JPS61124600A - Formation of frame pattern - Google Patents

Abstract

PURPOSE:To form economically a frame pattern of a metallic frame by printing a reverse pattern to metallic foil and forming a plating layer to the exposed part thereof then removing successively the metallic foil and printing part. CONSTITUTION:The reverse patter of the desired frame pattern is negative- printed on the surface of starting sheet foil 4 made of copper, etc. to <=0.1mm thickness by using resist ink 3. The plating layer 3 is formed to 0.05-0.2mm thickness by electroplating or chemical plating to the exposed part of the foil 4. The sheet 4 is then dissolved away by using an etching soln., etc. The ink 3 is removed by an ultrasonic oscillation method or solvent dipping method in succession thereto. The advantageous formation of the fine frame pattern is made possible by the above-mentioned method.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a method for forming a frame pattern when manufacturing a metal frame.

[Prior Art] Conventionally, a method using a press or an etching method has been adopted as a method for forming a frame pattern when manufacturing a metal frame.

[Problems to be solved by the invention] However, in the press processing method, the mold is very expensive, which is reflected in the product cost.On the other hand, in the etching method, the metal foil is melted and removed to form a frame pattern. The drawbacks were that there was a lot of loss of foil and the cost of treating the wastewater from the dissolved chemicals was high. In particular, in the etching method, the metal foil produced by adding energy is melted by consuming chemicals, and the molten metal is recovered by adding energy, which is completely contrary to energy conservation. .

The purpose of this invention is to eliminate the drawbacks of the prior art described above,
The object of the present invention is to provide a method of forming a frame pattern of a metal frame in a very economical manner.

[Means and operations for solving the problems] The gist of the present invention is as follows: (a) First, a pattern opposite to the intended frame pattern is printed in resist on a metal foil having a thickness of 0.1 # or less; (b) Next, the exposed part of this metal foil is coated with a thickness of 0.05 to 0.2 m by electroplating or chemical plating.
(c) Next, the metal foil is removed by an electrolytic dissolution method or a chemical dissolution method. (d) Finally, the resist printed part is removed by an ultrasonic vibration method or a solvent immersion method. The objective is to form a desired frame pattern.

FIG. 6 schematically shows the above-mentioned process, and FIG. 7 is a sectional view of a continuous metal frame manufacturing apparatus that can be used in the present invention. In the figure, the seed plate foil 4 has a coil shape and is continuously coated with resist ink by a roller coater 6.

Although not shown in the figure, an exposure device and a developing device are installed in the roller coater 6 portion. The printed foil enters an electroplating bath 7 and then enters a seed plate foil dissolving layer 8 where it is etched on both sides. ff1ll, the intermediate resist ink layer is removed by ultrasonic vibration or solvent immersion in the resist removal tank 9, and this series of steps continuously forms the completed frame 1.
0 can be manufactured.

Hereinafter, this invention will be explained in more detail with reference to Examples.

[Example 1] In order to manufacture a copper frame having the frame pattern shown in FIG. 1, a foil having a thickness of 0.02 m+ was used as the copper seed plate foil 4. In addition, this seed foil 4 was prepared with a width of 40mm and a length of 200mm in order to perform electroplating to a minimum board thickness of 0.15M, but when cutting the final slit width, the width of 40mm was prepared.
A width of #11 or more may also be used. The pattern shown in FIG. 1 was printed on the surface of this seed plate foil 4. Its cross section is shown in FIG.

In addition, the film thickness of the printing ink varies depending on the final electroplating thickness, and in the case of the final plate thickness of 0.15111N, it is 0°1~
A range of 0.15 m is desirable. Further, as a method for printing, it is preferable to apply a photoresist ink (roller coater method) or apply a dry film, which can increase the film thickness of the ink.

Next, this surface was electroplated to form the cross-sectional shape shown in FIG. At that time, electroplating was applied to the areas not coated with resist until the desired board thickness was achieved.

The thickness of electroplating varies by ±0.0 depending on the applied current and time.
It can be adjusted with an accuracy of 0INI.

Next, this was placed in a copper etching solution to dissolve and remove the seed plate foil to form the cross section shown in FIG.

At that time, the electroplated layer was also dissolved, but 1. The dissolution was about the same as the thickness of the seed plate foil of 0.02M, and the thickness was made in advance in anticipation of electroplating. After removing the intermediate resist ink from R&, the copper frame shown in FIG. 5 was obtained.

[Effects of the Invention] As explained above, according to the present invention, a frame pattern of a metal frame can be formed extremely economically, and is particularly advantageous when forming a fine pattern.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an example of a metal frame, FIGS.
The figure is a sectional view of a metal frame continuous manufacturing apparatus that can be used in the present invention. 1...Copper frame. 2...Opening. 3...Resist ink. 4...seed board bamboo. 5... Plating layer, '' 6... Resist printing machine 7... Plating tank. 8... Dissolving tank. 9... Resist removal tank. 10... Completed frame

Claims (1)

[Claims] (1) (a) A step of resist printing a reverse pattern of the desired frame pattern on a metal foil with a thickness of 0.1 mm or less, (
b) forming a plating layer with a thickness of 0.05 to 0.2 mm on the exposed part of the metal foil by electroplating or chemical plating; (c) forming the metal foil by electrolytic dissolution or chemical dissolution; and (d) removing the resist-printed portion by ultrasonic vibration or solvent immersion.