WO2013057772A1 - Method for producing perforated metal foil - Google Patents

Method for producing perforated metal foil Download PDF

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Publication number
WO2013057772A1
WO2013057772A1 PCT/JP2011/073744 JP2011073744W WO2013057772A1 WO 2013057772 A1 WO2013057772 A1 WO 2013057772A1 JP 2011073744 W JP2011073744 W JP 2011073744W WO 2013057772 A1 WO2013057772 A1 WO 2013057772A1
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WO
WIPO (PCT)
Prior art keywords
metal foil
insulating layer
perforated metal
base material
conductive substrate
Prior art date
Application number
PCT/JP2011/073744
Other languages
French (fr)
Japanese (ja)
Inventor
和彦 河東
慎一 羽生
加藤　聡一郎
Original Assignee
株式会社 ベアック
旭技研株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 株式会社 ベアック, 旭技研株式会社 filed Critical 株式会社 ベアック
Priority to PCT/JP2011/073744 priority Critical patent/WO2013057772A1/en
Priority to PCT/JP2012/076864 priority patent/WO2013058289A1/en
Publication of WO2013057772A1 publication Critical patent/WO2013057772A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C25D7/0678—Selective plating using masks

Definitions

  • the present invention relates to a method for producing a perforated metal foil.
  • FIG. 17 is a view for explaining a conventional method of manufacturing a perforated metal foil.
  • An electroforming system 900 used in a conventional method for manufacturing a perforated metal foil includes a plating tank 920, a cathode drum 930, and a winding roll 940 as shown in FIG.
  • the plating tank 920 contains a plating solution 921 and an anode 922.
  • the peripheral surface of the cathode drum 930 is partially masked by applying a resist 931.
  • the lower half 930a of the cathode drum is immersed in the plating solution 921.
  • the metal contained in the plating solution 921 is masked by the resist 931.
  • the metal foil 910 is formed by electrodeposition on the peripheral surface of the cathode drum 930 excluding the formed portion.
  • the formed metal foil 910 is peeled off from the peripheral surface of the cathode drum 930 and taken up by a take-up roll 940. In this case, even if the metal foil 910 is peeled off from the peripheral surface of the cathode drum 930, the resist 931 is held on the peripheral surface of the cathode drum 930. Can be used.
  • the resist 931 is formed using the resist 931 because the pattern shape and pattern dimensions of the resist 931 gradually deteriorate as the resist 931 is repeatedly used.
  • the hole shape and hole size of the metal foil gradually deteriorated, and as a result, the quality of the perforated metal foil was lowered.
  • the present invention has been made in order to solve the above-described problems, and is a perforated metal foil capable of stably producing a high-quality perforated metal foil without deterioration of the hole shape and hole size in the manufacturing process.
  • An object is to provide a manufacturing method.
  • a perforated metal foil having a large number of holes is produced by electrodepositing a metal foil on a predetermined first region on one surface of a conductive substrate.
  • a conductive group for preparing a perforated metal foil comprising a conductive base material having a structure in which an insulating layer is formed in a second region other than the first region on one surface of the conductive base material
  • an insulating layer removing step of removing the insulating layer after the metal foil forming step is
  • a conductive base material having a structure in which an insulating layer is formed in a second region for forming a hole is prepared, and the metal foil is formed on the conductive base material. Therefore, the hole shape and the hole size are not deteriorated in the manufacturing process, and a high-quality perforated metal foil can be stably manufactured.
  • the metal foil may be formed of any metal or alloy as long as it can be electrodeposited.
  • the metal foil may be formed of copper, aluminum, gold, silver, other metals, various alloys, or the like.
  • This perforated metal foil is a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial filter, etc.), printing screen, electromagnetic wave shielding sheet, carrier for catalyst for promoting chemical reaction, It can be used for a wide variety of other purposes.
  • the conductive base material a conductive base material made of metal or alloy can be used. It is also possible to use a nonconductive substrate having a conductive member disposed on the surface thereof.
  • the insulating layer removing step is performed before the metal foil peeling step, and in the insulating layer removing step, the metal foil is peeled off before the metal foil is peeled off. It is preferable to remove the insulating layer from the conductive substrate.
  • perforated metal foil can be produced by peeling the metal foil from the conductive base material from which the insulating layer has been removed in the insulating layer removing step.
  • the metal foil peeling step the metal foil is peeled from the conductive base material from which the insulating layer has been removed. Therefore, both the metal foil and the insulating layer are taken from the conductive base material from which the insulating layer has not been removed.
  • the metal foil can be peeled with a small force. For this reason, since it becomes difficult for a metal foil to deform
  • the insulating layer removing step is performed after the metal foil peeling step, and the insulating layer removing step is performed after peeling from the conductive substrate. It is preferable to remove the insulating layer from the metal foil.
  • the perforated metal foil can be produced also by removing the insulating layer from the metal foil after being peeled from the conductive base material in the metal foil peeling step.
  • the insulating layer removing step includes a first insulating layer removing step of removing the insulating layer before the metal foil peeling step, and the metal foil peeling step.
  • the insulating layer is removed from the conductive base material by the first insulating layer removing step, the metal foil is peeled from the conductive base material by the metal foil peeling step, and insulated from the metal foil by the second insulating layer removing step. It is also possible to produce perforated metal foil by removing the layer. In this case, even if the insulating layer remains on the metal foil after the first insulating layer removing step, the remaining insulating layer can be reliably removed during the second insulating layer removing step. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil from which the insulating layer is more completely removed.
  • the insulating layer removing liquid may be a solution capable of removing the insulating layer by contracting or expanding the insulating layer, or a solution capable of dissolving and removing the insulating layer.
  • the conductive base material preparing step includes the step of forming the first region or the second region on a photosensitive layer formed on one surface of the conductive base material. It is preferable to include an insulating layer forming step of irradiating light through a pattern mask having an opaque pattern in any region and removing either the photosensitive portion or the non-photosensitive portion due to the irradiation to form the insulating layer. .
  • the second region on one surface of the conductive base material is printed to form the insulating layer. It is preferable to include an insulating layer forming step.
  • an insulating layer is hardened
  • printing screen printing, inkjet printing, roll coater printing, or the like can be used.
  • the conductive base material preparing step is a pretreatment for one surface of the conductive base material before the insulating layer forming step. It is preferable to further include a pretreatment step to be applied.
  • the pretreatment includes, for example, a treatment for removing the oxide film from the conductive base material, and water washing, drying, or peeling promotion film formation on the conductive base material.
  • a treatment for removing the oxide film from the conductive base material is performed as the pretreatment, it is possible to easily form an insulating layer and to easily form a metal foil by electrodeposition.
  • the conductive substrate is washed with water as the pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate.
  • drying is performed as a pretreatment, an effect that the state of the surface of the conductive substrate can be made uniform can be obtained.
  • a peeling promoting film is formed on the surface of the conductive substrate as a pretreatment, the electrodeposited metal foil can be easily peeled with a small force.
  • the conductive base material is a long sheet-like conductive base material, and the conductive base material is fed out from a feeding roll and wound with a winding roll. It is preferable to manufacture the perforated metal foil while transporting the conductive base material with a roll-to-roll (RTR) apparatus.
  • RTR roll-to-roll
  • the conductive base material is composed of an endless belt-like conductive base material, and the conductive base material is continuously formed by a roll device including a plurality of rolls.
  • the perforated metal foil is preferably produced while being conveyed.
  • a metal foil post-treatment step of performing a post-treatment on the metal foil peeled from the conductive substrate is further performed. It is preferable to include.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a subsequent process, it is possible to obtain an effect that the surface state of the perforated metal foil can be made uniform.
  • the method for producing a perforated metal foil of the present invention further includes a metal foil post-processing step of performing post-processing on the metal foil from which the insulating layer has been removed after the insulating layer removing step. Is preferred.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained.
  • a rust preventive film forming step is performed as a subsequent step, it is possible to prevent rust from being generated on the perforated metal foil.
  • a metal foil post-treatment step of performing a post-treatment on the metal foil from which the insulating layer has been removed is further provided after the second insulating layer removing step. It is preferable to include.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained.
  • a rust preventive film forming process is performed as a post process, it is possible to prevent rust from being generated on the metal foil.
  • FIG. 3 is a flowchart shown for explaining a method of manufacturing the perforated metal foil according to the first embodiment. It is a figure which shows the manufacturing apparatus 100 of the perforated metal foil in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 in which the insulating layer 14 was formed by the insulating layer forming apparatus 130 in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 in which the metal foil 16 was formed by electrodeposition by the metal foil formation apparatus 140 in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 1.
  • FIG. 6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 2. It is a figure which shows the manufacturing apparatus 100a of the perforated metal foil in Embodiment 2. FIG. It is a figure which shows the perforated metal foil 10a peeled from the electroconductive base material 12a by the metal foil peeling apparatus 180 in Embodiment 2. It is a figure which shows the perforated metal foil 10a from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 2.
  • FIG. 6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 3. It is a figure which shows the manufacturing apparatus 100b of the perforated metal foil in Embodiment 3. It is a figure which shows the manufacturing apparatus 100c of the perforated metal foil in Embodiment 4.
  • FIG. 6 is a view for explaining a method for manufacturing a perforated metal foil according to Modifications 1 to 3. It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 4. It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 5. FIG. It is a figure shown in order to demonstrate the manufacturing method of the conventional perforated metal foil.
  • FIG. 1 is a flowchart shown for explaining a manufacturing method of a perforated metal foil according to the first embodiment.
  • FIG. 2 is a diagram illustrating a perforated metal foil manufacturing apparatus 100 according to the first embodiment. 2, the conductive substrate 12 at the right end of the upper diagram of FIG. 2 is illustrated so as to be connected to the conductive substrate 12 illustrated at the left end of the lower diagram of FIG.
  • FIG. 3 is a diagram illustrating the conductive substrate 12 on which the insulating layer 14 is formed by the insulating layer forming apparatus 130 in the first embodiment.
  • 3A is a plan view of the conductive substrate 12, and FIG.
  • FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A.
  • FIG. 4 is a diagram illustrating the conductive base material 12 in which the metal foil 16 is formed by electrodeposition using the metal foil forming apparatus 140 according to the first embodiment.
  • 4A is a plan view of the conductive substrate 12, and
  • FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A.
  • FIG. 5 is a diagram illustrating the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 according to the first embodiment.
  • FIG. 5A is a plan view of the conductive substrate 12, and
  • FIG. 5B is a cross-sectional view taken along line AA of FIG. 5A.
  • FIG. 6 is a view showing the perforated metal foil 10 peeled from the conductive base material 12 by the metal foil peeling device 180 according to the first embodiment.
  • 6A is a plan view of the perforated metal foil 10
  • FIG. 6B is a cross-sectional view taken along the line AA in FIG. 6A.
  • a number of methods for producing a perforated metal foil in Embodiment 1 can be obtained by electrodepositing the metal foil 16 on a predetermined first region (region where the insulating layer 14 is not formed) on one surface of the conductive substrate 12.
  • 1 is a method for producing a perforated metal foil 10 having a plurality of perforations, as shown in FIG. 1, as shown in FIG. 1, “conductive substrate preparation step S10”, “metal foil forming step S20”, “insulation”
  • Each process of "layer removal process S30", “metal foil peeling process S40", and “metal foil post-processing process S50" is included.
  • the conductive base material 12 is made of a long sheet-like conductive base material, and the conductive base material 12 is fed from the feeding roll 110 and wound by the winding roll 210.
  • the perforated metal foil 10 is manufactured while the conductive substrate 12 is conveyed by a roll-to-roll (RTR) apparatus. Therefore, each of "conductive base material preparation process S10", “metal foil formation process S20", “insulating layer removal process S30”, and “metal foil peeling process S40" with respect to the conductive base material 12 conveyed.
  • the steps are sequentially performed, and the “metal foil post-processing step S50” is performed on the perforated metal foil 10 peeled from the conductive substrate 12 in the “metal foil peeling step S40”.
  • the “conductive base material preparation process S10”, “metal foil formation process S20”, “insulating layer removal process S30”, “metal foil peeling process S40”, and “metal foil post-processing process S50” will be described in detail. explain.
  • Conductive substrate preparation step S10 In the conductive base material preparation step S10, an insulating layer is formed in a second region (region corresponding to the position of the hole 18) other than the first region (region where the metal foil 16 is electrodeposited) on one surface of the conductive base material 12.
  • a conductive substrate 12 having a structure in which 14 is formed is prepared.
  • the conductive base material preparation step S10 includes “conductive base material pretreatment step S11” and “insulating layer forming step S12”.
  • the conductive base material pretreatment step S ⁇ b> 11 is a step of performing a pretreatment on one surface of the conductive base material 12 conveyed from the feeding roll 110.
  • the conductive base material pretreatment step S11 includes an oxide film removing step, a water washing step, a drying step, and a peeling promotion film forming step.
  • the conductive substrate pretreatment step S11 is performed by the pretreatment device 120, and the pretreatment device 120 includes an etching solution nozzle 121, a water washing nozzle 122, an air nozzle 123, and a peeling accelerator nozzle 124.
  • the oxide film removing step is a step of removing the oxide film from the surface of the conductive substrate 12 carried by the etching solution nozzle 121 and transported.
  • the water washing step is a step of spraying washing water onto the surface of the conductive substrate 12 that is carried out by the water washing nozzle 122 and conveyed.
  • the drying step is a step that is performed by the air nozzle 123 and blows hot air to the conveyed conductive substrate 12 to remove water droplets and the like by washing with water, and uniformizes the surface state of the conductive substrate 14.
  • the peeling promotion film forming step is a step of forming a peeling promotion film by ejecting a peeling accelerator from the peeling accelerator nozzle 124.
  • the conductive base material 12 is a long sheet-like base material made of a flexible metal thin plate made of a metal such as stainless steel, other steel, brass, copper, or an alloy, and rust prevention treatment such as corrosion-resistant metal plating on one surface.
  • the other surface (back surface) and both side surfaces are coated with a non-conductive film.
  • Insulating layer formation process S12 is a process of forming insulating layer 14 in the 2nd field in one side of conductive substrate 12 conveyed, as shown in FIG.
  • the insulating layer forming step S12 is performed by the insulating layer forming apparatus 130 as shown in FIG.
  • the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region, and the non-photosensitive portion due to the irradiation is removed.
  • the insulating layer 14 is formed.
  • a photosensitive layer (photosensitive film) is pasted on the surface of the conductive substrate 12, and a pattern mask having an opaque pattern only in a region corresponding to the first region is photosensitive.
  • the insulating layer 14 is formed by disposing it above the film, exposing it from above the pattern mask, and removing the unexposed portion with an etching solution.
  • the photosensitive film preferably has a three-layer structure in which a cover sheet is detachably attached to the front side and the back side with a photosensitive layer in between. In this case, first, the cover sheet on the back side of the photosensitive film is peeled off, and the photosensitive film is attached to the surface of the conductive substrate 12. Next, the cover sheet on the front side is peeled off, and the pattern mask is disposed and pasted above the photosensitive film.
  • Metal foil formation process S20 is a process of forming the metal foil 16 in the 1st area
  • Metal foil formation process S30 is implemented by the metal foil formation apparatus 140 and the water washing and drying apparatus 150, as shown to Fig.2 (a).
  • the metal foil forming apparatus 140 is a so-called electroplating apparatus, and includes a plating tank 141, an anode plate 143, and a DC power supply device (not shown).
  • a plating solution 142 is stored in the plating tank 141.
  • the positive electrode of the DC power supply device is connected to the anode plate 143, and the negative electrode is connected to the conductive substrate 12.
  • the DC power supply device supplies a DC current between the anode plate 143 and the conductive substrate 12.
  • FIG. 2A the conveyed conductive substrate 12 is immersed in a plating solution 142 in the plating tank 141 by a roll 220, and as shown in FIG.
  • a metal foil 16 is formed by electrodeposition in the first region that is not formed.
  • the metal foil 16 is formed thinner than the insulating layer 14. This is because the holes 18 formed in the perforated metal foil 10 are formed vertically in a state of penetrating the front and back surfaces of the perforated metal foil 10.
  • any metal or alloy can be used as long as it can be electrodeposited.
  • copper, aluminum, gold, silver or other metals or various alloys can be used.
  • the plating solution 142 a solution corresponding to the metal of the metal foil 16 can be used.
  • copper is used as the material of the metal foil 16
  • a copper sulfate-based solution can be used.
  • the water washing / drying apparatus 150 performs water washing and drying of the conductive base material 12 on which the metal foil 16 is formed.
  • the water washing / drying device 150 includes a water washing nozzle 151 and an air nozzle 152, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 151 and dried by the air nozzle 152.
  • water washing and drying by the water washing / drying device 150 may be omitted depending on the state of the conductive base material 12 on which the metal foil 16 is formed.
  • Insulating layer removal step S30 The insulating layer removing step S30 is performed after the metal foil forming step S20, and is a step of removing the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removing liquid (see FIG. 5).
  • the insulating layer removing step S40 is performed by the insulating layer removing device 160, as shown in FIG.
  • the insulating layer removing device 160 includes an insulating layer removing liquid storage tank 161, and the insulating layer removing liquid 162 is stored in the insulating layer removing liquid tank 161.
  • the conductive base material 12 (the conductive base material 12 on which the insulating layer 14 and the metal foil 16 are formed on one surface) is transferred to the insulating layer removing liquid 161 in the insulating layer removing liquid storage tank 161 by the roll 220. It is immersed in 162 and the insulating layer 14 is removed.
  • the insulating layer removing liquid 162 can be appropriately selected according to the material of the insulating layer 14.
  • an acidic insulating layer removing liquid or an alkaline insulating layer removing liquid is used for the photosensitive layer (photosensitive film) used in Embodiment 1.
  • Use liquid The insulating layer removing liquid 162 removes the insulating layer 14 from the insulating base material 12 by contracting or expanding the insulating layer 14.
  • an insulating layer removing liquid 162 that dissolves and removes the insulating layer 14 may be used as the insulating layer removing liquid.
  • the insulating layer removing device 160 may further include a microvibration device that slightly vibrates the insulating layer removing liquid 162 and the insulating base material 12 when the insulating layer 14 is removed. You may further provide the heat retention / heating apparatus kept at high temperature. With such a configuration, the insulating layer 14 is easily removed, and the insulating layer 14 can be reliably removed.
  • the water washing / drying device 170 performs water washing and drying of the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing device 160.
  • the water washing / drying device 170 includes a water washing nozzle 171 and an air nozzle 172, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 171 and dried by the air nozzle 172.
  • water washing and drying by the water washing / drying device 170 may be omitted.
  • Metal foil peeling process S40 is a process of peeling the metal foil 16 from the electroconductive base material 12, as shown in FIG.
  • the metal foil peeling step S40 is performed by the metal foil peeling device 180 as illustrated in FIG.
  • the metal foil peeling device 180 peels the metal foil 16 from the conductive substrate 12 by the upper contact roll 181 and the lower contact roll 182, and the upper separation roll 183 and the lower separation roll 184.
  • the separated metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 as the perforated metal foil 10.
  • the peeled conductive substrate 12 is conveyed toward the take-up roll 210 by the lower separation roll 184 and taken up by the take-up roll 210.
  • the conductive base material 12 taken up by the take-up roll 210 is used when manufacturing the perforated metal foil 10 from the next time on.
  • the thickness of the perforated metal foil 10 can be 1 ⁇ m or more.
  • the diameter of the hole 11 in the perforated metal foil 10 can be 30 to 200 ⁇ m, preferably 70 to 100 ⁇ m, and the opening ratio can be 20 to 80%, preferably about 40%.
  • the perforated metal foil 10 can be manufactured by peeling the metal foil 16 from the conductive base material 12 from which the insulating layer 14 has been removed in the insulating layer removing step S30.
  • the metal foil peeling step S40 the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed.
  • the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform
  • Metal foil post-processing process S50 is a process of post-processing with respect to metal foil 16 (perforated metal foil 10) peeled from the electroconductive base material 12 after metal foil peeling process S40.
  • the metal foil post-treatment step S50 includes a water washing treatment step, a drying step, and a rust prevention treatment step.
  • Metal foil post-processing process S50 is implemented by the metal foil post-processing apparatus 190 provided with the water washing nozzle 191, the air nozzle 192, and the antirust agent nozzle 193.
  • the water washing step is a step of washing away dirt when the perforated metal foil 10 is peeled off, and is performed by the water washing nozzle 191.
  • the drying step is a step performed by the air nozzle 192 so as to dry the perforated metal foil 10, and is performed by the air nozzle 192.
  • the rust prevention treatment step is performed by a rust inhibitor nozzle 193 that applies a rust inhibitor to the perforated metal foil 10 so that the perforated metal foil 10 does not rust.
  • the metal foil post-processing step S60 can be omitted.
  • the perforated metal foil 10 subjected to the metal foil post-processing step S50 is wound around the metal foil winding roll 200.
  • the wound perforated metal foil 10 is cut into a predetermined shape and size by a press or a cutter, if necessary, and a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial) Filters, etc.), printing screens, electromagnetic shielding sheets, carriers for supporting chemical reaction catalysts, and other wide applications.
  • the perforated metal foil 10 can be manufactured.
  • the metal foil peeling step S40 the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed.
  • the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform
  • the manufacturing method of perforated metal foil which concerns on Embodiment 1
  • insulating layer removal process S30 which removes the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removal liquid 162 is included, external force is hardly applied. Since it becomes possible to remove the insulating layer 14 without the necessity, the metal foil 16 or the conductive substrate 12 is hardly deformed during the insulating layer removing step S30.
  • the foil 10 can be manufactured stably.
  • the insulating layer removing liquid 162 may be a solution capable of removing the insulating layer 14 by contracting or expanding the insulating layer 14 or a solution capable of dissolving and removing the insulating layer 14.
  • the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region. Since the insulating layer forming step S12 for forming the insulating layer 14 by removing the non-photosensitive portion caused by the irradiation is included, it is possible to form the insulating layer 14 using a photolithography technique that has been widely used conventionally. Therefore, it is possible to form the insulating layer 14 with high accuracy, and as a result, it is possible to stably manufacture the high-quality perforated metal foil 10.
  • the metal foil peeling step S30 can be performed satisfactorily.
  • the pretreatment includes, for example, a process of removing the oxide film from the conductive substrate 12 and a water washing, drying, or peeling promotion film formation on the conductive substrate 12.
  • the treatment for removing the oxide film from the conductive base material 12 is performed as the pretreatment, it is possible to obtain an effect that the insulating layer 14 is easily formed and the metal foil 16 is easily formed by electrodeposition.
  • the conductive substrate 12 is washed with water as a pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate 12.
  • drying is performed as a pretreatment, the effect that the surface state of the conductive substrate 12 can be made uniform can be obtained.
  • a peeling promoting film is formed on the surface of the conductive substrate 12 as a pretreatment, the electrodeposited metal foil can be easily peeled off with a small force.
  • the manufacturing method of the perforated metal foil which concerns on Embodiment 1
  • it is conductive with an RTR apparatus. While the base material 12 is being transported, it is possible to continuously perform a predetermined process on the conductive base material 12. For this reason, it becomes possible to manufacture the perforated metal foil 10 with high productivity.
  • the metal foil post-processing step S50 includes, for example, a water washing step, a drying step, a rust prevention film forming step, and the like.
  • a water washing step it becomes possible to wash away the dirt adhering to the perforated metal foil 10.
  • a drying process it becomes possible to obtain an effect that the surface state of the perforated metal foil 10 can be made uniform.
  • FIG. 7 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the second embodiment.
  • FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment.
  • FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment.
  • the conductive substrate 12a at the right end of the upper diagram of FIG. 8 is illustrated so as to be connected to the conductive substrate 12a illustrated at the left end of the lower diagram of FIG.
  • FIG. 9 is a view showing the perforated metal foil 10a peeled from the conductive base material 12a by the metal foil peeling device 180 according to the second embodiment.
  • FIG. 10 is a view showing the perforated metal foil 10a from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 in the second embodiment.
  • the manufacturing method of the perforated metal foil according to the second embodiment basically includes the same steps as the manufacturing method of the perforated metal foil according to the first embodiment, but “insulating layer removing step S30” and “metal foil peeling”.
  • the order in which “step S40” is performed is different from that in the method of manufacturing the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the second embodiment, as shown in FIG. 7, the insulating layer removing step S30 is performed after the metal foil peeling step S40.
  • the insulating layer 14 is removed from the perforated metal foil 10a after being peeled from the substrate 12a.
  • the “conductive base material preparation step S10”, “metal foil formation step S20”, “metal foil peeling” are performed on the conductive base material 12a being conveyed.
  • Each step of “Step S100” is sequentially performed.
  • each process of "insulating layer removal process S40" and “metal foil post-processing process S50” is sequentially performed with respect to the perforated metal foil 10a peeled off from the conductive substrate 12a in the "metal foil peeling process S40". It will be done.
  • the insulating layer removing apparatus 160 is arranged at the subsequent stage of the metal foil peeling apparatus 180.
  • metal foil peeling process S40 as shown in FIG. 9, the insulating layer 14 and the metal foil 16 are peeled from the electroconductive base material 12a.
  • the peeled metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 with the insulating layer 14 attached as the perforated metal foil 10a.
  • the insulating layer removing step S30 as shown in FIG. 10, the insulating layer 14 is removed from the perforated metal foil 10a.
  • the perforated metal foil 10a (perforated metal foil 10a to which the insulating layer 14 is attached) conveyed is immersed in the insulating layer removing liquid 162 in the insulating layer removing liquid storage tank 161 by the roll 220, so that the insulating layer 14 Is removed.
  • the insulating layer removing liquid 162 the same insulating layer removing liquid 162 as that in Embodiment 1 can be used.
  • the area where the insulating layer 14 comes into contact with the insulating layer removing liquid 162 is increased as compared with the case of the first embodiment, and the perforated metal foil 10a is efficiently used.
  • the insulating layer 14 can be removed.
  • a perforated metal is removed by removing the insulating layer 14 from the metal foil 16 after peeling from the electroconductive base material 12 by metal foil peeling process S40.
  • a foil can be manufactured.
  • the manufacturing method of perforated metal foil which concerns on Embodiment 2 is the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the order which implements "insulation layer removal process S30" and "metal foil peeling process S40". Since the same process as in the above case is included, it has a corresponding effect among the effects of the method for manufacturing a perforated metal foil according to the first embodiment.
  • FIG. 11 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the third embodiment.
  • FIG. 12 is a view showing a perforated metal foil manufacturing apparatus 100b according to the third embodiment.
  • the conductive substrate 12b at the right end of the upper diagram of FIG. 12 is illustrated so as to be connected to the conductive substrate 12b illustrated at the left end of the lower diagram of FIG.
  • the perforated metal foil manufacturing method according to the third embodiment basically includes the same steps as the perforated metal foil manufacturing method according to the first embodiment, but is performed in that the insulating layer removing step is performed twice. It differs from the case of the manufacturing method of the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the third embodiment, as shown in FIG. 11, the insulating layer removing step is an insulating layer removing step S30 (in which the insulating layer 14 is removed before the metal foil peeling step S40 ( A first insulating layer removing step S30) and a second insulating layer removing step S60 for removing the insulating layer 14 after the metal foil peeling step S40.
  • the insulating layer 14 is removed from the conductive base material 12b before peeling the metal foil 16, and in the second insulating layer removing step S60, after peeling from the conductive base material 12b.
  • the insulating layer 14 is removed from the metal foil (perforated metal foil 10b).
  • the “conductive base material preparation step S10”, “metal foil formation step S20”, “first insulation” are performed on the conductive base material 12b being conveyed.
  • Each step of “layer removal step S30” and “metal foil peeling step S40” is sequentially performed.
  • each process of "2nd insulating layer removal process S60" and “metal foil post-processing process S50" with respect to the perforated metal foil 10b peeled from the electroconductive base material 12b by "metal foil peeling process S40” is carried out. It will be implemented sequentially. That is, the perforated metal foil manufacturing method according to the third embodiment performs both the edge layer removing step S30 and the insulating layer removing step S60.
  • the insulating layer removing apparatus 160 is arranged at the front stage and the rear stage of the metal foil peeling apparatus 180, respectively.
  • the insulating layer 14 is removed from the conductive base material 12b by the first insulating layer removing step S30, and the metal from the conductive base material 12b by the metal foil peeling step S40. It is possible to manufacture the perforated metal foil 10b by peeling the foil 16 and removing the insulating layer 14 from the perforated metal foil 10b in the second insulating layer removing step S60. In this case, even if the insulating layer 14 remains on the metal foil 16 after the first insulating layer removing step S30, the remaining insulating layer 14 is surely removed during the second insulating layer removing step S60. Is possible. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil 10b from which the insulating layer 14 has been removed more completely.
  • the manufacturing method of perforated metal foil 10b which concerns on Embodiment 3 has the structure similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except performing an insulating layer removal process twice.
  • the perforated metal foil manufacturing method according to the first embodiment has a corresponding effect among the effects of the method.
  • FIG. 13 is a view showing a perforated metal foil manufacturing apparatus 100 c according to the fourth embodiment.
  • the method for manufacturing a perforated metal foil according to the fourth embodiment basically includes the same steps as the method for manufacturing the perforated metal foil according to the first embodiment, but the configuration of the conductive base material used is the same as that of the first embodiment. It differs from the case of the manufacturing method of the perforated metal foil. That is, in the method for manufacturing a perforated metal foil according to Embodiment 4, as shown in FIG. 13, the conductive base material is composed of an endless belt-like conductive base material 12 c and is conductive by a roll device including a plurality of rolls. The perforated metal foil 10c is manufactured while continuously transporting the conductive substrate 12c.
  • the manufacturing apparatus 100c for perforated metal foil in the fourth embodiment is based on the drive roll 350 and the driven roll 360 that are disposed at positions separated from each other in order to endlessly rotate the conductive base 12c, and the conductive base 12c.
  • the insulating layer forming apparatus 130 that performs the insulating layer forming process S12, the metal foil forming apparatus 140 that performs the metal foil forming process S20, the insulating layer removing apparatus 160 that performs the insulating layer removing process S30, and the metal foil peeling process S40 are performed.
  • a metal foil peeling device 180c and a metal foil winding roll 200 for winding the perforated metal foil 10c peeled by the metal foil peeling device 180c are provided.
  • a roll apparatus is comprised by the motor (not shown) which rotationally drives the drive roll 350, the driven roll 360, the driven roll 360, and the drive roll 350.
  • the method for manufacturing a perforated metal foil it is possible to continuously perform a predetermined process on the conductive base material 12c while the conductive base material 12c is being conveyed by the roll device. Become. For this reason, it becomes possible to manufacture the perforated metal foil 10c with high productivity. Since the endless belt-like conductive base material returns to the initial process position after a series of processes is completed, full automation can be realized and work efficiency can be further increased.
  • Embodiment 1 since the manufacturing method of perforated metal foil which concerns on Embodiment 4 includes the process similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the structure of the electroconductive base material to be used, Embodiment 1 It has the effect applicable among the effects which the manufacturing method of the perforated metal foil which concerns on has.
  • a metal or alloy flexible long sheet-like base material was used as the conductive base material, but the present invention is not limited thereto.
  • Various substrates can be used as long as the surface exhibits conductivity.
  • a conductive substrate formed by coating a conductive film on the surface of a non-conductive substrate such as plastic can be used. In this case, it is not necessary to mask the back surface and both side surfaces of the conductive substrate with a non-conductive member.
  • the thing which laminated the copper foil on the surface of the polyimide tape base material, and made it the electroconductive base material can be used.
  • a rigid conductive substrate may be used, or a strip-shaped conductive substrate may be used.
  • the method for producing a perforated metal foil of the present invention was described by using a so-called photolithography technique, but the present invention is not limited to this.
  • the insulating layer forming agent used for printing is preferably cured by heating or ultraviolet irradiation.
  • the printing method screen printing, ink jet printing, or roll coater printing is suitable.
  • FIG. 14 is a view for explaining the method of manufacturing the perforated metal foil according to the first to third modifications.
  • FIG. 14A is a diagram showing a state in which a metal foil 16d having substantially the same thickness as the insulating layer 14d is formed by electrodeposition (Modification 1)
  • FIG. 14B is a metal foil thicker than the insulating layer 14e.
  • FIG. 14C is a diagram showing a state in which 16e is formed by electrodeposition (Modification 2)
  • FIG. 14C shows a tapered insulating layer 14f and a metal foil 16f thinner than the insulating layer 14f by electrodeposition. It is a figure which shows a mode that it does (Modification 3).
  • the insulating layer 14d is formed by the insulating layer removing liquid, compared with the case where the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Easy to remove.
  • the metal foil 16e thicker than the insulating layer 14e is formed by electrodeposition, the metal foil 16e covers the insulating layer 14e than when the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Therefore, the bonding strength between the metal foil 16e and the insulating layer 14e can be increased, and the metal foil 16e and the insulating layer 14e are integrally peeled from the conductive substrate as in the second or third embodiment. It becomes easy.
  • the tapered insulating layer 14f is formed and the metal foil 16f thinner than the insulating layer 14f is formed by electrodeposition, the insulating layer 14f can be easily removed.
  • the tapered side surface of the insulating layer 14f is formed as follows. First, a first insulating layer 14f ′ is formed only in the second region of the conductive substrate 12, and then a second insulating layer 14f ′′ that is smaller than the first insulating layer 14f ′ is formed. Form. By repeating the above operation, the insulating layer 14f having a tapered side surface is formed.
  • each step is performed as a series of steps in one RTR apparatus, but the present invention is not limited to these.
  • FIG. 15 is a view for explaining the method for manufacturing the perforated metal foil according to the fourth modification.
  • FIG. 16 is a view for explaining the method for manufacturing the perforated metal foil according to the fifth modification.
  • the process of “conductive substrate preparation process S10” is performed by the first RTR device 230, and thereafter, “metal foil formation process S20”, “insulating layer removal process S30” and “ You may make it implement each process of metal foil peeling process S40 "with the 2nd RTR apparatus 250 as another process (modification 4).
  • FIG. 15 is a view for explaining the method for manufacturing the perforated metal foil according to the fourth modification.
  • FIG. 16 is a view for explaining the method for manufacturing the perforated metal foil according to the fifth modification.
  • the process of “conductive substrate preparation process S10” is performed by the first RTR device 230, and thereafter, “metal foil formation process S20”, “insulating layer removal
  • the “conductive substrate preparation step S10”, the “metal foil forming step S20”, the “insulating layer removing step S30” and the “metal foil peeling step S40” are respectively separate steps.
  • the first RTR device 230, the third RTR device 270, the fourth RTR device 300, and the fifth RTR device 330 may each be implemented.
  • electroconductive base material pre-processing process S11 and metal foil post-processing process S50 were implemented, this invention is not limited to this. Depending on the surface state and material of the conductive substrate, part or all of the conductive substrate pretreatment step S11 may be omitted. Depending on the state or material of the perforated metal foil, part or all of the metal foil post-processing step S50 may be omitted. Similarly, depending on the state of the conductive substrate or the metal foil, the water washing step and the drying step by the water washing / drying apparatuses 150 and 170 after the metal foil forming step S30 and the insulating layer removing step S40 may be omitted.
  • the insulating layer is removed using the insulating layer removing solution, but the present invention is not limited to this.
  • the insulating layer may be removed using an insulating layer removing step that mechanically or thermally removes the insulating layer.
  • the insulating layer removing step for mechanically removing for example, the insulating layer is brushed with a brush, or by applying ultrasonic vibration to the insulating layer, the insulating layer is peeled off from the conductive substrate or the metal foil and removed. It is good also as a process, and it is good also as a process of deleting an insulating layer with a micro drill or a micro cutter.
  • the insulating layer removing step for removing thermally may be, for example, a step for dissolving and removing the insulating layer by applying heater heat, or a step for dissolving and removing the insulating layer by irradiating laser light. Moreover, you may combine said method suitably.
  • Stripping accelerator nozzle 130 ... Insulating layer forming apparatus, 140 ... Metal foil forming device, 141 ... Plating tank, 142 ... Plating solution, 143 ... Anode plate, 150, 170 ... Washing / drying device, 1 DESCRIPTION OF SYMBOLS 0 ... Insulating layer removal apparatus, 161 ... Insulating layer removal liquid storage tank, 162 ... Insulating layer removal liquid, 180, 180e ... Metal foil peeling apparatus, 181 ... Upper contact roll, 182 ... Lower contact roll, 183 ... Upper separation roll, 184 ... Lower separation roll, 190 ... Metal foil post-processing device, 193 ... Rust preventive nozzle, 200 ...
  • Metal foil winding roll 210, 240, 290, 320 ... Winding roll, 220 ... roll, 230 ... 1st RTR device, 250 ... second RTR device, 270 ... third RTR device, 300 ... fourth RTR device, 330 ... fifth RTR device, 350 ... drive roll, 360 ... driven roll, 900 ... electroforming System, 910 ... Metal foil, 920 ... Plating tank, 921 ... Plating solution, 922 ... Anode, 930 ... Cathode drum, 930a ... Lower half of cathode drum, 931 ... Resist, 940 ... the take-up roll, 950 ... arrow

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Abstract

This method for producing a perforated metal foil includes: a conductive substrate preparation step (S20) for preparing a conductive substrate having a structure such that an insulating layer has been formed at a second region corresponding to the position of a perforation; a metal foil formation step (S30) for forming a metal foil by means of electrodeposition at a first region that is of the conductive substrate and to which the insulating layer has not been formed; an insulating layer elimination step (S40) for eliminating the insulating layer; and a metal foil peeling step (S50) for peeling the metal foil from the conductive substrate. By means of the method for producing a perforated metal foil, degradation of perforation shape and perforation dimensions during the production process are eliminated and so it is possible to stably produce a high-quality perforated metal foil.

Description

孔開き金属箔の製造方法Method for producing perforated metal foil
　本発明は、孔開き金属箔の製造方法に関する。 The present invention relates to a method for producing a perforated metal foil.
　従来、カソードドラムの周面に電解めっきを施すことにより、多数の孔を有するアルミニウム箔や銅箔を製造する孔開き金属箔の製造方法が知られている（例えば、特許文献１参照。）。 Conventionally, a perforated metal foil manufacturing method for manufacturing an aluminum foil or a copper foil having a large number of holes by performing electrolytic plating on the peripheral surface of the cathode drum is known (for example, see Patent Document 1).
　図１７は、従来の孔開き金属箔の製造方法を説明するために示す図である。 FIG. 17 is a view for explaining a conventional method of manufacturing a perforated metal foil.
　従来の孔開き金属箔の製造方法に用いる電鋳システム９００は、図１７に示すように、めっき槽９２０、カソードドラム９３０及び巻き取りロール９４０を備える。めっき槽９２０は、めっき液９２１及びアノード９２２を収納している。カソードドラム９３０の周面は、レジスト９３１の塗布により部分的にマスキングされている。カソードドラムの下半分９３０ａは、めっき液９２１に浸漬している。 An electroforming system 900 used in a conventional method for manufacturing a perforated metal foil includes a plating tank 920, a cathode drum 930, and a winding roll 940 as shown in FIG. The plating tank 920 contains a plating solution 921 and an anode 922. The peripheral surface of the cathode drum 930 is partially masked by applying a resist 931. The lower half 930a of the cathode drum is immersed in the plating solution 921.
　従来の孔開き金属箔の製造方法においては、電鋳システム９００に直流電圧を印加するとともに、カソードドラム９３０を矢印９５０の方向に回転すると、めっき液９２１中に含まれる金属が、レジスト９３１でマスキングされた部分を除くカソードドラム９３０の周面に電着され、金属箔９１０が形成される。形成された金属箔９１０は、カソードドラム９３０の周面から剥離され、巻き取りロール９４０に巻き取られる。この場合、金属箔９１０がカソードドラム９３０の周面から剥離されても、レジスト９３１はカソードドラム９３０の周面に保持されるため、次回以降の金属箔の電着の際にレジスト９３１として繰り返して使用することが可能となる。 In the conventional method of manufacturing a perforated metal foil, when a DC voltage is applied to the electroforming system 900 and the cathode drum 930 is rotated in the direction of the arrow 950, the metal contained in the plating solution 921 is masked by the resist 931. The metal foil 910 is formed by electrodeposition on the peripheral surface of the cathode drum 930 excluding the formed portion. The formed metal foil 910 is peeled off from the peripheral surface of the cathode drum 930 and taken up by a take-up roll 940. In this case, even if the metal foil 910 is peeled off from the peripheral surface of the cathode drum 930, the resist 931 is held on the peripheral surface of the cathode drum 930. Can be used.
特許第３３６９５９２号公報Japanese Patent No. 3369592
　しかしながら、従来の孔開き金属箔の製造方法においては、レジスト９３１を繰り返して使用するうちに、レジスト９３１のパターン形状及びパターン寸法が徐々に劣化してゆくことから、レジスト９３１を使用して形成される金属箔の孔形状及び孔寸法も徐々に劣化してゆき、その結果、孔開き金属箔の品質が低下するという問題があった。 However, in the conventional method for manufacturing a perforated metal foil, the resist 931 is formed using the resist 931 because the pattern shape and pattern dimensions of the resist 931 gradually deteriorate as the resist 931 is repeatedly used. The hole shape and hole size of the metal foil gradually deteriorated, and as a result, the quality of the perforated metal foil was lowered.
　本発明は、上記した問題を解決するためになされたもので、製造過程において孔形状及び孔寸法が劣化することなく、高品質な孔開き金属箔を安定して製造可能な孔開き金属箔の製造方法を提供することを目的とする。 The present invention has been made in order to solve the above-described problems, and is a perforated metal foil capable of stably producing a high-quality perforated metal foil without deterioration of the hole shape and hole size in the manufacturing process. An object is to provide a manufacturing method.
[１]本発明の孔開き金属箔の製造方法は、導電性基材の一方の表面における所定の第１領域に金属箔を電着することにより多数の孔を有する孔開き金属箔を製造する孔開き金属箔の製造方法であって、前記導電性基材の一方の面における前記第１領域以外の第２領域に絶縁層が形成された構造を有する導電性基材を準備する導電性基材準備工程と、前記導電性基材の一方の面における前記第１領域に前記金属箔を電着により形成する金属箔形成工程と、前記金属箔を前記導電性基材から剥離する金属箔剥離工程とを含み、前記金属箔形成工程より後に、前記絶縁層を除去する絶縁層除去工程をさらに含むことを特徴とする。 [1] In the method for producing a perforated metal foil of the present invention, a perforated metal foil having a large number of holes is produced by electrodepositing a metal foil on a predetermined first region on one surface of a conductive substrate. A conductive group for preparing a perforated metal foil, comprising a conductive base material having a structure in which an insulating layer is formed in a second region other than the first region on one surface of the conductive base material A metal foil forming step for forming the metal foil by electrodeposition in the first region on one surface of the conductive base material, and a metal foil peeling for peeling the metal foil from the conductive base material. And an insulating layer removing step of removing the insulating layer after the metal foil forming step.
　本発明の孔開き金属箔の製造方法によれば、孔を形成する第２領域に絶縁層が形成された構造を有する導電性基材を準備するとともに、当該導電性基材に対して金属箔を形成することとしているため、製造過程において孔形状及び孔寸法が劣化することがなくなり、高品質な孔開き金属箔を安定して製造することが可能となる。 According to the method for producing a perforated metal foil of the present invention, a conductive base material having a structure in which an insulating layer is formed in a second region for forming a hole is prepared, and the metal foil is formed on the conductive base material. Therefore, the hole shape and the hole size are not deteriorated in the manufacturing process, and a high-quality perforated metal foil can be stably manufactured.
　なお、金属箔は、電着可能な金属であればどのような金属又は合金により形成してもよく、例えば、銅、アルミニウム、金、銀、その他の金属、各種合金などにより形成してもよい。この孔開き金属箔は、二次電池の集電体、各種フィルター（気体用フィルター、液体用フィルター、抗菌用フィルター等）、印刷用スクリーン、電磁波遮蔽用シート、化学反応促進用触媒の担持体、その他の幅広い用途に使用することが可能となる。導電性基材としては、金属製又は合金製の導電性基材材を用いることができる。非導電性基材の表面に導電性部材を配設したものを用いることもできる。 The metal foil may be formed of any metal or alloy as long as it can be electrodeposited. For example, the metal foil may be formed of copper, aluminum, gold, silver, other metals, various alloys, or the like. . This perforated metal foil is a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial filter, etc.), printing screen, electromagnetic wave shielding sheet, carrier for catalyst for promoting chemical reaction, It can be used for a wide variety of other purposes. As the conductive base material, a conductive base material made of metal or alloy can be used. It is also possible to use a nonconductive substrate having a conductive member disposed on the surface thereof.
［２］本発明の孔開き金属箔の製造方法においては、前記金属箔剥離工程より前に前記絶縁層除去工程を実施し、前記絶縁層除去工程においては、前記金属箔を剥離する前の前記導電性基材から前記絶縁層を除去することが好ましい。 [2] In the method for producing a perforated metal foil of the present invention, the insulating layer removing step is performed before the metal foil peeling step, and in the insulating layer removing step, the metal foil is peeled off before the metal foil is peeled off. It is preferable to remove the insulating layer from the conductive substrate.
　このように、絶縁層除去工程により絶縁層が除去された導電性基材から金属箔を剥離することにより、孔開き金属箔を製造することが可能となる。この場合、金属箔剥離工程においては、絶縁層が除去された導電性基材から金属箔を剥離することとなるため、絶縁層が除去されていない導電性基材から金属箔及び絶縁層をともに剥離する場合に比べて、小さな力で金属箔を剥離することが可能となる。このため、金属箔剥離工程中に金属箔が変形し難くなることから、高い形状精度を有する孔開き金属箔を安定して製造することが可能となる。 Thus, perforated metal foil can be produced by peeling the metal foil from the conductive base material from which the insulating layer has been removed in the insulating layer removing step. In this case, in the metal foil peeling step, the metal foil is peeled from the conductive base material from which the insulating layer has been removed. Therefore, both the metal foil and the insulating layer are taken from the conductive base material from which the insulating layer has not been removed. Compared to the case of peeling, the metal foil can be peeled with a small force. For this reason, since it becomes difficult for a metal foil to deform | transform during a metal foil peeling process, it becomes possible to manufacture stably the perforated metal foil which has high shape accuracy.
［３］本発明の孔開き金属箔の製造方法においては、前記金属箔剥離工程より後に前記絶縁層除去工程を実施し、前記絶縁層除去工程においては、前記導電性基材から剥離した後の前記金属箔から前記絶縁層を除去することが好ましい。 [3] In the method for producing a perforated metal foil of the present invention, the insulating layer removing step is performed after the metal foil peeling step, and the insulating layer removing step is performed after peeling from the conductive substrate. It is preferable to remove the insulating layer from the metal foil.
　このように、金属箔剥離工程により導電性基材から剥離した後の金属箔から絶縁層を除去することによっても、孔開き金属箔を製造することが可能となる。 As described above, the perforated metal foil can be produced also by removing the insulating layer from the metal foil after being peeled from the conductive base material in the metal foil peeling step.
［４］本発明の孔開き金属箔の製造方法においては、前記絶縁層除去工程は、前記金属箔剥離工程より前に前記絶縁層を除去する第１絶縁層除去工程と、前記金属箔剥離工程より後に前記絶縁層を除去する第２絶縁層除去工程とを含み、前記第１絶縁層除去工程においては、前記金属箔を剥離する前の前記導電性基材から前記絶縁層を除去し、前記第２絶縁層除去工程においては、前記導電性基材から剥離した後の前記金属箔から前記絶縁層を除去することが好ましい。 [4] In the method for producing a perforated metal foil of the present invention, the insulating layer removing step includes a first insulating layer removing step of removing the insulating layer before the metal foil peeling step, and the metal foil peeling step. A second insulating layer removing step for removing the insulating layer later, and in the first insulating layer removing step, the insulating layer is removed from the conductive base material before peeling the metal foil, In the second insulating layer removing step, it is preferable to remove the insulating layer from the metal foil after peeling from the conductive base material.
　このように、第１絶縁層除去工程により導電性基材から絶縁層を除去し、金属箔剥離工程により導電性基材から金属箔を剥離するとともに、第２絶縁層除去工程により金属箔から絶縁層を除去することによっても、孔開き金属箔を製造することが可能となる。この場合、第１絶縁層除去工程後に金属箔に絶縁層が残存していたとしても、第２絶縁層除去工程中に、当該残存している絶縁層を確実に除去することが可能となる。このため、絶縁層がより完全に除去された清浄で高品質な孔開き金属箔を製造することが可能となる。 In this way, the insulating layer is removed from the conductive base material by the first insulating layer removing step, the metal foil is peeled from the conductive base material by the metal foil peeling step, and insulated from the metal foil by the second insulating layer removing step. It is also possible to produce perforated metal foil by removing the layer. In this case, even if the insulating layer remains on the metal foil after the first insulating layer removing step, the remaining insulating layer can be reliably removed during the second insulating layer removing step. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil from which the insulating layer is more completely removed.
［５］本発明の孔開き金属箔の製造方法においては、前記絶縁層除去工程においては、前記絶縁層を絶縁層除去液に浸漬することにより前記絶縁層を除去することが好ましい。 [5] In the method for producing a perforated metal foil of the present invention, in the insulating layer removing step, it is preferable to remove the insulating layer by immersing the insulating layer in an insulating layer removing solution.
　このような方法とすることにより、外力をほとんど必要とせずに絶縁層を除去することが可能となるため、絶縁層除去工程中に金属箔又は導電性基材が変形し難くなることから、高い形状精度を有する孔開き金属箔を安定して製造することが可能となる。
　なお、絶縁層除去液としては、絶縁層を収縮または膨張させて絶縁層を除去可能な溶液でもよく、絶縁層を溶解除去可能な溶液でもよい。 By adopting such a method, it becomes possible to remove the insulating layer with little need for external force. Therefore, the metal foil or the conductive substrate is hardly deformed during the insulating layer removing step, which is high. It becomes possible to stably manufacture a perforated metal foil having shape accuracy.
The insulating layer removing liquid may be a solution capable of removing the insulating layer by contracting or expanding the insulating layer, or a solution capable of dissolving and removing the insulating layer.
［６］本発明の孔開き金属箔の製造方法においては、前記導電性基材準備工程は、前記導電性基材の一方の表面に形成した感光層に前記第１領域又は前記第２領域のいずれかの領域に不透明パターンを有するパターンマスクを介して光を照射し、当該照射による感光部分又は非感光部分のいずれかを除去して前記絶縁層を形成する絶縁層形成工程を含むことが好ましい。 [6] In the method for producing a perforated metal foil of the present invention, the conductive base material preparing step includes the step of forming the first region or the second region on a photosensitive layer formed on one surface of the conductive base material. It is preferable to include an insulating layer forming step of irradiating light through a pattern mask having an opaque pattern in any region and removing either the photosensitive portion or the non-photosensitive portion due to the irradiation to form the insulating layer. .
　このような方法とすることにより、従来から広く実施されているフォトリソグラフィの手法を用いて絶縁層を形成することが可能となるため、高い精度で絶縁層を形成することが可能となり、ひいては、高品質な孔開き金属箔を安定して製造することが可能となる。 By adopting such a method, it becomes possible to form the insulating layer by using a photolithography technique that has been widely practiced so far, so that it is possible to form the insulating layer with high accuracy. A high-quality perforated metal foil can be stably produced.
［７］本発明の孔開き金属箔の製造方法においては、前記導電性基材準備工程は、前記導電性基材の一方の表面における前記第２領域に印刷を施して前記絶縁層を形成する絶縁層形成工程を含むことが好ましい。 [7] In the method for producing a perforated metal foil of the present invention, in the conductive base material preparation step, the second region on one surface of the conductive base material is printed to form the insulating layer. It is preferable to include an insulating layer forming step.
　このような方法とすることにより、従来から広く実施されている印刷技術を用いて絶縁層を形成することが可能となるため、高い生産性で絶縁層を形成することが可能となり、ひいては、比較的安価な製造コストで高品質な孔開き金属箔を製造することが可能となる。なお、絶縁層は、印刷後に、加熱、紫外線照射等により硬化するものであることが好ましい。印刷としては、スクリーン印刷、インクジェット印刷、ロールコーター印刷などを用いることができる。 By adopting such a method, it becomes possible to form an insulating layer using a printing technique that has been widely practiced so far, so it is possible to form the insulating layer with high productivity, and in comparison, It is possible to manufacture a high-quality perforated metal foil at a low manufacturing cost. In addition, it is preferable that an insulating layer is hardened | cured by heating, ultraviolet irradiation, etc. after printing. As printing, screen printing, inkjet printing, roll coater printing, or the like can be used.
［８］本発明の孔開き金属箔の製造方法においては、前記導電性基材準備工程は、前記絶縁層形成工程よりも前に、前記導電性基材の一方の表面に対して前処理を施す前処理工程をさらに含むことが好ましい。 [8] In the method for producing a perforated metal foil of the present invention, the conductive base material preparing step is a pretreatment for one surface of the conductive base material before the insulating layer forming step. It is preferable to further include a pretreatment step to be applied.
　このような方法とすることにより、前処理工程より後の工程、特に、絶縁層形成工程、金属箔形成工程、金属箔剥離工程などを良好に行うことができる。前処理には、例えば、導電性基材から酸化膜を除去する処理や、導電性基材に対する水洗、乾燥又は剥離促進膜形成を行うことが含まれる。前処理として導電性基材から酸化膜を除去する処理を行う場合には、絶縁層を形成し易い、また、金属箔を電着により形成し易いという効果が得られる。前処理として導電性基材に対する水洗を行う場合には、導電性基材の表面に付着した酸化膜除去剤や汚れを洗い流すことが可能となるという効果が得られる。前処理として乾燥を行う場合には導電性基材の表面の状態を均一化できるという効果が得られる。前処理として導電性基材の表面に剥離促進膜を形成する場合には、電着された金属箔を小さな力で容易に剥離することが可能となる。 By adopting such a method, it is possible to satisfactorily perform processes after the pretreatment process, in particular, an insulating layer forming process, a metal foil forming process, a metal foil peeling process, and the like. The pretreatment includes, for example, a treatment for removing the oxide film from the conductive base material, and water washing, drying, or peeling promotion film formation on the conductive base material. In the case where the treatment for removing the oxide film from the conductive substrate is performed as the pretreatment, it is possible to easily form an insulating layer and to easily form a metal foil by electrodeposition. In the case where the conductive substrate is washed with water as the pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate. When drying is performed as a pretreatment, an effect that the state of the surface of the conductive substrate can be made uniform can be obtained. When a peeling promoting film is formed on the surface of the conductive substrate as a pretreatment, the electrodeposited metal foil can be easily peeled with a small force.
［９］本発明の孔開き金属箔の製造方法においては、前記導電性基材は長尺シート状の導電性基材からなり、前記導電性基材を繰り出しロールから繰り出すとともに巻き取りロールで巻き取るロールツーロール（ＲＴＲ）装置により前記導電性基材を搬送しながら、前記孔開き金属箔を製造することが好ましい。 [9] In the method for producing a perforated metal foil of the present invention, the conductive base material is a long sheet-like conductive base material, and the conductive base material is fed out from a feeding roll and wound with a winding roll. It is preferable to manufacture the perforated metal foil while transporting the conductive base material with a roll-to-roll (RTR) apparatus.
　このような方法とすることにより、ＲＴＲ装置により導電性基材を搬送中に、当該導電性基材に対して所定工程を連続して実施することが可能となる。このため、高い生産性で孔開き金属箔を製造することが可能となる。 By adopting such a method, it is possible to continuously perform a predetermined process on the conductive base material while the conductive base material is being transported by the RTR apparatus. For this reason, it becomes possible to manufacture a perforated metal foil with high productivity.
［１０］本発明の孔開き金属箔の製造方法においては、前記導電性基材はエンドレスベルト状の導電性基材からなり、複数のロールを備えるロール装置により前記導電性基材を連続的に搬送しながら前記孔開き金属箔を製造することが好ましい。 [10] In the method for producing a perforated metal foil of the present invention, the conductive base material is composed of an endless belt-like conductive base material, and the conductive base material is continuously formed by a roll device including a plurality of rolls. The perforated metal foil is preferably produced while being conveyed.
　このような方法とすることにより、ロール装置により導電性基材を搬送中に、当該導電性基材に対して所定工程を連続して実施することが可能となる。このため、高い生産性で孔開き金属箔を製造することが可能となる。エンドレスベルト状の導電性基材は、一連の工程が終了すると最初の工程位置に戻るため、完全自動化が実現し、作業効率をより高くすることが可能となる。 By adopting such a method, it is possible to continuously perform a predetermined process on the conductive base material while the conductive base material is being conveyed by the roll device. For this reason, it becomes possible to manufacture a perforated metal foil with high productivity. Since the endless belt-like conductive base material returns to the initial process position after a series of processes is completed, full automation can be realized and work efficiency can be further increased.
［１１］本発明の孔開き金属箔の製造方法においては、前記金属箔剥離工程より後に、前記導電性基材から剥離された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことが好ましい。 [11] In the method for producing a perforated metal foil of the present invention, after the metal foil peeling step, a metal foil post-treatment step of performing a post-treatment on the metal foil peeled from the conductive substrate is further performed. It is preferable to include.
　このような方法とすることにより、金属箔剥離工程により剥離された孔開き金属箔の状態を良好な状態に維持することが可能となる。金属箔後処理工程には、例えば、水洗工程、乾燥工程、防錆膜形成工程などが含まれる。後工程として水洗工程を行う場合には孔開き金属箔に付着した汚れを洗い流すことが可能となる。後工程として乾燥工程を行う場合には孔開き金属箔の表面の状態を均一化できるという効果を得ることが可能となる。 By adopting such a method, the state of the perforated metal foil peeled off by the metal foil peeling step can be maintained in a good state. The metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process. In the case where the water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil. When a drying process is performed as a subsequent process, it is possible to obtain an effect that the surface state of the perforated metal foil can be made uniform.
［１２］本発明の孔開き金属箔の製造方法においては、前記絶縁層除去工程より後に、前記絶縁層が除去された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことが好ましい。 [12] The method for producing a perforated metal foil of the present invention further includes a metal foil post-processing step of performing post-processing on the metal foil from which the insulating layer has been removed after the insulating layer removing step. Is preferred.
　このような方法とすることにより、絶縁層除去工程において絶縁層が除去された孔開き金属箔の状態を良好に維持することが可能となる。金属箔後処理工程には、例えば、水洗工程、乾燥工程、防錆膜形成工程などが含まれる。後工程として水洗工程を行う場合には孔開き金属箔に付着した汚れを洗い流すことが可能となる。後工程として乾燥工程を行う場合には孔開き金属箔の表面の状態を均一化できるという効果が得られる。後工程として防錆膜形成工程を行う場合には、孔開き金属箔に錆が発生することを防止することが可能となる。 By adopting such a method, it is possible to satisfactorily maintain the state of the perforated metal foil from which the insulating layer has been removed in the insulating layer removing step. The metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process. In the case where the water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil. When performing a drying process as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained. When a rust preventive film forming step is performed as a subsequent step, it is possible to prevent rust from being generated on the perforated metal foil.
［１３］本発明の孔開き金属箔の製造方法においては、前記第２絶縁層除去工程より後に、前記絶縁層が除去された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことが好ましい。 [13] In the method for manufacturing a perforated metal foil of the present invention, a metal foil post-treatment step of performing a post-treatment on the metal foil from which the insulating layer has been removed is further provided after the second insulating layer removing step. It is preferable to include.
　このような方法とすることにより、金属箔剥離工程の前後で行われる第１絶縁層除去工程及び第２絶縁層除去工程において絶縁層が除去された孔開き金属箔の状態を良好に維持可能となる。金属箔後処理工程には、例えば、水洗工程、乾燥工程、防錆膜形成工程が含まれる。後工程として水洗工程を行う場合には孔開き金属箔に付着した汚れを洗い流すことが可能となる。後工程として乾燥工程を行う場合には孔開き金属箔の表面の状態を均一化できるという効果が得られる。後工程として防錆膜形成工程を行う場合には、金属箔に錆が発生することを防止することが可能となる。 By adopting such a method, the state of the perforated metal foil from which the insulating layer has been removed in the first insulating layer removing step and the second insulating layer removing step performed before and after the metal foil peeling step can be satisfactorily maintained. Become. The metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process. In the case where the water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil. When performing a drying process as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained. When a rust preventive film forming process is performed as a post process, it is possible to prevent rust from being generated on the metal foil.
実施形態１に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。3 is a flowchart shown for explaining a method of manufacturing the perforated metal foil according to the first embodiment. 実施形態１における孔開き金属箔の製造装置１００を示す図である。It is a figure which shows the manufacturing apparatus 100 of the perforated metal foil in Embodiment 1. FIG. 実施形態１における絶縁層形成装置１３０により絶縁層１４が形成された導電性基材１２を示す図である。It is a figure which shows the electroconductive base material 12 in which the insulating layer 14 was formed by the insulating layer forming apparatus 130 in Embodiment 1. FIG. 実施形態１における金属箔形成装置１４０により金属箔１６が電着により形成された導電性基材１２を示す図である。It is a figure which shows the electroconductive base material 12 in which the metal foil 16 was formed by electrodeposition by the metal foil formation apparatus 140 in Embodiment 1. FIG. 実施形態１における絶縁層除去装置１６０により絶縁層１４が除去された導電性基材１２を示す図である。It is a figure which shows the electroconductive base material 12 from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 1. FIG. 実施形態１における金属箔剥離装置１８０により導電性基材１２から剥離された孔開き金属箔１０を示す図である。It is a figure which shows the perforated metal foil 10 peeled from the electroconductive base material 12 by the metal foil peeling apparatus 180 in Embodiment 1. FIG. 実施形態２に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 2. 実施形態２における孔開き金属箔の製造装置１００ａを示す図である。It is a figure which shows the manufacturing apparatus 100a of the perforated metal foil in Embodiment 2. FIG. 実施形態２における金属箔剥離装置１８０により導電性基材１２ａから剥離された孔開き金属箔１０ａを示す図である。It is a figure which shows the perforated metal foil 10a peeled from the electroconductive base material 12a by the metal foil peeling apparatus 180 in Embodiment 2. 実施形態２における絶縁層除去装置１６０により絶縁層１４が除去された孔開き金属箔１０ａを示す図である。It is a figure which shows the perforated metal foil 10a from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 2. 実施形態３に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 3. 実施形態３における孔開き金属箔の製造装置１００ｂを示す図である。It is a figure which shows the manufacturing apparatus 100b of the perforated metal foil in Embodiment 3. 実施形態４における孔開き金属箔の製造装置１００ｃを示す図である。It is a figure which shows the manufacturing apparatus 100c of the perforated metal foil in Embodiment 4. 変形例１～３に係る孔開き金属箔の製造方法を説明するために示す図である。FIG. 6 is a view for explaining a method for manufacturing a perforated metal foil according to Modifications 1 to 3. 変形例４に係る孔開き金属箔の製造方法を説明するために示す図である。It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 4. 変形例５に係る孔開き金属箔の製造方法を説明するために示す図である。It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 5. FIG. 従来の孔開き金属箔の製造方法を説明するために示す図である。It is a figure shown in order to demonstrate the manufacturing method of the conventional perforated metal foil.
　以下、本発明の孔開き金属箔の製造方法について、図に示す実施の形態に基づいて説明する。 Hereinafter, the manufacturing method of the perforated metal foil of the present invention will be described based on the embodiments shown in the drawings.
［実施形態１］
１．実施形態１に係る孔開き金属箔１０の製造方法
　図１は、実施形態１に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。
　図２は、実施形態１における孔開き金属箔の製造装置１００を示す図である。図２においては、図２の上図の右端の導電性基材１２が、図２の下図の左端に図示された導電性基材１２に繋がるように図示されている。
　図３は、実施形態１における絶縁層形成装置１３０により絶縁層１４が形成された導電性基材１２を示す図である。図３（ａ）は導電性基材１２の平面図であり、図３（ｂ）は図３（ａ）のＡ―Ａ断面図である。
　図４は、実施形態１における金属箔形成装置１４０により金属箔１６が電着により形成された導電性基材１２を示す図である。図４（ａ）は導電性基材１２の平面図であり、図４（ｂ）は図４（ａ）のＡ―Ａ断面図である。
　図５は、実施形態１における絶縁層除去装置１６０により絶縁層１４が除去された導電性基材１２を示す図である。図５（ａ）は導電性基材１２の平面図であり、図５（ｂ）は図５（ａ）のＡ―Ａ断面図である。
　図６は、実施形態１における金属箔剥離装置１８０により導電性基材１２から剥離された孔開き金属箔１０を示す図である。図６（ａ）は孔開き金属箔１０の平面図であり、図６（ｂ）は図６（ａ）のＡ―Ａ断面図である。 [Embodiment 1]
1. Manufacturing Method of Perforated Metal Foil 10 According to Embodiment 1 FIG. 1 is a flowchart shown for explaining a manufacturing method of a perforated metal foil according to the first embodiment.
FIG. 2 is a diagram illustrating a perforated metal foil manufacturing apparatus 100 according to the first embodiment. 2, the conductive substrate 12 at the right end of the upper diagram of FIG. 2 is illustrated so as to be connected to the conductive substrate 12 illustrated at the left end of the lower diagram of FIG.
FIG. 3 is a diagram illustrating the conductive substrate 12 on which the insulating layer 14 is formed by the insulating layer forming apparatus 130 in the first embodiment. 3A is a plan view of the conductive substrate 12, and FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A.
FIG. 4 is a diagram illustrating the conductive base material 12 in which the metal foil 16 is formed by electrodeposition using the metal foil forming apparatus 140 according to the first embodiment. 4A is a plan view of the conductive substrate 12, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A.
FIG. 5 is a diagram illustrating the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 according to the first embodiment. FIG. 5A is a plan view of the conductive substrate 12, and FIG. 5B is a cross-sectional view taken along line AA of FIG. 5A.
FIG. 6 is a view showing the perforated metal foil 10 peeled from the conductive base material 12 by the metal foil peeling device 180 according to the first embodiment. 6A is a plan view of the perforated metal foil 10, and FIG. 6B is a cross-sectional view taken along the line AA in FIG. 6A.
　実施形態１における孔開き金属箔の製造方法は、導電性基材１２の一方の表面における所定の第１領域（絶縁層１４が形成されていない領域）に金属箔１６を電着することにより多数の孔を有する孔開き金属箔１０を製造する孔開き金属箔の製造方法であって、図１に示すように、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「絶縁層除去工程Ｓ３０」、「金属箔剥離工程Ｓ４０」及び「金属箔後処理工程Ｓ５０」の各工程を含む。 A number of methods for producing a perforated metal foil in Embodiment 1 can be obtained by electrodepositing the metal foil 16 on a predetermined first region (region where the insulating layer 14 is not formed) on one surface of the conductive substrate 12. 1 is a method for producing a perforated metal foil 10 having a plurality of perforations, as shown in FIG. 1, as shown in FIG. 1, “conductive substrate preparation step S10”, “metal foil forming step S20”, “insulation” Each process of "layer removal process S30", "metal foil peeling process S40", and "metal foil post-processing process S50" is included.
　実施形態１における孔開き金属箔の製造方法においては、導電性基材１２は長尺シート状の導電性基材からなり、導電性基材１２を繰り出しロール１１０から繰り出すとともに巻き取りロール２１０で巻き取るロールツーロール（ＲＴＲ）装置により導電性基材１２を搬送しながら、孔開き金属箔１０を製造する。
　そのため、搬送されてくる導電性基材１２に対して、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「絶縁層除去工程Ｓ３０」及び「金属箔剥離工程Ｓ４０」の各工程が順次実施され、「金属箔剥離工程Ｓ４０」で導電性基材１２から剥離された孔開き金属箔１０に対して「金属箔後処理工程Ｓ５０」が実施されていく。以下、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「絶縁層除去工程Ｓ３０」、「金属箔剥離工程Ｓ４０」及び「金属箔後処理工程Ｓ５０」の各工程を詳細に説明する。 In the manufacturing method of the perforated metal foil in the first embodiment, the conductive base material 12 is made of a long sheet-like conductive base material, and the conductive base material 12 is fed from the feeding roll 110 and wound by the winding roll 210. The perforated metal foil 10 is manufactured while the conductive substrate 12 is conveyed by a roll-to-roll (RTR) apparatus.
Therefore, each of "conductive base material preparation process S10", "metal foil formation process S20", "insulating layer removal process S30", and "metal foil peeling process S40" with respect to the conductive base material 12 conveyed. The steps are sequentially performed, and the “metal foil post-processing step S50” is performed on the perforated metal foil 10 peeled from the conductive substrate 12 in the “metal foil peeling step S40”. Hereinafter, each process of "conductive base material preparation process S10", "metal foil formation process S20", "insulating layer removal process S30", "metal foil peeling process S40", and "metal foil post-processing process S50" will be described in detail. explain.
（１）導電性基材準備工程Ｓ１０
　導電性基材準備工程Ｓ１０は、導電性基材１２の一方の面における第１領域（金属箔１６を電着する領域）以外の第２領域（孔１８の位置に対応する領域）に絶縁層１４が形成された構造を有する導電性基材１２を準備する。導電性基材準備工程Ｓ１０は、「導電性基材前処理工程Ｓ１１」及び「絶縁層形成工程Ｓ１２」を含む。 (1) Conductive substrate preparation step S10
In the conductive base material preparation step S10, an insulating layer is formed in a second region (region corresponding to the position of the hole 18) other than the first region (region where the metal foil 16 is electrodeposited) on one surface of the conductive base material 12. A conductive substrate 12 having a structure in which 14 is formed is prepared. The conductive base material preparation step S10 includes “conductive base material pretreatment step S11” and “insulating layer forming step S12”.
（１－１）導電性基材前処理工程Ｓ１１
　導電性基材前処理工程Ｓ１１は、図２に示すように、繰り出しロール１１０から搬送されてくる導電性基材１２の一方の表面に対して前処理を施す工程である。導電性基材前処理工程Ｓ１１は、酸化膜除去工程、水洗工程、乾燥工程及び剥離促進膜形成工程の各工程を含む。導電性基材前処理工程Ｓ１１は、前処理装置１２０により実施され、前処理装置１２０は、エッチング液ノズル１２１、水洗ノズル１２２、エアーノズル１２３及び剥離促進剤ノズル１２４を備える。 (1-1) Conductive substrate pretreatment step S11
As shown in FIG. 2, the conductive base material pretreatment step S <b> 11 is a step of performing a pretreatment on one surface of the conductive base material 12 conveyed from the feeding roll 110. The conductive base material pretreatment step S11 includes an oxide film removing step, a water washing step, a drying step, and a peeling promotion film forming step. The conductive substrate pretreatment step S11 is performed by the pretreatment device 120, and the pretreatment device 120 includes an etching solution nozzle 121, a water washing nozzle 122, an air nozzle 123, and a peeling accelerator nozzle 124.
　酸化膜除去工程は、エッチング液ノズル１２１により実施され、搬送されてくる導電性基材１２の表面から酸化膜を除去する工程である。水洗工程は、水洗ノズル１２２により実施され、搬送されてくる導電性基材１２の表面に洗浄水を噴射する工程である。乾燥工程は、エアーノズル１２３により実施され、搬送されてくる導電性基材１２に熱風を吹付けて水洗による水滴等を除去し、導電性基材１４の表面の状態を均一化する工程である。剥離促進膜形成工程は、剥離促進剤ノズル１２４により剥離促進剤を噴射し剥離促進膜を形成する工程である。 The oxide film removing step is a step of removing the oxide film from the surface of the conductive substrate 12 carried by the etching solution nozzle 121 and transported. The water washing step is a step of spraying washing water onto the surface of the conductive substrate 12 that is carried out by the water washing nozzle 122 and conveyed. The drying step is a step that is performed by the air nozzle 123 and blows hot air to the conveyed conductive substrate 12 to remove water droplets and the like by washing with water, and uniformizes the surface state of the conductive substrate 14. . The peeling promotion film forming step is a step of forming a peeling promotion film by ejecting a peeling accelerator from the peeling accelerator nozzle 124.
　導電性基材１２は、ステンレススチールその他のスチール、黄銅、銅等の金属又は合金のフレキシブルな金属薄板からなる長尺シート状の基材で、一方の表面に耐蝕性金属めっき等の錆び止め処理が施され、他方の表面（裏面）及び両側面に非導電膜がコートされている。 The conductive base material 12 is a long sheet-like base material made of a flexible metal thin plate made of a metal such as stainless steel, other steel, brass, copper, or an alloy, and rust prevention treatment such as corrosion-resistant metal plating on one surface. The other surface (back surface) and both side surfaces are coated with a non-conductive film.
（１－２）絶縁層形成工程Ｓ１２
　絶縁層形成工程Ｓ１２は、図３に示すように、搬送されてくる導電性基材１２の一方の面における第２領域に絶縁層１４を形成する工程である。絶縁層形成工程Ｓ１２は、図２(ａ）に示すように、絶縁層形成装置１３０により実施される。
　絶縁層形成工程Ｓ１２においては、導電性基材１２の一方の表面に形成した感光層に、第１領域に不透明パターンを有するパターンマスクを介して光を照射し、当該照射による非感光部分を除去することにより絶縁層１４を形成する。 (1-2) Insulating layer forming step S12
Insulating layer formation process S12 is a process of forming insulating layer 14 in the 2nd field in one side of conductive substrate 12 conveyed, as shown in FIG. The insulating layer forming step S12 is performed by the insulating layer forming apparatus 130 as shown in FIG.
In the insulating layer forming step S12, the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region, and the non-photosensitive portion due to the irradiation is removed. Thus, the insulating layer 14 is formed.
　具体的には、絶縁層形成工程Ｓ１２においては、導電性基材１２の表面に感光層（感光性フィルム）を貼り付け、第１領域に対応した領域にのみ不透明パターンを有するパターンマスクを感光性フィルムの上方に配置し、パターンマスクの上方から感光させ、感光しなかった部分をエッチング液で除去することにより絶縁層１４を形成する。
　感光性フィルムは、感光層を間にしてその表側と裏側にカバーシートを分離可能に貼付した３層構造を有するのが好ましい。この場合、まず感光性フィルムの裏側のカバーシートを剥がし、その感光性フィルムを導電性基材１２の表面に貼り付ける。次に、表側のカバーシートを剥がし、パターンマスクを感光性フィルムの上方に配置し貼り付ける。 Specifically, in the insulating layer forming step S12, a photosensitive layer (photosensitive film) is pasted on the surface of the conductive substrate 12, and a pattern mask having an opaque pattern only in a region corresponding to the first region is photosensitive. The insulating layer 14 is formed by disposing it above the film, exposing it from above the pattern mask, and removing the unexposed portion with an etching solution.
The photosensitive film preferably has a three-layer structure in which a cover sheet is detachably attached to the front side and the back side with a photosensitive layer in between. In this case, first, the cover sheet on the back side of the photosensitive film is peeled off, and the photosensitive film is attached to the surface of the conductive substrate 12. Next, the cover sheet on the front side is peeled off, and the pattern mask is disposed and pasted above the photosensitive film.
（２）金属箔形成工程Ｓ２０
　金属箔形成工程Ｓ２０は、図４に示すように、導電性基材１２の一方の面における第１領域に金属箔１６を電着により形成する工程である。金属箔形成工程Ｓ３０は、図２（ａ）に示すように、金属箔形成装置１４０と水洗・乾燥装置１５０とにより実施される。 (2) Metal foil forming step S20
Metal foil formation process S20 is a process of forming the metal foil 16 in the 1st area | region in the one surface of the electroconductive base material 12 by electrodeposition, as shown in FIG. Metal foil formation process S30 is implemented by the metal foil formation apparatus 140 and the water washing and drying apparatus 150, as shown to Fig.2 (a).
　金属箔形成装置１４０は、いわゆる電気めっき装置であって、めっき槽１４１、陽極板１４３及び直流電源装置（図示せず）を備える。めっき槽１４１内にはめっき液１４２が貯蔵される。直流電源装置の正極は陽極板１４３に接続され、負極は導電性基板１２に接続される。直流電源装置は、陽極板１４３と導電性基板１２との間に直流電流を供給する。
　搬送されてくる導電性基材１２は、図２（ａ）に示すように、ロール２２０によってめっき槽１４１内のめっき液１４２に浸漬され、図４（ｂ）に示すように、絶縁層１４が形成されていない第１領域に電着により金属箔１６が形成される。
　金属箔１６は、絶縁層１４より薄く形成される。孔開き金属箔１０に形成される孔１８を孔開き金属箔１０の表面と裏面まで貫通した状態で垂直状に形成するためである。 The metal foil forming apparatus 140 is a so-called electroplating apparatus, and includes a plating tank 141, an anode plate 143, and a DC power supply device (not shown). A plating solution 142 is stored in the plating tank 141. The positive electrode of the DC power supply device is connected to the anode plate 143, and the negative electrode is connected to the conductive substrate 12. The DC power supply device supplies a DC current between the anode plate 143 and the conductive substrate 12.
As shown in FIG. 2A, the conveyed conductive substrate 12 is immersed in a plating solution 142 in the plating tank 141 by a roll 220, and as shown in FIG. A metal foil 16 is formed by electrodeposition in the first region that is not formed.
The metal foil 16 is formed thinner than the insulating layer 14. This is because the holes 18 formed in the perforated metal foil 10 are formed vertically in a state of penetrating the front and back surfaces of the perforated metal foil 10.
　金属箔１６の材料としては、電着可能であればどのような金属又は合金を用いることもでき、例えば、銅、アルミニウム、金、銀その他の金属又は各種合金を用いることができる。めっき液１４２は、金属箔１６の金属に対応した液を用いることができ、例えば金属箔１６の材料としてを銅を用いた場合には、硫酸銅系溶液を用いることができる。 As the material of the metal foil 16, any metal or alloy can be used as long as it can be electrodeposited. For example, copper, aluminum, gold, silver or other metals or various alloys can be used. As the plating solution 142, a solution corresponding to the metal of the metal foil 16 can be used. For example, when copper is used as the material of the metal foil 16, a copper sulfate-based solution can be used.
　水洗・乾燥装置１５０は、金属箔１６が形成された導電性基材１２の水洗及び乾燥を行う。水洗・乾燥装置１５０は、水洗ノズル１５１とエアーノズル１５２とを備え、搬送されてくる導電性基材１２を水洗ノズル１５１によって水洗し、エアーノズル１５２によって乾燥する。なお、金属箔１６が形成された導電性基材１２の状態によっては、水洗・乾燥装置１５０による水洗及び乾燥を省略してもよい。 The water washing / drying apparatus 150 performs water washing and drying of the conductive base material 12 on which the metal foil 16 is formed. The water washing / drying device 150 includes a water washing nozzle 151 and an air nozzle 152, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 151 and dried by the air nozzle 152. In addition, depending on the state of the conductive base material 12 on which the metal foil 16 is formed, water washing and drying by the water washing / drying device 150 may be omitted.
（３）絶縁層除去工程Ｓ３０
　絶縁層除去工程Ｓ３０は、金属箔形成工程Ｓ２０の後に実施され、絶縁層１４を絶縁層除去液に浸漬することにより絶縁層１４を除去する工程である（図５参照。）。絶縁層除去工程Ｓ４０は、図２（ｂ）に示すように、絶縁層除去装置１６０により行われる。 (3) Insulating layer removal step S30
The insulating layer removing step S30 is performed after the metal foil forming step S20, and is a step of removing the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removing liquid (see FIG. 5). The insulating layer removing step S40 is performed by the insulating layer removing device 160, as shown in FIG.
　絶縁層除去装置１６０は、絶縁層除去液貯留槽１６１を備え、絶縁層除去液槽１６１内には絶縁層除去液１６２が貯蔵されている。搬送されてくる導電性基材１２（一方の面に絶縁層１４及び金属箔１６が形成されている導電性基材１２）は、ロール２２０によって絶縁層除去液貯留槽１６１内の絶縁層除去液１６２に浸漬され、絶縁層１４が除去される。
　絶縁層除去液１６２は、絶縁層１４の材質に応じて適宜選択することができ、実施形態１において用いられる感光層（感光性フィルム）に対しては、酸性絶縁層除去液またはアルカリ性絶縁層除去液を用いる。絶縁層除去液１６２は、絶縁層１４を収縮や膨張させることにより、絶縁性基材１２から絶縁層１４を除去する。なお、絶縁層除去液として、絶縁層１４を溶解して除去する絶縁層除去液１６２を用いてもよい。 The insulating layer removing device 160 includes an insulating layer removing liquid storage tank 161, and the insulating layer removing liquid 162 is stored in the insulating layer removing liquid tank 161. The conductive base material 12 (the conductive base material 12 on which the insulating layer 14 and the metal foil 16 are formed on one surface) is transferred to the insulating layer removing liquid 161 in the insulating layer removing liquid storage tank 161 by the roll 220. It is immersed in 162 and the insulating layer 14 is removed.
The insulating layer removing liquid 162 can be appropriately selected according to the material of the insulating layer 14. For the photosensitive layer (photosensitive film) used in Embodiment 1, an acidic insulating layer removing liquid or an alkaline insulating layer removing liquid is used. Use liquid. The insulating layer removing liquid 162 removes the insulating layer 14 from the insulating base material 12 by contracting or expanding the insulating layer 14. As the insulating layer removing liquid, an insulating layer removing liquid 162 that dissolves and removes the insulating layer 14 may be used.
　なお、絶縁層除去装置１６０は、絶縁層１４を除去する際に絶縁層除去液１６２及び絶縁性基材１２を微振動させる微振動装置をさらに備えてもよく、また、絶縁層除去液１６２を高い温度に保つ保温・加熱装置をさらに備えてもよい。このような構成とすることにより、絶縁層１４が除去されやすくなり、絶縁層１４を確実に除去することが可能となる。 The insulating layer removing device 160 may further include a microvibration device that slightly vibrates the insulating layer removing liquid 162 and the insulating base material 12 when the insulating layer 14 is removed. You may further provide the heat retention / heating apparatus kept at high temperature. With such a configuration, the insulating layer 14 is easily removed, and the insulating layer 14 can be reliably removed.
　水洗・乾燥装置１７０は、絶縁層除去装置１６０によって絶縁層１４が除去された導電性基材１２の水洗及び乾燥を行う。水洗・乾燥装置１７０は、水洗ノズル１７１とエアーノズル１７２とを備え、搬送されてくる導電性基材１２を水洗ノズル１７１によって水洗し、エアーノズル１７２によって乾燥する。なお、絶縁層１４が除去された導電性基材１２の状態によっては、水洗・乾燥装置１７０による水洗及び乾燥を省略してもよい。 The water washing / drying device 170 performs water washing and drying of the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing device 160. The water washing / drying device 170 includes a water washing nozzle 171 and an air nozzle 172, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 171 and dried by the air nozzle 172. Depending on the state of the conductive base material 12 from which the insulating layer 14 has been removed, water washing and drying by the water washing / drying device 170 may be omitted.
（４）金属箔剥離工程Ｓ４０
　金属箔剥離工程Ｓ４０は、図６に示すように、金属箔１６を導電性基材１２から剥離する工程である。金属箔剥離工程Ｓ４０は、図２（ｂ）に図示されているように、金属箔剥離装置１８０により行われる。 (4) Metal foil peeling step S40
Metal foil peeling process S40 is a process of peeling the metal foil 16 from the electroconductive base material 12, as shown in FIG. The metal foil peeling step S40 is performed by the metal foil peeling device 180 as illustrated in FIG.
　金属箔剥離装置１８０は、上接触ロール１８１及び下接触ロール１８２並びに上分離ロール１８３及び下分離ロール１８４によって導電性基材１２から金属箔１６を剥離する。分離された金属箔１６は、孔開き金属箔１０として上分離ロール１８３によって巻き取りロール２００に向かって搬送される。一方、剥離された導電性基材１２は、下分離ロール１８４によって巻き取りロール２１０に向かって搬送され、巻き取りロール２１０に巻き取られる。巻き取りロール２１０に巻き取られた導電性基材１２は、次回以降の孔開き金属箔１０の製造の際に用いられる。 The metal foil peeling device 180 peels the metal foil 16 from the conductive substrate 12 by the upper contact roll 181 and the lower contact roll 182, and the upper separation roll 183 and the lower separation roll 184. The separated metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 as the perforated metal foil 10. On the other hand, the peeled conductive substrate 12 is conveyed toward the take-up roll 210 by the lower separation roll 184 and taken up by the take-up roll 210. The conductive base material 12 taken up by the take-up roll 210 is used when manufacturing the perforated metal foil 10 from the next time on.
　孔開き金属箔１０の厚さは、１μｍ以上のものが可能である。孔開き金属箔１０における孔１１の直径は、３０μｍ～２００μｍ、好ましくは７０～１００μｍに形成することができ、開口率は２０％～８０％、好ましくは４０％前後とすることができる。 The thickness of the perforated metal foil 10 can be 1 μm or more. The diameter of the hole 11 in the perforated metal foil 10 can be 30 to 200 μm, preferably 70 to 100 μm, and the opening ratio can be 20 to 80%, preferably about 40%.
　このように、絶縁層除去工程Ｓ３０により絶縁層１４が除去された導電性基材１２から金属箔１６を剥離することにより、孔開き金属箔１０を製造することが可能となる。この場合、金属箔剥離工程Ｓ４０においては、絶縁層１４が除去された導電性基材１２から金属箔１６を剥離することとなるため、絶縁層１４が除去されていない導電性基材１２から金属箔１６及び絶縁層１４をともに剥離する場合に比べて、小さな力で金属箔１６を剥離することが可能となる。このため、金属箔剥離工程Ｓ３０中に金属箔１６が変形し難くなることから、高い形状精度を有する孔開き金属箔１０を安定して製造することが可能となる。 Thus, the perforated metal foil 10 can be manufactured by peeling the metal foil 16 from the conductive base material 12 from which the insulating layer 14 has been removed in the insulating layer removing step S30. In this case, in the metal foil peeling step S40, the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed. Compared to the case where both the foil 16 and the insulating layer 14 are peeled off, the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform | transform during metal foil peeling process S30, it becomes possible to manufacture the perforated metal foil 10 which has a high shape precision stably.
（５）金属箔後処理工程Ｓ５０
　金属箔後処理工程Ｓ５０は、金属箔剥離工程Ｓ４０より後に、導電性基材１２から剥離された金属箔１６（孔開き金属箔１０）に対して後処理を施す工程である。金属箔後処理工程Ｓ５０は、水洗処理工程、乾燥工程及び防錆処理工程を含む。金属箔後処理工程Ｓ５０は、水洗ノズル１９１、エアーノズル１９２及び防錆剤ノズル１９３を備える金属箔後処理装置１９０により実施される。 (5) Metal foil post-processing step S50
Metal foil post-processing process S50 is a process of post-processing with respect to metal foil 16 (perforated metal foil 10) peeled from the electroconductive base material 12 after metal foil peeling process S40. The metal foil post-treatment step S50 includes a water washing treatment step, a drying step, and a rust prevention treatment step. Metal foil post-processing process S50 is implemented by the metal foil post-processing apparatus 190 provided with the water washing nozzle 191, the air nozzle 192, and the antirust agent nozzle 193.
　水洗工程は、孔開き金属箔１０の剥離の際の汚れを洗い流す工程であり、水洗ノズル１９１により実施される。乾燥工程は、孔開き金属箔１０を乾燥させるようにエアーノズル１９２により行う工程であり、エアーノズル１９２により実施される。防錆処理工程は、孔開き金属箔１０が錆びないように孔開き金属箔１０に防錆剤を塗布する防錆剤ノズル１９３により実施される。なお、金属箔後処理工程Ｓ６０は、省略することもできる。 The water washing step is a step of washing away dirt when the perforated metal foil 10 is peeled off, and is performed by the water washing nozzle 191. The drying step is a step performed by the air nozzle 192 so as to dry the perforated metal foil 10, and is performed by the air nozzle 192. The rust prevention treatment step is performed by a rust inhibitor nozzle 193 that applies a rust inhibitor to the perforated metal foil 10 so that the perforated metal foil 10 does not rust. The metal foil post-processing step S60 can be omitted.
　金属箔後処理工程Ｓ５０を施された孔開き金属箔１０は、金属箔巻き取りロール２００に巻き取られる。巻き取られた孔開き金属箔１０は、必要により、所定の形状及び大きさにプレスまたはカッタ等により切断され、二次電池の集電体、各種フィルター（気体用フィルター、液体用フィルター、抗菌用フィルター等）、印刷用スクリーン、電磁波遮蔽用シート、化学反応促進用触媒の担持体、その他の幅広い用途に使用される。 The perforated metal foil 10 subjected to the metal foil post-processing step S50 is wound around the metal foil winding roll 200. The wound perforated metal foil 10 is cut into a predetermined shape and size by a press or a cutter, if necessary, and a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial) Filters, etc.), printing screens, electromagnetic shielding sheets, carriers for supporting chemical reaction catalysts, and other wide applications.
２．実施形態１に係る孔開き金属箔の製造方法の効果
　実施形態１に係る孔開き金属箔の製造方法によれば、孔１８を形成する第２領域に絶縁層１４が形成された構造を有する導電性基材１２を準備するとともに、当該導電性基材１２に対して金属箔１６を形成することとしているため、製造過程において孔形状及び孔寸法が劣化することがなくなり、高品質な孔開き金属箔１０を安定して製造することが可能となる。 2. Effect of the method for manufacturing a perforated metal foil according to Embodiment 1 According to the method for manufacturing a perforated metal foil according to Embodiment 1, the conductive layer having the structure in which the insulating layer 14 is formed in the second region where the hole 18 is formed. In addition to preparing the conductive base material 12 and forming the metal foil 16 on the conductive base material 12, the hole shape and the hole size are not deteriorated in the manufacturing process, and a high-quality perforated metal The foil 10 can be manufactured stably.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、金属箔１６を剥離する前の導電性基材１２から絶縁層１４を除去する絶縁層除去工程を含むため、絶縁層除去工程Ｓ３０により絶縁層１４が除去された導電性基材１２から金属箔１６を剥離することにより、孔開き金属箔１０を製造することが可能となる。この場合、金属箔剥離工程Ｓ４０においては、絶縁層１４が除去された導電性基材１２から金属箔１６を剥離することとなるため、絶縁層１４が除去されていない導電性基材１２から金属箔１６及び絶縁層１４をともに剥離する場合に比べて、小さな力で金属箔１６を剥離することが可能となる。このため、金属箔剥離工程Ｓ３０中に金属箔１６が変形し難くなることから、高い形状精度を有する孔開き金属箔１０を安定して製造することが可能となる。 Moreover, according to the manufacturing method of the perforated metal foil which concerns on Embodiment 1, since the insulating layer removal process of removing the insulating layer 14 from the electroconductive base material 12 before peeling the metal foil 16 is included, an insulating layer removal process By separating the metal foil 16 from the conductive base material 12 from which the insulating layer 14 has been removed in S30, the perforated metal foil 10 can be manufactured. In this case, in the metal foil peeling step S40, the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed. Compared to the case where both the foil 16 and the insulating layer 14 are peeled off, the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform | transform during metal foil peeling process S30, it becomes possible to manufacture the perforated metal foil 10 which has a high shape precision stably.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、絶縁層１４を絶縁層除去液１６２に浸漬することにより絶縁層１４を除去する絶縁層除去工程Ｓ３０を含むため、外力をほとんど必要とせずに絶縁層１４を除去することが可能となることから、絶縁層除去工程Ｓ３０中に金属箔１６又は導電性基材１２が変形し難くなることから、高い形状精度を有する孔開き金属箔１０を安定して製造することが可能となる。
　なお、絶縁層除去液１６２としては、絶縁層１４を収縮または膨張させて絶縁層１４を除去可能な溶液でもよく、絶縁層１４を溶解除去可能な溶液でもよい。 Moreover, according to the manufacturing method of perforated metal foil which concerns on Embodiment 1, since insulating layer removal process S30 which removes the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removal liquid 162 is included, external force is hardly applied. Since it becomes possible to remove the insulating layer 14 without the necessity, the metal foil 16 or the conductive substrate 12 is hardly deformed during the insulating layer removing step S30. The foil 10 can be manufactured stably.
Note that the insulating layer removing liquid 162 may be a solution capable of removing the insulating layer 14 by contracting or expanding the insulating layer 14 or a solution capable of dissolving and removing the insulating layer 14.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、導電性基材１２の一方の表面に形成した感光層に第１領域に不透明パターンを有するパターンマスクを介して光を照射し、当該照射による非感光部分を除去して絶縁層１４を形成する絶縁層形成工程Ｓ１２を含むことから、従来から広く実施されているフォトリソグラフィの手法を用いて絶縁層１４を形成することが可能となるため、高い精度で絶縁層１４を形成することが可能となり、ひいては、高品質な孔開き金属箔１０を安定して製造することが可能となる。 In addition, according to the method for manufacturing a perforated metal foil according to the first embodiment, the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region. Since the insulating layer forming step S12 for forming the insulating layer 14 by removing the non-photosensitive portion caused by the irradiation is included, it is possible to form the insulating layer 14 using a photolithography technique that has been widely used conventionally. Therefore, it is possible to form the insulating layer 14 with high accuracy, and as a result, it is possible to stably manufacture the high-quality perforated metal foil 10.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、導電性基材前処理工程を含むため、前処理工程より後の工程、特に、絶縁層形成工程Ｓ１２、金属箔形成工程Ｓ２０、金属箔剥離工程Ｓ３０などを良好に行うことができる。前処理には、例えば、導電性基材１２から酸化膜を除去する処理や、導電性基材１２に対する水洗、乾燥又は剥離促進膜形成を行うことが含まれる。前処理として導電性基材１２から酸化膜を除去する処理を行う場合には、絶縁層１４を形成し易い、また、金属箔１６を電着により形成し易いという効果が得られる。前処理として導電性基材１２に対する水洗を行う場合には、導電性基材１２の表面に付着した酸化膜除去剤や汚れを洗い流すことが可能となるという効果が得られる。前処理として乾燥を行う場合には導電性基材１２の表面の状態を均一化できるという効果が得られる。前処理として導電性基材１２の表面に剥離促進膜を形成する場合には、電着された金属箔を小さな力で容易に剥離することが可能となる。 Moreover, according to the manufacturing method of the perforated metal foil which concerns on Embodiment 1, since a conductive base material pre-processing process is included, the process after a pre-processing process, especially insulating layer formation process S12, metal foil formation process S20 The metal foil peeling step S30 can be performed satisfactorily. The pretreatment includes, for example, a process of removing the oxide film from the conductive substrate 12 and a water washing, drying, or peeling promotion film formation on the conductive substrate 12. When the treatment for removing the oxide film from the conductive base material 12 is performed as the pretreatment, it is possible to obtain an effect that the insulating layer 14 is easily formed and the metal foil 16 is easily formed by electrodeposition. In the case where the conductive substrate 12 is washed with water as a pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate 12. When drying is performed as a pretreatment, the effect that the surface state of the conductive substrate 12 can be made uniform can be obtained. When a peeling promoting film is formed on the surface of the conductive substrate 12 as a pretreatment, the electrodeposited metal foil can be easily peeled off with a small force.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、ロールツーロール（ＲＴＲ）装置により導電性基材１２を搬送しながら孔開き金属箔１０を製造するため、ＲＴＲ装置により導電性基材１２を搬送中に、当該導電性基材１２に対して所定工程を連続して実施することが可能となる。このため、高い生産性で孔開き金属箔１０を製造することが可能となる。 Moreover, according to the manufacturing method of the perforated metal foil which concerns on Embodiment 1, in order to manufacture the perforated metal foil 10 while conveying the electroconductive base material 12 with a roll-to-roll (RTR) apparatus, it is conductive with an RTR apparatus. While the base material 12 is being transported, it is possible to continuously perform a predetermined process on the conductive base material 12. For this reason, it becomes possible to manufacture the perforated metal foil 10 with high productivity.
　また、実施形態１に係る孔開き金属箔の製造方法によれば、金属箔後処理工程Ｓ５０を含むため、金属箔剥離工程Ｓ４０により剥離された孔開き金属箔１０の状態を良好な状態に維持することが可能となる。金属箔後処理工程Ｓ５０には、例えば、水洗工程、乾燥工程、防錆膜形成工程などが含まれる。後工程として水洗工程を行う場合には孔開き金属箔１０に付着した汚れを洗い流すことが可能となる。後工程として乾燥工程を行う場合には孔開き金属箔１０の表面の状態を均一化できるという効果を得ることが可能となる。 Moreover, according to the manufacturing method of perforated metal foil which concerns on Embodiment 1, since the metal foil post-processing process S50 is included, the state of the perforated metal foil 10 peeled by metal foil peeling process S40 is maintained in a favorable state. It becomes possible to do. The metal foil post-processing step S50 includes, for example, a water washing step, a drying step, a rust prevention film forming step, and the like. When performing the water washing process as a post process, it becomes possible to wash away the dirt adhering to the perforated metal foil 10. When performing a drying process as a post process, it becomes possible to obtain an effect that the surface state of the perforated metal foil 10 can be made uniform.
［実施形態２］
　図７は、実施形態２に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。
　図８は、実施形態２における孔開き金属箔の製造装置１００ａを示す図である。図８は、実施形態２における孔開き金属箔の製造装置１００ａを示す図である。図８においては、図８の上図の右端の導電性基材１２ａが、図８の下図の左端に図示された導電性基材１２ａに繋がるように図示されている。
　図９は、実施形態２における金属箔剥離装置１８０により導電性基材１２ａから剥離された孔開き金属箔１０ａを示す図である。
　図１０は、実施形態２における絶縁層除去装置１６０により絶縁層１４が除去された孔開き金属箔１０ａを示す図である。 [Embodiment 2]
FIG. 7 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the second embodiment.
FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment. FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment. 8, the conductive substrate 12a at the right end of the upper diagram of FIG. 8 is illustrated so as to be connected to the conductive substrate 12a illustrated at the left end of the lower diagram of FIG.
FIG. 9 is a view showing the perforated metal foil 10a peeled from the conductive base material 12a by the metal foil peeling device 180 according to the second embodiment.
FIG. 10 is a view showing the perforated metal foil 10a from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 in the second embodiment.
　実施形態２に係る孔開き金属箔の製造方法は、基本的には実施形態１に係る孔開き金属箔の製造方法と同様の工程を含むが、「絶縁層除去工程Ｓ３０」と「金属箔剥離工程Ｓ４０」とを実施する順序が実施形態１に係る孔開き金属箔の製造方法の場合と異なる。すなわち、実施形態２に係る孔開き金属箔の製造方法においては、図７に示すように、金属箔剥離工程Ｓ４０より後に絶縁層除去工程Ｓ３０を実施し、絶縁層除去工程Ｓ３０においては、導電性基材１２ａから剥離した後の孔開き金属箔１０ａから絶縁層１４を除去する。 The manufacturing method of the perforated metal foil according to the second embodiment basically includes the same steps as the manufacturing method of the perforated metal foil according to the first embodiment, but “insulating layer removing step S30” and “metal foil peeling”. The order in which “step S40” is performed is different from that in the method of manufacturing the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the second embodiment, as shown in FIG. 7, the insulating layer removing step S30 is performed after the metal foil peeling step S40. The insulating layer 14 is removed from the perforated metal foil 10a after being peeled from the substrate 12a.
　実施形態２に係る孔開き金属箔の製造方法においては、搬送されてくる導電性基材１２ａに対して、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「金属箔剥離工程Ｓ１００」の各工程が順次実施されていく。また、「金属箔剥離工程Ｓ４０」で導電性基材１２ａから剥離された孔開き金属箔１０ａに対して、「絶縁層除去工程Ｓ４０」及び「金属箔後処理工程Ｓ５０」の各工程が順次実施されていく。 In the manufacturing method of the perforated metal foil according to the second embodiment, the “conductive base material preparation step S10”, “metal foil formation step S20”, “metal foil peeling” are performed on the conductive base material 12a being conveyed. Each step of “Step S100” is sequentially performed. Moreover, each process of "insulating layer removal process S40" and "metal foil post-processing process S50" is sequentially performed with respect to the perforated metal foil 10a peeled off from the conductive substrate 12a in the "metal foil peeling process S40". It will be done.
　実施形態２における孔開き金属箔の製造装置１００ａにおいては、図８に示すように、絶縁層除去装置１６０は、金属箔剥離装置１８０の後段に配置されている。 In the perforated metal foil manufacturing apparatus 100a according to the second embodiment, as shown in FIG. 8, the insulating layer removing apparatus 160 is arranged at the subsequent stage of the metal foil peeling apparatus 180.
　金属箔剥離工程Ｓ４０においては、図９に示すように、絶縁層１４及び金属箔１６を導電性基材１２ａから剥離する。剥離された金属箔１６は、孔開き金属箔１０ａとして絶縁層１４が付着したまま上分離ロール１８３によって巻き取りロール２００に向かって搬送される。
　絶縁層除去工程Ｓ３０においては、図１０に示すように、孔開き金属箔１０ａから絶縁層１４を除去する。搬送されてくる孔開き金属箔１０ａ（絶縁層１４が付着している孔開き金属箔１０ａ）は、ロール２２０によって絶縁層除去液貯留槽１６１内の絶縁層除去液１６２に浸漬され、絶縁層１４が除去される。絶縁層除去液１６２は実施形態１における絶縁層除去液１６２と同様のものを用いることができる。 In metal foil peeling process S40, as shown in FIG. 9, the insulating layer 14 and the metal foil 16 are peeled from the electroconductive base material 12a. The peeled metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 with the insulating layer 14 attached as the perforated metal foil 10a.
In the insulating layer removing step S30, as shown in FIG. 10, the insulating layer 14 is removed from the perforated metal foil 10a. The perforated metal foil 10a (perforated metal foil 10a to which the insulating layer 14 is attached) conveyed is immersed in the insulating layer removing liquid 162 in the insulating layer removing liquid storage tank 161 by the roll 220, so that the insulating layer 14 Is removed. As the insulating layer removing liquid 162, the same insulating layer removing liquid 162 as that in Embodiment 1 can be used.
　実施形態２に係る孔開き金属箔の製造方法によれば、実施形態１の場合と比較して絶縁層１４が絶縁層除去液１６２と接触する面積が大きくなり、孔開き金属箔１０ａから効率よく絶縁層１４を除去することが可能となる。 According to the method for manufacturing a perforated metal foil according to the second embodiment, the area where the insulating layer 14 comes into contact with the insulating layer removing liquid 162 is increased as compared with the case of the first embodiment, and the perforated metal foil 10a is efficiently used. The insulating layer 14 can be removed.
　また、実施形態２に係る孔開き金属箔の製造方法によれば、金属箔剥離工程Ｓ４０により導電性基材１２から剥離した後の金属箔１６から絶縁層１４を除去することにより、孔開き金属箔を製造することが可能となる。 Moreover, according to the manufacturing method of the perforated metal foil which concerns on Embodiment 2, a perforated metal is removed by removing the insulating layer 14 from the metal foil 16 after peeling from the electroconductive base material 12 by metal foil peeling process S40. A foil can be manufactured.
　なお、実施形態２に係る孔開き金属箔の製造方法は、「絶縁層除去工程Ｓ３０」と「金属箔剥離工程Ｓ４０」とを実施する順番以外は実施形態１に係る孔開き金属箔の製造方法の場合と同様の工程を含むため、実施形態１に係る孔開き金属箔の製造方法が有する効果のうち該当する効果を有する。 In addition, the manufacturing method of perforated metal foil which concerns on Embodiment 2 is the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the order which implements "insulation layer removal process S30" and "metal foil peeling process S40". Since the same process as in the above case is included, it has a corresponding effect among the effects of the method for manufacturing a perforated metal foil according to the first embodiment.
［実施形態３］
　図１１は、実施形態３に係る孔開き金属箔の製造方法を説明するために示すフローチャートである。
　図１２は、実施形態３における孔開き金属箔の製造装置１００ｂを示す図である。図１２においては、図１２の上図の右端の導電性基材１２ｂが、図１２の下図の左端に図示された導電性基材１２ｂに繋がるように図示されている。 [Embodiment 3]
FIG. 11 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the third embodiment.
FIG. 12 is a view showing a perforated metal foil manufacturing apparatus 100b according to the third embodiment. In FIG. 12, the conductive substrate 12b at the right end of the upper diagram of FIG. 12 is illustrated so as to be connected to the conductive substrate 12b illustrated at the left end of the lower diagram of FIG.
　実施形態３に係る孔開き金属箔の製造方法は、基本的には実施形態１に係る孔開き金属箔の製造方法と同様の工程を含むが、絶縁層除去工程を２回実施する点で実施形態１に係る孔開き金属箔の製造方法の場合と異なる。すなわち、実施形態３に係る孔開き金属箔の製造方法においては、図１１に示すように、絶縁層除去工程は、金属箔剥離工程Ｓ４０より前に絶縁層１４を除去する絶縁層除去工程Ｓ３０（第１絶縁層除去工程Ｓ３０）と、金属箔剥離工程Ｓ４０より後に絶縁層１４を除去する第２絶縁層除去工程Ｓ６０とを含む。第１絶縁層除去工程Ｓ３０においては、金属箔１６を剥離する前の導電性基材１２ｂから絶縁層１４を除去し、第２絶縁層除去工程Ｓ６０においては、導電性基材１２ｂから剥離した後の金属箔（孔開き金属箔１０ｂ）から絶縁層１４を除去する。 The perforated metal foil manufacturing method according to the third embodiment basically includes the same steps as the perforated metal foil manufacturing method according to the first embodiment, but is performed in that the insulating layer removing step is performed twice. It differs from the case of the manufacturing method of the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the third embodiment, as shown in FIG. 11, the insulating layer removing step is an insulating layer removing step S30 (in which the insulating layer 14 is removed before the metal foil peeling step S40 ( A first insulating layer removing step S30) and a second insulating layer removing step S60 for removing the insulating layer 14 after the metal foil peeling step S40. In the first insulating layer removing step S30, the insulating layer 14 is removed from the conductive base material 12b before peeling the metal foil 16, and in the second insulating layer removing step S60, after peeling from the conductive base material 12b. The insulating layer 14 is removed from the metal foil (perforated metal foil 10b).
　実施形態３に係る孔開き金属箔の製造方法においては、搬送されてくる導電性基材１２ｂに対して、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「第１絶縁層除去工程Ｓ３０」及び「金属箔剥離工程Ｓ４０」の各工程が順次実施されていく。また、「金属箔剥離工程Ｓ４０」で導電性基材１２ｂから剥離された孔開き金属箔１０ｂに対して、「第２絶縁層除去工程Ｓ６０」、「金属箔後処理工程Ｓ５０」の各工程が順次実施されていく。すなわち、実施形態３に係る孔開き金属箔の製造方法は、縁層除去工程Ｓ３０と絶縁層除去工程Ｓ６０の両者を行うものである。 In the manufacturing method of the perforated metal foil according to the third embodiment, the “conductive base material preparation step S10”, “metal foil formation step S20”, “first insulation” are performed on the conductive base material 12b being conveyed. Each step of “layer removal step S30” and “metal foil peeling step S40” is sequentially performed. Moreover, each process of "2nd insulating layer removal process S60" and "metal foil post-processing process S50" with respect to the perforated metal foil 10b peeled from the electroconductive base material 12b by "metal foil peeling process S40" is carried out. It will be implemented sequentially. That is, the perforated metal foil manufacturing method according to the third embodiment performs both the edge layer removing step S30 and the insulating layer removing step S60.
　実施形態３における孔開き金属箔の製造装置１００ｂにおいて、図１２に示すように、絶縁層除去装置１６０が、金属箔剥離装置１８０の前段及び後段にそれぞれ配置されている。 In the perforated metal foil manufacturing apparatus 100b according to the third embodiment, as shown in FIG. 12, the insulating layer removing apparatus 160 is arranged at the front stage and the rear stage of the metal foil peeling apparatus 180, respectively.
　実施形態３に係る孔開き金属箔の製造方法によれば、第１絶縁層除去工程Ｓ３０により導電性基材１２ｂから絶縁層１４を除去し、金属箔剥離工程Ｓ４０により導電性基材１２ｂから金属箔１６を剥離するとともに、第２絶縁層除去工程Ｓ６０により孔開き金属箔１０ｂから絶縁層１４を除去することにより、孔開き金属箔１０ｂを製造することが可能となる。この場合、第１絶縁層除去工程Ｓ３０後に金属箔１６に絶縁層１４が残存していたとしても、第２絶縁層除去工程Ｓ６０中に、当該残存している絶縁層１４を確実に除去することが可能となる。このため、絶縁層１４がより完全に除去された清浄で高品質な孔開き金属箔１０ｂを製造することが可能となる。 According to the method for manufacturing a perforated metal foil according to the third embodiment, the insulating layer 14 is removed from the conductive base material 12b by the first insulating layer removing step S30, and the metal from the conductive base material 12b by the metal foil peeling step S40. It is possible to manufacture the perforated metal foil 10b by peeling the foil 16 and removing the insulating layer 14 from the perforated metal foil 10b in the second insulating layer removing step S60. In this case, even if the insulating layer 14 remains on the metal foil 16 after the first insulating layer removing step S30, the remaining insulating layer 14 is surely removed during the second insulating layer removing step S60. Is possible. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil 10b from which the insulating layer 14 has been removed more completely.
　なお、実施形態３に係る孔開き金属箔１０ｂの製造方法は、絶縁層除去工程を２回実施形する以外は実施形態１に係る孔開き金属箔の製造方法の場合と同様の構成を有するため、実施形態１に係る孔開き金属箔の製造方法が有する効果のうち該当する効果を有する。 In addition, since the manufacturing method of perforated metal foil 10b which concerns on Embodiment 3 has the structure similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except performing an insulating layer removal process twice. In addition, the perforated metal foil manufacturing method according to the first embodiment has a corresponding effect among the effects of the method.
［実施形態４］
　図１３は、実施形態４における孔開き金属箔の製造装置１００ｃを示す図である。    [Embodiment 4]
FIG. 13 is a view showing a perforated metal foil manufacturing apparatus 100 c according to the fourth embodiment.
　実施形態４に係る孔開き金属箔の製造方法は、基本的には実施形態１に係る孔開き金属箔の製造方法と同様の工程を含むが、用いる導電性基材の構成が実施形態１に係る孔開き金属箔の製造方法の場合と異なる。すなわち、実施形態４に係る孔開き金属箔の製造方法においては、図１３に示すように、導電性基材はエンドレスベルト状の導電性基材１２ｃからなり、複数のロールを備えるロール装置により導電性基材１２ｃを連続的に搬送しながら孔開き金属箔１０ｃを製造する。 The method for manufacturing a perforated metal foil according to the fourth embodiment basically includes the same steps as the method for manufacturing the perforated metal foil according to the first embodiment, but the configuration of the conductive base material used is the same as that of the first embodiment. It differs from the case of the manufacturing method of the perforated metal foil. That is, in the method for manufacturing a perforated metal foil according to Embodiment 4, as shown in FIG. 13, the conductive base material is composed of an endless belt-like conductive base material 12 c and is conductive by a roll device including a plurality of rolls. The perforated metal foil 10c is manufactured while continuously transporting the conductive substrate 12c.
　実施形態４における孔開き金属箔の製造装置１００ｃは、導電性基材１２ｃをエンドレスに回動させるため互いに離れた位置に配置された駆動ロール３５０及び従動ロール３６０と、導電性基材１２ｃに対して絶縁層形成工程Ｓ１２を行う絶縁層形成装置１３０と、金属箔形成工程Ｓ２０を行う金属箔形成装置１４０と、絶縁層除去工程Ｓ３０を行う絶縁層除去装置１６０と、金属箔剥離工程Ｓ４０を行う金属箔剥離装置１８０ｃと、金属箔剥離装置１８０ｃで剥離された孔開き金属箔１０ｃを巻き取る金属箔巻き取りロール２００とを備える。なお、駆動ロール３５０、従動ロール３６０、従動ロール３６０及び駆動ロール３５０を回転駆動するモータ（図示せず）によりロール装置を構成する。 The manufacturing apparatus 100c for perforated metal foil in the fourth embodiment is based on the drive roll 350 and the driven roll 360 that are disposed at positions separated from each other in order to endlessly rotate the conductive base 12c, and the conductive base 12c. The insulating layer forming apparatus 130 that performs the insulating layer forming process S12, the metal foil forming apparatus 140 that performs the metal foil forming process S20, the insulating layer removing apparatus 160 that performs the insulating layer removing process S30, and the metal foil peeling process S40 are performed. A metal foil peeling device 180c and a metal foil winding roll 200 for winding the perforated metal foil 10c peeled by the metal foil peeling device 180c are provided. In addition, a roll apparatus is comprised by the motor (not shown) which rotationally drives the drive roll 350, the driven roll 360, the driven roll 360, and the drive roll 350. FIG.
　実施形態４に係る孔開き金属箔の製造方法によれば、ロール装置により導電性基材１２ｃを搬送中に、当該導電性基材１２ｃに対して所定工程を連続して実施することが可能となる。このため、高い生産性で孔開き金属箔１０ｃを製造することが可能となる。エンドレスベルト状の導電性基材は、一連の工程が終了すると最初の工程位置に戻るため、完全自動化が実現し、作業効率をより高くすることが可能となる。 According to the method for manufacturing a perforated metal foil according to the fourth embodiment, it is possible to continuously perform a predetermined process on the conductive base material 12c while the conductive base material 12c is being conveyed by the roll device. Become. For this reason, it becomes possible to manufacture the perforated metal foil 10c with high productivity. Since the endless belt-like conductive base material returns to the initial process position after a series of processes is completed, full automation can be realized and work efficiency can be further increased.
　なお、実施形態４に係る孔開き金属箔の製造方法は、用いる導電性基材の構成以外は実施形態１に係る孔開き金属箔の製造方法の場合と同様の工程を含むため、実施形態１に係る孔開き金属箔の製造方法が有する効果のうち該当する効果を有する。 In addition, since the manufacturing method of perforated metal foil which concerns on Embodiment 4 includes the process similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the structure of the electroconductive base material to be used, Embodiment 1 It has the effect applicable among the effects which the manufacturing method of the perforated metal foil which concerns on has.
　以上、本発明を上記各実施形態に基づいて説明したが、本発明は上記各実施形態に限定されるものではない。その趣旨を逸脱しない範囲において種々の態様で実施することが可能であり、例えば、次のような変形も可能となる。 As mentioned above, although this invention was demonstrated based on said each embodiment, this invention is not limited to said each embodiment. The present invention can be implemented in various modes without departing from the spirit thereof, and for example, the following modifications are possible.
（１）上記各実施形態において、導電性基材として、金属製又は合金製のフレキシブルな長尺シート状の基材を用いたが、本発明はこれらに限定されるものではない。表面が導電性を呈するものであれば種々の基材を用いることができる。例えば、プラスチック等の非導電性基材の表面に導電膜を被覆して構成した導電性基材を用いることもできる。この場合、導電性基材の裏面及び両側面を非導電性部材でマスクする必要がなくなる。好適には、ポリイミドテープ基材の表面に銅箔をラミネートして導電性基材としたものを用いることができる。また、剛体の導電性基材を用いてもよく、短冊状の導電性基材を用いてもよい。 (1) In each of the above embodiments, a metal or alloy flexible long sheet-like base material was used as the conductive base material, but the present invention is not limited thereto. Various substrates can be used as long as the surface exhibits conductivity. For example, a conductive substrate formed by coating a conductive film on the surface of a non-conductive substrate such as plastic can be used. In this case, it is not necessary to mask the back surface and both side surfaces of the conductive substrate with a non-conductive member. Suitably, the thing which laminated the copper foil on the surface of the polyimide tape base material, and made it the electroconductive base material can be used. Further, a rigid conductive substrate may be used, or a strip-shaped conductive substrate may be used.
（２）上記各実施形態において、いわゆるフォトリソグラフィの手法を用いて絶縁層を本発明の孔開き金属箔の製造方法を説明したが、本発明はこれに限定されるものではない。例えば、導電性基材の一方の表面における第２領域に印刷を施して絶縁層を形成する絶縁層形成工程を用いてもよい。このような工程とすることにより、絶縁層１４を容易かつ確実に形成することができる。印刷に用いる絶縁層形成剤は、加熱又は紫外線照射等により硬化させることが好適である。印刷方法としては、スクリーン印刷、インクジェット印刷又はロールコーター印刷が好適である。 (2) In each of the above-described embodiments, the method for producing a perforated metal foil of the present invention was described by using a so-called photolithography technique, but the present invention is not limited to this. For example, you may use the insulating layer formation process which prints to the 2nd area | region in one surface of an electroconductive base material, and forms an insulating layer. By setting it as such a process, the insulating layer 14 can be formed easily and reliably. The insulating layer forming agent used for printing is preferably cured by heating or ultraviolet irradiation. As the printing method, screen printing, ink jet printing, or roll coater printing is suitable.
（３）上記各実施形態において、絶縁層１４よりも薄い金属箔１６を電着により形成することとしたが、本発明はこれらに限定されるものではない。図１４は、変形例１～３に係る孔開き金属箔の製造方法を説明するために示す図である。図１４（ａ）は絶縁層１４ｄとほぼ同じ厚さの金属箔１６ｄを電着により形成する様子を示す図であり（変形例１）、図１４（ｂ）は絶縁層１４ｅよりも厚い金属箔１６ｅを電着により形成する様子を示す図であり（変形例２）、図１４（ｃ）はテーパ状の絶縁層１４ｆを形成するとともに当該絶縁層１４ｆよりも薄い金属箔１６ｆを電着により形成する様子を示す図である（変形例３）。 (3) In each of the above embodiments, the metal foil 16 thinner than the insulating layer 14 is formed by electrodeposition, but the present invention is not limited to these. FIG. 14 is a view for explaining the method of manufacturing the perforated metal foil according to the first to third modifications. FIG. 14A is a diagram showing a state in which a metal foil 16d having substantially the same thickness as the insulating layer 14d is formed by electrodeposition (Modification 1), and FIG. 14B is a metal foil thicker than the insulating layer 14e. FIG. 14C is a diagram showing a state in which 16e is formed by electrodeposition (Modification 2), and FIG. 14C shows a tapered insulating layer 14f and a metal foil 16f thinner than the insulating layer 14f by electrodeposition. It is a figure which shows a mode that it does (Modification 3).
　絶縁層１４ｄとほぼ同じ厚さの金属箔１６ｄを電着により形成した場合には、絶縁層１４ｄよりも薄い金属箔１６ｄを電着により形成する場合よりも、絶縁層除去液により絶縁層１４ｄを除去するのが容易になる。絶縁層１４ｅよりも厚い金属箔１６ｅを電着により形成した場合には、絶縁層１４ｄよりも薄い金属箔１６ｄを電着により形成する場合よりも、金属箔１６ｅが絶縁層１４ｅを覆った構造を有するため、金属箔１６ｅと絶縁層１４ｅとの接合強度を高めることが可能となり、実施形態２又は３の場合のように金属箔１６ｅと絶縁層１４ｅとを一体的に導電性基材から剥離することが容易となる。また、テーパ状の絶縁層１４ｆを形成するとともに当該絶縁層１４ｆよりも薄い金属箔１６ｆを電着により形成する場合には、絶縁層１４ｆを除去し易くなる。 When the metal foil 16d having substantially the same thickness as the insulating layer 14d is formed by electrodeposition, the insulating layer 14d is formed by the insulating layer removing liquid, compared with the case where the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Easy to remove. When the metal foil 16e thicker than the insulating layer 14e is formed by electrodeposition, the metal foil 16e covers the insulating layer 14e than when the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Therefore, the bonding strength between the metal foil 16e and the insulating layer 14e can be increased, and the metal foil 16e and the insulating layer 14e are integrally peeled from the conductive substrate as in the second or third embodiment. It becomes easy. In addition, when the tapered insulating layer 14f is formed and the metal foil 16f thinner than the insulating layer 14f is formed by electrodeposition, the insulating layer 14f can be easily removed.
　絶縁層１４ｆのテーパー状側面の形成は、例えば次の様に行う。まず導電性基材１２における第２領域のみに１層目の絶縁層１４ｆ'を形成し、次に１層目の絶縁層１４ｆ'よりも小さくなるような２層目の絶縁層１４ｆ''を形成する。以上の作業を繰り返すことにより、側面がテーパー状の絶縁層１４ｆが形成される。 For example, the tapered side surface of the insulating layer 14f is formed as follows. First, a first insulating layer 14f ′ is formed only in the second region of the conductive substrate 12, and then a second insulating layer 14f ″ that is smaller than the first insulating layer 14f ′ is formed. Form. By repeating the above operation, the insulating layer 14f having a tapered side surface is formed.
（４）上記実施形態１～３においては、各工程を１つのＲＴＲ装置内で一連の工程として実施するようにしたが、本発明はこれらに限定されるものではない。図１５は、変形例４に係る孔開き金属箔の製造方法を説明するために示す図である。図１６は、変形例５に係る孔開き金属箔の製造方法を説明するために示す図である。
　例えば、図１５に示すように、「導電性基材準備工程Ｓ１０」の工程を第１のＲＴＲ装置２３０で実施し、その後、「金属箔形成工程Ｓ２０」、「絶縁層除去工程Ｓ３０」及び「金属箔剥離工程Ｓ４０」の各工程を別の工程として第２のＲＴＲ装置２５０で実施するようにしてもよい（変形例４）。
　また、図１６に示すように、「導電性基材準備工程Ｓ１０」、「金属箔形成工程Ｓ２０」、「絶縁層除去工程Ｓ３０」及び「金属箔剥離工程Ｓ４０」をそれぞれ別々の工程とし、第１のＲＴＲ装置２３０、第３のＲＴＲ装置２７０、第４のＲＴＲ装置３００及び第５のＲＴＲ装置３３０でそれぞれ実施するようにしてもよい。 (4) In the first to third embodiments, each step is performed as a series of steps in one RTR apparatus, but the present invention is not limited to these. FIG. 15 is a view for explaining the method for manufacturing the perforated metal foil according to the fourth modification. FIG. 16 is a view for explaining the method for manufacturing the perforated metal foil according to the fifth modification.
For example, as shown in FIG. 15, the process of “conductive substrate preparation process S10” is performed by the first RTR device 230, and thereafter, “metal foil formation process S20”, “insulating layer removal process S30” and “ You may make it implement each process of metal foil peeling process S40 "with the 2nd RTR apparatus 250 as another process (modification 4).
Also, as shown in FIG. 16, the “conductive substrate preparation step S10”, the “metal foil forming step S20”, the “insulating layer removing step S30” and the “metal foil peeling step S40” are respectively separate steps. The first RTR device 230, the third RTR device 270, the fourth RTR device 300, and the fifth RTR device 330 may each be implemented.
（５）上記各実施形態においては、導電性基材前処理工程Ｓ１１及び金属箔後処理工程Ｓ５０を実施したが、本発明はこれに限定されるものではない。導電性基材の表面状態及び材質により導電性基材前処理工程Ｓ１１の一部または全部を省略してもよい。また孔開き金属箔の状態または材質によっては、金属箔後処理工程Ｓ５０の一部または全部を省略してもよい。同様に、導電性基材又は金属箔の状態によっては、金属箔形成工程Ｓ３０及び絶縁層除去工程Ｓ４０の後の水洗・乾燥装置１５０、１７０による水洗工程及び乾燥工程を省略してもよい。 (5) In each said embodiment, although electroconductive base material pre-processing process S11 and metal foil post-processing process S50 were implemented, this invention is not limited to this. Depending on the surface state and material of the conductive substrate, part or all of the conductive substrate pretreatment step S11 may be omitted. Depending on the state or material of the perforated metal foil, part or all of the metal foil post-processing step S50 may be omitted. Similarly, depending on the state of the conductive substrate or the metal foil, the water washing step and the drying step by the water washing / drying apparatuses 150 and 170 after the metal foil forming step S30 and the insulating layer removing step S40 may be omitted.
（６）上記各実施形態においては、絶縁層除去液を用いて絶縁層を除去したが、本発明はこれに限定されるものではない。絶縁層を機械的または熱的に除去する絶縁層除去工程を用いて絶縁層を除去してもよい。機械的に除去する絶縁層除去工程としては、例えば、絶縁層をブラシでブラッシングする、あるいは絶縁層に超音波振動を加えることにより、絶縁層を導電性基材または金属箔から剥離して除去する工程としてもよいし、微小ドリルまたは微小カッタで絶縁層を削除する工程としてもよい。熱的に除去する絶縁層除去工程としては、例えばヒータ熱を加えて絶縁層を熔解除去する工程としてもよいし、レーザ光を照射して絶縁層を熔解除去する工程としてもよい。また、上記の方法を適宜組み合わせてもよい。 (6) In each of the above embodiments, the insulating layer is removed using the insulating layer removing solution, but the present invention is not limited to this. The insulating layer may be removed using an insulating layer removing step that mechanically or thermally removes the insulating layer. As the insulating layer removing step for mechanically removing, for example, the insulating layer is brushed with a brush, or by applying ultrasonic vibration to the insulating layer, the insulating layer is peeled off from the conductive substrate or the metal foil and removed. It is good also as a process, and it is good also as a process of deleting an insulating layer with a micro drill or a micro cutter. The insulating layer removing step for removing thermally may be, for example, a step for dissolving and removing the insulating layer by applying heater heat, or a step for dissolving and removing the insulating layer by irradiating laser light. Moreover, you may combine said method suitably.
１０、１０ａ、１０ｂ、１０ｃ、１０ｄ、１０ｅ…孔開き金属箔、１２、１２ａ、１２ｂ、１２ｃ、１２ｄ、１２ｅ…導電性基材、１４、１４ｄ、１４ｅ、１４ｆ…絶縁層、１６、１６ｄ、１６ｅ、１６ｆ…金属箔、１８…孔、１００、１００ａ、１００ｂ、１００ｃ、１００ｇ、１００ｈ…孔開き金属箔の製造装置、１１０、２６０、２８０、３１０、３４０…繰り出しロール、１２０…導電性基材前処理装置、１２１…エッチング液ノズル、１２２、１５１、１７１、１９１、３７２…水洗ノズル、１２３、１５２、１７２、１９２、３７３…エアーノズル、１２４…剥離促進剤ノズル、１３０…絶縁層形成装置、１４０…金属箔形成装置、１４１…めっき槽、１４２…めっき液、１４３…陽極板、１５０、１７０…水洗・乾燥装置、１６０…絶縁層除去装置、１６１…絶縁層除去液貯留槽、１６２…絶縁層除去液、１８０、１８０ｅ…金属箔剥離装置、１８１…上接触ロール、１８２…下接触ロール、１８３…上分離ロール、１８４…下分離ロール、１９０…金属箔後処理装置、１９３…防錆剤ノズル、２００…金属箔巻き取りロール、２１０、２４０、２９０、３２０…巻き取りロール、２２０・・ロール、２３０…第１のＲＴＲ装置、２５０…第２のＲＴＲ装置、２７０…第３のＲＴＲ装置、３００…第４のＲＴＲ装置、３３０…第５のＲＴＲ装置、３５０…駆動ロール、３６０…従動ロール、９００…電鋳システム、９１０…金属箔、９２０…めっき槽、９２１…めっき液、９２２…アノード、９３０…カソードドラム、９３０ａ…カソードドラムの下半分、９３１…レジスト、９４０…巻き取りロール、９５０…矢印 10, 10a, 10b, 10c, 10d, 10e ... perforated metal foil, 12, 12a, 12b, 12c, 12d, 12e ... conductive substrate, 14, 14d, 14e, 14f ... insulating layer, 16, 16d, 16e , 16f ... metal foil, 18 ... hole, 100, 100a, 100b, 100c, 100g, 100h ... perforated metal foil manufacturing apparatus, 110, 260, 280, 310, 340 ... feeding roll, 120 ... in front of conductive substrate Processing apparatus, 121 ... Etching solution nozzle, 122, 151, 171, 191, 372 ... Washing nozzle, 123, 152, 172, 192, 373 ... Air nozzle, 124 ... Stripping accelerator nozzle, 130 ... Insulating layer forming apparatus, 140 ... Metal foil forming device, 141 ... Plating tank, 142 ... Plating solution, 143 ... Anode plate, 150, 170 ... Washing / drying device, 1 DESCRIPTION OF SYMBOLS 0 ... Insulating layer removal apparatus, 161 ... Insulating layer removal liquid storage tank, 162 ... Insulating layer removal liquid, 180, 180e ... Metal foil peeling apparatus, 181 ... Upper contact roll, 182 ... Lower contact roll, 183 ... Upper separation roll, 184 ... Lower separation roll, 190 ... Metal foil post-processing device, 193 ... Rust preventive nozzle, 200 ... Metal foil winding roll, 210, 240, 290, 320 ... Winding roll, 220 ... roll, 230 ... 1st RTR device, 250 ... second RTR device, 270 ... third RTR device, 300 ... fourth RTR device, 330 ... fifth RTR device, 350 ... drive roll, 360 ... driven roll, 900 ... electroforming System, 910 ... Metal foil, 920 ... Plating tank, 921 ... Plating solution, 922 ... Anode, 930 ... Cathode drum, 930a ... Lower half of cathode drum, 931 ... Resist, 940 ... the take-up roll, 950 ... arrow

Claims (13)

  1. 　導電性基材の一方の表面における所定の第１領域に金属箔を電着することにより多数の孔を有する孔開き金属箔を製造する孔開き金属箔の製造方法であって、
    　前記導電性基材の一方の面における前記第１領域以外の第２領域に絶縁層が形成された構造を有する導電性基材を準備する導電性基材準備工程と、
    　前記導電性基材の一方の面における前記第１領域に前記金属箔を電着により形成する金属箔形成工程と、
    　前記金属箔を前記導電性基材から剥離する金属箔剥離工程とを含み、
    　前記金属箔形成工程より後に、前記絶縁層を除去する絶縁層除去工程をさらに含むことを特徴とする孔開き金属箔の製造方法。     A method for producing a perforated metal foil for producing a perforated metal foil having a large number of holes by electrodepositing a metal foil on a predetermined first region on one surface of a conductive substrate,
    A conductive substrate preparation step of preparing a conductive substrate having a structure in which an insulating layer is formed in a second region other than the first region on one surface of the conductive substrate;
    A metal foil forming step of forming the metal foil by electrodeposition in the first region on one surface of the conductive substrate;
    Including a metal foil peeling step of peeling the metal foil from the conductive substrate,
    A method for producing a perforated metal foil, further comprising an insulating layer removing step of removing the insulating layer after the metal foil forming step.
  2. 　請求項１に記載の孔開き金属箔の製造方法において、
    　前記金属箔剥離工程より前に前記絶縁層除去工程を実施し、
    　前記絶縁層除去工程においては、前記金属箔を剥離する前の前記導電性基材から前記絶縁層を除去することを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 1,
    The insulating layer removing step is performed before the metal foil peeling step,
    In the said insulating layer removal process, the said insulating layer is removed from the said electroconductive base material before peeling the said metal foil, The manufacturing method of the perforated metal foil characterized by the above-mentioned.
  3. 　請求項１に記載の孔開き金属箔の製造方法において、
    　前記金属箔剥離工程より後に前記絶縁層除去工程を実施し、
    　前記絶縁層除去工程においては、前記導電性基材から剥離した後の前記金属箔から前記絶縁層を除去することを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 1,
    The insulating layer removal step is performed after the metal foil peeling step,
    In the said insulating layer removal process, the said insulating layer is removed from the said metal foil after peeling from the said electroconductive base material, The manufacturing method of the perforated metal foil characterized by the above-mentioned.
  4. 　請求項１に記載の孔開き金属箔の製造方法において、
    　前記絶縁層除去工程は、前記金属箔剥離工程より前に前記絶縁層を除去する第１絶縁層除去工程と、前記金属箔剥離工程より後に前記絶縁層を除去する第２絶縁層除去工程とを含み、
    　前記第１絶縁層除去工程においては、前記金属箔を剥離する前の前記導電性基材から前記絶縁層を除去し、
    　前記第２絶縁層除去工程においては、前記導電性基材から剥離した後の前記金属箔から前記絶縁層を除去することを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 1,
    The insulating layer removing step includes a first insulating layer removing step for removing the insulating layer before the metal foil peeling step, and a second insulating layer removing step for removing the insulating layer after the metal foil peeling step. Including
    In the first insulating layer removing step, the insulating layer is removed from the conductive base material before peeling the metal foil,
    In the second insulating layer removing step, the insulating layer is removed from the metal foil after being peeled off from the conductive base material.
  5. 　請求項１～４のいずれかに記載の孔開き金属箔の製造方法において、
    　前記絶縁層除去工程においては、前記絶縁層を絶縁層除去液に浸漬することにより前記絶縁層を除去することを特徴とする孔開き金属箔の製造方法。     In the method for producing a perforated metal foil according to any one of claims 1 to 4,
    In the insulating layer removing step, the insulating layer is removed by immersing the insulating layer in an insulating layer removing solution.
  6. 　請求項１～５のいずれかに記載の孔開き金属箔の製造方法において、
    　前記導電性基材準備工程は、前記導電性基材の一方の表面に形成した感光層に前記第１領域又は前記第２領域のいずれかの領域に不透明パターンを有するパターンマスクを介して光を照射し、当該照射による感光部分又は非感光部分のいずれかを除去して前記絶縁層を形成する絶縁層形成工程を含むことを特徴とする孔開き金属箔の製造方法。     In the method for producing a perforated metal foil according to any one of claims 1 to 5,
    In the conductive substrate preparation step, the photosensitive layer formed on one surface of the conductive substrate is irradiated with light through a pattern mask having an opaque pattern in either the first region or the second region. A method for producing a perforated metal foil, comprising: an insulating layer forming step of irradiating and removing the photosensitive portion or the non-photosensitive portion caused by the irradiation to form the insulating layer.
  7. 　請求項１～５のいずれかに記載の孔開き金属箔の製造方法において、
    　前記導電性基材準備工程は、前記導電性基材の一方の表面における前記第２領域に印刷を施して前記絶縁層を形成する絶縁層形成工程を含むことを特徴とする孔開き金属箔の製造方法。     In the method for producing a perforated metal foil according to any one of claims 1 to 5,
    The conductive base material preparing step includes an insulating layer forming step of forming the insulating layer by printing the second region on one surface of the conductive base material. Production method.
  8. 　請求項６又は７に記載の孔開き金属箔の製造方法において、
    　前記導電性基材準備工程は、前記絶縁層形成工程よりも前に、前記導電性基材の一方の表面に対して前処理を施す前処理工程をさらに含むことを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 6 or 7,
    The perforated metal foil, wherein the conductive base material preparation step further includes a pretreatment step of pretreating one surface of the conductive base material before the insulating layer forming step. Manufacturing method.
  9. 　請求項１～８のいずれかに記載の孔開き金属箔の製造方法において、
    　前記導電性基材は長尺シート状の導電性基材からなり、
    　前記導電性基材を繰り出しロールから繰り出すとともに巻き取りロールで巻き取るロールツーロール（ＲＴＲ）装置により前記導電性基材を搬送しながら、前記孔開き金属箔を製造することを特徴とする孔開き金属箔の製造方法。     In the method for producing a perforated metal foil according to any one of claims 1 to 8,
    The conductive substrate comprises a long sheet-like conductive substrate,
    The perforated metal foil is produced while the conductive base material is conveyed by a roll-to-roll (RTR) device that unwinds the conductive base material from a feed roll and winds it with a take-up roll. Manufacturing method of metal foil.
  10. 　請求項１～８のいずれかに記載の孔開き金属箔の製造方法において、
    　前記導電性基材はエンドレスベルト状の導電性基材からなり、
    　複数のロールを備えるロール装置により前記導電性基材を連続的に搬送しながら前記孔開き金属箔を製造することを特徴とする孔開き金属箔の製造方法。     In the method for producing a perforated metal foil according to any one of claims 1 to 8,
    The conductive substrate comprises an endless belt-shaped conductive substrate,
    A method for producing a perforated metal foil, comprising producing the perforated metal foil while continuously transporting the conductive base material by a roll device including a plurality of rolls.
  11. 　請求項２に記載の孔開き金属箔の製造方法において、
    　前記金属箔剥離工程より後に、前記導電性基材から剥離された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 2,
    A method for producing a perforated metal foil, further comprising a metal foil post-treatment step of performing a post-treatment on the metal foil peeled from the conductive substrate after the metal foil peeling step.
  12. 　請求項３に記載の孔開き金属箔の製造方法において、
    　前記絶縁層除去工程より後に、前記絶縁層が除去された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 3,
    A method for producing a perforated metal foil, further comprising a metal foil post-processing step of post-processing the metal foil from which the insulating layer has been removed after the insulating layer removing step.
  13. 　請求項４に記載の孔開き金属箔の製造方法において、
    　前記第２絶縁層除去工程より後に、前記絶縁層が除去された前記金属箔に対して後処理を施す金属箔後処理工程をさらに含むことを特徴とする孔開き金属箔の製造方法。     In the manufacturing method of the perforated metal foil according to claim 4,
    A method for manufacturing a perforated metal foil, further comprising a metal foil post-processing step of performing a post-processing on the metal foil from which the insulating layer has been removed after the second insulating layer removing step.
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Publication number Priority date Publication date Assignee Title
EP3470553A4 (en) * 2016-06-09 2019-08-21 JFE Steel Corporation Method for producing electroplated steel sheet and production device therefor
US11365489B2 (en) 2016-06-09 2022-06-21 Jfe Steel Corporation Method and apparatus for manufacturing electroplated steel sheet

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