JP5111751B2 - Manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a method for manufacturing a semiconductor device in which a semiconductor chip is mounted on a circuit board having a wiring circuit on the substrate. Further, the present invention relates to a plating plate that can be suitably used for a method of manufacturing a circuit board or a semiconductor device. An example of the semiconductor device of the present invention is an electronic tag. The present invention can be applied to electronic tags such as RFIDs used for merchandise classification and physical distribution.

  In recent years, the efficiency of physical distribution management and merchandise management has progressed, and management that has been performed with bar codes and the like has been performed with an electronic tag made up of a circuit board called RFID and a semiconductor chip. Electronic tags can be roughly classified into contact and non-contact methods according to the information transmission method. In the contact method, information is transmitted and received by contacting an external terminal of the electronic tag and a terminal of the external processing device. In the non-contact method, information is transmitted and received via a coiled wiring circuit (hereinafter also referred to as an antenna in an electronic tag). In particular, in recent years, management methods using wireless non-contact electronic tags have been actively performed. In the non-contact method, a method has been developed in which driving power of a semiconductor chip is provided by electromagnetic induction.

  In general, a non-contact type electronic tag has been developed having a wiring circuit and a semiconductor chip on a substrate. The wiring circuit functions as an antenna. As a wiring circuit, a method of attaching a metal wire wound in a coil shape on a substrate is known. However, this method relies heavily on mechanical accuracy, and is not suitable for manufacturing an electronic tag that requires a highly accurate antenna. Further, a metal foil is pasted on a substrate, and this metal foil is patterned by etching (Patent Documents 1 and 2). A method of forming a wiring circuit for an electronic tag by printing a metal paste on a substrate has also been developed.

  In addition, in order to avoid a complicated manufacturing process and an increase in manufacturing cost due to mounting a semiconductor chip on a substrate, an electronic tag having a coil-on-chip module structure in which a wiring circuit is directly formed on the semiconductor chip is known. (Patent Documents 1 and 3).

By the way, generally, an electronic tag is premised on disposable, and a reduction in manufacturing cost is desired. However, the above-described printing method using a metal paste is not suitable for manufacturing an electronic tag that requires a reduction in manufacturing cost because the metal paste is expensive and a large amount of ink is wasted during printing.
Further, in the method of forming a metal foil described in the above-mentioned patent document by etching, several kinds of processes are necessary before and after plating, which is a so-called dry (no solution) process and wet (a solution is used). It is a different process and type. In general, since different types of processes cannot be processed continuously, the production of an electronic tag by this method takes production time and increases the cost.
In particular, in the case of an electronic tag having a coil-on-chip module structure, a wet process is applied to a semiconductor chip, so that accuracy and processability are further deteriorated.
In manufacturing an antenna as in the above-mentioned patent document, a circuit board pattern is directly formed on a substrate by a photolithography method every time an electronic tag is manufactured, and plating is applied to that portion. In this method, since it is necessary to apply the photolithography method every time a pattern is formed on the substrate, a large amount of photoresist, developer, and the like are wasted, and there is a problem that it takes time in the process.
Furthermore, in the production of circuit boards by plating, antenna patterns are formed directly on individual substrates, and plating is applied to those parts, but this requires time and cost for the formation of individual patterns. There was a problem that took. Further, a method of forming a plurality of patterns by batch processing using a panel substrate is known, but this method also has poor productivity, and it has been difficult to reduce time and cost by mass production.
JP 2002-92566 A JP 2005-711144 A JP 2000-137779 A

The present invention has been made to solve the above-described problems, and the object of the present invention is to form a pattern of a wiring circuit included in a semiconductor device in the manufacture of a semiconductor device such as an electronic tag. Another object of the present invention is to provide a method of manufacturing a semiconductor device that is low in environmental load and economical.
More specifically, in the manufacture of semiconductor devices, in addition to the merit of the plating method that patterns can be selectively formed on necessary portions, the material cost and The object is to greatly reduce the processing cost.

  By the way, according to the study by the present inventors, a resist pattern corresponding to a desired wiring circuit is formed on a plating plate, and a metal material is plated by electrolytic plating in an opening portion of the resist pattern on the plating plate. It has been found that a semiconductor device provided with a wiring circuit can be manufactured by transferring the plated portion to another substrate. Further, the plating plate is processed into a cylindrical shape, or the plating plate is held on a cylindrical drum, and while rotating the cylinder, the plating is deposited on the curved surface of the outer periphery of the cylinder to form a wiring circuit, and this is the substrate. It was found that a semiconductor device provided with a wiring circuit can be continuously produced by transferring to the above. The present invention has been made based on such knowledge, can be a highly productive process, and can realize the manufacture of an antenna at a low cost.

According to the present invention, the number of times of photolithography performed for forming a wiring circuit pattern can be reduced. For this reason, resources such as photoresist and developer generated by the photolithography process can be saved, and at the same time, the production time of the circuit board can be shortened.
In forming a wiring circuit pattern included in a circuit board, a highly accurate, short time, low environmental load and economical method for manufacturing a circuit board could be provided.
In manufacturing an electronic tag having a chip-on-module structure, a pattern is formed by a photolithography method, and an electronic tag having high processability and accuracy can be provided.
Furthermore, according to the present invention, in addition to the merit of the plating method that a pattern can be selectively formed in a necessary portion, a method for manufacturing a semiconductor device is provided that simplifies the front and rear processes and provides a continuous process. I was able to.

A method of manufacturing a semiconductor device according to the present invention will be described below based on the embodiment.
The semiconductor device manufacturing method of the present invention is roughly divided into three steps. That is,
(1) forming a resist pattern on the plating plate;
(2) A step of forming a wiring circuit by depositing plating on the opening of the resist pattern,
(3) a step of transferring the wiring circuit onto another substrate;
It is.
(1) In the step of forming a resist pattern on the plating plate, for example, the resist pattern can be formed on a cylindrical or long plating plate. The resist pattern can be formed by subjecting a resist material to photolithography, laser processing, printing, router processing, and other mechanical etching.
<Plating plate>
The plating plate is a medium on which a wiring circuit transferred to a substrate is formed. As the material of the plating plate, for example, stainless steel, copper, titanium, aluminum, nickel, and alloys thereof can be used. Moreover, what coated the metal by sputtering, vapor deposition, plating, etc. on the surface of what made these plate-shaped can be used. However, the surface of the plating plate needs to be inert to the wiring circuit formed by plating. This is because if the plating plate and the wiring circuit are in close contact, the wiring circuit cannot be transferred to another substrate. For this reason, it is preferable to select the material and surface state of the plating plate to make the surface as smooth as possible. For example, a plate obtained by mirror polishing a stainless steel plate is suitable.
<Resist pattern>
As this resist material, it is desirable to use an insulator in order to prevent deposition of a metal material due to electrolytic plating. For example, fluorine resin composition, acrylic resin composition, polyethylene resin composition, epoxy resin composition, urethane resin composition, other dry films, polymer sheets, organic materials such as ink, and inorganic materials such as metal oxide powder Can be used.
The resist pattern forming method is selected depending on the type of plating resist and the pattern density. When the resist pattern is formed by laser processing, it can be performed by an excimer laser, a carbon dioxide gas laser, a YAG laser, or a UV-YAG laser.
When the resist pattern is formed by the photo method, it is suitable for forming a fine high-definition pattern (a pattern pitch <200 μm as a guide). With a general pattern (standard pattern pitch> 200 μm), the cost can be reduced by performing pattern formation by a method such as screen printing.

(2) The step of depositing plating on the opening of the resist pattern to form a wiring circuit is formed by plating a metal material on the opening of the resist pattern. Electrolytic plating can be suitably used for forming the metal layer, but electroless plating can also be used. When a circuit board is used as an antenna for an electronic tag, the electrical conductivity and film thickness of the wiring circuit are considered at the design stage of the wiring circuit. If the film thickness of the wiring circuit is about the same as or slightly larger than that of the resist pattern, the transfer circuit is efficient in the subsequent process. Further, it is preferable that the surface of the wiring circuit is roughened and then processed so as to be easily transferred.
As the metal material, copper, nickel, iron, chromium, manganese, titanium, cobalt, zinc, tin, lead, other noble metals, and alloys thereof are suitable. Properties such as electrical conductivity, hardness, ductility, and surface roughness of metallic materials affect wiring circuit characteristics, antenna characteristics when used as an electronic tag, and operability (easily transferable) in subsequent transfer processes. To do. Therefore, these characteristics can be selected in the plating process by selecting the composition of the plating solution (metal salt type, concentration, pH, additives, etc.) and setting the plating conditions (current density, deposition rate, solution temperature, solution flow). It is preferable to optimize by studying.
Further, when a paramagnetic material such as nickel or iron is used, it can be assisted by magnetic force when the wiring circuit is transferred to the substrate.
As an example of this step, a cylindrical plate can be used, or a long plate can be held on a cylindrical drum. In any case, the pre-process, the plating process, the post-process, and the transfer process to the substrate are sequentially performed on the resist pattern and the wiring circuit on the curved surface of the cylinder while rotating the cylinder.

(3) The step of transferring the wiring circuit onto another substrate is a step of transferring the wiring circuit onto the substrate after the wiring circuit plated on the plating plate and the other substrate (hereinafter also simply referred to as a substrate) are brought into close contact with each other. It is. Since the wiring circuit is held on the plating plate by plating, a force is applied to separate the wiring circuit and transfer it to the substrate. For example, there is a method in which an adhesive layer is formed in advance on the substrate and an adhesive force is generated when the substrate and the wiring circuit are brought into close contact with each other.
As another substrate, a long sheet such as a glass substrate, an insulating substrate, a metal plate, a panel like a semiconductor chip, a plastic film, a metal foil, or a composite film of these can be used. When a long sheet is used, there is an advantage that the wiring circuit can be plated and transferred by roll-to-roll and the production efficiency is good.
Also, in order to enhance the transfer efficiency, by placing magnets on the surface of the other substrate opposite to the surface facing the plating plate, the attractive force that draws the wiring circuit toward the other substrate works to assist the transfer. be able to. At this time, the metal material forming the wiring circuit is preferably a paramagnetic material.
In the method of manufacturing a semiconductor device according to the present invention, an optimum method is selected from the above-described plurality of methods, and the process is performed as a series of steps arbitrarily combining (1) to (3). Can do. However, it is not limited to the process mentioned above.

Hereinafter, the manufacturing method of the semiconductor device of the present invention will be described by taking the manufacture of an electronic tag as an example.
First, in the first example shown in FIG. 1, plating is performed on a cylindrical plating plate on which a resist pattern 14 is formed. Subsequently, the wiring circuit 13 is transferred onto the substrate. A series of steps are repeatedly and continuously performed by the rotation of the cylinder of the cylindrical plating plate (see FIG. 1). Here, the wiring circuit 13 deposited on the cylindrical plating plate is transferred onto the substrate sheet by bringing the continuously supplied long substrate sheet into close contact with the plating plate and peeling it off. This state is shown in FIG. On the curved surface of the cylindrical plating plate, a resist pattern as shown in FIG. 5 is previously formed on the entire circumference.
A cylindrical plating plate 1 in FIG. 1 rotates around an axis 2. While rotating, the pre-process, the plating process, the post-process, and the transfer process to the substrate are sequentially performed on the resist pattern 14 on the curved surface. The elementary steps are pretreatment (washing of the plating deposit surface), washing with water, plating, washing with water, drying and transfer, and a series of steps are repeated again.
An insulating coating process is applied to the flat portion of the cylindrical plating plate 1. Pretreatment and water washing are performed by ejecting liquid from the nozzle 8 to the curved surface portion 5 of the cylindrical plating plate. In order to prevent the liquid after ejection from falling downward, it may be received by a squeeze roll or tray and flow out of the system. Plating is performed by passing a current between the anode 3 and the portion where the cylindrical plating plate 1 is immersed in the plating solution 4. The cathode contact is suitably provided for the rotating shaft 2. After plating, washing and drying, the substrate 6 is sandwiched between the rolls 7 and brought into close contact with each other, whereby the wiring circuit formed by plating is transferred onto the substrate. This part is shown in detail in FIG. By applying the adhesive 12 on the substrate 6 and further providing the roll 7 with a heating mechanism, the transfer efficiency is increased. A series of steps are completed by transfer, but if there is something left without being transferred, it will become defective when it is put back in again, so the process of removing the residue by inspecting the presence or absence of the residue after transfer Is preferably introduced.

Next, a second embodiment is shown in FIG. FIG. 2 shows a batch method in which plating on a cylindrical plating plate on which a resist pattern portion is formed is performed while rotating in a liquid. A wiring circuit is formed in the plating solution and transferred to a substrate sheet as a substrate in a separate process after plating. The transfer state (FIG. 4) and the formation state of the pattern on the curved surface of the cylindrical plating plate (FIG. 5) are the same as the method described in the first example.
In FIG. 2, the cylindrical plating plate 1 is pre-treated in a separate tank and then introduced into the plating solution 4 and rotates around the shaft 2. In the liquid, the anode 3 opposes and an electric current is passed, so that plating is deposited on the pattern portion of the plating plate 1 serving as the cathode. The electrical contact to the plating plate is suitably taken from the shaft 2. After plating is performed under appropriate conditions and time, the plating plate 1 is taken out from the solution, washed with water in a separate tank, dried, and then transferred. Here, the wiring circuit formed by plating is transferred onto the substrate by sandwiching the substrate 6 between the rolls 7 and closely contacting it. The transfer mechanism and method are substantially the same as those in the first example. By applying the adhesive 12 on the substrate 6 and further providing the roll 7 with a heating mechanism, the transfer efficiency is increased. The plating mold 1 is then inspected, corrected for defects, and then re-introduced.

Next, a third embodiment is shown in FIG. In this example, a long metal sheet is used as a plating plate, and plating is deposited on a resist pattern portion formed on the surface of the metal sheet, which is transferred onto another substrate. . A wiring circuit is plated on the resist pattern opening of the long sheet-like metal plating plate. A long metal plating plate and a wiring circuit are held on the curved surface of a cylindrical drum and introduced into the plating solution. Subsequently, the long substrate sheet is brought into close contact with the wiring circuit deposited on the long metal sheet through a roll or the like, and then peeled off. Then, the wiring circuit formed on the long metal sheet is continuously transferred to the long base sheet.
A long metal sheet 10 is continuously conveyed from the right to the left in the figure, and in the middle of the process, elementary steps of pretreatment, water washing, plating, water washing, drying and transfer are sequentially performed. A wiring circuit as shown in FIG. 5 is formed on one surface of the long metal sheet 10, and the opposite surface is insulated. For pre-treatment and washing with water, a system in which the liquid is ejected from the nozzle 8 onto a metal sheet pattern, received in a storage tank, and reused is appropriate. The long metal sheet is held by the transporting roll 11, and is further held on the curved surface of the plating cylindrical drum 9 and passes through the plating tank 4. The plating cylindrical drum 9 rotates about the shaft 2. In the meantime, plating is deposited in the openings of the resist pattern 14 on the metal sheet by flowing current against the anode 3. Power supply to the metal sheet may be performed by providing a contact point on the holding roll 11 outside the plating solution. The cylindrical drum 9 for plating does not need to be a conductor, and a resin-made one or a metal-coated one can be used. Thereafter, the long metal sheet 10 passes through the holding roll 11 and is then washed with water and dried to proceed to the transfer process. Details of the transfer portion are shown in FIG. The wiring circuit formed by plating is transferred onto the substrate by sandwiching the substrate 6 and the plated metal sheet 10 between the two rolls 7 and bringing them into close contact with each other. By applying the adhesive 12 on the substrate 6 and further providing the roll 7 with a heating mechanism, the transfer efficiency is increased. The long metal sheet 10 after the wiring circuit is transferred is reused.

In the above example, the form of operation is different, but the series of elementary steps is the same. The first pretreatment is a step of cleaning the wiring circuit on which plating is deposited. The chemical used depends on the level of dirt, but if it is light, it may be a diluted acid. If there is organic dirt, a degreasing agent containing a surfactant is used.
The antenna pattern formed by plating is transferred onto the substrate. However, since the substrate 6 serves as a base material for use as an electronic tag, the material and properties are selected depending on the application. In the case of a resin sheet, the plating is transferred in a semi-cured state and then cured. When an insulating base material such as paper or a general-purpose polymer sheet is used, the adhesive 12 is bonded in advance, and then plating is transferred.

  In addition, the plating plate having the resist pattern described above is formed by plating a metal antenna, other circuit board, semiconductor device, or the like used for an electronic tag used by mounting a semiconductor and transmitting and receiving radio waves by radio. Etc. The plate for plating includes a metal plate and an insulating layer on the metal layer. When the insulating layer has a shape corresponding to an arbitrary pattern such as a wiring circuit, the plating plate of the present invention can be obtained. Furthermore, the plating plate of the present invention includes a dummy pattern different from an arbitrary pattern. By providing the dummy pattern, the current distribution on the surface of the metal plate is made uniform, and the shape of the wiring circuit to be plated is stabilized. Moreover, the shape of this plate for plating can be made into a cylindrical (cylinder) shape or a long sheet shape. The cylindrical plating plate can be used in the methods shown in the first and second examples, and the long sheet-shaped plating plate can be used in the third method. .

The antenna pattern part is formed on the cylindrical plating plate, and the plated antenna is continuously transferred onto the substrate, and these steps are repeated by rotating the cylindrical plating plate. A manufacturing method is shown. A method of manufacturing an antenna, which is batch-type and performs plating on a cylindrical plating plate on which an antenna pattern portion is formed while rotating in a liquid, and transfers the antenna to a substrate sheet in a separate process after plating is shown. An antenna manufacturing method in which plating is deposited on an antenna pattern portion formed on the surface of a long metal sheet plate and transferred onto another substrate will be described. The transfer of the antenna from the cylindrical plating plate to the substrate sheet is shown. An antenna pattern formed by multiple imposition on a plating plate is shown. Shows antenna transfer from long metal sheet plate to substrate sheet

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Cylindrical plating plate 2 ... Shaft 3 ... Anode 4 ... Plating solution 5 ... Curved surface part 6 of cylindrical plating plate ... Substrate sheet 7 ... Roll 8 ... · Nozzle 9 · · · cylindrical drum 10 for plating · · · long metal sheet 11 · · · roll 12 · · · adhesive 13 · · · wiring circuit 14 · · · resist pattern

Claims (3)

In a method for manufacturing a semiconductor device mounted with a semiconductor and provided with a wiring circuit,
(A) forming a resist pattern on the curved surface of the cylindrical plating plate;
(B) depositing plating on the opening of the resist pattern to form a wiring circuit;
(C) transferring the wiring circuit onto another substrate,
(B) depositing plating on the opening of the resist pattern to form a wiring circuit;
(B-1) The cylindrical plating plate is rotated in the plating solution to perform plating , and before the step (c) of transferring the wiring circuit onto another substrate, the plate is installed separately from the plating. The manufacturing method of the semiconductor device characterized by including the process to transfer to. After the wiring circuit is formed by plating , the plating plate is transferred to another substrate,
It consists of a metal plate and an insulating layer provided on the metal plate,
Further, the insulating layer is processed into a pattern corresponding to the wiring circuit,
2. The method for manufacturing a semiconductor device according to claim 1, wherein a plating plate including a portion processed into a dummy pattern for uniformizing current distribution is used at an outer edge portion of a pattern corresponding to the wiring circuit. 3. The method of manufacturing a semiconductor device according to claim 1, wherein a plating plate containing any one of stainless steel, titanium, copper, copper alloy, nickel, and aluminum as a main raw material is used.