JP3166693B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component used for various electronic devices.

[0002]

2. Description of the Related Art Conventionally, multilayer ceramic capacitors have been required to be further reduced in size, increased in capacity, and reduced in cost with the miniaturization and high performance of various electronic devices. For this reason, it is desired to change the internal electrode from the conventional palladium to nickel, and to further reduce the thickness of the dielectric (less than 2 μm after firing) and increase the number of layers (more than 300 layers). High cost due to lowness has been a problem.

Conventionally, Japanese Patent Publication No. 5-25381 proposes an electrode transfer method, and Japanese Patent Laid-Open Publication No. Hei 4-7577 proposes a thermal transfer method of a green sheet. These will be described together with reference to FIG. 9 and FIG. FIG.
In (A), a heater 1 fixes a green sheet 3 to the surface of the table 2 while keeping the table 2 at a constant temperature. An electrode 5 is formed on the surface of the base film 4.
Reference numeral 6 denotes a heater for keeping the hot platen 7 at a constant temperature. Next, as shown in FIG. 9B, the hot platen 7 is moved up and down,
The electrode 5 is thermally transferred onto the green sheet 3. Next, FIG.
As shown in FIG. 9C and FIG.
The ceramic green sheet 8 formed thereon is thermally transferred so as to cover the green sheet 3 and the electrode 5.

Similarly, as shown in FIGS. 10E and 10F, an electrode 5 formed on a base film 4 is thermally transferred thereon. These steps are repeated as many times as necessary to form a laminate as shown in FIG. 10 (G), and then divided along the cutting position 9 so that the electrode 5 as shown in FIG. However, a green sheet density difference is likely to occur between the vertical direction and the horizontal direction of the electrode 5. The individual pieces are fired to form end face electrodes, thereby completing a multilayer ceramic electronic component.

FIG. 11A is a partial cross-sectional view of a multilayer ceramic capacitor which is an example of the multilayer ceramic electronic component thus manufactured. In FIG. 11A, several tens to several hundreds of internal electrodes 10 are embedded in the ceramic layer 11. The end face electrodes 12 are alternately connected to the internal electrodes 10.

However, as shown in FIG. 9C, since the green sheet 8 formed on the base film 4 is formed to be thin and uniform in thickness and uniform in density, FIG.
As shown in FIG. 10 (G), irregularities corresponding to the thickness of the embedded electrode 5 are generated on the surface of the transferred green sheet 8, and at the same time, pinholes or microcracks (fine cracks) are formed on the ceramic green sheet 3. Cracks are easily generated. The pinholes and microcracks generated here cannot be repaired in the next step. Thus, the internal electrode 5
As the number of stacked layers increases, the unevenness increases, and there is a possibility that lamination defects and density unevenness of the green sheet may increase.

FIG. 11B shows an example of a multilayer ceramic capacitor in which a defect has occurred.
3 is a defect called a lateral crack. This side crack 13
Not only poses a problem in appearance but also affects the reliability of the multilayer ceramic electronic component depending on its size (or depth). It is empirically known that the side cracks 13 hardly occur on the upper and lower outer surfaces of the ceramic layer 11 and easily occur on the side surfaces of the ceramic layer.
Further, since the side cracks 13 are likely to occur when the internal electrodes 10 are stacked in 200 layers or more (especially 500 layers or more), it is considered that the phenomenon described with reference to FIGS. Can be

[0008] Then, the inventors disclosed in Japanese Patent Application Laid-Open No. 1-222.
No. 6131 proposes a method of thermally transferring a ceramic green sheet with embedded electrodes, but the green sheet tends to have uneven thickness. Also, Japanese Unexamined Patent Publication No.
No. 70 proposes a method of laminating a reverse pattern on a dielectric green sheet while printing it by a gravure printing method. In this case, too, the solvent contained in the electrode ink causes the green sheet to swell. Short circuit.

[0009]

In the case of a laminating method in which a ceramic green sheet with embedded electrodes is thermally transferred onto a ceramic green laminate, a thin layer of a dielectric material must be obtained unless the surface of the green ceramic sheet with embedded electrodes is highly planarized. With the increase in the number of layers and the number of layers, the unevenness of the overlapping part of the internal electrodes increases,
There is a problem that side cracks are likely to occur in the completed multilayer ceramic electronic component. In order to reduce the unevenness of the embedded electrode, a reverse pattern was printed with dielectric ink between the electrodes (gap between the electrode patterns), but the green sheet swelled and could be short-circuited. There is.

The present invention solves the above-mentioned conventional problems. By improving the thermal transfer method of a ceramic sheet with embedded electrodes, it is possible to increase productivity, and to cope with thinning and high lamination of an electric body. It is an object of the present invention to provide a method for manufacturing a ceramic electronic component.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a gravure printing method for eliminating unevenness of internal electrodes, which has been a problem when laminating a conventional ceramic green sheet with embedded electrodes. A ceramic reverse pattern is formed between the formed electrode inks, and further, a required number of raw ceramic sheets with embedded electrodes formed by transferring a raw ceramic sheet formed on another base film thereon are laminated. Accordingly, even if the thickness of the dielectric layer is as thin as 10 μm or less, the dielectric layer does not have unevenness and lamination cracks.
A multilayer ceramic electronic component having a high lamination of zero or more layers can be manufactured with a high yield.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is characterized in that a plurality of gravure-printed electrode patterns on a first base film are placed on the second base film with a thickness of 10 μm.
The following ceramic raw sheet and a ceramic reverse pattern are transcribed to prepare an electrode-embedded ceramic raw sheet, and the electrode-embedded ceramic raw sheet is positioned on another ceramic green laminate, and then the electrode-embedded ceramic raw sheet is formed. After the ceramic green sheet and the ceramic green laminate are brought into close contact with each other by thermocompression bonding from the base surface of the sheet, the ceramic raw sheet and the ceramic are thermocompression bonded from the base surface of the electrode embedded ceramic green sheet. After repeating a series of steps of adhering the green laminate and peeling only the base film a plurality of times, cutting the finished ceramic green laminate into a predetermined shape, firing, and forming the end face electrode of the multilayer ceramic electronic component. This is a manufacturing method. Prevents printing misregistration that has become a problem in the printing method, reduces the unevenness of the electrode pattern with a gravure-printed reverse ceramic pattern, and transfers a ceramic raw sheet of uniform thickness onto this, thereby achieving a more laminated ceramic electronic This has the effect of improving the production cost and yield during thinning and high lamination of components.

[0013] According to a second aspect of the present invention, the ceramic reverse pattern and the gravure printed ceramic reverse pattern are formed on a first base film on which a plurality of gravure printed electrode patterns and a ceramic reverse pattern are formed. 10 μm from the second base film so as to cover the electrode pattern.
m or less, and after embedding an electrode-embedded ceramic raw sheet obtained by transferring a ceramic raw sheet having a size of m or less, onto another ceramic raw laminate, the base material of the electrode-embedded ceramic raw sheet is heated and pressed to form the ceramic. After repeating a series of steps of adhering the green sheet and the ceramic green laminate and peeling only the base film a plurality of times, cutting the finished ceramic green laminate into a predetermined shape, firing, and forming an end face electrode. This is a method for manufacturing multilayer ceramic electronic components. Gravure printing of the electrode pattern prevents print misalignment that has been a problem with conventional screen printing methods, and reduces the unevenness of the electrode pattern with a gravure-printed reverse ceramic pattern. By further transferring a ceramic raw sheet of uniform thickness on this, An effect that can increase the production cost and yield during thinning and high stacking the click electronic components.

According to a third aspect of the present invention, there is provided a ceramic green sheet having a thickness of 10 μm or less on a second base film so as to cover a plurality of gravure printed electrode patterns on the first base film. Transferring the ceramic reverse pattern on the base film of No. 3 to prepare an electrode-embedded ceramic raw sheet, and positioning the electrode-embedded ceramic raw sheet on another ceramic raw laminate, From the base surface, the ceramic green sheet and the ceramic green laminate are brought into close contact by heating and pressing, and a series of steps of peeling only the first base film are repeated a plurality of times. This is a method of manufacturing a multilayer ceramic electronic component in which a predetermined shape is cut, fired, and an end face electrode is formed. The gravure printing prevents printing misregistration that has been a problem with conventional screen printing methods, reduces the unevenness of the electrode pattern with a gravure-printed ceramic reverse pattern, and transfers a ceramic raw sheet of uniform thickness onto this By doing so, there is an effect that the production cost and yield can be improved when the multilayer ceramic electronic component is made thinner and more highly laminated.

According to a fourth aspect of the present invention, when transferring a ceramic green sheet or a gravure-printed ceramic reverse pattern onto a plurality of gravure-printed electrode patterns on the first base film, a roll is formed. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a transfer device is used, and a raw ceramic sheet with embedded electrodes can be manufactured continuously by using a roll transfer device, thereby reducing production cost and yield. It has the effect of being able to improve.

According to a fifth aspect of the present invention, the electrode pattern has a viscosity of 10 poise or less containing at least a resin, a solvent, and a metal powder having a diameter of 1 μm or less, from which aggregates having a size of 15 μm or more have been removed. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the electrode ink is gravure-printed, and has low viscosity, which is too low in conventional screen printing to print. By using electrode ink, aggregates having a size of 15 μm or more, which were impossible with conventional screen printing, can be removed. Further, by performing gravure printing, the deformation of the printed pattern can be minimized. This has the effect of improving production cost and yield during thinning and high lamination.

According to a sixth aspect of the present invention, in the gravure-printed ceramic reverse pattern, a viscosity of 20 poise or less containing at least a resin, a solvent, a plasticizer, and ceramic powder from which agglomerates having a size of 15 μm or more have been removed is provided. 4. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the ceramic ink is printed by stripe printing or stripe coating. By using low-viscosity ceramic ink, aggregates with a size of 15 microns or more, which were impossible with conventional screen printing, can be removed, and by gravure printing, gravure printing can be performed with the same high precision as the electrode pattern. Ceramic reverse pattern printing can be formed, and the production cost for thinning and high lamination of multilayer ceramic electronic components An effect that can be improved fine yield.

According to a seventh aspect of the present invention, the pitch of the gravure-printed ceramic reverse pattern and the pitch of the electrode pattern match, and the thickness difference between the gravure-printed ceramic reverse pattern and the electrode pattern is 5 μm. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the thickness difference between the electrode pattern and the ceramic pattern is reduced, and the occurrence of unevenness due to the electrode thickness during lamination is reduced. This has the effect of improving the production cost and yield when the multilayer ceramic electronic component is made thinner and more highly laminated.

According to an eighth aspect of the present invention, in the gravure-printed reverse ceramic pattern, a ceramic ink containing at least a resin, a solvent, a plasticizer, and a ceramic powder from which aggregates having a size of 15 μm or more have been removed is transferred. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the gravure printing is performed on the film and then transferred onto the base film or the ceramic raw sheet from the transfer film. The printed ceramic reverse pattern is also gravure printed to prevent print misregistration that was a problem with conventional screen printing methods,
By reducing the unevenness of the electrode pattern with a gravure-printed ceramic reverse pattern and further embedding it in a ceramic raw sheet, it is possible to improve the production cost and yield at the time of thinning and high lamination of multilayer ceramic electronic components. Have.

According to a ninth aspect of the present invention, the electrode pattern and the reverse ceramic pattern are gravure printed at a speed of 10 m / min or more, and at least the thickness of the electrode pattern after drying is 3 μm or less. A method for manufacturing a multilayer ceramic electronic component according to any one of the above, wherein by transferring a gravure-printed ceramic reverse pattern, it is possible to minimize the influence of an ink solvent which is a problem when directly printing a ceramic ink. This has the effect of improving the production cost and yield when the multilayer ceramic electronic component is made thinner and more highly laminated. By reducing the variation in tension between the left and right sides of the base film during gravure printing, the printing accuracy of the electrode pattern and the ceramic pattern can be improved, and the printing productivity can be improved. This has the effect of improving the production cost and yield during high integration and high lamination.

According to a tenth aspect of the present invention, in the gravure-printed ceramic reverse pattern, a ceramic slurry containing at least a resin, a solvent, a plasticizer, and ceramic powder from which aggregates having a size of 15 microns or more have been removed is provided. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component is manufactured by printing and drying at least one layer or more, wherein a gravure-printed ceramic reverse pattern is printed and formed a plurality of times. Thus, the thickness accuracy and the occurrence of pinholes can be minimized, and the production cost and yield can be improved when the multilayer ceramic electronic component is thinned and highly laminated.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a member for producing a raw ceramic sheet with embedded electrodes according to the first embodiment of the present invention, and FIG. 2 shows a configuration of the raw ceramic sheet with embedded electrodes manufactured in the same embodiment. 3 and 4 are views for explaining the state of lamination of the ceramic raw sheets with embedded electrodes. FIG. 5 is a diagram for explaining a less expensive method for producing a green ceramic sheet with embedded electrodes according to the second embodiment of the present invention, and FIG. 6 is a method for producing a green ceramic sheet with embedded electrodes according to the third embodiment of the present invention. FIG. 7 is a view for explaining a method of individually transferring and creating the constituent members of the ceramic raw sheet with embedded electrodes according to the fourth embodiment of the present invention. FIG. 8 is a diagram showing a state where a ceramic reverse pattern and an electrode pattern are flattened using a smoother according to a seventh embodiment of the present invention.

In the above description, a multilayer ceramic capacitor has been described as an example of a multilayer ceramic electronic component, but other multilayer ceramic electronic components can be similarly implemented.

(Embodiment 1) In FIGS. 1 and 2,
Reference numeral 14 denotes a second base film, on which a ceramic green sheet 15 and a ceramic reverse pattern 16 having a thickness of 10 μm or less are formed.
Reference numeral 17 denotes an electrode pattern, a plurality of which are formed on the first base film 18 by gravure printing. Note that FIG. 1C shows a cross section of FIG. 1A, and shows a positional relationship of each member. And FIG.
As shown in (B), the ceramic raw sheet 15 and the ceramic reverse pattern 16 formed on the second base film 14 face the electrode pattern 17 formed on the first base film 18.

Then, as shown in FIG. 2 (C), pressure is applied to adhere and integrate each other, and finally, only the second base film 14 is peeled off to form an electrode as shown in FIG. 2 (A). The embedded ceramic raw sheet is completed. In this way, as shown in FIG. 2A, the electrode pattern 17 and the ceramic reverse pattern 16 are integrated. In FIG. 2A, the electrode pattern 17 and the ceramic reverse pattern 16 are shown.
The ceramic raw sheet 15 formed thereon is omitted in order to make the relationship easily understandable. Thus, FIG.
As shown in (C), an electrode-embedded ceramic raw sheet composed of an electrode pattern 17, a gravure-printed ceramic reverse pattern 16 and a ceramic raw sheet 15 is completed on a first base film 18. .

FIGS. 3 and 4 illustrate the state of lamination of the ceramic raw sheets with embedded electrodes. For the lamination of the electrode-embedded ceramic raw sheets, a method of manufacturing a laminated ceramic electronic component by thermal transfer proposed by the inventors in Japanese Patent Application Laid-Open No. 1-226133 or the like can be used.
In FIG. 3 (A), a heater 1 has a green sheet 3 fixed on the surface thereof while keeping the table 2 at a constant temperature.
An electrode pattern 17 and a gravure-printed ceramic reverse pattern 16 are formed on the surface of the first base film 18.
And a raw ceramic sheet 15 formed so as to cover them. Reference numeral 6 denotes a heater for keeping the hot platen 7 at a constant temperature.

Next, as shown in FIG. 3A, the hot platen 7 is moved up and down so that the electrode pattern 1 is placed on the green sheet 3.
7 and ceramic reverse pattern 16 and ceramic raw sheet 1
5 is thermally transferred simultaneously. Next, FIG. 3 (C) and FIG. 4 (D)
As shown in (2), such a lamination process is repeated a predetermined number of times.
These steps are repeated as many times as necessary to form a laminate as shown in FIG. 4E, and then divided along the cutting position 9 so that the electrode pattern 17 as shown in FIG. Individual pieces embedded in the sheet 15 are formed. As shown in FIG. 3 and FIG. 4, in the case of the present invention, by providing the ceramic reverse pattern 16 printed by gravure, the occurrence of unevenness due to the electrode pattern 17 can be prevented, and the yield of the laminating step is increased. Furthermore, since the density difference does not occur in the laminated body produced in this way, defects such as side cracks do not occur in the finished laminated ceramic electronic component.

The method for manufacturing a multilayer ceramic capacitor will be described in more detail by way of example. As a monolithic ceramic capacitor, a prototype having a nickel thickness of 2 μm and an internal electrode of 600 layers after firing was manufactured. First, the first base film 18 shown in FIG.
A commercially available polyester film having a thickness of 0 μm and a width of 300 mm was used, and the electrode ink was directly gravure printed thereon. The internally developed gravure printing nickel ink was used. The gravure printing machine used was a commercially available gravure printing machine, and the gravure plate used had a diameter of 10 cm. For the printing, the pattern of the internal electrode of the multilayer ceramic capacitor was formed on the circumference of the surface with an area of about 300 mm square, and nickel plating was performed to extend the life. Thus, FIG.
(B) An equivalent was prepared.

Further, the second base film 1 subjected to the release treatment
A ceramic green sheet 15 having a thickness of 10 μm or less was formed on the substrate 4, and a ceramic reverse pattern 16 was formed thereon. Here, the ceramic reverse pattern was prepared in the same manner as the electrode ink, and formed on a ceramic green sheet by gravure printing. FIG. 1A and FIG.
(C) The equivalent sample is cut into sheets (sheet shape) of about 300 mm square, and further set so that the coating surfaces face each other as shown in FIG. 2 (B). After being integrated using the same, the second base film 14 was peeled off, and an electrode-embedded ceramic raw sheet corresponding to FIG. 2C was prepared.

Next, through a laminating process as shown in FIGS. 3 and 4, 600 electrode patterns 18 were laminated, cut into a predetermined shape, fired, and end face electrodes were formed. . When the completed sample was observed, there was no side crack 13 as shown in FIG. 11B, and a good product was obtained in the reliability evaluation. In this way, good products could be produced with a high yield.

As a conventional example, when the lamination was attempted using the sample shown in FIG. 7 with the slight irregularities remaining, the irregularities on the surface increased as the number of layers increased, and it was difficult to laminate 200 or more layers. . Therefore, lamination was stopped with the number of laminations kept at 200, cut into a predetermined shape, fired, and end face electrodes were formed, thereby producing a prototype multilayer ceramic capacitor. However, the completed sample had side cracks as shown in FIG. 11 (B), and a problem remained in terms of reliability. 9 and 10, since the electrodes and the ceramic green sheets are separately laminated, the lamination time and the lamination cost are twice as large as those of the present invention.

The thickness of the single green sheet is 10 μm.
The following (especially, 5 μm or less) is desirable. When a green sheet having a thickness of 12 μm or more is used, the thickness of the fired ceramic layer 11 increases, and the capacitance characteristics of the product decrease. Further, a green sheet having a thickness of 12 μm or more has appropriate elasticity (or compressibility), so that the thickness of the electrode pattern is easily absorbed. However, a very thin ceramic sheet having a thickness of several μm as described in the present embodiment can no longer absorb the electrode thickness. Therefore, by introducing a gravure-printed ceramic reverse pattern in such a very thin ceramic raw sheet, the thickness of the electrode can be easily absorbed.

(Embodiment 2) In FIG. 5, reference numeral 19 denotes a winding core. On the core 19a, a second base film 14, and a ceramic raw sheet 15 formed thereon,
A gravure-printed ceramic reverse pattern 16 is wound over a long length. On the core 19b, the first
, And an electrode pattern 17 formed thereon are wound over a long length. Reference numeral 20 denotes a roll press, which presses and adheres to each other while contacting the first base film and the second base film.

In this way, the ceramic reverse pattern 16 and the ceramic raw sheet 15 gravure-printed on the electrode pattern 17 are transferred and wound around the core 19d together with the first base film 18. The unnecessary second base film 14 is collected by the core 19c and reused. In FIG. 5, arrows indicate the state of application of pressure by the roll press 20 and the direction in which the core 19 rotates.

By using the roll press 20 in this way, the productivity can be improved, and the reuse of the base film can be facilitated, which is effective in cost reduction and waste reduction.

(Embodiment 3) In FIG. 6A, only a ceramic green sheet 15 is formed on a second base film 14. On one first base film 18, an electrode pattern 17 and a ceramic reverse pattern 16 are formed so as not to overlap with each other. In the third embodiment, as shown in FIG. 6A, the ceramic raw sheet 15, the electrode pattern 17 and the ceramic reverse pattern 16 are set facing each other, and are adhered and integrated with each other. Thereafter, as shown in FIG. 6 (B), by peeling off only the second base film 14, a ceramic raw sheet with embedded electrodes can be produced.

When the ceramic reverse pattern 16 is printed using a gravure printing machine on which the electrode pattern 17 is printed, first, the gravure printed ceramic reverse pattern 16 is printed on the first base film using the gravure printing machine. Then, it is desirable to print the electrode pattern 17. This minimizes damage to the electrode pattern 17.

(Embodiment 4) In FIG. 7A, only a ceramic green sheet 15 is formed on a second base film 14. This ceramic raw sheet 1
5 and the electrode pattern 17 formed on the first base film 18 are set so as to face each other.
As shown in (B), they are brought into close contact with each other and integrated. After that, only the second base film 14 is peeled off. Furthermore,
As shown in FIG. 7 (C), only the ceramic reverse pattern 16 is formed on the second base film 14, and this is adhered to the surface of the ceramic raw sheet 15 as shown in FIG. 7 (D). , After being integrated, the second base film 1
Only 4 will be peeled off.

As shown in the present embodiment, the gravure-printed ceramic reverse pattern 16 is finally transferred (in total, two transfer steps are performed), whereby the electrode pattern 17 and the ceramic raw sheet are transferred. Even if pinholes or microcracks (microcracks) occur in the ceramic green sheet while increasing the adhesion of the ceramic sheet 15, these can be repaired by retransfer. The ceramic raw sheet 15
In the case of only transfer, since no alignment is required, the equipment cost is low, high-speed transfer can be performed, and the cost does not increase.

When one of the electrode pattern 17 and the gravure-printed ceramic inverted pattern 16 was formed on a trial basis using the screen printing method, the positional deviation was large and the desired product could not be obtained. In particular, when the screen printing method is used, the precision required for the screen plate to gradually elongate or deform cannot be obtained due to an increase in the number of times of printing. On the other hand, in the case of gravure printing, since the plate itself is a rigid body, high accuracy can be maintained regardless of the number of printings. As described above, by performing both the ceramic reverse pattern and the electrode pattern by gravure printing, both coating film thicknesses, printing accuracy, and the like can be easily adjusted.

(Embodiment 5) The electrode pattern and the electrode gravure ink used in the present invention will be described in more detail. The electrode ink used for gravure printing is composed of at least a resin, a solvent, and metal powder having a diameter of 1 μm or less, and desirably has a viscosity of 10 poise or less (particularly 5 poise or less). Aggregates having a size of 15 μm or more (preferably 10 μm or more) need to be removed. By using such an electrode ink, a predetermined multilayer ceramic electronic component can be manufactured with a high yield even when the dielectric is made thinner and more highly laminated.

The means for removing the aggregates can be dealt with by selecting an appropriate solvent-resistant material from commercially available filter media and performing pressure filtration. If the viscosity of the electrode ink exceeds 20 poise, the required printing accuracy and film thickness cannot be obtained.
One of the causes is considered to be a phenomenon that occurs when the gravure printing is performed directly on the green sheet because the ink permeates the green sheet but the electrode ink does not permeate the base film.

(Embodiment 6) A gravure-printed ceramic reverse pattern and a ceramic gravure ink used in the present invention will be described. The ceramic ink used to form the gravure-printed ceramic reverse pattern is 1
It is desirable that a ceramic ink having a viscosity of 20 poise or less containing at least a resin, a solvent, a plasticizer, and ceramic powder from which an aggregate having a size of 5 μm or more (preferably 10 μm or more) has been removed is gravure printed. Since the gravure-printed ceramic reverse pattern is a continuous pattern in the printing direction, there is no particular problem even if it is shifted (slipped) in this printing direction. Therefore, the printing conditions for gravure printing have a margin, and it is possible to use a material having a higher viscosity than the electrode ink for gravure printing. The lamination stability can be improved by changing the resin material used for (1).

(Embodiment 7) The relationship between the ceramic reverse pattern and the electrode pattern will be described with reference to FIG. FIG. 8 shows a state where the ceramic reverse pattern and the electrode pattern are flattened using a smoother. For example, by making the width of the ceramic inverted pattern 16 smaller than the interval between the electrode patterns 17, the ceramic inverted pattern 16 is made thicker than the electrode pattern 17, and the first base film 18 is run in the direction of the arrow in FIG. , And the smoother 21 can smooth each other. In particular, by smoothing the ceramic ink in an undried state, the gap between the ceramic ink and the electrode pattern can be easily and accurately filled.

In addition to the smoothing, a roll press or a calender may be used. In such a device, after the ceramic reverse pattern is completed, even if the thickness of the gravure-printed ceramic reverse pattern is larger than the electrode pattern, the thickness is automatically adjusted to the thickness of the electrode pattern.

(Embodiment 8) The width of the base film for printing the electrode pattern and the ceramic pattern is 100
mm or more is desirable. When the width of the base film is 70 mm, especially when the thickness of the base film is less than 30 μm, it is difficult to adjust the right and left tension in the width direction of the film, and it takes time to align the electrode pattern and the ceramic pattern. The film width is preferably 100 mm or more, and preferably 150 mm or more. It is easy to make film tension uniform during gravure printing. Therefore, in addition to the gravure printing in the circumferential direction, the gravure printing plate can be obtained in the width direction of the film. Thus, one print pattern (corresponding to one lamination area of the embedded ceramic green sheet) is 2
Even if it is a 00 mm square, by setting the base film width to 450 mm, two chamfers can be formed in the width direction of the base film, and productivity can be improved. The maximum width of the base film is preferably up to about 1000 mm. If the maximum width of the base film exceeds 2 m, the unit itself becomes a considerable weight unless divided by a slitter or the like, and handling becomes difficult.

The printing speed for gravure printing of the electrode pattern and the gravure-printed ceramic reverse pattern is preferably 10 m / min or more. By setting the speed to 10 m / min or more, the base film can be stretched with a certain tension or more, and the electrode pattern and the gravure-printed ceramic reverse pattern can be aligned with high accuracy. When the speed is 7 m / min or less, the base film is easily loosened in a printing machine or a drier, and the base film can be displaced.

The ceramic raw sheet used here is formed by applying a ceramic slurry containing at least a resin, a solvent, a plasticizer and ceramic powder and having a size of 15 μm or more from which agglomerates have been removed onto a transfer film at least once.
The ceramic raw sheet may be dried to be transferred from the transfer film onto the electrode pattern 17 shown in FIG. Alternatively, this may be transferred from the transfer film on the electrode pattern 17 and the gravure-printed ceramic reverse pattern 16 shown in FIG. 3A. In this way, an electrode-embedded ceramic raw sheet with minimal surface irregularities can be produced. By transferring the ceramic raw sheet instead of applying the ceramic slurry in this manner, productivity can be improved.

Particularly, in the present invention, since the ceramic green sheet can be formed alone on the base film, its density, thickness, mechanical strength, etc. can be controlled with high precision. Further, since the base film can be cleaned immediately before coating, occurrence of defects such as pinholes can be prevented. When both the electrode pattern and the gravure-printed ceramic reverse pattern are formed by gravure printing, not only the gravure ink manufacturing specifications (solvent, resin, equipment) but also the printing apparatus can be shared. Therefore, the accuracy of the gravure printing pattern,
Thickness, coating density, etc. can be easily adjusted.

[0050]

As described above, according to the present invention, by using a homogeneous ceramic green sheet, a buried ceramic green sheet can be produced with high accuracy, and even when high lamination is performed, the occurrence of side cracks can be prevented. The effect of reducing the thickness of the ceramic layer or the dielectric layer to 2 μm or less and the ultra-high lamination of 500 or more layers can be obtained at a high yield and can be realized at low cost.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a member for manufacturing a ceramic raw sheet with embedded electrodes according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a raw ceramic sheet with embedded electrodes manufactured in the same embodiment.

FIG. 3 is a process diagram for explaining a state of lamination of the ceramic raw sheet with embedded electrodes.

[Fig. 4]

FIG. 5 is a diagram showing a less expensive method of manufacturing a ceramic green sheet with embedded electrodes according to the second embodiment of the present invention.

FIG. 6 is a view for explaining another method for producing a ceramic raw sheet with embedded electrodes according to the third embodiment of the present invention.

FIG. 7 is a view for explaining a method of individually transferring and forming constituent members of a ceramic raw sheet with embedded electrodes according to a fourth embodiment of the present invention.

FIG. 8 is a diagram showing a state where a ceramic reverse pattern and an electrode pattern are flattened using a smoother according to a seventh embodiment of the present invention.

FIG. 9 is a process chart for explaining a state of laminating a ceramic raw sheet according to a conventional method.

FIG. 10

FIG. 11 is a partially cutaway perspective view of a multilayer ceramic capacitor manufactured by a conventional method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 heater 2 units 3 green sheet 4 base film 5 electrode 6 heater 7 hot platen 9 cutting position 14 second base film 15 ceramic raw sheet 16 gravure-printed ceramic reverse pattern 17 electrode pattern 18 first base film 19 core 20 Roll press 21 Smoother

Claims (10)

(57) [Claims] 1. A ceramic green sheet having a thickness of 10 μm or less and a ceramic reverse pattern are transferred from a second base film onto a plurality of gravure-printed electrode patterns on a first base film, and the electrode embedded ceramic green sheet is transferred. After preparing a sheet and positioning the electrode-embedded ceramic raw sheet on another ceramic raw laminate, by heating and pressing from the base surface of the electrode-embedded ceramic raw sheet, the ceramic raw sheet and the ceramic After bringing the green laminate into close contact with each other, a series of steps of heating and pressing from the base surface of the electrode-embedded ceramic raw sheet to bring the ceramic raw sheet into close contact with the ceramic green laminate, and peeling off only the first base film. Process
A method for manufacturing a multilayer ceramic electronic component, in which after repeating a plurality of times, the completed ceramic green laminate is cut into a predetermined shape, fired, and end electrodes are formed. 2. The method according to claim 1, wherein the gravure-printed electrode pattern on the first base film and the gravure-printed ceramic reverse pattern are covered by one second from the second base film.
A ceramic raw sheet having a thickness of 0 μm or less is transferred to form an electrode-embedded ceramic raw sheet, positioned on another ceramic raw laminate, and then heated and pressed from the base surface of the electrode-embedded ceramic raw sheet to form the ceramic. After repeating a series of steps of bringing a green sheet into close contact with the green ceramic laminate and peeling off only the first base film a plurality of times, cutting the finished ceramic green laminate into a predetermined shape, firing, and sintering the electrode. A method for producing a multilayer ceramic electronic component for forming the same. 3. A ceramic raw sheet having a thickness of 10 μm or less on a second base film and a ceramic on a third base film so as to cover a plurality of gravure-printed electrode patterns on the first base film. The reverse pattern is transferred to create an electrode-embedded ceramic raw sheet, and after positioning this electrode-embedded ceramic raw sheet on another ceramic raw laminate, the base material of the electrode-embedded ceramic raw sheet is heated and pressed. A series of steps of bringing the ceramic green sheet and the ceramic green laminate into close contact with each other and peeling only the first base film is repeated a plurality of times, and then cutting the completed ceramic green laminate into a predetermined shape and firing. And a method of manufacturing a multilayer ceramic electronic component forming an end face electrode. 4. A roll transfer device for transferring a ceramic raw sheet or a gravure-printed reverse ceramic pattern onto a plurality of gravure-printed electrode patterns on a first base film. From 3
The method for producing a multilayer ceramic electronic component according to any one of the above. 5. The electrode pattern according to claim 1, wherein at least a resin, a solvent, a diameter of 1 μm and a size of 15 μm or more are removed.
An electrode ink having a viscosity of 10 poise or less containing a metal powder having a diameter of not more than μm is gravure printed.
4. The method for manufacturing a multilayer ceramic electronic component according to any one of the above items. 6. The gravure-printed ceramic reverse pattern is formed by striping or printing a ceramic ink having a viscosity of 20 poise or less containing at least a resin, a solvent, a plasticizer, and ceramic powder from which agglomerates having a size of 15 μm or more have been removed. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the multilayer ceramic electronic component is coated with a stripe. 7. The ceramic reverse pattern is a reverse pattern or a reverse pattern of the electrode pattern, and the ceramic reverse pattern and the electrode pattern are gravure printed so as not to overlap with each other, and a difference between the thickness of the ceramic reverse pattern and the thickness of the electrode pattern. The method for producing a multilayer ceramic electronic component according to claim 1, wherein is less than or equal to 5 μm. 8. The reverse ceramic pattern is formed by gravure printing a ceramic ink containing at least a resin, a solvent, a plasticizer, and ceramic powder on a transfer film from which an aggregate having a size of 15 μm or more has been removed. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the multilayer ceramic electronic component is transferred from a film onto a first base film or a ceramic raw sheet. 9. The multilayer ceramic according to claim 1, wherein the electrode pattern and the reverse ceramic pattern are gravure printed at a speed of 10 m / min or more, and at least the thickness of the electrode pattern after drying is 3 μm or less. Manufacturing method of electronic components. 10. A gravure-printed ceramic reverse pattern is formed by printing at least one layer of a ceramic slurry containing at least a resin, a solvent, a plasticizer, and a ceramic powder, from which aggregates having a size of 15 microns or more have been removed. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component is formed by drying.