WO2013057772A1 - Procédé permettant de produire une feuille métallique perforée - Google Patents

Procédé permettant de produire une feuille métallique perforée Download PDF

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Publication number
WO2013057772A1
WO2013057772A1 PCT/JP2011/073744 JP2011073744W WO2013057772A1 WO 2013057772 A1 WO2013057772 A1 WO 2013057772A1 JP 2011073744 W JP2011073744 W JP 2011073744W WO 2013057772 A1 WO2013057772 A1 WO 2013057772A1
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WO
WIPO (PCT)
Prior art keywords
metal foil
insulating layer
perforated metal
base material
conductive substrate
Prior art date
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PCT/JP2011/073744
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English (en)
Japanese (ja)
Inventor
和彦 河東
慎一 羽生
加藤　聡一郎
Original Assignee
株式会社 ベアック
旭技研株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社 ベアック, 旭技研株式会社 filed Critical 株式会社 ベアック
Priority to PCT/JP2011/073744 priority Critical patent/WO2013057772A1/fr
Priority to PCT/JP2012/076864 priority patent/WO2013058289A1/fr
Publication of WO2013057772A1 publication Critical patent/WO2013057772A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C25D7/0678—Selective plating using masks

Definitions

  • the present invention relates to a method for producing a perforated metal foil.
  • FIG. 17 is a view for explaining a conventional method of manufacturing a perforated metal foil.
  • An electroforming system 900 used in a conventional method for manufacturing a perforated metal foil includes a plating tank 920, a cathode drum 930, and a winding roll 940 as shown in FIG.
  • the plating tank 920 contains a plating solution 921 and an anode 922.
  • the peripheral surface of the cathode drum 930 is partially masked by applying a resist 931.
  • the lower half 930a of the cathode drum is immersed in the plating solution 921.
  • the metal contained in the plating solution 921 is masked by the resist 931.
  • the metal foil 910 is formed by electrodeposition on the peripheral surface of the cathode drum 930 excluding the formed portion.
  • the formed metal foil 910 is peeled off from the peripheral surface of the cathode drum 930 and taken up by a take-up roll 940. In this case, even if the metal foil 910 is peeled off from the peripheral surface of the cathode drum 930, the resist 931 is held on the peripheral surface of the cathode drum 930. Can be used.
  • the resist 931 is formed using the resist 931 because the pattern shape and pattern dimensions of the resist 931 gradually deteriorate as the resist 931 is repeatedly used.
  • the hole shape and hole size of the metal foil gradually deteriorated, and as a result, the quality of the perforated metal foil was lowered.
  • the present invention has been made in order to solve the above-described problems, and is a perforated metal foil capable of stably producing a high-quality perforated metal foil without deterioration of the hole shape and hole size in the manufacturing process.
  • An object is to provide a manufacturing method.
  • a perforated metal foil having a large number of holes is produced by electrodepositing a metal foil on a predetermined first region on one surface of a conductive substrate.
  • a conductive group for preparing a perforated metal foil comprising a conductive base material having a structure in which an insulating layer is formed in a second region other than the first region on one surface of the conductive base material
  • an insulating layer removing step of removing the insulating layer after the metal foil forming step is
  • a conductive base material having a structure in which an insulating layer is formed in a second region for forming a hole is prepared, and the metal foil is formed on the conductive base material. Therefore, the hole shape and the hole size are not deteriorated in the manufacturing process, and a high-quality perforated metal foil can be stably manufactured.
  • the metal foil may be formed of any metal or alloy as long as it can be electrodeposited.
  • the metal foil may be formed of copper, aluminum, gold, silver, other metals, various alloys, or the like.
  • This perforated metal foil is a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial filter, etc.), printing screen, electromagnetic wave shielding sheet, carrier for catalyst for promoting chemical reaction, It can be used for a wide variety of other purposes.
  • the conductive base material a conductive base material made of metal or alloy can be used. It is also possible to use a nonconductive substrate having a conductive member disposed on the surface thereof.
  • the insulating layer removing step is performed before the metal foil peeling step, and in the insulating layer removing step, the metal foil is peeled off before the metal foil is peeled off. It is preferable to remove the insulating layer from the conductive substrate.
  • perforated metal foil can be produced by peeling the metal foil from the conductive base material from which the insulating layer has been removed in the insulating layer removing step.
  • the metal foil peeling step the metal foil is peeled from the conductive base material from which the insulating layer has been removed. Therefore, both the metal foil and the insulating layer are taken from the conductive base material from which the insulating layer has not been removed.
  • the metal foil can be peeled with a small force. For this reason, since it becomes difficult for a metal foil to deform
  • the insulating layer removing step is performed after the metal foil peeling step, and the insulating layer removing step is performed after peeling from the conductive substrate. It is preferable to remove the insulating layer from the metal foil.
  • the perforated metal foil can be produced also by removing the insulating layer from the metal foil after being peeled from the conductive base material in the metal foil peeling step.
  • the insulating layer removing step includes a first insulating layer removing step of removing the insulating layer before the metal foil peeling step, and the metal foil peeling step.
  • the insulating layer is removed from the conductive base material by the first insulating layer removing step, the metal foil is peeled from the conductive base material by the metal foil peeling step, and insulated from the metal foil by the second insulating layer removing step. It is also possible to produce perforated metal foil by removing the layer. In this case, even if the insulating layer remains on the metal foil after the first insulating layer removing step, the remaining insulating layer can be reliably removed during the second insulating layer removing step. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil from which the insulating layer is more completely removed.
  • the insulating layer removing liquid may be a solution capable of removing the insulating layer by contracting or expanding the insulating layer, or a solution capable of dissolving and removing the insulating layer.
  • the conductive base material preparing step includes the step of forming the first region or the second region on a photosensitive layer formed on one surface of the conductive base material. It is preferable to include an insulating layer forming step of irradiating light through a pattern mask having an opaque pattern in any region and removing either the photosensitive portion or the non-photosensitive portion due to the irradiation to form the insulating layer. .
  • the second region on one surface of the conductive base material is printed to form the insulating layer. It is preferable to include an insulating layer forming step.
  • an insulating layer is hardened
  • printing screen printing, inkjet printing, roll coater printing, or the like can be used.
  • the conductive base material preparing step is a pretreatment for one surface of the conductive base material before the insulating layer forming step. It is preferable to further include a pretreatment step to be applied.
  • the pretreatment includes, for example, a treatment for removing the oxide film from the conductive base material, and water washing, drying, or peeling promotion film formation on the conductive base material.
  • a treatment for removing the oxide film from the conductive base material is performed as the pretreatment, it is possible to easily form an insulating layer and to easily form a metal foil by electrodeposition.
  • the conductive substrate is washed with water as the pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate.
  • drying is performed as a pretreatment, an effect that the state of the surface of the conductive substrate can be made uniform can be obtained.
  • a peeling promoting film is formed on the surface of the conductive substrate as a pretreatment, the electrodeposited metal foil can be easily peeled with a small force.
  • the conductive base material is a long sheet-like conductive base material, and the conductive base material is fed out from a feeding roll and wound with a winding roll. It is preferable to manufacture the perforated metal foil while transporting the conductive base material with a roll-to-roll (RTR) apparatus.
  • RTR roll-to-roll
  • the conductive base material is composed of an endless belt-like conductive base material, and the conductive base material is continuously formed by a roll device including a plurality of rolls.
  • the perforated metal foil is preferably produced while being conveyed.
  • a metal foil post-treatment step of performing a post-treatment on the metal foil peeled from the conductive substrate is further performed. It is preferable to include.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a subsequent process, it is possible to obtain an effect that the surface state of the perforated metal foil can be made uniform.
  • the method for producing a perforated metal foil of the present invention further includes a metal foil post-processing step of performing post-processing on the metal foil from which the insulating layer has been removed after the insulating layer removing step. Is preferred.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained.
  • a rust preventive film forming step is performed as a subsequent step, it is possible to prevent rust from being generated on the perforated metal foil.
  • a metal foil post-treatment step of performing a post-treatment on the metal foil from which the insulating layer has been removed is further provided after the second insulating layer removing step. It is preferable to include.
  • the metal foil post-treatment process includes, for example, a water washing process, a drying process, and a rust prevention film forming process.
  • a water washing step is performed as a subsequent step, it is possible to wash away dirt adhering to the perforated metal foil.
  • a drying process is performed as a post process, the effect that the surface state of a perforated metal foil can be made uniform is obtained.
  • a rust preventive film forming process is performed as a post process, it is possible to prevent rust from being generated on the metal foil.
  • FIG. 3 is a flowchart shown for explaining a method of manufacturing the perforated metal foil according to the first embodiment. It is a figure which shows the manufacturing apparatus 100 of the perforated metal foil in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 in which the insulating layer 14 was formed by the insulating layer forming apparatus 130 in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 in which the metal foil 16 was formed by electrodeposition by the metal foil formation apparatus 140 in Embodiment 1.
  • FIG. It is a figure which shows the electroconductive base material 12 from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 1.
  • FIG. 6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 2. It is a figure which shows the manufacturing apparatus 100a of the perforated metal foil in Embodiment 2. FIG. It is a figure which shows the perforated metal foil 10a peeled from the electroconductive base material 12a by the metal foil peeling apparatus 180 in Embodiment 2. It is a figure which shows the perforated metal foil 10a from which the insulating layer 14 was removed by the insulating layer removal apparatus 160 in Embodiment 2.
  • FIG. 6 is a flowchart for explaining a method for producing a perforated metal foil according to Embodiment 3. It is a figure which shows the manufacturing apparatus 100b of the perforated metal foil in Embodiment 3. It is a figure which shows the manufacturing apparatus 100c of the perforated metal foil in Embodiment 4.
  • FIG. 6 is a view for explaining a method for manufacturing a perforated metal foil according to Modifications 1 to 3. It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 4. It is a figure shown in order to demonstrate the manufacturing method of the perforated metal foil which concerns on the modification 5. FIG. It is a figure shown in order to demonstrate the manufacturing method of the conventional perforated metal foil.
  • FIG. 1 is a flowchart shown for explaining a manufacturing method of a perforated metal foil according to the first embodiment.
  • FIG. 2 is a diagram illustrating a perforated metal foil manufacturing apparatus 100 according to the first embodiment. 2, the conductive substrate 12 at the right end of the upper diagram of FIG. 2 is illustrated so as to be connected to the conductive substrate 12 illustrated at the left end of the lower diagram of FIG.
  • FIG. 3 is a diagram illustrating the conductive substrate 12 on which the insulating layer 14 is formed by the insulating layer forming apparatus 130 in the first embodiment.
  • 3A is a plan view of the conductive substrate 12, and FIG.
  • FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A.
  • FIG. 4 is a diagram illustrating the conductive base material 12 in which the metal foil 16 is formed by electrodeposition using the metal foil forming apparatus 140 according to the first embodiment.
  • 4A is a plan view of the conductive substrate 12, and
  • FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A.
  • FIG. 5 is a diagram illustrating the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 according to the first embodiment.
  • FIG. 5A is a plan view of the conductive substrate 12, and
  • FIG. 5B is a cross-sectional view taken along line AA of FIG. 5A.
  • FIG. 6 is a view showing the perforated metal foil 10 peeled from the conductive base material 12 by the metal foil peeling device 180 according to the first embodiment.
  • 6A is a plan view of the perforated metal foil 10
  • FIG. 6B is a cross-sectional view taken along the line AA in FIG. 6A.
  • a number of methods for producing a perforated metal foil in Embodiment 1 can be obtained by electrodepositing the metal foil 16 on a predetermined first region (region where the insulating layer 14 is not formed) on one surface of the conductive substrate 12.
  • 1 is a method for producing a perforated metal foil 10 having a plurality of perforations, as shown in FIG. 1, as shown in FIG. 1, “conductive substrate preparation step S10”, “metal foil forming step S20”, “insulation”
  • Each process of "layer removal process S30", “metal foil peeling process S40", and “metal foil post-processing process S50" is included.
  • the conductive base material 12 is made of a long sheet-like conductive base material, and the conductive base material 12 is fed from the feeding roll 110 and wound by the winding roll 210.
  • the perforated metal foil 10 is manufactured while the conductive substrate 12 is conveyed by a roll-to-roll (RTR) apparatus. Therefore, each of "conductive base material preparation process S10", “metal foil formation process S20", “insulating layer removal process S30”, and “metal foil peeling process S40" with respect to the conductive base material 12 conveyed.
  • the steps are sequentially performed, and the “metal foil post-processing step S50” is performed on the perforated metal foil 10 peeled from the conductive substrate 12 in the “metal foil peeling step S40”.
  • the “conductive base material preparation process S10”, “metal foil formation process S20”, “insulating layer removal process S30”, “metal foil peeling process S40”, and “metal foil post-processing process S50” will be described in detail. explain.
  • Conductive substrate preparation step S10 In the conductive base material preparation step S10, an insulating layer is formed in a second region (region corresponding to the position of the hole 18) other than the first region (region where the metal foil 16 is electrodeposited) on one surface of the conductive base material 12.
  • a conductive substrate 12 having a structure in which 14 is formed is prepared.
  • the conductive base material preparation step S10 includes “conductive base material pretreatment step S11” and “insulating layer forming step S12”.
  • the conductive base material pretreatment step S ⁇ b> 11 is a step of performing a pretreatment on one surface of the conductive base material 12 conveyed from the feeding roll 110.
  • the conductive base material pretreatment step S11 includes an oxide film removing step, a water washing step, a drying step, and a peeling promotion film forming step.
  • the conductive substrate pretreatment step S11 is performed by the pretreatment device 120, and the pretreatment device 120 includes an etching solution nozzle 121, a water washing nozzle 122, an air nozzle 123, and a peeling accelerator nozzle 124.
  • the oxide film removing step is a step of removing the oxide film from the surface of the conductive substrate 12 carried by the etching solution nozzle 121 and transported.
  • the water washing step is a step of spraying washing water onto the surface of the conductive substrate 12 that is carried out by the water washing nozzle 122 and conveyed.
  • the drying step is a step that is performed by the air nozzle 123 and blows hot air to the conveyed conductive substrate 12 to remove water droplets and the like by washing with water, and uniformizes the surface state of the conductive substrate 14.
  • the peeling promotion film forming step is a step of forming a peeling promotion film by ejecting a peeling accelerator from the peeling accelerator nozzle 124.
  • the conductive base material 12 is a long sheet-like base material made of a flexible metal thin plate made of a metal such as stainless steel, other steel, brass, copper, or an alloy, and rust prevention treatment such as corrosion-resistant metal plating on one surface.
  • the other surface (back surface) and both side surfaces are coated with a non-conductive film.
  • Insulating layer formation process S12 is a process of forming insulating layer 14 in the 2nd field in one side of conductive substrate 12 conveyed, as shown in FIG.
  • the insulating layer forming step S12 is performed by the insulating layer forming apparatus 130 as shown in FIG.
  • the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region, and the non-photosensitive portion due to the irradiation is removed.
  • the insulating layer 14 is formed.
  • a photosensitive layer (photosensitive film) is pasted on the surface of the conductive substrate 12, and a pattern mask having an opaque pattern only in a region corresponding to the first region is photosensitive.
  • the insulating layer 14 is formed by disposing it above the film, exposing it from above the pattern mask, and removing the unexposed portion with an etching solution.
  • the photosensitive film preferably has a three-layer structure in which a cover sheet is detachably attached to the front side and the back side with a photosensitive layer in between. In this case, first, the cover sheet on the back side of the photosensitive film is peeled off, and the photosensitive film is attached to the surface of the conductive substrate 12. Next, the cover sheet on the front side is peeled off, and the pattern mask is disposed and pasted above the photosensitive film.
  • Metal foil formation process S20 is a process of forming the metal foil 16 in the 1st area
  • Metal foil formation process S30 is implemented by the metal foil formation apparatus 140 and the water washing and drying apparatus 150, as shown to Fig.2 (a).
  • the metal foil forming apparatus 140 is a so-called electroplating apparatus, and includes a plating tank 141, an anode plate 143, and a DC power supply device (not shown).
  • a plating solution 142 is stored in the plating tank 141.
  • the positive electrode of the DC power supply device is connected to the anode plate 143, and the negative electrode is connected to the conductive substrate 12.
  • the DC power supply device supplies a DC current between the anode plate 143 and the conductive substrate 12.
  • FIG. 2A the conveyed conductive substrate 12 is immersed in a plating solution 142 in the plating tank 141 by a roll 220, and as shown in FIG.
  • a metal foil 16 is formed by electrodeposition in the first region that is not formed.
  • the metal foil 16 is formed thinner than the insulating layer 14. This is because the holes 18 formed in the perforated metal foil 10 are formed vertically in a state of penetrating the front and back surfaces of the perforated metal foil 10.
  • any metal or alloy can be used as long as it can be electrodeposited.
  • copper, aluminum, gold, silver or other metals or various alloys can be used.
  • the plating solution 142 a solution corresponding to the metal of the metal foil 16 can be used.
  • copper is used as the material of the metal foil 16
  • a copper sulfate-based solution can be used.
  • the water washing / drying apparatus 150 performs water washing and drying of the conductive base material 12 on which the metal foil 16 is formed.
  • the water washing / drying device 150 includes a water washing nozzle 151 and an air nozzle 152, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 151 and dried by the air nozzle 152.
  • water washing and drying by the water washing / drying device 150 may be omitted depending on the state of the conductive base material 12 on which the metal foil 16 is formed.
  • Insulating layer removal step S30 The insulating layer removing step S30 is performed after the metal foil forming step S20, and is a step of removing the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removing liquid (see FIG. 5).
  • the insulating layer removing step S40 is performed by the insulating layer removing device 160, as shown in FIG.
  • the insulating layer removing device 160 includes an insulating layer removing liquid storage tank 161, and the insulating layer removing liquid 162 is stored in the insulating layer removing liquid tank 161.
  • the conductive base material 12 (the conductive base material 12 on which the insulating layer 14 and the metal foil 16 are formed on one surface) is transferred to the insulating layer removing liquid 161 in the insulating layer removing liquid storage tank 161 by the roll 220. It is immersed in 162 and the insulating layer 14 is removed.
  • the insulating layer removing liquid 162 can be appropriately selected according to the material of the insulating layer 14.
  • an acidic insulating layer removing liquid or an alkaline insulating layer removing liquid is used for the photosensitive layer (photosensitive film) used in Embodiment 1.
  • Use liquid The insulating layer removing liquid 162 removes the insulating layer 14 from the insulating base material 12 by contracting or expanding the insulating layer 14.
  • an insulating layer removing liquid 162 that dissolves and removes the insulating layer 14 may be used as the insulating layer removing liquid.
  • the insulating layer removing device 160 may further include a microvibration device that slightly vibrates the insulating layer removing liquid 162 and the insulating base material 12 when the insulating layer 14 is removed. You may further provide the heat retention / heating apparatus kept at high temperature. With such a configuration, the insulating layer 14 is easily removed, and the insulating layer 14 can be reliably removed.
  • the water washing / drying device 170 performs water washing and drying of the conductive substrate 12 from which the insulating layer 14 has been removed by the insulating layer removing device 160.
  • the water washing / drying device 170 includes a water washing nozzle 171 and an air nozzle 172, and the conductive substrate 12 being conveyed is washed with water by the water washing nozzle 171 and dried by the air nozzle 172.
  • water washing and drying by the water washing / drying device 170 may be omitted.
  • Metal foil peeling process S40 is a process of peeling the metal foil 16 from the electroconductive base material 12, as shown in FIG.
  • the metal foil peeling step S40 is performed by the metal foil peeling device 180 as illustrated in FIG.
  • the metal foil peeling device 180 peels the metal foil 16 from the conductive substrate 12 by the upper contact roll 181 and the lower contact roll 182, and the upper separation roll 183 and the lower separation roll 184.
  • the separated metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 as the perforated metal foil 10.
  • the peeled conductive substrate 12 is conveyed toward the take-up roll 210 by the lower separation roll 184 and taken up by the take-up roll 210.
  • the conductive base material 12 taken up by the take-up roll 210 is used when manufacturing the perforated metal foil 10 from the next time on.
  • the thickness of the perforated metal foil 10 can be 1 ⁇ m or more.
  • the diameter of the hole 11 in the perforated metal foil 10 can be 30 to 200 ⁇ m, preferably 70 to 100 ⁇ m, and the opening ratio can be 20 to 80%, preferably about 40%.
  • the perforated metal foil 10 can be manufactured by peeling the metal foil 16 from the conductive base material 12 from which the insulating layer 14 has been removed in the insulating layer removing step S30.
  • the metal foil peeling step S40 the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed.
  • the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform
  • Metal foil post-processing process S50 is a process of post-processing with respect to metal foil 16 (perforated metal foil 10) peeled from the electroconductive base material 12 after metal foil peeling process S40.
  • the metal foil post-treatment step S50 includes a water washing treatment step, a drying step, and a rust prevention treatment step.
  • Metal foil post-processing process S50 is implemented by the metal foil post-processing apparatus 190 provided with the water washing nozzle 191, the air nozzle 192, and the antirust agent nozzle 193.
  • the water washing step is a step of washing away dirt when the perforated metal foil 10 is peeled off, and is performed by the water washing nozzle 191.
  • the drying step is a step performed by the air nozzle 192 so as to dry the perforated metal foil 10, and is performed by the air nozzle 192.
  • the rust prevention treatment step is performed by a rust inhibitor nozzle 193 that applies a rust inhibitor to the perforated metal foil 10 so that the perforated metal foil 10 does not rust.
  • the metal foil post-processing step S60 can be omitted.
  • the perforated metal foil 10 subjected to the metal foil post-processing step S50 is wound around the metal foil winding roll 200.
  • the wound perforated metal foil 10 is cut into a predetermined shape and size by a press or a cutter, if necessary, and a secondary battery current collector, various filters (gas filter, liquid filter, antibacterial) Filters, etc.), printing screens, electromagnetic shielding sheets, carriers for supporting chemical reaction catalysts, and other wide applications.
  • the perforated metal foil 10 can be manufactured.
  • the metal foil peeling step S40 the metal foil 16 is peeled from the conductive base material 12 from which the insulating layer 14 has been removed, so that the metal from the conductive base material 12 from which the insulating layer 14 has not been removed.
  • the metal foil 16 can be peeled off with a small force. For this reason, since it becomes difficult for the metal foil 16 to deform
  • the manufacturing method of perforated metal foil which concerns on Embodiment 1
  • insulating layer removal process S30 which removes the insulating layer 14 by immersing the insulating layer 14 in the insulating layer removal liquid 162 is included, external force is hardly applied. Since it becomes possible to remove the insulating layer 14 without the necessity, the metal foil 16 or the conductive substrate 12 is hardly deformed during the insulating layer removing step S30.
  • the foil 10 can be manufactured stably.
  • the insulating layer removing liquid 162 may be a solution capable of removing the insulating layer 14 by contracting or expanding the insulating layer 14 or a solution capable of dissolving and removing the insulating layer 14.
  • the photosensitive layer formed on one surface of the conductive substrate 12 is irradiated with light through a pattern mask having an opaque pattern in the first region. Since the insulating layer forming step S12 for forming the insulating layer 14 by removing the non-photosensitive portion caused by the irradiation is included, it is possible to form the insulating layer 14 using a photolithography technique that has been widely used conventionally. Therefore, it is possible to form the insulating layer 14 with high accuracy, and as a result, it is possible to stably manufacture the high-quality perforated metal foil 10.
  • the metal foil peeling step S30 can be performed satisfactorily.
  • the pretreatment includes, for example, a process of removing the oxide film from the conductive substrate 12 and a water washing, drying, or peeling promotion film formation on the conductive substrate 12.
  • the treatment for removing the oxide film from the conductive base material 12 is performed as the pretreatment, it is possible to obtain an effect that the insulating layer 14 is easily formed and the metal foil 16 is easily formed by electrodeposition.
  • the conductive substrate 12 is washed with water as a pretreatment, an effect is obtained that it is possible to wash away the oxide film removing agent and dirt adhering to the surface of the conductive substrate 12.
  • drying is performed as a pretreatment, the effect that the surface state of the conductive substrate 12 can be made uniform can be obtained.
  • a peeling promoting film is formed on the surface of the conductive substrate 12 as a pretreatment, the electrodeposited metal foil can be easily peeled off with a small force.
  • the manufacturing method of the perforated metal foil which concerns on Embodiment 1
  • it is conductive with an RTR apparatus. While the base material 12 is being transported, it is possible to continuously perform a predetermined process on the conductive base material 12. For this reason, it becomes possible to manufacture the perforated metal foil 10 with high productivity.
  • the metal foil post-processing step S50 includes, for example, a water washing step, a drying step, a rust prevention film forming step, and the like.
  • a water washing step it becomes possible to wash away the dirt adhering to the perforated metal foil 10.
  • a drying process it becomes possible to obtain an effect that the surface state of the perforated metal foil 10 can be made uniform.
  • FIG. 7 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the second embodiment.
  • FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment.
  • FIG. 8 is a view showing a perforated metal foil manufacturing apparatus 100a according to the second embodiment.
  • the conductive substrate 12a at the right end of the upper diagram of FIG. 8 is illustrated so as to be connected to the conductive substrate 12a illustrated at the left end of the lower diagram of FIG.
  • FIG. 9 is a view showing the perforated metal foil 10a peeled from the conductive base material 12a by the metal foil peeling device 180 according to the second embodiment.
  • FIG. 10 is a view showing the perforated metal foil 10a from which the insulating layer 14 has been removed by the insulating layer removing apparatus 160 in the second embodiment.
  • the manufacturing method of the perforated metal foil according to the second embodiment basically includes the same steps as the manufacturing method of the perforated metal foil according to the first embodiment, but “insulating layer removing step S30” and “metal foil peeling”.
  • the order in which “step S40” is performed is different from that in the method of manufacturing the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the second embodiment, as shown in FIG. 7, the insulating layer removing step S30 is performed after the metal foil peeling step S40.
  • the insulating layer 14 is removed from the perforated metal foil 10a after being peeled from the substrate 12a.
  • the “conductive base material preparation step S10”, “metal foil formation step S20”, “metal foil peeling” are performed on the conductive base material 12a being conveyed.
  • Each step of “Step S100” is sequentially performed.
  • each process of "insulating layer removal process S40" and “metal foil post-processing process S50” is sequentially performed with respect to the perforated metal foil 10a peeled off from the conductive substrate 12a in the "metal foil peeling process S40". It will be done.
  • the insulating layer removing apparatus 160 is arranged at the subsequent stage of the metal foil peeling apparatus 180.
  • metal foil peeling process S40 as shown in FIG. 9, the insulating layer 14 and the metal foil 16 are peeled from the electroconductive base material 12a.
  • the peeled metal foil 16 is conveyed toward the take-up roll 200 by the upper separation roll 183 with the insulating layer 14 attached as the perforated metal foil 10a.
  • the insulating layer removing step S30 as shown in FIG. 10, the insulating layer 14 is removed from the perforated metal foil 10a.
  • the perforated metal foil 10a (perforated metal foil 10a to which the insulating layer 14 is attached) conveyed is immersed in the insulating layer removing liquid 162 in the insulating layer removing liquid storage tank 161 by the roll 220, so that the insulating layer 14 Is removed.
  • the insulating layer removing liquid 162 the same insulating layer removing liquid 162 as that in Embodiment 1 can be used.
  • the area where the insulating layer 14 comes into contact with the insulating layer removing liquid 162 is increased as compared with the case of the first embodiment, and the perforated metal foil 10a is efficiently used.
  • the insulating layer 14 can be removed.
  • a perforated metal is removed by removing the insulating layer 14 from the metal foil 16 after peeling from the electroconductive base material 12 by metal foil peeling process S40.
  • a foil can be manufactured.
  • the manufacturing method of perforated metal foil which concerns on Embodiment 2 is the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the order which implements "insulation layer removal process S30" and "metal foil peeling process S40". Since the same process as in the above case is included, it has a corresponding effect among the effects of the method for manufacturing a perforated metal foil according to the first embodiment.
  • FIG. 11 is a flowchart shown for explaining the method for manufacturing the perforated metal foil according to the third embodiment.
  • FIG. 12 is a view showing a perforated metal foil manufacturing apparatus 100b according to the third embodiment.
  • the conductive substrate 12b at the right end of the upper diagram of FIG. 12 is illustrated so as to be connected to the conductive substrate 12b illustrated at the left end of the lower diagram of FIG.
  • the perforated metal foil manufacturing method according to the third embodiment basically includes the same steps as the perforated metal foil manufacturing method according to the first embodiment, but is performed in that the insulating layer removing step is performed twice. It differs from the case of the manufacturing method of the perforated metal foil according to the first embodiment. That is, in the method for manufacturing a perforated metal foil according to the third embodiment, as shown in FIG. 11, the insulating layer removing step is an insulating layer removing step S30 (in which the insulating layer 14 is removed before the metal foil peeling step S40 ( A first insulating layer removing step S30) and a second insulating layer removing step S60 for removing the insulating layer 14 after the metal foil peeling step S40.
  • the insulating layer 14 is removed from the conductive base material 12b before peeling the metal foil 16, and in the second insulating layer removing step S60, after peeling from the conductive base material 12b.
  • the insulating layer 14 is removed from the metal foil (perforated metal foil 10b).
  • the “conductive base material preparation step S10”, “metal foil formation step S20”, “first insulation” are performed on the conductive base material 12b being conveyed.
  • Each step of “layer removal step S30” and “metal foil peeling step S40” is sequentially performed.
  • each process of "2nd insulating layer removal process S60" and “metal foil post-processing process S50" with respect to the perforated metal foil 10b peeled from the electroconductive base material 12b by "metal foil peeling process S40” is carried out. It will be implemented sequentially. That is, the perforated metal foil manufacturing method according to the third embodiment performs both the edge layer removing step S30 and the insulating layer removing step S60.
  • the insulating layer removing apparatus 160 is arranged at the front stage and the rear stage of the metal foil peeling apparatus 180, respectively.
  • the insulating layer 14 is removed from the conductive base material 12b by the first insulating layer removing step S30, and the metal from the conductive base material 12b by the metal foil peeling step S40. It is possible to manufacture the perforated metal foil 10b by peeling the foil 16 and removing the insulating layer 14 from the perforated metal foil 10b in the second insulating layer removing step S60. In this case, even if the insulating layer 14 remains on the metal foil 16 after the first insulating layer removing step S30, the remaining insulating layer 14 is surely removed during the second insulating layer removing step S60. Is possible. For this reason, it becomes possible to manufacture a clean and high-quality perforated metal foil 10b from which the insulating layer 14 has been removed more completely.
  • the manufacturing method of perforated metal foil 10b which concerns on Embodiment 3 has the structure similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except performing an insulating layer removal process twice.
  • the perforated metal foil manufacturing method according to the first embodiment has a corresponding effect among the effects of the method.
  • FIG. 13 is a view showing a perforated metal foil manufacturing apparatus 100 c according to the fourth embodiment.
  • the method for manufacturing a perforated metal foil according to the fourth embodiment basically includes the same steps as the method for manufacturing the perforated metal foil according to the first embodiment, but the configuration of the conductive base material used is the same as that of the first embodiment. It differs from the case of the manufacturing method of the perforated metal foil. That is, in the method for manufacturing a perforated metal foil according to Embodiment 4, as shown in FIG. 13, the conductive base material is composed of an endless belt-like conductive base material 12 c and is conductive by a roll device including a plurality of rolls. The perforated metal foil 10c is manufactured while continuously transporting the conductive substrate 12c.
  • the manufacturing apparatus 100c for perforated metal foil in the fourth embodiment is based on the drive roll 350 and the driven roll 360 that are disposed at positions separated from each other in order to endlessly rotate the conductive base 12c, and the conductive base 12c.
  • the insulating layer forming apparatus 130 that performs the insulating layer forming process S12, the metal foil forming apparatus 140 that performs the metal foil forming process S20, the insulating layer removing apparatus 160 that performs the insulating layer removing process S30, and the metal foil peeling process S40 are performed.
  • a metal foil peeling device 180c and a metal foil winding roll 200 for winding the perforated metal foil 10c peeled by the metal foil peeling device 180c are provided.
  • a roll apparatus is comprised by the motor (not shown) which rotationally drives the drive roll 350, the driven roll 360, the driven roll 360, and the drive roll 350.
  • the method for manufacturing a perforated metal foil it is possible to continuously perform a predetermined process on the conductive base material 12c while the conductive base material 12c is being conveyed by the roll device. Become. For this reason, it becomes possible to manufacture the perforated metal foil 10c with high productivity. Since the endless belt-like conductive base material returns to the initial process position after a series of processes is completed, full automation can be realized and work efficiency can be further increased.
  • Embodiment 1 since the manufacturing method of perforated metal foil which concerns on Embodiment 4 includes the process similar to the case of the manufacturing method of perforated metal foil which concerns on Embodiment 1 except the structure of the electroconductive base material to be used, Embodiment 1 It has the effect applicable among the effects which the manufacturing method of the perforated metal foil which concerns on has.
  • a metal or alloy flexible long sheet-like base material was used as the conductive base material, but the present invention is not limited thereto.
  • Various substrates can be used as long as the surface exhibits conductivity.
  • a conductive substrate formed by coating a conductive film on the surface of a non-conductive substrate such as plastic can be used. In this case, it is not necessary to mask the back surface and both side surfaces of the conductive substrate with a non-conductive member.
  • the thing which laminated the copper foil on the surface of the polyimide tape base material, and made it the electroconductive base material can be used.
  • a rigid conductive substrate may be used, or a strip-shaped conductive substrate may be used.
  • the method for producing a perforated metal foil of the present invention was described by using a so-called photolithography technique, but the present invention is not limited to this.
  • the insulating layer forming agent used for printing is preferably cured by heating or ultraviolet irradiation.
  • the printing method screen printing, ink jet printing, or roll coater printing is suitable.
  • FIG. 14 is a view for explaining the method of manufacturing the perforated metal foil according to the first to third modifications.
  • FIG. 14A is a diagram showing a state in which a metal foil 16d having substantially the same thickness as the insulating layer 14d is formed by electrodeposition (Modification 1)
  • FIG. 14B is a metal foil thicker than the insulating layer 14e.
  • FIG. 14C is a diagram showing a state in which 16e is formed by electrodeposition (Modification 2)
  • FIG. 14C shows a tapered insulating layer 14f and a metal foil 16f thinner than the insulating layer 14f by electrodeposition. It is a figure which shows a mode that it does (Modification 3).
  • the insulating layer 14d is formed by the insulating layer removing liquid, compared with the case where the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Easy to remove.
  • the metal foil 16e thicker than the insulating layer 14e is formed by electrodeposition, the metal foil 16e covers the insulating layer 14e than when the metal foil 16d thinner than the insulating layer 14d is formed by electrodeposition. Therefore, the bonding strength between the metal foil 16e and the insulating layer 14e can be increased, and the metal foil 16e and the insulating layer 14e are integrally peeled from the conductive substrate as in the second or third embodiment. It becomes easy.
  • the tapered insulating layer 14f is formed and the metal foil 16f thinner than the insulating layer 14f is formed by electrodeposition, the insulating layer 14f can be easily removed.
  • the tapered side surface of the insulating layer 14f is formed as follows. First, a first insulating layer 14f ′ is formed only in the second region of the conductive substrate 12, and then a second insulating layer 14f ′′ that is smaller than the first insulating layer 14f ′ is formed. Form. By repeating the above operation, the insulating layer 14f having a tapered side surface is formed.
  • each step is performed as a series of steps in one RTR apparatus, but the present invention is not limited to these.
  • FIG. 15 is a view for explaining the method for manufacturing the perforated metal foil according to the fourth modification.
  • FIG. 16 is a view for explaining the method for manufacturing the perforated metal foil according to the fifth modification.
  • the process of “conductive substrate preparation process S10” is performed by the first RTR device 230, and thereafter, “metal foil formation process S20”, “insulating layer removal process S30” and “ You may make it implement each process of metal foil peeling process S40 "with the 2nd RTR apparatus 250 as another process (modification 4).
  • FIG. 15 is a view for explaining the method for manufacturing the perforated metal foil according to the fourth modification.
  • FIG. 16 is a view for explaining the method for manufacturing the perforated metal foil according to the fifth modification.
  • the process of “conductive substrate preparation process S10” is performed by the first RTR device 230, and thereafter, “metal foil formation process S20”, “insulating layer removal
  • the “conductive substrate preparation step S10”, the “metal foil forming step S20”, the “insulating layer removing step S30” and the “metal foil peeling step S40” are respectively separate steps.
  • the first RTR device 230, the third RTR device 270, the fourth RTR device 300, and the fifth RTR device 330 may each be implemented.
  • electroconductive base material pre-processing process S11 and metal foil post-processing process S50 were implemented, this invention is not limited to this. Depending on the surface state and material of the conductive substrate, part or all of the conductive substrate pretreatment step S11 may be omitted. Depending on the state or material of the perforated metal foil, part or all of the metal foil post-processing step S50 may be omitted. Similarly, depending on the state of the conductive substrate or the metal foil, the water washing step and the drying step by the water washing / drying apparatuses 150 and 170 after the metal foil forming step S30 and the insulating layer removing step S40 may be omitted.
  • the insulating layer is removed using the insulating layer removing solution, but the present invention is not limited to this.
  • the insulating layer may be removed using an insulating layer removing step that mechanically or thermally removes the insulating layer.
  • the insulating layer removing step for mechanically removing for example, the insulating layer is brushed with a brush, or by applying ultrasonic vibration to the insulating layer, the insulating layer is peeled off from the conductive substrate or the metal foil and removed. It is good also as a process, and it is good also as a process of deleting an insulating layer with a micro drill or a micro cutter.
  • the insulating layer removing step for removing thermally may be, for example, a step for dissolving and removing the insulating layer by applying heater heat, or a step for dissolving and removing the insulating layer by irradiating laser light. Moreover, you may combine said method suitably.
  • Stripping accelerator nozzle 130 ... Insulating layer forming apparatus, 140 ... Metal foil forming device, 141 ... Plating tank, 142 ... Plating solution, 143 ... Anode plate, 150, 170 ... Washing / drying device, 1 DESCRIPTION OF SYMBOLS 0 ... Insulating layer removal apparatus, 161 ... Insulating layer removal liquid storage tank, 162 ... Insulating layer removal liquid, 180, 180e ... Metal foil peeling apparatus, 181 ... Upper contact roll, 182 ... Lower contact roll, 183 ... Upper separation roll, 184 ... Lower separation roll, 190 ... Metal foil post-processing device, 193 ... Rust preventive nozzle, 200 ...
  • Metal foil winding roll 210, 240, 290, 320 ... Winding roll, 220 ... roll, 230 ... 1st RTR device, 250 ... second RTR device, 270 ... third RTR device, 300 ... fourth RTR device, 330 ... fifth RTR device, 350 ... drive roll, 360 ... driven roll, 900 ... electroforming System, 910 ... Metal foil, 920 ... Plating tank, 921 ... Plating solution, 922 ... Anode, 930 ... Cathode drum, 930a ... Lower half of cathode drum, 931 ... Resist, 940 ... the take-up roll, 950 ... arrow

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Materials Engineering (AREA)
  • Metallurgy (AREA)
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Abstract

La présente invention se rapporte à un procédé permettant de produire une feuille métallique perforée, ledit procédé comprenant : une étape de préparation d'un substrat conducteur (S20) destinée à préparer un substrat conducteur qui présente une structure de telle sorte qu'une couche isolante soit formée au niveau d'une seconde région qui correspond à la position d'une perforation ; une étape de formation d'une feuille métallique (S30) destinée à former une feuille métallique au moyen d'un dépôt électrolytique au niveau d'une première région qui est composée du substrat conducteur et sur laquelle la couche isolante n'a pas été formée ; une étape d'enlèvement de la couche isolante (S40) destinée à enlever la couche isolante ; et une étape de décollement de la feuille métallique (S50) destinée à décoller la feuille métallique du substrat conducteur. Au moyen du procédé permettant de produire une feuille métallique perforée, la dégradation de la forme des perforations et des dimensions des perforations pendant le procédé de production sont éliminées et il est donc possible de produire de manière stable une feuille métallique perforée de grande qualité.
PCT/JP2011/073744 2011-10-17 2011-10-17 Procédé permettant de produire une feuille métallique perforée WO2013057772A1 (fr)

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PCT/JP2011/073744 WO2013057772A1 (fr) 2011-10-17 2011-10-17 Procédé permettant de produire une feuille métallique perforée
PCT/JP2012/076864 WO2013058289A1 (fr) 2011-10-17 2012-10-17 Procédé de fabrication d'une feuille métallique perforée

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EP3470553A4 (fr) * 2016-06-09 2019-08-21 JFE Steel Corporation Procédé de production d'une tôle d'acier galvanisée et dispositif de production associé

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CN110055567B (zh) * 2019-04-18 2021-05-07 中国科学院化学研究所 微孔膜材料的电沉积制备方法和微孔膜材料及其应用

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JPS5492527A (en) * 1977-12-28 1979-07-21 Dainippon Printing Co Ltd Manufacture of metal foil having apertures
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JPS5382626A (en) * 1976-12-28 1978-07-21 Hamasawa Kogyo Kk Continuous production method of metal plate
JPS5492527A (en) * 1977-12-28 1979-07-21 Dainippon Printing Co Ltd Manufacture of metal foil having apertures
JPS6187889A (ja) * 1984-10-04 1986-05-06 Kawasaki Steel Corp 合金薄帯の製造方法
JPS61124600A (ja) * 1984-11-21 1986-06-12 Hitachi Cable Ltd フレ−ムパタ−ンの形成方法
JPH01222084A (ja) * 1988-02-29 1989-09-05 Nisshin Steel Co Ltd 金属箔の連続的製造方法
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JP2004091909A (ja) * 2002-09-04 2004-03-25 Kenseidou Kagaku Kogyo Kk レーザ加工機用マスク等に用いる精密な貫通部パターンを含む銅製プレートの電鋳方法

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US11365489B2 (en) 2016-06-09 2022-06-21 Jfe Steel Corporation Method and apparatus for manufacturing electroplated steel sheet

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