and carry out range upon range ofly, repeat aforesaid operations and form the duplexer piece, be cut to components and parts unit again from film.
Different with it is; Disclosed a kind of laminated ceramic electronic components and parts manufacturing approach in the following patent documentation 1; This method is carried out range upon range of through a plurality of ceramic green sheets that formation on basis material is obtained, form the duplexer piece, with components and parts unit formed said duplexer piece is cut off; Thereby make the laminated ceramic electronic components and parts; Wherein, constitute the regulations zone that has at least 2 to be formed on the same said basis material in a plurality of said ceramic green sheet of same said duplexer piece, and make direction in the face of each ceramic green sheet towards and the position of each ceramic green sheet consistent in fact carry out range upon range of.
Disclosed following technology in the following patent documentation 2: the 1st flexible is ceaselessly moved; On a surface of the 2nd flexible, be coated with ceramic coating; The undried ceramic coating layer of gained is transferred on the 1st flexible, after transfer printing, the 2nd flexible is peeled off from the ceramic coating layer, and at the surface printing electrode that is transferred to the ceramic coating layer on the 1st flexible; And make pole drying, on the 1st flexible, repeat above-mentioned operation then.
Disclosed a kind of laminated body producing device in the following patent documentation 3; This device is used for making by containing pottery and organically combining the composition of material and have the formed laminated electronic component of neutral raw cook of the predetermined pattern that is used for forming interior electrode layer above that, and the technology that wherein discloses is the neutral raw cook that is pre-formed predetermined pattern to be wound on the column roller make.
Disclosed a kind of technology that can make duplexer at a high speed in the following patent documentation 4, having comprised: the uncoiling supply unit that is used to provide raw cook; Thereby raw cook is wound in the range upon range of cylinder that outer peripheral face forms duplexer; Be used for detecting the rotation angle detection apparatus of the anglec of rotation of range upon range of cylinder; And based on the information of rotation angle detection apparatus, while the raw cook of reeling being wound in the internal electrode Printing Department that forms internal electrode on the raw cook of range upon range of cylinder, can make duplexer at high speed thus.
Disclosed the range upon range of system making method of a kind of pottery in the following patent documentation 5; This method is to make on one side the endless belt rotation that is wound in the multi-edge column-shaped wheel, on one side on endless belt according to the rules order recycling application roll carry out ceramic green sheet and be shaped and utilize transfer device to form internal electrode.And; During the endless belt rotation; Set certain zone of endless belt for take turns planar section and contact, utilize the target pottery duplexer of the interior size of die-cut suction nozzle taking-up and the contacted regional extent of above-mentioned planar section, make ceramic duplexer thus with multi-edge column-shaped.
Here; Duplexer formation method as in the laminated ceramic capacitor manufacture process, generally adopt following method: after coating pottery on the rectangular film was filmed and is shaped, printing above that formed internal electrode; Then it is cut and peel off, thereby carry out range upon range of from film.For miniaturization and the big electric capacityization that realizes cascade capacitor; Need form ceramic dielectric layer thinner; And increase the lamination sheets number, but can know that the poor qualities' such as the caused short circuit of influence of the defective part that so can cause producing because of the thrust on the film ratio increases.Therefore, make film further level and smooth though studying, problem is that operability variation and film cost rise, and prospect causes anxiety.
As the means that address the above problem, proposed to reuse the method (with reference to patent documentation 1) that plate same basis material forms ceramic green sheet.Owing to, make defective part concentrate on a part of range upon range of through using same basis material, even therefore on the basis material thrust is arranged, also can be with the defective chip controls that influence caused of this thrust at bottom line.
Patent documentation 1: Japanese Patent Laid is opened the 2004-296641 communique
Patent documentation 2: Japanese Patent Laid is opened the 2002-141245 communique
Patent documentation 3: Japanese Patent Laid is opened the 2000-306766 communique
Patent documentation 4: Japanese Patent Laid is opened the 2003-217992 communique
Patent documentation 5: japanese patent laid-open 10-32140 communique
Yet; In the technology of above-mentioned patent documentation 1; Owing to need on dull and stereotyped or basis material cylindraceous, intermittently form the raw cook film, therefore can begin the zone of portion and end portion generation membrane thickness unevenness in film forming, even formed the duplexer piece; But can access hope that the zone of quality is also very narrow, very big problem is arranged on qualification rate.In addition, in the operation of dull and stereotyped laminated raw cook, also need successively to carry out intermittent action, the shortcoming that exists speed of production to improve.
And, the technology of above-mentioned patent documentation 2 has been proposed as efficiently carrying out the range upon range of means of ceramic green sheet.Be coating pottery on rectangular film, and it is transferred on the endless belt, thereby obtain laminate structure.In this operation, though need not to carry out intermittent action, thus can realize high speed, owing to use rectangular basis material, therefore, can not expect to have the poor quality's that ceramic layer defective part that inhibition produced because of the basis material thrust causes effect.
In addition, also put down in writing similar inventions in the above-mentioned patent documentation 3.Wherein, be on cylindric cylinder, to form laminate structure, just can realize that through continuous action high speed is range upon range of, but raw cook only limits to not have supporting mass and high-intensity neutral raw cooks such as film.Though the frequency that the inherent defective part of this neutral raw cook produces is still indeterminate; Thereby but in firing process, be difficult to degreasing owing to contain this sheet material that the high polymerization degree resin strengthened intensity; Thereby become the reason of the compactness of the pottery after influence is burnt till; Therefore cause practicality very low, be difficult to use in a large amount of productions.
The invention of above-mentioned patent documentation 4 be on cylinder or polygon prism, carry out continuously range upon range of; And utilize ink-jet method to form telegraph circuit; But in this case; Also need make raw cook have can the independent delivery degree high strength, thereby as the solution of this technical problem of laminate structure that forms thin ceramic layer and impracticable.
Of above-mentioned patent documentation 5; The method of continuously on dried sheet material, carrying out coating sizing-agent with wet state repeatedly can cause the sheet material below institute's dissolution with solvents in the slurry that is coated with, thereby generation is because of short circuit or the caused sheet material defective of IR not good (insulation resistance is not good).The sheet thickness of especially present laminated ceramic capacitor thins down, and the painting process of this method is also inapplicable.
Under situation about sheet material being shaped as other operation, the storage that this operation relates to, keeping and carrying etc. also need expend very big cost, must cause the elongated problem of production period.In addition, since operation is separated, therefore except range upon range of needed sheet length, also need be used to transport unnecessary sheet materials such as path, range upon range of terminal number, can cause spillage of material.On the other hand; After range upon range of sheet material, sheet material is carried out under the situation of electrode printing; The sheet material etch that sheet material is taken place by the electrode dissolution with solvents not only can take place in the sheet material that is printing; In the electrode of its lower floor or sheet material, also can take place, thereby cause problems such as short circuit or IR be not good.This will become the bad reason of electronic component quality of manufacturing.
Summary of the invention
Therefore; In view of the above problems; The objective of the invention is to, provide a kind of electronic component quality that can suppress bad, low-cost and can improve the laminated electronic component manufacturing installation and the laminated electronic component manufacturing approach of the manufacturing efficient (speed of production) of laminated electronic component.
The present invention relates to a kind of laminated electronic component manufacturing installation, it is characterized in that, comprising: periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled; Thereby said film forming basis material is coated with ceramic size and makes its drying form the film forming formation portion of potsherd continuously; Said potsherd on the said film forming basis material is formed the telegraph circuit formation portion of telegraph circuit; And with said film forming basis material through the contacted range upon range of supporting mass of said potsherd; This range upon range of supporting mass strips down said potsherd from said film forming basis material; And the said potsherd that will strip down is wound in periphery, thereby forms the laminate structure of said potsherd and said telegraph circuit.
According to the present invention; Because even defective agent such as thrust is arranged on the film forming basis material; The defective part of consequent potsherd is concentrated in the limited range of laminate structure; Therefore, can suppress the degree of cutting apart the electronic devices and components generation poor quality who obtains through cut-out lower.
In addition, because potsherd forms on the film forming basis material continuously, therefore compare with the intermittence coating, the stability region of thickness is bigger, can increase from resulting laminate structure to cut apart the number as electronic devices and components.
Carry out through continuous running owing to form the operation of the laminate structure of potsherd in the operation that forms potsherd on the film forming basis material with on range upon range of supporting mass, therefore can be in the shorter time form the laminate structure of potsherd with high production rate.
In addition, need as in the past, not use rectangular film matrix material, and therefore can reduce the cost of intermediate materials.
In sum, can suppress the situation that electronic devices and components take place by the poor quality, reduce cost, and turn round but not intermittent running, can improve the manufacturing efficient (speed of production) of laminated electronic component through continuous.
In addition, the present invention relates to a kind of laminated electronic component manufacturing installation, it is characterized in that, comprising: periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled; Thereby said film forming basis material is coated with ceramic size and makes its drying form the film forming formation portion of potsherd continuously; Said potsherd is formed the telegraph circuit formation portion of telegraph circuit; Thereby through said potsherd being wound in the range upon range of supporting mass that periphery forms the laminate structure of said potsherd and said telegraph circuit; And be arranged to said film forming basis material and said range upon range of supporting mass through the contacted member that transports of said potsherd; This transports member and accepts the said potsherd that said film forming basis material forms from said film forming basis material, and the said potsherd of being accepted is transported to said range upon range of supporting mass.
According to the present invention, the potsherd that is formed on the film forming basis material temporarily is transported member acceptance.Then, potsherd is transported to range upon range of supporting mass from transporting member.Thus, potsherd peeled off from the film forming basis material influenced by the state of range upon range of supporting mass one side, can carry out stable operation.Particularly; If on range upon range of supporting mass, form the laminate structure of potsherd; Then not only the size of range upon range of supporting mass can become greatly, and is being formed with under the situation of telegraph circuit, can produce the state variation on the profile such as concavo-convex at this position; But transport member through making to exist between film forming basis material and the range upon range of supporting mass, can avoid making the film forming basis material directly to contact with range upon range of supporting mass.And, according to the state variation of range upon range of supporting mass, can suitably adjust range upon range of supporting mass and position relation of transporting member and pressure etc.The laminate structure that thus, can prevent to be formed at the potsherd on the range upon range of supporting mass causes degradation because of the state variation of range upon range of supporting mass.In addition, directly do not contact through range upon range of supporting mass is designed to, can prevent to cause being formed on the potsherd degradation on the film forming basis material, and then prevent the degradation of electronic devices and components because of the state variation of range upon range of supporting mass with the film forming basis material.
In addition, owing to need not to make the film forming basis material of monomer to maximize, therefore the mobile route of the potsherd that before being transported to range upon range of supporting mass, can extend can increase drying time of potsherd.And, owing to be coated with ceramic size constantly, therefore can improve the manufacturing speed (manufacturing efficient) of potsherd to the film forming basis material, can improve the manufacturing efficient of the laminate structure of potsherd, and then improve the manufacturing efficient of electronic devices and components.
In addition, preferably utilize telegraph circuit formation portion on the potsherd that will be wound in before the range upon range of supporting mass, to form telegraph circuit.Thus, before potsherd will be laminated to range upon range of supporting mass, on potsherd, form telegraph circuit.If after potsherd is laminated in range upon range of supporting mass, on potsherd, form telegraph circuit again, the sheet material etch can take place because of the electrode solvent in the telegraph circuit that then forms on the potsherd of lower floor or the potsherd that forms telegraph circuit of lower floor.As according to the invention,, can reduce the not good problems such as (insulation resistance are not good) of short circuit or IR if, then can the influence of sheet material etch be controlled at the only bottom line of individual layer at the state of the potsherd of individual layer formation telegraph circuit down.
The present invention preferably utilizes said telegraph circuit formation portion that the said said potsherd that transports on the member is formed said telegraph circuit.
Thus, utilize telegraph circuit formation portion that the potsherd that transports on the member is formed telegraph circuit.Thereby,, therefore, can further improve the positional precision of the formation position of telegraph circuit owing to be to form telegraph circuit on the film forming basis material, having obtained dry potsherd.
In addition, be a kind of laminated electronic component manufacturing installation, it is characterized in that comprise: periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled; On said film forming basis material, form the telegraph circuit formation portion of telegraph circuit; Thereby the film forming basis material that has formed said telegraph circuit is coated with ceramic size and makes its drying form the film forming formation portion with the potsherd of said telegraph circuit continuously; And with said film forming basis material through with the contacted range upon range of supporting mass of the said potsherd of said telegraph circuit; This range upon range of supporting mass will strip down from said film forming basis material with the said potsherd of said telegraph circuit; And the said potsherd with said telegraph circuit that will strip down is wound in periphery, thereby forms the laminate structure of said potsherd and said telegraph circuit.
In addition, be a kind of laminated electronic component manufacturing installation, it is characterized in that comprise: periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled; On said film forming basis material, form the telegraph circuit formation portion of telegraph circuit; Thereby the film forming basis material that has formed said telegraph circuit is coated with ceramic size and makes its drying form the film forming formation portion with the potsherd of said telegraph circuit continuously; Thereby through being wound in the range upon range of supporting mass that periphery forms the laminate structure of said potsherd and said telegraph circuit with the said potsherd of said telegraph circuit; And be arranged to said film forming basis material and said range upon range of supporting mass through with the contacted member that transports of the said potsherd of said telegraph circuit; This transports member and accepts the said potsherd with said telegraph circuit that said film forming basis material forms from said film forming basis material, and the said potsherd of being accepted with said telegraph circuit is transported to said range upon range of supporting mass.
The invention is characterized in that said telegraph circuit formation portion is used for said potsherd is carried out the no version printing equipment of electrode printing.
Thus, can on each layer of potsherd, form the telegraph circuit of different pattern.In addition, even along with carrying out the range upon range of of potsherd on the range upon range of supporting mass, the size that flexible or range upon range of supporting mass take place potsherd changes, and also can adjust the spacing between the telegraph circuit, forms the telegraph circuit of no position deviation.
And as there not being the version printing equipment, preferably constitute by ink-jet printing apparatus and ink dried solidification equipment.
The invention is characterized in; The outer perimeter of said film forming basis material and the outer perimeter of said range upon range of supporting mass are equal length, or one of them outer perimeter of the outer perimeter of the outer perimeter of said film forming basis material and said range upon range of supporting mass is the integral multiple of another outer perimeter.
Thus, the defective part because of there being the potsherd that defective agents such as thrust produce on the film forming basis material is concentrated in the specific region of laminate structure.Particularly, the defective part that produces in can the laminate structure with the potsherd on the range upon range of supporting mass concentrates on the same circular orbit of laminate structure (the same row on the laminate structure when observing along the direction that transmits potsherd).And; Want than the outer perimeter of film forming basis material under the lint-long integer situation doubly at the outer perimeter of range upon range of supporting mass, the defective part that produces in can the laminate structure with the potsherd on the range upon range of supporting mass concentrates on the same coordinate of laminate structure (the same row and column on the laminate structure when observing along the direction that transmits potsherd).
The invention is characterized in, thereby when the periphery that said potsherd is wound in said range upon range of supporting mass forms the laminate structure of said potsherd, on said film forming basis material, continue to form new said potsherd.
Thus, owing to can turn round continuously rather than intermittent running ground forms the laminate structure of potsherd, therefore can in the extremely short time, form the laminate structure of potsherd.Consequently, can improve the manufacturing efficient of the laminate structure of potsherd.
The present invention relates to a kind of laminated electronic component manufacturing approach; It is characterized in that, comprise following operation: thus the film forming basis material that utilizes film forming formation portion that periphery has been implemented the continuous shape of annular of demoulding processing is coated with ceramic size and makes its drying form the film forming formation operation of potsherd continuously; Utilize telegraph circuit formation portion that the telegraph circuit that the said potsherd on the said film forming basis material forms telegraph circuit is formed operation; And laminate structure forms operation; This laminate structure forms in the operation; Range upon range of supporting mass is contacted through said potsherd with said film forming basis material; Thereby said potsherd is stripped down from said film forming basis material, and the said potsherd that will strip down is wound in the periphery of said range upon range of supporting mass, thereby forms the laminate structure of said potsherd and said telegraph circuit.
The present invention relates to a kind of laminated electronic component manufacturing approach; It is characterized in that, comprise following operation: thus the film forming basis material that utilizes film forming formation portion that periphery has been implemented the continuous shape of annular of demoulding processing is coated with ceramic size and makes its drying form the film forming formation operation of potsherd continuously; Utilize telegraph circuit formation portion that the telegraph circuit that said potsherd forms telegraph circuit is formed operation; Thereby the laminate structure that forms the laminate structure of said potsherd and said telegraph circuit through the periphery that said potsherd is wound in range upon range of supporting mass forms operation; And after said film forming forms operation and at said laminate structure, form the operation of transporting that operation carries out before; This transports in the operation; Transport member and accept the said potsherd that said film forming basis material forms, and utilize the said member that transports that the said potsherd of being accepted is transported to said range upon range of supporting mass from said film forming basis material.
Form in the operation at telegraph circuit, preferably the said said potsherd that transports on the member is formed said telegraph circuit.
The present invention relates to a kind of laminated electronic component manufacturing approach; It is characterized in that, comprise following operation: utilize telegraph circuit formation portion to implement the telegraph circuit that annular that the demoulding handles forms telegraph circuit continuously on the film forming basis material of shape and form operation in periphery; Utilize film forming formation portion that thereby the film forming basis material coating ceramic size that formed said telegraph circuit and film forming that its drying is formed with the potsherd of said telegraph circuit are continuously formed operation; And laminate structure forms operation; This laminate structure forms in the operation; Range upon range of supporting mass is contacted through the said potsherd with said telegraph circuit with said film forming basis material; Thereby will strip down from said film forming basis material with the said potsherd of said telegraph circuit, and will strip down be wound in the periphery of said range upon range of supporting mass with the said potsherd of said telegraph circuit, thereby form the laminate structure of said potsherd and said telegraph circuit.
The present invention relates to a kind of laminated electronic component manufacturing approach; It is characterized in that, comprise following operation: utilize telegraph circuit formation portion to implement the telegraph circuit that annular that the demoulding handles forms telegraph circuit continuously on the film forming basis material of shape and form operation in periphery; Utilize film forming formation portion that thereby the film forming basis material coating ceramic size that formed said telegraph circuit and film forming that its drying is formed with the potsherd of said telegraph circuit are continuously formed operation; Thereby the laminate structure that forms the laminate structure of said potsherd and said telegraph circuit through the periphery that will be wound in range upon range of supporting mass with the said potsherd of said telegraph circuit forms operation; And after said film forming forms operation and at said laminate structure, form the operation of transporting that operation carries out before; This transports in the operation; Transport member and accept the said potsherd that said film forming basis material forms, and utilize the said member that transports that the said potsherd of being accepted with said telegraph circuit is transported to said range upon range of supporting mass with said telegraph circuit from said film forming basis material.
Under above-mentioned these situation, said telegraph circuit forms the quality award from the ministry choosing and uses the no version printing equipment that said potsherd is carried out the electrode printing.
As said nothing version printing equipment, preferably use ink-jet printing apparatus and ink dried solidification equipment.
Form in the operation at said laminate structure; When thereby the periphery that said potsherd is wound in said range upon range of supporting mass forms the laminate structure of said potsherd and said telegraph circuit, preferably form and on said film forming basis material, continue to form new said potsherd in the operation in said film forming.
According to the present invention, can suppress the situation that electronic devices and components take place by the poor quality, reduce cost, and turn round but not intermittent running through continuous, can improve the manufacturing efficient (manufacturing speed) of laminated electronic component.
Description of drawings
Fig. 1 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 1.
Fig. 2 is the key diagram of the position of the defective part on the expression potsherd.
Fig. 3 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 2.
Fig. 4 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 3.
Fig. 5 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 4.
Fig. 6 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 5.
Fig. 7 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 6.
Fig. 8 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 7.
Fig. 9 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 8.
Figure 10 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 9.
Figure 11 is the key diagram of the related laminated electronic component manufacturing installation of execution mode of the present invention 10.
Label declaration
10 laminated electronic component manufacturing installations
12 application roll (film forming basis material)
14 range upon range of rollers (range upon range of supporting mass)
15 range upon range of rollers (range upon range of supporting mass)
16 one-tenth film units (film forming formation portion)
22 telegraph circuits form unit (telegraph circuit formation portion)
24 telegraph circuits
Roller (transporting member) is transported in 30 printings
Transport roller (transporting member) in the middle of 32
38 transport endless belt (transporting member)
Transport roller (transporting member) in the middle of 40
Transport roller (transporting member) in the middle of 42
44 film forming endless belt (film forming basis material)
Transport roller (transporting member) in the middle of 46
Transport roller (transporting member) in the middle of 52
Roller (transporting member) is transported in 54 printings
Transport roller (transporting member) in the middle of 56
Transport roller (transporting member) in the middle of 58
Transport roller (transporting member) in the middle of 60
The S potsherd
The laminate structure of S ' potsherd
Embodiment
With reference to accompanying drawing, execution mode 1 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approach of the present invention described.In addition, in " laminated electronic component " as manufacturing object of the present invention, comprise laminated electronic components such as laminated ceramic capacitor and laminated ceramic inductor.Below, enumerate laminated ceramic capacitor and describe as an example of laminated electronic component.
At first, the laminated electronic component manufacturing installation is described.
As shown in Figure 1, laminated electronic component manufacturing installation 10 mainly comprises: the application roll 12 (film forming basis material) that potsherd S was handled and formed in the demoulding is implemented on surface (outer peripheral face); Thereby and the range upon range of roller 14,15 (range upon range of supporting mass) of the laminate structure S ' of the formation potsherd S that will reel from the potsherd S that application roll 12 strips down.
Around application roll 12, dispose: being used for surface coated in application roll 12 becomes the one-tenth film unit 16 (film forming formation portion) of ceramic size of the material of potsherd S; Be used for to becoming film unit 16 to supply with the liquid-supply unit 18 of ceramic size; Be used for making the dry dry solidification device 20 that also solidifies of lip-deep ceramic size of application roll 12; Be used for going up the telegraph circuit that forms telegraph circuit 24 (with reference to Fig. 2) and form unit 22 (telegraph circuit formation portion) at (range upon range of) the potsherd S before the outer peripheral face of range upon range of roller 14,15 that will reel; Be used for making the dry solidification device 26 of telegraph circuit 24 dryings; And above-mentioned range upon range of roller 14,15.
The laminated electronic component manufacturing installation 10 of this execution mode is characterised in that; On the potsherd S before the outer peripheral face that will be wound in range upon range of roller 14,15, form telegraph circuit 24; To be formed with the outer peripheral face of the potsherd S coiling (range upon range of) of telegraph circuit 24 then, thereby form the laminate structure S ' of potsherd S to range upon range of roller 14,15.
In addition, in the downstream of the application roll direction of rotation that becomes film unit 16 (becoming film unit 16 and telegraph circuit to form between the unit 22), dispose the dry dry solidification device 20 that also solidifies of lip-deep ceramic size that is used for making application roll 12.And form the downstream (telegraph circuit forms between unit 22 and the range upon range of roller 14) of the application roll direction of rotation of unit 22 at telegraph circuit, dispose the dry solidification device 26 that is used for making telegraph circuit 24 dryings.
Particularly, application roll 12 is that the rigid body rollers such as metal (cylindrical or cylindrical shape) that the demoulding is handled have been implemented on the surface, and is made up of the basis material of the continuous shape of annular.Application roll 12 has the structure that is rotated driving by not shown drive source.In addition, the so-called demoulding is handled, and for example is equivalent to plating fluorine class processing etc.
Range upon range of roller 14,15 constitutes through pasting elastomer (for example resin film, elastic film, rubber, adhesive tab etc.) at the outer peripheral face of metal cylinder anchor clamps removably.These cylinder anchor clamps are installed in the rotating shaft, itself and application roll 12 are rotated synchronously.Range upon range of roller 14,15 both can be the structure that is rotated driving by not shown drive source, also can be receive application roll 12 revolving force effect and thereupon the rotation structure.Range upon range of roller 14,15 is pushed down application roll 12 through not shown pressure exerting arrangement with the pressure (pushing down power) of regulation.Range upon range of roller 14,15 is through not shown switching mechanism, can make any and application roll 12 in range upon range of roller 14 and the range upon range of roller 15 add press contacts.
The surface of elastomer of range upon range of roller 14 keeps potsherd S through methods such as bonding or Electrostatic Absorption.In addition, the potsherd S that is wound in range upon range of roller 14 be through with the lamella that overlaps each other crimping come to keep each other.Owing to set above-mentioned these confining forces for keep potsherd S greater than application roll 12 power, so potsherd S peels off and is transferred on the range upon range of roller 14 from application roll 12.Range upon range of roller 15 too.
For potsherd S is transferred to range upon range of roller 14 from application roll 12 reliably, is preferably on one side range upon range of roller is suitably pushed down application roll 12, Yi Bian carry out transfer printing.If between application roll 12 and the range upon range of roller 14 space is arranged, the potsherd S that then can cause producing in the process of transporting does not receive the interval of other member supporting, and might cause that in this interval sheet material is damaged.Therefore, in order not produce the interval that potsherd S is not supported, range upon range of roller 14 is suitably pushed down application roll 12., machinery twines range upon range of roller 14 surperficial flexible for not taking place when pushing down.
Here, the outer perimeter of the outer perimeter of preferred coated roller 12 and range upon range of roller 14,15 is an equal length, or one of them outer perimeter of the outer perimeter of the outer perimeter of application roll 12 and range upon range of roller 14,15 is the integral multiple of another outer perimeter.
As becoming film unit 16, for example can adopt extrusion coated mode such as mould type coating machine or scraper, roll coater, inkjet type coating machine etc.So-called extrusion coated mode is meant from the lip of mould to squeeze out the mode that coating fluid is coated with.In addition, for the thickness that makes the potsherd S on the outer peripheral face that is formed at application roll 12 becomes thinner, preferably mould type coating machine is provided with the upper reaches mechanism of decompressor.By becoming 16 pairs of application roll 12 of film unit (intermittently non-) coating ceramic size continuously, thereby form potsherd S.Like this, can to same application roll 12 ceramic size be provided continuously.
As liquid-supply unit 18, for example can adopt gear pump.In addition, liquid-supply unit 18 is not limited to gear pump, also can suitably adopt cylinder type dispenser, membrane pump etc.
As dry solidification device 20,26, can adopt the method for for example utilizing hot blast to carry out dry method or the outer peripheral face of application roll 12 is heated.Under the situation of using ultra-violet solidified resin, also can make its curing by irradiation ultraviolet radiation. Dry solidification device 20,26 is used for making ceramic size and electrode material ink dried or the curing that is coated with.In addition, be used for making the dry dry solidification device 20 of ceramic size on the application roll 12 also can use the vacuumize unit.
As ceramic size, for example can be employed in and dissolve the material that has mixed ceramic powders and resin in the organic solvent.Also can use the material that in ultraviolet curable resin, has mixed ceramic powders.In addition, solvent also can be the water class.
Then, the manufacturing approach to the laminate structure S ' of the potsherd S that uses laminated electronic component manufacturing installation 10 describes.
Make and implemented the speed rotation of application roll 12 that the demoulding is handled, utilize into film unit 16 its outer peripheral face coating ceramic size to stipulate.In addition, use gear pump that ceramic size is provided as liquid-supply unit 18.Then, use dry solidification device 20 on application roll 12, ceramic size to be carried out drying and makes its curing.Here, carry out drying, use the hot blast of set point of temperature in order to utilize 20 pairs of ceramic sizes of dry solidification device.Also heat with thermoregulator in addition or cool off and adjust temperature, so that the temperature of the outer peripheral face of application roll 12 is suitable.In addition, according to the material of potsherd S these temperature are suitably adjusted.Through like this, utilize into film unit 16 and liquid-supply unit 18, to application roll 12 ceramic size is provided continuously, thereby forms potsherd S constantly.With the potsherd S of the circuit 24 that do not print electrode of the range upon range of roller 14 coiling regulation numbers of plies, form the outer portion of laminate structure S '.
Then, form the potsherd S coating electrode material ink on the 22 pairs of application roll 12 in unit by telegraph circuit, to print the telegraph circuit (internal electrode circuit) 24 of the pictorial pattern of stipulating.After having printed telegraph circuit 24, blow out the warm braw of set point of temperature by dry solidification device 26, make telegraph circuit 24 dryings.Here, the formation operation of telegraph circuit is when the outer peripheral face of range upon range of roller 14,15 is reeled, and changes pictorial pattern and carries out the electrode printing so that the telegraph circuit 24 of each layer (each week) becomes the mode of comparative electrode.Thus, the potsherd S on the application roll 12 is formed telegraph circuit 24.
Then, the plus-pressure with regulation makes range upon range of roller 14 add press contacts with application roll 12 across ceramic green sheet S.Said plus-pressure need suitably be adjusted according to the material of potsherd S.Then, with peeling off from the outer peripheral face of overlay 12 of the outer peripheral face that is formed at application roll 12, it is transferred on the outer peripheral face of range upon range of roller 14 and reels through dried potsherd S (having formed telegraph circuit).Here; Because the outer peripheral face of application roll 12 has been implemented demoulding processing; And the plus-pressure with regulation makes range upon range of roller 14 contact through potsherd S with application roll 12; Therefore be formed at the peeling off from the outer peripheral face of application roll 12 easily of outer peripheral face of application roll 12, and be transferred to the outer peripheral face of range upon range of roller 14 through dried potsherd S.Range upon range of roller 14 is the outer peripheral face coiling elastic resin films at metal cylinder type anchor clamps, and adjusts the temperature of its outer peripheral face, makes it reach the temperature of regulation.The temperature of outer peripheral face need suitably be adjusted according to the material of potsherd S.
After the potsherd S of the regulation numbers of plies of reeling with range upon range of roller 14, telegraph circuit forms unit 22 circuit 24 that stops to print electrode.Then, the potsherd S of the circuit 24 that do not print electrode of the coiling regulation number of plies on range upon range of roller 14, the outer portion of formation laminate structure S '.Then; Stop ceramic size being provided to application roll 12; Finish the forming process of the laminate structure S ' of potsherd S; Or make the range upon range of roller 15 and the outer peripheral face of application roll 12 add press contacts through switching mechanism, replace range upon range of roller 14, thereby at the outer peripheral face coiling potsherd S of range upon range of roller 15 (the ceramic layer S after having formed telegraph circuit 24).Form the laminate structure S ' of potsherd S thus.
Laminate structure S ' and the cylinder type anchor clamps that further will be formed at the potsherd S of range upon range of roller 14 together take off, and according to the punching press of pressurizeing of original drum, and utilize cutting machine to cut into sheet.Afterwards, burn till, form telegraph circuit (outer electrode circuit) etc., the manufacturing process through common produces laminated ceramic capacitor.
Laminated electronic component manufacturing installation and laminated electronic component manufacturing approach according to execution mode 1; When the outer peripheral face of application roll 12 has small flaw or thrust; Though can in the potsherd S that is coated with, repeatedly produce defective part 28; But through reusing same application roll 12, on range upon range of roller 14, be wound among the columnar laminate structure S ', can defective part 28 be concentrated on the zone that limits.Thereby the laminate structure S ' of the potsherd S that can suppress to obtain thus cuts off the situation of cutting apart the poor quality of taking place in the resulting electronic devices and components in back.
In addition; When thereby the outer peripheral face that potsherd S peeled off and be wound in range upon range of roller 14 from application roll 12 forms the laminate structure S ' of potsherd S; Owing to continue on the application roll 12 to form new potsherd S, so the formation of the laminate structure S ' of the formation of the potsherd S on the application roll 12 and the potsherd S on the range upon range of roller 14 is carried out simultaneously.Thereby, need not to suspend the rotation driving of application roll 12, can form potsherd S continuously, also need not to suspend the rotation driving of range upon range of roller 14, can make the laminate structure S ' of potsherd S continuously.Thus, can form the laminate structure S ' of potsherd S through continuous running rather than intermittent running.Consequently, the laminate structure S ' of potsherd S can be in the extremely short time, formed, the manufacturing efficient of the laminate structure S ' of potsherd S can be improved.
In addition; Because potsherd S is formed on the application roll 12 as rigid body; From sheet material be formed into the range upon range of operation of sheet material all be by coating transport roller 12 or transfer roll 14 on one side the supporting slice faces transport on one side; Therefore, even use thin and low intensive potsherd S, also can suppress potsherd S and take place damaged or scuffing.Consequently, can improve the operability of thin and low intensive potsherd S.
In addition, as shown in Figure 1, the outer perimeter through making application roll 12 and range upon range of roller 14 is identical or make the integral multiple of one of them outer perimeter for another outer perimeter, thereby can that kind as shown in Figure 2 make defective part 28 further concentrate on privileged site.Become at outer perimeter under the situation of integral multiple, the defective part 28 that produces among the laminate structure S ' of the potsherd S on the range upon range of roller 14 is concentrated on the same circular orbit of range upon range of roller 14 (the same row on the laminate structure when observing along the direction that transmits potsherd).And; Want than the outer perimeter of application roll 12 under the lint-long integer situation doubly at the outer perimeter of range upon range of roller 14, can the defective part 28 that produce among the laminate structure S ' of the potsherd S on the range upon range of roller 14 be concentrated on the same coordinate of range upon range of roller 14 (the same row and column on the laminate structure when observing along the direction that transmits potsherd).
In addition, compare, can obtain film thickness uniformity and the high production rate of potsherd S with the method for using known intermittent coating ceramic size.That is,, therefore compare, can enlarge the stability region of thickness with the intermittence coating because the laminate structure S ' of potsherd S forms cylindrical shape continuously.Consequently, can obtain stay-in-grade electronic devices and components from the laminate structure S ' of potsherd S.The laminate structure per unit volume of potsherd S the number of getable electronic devices and components more.
In addition; In this execution mode; Owing to need not to use the intermediate consumption material of disposable basis material (PET film etc.), can cut down the intermediate materials cost that comprises keeping, transportation etc., therefore; Can significantly reduce the manufacturing cost of the laminate structure S ' of potsherd S, and then significantly reduce the manufacturing cost of electronic devices and components.
In addition; In this execution mode, owing to, only need the potsherd S that forms aequum to get final product through film formation process, printing process and range upon range of operation are coupled together; Can loss not take place on the path or produce range upon range of terminal number etc. in range upon range of transporting as in the past, therefore can reduce spillage of material.
In addition; In this execution mode; Owing to be before potsherd S is laminated to the outer peripheral face of range upon range of roller 14, to form telegraph circuit 24; Therefore in other words, be on potsherd S, to have formed after the telegraph circuit 24, the outer peripheral face that the potsherd S that forms telegraph circuit 24 is wound in range upon range of roller 14 carries out range upon range of.If after potsherd S is laminated in the outer peripheral face of range upon range of roller 14; On potsherd S, form telegraph circuit 24 again, then the sheet material etch can take place because of the electrode solvent in the last telegraph circuit 24 that forms of the potsherd S of lower floor or the potsherd S that forms telegraph circuit of lower floor.As according to the invention,, can reduce the not good problems such as (insulation resistance are not good) of short circuit or IR if, then can the influence of sheet material etch be controlled at the only bottom line of individual layer at the state of the potsherd of individual layer formation telegraph circuit down.
Especially owing on application roll 12, form potsherd S and telegraph circuit 24 simultaneously, therefore can make one whole equipment become compact very simply, can reduce equipment price and reduce area, can also improve the reliability of equipment.
In addition,,, therefore need not on dried potsherd S, to be coated with ceramic size, can the sheet material etch not take place because of dissolving again at the range upon range of roller 14 laminated potsherd S that are provided with in addition owing on application roll 12, make ceramic size dry.
In addition, form telegraph circuit 24, can be formed in the telegraph circuit 24 that all has different electrode patterns on each layer of potsherd S through using nothings edition print processes such as ink-jet.Particularly being accompanied by potsherd S carries out range upon range of; Because of causing girth, the distortion of potsherd S or the external diameter increase of range upon range of roller 14 etc. increase; Even like this, owing to also can freely change the pattern and formation position of telegraph circuit 24, therefore; The spacing (at interval) between the telegraph circuit 24 can be suitably adjusted, thereby the telegraph circuit 24 of no position deviation can be formed.
In addition, in execution mode 1, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.
Then, with reference to accompanying drawing, execution mode 2 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of execution mode 1, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 3, in the execution mode 2, application roll 12 and printing are transported roller (transporting member) 30 and are contacted through potsherd S.In addition, printing is transported roller 30 and centre and is transported roller (transporting member) 32 and contact through potsherd S.The centre is transported roller 32 and is contacted through potsherd S with range upon range of roller 15 these 2 range upon range of rollers with range upon range of roller 14.Range upon range of roller 14 and range upon range of roller 15 these 2 range upon range of rollers contact through potsherd S respectively with separately pressure roller 34,36.Thus, at the range upon range of roller of application roll 12 and each 14, exist between 15 that roller 30 is transported in printing and roller 32 is transported in the centre.Therefore, application roll 12 and each range upon range of roller 14,15 are in the state (can pass through the state of mechanical system transferring power) of indirect contact.
In addition, around application roll 12, dispose: being used for surface coated in application roll 12 becomes the one-tenth film unit 16 (film forming formation portion) of ceramic size of the material of potsherd S; Be used for to becoming film unit 16 that the liquid-supply unit 18 of ceramic size is provided; And be positioned at into film unit 16 application roll direction of rotation downstream, be used for making the dry solidification device 20 that the lip-deep ceramic size of application roll 12 is dry and solidify.Printing transport roller 30 around, dispose: be used for going up the telegraph circuit that forms telegraph circuit 24 and form unit 22 (telegraph circuit formation portion) at (range upon range of) the potsherd S before the outer peripheral face of range upon range of roller 14,15 that will reel; Be positioned at the 1st donor rollers direction of rotation downstream that telegraph circuit forms unit 22, be used for making the dry dry solidification device 26 of telegraph circuit 24; And roller 32 is transported in above-mentioned centre.
Here, printing is transported roller 30 and is transported the function that roller 32 had and be with middle, through method such as bonding, from before operation accept potsherd S, and the operation after the potsherd S that is accepted offered.Roller 30 and the middle roller etc. that transports that roller 32 can suitably be selected the rigid body roller of metal or resin or be covered with resin in surfaces coated are transported in printing.
Because being transported roller 30, printing keep the power of potsherd S to be set at the power of transporting roller 32 maintenance potsherd S greater than the power of application roll 12 maintenance potsherd S and less than the centre; Therefore; Can make potsherd S peel off and remain on printing from application roll 12 transports on the roller 30; Then, be transferred to the middle roller 32 that transports.Keep the power of potsherd S to set the power that keeps potsherd S less than range upon range of roller 14 for because roller 32 is transported in the centre, so potsherd S can transport roller 32 from the centre and peels off and be transferred on the range upon range of roller 14.The surface of elastomer of range upon range of roller 14 keeps potsherd S through methods such as bonding or Electrostatic Absorption.In addition, the potsherd S that is wound in range upon range of roller 14 be through with the lamella that overlaps each other crimping come to keep each other.Owing to will above-mentioned these confining forces set the power of transporting roller 32 maintenance potsherd S greater than the centre for, so potsherd S can transport roller 32 from the centre and peels off and be transferred on the range upon range of roller 14.
In detail, printing is transported roller 30 and is had the function from transporting roller 32 in the middle of application roll 12 is peeled off and it is transferred to potsherd S.In addition, the centre is transported roller 32 and is had and potsherd S is transported roller 30 from printing peel off and it is transferred to the function of range upon range of roller 14.Printing is transported roller 30 and centre to transport roller 32 also can be with potsherd S absorption (attracting or Electrostatic Absorption) thereby peels off peeling off of transporting and transport roller.At this moment, printing is transported roller 30 and is transported with middle that roller 32 is preferred to be adopted the position of absorption potsherd S and do not adsorb the structure that the position of potsherd S is controlled.When application roll 12 is accepted potsherd S; Make the regulation position of transporting roller 30 have the function of absorption with the contacted printing of potsherd S; When in the middle of the potsherd S that is accepted is transferred to, transporting roller 32; Make the regulation position of transporting roller 30 have non-adsorbable zone, thereby can successfully accept and transfer printing potsherd S with the contacted printing of potsherd S.About above-mentioned adsorption function and binding domain not, transport roller 32 too for the centre.Promptly; When transporting roller 30 from printing and accept potsherd S; Make the regulation position of transporting roller 32 have the function of absorption with the contacted centre of potsherd S; When the potsherd S that is accepted being transferred to range upon range of roller 14, making the regulation position of transporting roller 32 have non-adsorbable zone, thereby can successfully accept and transfer printing potsherd S with the contacted centre of potsherd S.
In the execution mode 2, utilize into film unit 16 and to the outer peripheral face of application roll 12 ceramic size is provided with liquid-supply unit 18.Then, use dry solidification device 20 on application roll 12, ceramic size to be carried out dry solidification.Form potsherd S thus.Transport the potsherd S on the roller 30 for move to printing from application roll 12, form unit 22 (for example ink jet printing) to its coating electrode material ink, to print the telegraph circuit 24 of the pictorial pattern of stipulating from telegraph circuit.After having printed telegraph circuit 24, transport the warm braw that potsherd S on the roller 30 blows out set point of temperature from 26 pairs of printings of dry solidification device, make telegraph circuit 24 dryings.Thus, the potsherd S that printing is transported on the roller 30 forms telegraph circuit 24.Then, the potsherd S that is formed with telegraph circuit 24 is transported roller 32 by the centre and accepts, and the outer peripheral face that is wound in range upon range of roller 14 is also range upon range of.Thus, form the laminate structure S ' of potsherd S.Like this, in execution mode 2, also be after having formed telegraph circuit 24 on the potsherd S, the outer peripheral face that the potsherd S that forms telegraph circuit 24 is wound in range upon range of roller 14 is also range upon range of.Application roll 12, printing are transported the outer peripheral face of roller 30, range upon range of roller 14 and are adjusted temperature through thermoregulator, to reach suitable temperature.
According to execution mode 2, potsherd S peeled off from application roll 12 influenced by the state of range upon range of roller 14 1 sides, can carry out stable operation.Particularly, if on range upon range of roller 14, form the laminate structure S ' of potsherd S, it is big that the size that comprises potsherd (external diameter) of then range upon range of roller 14 can become, and the state variation on the profile such as concavo-convex appears in the position that also can cause being formed with telegraph circuit 24.Yet; Have printing between application roll 12 and the range upon range of roller 14 and transport roller 30 and transport roller 32 through making with the centre; Can be according to the state variation of above-mentioned range upon range of roller 14, suitably adjust range upon range of roller 14 and printing and transport roller 30 and middle and transport position relation and pressure etc. between the roller 32.The laminate structure S ' that thus, can prevent to be formed at the potsherd S on the range upon range of roller 14 causes degradation because of the state variation of range upon range of roller 14.In addition; Through range upon range of roller 14 is designed to directly not contact with application roll 12; Can prevent that range upon range of roller 14 from causing damage along with the state variation of self to the potsherd S that is formed on the coating roller 12, can prevent the degradation of potsherd S, and then prevent the degradation of electronic devices and components.
In addition, because roller 30 is transported in printing and roller 32 is transported in the centre through being provided with, application roll 12 needn't maximize, and before offering range upon range of roller 14, can make the mobile route of potsherd S elongated, therefore, can increase the drying time of potsherd S and telegraph circuit 24.And owing on coating roller 12, be coated with ceramic size constantly, therefore, potsherd S transports roller 30 from application roll 12 through printing can carry out with the middle mobile process that transports roller 32 and offer till the range upon range of roller 14 continuously.Consequently, can improve the streamline speed of equipment, can improve the manufacturing speed (manufacturing efficient) of potsherd S, can improve the manufacturing efficient of the laminate structure S ' of potsherd S, and then improve the manufacturing efficient of electronic devices and components.
In addition, the potsherd S that printing is transported on the roller 30 forms telegraph circuit 24.Thereby,, therefore, can further improve the positional precision of the formation position of telegraph circuit 24 owing to be to form telegraph circuit 24 on application roll 12, having obtained dry potsherd S reliably.Otherwise, if semiarid potsherd S is formed telegraph circuit 24, then owing to become the potsherd S of bottom deformation etc. can take place, also might squint in the position of the telegraph circuit 24 that forms above that.In order to address the above problem, 2 pairs of execution modes have obtained dry potsherd S reliably and have formed telegraph circuit 24 on application roll 12.
In addition, in execution mode 2, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.To transport roller 32 corresponding with " transporting member " of the present invention and roller 30 and centre are transported in printing.
Then, with reference to accompanying drawing, execution mode 3 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of above-mentioned each execution mode, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 4, in the execution mode 3, transporting on the endless belt (transporting member) 38 potsherd S formation telegraph circuit 24.That is to say that application roll 12 and centre are transported roller (transporting member) 40 and contacted through potsherd S.In addition, the centre is transported roller 40 and is transported endless belt 38 and contact through potsherd S.In addition, transporting endless belt 38 and centre transports roller (transporting member) 42 and contacts through potsherd S.The centre is transported roller 42 and is contacted through potsherd S with range upon range of roller 15 these 2 range upon range of rollers with range upon range of roller 14.Range upon range of roller 14 and range upon range of roller 15 these 2 range upon range of rollers contact through potsherd S respectively with separately pressure roller 34,36.Thus, at the range upon range of roller of application roll 12 and each 14, transport roller 40 in the middle of existing between 15, transport endless belt 38 and roller 42 is transported in the centre.Therefore, application roll 12 and each range upon range of roller 14,15 are in the state (can pass through the state of mechanical system transferring power) of indirect contact.
In addition, around application roll 12, dispose: being used for surface coated in application roll 12 becomes the one-tenth film unit 16 (film forming formation portion) of ceramic size of the material of potsherd S; Be used for to becoming film unit 16 that the liquid-supply unit 18 of ceramic size is provided; Be positioned at into film unit 16 application roll direction of rotation downstream, be used for making the dry solidification device 20 that the lip-deep ceramic size of application roll 12 is dry and solidify; And roller 40 is transported in above-mentioned centre.Transport endless belt 38 around, dispose: be used for going up the telegraph circuit that forms telegraph circuit 24 and form unit 22 at (range upon range of) the potsherd S before the outer peripheral face of range upon range of roller 14,15 that will reel; Be positioned at endless belt direction of rotation downstream that telegraph circuit forms unit 22, be used for making the dry dry solidification device 26 of telegraph circuit 24; And roller 42 is transported in above-mentioned centre.
In detail, the centre is transported roller 40 and is had potsherd S is peeled off and it is transferred to the function of transporting endless belt 38 from application roll 12.In the execution mode 3, the potsherd S that the centre is transported on the roller 40 does not form telegraph circuit 24.Transport endless belt 38 have with potsherd S transport from the centre that roller 40 is peeled off and it is transferred in the middle of transport roller 42 function.In addition, the centre is transported roller 42 and is had potsherd S from transporting endless belt 38 and peel off and it being transferred to the function of range upon range of roller 14.
In the execution mode 3, utilize into film unit 16 and be coated with and provide ceramic size to the outer peripheral face of application roll 12 with liquid-supply unit 18.Then, use dry solidification device 20 on application roll 12, ceramic size to be carried out dry solidification.Form potsherd S thus.For transporting roller 40 and move to the potsherd S that transports on the endless belt 38 via the centre from application roll 12; Form unit 22 (for example ink jet printing) to its coating electrode material ink, to print the telegraph circuit (internal electrode circuit) 24 of the pictorial pattern of stipulating from telegraph circuit.After having printed telegraph circuit 24, transport the warm braw that potsherd S on the endless belt 38 blows out set point of temperature from 26 pairs in dry solidification device, make telegraph circuit 24 dryings.Thus, the potsherd S that transports on the endless belt 38 is formed telegraph circuit 24.Then, the potsherd S that is formed with telegraph circuit 24 is transported roller 42 by the centre and accepts, and the outer peripheral face that is wound in range upon range of roller 14 is also range upon range of.Thus, form the laminate structure S ' of potsherd S.Like this, in execution mode 3, also be after having formed telegraph circuit 24 on the potsherd S, the outer peripheral face that the potsherd S that forms telegraph circuit 24 is wound in range upon range of roller 14 is also range upon range of.
According to execution mode 3; Since as the outer perimeter that transports endless belt 38 of rectangular belt than the outer perimeter of application roll 12 or in the middle of to transport the outer perimeter of roller 40 long, therefore can enlarge the arid region (can utilize dry solidification device 26 to carry out the zone of drying) of the potsherd S that transports on the endless belt 38.Thereby, can make the formation speed (also comprising rate of drying) of the telegraph circuit 24 on the potsherd S accelerate, and then improve the manufacturing speed of electronic devices and components.
Especially when telegraph circuit formed unit 22 employing ink-jetting styles, because the quantity of solvent of ink is more, so ink was difficult to drying.So, transport endless belt 38 through Printing Department's employing to telegraph circuit 24, even do not use large diameter roller, also can make the displacement of potsherd S elongated, can increase the time of telegraph circuit 24 dryings that are used for making on the potsherd S.Therefore, the quality of the telegraph circuit 24 that the use ink-jetting style forms can be not uneven, can keep the high-quality of electronic devices and components.
In addition, in execution mode 3, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.And roller 40 is transported in the centre, transporting endless belt 38 and centre, to transport roller 42 corresponding with " transporting member " of the present invention.
Then, with reference to accompanying drawing, execution mode 4 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of above-mentioned each execution mode, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 5, execution mode 4 is application roll 12 that the film forming endless belt 44 that is used as rectangular belt constitutes execution mode 1.That is transport endless belt 44 and the centre that, are used for forming potsherd S (film forming) are transported roller (transporting member) 46 and are contacted through potsherd S.In addition, the centre is transported roller 46 and is contacted through potsherd S with range upon range of roller 14 and range upon range of roller 15 these 2 range upon range of rollers.Range upon range of roller 14 and range upon range of roller 15 these 2 range upon range of rollers contact through potsherd S respectively with separately pressure roller 34,36.Thus, at the range upon range of roller of film forming endless belt 44 and each 14, transport roller 46 in the middle of existing between 15.Therefore, film forming endless belt 44 and each range upon range of roller 14,15 are in the state (can pass through the state of mechanical system transferring power) of indirect contact.
Particularly around film forming endless belt 44, dispose: being used for surface coated at film forming endless belt 44 becomes the one-tenth film unit 16 (film forming formation portion) of ceramic size of the material of potsherd S; Be used for to becoming film unit 16 to supply with the liquid-supply unit 18 of ceramic size; Be positioned at into film unit 16 endless belt direction of rotation downstream, be used for making the dry solidification device 20 that the lip-deep ceramic size of film forming endless belt 44 is dry and solidify; Measure the thickness testing fixture (CCD camera etc.) 48 of the thickness of potsherd S; Be used for going up the telegraph circuit that forms telegraph circuit 24 and form unit 22 at (range upon range of) the potsherd S before the outer peripheral face of range upon range of roller 14,15 that will reel; Be positioned at endless belt direction of rotation downstream that telegraph circuit forms unit 22, be used for making the dry dry solidification device 26 of telegraph circuit 24; That removes underproof potsherd S removes roller 50; And roller 46 is transported in above-mentioned centre.
In the execution mode 4, utilize into film unit 16 and to the outer peripheral face of film forming endless belt 44 ceramic size is provided with liquid-supply unit 18.Then, use dry solidification device 20 on film forming endless belt 44, ceramic size to be carried out dry solidification.Form potsherd S thus.Then, utilize thickness testing fixture (CCD camera etc.) 48, measure the thickness of the potsherd S on the film forming endless belt 44.Form the 22 pairs of potsherd S coatings in unit electrode material ink by telegraph circuit, to print the telegraph circuit 24 of the pictorial pattern of stipulating.After having printed telegraph circuit 24, the potsherd S from 26 pairs of film forming endless belt 44 of dry solidification device blows out the warm braw of set point of temperature, makes telegraph circuit 24 dryings.Thus, the potsherd S on the film forming endless belt 44 is formed telegraph circuit 24.Then, the potsherd S that is formed with telegraph circuit 24 is transported roller 46 by the centre and accepts, and the outer peripheral face that is wound in range upon range of roller 14 is also range upon range of.Thus, form the laminate structure S ' of potsherd S.Like this, in execution mode 4, also be after having formed telegraph circuit 24 on the potsherd S, the outer peripheral face that the potsherd S that forms telegraph circuit 24 is wound in range upon range of roller 14 is also range upon range of.
Here, when telegraph circuit formed unit 22 employing ink-jetting styles, because the quantity of solvent of ink is more, so ink was difficult to drying.So, through Printing Department is adopted film forming endless belt 44,, also can make the displacement of potsherd S elongated even do not use large diameter roller, can increase the time of telegraph circuit 24 dryings that are used for making on the potsherd S.Therefore, the quality of the telegraph circuit 24 that the use ink-jetting style forms can be not uneven, can keep the high-quality of electronic devices and components.
In addition, in execution mode 4, film forming endless belt 44 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.And that roller 46 is transported in the centre is corresponding with " transporting member " of the present invention.
Then, with reference to accompanying drawing, execution mode 5 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of above-mentioned each execution mode, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 6, execution mode 5 is to adopt the printing process of the mode of printing of intaglio offset as telegraph circuit 24.That is to say that application roll 12 and centre are transported roller (transporting member) 52 and contacted through potsherd S.Employed printing was transported roller (transporting member) 54 and is contacted through potsherd S when in addition, the centre was transported roller 52 and on potsherd S, formed telegraph circuit 24.Printing is transported roller 54 and centre and is transported roller (transporting member) 56 and contact through potsherd S.The centre is transported roller 56 and is contacted through potsherd S with range upon range of roller 14.Range upon range of roller 14 and pressure roller 34,36 contact through potsherd S.Thus, at the range upon range of roller of application roll 12 and each 14, transport roller 52 in the middle of existing between 15, roller 54 is transported in printing and roller 56 is transported in the centre.Therefore, application roll 12 and each range upon range of roller 14 are in the state (can pass through the state of mechanical system transferring power) of indirect contact.
In addition, around application roll 12, dispose: being used for surface coated in application roll 12 becomes the one-tenth film unit 16 of ceramic size of the material of potsherd S; Be used for to becoming film unit 16 that the liquid-supply unit 18 of ceramic size is provided; Be positioned at into film unit 16 application roll direction of rotation downstream, be used for making the dry solidification device 20 that the lip-deep ceramic size of application roll 12 is dry and solidify; And roller 52 is transported in the centre.In addition, printing transport roller 54 around, dispose: be used for going up the telegraph circuit that forms telegraph circuit 24 and form unit 22 at (range upon range of) the potsherd S before the outer peripheral face of range upon range of roller 14 that will reel; Be used for making the dry solidification device 26 of telegraph circuit 24 dryings; And roller 52 is transported in above-mentioned centre and roller 56 is transported in the centre.
Here, telegraph circuit forms the mode of printing that unit 22 adopts intaglio offset.That is, the telegraph circuit of the mode of printing of intaglio offset forms unit 22 and has: the pattern that is carved with the corresponding groove of the pattern of conductive paste film (groove of filled conductive property thickener) at outer peripheral face in order to form telegraph circuit 24 forms roller 22A; And pattern formed the transfer roll 22B that pattern that roller 22A go up to form carries out transfer printing.In addition, blow out the warm braw of set point of temperature by 26 pairs of patterns that are transferred on the transfer roll 22B of dry solidification device, to carry out drying.Roller 54 is transported in the pattern transfer that is transferred to the telegraph circuit 24 on the transfer roll 22B to printing, transport the telegraph circuit 24 that forms the pattern of regulation on the potsherd S on the roller 54 in printing.
According to execution mode 5, utilize into film unit 16 and to the outer peripheral face of application roll 12 ceramic size is provided with liquid-supply unit 18.Then, use dry solidification device 20 on application roll 12, ceramic size to be carried out dry solidification.Form potsherd S thus.Transport roller 52 in the middle of potsherd S on the application roll 12 moves to and transport roller 54 with printing.Transport the potsherd S on the roller 54 for printing, form the telegraph circuit 24 of the pattern of regulation from transfer roll 22B transfer printing.Thus, the potsherd S that printing is transported on the roller 54 forms telegraph circuit 24.Then, the potsherd S that is formed with telegraph circuit 24 is transported roller 56 by the centre and accepts, and the outer peripheral face that is wound in range upon range of roller 14 is also range upon range of.Thus, form the laminate structure S ' of potsherd S.Like this, in execution mode 5, also be after having formed telegraph circuit 24 on the potsherd S, the outer peripheral face that the potsherd S that forms telegraph circuit 24 is wound in range upon range of roller 14 is also range upon range of.
In addition, in execution mode 5, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14 is corresponding with " range upon range of supporting mass " of the present invention.And the centre is transported roller 52, printing and is transported roller 54 and centre to transport roller 56 corresponding with " transporting member " of the present invention.
Then, with reference to accompanying drawing, execution mode 6 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of above-mentioned each execution mode, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 7, execution mode 6 is based on the structure of execution mode 1, and a part is wherein improved, and transports roller (transporting member) 58 in the middle of between application roll 12 and range upon range of roller 14 or range upon range of roller 15, existing.
In the execution mode 6, on application roll 12, potsherd S is formed telegraph circuit 24, the potsherd S that has formed telegraph circuit 24 is transported roller 28 by the centre and accepts.Then, potsherd S that roller 58 accepts is transported in the centre be wound in the outer peripheral face of range upon range of roller 14 and range upon range of, thereby form the laminate structure S ' of potsherd S.
According to execution mode 6; Since transport roller 58 in the middle of between application roll 12 and range upon range of roller 14 or range upon range of roller 15, existing, therefore, the same with the effect of execution mode 2; Can not receive range upon range of roller 14 1 sides state influence and from application roll 12 potsherd S is peeled off, can stably operate.
In addition, in execution mode 6, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.And that roller 58 is transported in the centre is corresponding with " transporting member " of the present invention.
Then, with reference to accompanying drawing, execution mode 7 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.In addition, to the identical label of structure mark that repeats with the structure of above-mentioned each execution mode, and omit the structure of repetition and the explanation of action effect.
As shown in Figure 8, execution mode 7 is based on the structure of execution mode 2, and a part is wherein improved, transport in application roll 12 and printing have another donor rollers between the roller 30, promptly roller (transporting member) 60 is transported in the centre.
In the execution mode 7, the potsherd S that on application roll 12, forms transports roller 60 via the centre and offers printing and transport roller 30.Transport and form telegraph circuit 24 on the potsherd S of roller 30 offering printing, the potsherd S that has formed telegraph circuit 24 transports roller 30 from printing and is transported roller 32 by the centre and accept.Then, transport potsherd S that roller 32 accepts with the 2nd donor rollers, in the middle of promptly and be wound in the outer peripheral face of range upon range of roller 14 and range upon range of, thereby form the laminate structure S ' of potsherd S.
According to execution mode 7; Since transport in application roll 12 and printing and to transport roller 60 in the middle of existing between the roller 30, therefore, the same with the effect of execution mode 2; Can not receive range upon range of roller 14 1 sides state influence and from application roll 12 potsherd S is peeled off, can stably operate.
In addition, in execution mode 7, application roll 12 is corresponding with " film forming basis material " of the present invention, and range upon range of roller 14,15 is corresponding with " range upon range of supporting mass " of the present invention.And the centre is transported roller, printing and is transported roller 30 and centre to transport roller 32 corresponding with " transporting member " of the present invention.
Then, with reference to accompanying drawing, execution mode 8～execution mode 10 related laminated electronic component manufacturing installation and laminated electronic component manufacturing approaches of the present invention are described.
In execution mode 8～execution mode 10,, utilize telegraph circuit to form unit 22, implemented annular that the demoulding handles in periphery and formed telegraph circuit 24 on application roll 12 or the film forming endless belt 44 of shape continuously like Fig. 9～shown in Figure 11.Then, utilize into film unit 16, to application roll 12 or the film forming endless belt 44 coating ceramic sizes that are formed with telegraph circuit 24, and make it dry, thereby form the potsherd S of belt electrode circuit continuously.Then, the potsherd S of belt electrode circuit is peeled off from application roll 12 or film forming endless belt 44, the potsherd S of the belt electrode circuit that strips down is wound in the periphery of range upon range of roller 14.Thus, form the laminate structure S ' of potsherd S and telegraph circuit 24.
Claims (17)
1. a laminated electronic component manufacturing installation is characterized in that, comprising:
Periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled;
Thereby said film forming basis material is coated with ceramic size and makes its drying form the film forming formation portion of potsherd continuously;
Said potsherd on the said film forming basis material is formed the telegraph circuit formation portion of telegraph circuit; And
Pass through the contacted range upon range of supporting mass of said potsherd with said film forming basis material; This range upon range of supporting mass strips down said potsherd from said film forming basis material; And the said potsherd that will strip down is wound in periphery, thereby forms the laminate structure of said potsherd and said telegraph circuit.
2. a laminated electronic component manufacturing installation is characterized in that, comprising:
Periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled;
Thereby said film forming basis material is coated with ceramic size and makes its drying form the film forming formation portion of potsherd continuously;
Said potsherd is formed the telegraph circuit formation portion of telegraph circuit;
Thereby through said potsherd being wound in the range upon range of supporting mass that periphery forms the laminate structure of said potsherd and said telegraph circuit; And
Be arranged to said film forming basis material and said range upon range of supporting mass through the contacted member that transports of said potsherd; This transports member and is received in the said potsherd that said film forming basis material forms from said film forming basis material, and the said potsherd of being accepted is transported to said range upon range of supporting mass.
3. laminated electronic component manufacturing installation as claimed in claim 2 is characterized in that,
Said telegraph circuit formation portion forms said telegraph circuit to the said said potsherd that transports on the member.
4. a laminated electronic component manufacturing installation is characterized in that, comprising:
Periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled;
On said film forming basis material, form the telegraph circuit formation portion of telegraph circuit;
Thereby the film forming basis material that has formed said telegraph circuit is coated with ceramic size and makes its drying form the film forming formation portion with the potsherd of said telegraph circuit continuously; And
With said film forming basis material through with the contacted range upon range of supporting mass of the said potsherd of said telegraph circuit; This range upon range of supporting mass will strip down from said film forming basis material with the said potsherd of said telegraph circuit; And the said potsherd with said telegraph circuit that will strip down is wound in periphery, thereby forms the laminate structure of said potsherd and said telegraph circuit.
5. a laminated electronic component manufacturing installation is characterized in that, comprising:
Periphery has been implemented the annular film forming basis material of shape continuously that the demoulding is handled;
On said film forming basis material, form the telegraph circuit formation portion of telegraph circuit;
Thereby the film forming basis material that has formed said telegraph circuit is coated with ceramic size and makes its drying form the film forming formation portion with the potsherd of said telegraph circuit continuously;
Thereby through being wound in the range upon range of supporting mass that periphery forms the laminate structure of said potsherd and said telegraph circuit with the said potsherd of said telegraph circuit; And
Be arranged to said film forming basis material and said range upon range of supporting mass through with the contacted member that transports of the said potsherd of said telegraph circuit; This transports member and is received in the said potsherd with said telegraph circuit that said film forming basis material forms from said film forming basis material, and the said potsherd of being accepted with said telegraph circuit is transported to said range upon range of supporting mass.
6. like each the described laminated electronic component manufacturing installation in the claim 1 to 5, it is characterized in that,
Said telegraph circuit formation portion is the no version printing equipment that said potsherd is carried out the electrode printing.
7. laminated electronic component manufacturing installation as claimed in claim 6 is characterized in that,
Said nothing version printing equipment is made up of ink-jet printing apparatus and ink dried solidification equipment.
8. like each the described laminated electronic component manufacturing installation in the claim 1 to 7, it is characterized in that,
The outer perimeter of said film forming basis material and the outer perimeter of said range upon range of supporting mass are equal length, or one of them outer perimeter of the outer perimeter of the outer perimeter of said film forming basis material and said range upon range of supporting mass is the integral multiple of another outer perimeter.
9. like each the described laminated electronic component manufacturing installation in the claim 1 to 8, it is characterized in that,
When thereby the periphery that said potsherd is wound in said range upon range of supporting mass forms the laminate structure of said potsherd and said telegraph circuit,
On said film forming basis material, continue to form new said potsherd.
10. a laminated electronic component manufacturing approach is characterized in that, comprises following operation:
Thereby the film forming basis material that utilizes film forming formation portion that periphery has been implemented the continuous shape of annular of demoulding processing is coated with ceramic size and makes its drying form the film forming formation operation of potsherd continuously;
Utilize telegraph circuit formation portion that the telegraph circuit that the said potsherd on the said film forming basis material forms telegraph circuit is formed operation; And
Laminate structure forms operation; This laminate structure forms in the operation; Range upon range of supporting mass is contacted through said potsherd with said film forming basis material; Thereby said potsherd is stripped down from said film forming basis material, and the said potsherd that will strip down is wound in the periphery of said range upon range of supporting mass, thereby forms the laminate structure of said potsherd and said telegraph circuit.
11. a laminated electronic component manufacturing approach is characterized in that, comprises following operation:
Thereby the film forming basis material that utilizes film forming formation portion that periphery has been implemented the continuous shape of annular of demoulding processing is coated with ceramic size and makes its drying form the film forming formation operation of potsherd continuously;
Utilize telegraph circuit formation portion that the telegraph circuit that said potsherd forms telegraph circuit is formed operation;
Thereby the laminate structure that forms the laminate structure of said potsherd and said telegraph circuit through the periphery that said potsherd is wound in range upon range of supporting mass forms operation; And
After said film forming forms operation and at said laminate structure, form the operation of transporting that operation carries out before; This transports in the operation; Transport member and be received in the said potsherd that said film forming basis material forms, and utilize the said member that transports that the said potsherd of being accepted is transported to said range upon range of supporting mass from said film forming basis material.
12. laminated electronic component manufacturing approach as claimed in claim 11 is characterized in that,
Form in the operation at telegraph circuit, the said said potsherd that transports on the member is formed said telegraph circuit.
13. a laminated electronic component manufacturing approach is characterized in that, comprises following operation:
Utilize telegraph circuit formation portion to implement the telegraph circuit that annular that the demoulding handles forms telegraph circuit continuously on the film forming basis material of shape and form operation in periphery;
Utilize film forming formation portion that thereby the film forming basis material coating ceramic size that formed said telegraph circuit and film forming that its drying is formed with the potsherd of said telegraph circuit are continuously formed operation; And
Laminate structure forms operation; This laminate structure forms in the operation; Range upon range of supporting mass is contacted through the said potsherd with said telegraph circuit with said film forming basis material; Thereby will strip down from said film forming basis material with the said potsherd of said telegraph circuit, and will strip down be wound in the periphery of said range upon range of supporting mass with the said potsherd of said telegraph circuit, thereby form the laminate structure of said potsherd and said telegraph circuit.
14. a laminated electronic component manufacturing approach is characterized in that, comprises following operation:
Utilize telegraph circuit formation portion to implement the telegraph circuit that annular that the demoulding handles forms telegraph circuit continuously on the film forming basis material of shape and form operation in periphery;
Utilize film forming formation portion that thereby the film forming basis material coating ceramic size that formed said telegraph circuit and film forming that its drying is formed with the potsherd of said telegraph circuit are continuously formed operation;
Thereby the laminate structure that forms the laminate structure of said potsherd and said telegraph circuit through the periphery that will be wound in range upon range of supporting mass with the said potsherd of said telegraph circuit forms operation; And
After said film forming forms operation and at said laminate structure, form the operation of transporting that operation carries out before; This transports in the operation; Transport member and be received in the said potsherd that said film forming basis material forms, and utilize the said member that transports that the said potsherd of being accepted with said telegraph circuit is transported to said range upon range of supporting mass with said telegraph circuit from said film forming basis material.
15. each the described laminated electronic component manufacturing approach as in the claim 10 to 14 is characterized in that,
As said telegraph circuit formation portion, use the no version printing equipment that said potsherd is carried out the electrode printing.
16. laminated electronic component manufacturing approach as claimed in claim 15 is characterized in that,
As said nothing version printing equipment, use ink-jet printing apparatus and ink dried solidification equipment.
17. each the described laminated electronic component manufacturing approach as in the claim 10 to 16 is characterized in that,
Form in the operation at said laminate structure, thereby when the periphery that said potsherd is wound in said range upon range of supporting mass forms the laminate structure of said potsherd and said telegraph circuit,
Form in the operation in said film forming, on said film forming basis material, continue to form new said potsherd.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2010-111269 | 2010-05-13 | ||
| JP2010111269 | 2010-05-13 | ||
| JP2011-089641 | 2011-04-13 | ||
| JP2011089641A JP5516996B2 (en) | 2010-05-13 | 2011-04-13 | Multilayer electronic component manufacturing apparatus and multilayer electronic component manufacturing method |
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| CN102315022A true CN102315022A (en) | 2012-01-11 |
| CN102315022B CN102315022B (en) | 2013-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011101303351A Active CN102315022B (en) | 2010-05-13 | 2011-05-12 | Apparatus and method for manufacturing laminated electronic component |
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| KR (1) | KR101248496B1 (en) |
| CN (1) | CN102315022B (en) |
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| CN108630464A (en) * | 2017-03-23 | 2018-10-09 | 株式会社村田制作所 | The production line of laminated electronic component and the manufacturing method of laminated electronic component |
| CN110993339A (en) * | 2018-10-02 | 2020-04-10 | 株式会社村田制作所 | Apparatus and method for manufacturing laminated ceramic electronic component |
| CN112233904A (en) * | 2019-06-27 | 2021-01-15 | 株式会社村田制作所 | Method for manufacturing laminated ceramic electronic component and pressing device |
| CN114597348A (en) * | 2020-12-02 | 2022-06-07 | 通用汽车环球科技运作有限责任公司 | Method for producing electrode by rolling |
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| JP2002141245A (en) * | 2000-11-06 | 2002-05-17 | Tdk Corp | Method and apparatus for manufacturing ceramic electronic component |
| JP2003217992A (en) * | 2002-01-21 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Laminate manufacturing device of laminated electronic component |
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| JP2002170737A (en) | 2000-11-30 | 2002-06-14 | Uht Corp | Ceramic laminate manufacturing device |
| JP2003109841A (en) | 2001-10-01 | 2003-04-11 | Murata Mfg Co Ltd | Laminated electronic component and its manufacturing method |
| JP5217732B2 (en) | 2008-07-25 | 2013-06-19 | 株式会社村田製作所 | Electronic component manufacturing apparatus and electronic component manufacturing method |
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| JP2002141245A (en) * | 2000-11-06 | 2002-05-17 | Tdk Corp | Method and apparatus for manufacturing ceramic electronic component |
| JP2003217992A (en) * | 2002-01-21 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Laminate manufacturing device of laminated electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108630464A (en) * | 2017-03-23 | 2018-10-09 | 株式会社村田制作所 | The production line of laminated electronic component and the manufacturing method of laminated electronic component |
| CN110993339A (en) * | 2018-10-02 | 2020-04-10 | 株式会社村田制作所 | Apparatus and method for manufacturing laminated ceramic electronic component |
| CN112233904A (en) * | 2019-06-27 | 2021-01-15 | 株式会社村田制作所 | Method for manufacturing laminated ceramic electronic component and pressing device |
| CN112233904B (en) * | 2019-06-27 | 2022-09-20 | 株式会社村田制作所 | Method for manufacturing laminated ceramic electronic component and pressing device |
| CN114597348A (en) * | 2020-12-02 | 2022-06-07 | 通用汽车环球科技运作有限责任公司 | Method for producing electrode by rolling |
| US11936030B2 (en) | 2020-12-02 | 2024-03-19 | GM Global Technology Operations LLC | Fabrication process to make electrodes by rolling |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110125625A (en) | 2011-11-21 |
| CN102315022B (en) | 2013-10-16 |
| KR101248496B1 (en) | 2013-04-03 |
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