WO2014013962A1

WO2014013962A1 - Continuous pattern plating transfer system and method for manufacturing continuous pattern plating transfer material

Info

Publication number: WO2014013962A1
Application number: PCT/JP2013/069238
Authority: WO
Inventors: 重田　龍男
Original assignee: 株式会社シンク・ラボラトリー
Priority date: 2012-07-20
Filing date: 2013-07-16
Publication date: 2014-01-23
Also published as: JP6117520B2; KR101603967B1; CN104206031B; JP2014037615A; KR20140132743A; CN104206031A

Abstract

Provided are a continuous pattern plating transfer system and a method for manufacturing continuous pattern plating transfer material that carry out patterning only with plating and do not require etching. The present invention includes: a plating unit that includes at least one plating tank that accommodates a plating solution; at least one DLC pattern cylinder body that is immersed in the plating solution in the plating tank, has a pattern plating layer formed on the surface thereof, and is provided rotatably; and at least one printing base material rotating means that includes printing base material transported continuously to the surface of the DLC pattern cylinder body and a pressure transfer roller that carries out pressure transfer of the pattern plating layer from the surface of the DLC pattern cylinder body onto at least one surface of the printing base material. The pattern plating layer is continuously transferred by carrying out pressure transfer of the pattern plating layer to at least part of the printing base material by the pressure transfer roller.

Description

Continuous pattern plating transfer system and method of manufacturing continuous pattern plating transfer

The present invention relates to a plating transfer product using continuous pattern plating, in particular, a continuous pattern plating transfer system suitable for manufacturing a printed circuit board, and a method of manufacturing a continuous pattern plating transfer product using the same.

Conventionally, depending on the number of layers, printed circuit boards are largely divided into single-sided printed circuit boards in which circuits are formed only on one side of an insulating substrate, double-sided printed circuit boards in which circuits are formed on both sides, and multilayer printed circuit boards in which circuits are formed in multiple layers. Separated. Conventionally, the component elements were simple and the circuit pattern was simple, and single-sided printed circuit boards were used. Recently, however, the complexity of circuits has increased, and the demand for higher density and smaller circuits has also increased. It is common to use a circuit board or a multilayer printed circuit board. The most frequently used material for a double-sided printed circuit board is a copper clad laminate in which a thin copper plating layer is formed on both sides of an insulator (Patent Document 1).

The printed circuit board is classified into a rigid type, a flexible type, and a rigid-flexible type in which these two are mixed depending on the material of the base material. A rigid printed circuit board refers to a known fixed printed circuit board. On the other hand, the flexible printed circuit board is flexible and is used when it is necessary to attach the printed circuit board in a bent or bent state in an electronic device or the like. Further, when electrical connection is required at a portion driven like a printer head, it is also used as a kind of connector.

A rigid-flexible printed circuit board is a printed circuit board in which a rigid printed circuit board is connected by a flexible printed circuit board, and more elaborate circuits can be manufactured and electrical connection can be reduced. High reliability. Therefore, it is often used for aerospace and military equipment. Furthermore, recently, it is also used for electrical connection of a folded portion of a foldable mobile phone. Rigid-flexible printed circuit boards are manufactured by combining original plates made of different materials, so there is a difficulty in that production efficiency is low and special technologies are required. The frequency of use is increasing along with the shift to commercialization.

There are various methods for forming the designed circuit pattern on the substrate after designing the circuit pattern in the production of the printed circuit board, and any circuit pattern forming method is based on etching and plating. . That is, both of them are appropriately used to adapt to the required properties and economic conditions of various substrates (Patent Documents 2 to 4). However, when etching is performed after plating, the quality of the circuit pattern is determined by the quality of the etching, so it is necessary to perform very precise etching, and it takes time and cost to perform the etching. It was a thing. Therefore, there is a need for a circuit pattern forming method that forms a circuit pattern only by plating and does not require etching, but a printed circuit board manufacturing apparatus and method that does not require etching by patterning only by plating have been developed. There is no current situation.

JP 2002-171032 A JP 2004-214590 A JP 2004-273915 A JP 2009-158707 A International Publication WO2011 / 125926

The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a continuous pattern plating transfer system and a continuous pattern plating transfer material manufacturing method that perform patterning only by plating and do not require etching. To do.
The applicant of the present application has been conducting research and development on a method for patterning gravure plate rolls using DLC (diamond-like carbon), and by using DLC, it is possible to achieve very precise and fine patterning. Have been proposed as, for example, Japanese Patent Application No. 2011-11141 and Japanese Patent Application No. 2012-120058, but focusing on applying the patterning technology using the DLC to the production of a continuous pattern plating transfer product such as a printed circuit board, The present invention has been completed through extensive research.

In order to solve the above problems, a continuous pattern plating transfer system according to the present invention includes a plating unit including at least one plating tank containing a plating solution, and a pattern plating layer on the surface of the plating unit immersed in the plating solution. At least one DLC pattern cylinder body that is formed and rotatably provided, a printing substrate continuously conveyed to the surface of the DLC pattern cylinder body, and the DLC on at least one surface of the printing substrate At least one printing substrate rotating means including a pressure-transfer roller that pressure-transfers the pattern-plating layer from the surface of the pattern cylinder body, and the pattern-plating layer is formed on the substrate for printing by the pressure-transfer roller. The pattern plating layer is continuously transferred by applying pressure transfer to at least a part. It is characterized by comprising.

As the substrate for printing, for example, a synthetic resin film such as a polyimide film can be applied. As the metal used for the pattern plating layer, any metal that can be plated can be applied. For example, nickel, tungsten, chromium, titanium, gold, silver, platinum, iron, copper, aluminum, and the like can be applied. .

In addition, when the DLC pattern cylinder body has a diameter of about 200 mm to 1000 mm, it is preferable to rotate the DLC pattern cylinder body at a low speed of about 0.01 to 10 rpm.

Further, it is preferable that a release treatment zone for releasing the pattern plating layer by immersing the pattern plating layer in a release treatment agent is provided on the DLC pattern cylinder body. This is because the pattern plating layer is easily transferred to the substrate for printing by immersing the pattern plating layer on the DLC pattern cylinder body in a release treatment agent. As the release treatment zone, a release treatment agent unit containing a release treatment agent may be provided on the DLC pattern cylinder body. Although there is no particular limitation on the position of the mold release treatment zone, the pressure transfer position is a position where the pattern plating layer is pressure transferred to at least a part of the substrate for printing by the pressure transfer roller. It is preferable that the release processing zone is located downstream in the rotation direction of the DLC pattern cylinder body.

It is preferable that a washing / drying zone for washing and drying the pattern plating layer is provided on the DLC pattern cylinder body. This is because dirt or the like can be removed by washing and drying the pattern plating layer on the DLC pattern cylinder body. As this washing / drying zone, a washing / drying unit containing a washing device and a drying device may be provided on the DLC pattern cylinder body. A conventionally well-known apparatus can be used as a washing apparatus and a drying apparatus. Although there is no particular limitation on the position of the washing / drying zone, the DLC with respect to the pressure transfer position where the pattern plating layer is pressure transferred to at least a part of the substrate for printing by the pressure transfer roller. It is preferable that the washing / drying zone is located downstream in the rotation direction of the pattern cylinder body.

The continuous pattern plating transfer multi-system of the present invention is a continuous pattern plating transfer multi-system in which a plurality of the continuous pattern plating transfer systems are provided, and is used for printing a pattern plating layer by at least the first continuous pattern plating transfer system. It is characterized in that it is transferred to one surface of the substrate and the pattern plating layer is transferred to the other surface of the printing substrate by at least a second continuous pattern plating transfer system. With this configuration, at least one type of pattern plating layer can be transferred to one side of the printing substrate, and at least another type of pattern plating layer can be transferred to the other side of the printing substrate. Thereby, a pattern plating layer can be transcribe | transferred to the surface of the both sides of the said base material for printing.

The continuous pattern plating transfer product manufacturing method of the present invention is a continuous pattern plating transfer product manufacturing method using the above-described system of the present invention, and a step of forming a pattern plating layer on the surface of the DLC pattern cylinder body, Forming a plated transfer product by pressure-transferring the pattern plating layer onto at least a part of the substrate for printing by the pressure-transfer roller.

The continuous pattern plating transfer product of the present invention is a continuous pattern plating transfer product manufactured using the above-described system of the present invention, wherein a pattern plating layer is formed on the surface of the DLC pattern cylinder body, and the pattern plating layer Is produced by pressure-transferring at least a part of the substrate for printing by the pressure-transfer transfer roller.

Further, it is preferable that the continuous pattern plating transfer product is a printed circuit board. In the present specification, the continuous pattern plating transfer product means a product obtained by continuously plating a pattern and transferring the plating.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the continuous pattern plating transcription | transfer system and continuous pattern plating transcription | transfer manufacturing method which perform patterning only by plating and do not require etching, and save time compared with the conventional manufacturing method. In addition, it is possible to greatly reduce the cost, and it is possible to obtain a continuous pattern plating transfer product having excellent pattern accuracy.

1 is a schematic side view showing one embodiment of a continuous pattern plating transfer system of the present invention. FIG. It is typical explanatory drawing which shows the formation procedure of a continuous pattern plating transcription | transfer material, (a) is the state which accommodated the plating liquid in the recessed part of the DLC pattern cylinder body, (b) is the plating layer formed in the recessed part of the DLC pattern cylinder body And (c) shows a state in which a pattern plating layer is transferred onto the printing substrate to produce a continuous pattern plating transfer product. 1 is a schematic side view illustrating one embodiment of a continuous pattern plating transfer multi-system of the present invention. FIG. It is explanatory drawing which shows typically the manufacturing process of the DLC pattern cylinder body used for this invention, (a) is principal part sectional drawing of the state which apply | coated the photosensitive agent on the surface of a cylinder body base material, (b) is exposure * (C) is a cross-sectional view of the main part in a state where a DLC coating film is formed on the surfaces of the cylinder body substrate and the resist pattern, and (d) is a cross-sectional view of the main part It is principal part sectional drawing which shows the state which removed the DLC coating film on the surface of a resist pattern, and made the DLC pattern remain on a cylinder body base material. It is a flowchart which shows the manufacturing process of a DLC pattern cylinder body.

Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications are possible without departing from the technical idea of the present invention.

In FIG. 1, reference numeral 10A denotes a continuous pattern plating transfer system according to the present invention.

The continuous pattern plating transfer system 10A includes a plating unit 14 including at least one plating tank 12 containing a plating solution M, and a pattern plating layer MA formed on the surface of the plating unit 14 by being immersed in the plating solution M of the plating tank 12. And at least one DLC pattern cylinder body 16 that is rotatably provided, a printing substrate 18 that is continuously conveyed to the surface of the DLC pattern cylinder body 16, and at least one surface of the printing substrate 18 At least one substrate rotation means 22 for printing including a pressure transfer roller 20 for pressure transfer of the pattern plating layer MA from the surface of the DLC pattern cylinder body 16 is included. The printing substrate 18 is sent out by a delivery roller 21 and continuously conveyed, and the manufactured continuous pattern plating transfer product 25 is taken up by a take-up roller 23.

As the substrate 18 for printing, for example, a synthetic resin film such as a polyimide film can be applied. Also in the illustrated example, an example using a polyimide film is shown.

Further, when the DLC pattern cylinder body 16 has a diameter of about 200 mm to 1000 mm, it is preferable to rotate the DLC pattern cylinder body 16 at a low speed of about 0.01 to 10 rpm.

Then, the pattern plating layer MA is transferred to at least a part of the substrate 18 for printing by the pressure-transfer roller 20 so as to be continuously applied to the substrate 18 for printing as shown in FIG. The pattern plating layer is transferred.

In the example of FIG. 1, the continuous pattern plating transfer system 10 </ b> A is easy to release the pattern plating layer MA from the pattern plating layer MA from the DLC pattern cylinder body 16 by immersing the pattern plating layer MA in a release treatment agent. A release treatment zone 24 for performing a peeling treatment for the purpose is provided on the DLC pattern cylinder body 16. The release treatment zone 24 is configured such that a release treatment unit 26 containing a release treatment agent is provided on the DLC pattern cylinder body 16.

In the example of FIG. 1, the DLC pattern cylinder body 16 with respect to the pressure transfer position P that is the position where the pattern plating layer MA is pressure transferred to at least a part of the printing substrate 18 by the pressure transfer roller 20. An example in which the mold release treatment zone 24 is positioned downstream in the rotation direction is shown.

Further, in the example of FIG. 1, a washing / drying zone 28 for washing and drying the pattern plating layer MA is provided on the DLC pattern cylinder body 16. The washing / drying zone 28 is configured such that a washing / drying unit 30 including a washing device and a drying device is provided on the DLC pattern cylinder body 16.

In the example of FIG. 1, the DLC pattern cylinder body 16 with respect to the pressure transfer position P that is the position where the pattern plating layer MA is pressure transferred to at least a part of the printing substrate 18 by the pressure transfer roller 20. In this example, the washing / drying zone 28 is positioned upstream in the rotation direction. Reference numeral 52 denotes a sponge roller for preventing the mold release treatment agent from entering the plating solution M, and reference numeral 54 denotes a sponge roller for discharging the plating solution

M. Reference numerals

56 and 58 denote rollers.

A convex DLC pattern 32 formed by a method described later is provided on the surface of the DLC pattern cylinder body 16, and a surface portion other than the DLC pattern 32 is a concave portion 34 in which the plating solution M can be accommodated. The DLC pattern cylinder body 16 is rotatably provided. When the DLC pattern cylinder body 16 is immersed in the plating solution M of the plating tank 12, the plating solution M is accommodated in the concave portion 34, which is well illustrated in FIGS. Thus, the pattern plating layer MA is formed on the surface. As the metal used for the pattern plating layer MA, any metal that can be plated can be applied. For example, nickel, tungsten, chromium, titanium, gold, silver, platinum, iron, copper, aluminum or the like can be applied. it can.

As the plating unit 14, the example of FIG. 1 shows an example in which copper plating is performed using an insoluble anode. Reference numeral 36 denotes an insoluble anode for plating installed in the plating tank 12 and is connected to a plus terminal. The center of the DLC pattern cylinder body 16 is connected to the negative terminal. The DLC pattern cylinder body 16 is hollow, and the hollow center is rotatably supported by the chuck means 38. As the plating unit 14, for example, a plating unit similar to that used in the fully automatic gravure plate processing system disclosed in Patent Document 5 can be used.

Next, an embodiment of the continuous pattern plating transfer multisystem of the present invention will be described with reference to FIG.

In FIG. 3, a continuous pattern plating transfer multisystem 50 of the present invention is a continuous pattern plating transfer multisystem provided with a plurality of the above-described continuous pattern plating transfer systems. That is, in the continuous pattern plating transfer multisystem 50, the pattern plating layer MA is transferred to one surface of the printing substrate 18 by at least the first continuous pattern plating transfer system 10A, and the pattern is transferred by at least the second continuous pattern plating transfer system 10B. The plating layer MA is configured to be transferred to the other surface of the printing substrate 18.

In the example of FIG. 3, an example is shown in which two continuous pattern plating transfer systems, a continuous pattern plating transfer system 10A and a continuous pattern plating transfer system 10B, are arranged.

Since the configuration of the continuous pattern plating transfer system 10A is as described above, detailed description thereof is omitted. The continuous pattern plating transfer system 10B can have the same configuration as the continuous pattern plating transfer system 10A.

The printing substrate 18 is fed by the feeding roller 21 and continuously conveyed, and is transferred to one surface (the surface side in the illustrated example) of the printing substrate 18 by the continuous pattern plating transfer system 10A. Then, the pattern plating layer MB that is continuously conveyed to the surface of the DLC pattern cylinder body 16 of the continuous pattern plating transfer system 10B and formed on the surface of the DLC pattern cylinder body 16 is printed on the substrate for printing by the pressure-transfer roller 20. The continuous pattern plating transfer product 40 transferred to the other surface 18 (the back surface side in the illustrated example) and manufactured in this manner is wound up by a winding roller 42. Reference numeral 60 denotes a roller.

The manufacturing method of the continuous pattern plating transfer product of the present invention is a manufacturing method using the above-described system of the present invention, comprising the step of forming a pattern plating layer MA on the surface of the DLC pattern cylinder body 16, and the pattern plating. Forming a

plating transfer product

25, 40 by pressure-transferring the layer MA onto at least a part of the substrate 18 for printing by the press-transfer roller 20, and a continuous pattern plating transfer product manufacturing method. By doing so, patterning is performed only by plating and etching becomes unnecessary.

Next, a manufacturing method of the DLC pattern cylinder body used in the present invention will be described below with reference to FIGS.

First, the photosensitive material 214 is applied to the surface of the cylinder base material 212 which is the base material (step 300 in FIG. 4A and FIG. 5). As the cylinder body base 212, a hollow roll made of aluminum alloy, iron, or CFRP (fiber reinforced plastic) can be used.

Next, the cylinder base material 212 coated with the photosensitive material 214 is exposed and developed to form a resist pattern 216 (FIG. 4B and step 302 in FIG. 5). The photosensitive composition used as the photosensitive material can be either a negative type or a positive type, but it is preferable to use a negative photosensitive composition.

Next, a DLC coating film 218 is formed on the surfaces of the cylinder body base material 212 and the resist pattern 216 (FIG. 4C and step 304 in FIG. 5). The DLC coating film may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

Next, the DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form the convex DLC pattern 220 and the concave portion 222 on the surface of the substrate (steps of FIG. 4D and FIG. 5). 306). In this way, the DLC pattern cylinder body 224 can be manufactured. This manufactured DLC pattern cylinder body can be used as the DLC pattern cylinder body 16 in the present invention.

10A, 10B: Continuous pattern plating transfer system, 12: plating tank, 14: plating unit, 16,224: DLC pattern cylinder body, 18: substrate for printing, 20: pressure transfer roller, 21: delivery roller, 22: printing Substrate rotating means, 23, 42: winding roller, 24: release processing zone, 25, 40: continuous pattern plating transfer product, 26: release processing unit, 28: water washing drying zone, 30: water washing drying unit 32, 220: DLC pattern, 34, 222: recess, 36: insoluble anode for plating, 38: chuck means, 50: continuous pattern plating transfer multisystem, 52, 54: sponge roller, 56, 58, 60: roller, 212: cylinder body base material, 214: photosensitive material, 216: resist pattern, 218: coating film, : Plating solution, MA, MB: pattern plating layer, P: crimping transfer position.

Claims

A plating unit including at least one plating tank containing a plating solution;
At least one DLC pattern cylinder body that is dipped in the plating solution of the plating tank to form a pattern plating layer on the surface and is rotatably provided;
A printing substrate continuously conveyed to the surface of the DLC pattern cylinder body, and at least a pressure-transfer roller for pressure-transferring the pattern plating layer from the surface of the DLC pattern cylinder body to at least one surface of the printing substrate. One substrate rotation means for printing;
Including
A continuous pattern plating transfer system, wherein the pattern plating layer is continuously transferred by pressure-transferring the pattern plating layer onto at least a part of the printing substrate by the pressure-transfer roller.
2. The continuous pattern plating transfer according to claim 1, wherein a release treatment zone for releasing the pattern plating layer by immersing the pattern plating layer in a release treatment agent is provided on the DLC pattern cylinder body. system.
The continuous pattern plating transfer system according to claim 1 or 2, wherein a water washing and drying zone for washing and drying the pattern plating layer is provided on the DLC pattern cylinder body.
A continuous pattern plating transfer multi-system comprising a plurality of continuous pattern plating transfer systems according to any one of claims 1 to 3, wherein at least the first continuous pattern plating transfer system applies a pattern plating layer to a printing substrate. A continuous pattern plating transfer multi-system characterized in that the pattern plating layer is transferred to the other side of the substrate for printing by at least a second continuous pattern plating transfer system.
A method for producing a continuous pattern plating transfer using the system according to any one of claims 1 to 4,
Forming a pattern plating layer on the surface of the DLC pattern cylinder body;
Forming a plated transfer product by causing the pattern plating layer to be pressure-transferred to at least a part of the substrate for printing by the pressure-transfer roller, and
A method for producing a continuous pattern plating transfer product, comprising:
A continuous pattern plating transfer product manufactured using the system according to any one of claims 1 to 4, wherein a pattern plating layer is formed on a surface of the DLC pattern cylinder body, and the pattern plating layer is transferred to the pressure transfer A continuous pattern plating transfer product produced by pressure-transferring at least a part of the substrate for printing with a roller.
The continuous pattern plating transfer product according to claim 6, wherein the continuous pattern plating transfer product is a printed circuit board.