JP2011258930A - Laminated electronic component manufacturing device and method for manufacturing laminated electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component manufacturing device and a method thereof capable of making facilities smaller, reducing a cost, and efficiently manufacturing high-quality laminated electronic components.SOLUTION: The electronic component manufacturing device comprises: a sheet conveyance member 12 which continuously conveys a ceramic sheet S in a predetermined direction; a sheet cutting member 14 which cuts the ceramic sheet S to a predetermined length; a sheet lamination member 18 on which cut pieces ST1 and ST2 of the ceramic sheet S cut to the predetermined length by the sheet cutting member 14 are laminated; and a plurality of sheet transfer members 16A and 16B which peel the cut pieces ST1 and ST2 of the ceramic sheet cut to the predetermined length by the sheet cutting member 14 from the sheet conveyance member 12 and transfers the cut pieces ST1 and ST2 to the sheet lamination member 18. One sheet transfer member 16A and the other sheet transfer member 16B alternately transfer and laminate the cut pieces ST1 and ST2 of the ceramic sheet S.

Description

  The present invention relates to a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method for manufacturing a multilayer electronic component such as a multilayer ceramic capacitor.

  The prior art of Patent Document 1 is a method for manufacturing a multilayer ceramic capacitor, in which a mother ceramic green sheet supported by a carrier film is supplied, peeled off by a suction roll, and the mother ceramic green sheet is removed by a transfer / crimping method. Laminate on a flat stage with precision to obtain a laminate. In the prior art of this patent document 1, long ceramic green sheets cannot be continuously supplied, and it is necessary to supply intermittently.

  The prior art of Patent Document 2 is a method for manufacturing a multilayer ceramic capacitor, in which a ceramic green sheet having internal electrodes printed on a ceramic green sheet formed on a roll is supplied, and after sheet handling on a roller, To obtain a laminate. In the prior art of Patent Document 2, the formation of the ceramic green sheet and the formation of the internal electrode cannot be performed continuously, and must be stopped for each predetermined size.

JP 2005-217278 A Japanese Patent Application Laid-Open No. 2004-296641

  However, in the prior art disclosed in Patent Document 1, when a ceramic green sheet is laminated on a strip-shaped lamination stage, the operation of peeling the supplied ceramic green sheet with a suction roll and the operation of laminating from the suction roll to the lamination stage are performed simultaneously. Since it cannot be performed, each operation is an intermittent operation. In order to intermittently supply the ceramic green sheet, it is necessary to operate the supply reel itself intermittently or to have a buffer part between the continuously rotating supply reel and the peeling part of the suction roll. Becomes expensive, the volume increases, and energy consumption such as electric power also increases. In addition, quality variations due to intermittent operation (scratches and distortion during ceramic green sheet conveyance and peeling, stacking position shift due to handling mistakes, contamination due to scattering of cut waste) occur. And since the weight of a suction roll is also heavy here, the inertia at the time of acceleration / deceleration is large, and it is difficult to speed up. Then, stacking deviation occurs.

  On the other hand, in the prior art disclosed in Patent Document 2, when the process includes ceramic green sheet formation and internal electrode formation, in the operation of laminating the ceramic green sheet formation and electrode formation on a strip-shaped laminate, the lamination process The supply of the ceramic green sheet to the battery becomes an intermittent operation. Along with this, when the formation of ceramic green sheets and internal electrodes is stopped for each layer, material loss and quality variation (green sheet thickness, electrode thickness, Variation in electrode area) and sheet streaks occur. Moreover, energy consumption, such as electric power, becomes large by performing intermittent operation | movement. Furthermore, since the roll is heavy, the inertia during acceleration / deceleration is large and it is difficult to increase the speed.

  Accordingly, in view of the above problems, an object of the present invention is to manufacture a multilayer electronic component capable of simplifying equipment, reducing the size and reducing the cost, and efficiently manufacturing a high-quality multilayer electronic component. An apparatus and a method for manufacturing a multilayer electronic component are provided.

  The present invention provides a sheet conveying member that continuously conveys a ceramic sheet in a predetermined direction, a sheet cutting member that cuts the ceramic sheet to a predetermined length, and the ceramic cut to a predetermined length by the sheet cutting member. A sheet lamination member on which cut pieces of the sheet are laminated, and a cut piece of the ceramic sheet cut to a predetermined length by the sheet cutting member are peeled off from the sheet conveying member, and the cut piece of the ceramic sheet is A plurality of sheet transfer members to be transferred to the sheet stacking member, and the one sheet transfer member and the other sheet transfer member are stacked by alternately transferring the cut pieces of the ceramic sheet.

  According to this configuration, the cut piece of the ceramic sheet cut by the sheet cutting member is peeled off from the sheet conveying member by one of the plurality of sheet transfer members and transferred to the sheet stacking member. Then, the cut piece of the ceramic sheet cut by the sheet cutting member is peeled off from the sheet conveying member by the other sheet transfer member among the plurality of sheet transfer members, and the ceramic sheet already transferred to the sheet lamination member is cut. It is transferred to a piece. In this way, the cut pieces of the ceramic sheet are alternately transferred and stacked by the operation of one sheet transfer member and the other sheet transfer member.

  ADVANTAGE OF THE INVENTION According to this invention, it can laminate | stack on one sheet | seat laminated member, supplying a ceramic sheet, without stopping continuously. As a result, the buffer mechanism and the portion that requires acceleration / deceleration are not required, the device cost can be reduced, the device size can be reduced, and the power consumption such as power can be reduced. Moreover, since each process is performed at substantially constant speed, damage, distortion, handling error, and cut waste to the ceramic sheet can be reduced, and stacking accuracy can be improved by reducing conveyance positioning variation. Furthermore, since the problems in terms of apparatus and quality can be reduced, the production line speed can be easily improved.

  In addition, an electrode circuit forming unit for forming an electrode circuit on the ceramic sheet is provided, and the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit in a state where the conveyance of the ceramic sheet by the sheet conveying member is continued. Preferably it is formed.

  According to this configuration, the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit while the ceramic sheet is continuously conveyed by the sheet conveying member. This allows continuous printing of the electrode circuit.

  Also, having a dielectric coating film forming portion for forming a dielectric coating film on the step portion of the ceramic sheet generated by the formation of the electrode circuit, in a state where the conveyance of the ceramic sheet by the sheet conveying member is continued, It is preferable that the dielectric coating film is formed on the stepped portion by the dielectric coating film forming unit.

  According to this configuration, the dielectric coating film is formed on the step portion of the ceramic sheet by the dielectric coating film forming unit while the ceramic sheet is continuously conveyed by the sheet conveying member. Thereby, since the formation process of a dielectric coating film is performed in the state where conveyance of the ceramic sheet was continued by the sheet conveyance member, continuous printing of a dielectric coating film is attained. As a result, compared to the case where dielectric coatings are formed in separate processes and in independent time, the laminated structure in which ceramic sheets are laminated, and thus the variation in the quality of electronic components is reduced, and the line speed is improved. It is possible to reduce material loss. Furthermore, the overall apparatus cost can be reduced, the apparatus size can be reduced, and the energy consumption can be further reduced.

  Moreover, it is preferable that the said electrode circuit formation part or the said dielectric material coating film formation part is a plateless printing apparatus.

  According to this configuration, it is possible to easily and quickly form electrode circuits and dielectric coating films having different patterns for each layer of the cut pieces of the ceramic sheet. In addition, even if an error occurs in the position control of the sheet laminated member, it is possible to freely adjust the pitch between the electrode circuits and between the dielectric coating films to form an electrode circuit and a dielectric coating film without misalignment. it can. As a result, complicated equipment is not required, and the cost of new equipment investment can be reduced.

  The sheet transfer member includes a film formation unit that forms a ceramic sheet by applying a ceramic slurry to the sheet conveying member, and the plurality of sheet transfers are performed while the formation of the ceramic sheet by the film formation unit is continued. It is preferable that the cut piece of the ceramic sheet is transferred by a member.

  According to this configuration, the cut pieces of the ceramic sheet are transferred by the plurality of sheet transfer members while the formation of the ceramic sheet by the film forming unit is continued. Thereby, continuous formation of the ceramic sheet and continuous transfer of the cut pieces of the ceramic sheet are possible. For this reason, it becomes possible to manufacture the laminated structure of a ceramic sheet as a continuous series of processes. As a result, compared with the case where the formation of the ceramic sheet by the film forming unit and the transfer of the cut pieces of the ceramic sheet by a plurality of sheet transfer members are performed in separate steps and independent times, the laminated structure of the ceramic sheets It is possible to reduce the variation in the quality of the body and the electronic parts, improve the line speed, and reduce the material loss. Furthermore, the overall apparatus cost can be reduced, the apparatus size can be reduced, and the energy consumption can be further reduced.

  The present invention also includes a sheet conveying step of continuously conveying a ceramic sheet in a predetermined direction by a sheet conveying member, a sheet cutting step of cutting the ceramic sheet to a predetermined length by a sheet cutting member, and the sheet cutting member. A sheet transfer step in which a piece of the ceramic sheet cut to a predetermined length is peeled off from the sheet conveying member by a plurality of sheet transfer members and transferred to a sheet lamination member, and in the sheet transfer step, One of the sheet transfer members and the other sheet transfer member are laminated by transferring the cut pieces of the ceramic sheet alternately onto the sheet lamination member, and laminating them.

  In addition, an electrode circuit forming step of forming an electrode circuit on the ceramic sheet by an electrode circuit forming unit, and in the electrode circuit forming step, the electrode is formed while the ceramic sheet is continuously conveyed by the sheet conveying member. It is preferable that the electrode circuit is formed on the ceramic sheet by a circuit forming unit.

  In addition, a dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on a step portion of the ceramic sheet generated by the formation of the electrode circuit, the dielectric coating film forming step, It is preferable that the dielectric coating film is formed on the stepped portion by the dielectric coating film forming unit in a state where the ceramic sheet is continuously conveyed by the sheet conveying member.

  In the electrode circuit forming step or the dielectric coating film forming step, it is preferable to use a plateless printing apparatus as the electrode circuit forming unit or the dielectric coating film forming unit.

  Furthermore, it has a film-forming process which forms a ceramic sheet by applying a ceramic slurry to the sheet conveying member by a film-forming part, and in the film-forming part, the formation of the ceramic sheet by the film-forming part It is preferable that the cut piece of the ceramic sheet is transferred by the plurality of sheet transfer members in a continued state.

  According to the present invention, it is possible to reduce the size and cost of equipment, and it is possible to efficiently manufacture a high-quality multilayer electronic component.

1 is a configuration diagram of a multilayer electronic component manufacturing apparatus according to a first embodiment of the present invention. It is a block diagram of the multilayer electronic component manufacturing apparatus which concerns on 2nd Embodiment of this invention. It is explanatory drawing which showed the level | step-difference part (concave part) which generate | occur | produced between the electrode circuits on a ceramic sheet. It is explanatory drawing which showed the electrode circuit and dielectric material coating film on a ceramic sheet. It is a block diagram of the multilayer electronic component manufacturing apparatus which concerns on 3rd Embodiment of this invention. It is a timing chart when laminating | cutting the cut piece of a ceramic sheet on a sheet | seat laminated member using the sheet | seat transfer member of this invention.

  A multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a first embodiment of the present invention will be described with reference to the drawings. The “multilayer electronic component” to be manufactured in the present invention includes multilayer electronic components such as a multilayer ceramic capacitor and a multilayer ceramic inductor. Hereinafter, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component.

First, a multilayer electronic component manufacturing apparatus will be described.
In addition, 1st Embodiment is a thing of the aspect by which the elongate ceramic sheet in which the electrode circuit (internal electrode) and the dielectric coating film were already formed is conveyed continuously (non-intermittently) to the following sheet conveyance roll. is there.

  As shown in FIG. 1, the multilayer electronic component manufacturing apparatus 10 mainly has a ceramic sheet S (ceramic green sheet) and a sheet conveying roll 12 (sheet conveying member) that conveys a base film, and a ceramic sheet S in a predetermined manner. A cutting mechanism 14 (sheet cutting member) that cuts into lengths, and a first peeling roll 16A and a second peeling roll 16B that peel the ceramic sheet S conveyed by the sheet conveying roll 12 from the outer peripheral surface of the sheet conveying roll 12 ( Sheet transfer member) and the cut pieces ST1 and ST2 of the ceramic sheet S cut to a predetermined length by the cutting mechanism 14 and peeled by the peeling rolls 16A and 16B are laminated to form a laminated structure of the ceramic sheets S. And a flat plate-like lamination stage 18 (sheet lamination member). A mold release treatment is performed on the surface of the base film.

  Specifically, the sheet conveying roll 12 is configured by a rigid roll (columnar or cylindrical). The sheet conveying roll 12 is configured to be rotationally driven by a rotational driving mechanism (not shown).

  For example, the cutting mechanism 14 is provided with a blade on a cutting roller that is rotated by a rotation driving mechanism (not shown), and closes to the sheet conveying roll 12 and rotates at substantially the same peripheral speed, so that the ceramic sheet S on the sheet conveying roll 12 is moved. What cut | disconnects in a predetermined cutting position is used. Alternatively, the cutting mechanism 14 may be provided so that the blade linearly reciprocates by a linear drive mechanism (not shown). In this case, the ceramic sheet S conveyed on the sheet conveying roll 12 is cut at a predetermined cutting position by the linear reciprocating motion of the blade.

  The first peeling roll 16A and the second peeling roll 16B have a mechanism (means) for holding the cut pieces ST1, ST2 of the ceramic sheet S on the roll. As a mechanism for holding the cut pieces ST1, ST2 of the ceramic sheet S on the roll, for example, a cut piece ST1, ST2 of the ceramic sheet S, such as a vacuum suction mechanism, adhesion by pressure / temperature, adhesion by static electricity (electrostatic adsorption), etc. Any means or mechanism capable of adsorbing can be used.

  The first peeling roll 16A and the second peeling roll 16B can be freely moved between a position close to the sheet conveying roll 12 (peeling position) and a position close to the stacking stage 18 (transfer position) by a moving device (not shown). It is configured to be movable (for example, linear movement). Thereby, the first peeling roll 16A and the second peeling roll 16B can peel the cut pieces ST1 and ST2 of the ceramic sheet S on the sheet conveying roll 12 and transfer them onto the lamination stage 18.

  Furthermore, the first peeling roll 16A and the second peeling roll 16B are provided so as to be rotatable by a rotation driving mechanism (not shown). The first peeling roll 16A and the second peeling roll 16B are pressed against the cut pieces ST1 and ST2 of the ceramic sheet S on the outer peripheral surface of the sheet conveying roll 12 and rotated, whereby the outer periphery of the base film of the sheet conveying roll 12 The cut pieces ST1 and ST2 of the ceramic sheet S are peeled off from the surface.

  As the lamination stage 18, for example, a rigid flat plate is used. However, it is not limited to a rigid flat plate, and a cylindrical or columnar roll may be used. When using a roll, the cut pieces ST1 and ST2 of the ceramic sheet S are wound around the outer peripheral surface and laminated. Moreover, the lamination | stacking stage 18 is comprised so that it may move along a horizontal direction (refer arrow X in FIG. 1) with the linear drive mechanism which is not shown in figure. Thereby, the lamination | stacking stage 18 can reciprocate in a horizontal direction (left-right direction in FIG. 1).

  The peeling rolls 16A and 16B hold the ceramic sheet S by means such as adsorption (suction, electrostatic adsorption or adhesion). Further, as means for holding the cut pieces ST1 and ST2 of the ceramic sheet S on the lamination stage 18, a close pressure method of the first peeling roll 16A and the second peeling roll 16B, or an adhesion method using pressure and temperature is used. The force with which the peeling rolls 16A and 16B hold the cut pieces ST1 and ST2 is set to be larger than the force with which the base film holds the cut pieces ST1 and ST2, and the lamination stage 18 has a smaller force than the force to hold the cut pieces ST1 and ST2. Therefore, the cut pieces ST1 and ST2 of the ceramic sheet S are peeled from the base film, held on the peeling rolls 16A and 16B, and then transferred to the lamination stage 18.

  The peeling rolls 16 </ b> A and 16 </ b> B may be vacuum suction rolls that suck and peel the ceramic sheet S. At this time, it is preferable that peeling roll 16A, 16B is comprised so that the site | part which adsorb | sucks the ceramic sheet S, and the site | part which does not adsorb | suck. When receiving the ceramic sheet S from the base film, a predetermined portion of the peeling rolls 16A and 16B that comes in contact with the ceramic sheet S is provided with an adsorption function, and when the received ceramic sheet S is transferred to the lamination stage 18, it contacts the ceramic sheet S. The ceramic sheet S can be received and transferred smoothly by providing a non-adsorptive region at predetermined portions of the peeling rolls 16A and 16B.

  Next, the manufacturing method of the laminated structure of the ceramic sheet S using the multilayer electronic component manufacturing apparatus 10 according to the first embodiment will be described.

  As shown in FIGS. 1 and 2, a long ceramic sheet S on which an electrode circuit and a dielectric coating film have already been formed is conveyed continuously and at a constant speed by a sheet conveying roll 12. The sheet conveying roll 12 is driven to rotate by a rotation driving mechanism (not shown).

  Then, the ceramic sheet S conveyed by the sheet conveying roll 12 is cut by the cutting mechanism 14. The cutting mechanism 14 is rotated by a rotation driving mechanism (not shown), and the blade cuts the ceramic sheet S at a predetermined site. For this reason, every time the cutting mechanism 14 rotates once, one place on the ceramic sheet S is cut. In the cutting process by the cutting mechanism 14, the conveyance of the ceramic sheet S is continued. That is, the ceramic sheet S is continuously supplied without being affected by the cutting process by the cutting mechanism 14. In this way, the ceramic sheets S on the sheet conveying roll 12 are cut one after another at a predetermined interval, and a plurality of strip-shaped cut pieces ST1 and ST2 which are ceramic sheets S are generated on the outer peripheral surface of the sheet conveying roll 12. Is done.

  Next, at a predetermined timing, the first peeling roll 16A or the second peeling roll 16B alternately peels the cut pieces ST1, ST2 of the ceramic sheet S on the sheet conveying roll 12 from the sheet conveying roll 12. That is, the cut piece ST1 of the ceramic sheet S is peeled off from the base film on the sheet transport roll 12 by the first peeling roll 16A, and the cut piece ST2 of another ceramic sheet S is placed on the sheet transport roll 12 by the second peeling roll 16B. It peels from the base film. In this way, the plurality of cut pieces ST1, ST2 of the ceramic sheet S on the sheet conveying roll 12 are alternately peeled by the first peeling roll 16A and the second peeling roll 16B. The peeling operation by the first peeling roll 16A and the second peeling roll 16B is continued until a predetermined number of the cut pieces ST1, ST2 of the ceramic sheet S are stacked without stopping in the middle.

  Here, the peeling speed by the first peeling roll 16 </ b> A or the second peeling roll 16 </ b> B is adjusted to substantially the same speed as the supply speed of the cut pieces ST <b> 1 and ST <b> 2 of the ceramic sheet S by the sheet conveying roll 12. For this reason, the peeling operation by the first peeling roll 16A and the second peeling roll 16B can be continued while maintaining the state where the cut pieces ST1 and ST2 of the ceramic sheet S are continuously supplied. As a result, there is no need to slow down the supply speed of the cut pieces ST1, ST2 of the ceramic sheet S by the sheet conveying roll 12, or to temporarily stop the supply of the cut pieces ST1, ST2 of the ceramic sheet S. The production of the laminated structure can be speeded up.

  In the present specification, “the peeling speed by the first peeling roll 16A or the second peeling roll 16B is adjusted to be substantially the same speed as the supply speed of the cut pieces ST1 and ST2 of the ceramic sheet S by the sheet conveying roll 12”. Means that the circumferential speed of the first peeling roll 16 </ b> A and the circumferential speed of the second peeling roll 16 </ b> B are the same speed as the circumferential speed of the sheet conveying roll 12. Specifically, while the first peeling roll 16A (or the second peeling roll 16B) is in proximity to the sheet conveying roll 12 (including from the start to the end of the peeling of one strip sheet), the first peeling roll 16A ( Or it means that the peripheral speed of the second peeling roll 16B) and the peripheral speed of the sheet conveying roll 12 are substantially the same peripheral speed.

  Subsequently, the first peeling roll 16A holding the cut piece ST1 of the ceramic sheet S moves in the vertical direction (downward in FIG. 1) toward the transfer position, and the end of the cut piece ST1 faces downward. It moves toward the stacking stage 18 while rotating. Thereafter, the laminating stage 18 moves horizontally (to the right in FIG. 1) toward the transfer position of the first peeling roll 16A, whereby the cut piece ST1 of the ceramic sheet S held on the first peeling roll 16A and the laminating stage 18 The upper surface of the substrate contacts with a predetermined pressure. Even after both contact, the laminating stage 18 moves in the horizontal direction, whereby the first peeling roll 16A rotates, and the cut piece ST1 of the ceramic sheet S peeled off from the sheet conveying roll 12 by the first peeling roll 16A is obtained. Transferred onto the upper surface of the lamination stage 18 (formation of the first layer). The transfer method is as described above. After the transfer of the cut piece ST1 of the ceramic sheet S as the first layer, the first peeling roll 16A moves in the vertical direction (upward direction in FIG. 1) and again cuts the ceramic sheet S on the sheet conveying roll 12. The piece ST1 is peeled off from the sheet conveying roll 12.

  After the transfer of the cut piece ST1 of the ceramic sheet S by the first release roll 16A (after the formation of the first layer), the second release roll 16B holding the cut piece ST2 of the ceramic sheet S is perpendicular to the transfer position. It moves in the direction (downward in FIG. 1) and moves toward the stacking stage 18 while rotating so that the end of the cut piece ST2 faces downward. Thereafter, the laminating stage 18 moves horizontally (to the left in FIG. 1) toward the transfer position of the second peeling roll 16B, whereby the cut piece ST2 of the ceramic sheet S held on the second peeling roll 16B and the laminating stage 18 The first-layer cut piece ST1 transferred to the contact with a predetermined pressure. Even after the two come into contact, the second peeling roll 16B rotates by moving the lamination stage 18 in the horizontal direction, and the cut pieces ST1 of the ceramic sheet S transferred onto the lamination stage 18 by the first peeling roll 16A. The cut piece ST2 of the ceramic sheet S peeled from the sheet conveying roll 12 by the second peeling roll 16B is transferred to the upper surface (formation of the second layer). After the transfer of the cut piece ST2 of the ceramic sheet S as the second layer, the second peeling roll 16B moves in the vertical direction (upward in FIG. 1) and again cuts the ceramic sheet S on the sheet conveying roll 12. The piece ST2 is peeled off from the sheet conveying roll 12.

  Further, after the transfer of the cut piece ST2 of the ceramic sheet S by the second release roll 16B (after the formation of the second layer), the first release roll 16A holding the cut piece ST1 of the ceramic sheet S is perpendicular to the transfer position. It moves in the direction (downward in FIG. 1) and moves toward the stacking stage 18 while rotating so that the end of the cut piece ST1 faces downward. Thereafter, the laminating stage 18 moves horizontally (to the right in FIG. 1) toward the transfer position of the first peeling roll 16A, whereby the cut piece ST1 of the ceramic sheet S held on the first peeling roll 16A and the laminating stage 18 The second-layer cut piece ST2 transferred to is contacted at a predetermined pressure. Even after both contact, the first peeling roll 16A rotates by moving the stacking stage 18 in the horizontal direction, and the first peeling roll 16A forms a sheet on the upper surface of the cut piece ST2 of the second ceramic sheet S. The cut piece ST1 of the ceramic sheet S peeled off from the transport roll 12 is transferred (formation of the third layer). After the transfer of the cut piece ST1 of the ceramic sheet S as the third layer, the first peeling roll 16A moves in the vertical direction (upward in FIG. 1), and again cuts the ceramic sheet S on the sheet transport roll 12. The piece ST1 is peeled off from the sheet conveying roll 12.

  Subsequently, after the transfer of the cut piece ST1 of the ceramic sheet S by the first release roll 16A (after the formation of the third layer), the second release roll 16B holding the cut piece ST2 of the ceramic sheet S faces the transfer position. It moves in the vertical direction (downward in FIG. 1) and moves toward the stacking stage 18 while rotating so that the end of the cut piece ST2 faces downward. Thereafter, the laminating stage 18 moves horizontally (to the left in FIG. 1) toward the transfer position of the second peeling roll 16B, whereby the cut piece ST2 of the ceramic sheet S held on the second peeling roll 16B and the laminating stage 18 The third-layer cut piece ST1 transferred to is contacted at a predetermined pressure. Even after both contact, the second peeling roll 16B rotates by moving the stacking stage 18 in the horizontal direction, and the sheet is placed on the upper surface of the cut piece ST1 of the third-layer ceramic sheet S by the second peeling roll 16B. The cut piece ST2 of the ceramic sheet S peeled from the transport roll 12 is transferred (formation of the fourth layer). After the transfer of the cut piece ST2 of the fourth ceramic sheet S, the second peeling roll 16B moves in the vertical direction (upward in FIG. 1), and again cuts the ceramic sheet S on the sheet conveying roll 12. The piece ST2 is peeled off from the sheet conveying roll 12.

  In this way, the linear reciprocation of the first peeling roll 16A and the second peeling roll 16B in the vertical direction is continued until the predetermined number of cut pieces ST1 and ST2 of the ceramic sheet S are laminated on the lamination stage 18, And the linear reciprocation of the lamination | stacking stage 18 in the horizontal direction is continued, and peeling operation | movement and transfer operation | movement by the 1st peeling roll 16A and 2nd peeling roll 16B are repeated (peeling operation | movement and transfer operation | movement are performed continuously). . Then, the separation / transfer of the cut piece ST1 of the ceramic sheet S by the first peeling roll 16A and the peeling / transfer of the cut piece ST2 of the ceramic sheet S by the second peeling roll 16B are alternately performed, and the cut piece of the ceramic sheet S ST1 and ST2 are stacked. And the laminated structure of the ceramic sheet S is formed.

  The laminated structure of the ceramic sheets S formed on the lamination stage 18 is removed from the lamination stage 18 and cut into chips by dicer cutting. Thereafter, the multilayer ceramic capacitor is manufactured through a normal manufacturing process such as firing and forming an electrode circuit (external electrode circuit).

  As described above, according to the first embodiment, the cut pieces ST1 and ST2 of the ceramic sheet S are conveyed by the peeling rolls 16A and 16B while the long ceramic sheet S is continuously supplied without being stopped. It can be peeled off from the roll 12 and continuously laminated on the lamination stage 18. For this reason, each process of the conveyance process of the ceramic sheet S, the cutting process of the ceramic sheet S, and the peeling / transfer process of the cut pieces ST1 and ST2 of the ceramic sheet S proceeds non-stop, and the laminated structure of the ceramic sheet S The body is formed. As a result, the buffer mechanism and the portion requiring acceleration / deceleration are not required, the apparatus cost can be reduced, the apparatus size can be reduced, and the power consumption such as electric power can be reduced. Moreover, since each process is performed at substantially constant speed, damage, distortion, handling mistakes, and cutting waste to the ceramic sheet S can be reduced, and conveyance of the cut pieces ST1 and ST2 of the ceramic sheet S by the peeling rolls 16A and 16B. By reducing the variation in positioning, the stacking accuracy of the cut pieces ST1 and ST2 of the ceramic sheet S can be improved. Furthermore, since the problems in terms of apparatus and quality can be reduced, the production line speed can be easily improved.

  Here, it demonstrates based on a time chart. FIG. 6 is a timing chart when the cut pieces ST1 and ST2 of the ceramic sheet are laminated on the lamination stage 18 using the peeling rollers 16A and 16B. A stack of two cut pieces ST1 and ST2 of the ceramic sheet is shown as one cycle. The ceramic sheet S to which the peeling roller 16A next transfers while the cut pieces ST2 are stacked by the peeling roller 16B on the upper surface of the cut pieces ST1 of the ceramic sheet S already transferred to the upper surface of the lamination stage 18 by the peeling roll 16A. The cut piece ST1 is peeled off. By moving the two peeling rolls 16A and 16B alternately, and further laminating and peeling the ceramic sheet cutting pieces ST1 and ST2, the time can be afforded without stopping the continuous conveyance of the ceramic sheet S. The cut pieces ST1 and ST2 of the ceramic sheet S can be laminated on the lamination stage 18. FIG. 1 shows a configuration diagram at the time when each step in the time chart of FIG. 6 is completed.

  In the first embodiment, the sheet conveyance roll 12 corresponds to the “sheet conveyance member” of the present invention, and the lamination stage 18 corresponds to the “sheet lamination member” of the present invention. The first peeling roll 16A and the second peeling roll 16B correspond to the “sheet transfer member” of the present invention, and the cutting mechanism 14 corresponds to the “sheet cutting member” of the present invention.

  In the above embodiment, the ceramic sheet S (with the electrode circuit 24 formed in advance) with the carrier film (PET film) is conveyed by the sheet conveying roll 12 until the electrode circuit 24 is formed from the application of the ceramic slurry. This process can be deleted. As a result, downsizing and cost reduction of the equipment can be realized.

  The carrier film is conveyed as it is to the sheet conveying roll 12. Thus, since conveyance and lamination | stacking object can be extended to the ceramic sheet S with a carrier film, a novel capital investment cost can be reduced significantly.

  Further, since the ceramic sheet S that has already been attached to the carrier film is used, the cutting of the ceramic sheet S by the cutting mechanism 14 is facilitated as compared with the case where the ceramic sheet is formed by applying ceramic slurry. Become. Thereby, lamination | stacking of the cut pieces ST1 and ST2 of the ceramic sheet S can be performed at higher speed. Moreover, the loss of the ceramic slurry in the lamination start state from the lamination stop state of the cut pieces ST1 and ST2 of the ceramic sheet S can be eliminated.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a second embodiment of the present invention will be described with reference to the drawings. In addition, while the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment, description of the overlapping structure and effect is abbreviate | omitted.

  In the second embodiment, ceramic slurry is applied on a coating conveying roll (sheet conveying member) to form a ceramic sheet, and an electrode circuit (internal electrode) and a dielectric coating film are further formed on the ceramic sheet on the coating conveying roll. After the formation, the ceramic sheet is cut by a cutting mechanism, and the cut piece is transferred on the lamination stage.

  As shown in FIG. 2, on the periphery of the coating conveyance roll (sheet conveyance member) 20, a film forming means 22 for applying a ceramic slurry to be a material of the ceramic sheet S on the surface of the coating conveyance roll 20, and a film formation A liquid supply means 26 for supplying the ceramic slurry to the means 22 and a drying for drying and solidifying the ceramic slurry on the surface of the coating transport roll 20 located downstream in the rotation direction of the coating transport roll with respect to the film forming means 22 Curing device 28, electrode circuit forming means 30 (electrode circuit forming portion) for forming electrode circuit 24 on ceramic sheet S on coating transport roll 20, and cut pieces of ceramic sheet S by forming electrode circuit 24 The dielectric coating 3 is formed on the step 34 (see FIGS. 3 and 4) generated on the surfaces of ST1 and ST2. A dielectric film forming means 32 for forming the (dielectric film forming section), and the drying and curing device 38 for drying the electrode circuit 24 and the dielectric coating 36, is disposed.

  Note that, similarly to the first embodiment, the first peeling roll 16A and the second peeling roll 16B and the lamination stage 18 are also provided in the second embodiment.

  The coating conveyance roll 20 is comprised by rigid body rolls (columnar shape or cylindrical shape), such as a metal by which the mold release process was performed on the surface. The coating transport roll 20 is configured to be rotationally driven by a rotational drive mechanism (not shown). When the coating conveying roll 20 is driven to rotate, the ceramic sheet S formed on the outer peripheral surface is conveyed. The mold release treatment corresponds to, for example, fluorine plating treatment.

  As the film forming means 22, for example, a die coater, a doctor blade, a roll coater or the like is appropriately employed. In order to make the film thickness of the ceramic sheet S formed on the outer peripheral surface of the coating transport roll 20 thinner, it is preferable to provide an upstream pressure reducing mechanism in the die coater. A ceramic slurry is continuously applied from the film forming unit 22 to the coating conveyance roll 20 to form the ceramic sheet S. Thus, the ceramic slurry is continuously supplied to the same coating transport roll 20. As the ceramic slurry, for example, a ceramic slurry in which a ceramic powder and a resin component are dissolved and dispersed is employed. You may use what disperse | distributed ceramic powder to UV hardening resin. The solvent may be aqueous.

  As the liquid supply means 26, for example, a cylinder type dispenser is adopted. The liquid supply means 26 is not limited to the cylinder-type dispenser, and a gear pump, a diaphragm pump, or the like may be appropriately employed.

  As the electrode circuit forming means 30, for example, an ink jet printing apparatus is employed. The electrode circuit forming means 30 is preferably plateless printing means, but the electrode circuit 24 after drying may be transferred, and any means such as intaglio printing or intaglio offset printing may be used. The electrode material ink used in the electrode circuit forming means 30 is, for example, one obtained by dissolving and dispersing Ni powder (nickel powder) and resin in an organic solvent. A material in which Ni powder is dispersed in a UV curable resin may be used. In particular, it is preferable to use a low swelling solvent for the ceramic coating. The solvent may be aqueous.

  As the dielectric coating film forming means 32, for example, an ink jet printing apparatus is employed. The dielectric coating film forming means 32 is preferably plateless printing means, but may transfer the dried dielectric coating film, intaglio printing, intaglio offset printing, gravure printing, gravure offset printing, rotary screen printing, etc. Any means can be used. The dielectric material used in the dielectric coating film forming means 32 is a ceramic ink, for example, a material obtained by dissolving and dissolving ceramic powder and resin in an organic solvent. You may use what disperse | distributed ceramic powder to UV hardening resin. In particular, it is preferable to use a low swelling solvent for the ceramic coating. The solvent may be aqueous.

  As the drying and curing devices 28 and 38, for example, a method of drying with hot air or a method of heating the outer peripheral surface of the coating transport roll 20 is employed. When a UV curable resin is used, it may be cured by UV irradiation. The drying and curing devices 28 and 38 are for forming the ceramic sheet S by drying or curing the ceramic slurry applied on the coating conveying roll 20.

  Next, the manufacturing method of the laminated structure of the ceramic sheet S using the multilayer electronic component manufacturing apparatus of 2nd Embodiment is demonstrated. In addition, about the effect which overlaps with the effect of the multilayer electronic component manufacturing apparatus of 1st Embodiment, description is abbreviate | omitted suitably.

  As shown in FIG. 2, the coating conveyance roll 20 that has been subjected to the mold release treatment is rotated at a predetermined speed, and the ceramic slurry is applied to the outer peripheral surface by the film forming means 22. The ceramic slurry is supplied using a cylinder-type dispenser that is the liquid supply means 26. Then, the ceramic slurry is dried and solidified on the coating conveying roll 20 using the drying and curing device 38. Here, hot air at a predetermined temperature is used for drying the ceramic slurry by the drying and curing device 38. The temperature is separately adjusted so that the outer peripheral surface of the coating transport roll 20 has an appropriate temperature. Note that these temperatures are appropriately adjusted depending on the material of the ceramic sheet S. In this way, the ceramic slurry is continuously supplied to the coating conveyance roll 20 by the film forming unit 22 and the liquid supply unit 26, and the ceramic sheet S is continuously formed on the coating conveyance roll 20.

  Next, electrode material ink is applied to the formed ceramic sheet S, and an electrode circuit (internal electrode circuit) 24 having a predetermined graphic pattern is printed. Further, a ceramic material (dielectric material) is applied from the dielectric coating film forming means 32 (for example, ink jet printing) to the step portion 34 (concave portion) generated by the electrode circuit 24 formed on the ceramic sheet S, A dielectric coating film 36 having a predetermined graphic pattern is printed.

  Here, the formation speed of the electrode circuit 24 by the electrode circuit formation means 30 and the formation speed of the dielectric coating film 36 by the dielectric coating film formation means 32 are the formation speed of the ceramic sheet S by the coating conveyance roll 20 and the first peeling. The peeling speed by the roll 16A and the second peeling roll 16B is adjusted to substantially the same speed. For this reason, while maintaining the state in which the ceramic sheet S is continuously formed, the electrode circuit 24 and the dielectric coating film 36 are formed, and the peeling operation by the first peeling roll 16A and the second peeling roll 16B is continued. be able to. That is, the process from the formation process of the ceramic sheet S to the formation process of the electrode circuit 24 and the dielectric coating film 36, the cutting process of the ceramic sheet S, and the peeling transfer process of the cut pieces ST1 and ST2 can be performed non-stop. As a result, since it is not necessary to slow down the conveyance speed of the ceramic sheet S by the coating conveyance roll 20 or to stop the conveyance of the ceramic sheet S, the production of the laminated structure of the ceramic sheets S can be speeded up. .

  The dielectric coating film 36 and the electrode circuit 24 formed on the ceramic sheet S are dried by blowing hot air from the drying and curing device 38. The order of forming the dielectric coating film 36 and the electrode circuit 24 is not particularly limited. In this manner, following the formation of the ceramic sheet S, the electrode circuit 24 and the dielectric coating film 36 are formed. For this reason, formation of the ceramic sheet S and formation of the electrode circuit 24 and the dielectric coating film 36 are continuously performed. Further, since the formation of the ceramic sheet S is continued even when the electrode circuit 24 and the dielectric coating film 36 are formed (including drying by the drying and curing device 38), the coating of the ceramic sheet S formed on the outer peripheral surface is performed. The electrode circuit 24 and the dielectric coating film 36 are formed in a state where the conveyance by the conveyance roll 20 is continued.

  Next, the ceramic sheet S on which the electrode circuit 24 and the dielectric coating film 36 are formed is cut at a predetermined portion by the cutting mechanism 14. In addition, since the cutting method of the ceramic sheet S by the cutting mechanism 14 is the same as that of 1st Embodiment, description is abbreviate | omitted. After cutting by the cutting mechanism 14, the cut pieces ST1, ST2 of the ceramic sheet S are peeled from the coating transport roll 20 one after another by the first peeling roll 16A and the second peeling roll 16B, and are laminated on the lamination stage 18. . Also in the second embodiment, the cut pieces ST1 of the ceramic sheet S by the first peeling roll 16A and the cut pieces ST2 of the ceramic sheet S by the second peeling roll 16B are alternately stacked, and the laminated structure of the ceramic sheets S Is formed.

  According to the second embodiment, when forming the ceramic sheet S, printing and laminating the electrode circuit 24 and the dielectric coating film 36 consistently, continuous forming and continuous printing are possible along with the formation of the ceramic sheet S. Therefore, it is possible to reduce the quality variation, improve the line speed, and reduce the material loss.

  In particular, the transfer of the cut pieces ST1 and ST2 of the ceramic sheet S by the first peeling roll 16A and the second peeling roll 16B is performed while the formation of the ceramic sheet S by the film forming unit 22 is continued on the coating transport roll 20. Is called. Thereby, continuous molding of the ceramic sheet S and continuous transfer of the cut pieces ST1 and ST2 of the ceramic sheet S are possible. In addition, the formation of the electrode circuit 24 by the electrode circuit forming unit 30 and the dielectric coating film by the dielectric coating film forming unit 32 while the formation of the ceramic sheet S by the film forming unit 22 is continued on the coating transport roll 20. 36 is formed. Thereby, continuous formation of the ceramic sheet S and continuous formation of the electrode circuit 24 and the dielectric coating film 36 become possible. For this reason, each process of the formation process of the ceramic sheet S, the formation process of the electrode circuit 24 and the dielectric coating film 36, the cutting process of the ceramic sheet S, and the separation and transfer processes of the cut pieces ST1 and ST2 of the ceramic sheet S are non-stop. The laminated structure of the ceramic sheet S is formed. Thereby, it becomes possible to manufacture the laminated structure of the ceramic sheet S as a series of steps in which all steps are continuous. As a result, it is possible to reduce the quality variation of the laminated structure of the ceramic sheet S and thus the electronic parts, improve the line speed, and reduce the material loss. Furthermore, the overall apparatus cost can be reduced, the apparatus size can be reduced, and the energy consumption can be further reduced.

  As shown in FIGS. 3 and 4, when the electrode circuit 24 is formed on the ceramic sheet S, a recess is formed between the electrode circuits 24, and a step 34 (recess) is generated on the ceramic sheet S. The step part 34 can be reduced by printing the dielectric coating film 36 on the part 34. Thus, by filling the stepped portion 34 between the electrode circuits with the dielectric coating film 36, it is possible to prevent stacking misalignment and adhesion failure that are likely to occur when the number of laminated ceramic sheets S increases, Moreover, the structural defect resulting from the presence of the stepped portion 34 can be suppressed. As a result, it is possible to prevent a quality defect of the manufactured electronic component.

  In particular, since the electric circuit 24 and the dielectric coating film 36 are formed on the coating conveying roll 20 at substantially the same timing, the positional accuracy of the electric circuit 24 and the dielectric coating film 36 can be increased. As a result, a highly accurate laminated structure of ceramic sheets S can be manufactured without separately installing a detection means such as a CCD camera.

  Further, since the ceramic sheet S is formed on the coating transport roll 20 which is a rigid body and transports while supporting the sheet surface by the coating transport roll 20 and the transfer roll 14 from the sheet forming to the sheet lamination process, it is thin and has low strength. Even when the ceramic sheet S is used, the ceramic sheet S can be prevented from being broken or damaged. As a result, the handling property of the thin and low strength ceramic sheet S can be enhanced. Further, since the lamination stage 18 is made of a rigid metal, even if a thin and low-strength ceramic sheet S is used in the lamination process of the cut pieces ST1 and ST2 of the ceramic sheet S, misalignment (lamination deviation). ) There is nothing to do.

  Moreover, the formation of the electrode circuit 24 and the dielectric coating film 36 can be speeded up by using a plateless printing method such as ink jet for forming the electrode circuit 24 and the dielectric coating film 36. In addition, it is possible to form the electrode circuit 24 and the dielectric coating film 36 having different electrode patterns for each layer of the ceramic sheet S. In particular, even when the distortion of the ceramic sheet S and the height of the lamination stage 18 change as the lamination of the ceramic sheet S progresses, the pattern and formation position of the electrode circuit 24 and the dielectric coating film 36 can be freely changed. Therefore, it is possible to appropriately form the pitch (interval) between the electrode circuits 24 and between the dielectric coating films 36 to form the electrode circuits 24 and the dielectric coating films 36 without positional displacement.

  In the second embodiment, the coating conveyance roll 20 corresponds to the “sheet conveyance member” of the present invention, and the lamination stage 18 corresponds to the “sheet lamination member” of the present invention. The first peeling roll 16A and the second peeling roll 16B correspond to the “sheet transfer member” of the present invention, and the cutting mechanism 14 corresponds to the “sheet cutting member” of the present invention. Further, the electrode circuit forming means 30 corresponds to the “electrode circuit forming portion” of the present invention, and the dielectric coating film forming means 32 corresponds to the “dielectric coating film forming portion” of the present invention.

  Next, a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method according to a third embodiment of the present invention will be described with reference to the drawings. In addition, while the same code | symbol is attached | subjected to the structure which overlaps with the structure of 1st Embodiment and 2nd Embodiment, description of the overlapping structure and an effect is abbreviate | omitted.

  In the third embodiment, a ceramic slurry is applied on a coating conveying roll to form a ceramic sheet, the ceramic sheet is cut by a cutting mechanism, and the cut piece is transferred to a lamination stage, and then an electrode circuit is applied to the ceramic sheet. (Internal electrode) and a dielectric coating are formed.

  As shown in FIG. 5, the electrode circuit forming means 30, the dielectric coating film forming means 32, and the drying and curing device 38 that dries the electrode circuit 24 and the dielectric coating film 36 are in the vicinity of the movement trajectory of the lamination stage 18. Has been placed.

  According to the third embodiment, the ceramic sheet S formed by applying the ceramic slurry on the coating conveying roll 20 is cut by the cutting mechanism 14. Then, the cut pieces ST1 and ST2 of the ceramic sheet S are peeled off from the coating transport roll 20 by the first peeling roll 16A and the second peeling roll 16B, and transferred onto the lamination stage 18 alternately.

  Here, the electrode circuit 24 is formed by the electrode circuit forming means 30 on the cut pieces ST1, ST2 of the ceramic sheet S transferred onto the lamination stage 18, and the dielectric coating film 36 is formed by the dielectric coating film forming means 32. It is formed. Then, the electrode circuit 24 and the dielectric coating film 36 are dried by the drying and curing device 38. In this way, each time the cut pieces ST1 and ST2 of the single ceramic sheet S are transferred to the lamination stage 18, the electrode circuit 24 and the dielectric coating film 36 are formed. Then, after the electrode circuit 24 and the dielectric coating film 36 are formed, the cut piece ST2 of the ceramic sheet S as the second layer is transferred so as to overlap the cut piece ST1 of the first layer. This is repeated to form a laminated structure of ceramic sheets S.

  In the third embodiment, the coating conveyance roll 20 corresponds to the “sheet conveyance member” of the present invention, and the lamination stage 18 corresponds to the “sheet lamination member” of the present invention. The first peeling roll 16A and the second peeling roll 16B correspond to the “sheet transfer member” of the present invention, and the cutting mechanism 14 corresponds to the “sheet cutting member” of the present invention. Further, the electrode circuit forming means 30 corresponds to the “electrode circuit forming portion” of the present invention, and the dielectric coating film forming means 32 corresponds to the “dielectric coating film forming portion” of the present invention.

DESCRIPTION OF SYMBOLS 10 Stack type electronic component manufacturing apparatus 12 Sheet conveyance roll (sheet conveyance member)
14 Cutting mechanism (sheet cutting member)
16A 1st peeling roll (sheet transfer member)
16B Second peeling roll (sheet transfer member)
18 Lamination stage (sheet lamination member)
20 Coating transport roll (sheet transport member)
22 Film forming means (film forming section)
24 Electrode circuit 30 Electrode circuit forming means (electrode circuit forming part)
32 Dielectric coating film forming means (dielectric coating film forming section)
34 Step 36 Dielectric coating S Ceramic sheet ST1 Ceramic sheet cut piece
ST2 Ceramic sheet cutting

Claims (10)

A sheet conveying member for continuously conveying the ceramic sheet in a predetermined direction;
A sheet cutting member for cutting the ceramic sheet into a predetermined length;
A sheet lamination member on which the cut pieces of the ceramic sheet cut to a predetermined length by the sheet cutting member are laminated;
A plurality of sheet transfer members for peeling the cut pieces of the ceramic sheet cut to a predetermined length by the sheet cutting member from the sheet conveying member, and transferring the cut pieces of the ceramic sheet to the sheet lamination member;
Have
One of the sheet transfer members and the other sheet transfer member are laminated by alternately transferring the cut pieces of the ceramic sheet. Having an electrode circuit forming part for forming an electrode circuit on the ceramic sheet;
2. The multilayer electronic component manufacturing according to claim 1, wherein the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit in a state where the ceramic sheet is continuously conveyed by the sheet conveying member. apparatus. Having a dielectric coating film forming portion for forming a dielectric coating film on a step portion of the ceramic sheet generated by the formation of the electrode circuit;
3. The laminate according to claim 2, wherein the dielectric coating film is formed on the stepped portion by the dielectric coating film forming unit in a state where the ceramic sheet is continuously conveyed by the sheet conveying member. Type electronic component manufacturing equipment.   4. The multilayer electronic component manufacturing apparatus according to claim 2, wherein the electrode circuit forming unit or the dielectric coating film forming unit is a plateless printing apparatus. 5. Having a film forming part for applying the ceramic slurry to the sheet conveying member to form the ceramic sheet;
5. The cut piece of the ceramic sheet is transferred by a plurality of the sheet transfer members in a state where the formation of the ceramic sheet by the film forming unit is continued. 2. The multilayer electronic component manufacturing apparatus according to item 1. A sheet conveying step of continuously conveying the ceramic sheet in a predetermined direction by the sheet conveying member;
A sheet cutting step of cutting the ceramic sheet into a predetermined length by a sheet cutting member;
A sheet transfer step in which a cut piece of the ceramic sheet cut to a predetermined length by the sheet cutting member is peeled from the sheet conveying member by a plurality of sheet transfer members and transferred to a sheet lamination member;
Have
In the sheet transfer step, one of the sheet transfer members and the other sheet transfer member are laminated by alternately transferring the cut pieces of the ceramic sheet to the sheet lamination member. Manufacturing method. An electrode circuit forming step of forming an electrode circuit on the ceramic sheet by an electrode circuit forming portion;
7. The electrode circuit forming step, wherein the electrode circuit is formed on the ceramic sheet by the electrode circuit forming unit in a state where the ceramic sheet is continuously conveyed by the sheet conveying member. The manufacturing method of the multilayer electronic component of description. A dielectric coating film forming step of forming a dielectric coating film by a dielectric coating film forming portion on a step portion of the ceramic sheet generated by the formation of the electrode circuit;
In the dielectric coating film forming step, the dielectric coating film is formed on the stepped portion by the dielectric coating film forming unit in a state in which the ceramic sheet is continuously conveyed by the sheet conveying member. A method for manufacturing a multilayer electronic component according to claim 7.   9. The plateless printing apparatus is used as the electrode circuit forming unit or the dielectric coating film forming unit in the electrode circuit forming step or the dielectric coating film forming step. A method of manufacturing a multilayer electronic component. A film forming step of forming the ceramic sheet by applying a ceramic slurry to the sheet conveying member by a film forming unit;
The transfer of the cut piece of the ceramic sheet by a plurality of the sheet transfer members is performed in a state in which the formation of the ceramic sheet by the film forming unit is continued in the film forming step. The method for manufacturing a multilayer electronic component according to any one of 7 to 9.

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