JPH0355556B2 - - Google Patents

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a method for forming a frame pattern that can be applied to manufacturing a metal frame having a fine pattern. [Prior Art] Conventionally, when manufacturing a metal frame having a fine pattern, press punching or etching has been adopted as a method for forming the frame pattern. [Problems to be solved by the invention] However, in the press punching method, the mold is very expensive, which is reflected in the product cost.On the other hand, in the etching method, metal foil corresponding to the thickness of the product is prepared. However, because a part of the metal foil is dissolved and removed to form a frame pattern, there is a large loss of metal foil, and the wastewater treatment cost for the chemicals used to dissolve and remove it is high. In particular, in the etching method, a part of the metal foil produced by adding a considerable amount of energy is melted by consuming chemicals, and then the melted metal foil is recovered by adding energy, which is completely contrary to energy conservation. The current situation is that SUMMARY OF THE INVENTION An object of the present invention is to provide a method for forming a frame pattern, which eliminates the drawbacks of the prior art described above and allows metal frames with fine patterns to be manufactured extremely economically. [Means and effects for solving the problems] The gist of the present invention is as follows: (a) A metal foil with a thickness of 0.1 mm or less is prepared as a seed plate and a coiled carrier for pattern formation; Step of resist printing a reverse pattern of the desired frame pattern on the metal foil, (b) Electroplating or chemical plating on the exposed part of the metal foil to a thickness of 0.2 or more of the metal foil.
Step of forming a plating layer of mm or less, (c) Step of removing the metal foil by electrolytic dissolution method or chemical dissolution method, and (d) Step of removing the resist printed part by ultrasonic vibration method or solvent dipping method. By sequentially performing these steps, a desired frame pattern is formed. FIG. 6 shows a simple process diagram of the series of steps described above. FIG. 7 is an illustration of a method and apparatus for continuously manufacturing a metal frame according to the present invention. In the figure, 4 is a metal foil serving as a seed plate and a coiled carrier, and 6 is a roller coater for resist printing. A resist ink in a pattern opposite to the desired frame pattern is applied to the metal foil 4 through a roller coater 6. Although not shown in the figure, the roller coater 6 is equipped with an exposure device and a developing device. Resist ink is applied through a roller coater 6, and the printed metal foil 4 passes through an electroplating tank 7. After a plating layer of a desired thickness is formed on the exposed portion, it passes through a metal foil dissolving tank 8. The metal foil 4, which is etched from both sides and serves as a seed plate, is dissolved and removed by etching. lastly,
The resist ink layer present between the plated layers is removed through the resist removal tank 9 by ultrasonic vibration or solvent immersion. Through this series of steps, the metal frame 10 with a fine pattern can be continuously manufactured. Examples of the present invention will be described in detail below. [Example] A copper metal foil 4 having a thickness of 0.02 mm as shown in FIG. 2 was used as a seed plate and a coiled carrier for manufacturing a copper metal frame 1 having a frame pattern (having an opening 2) shown in FIG. Prepare. This metal foil 4 is planned to be electroplated to a thickness of 0.15 mm. The dimensions of metal foil 4 are width 40mm and length 200mm.
Use mm. Regarding the width of 40mm, the slit width will be cut to 40mm at the end, so the 40mm width will be cut at the end.
You may use one with a width of mm or more. FIG. 1 shows a state in which a resist ink 3 having the pattern shown in the figure is negatively printed on one surface of this kind of metal foil 4. As shown in FIG. Figure 2 shows its cross section. The film thickness of the negative printed resist ink 3 varies depending on the thickness of electroplating to be applied later, but when the thickness of electroplating is 0.15 mm, it is preferably in the range of 0.1 to 0.15 mm. Further, as a negative printing method, a method of applying photoresist ink using a roller coater method or a method of pasting a dry film is preferable because the film thickness of the ink 3 can be increased. Next, copper was electroplated on the surface of the metal foil 4.
The state is shown in FIG. The electroplating layer 5 is formed on the exposed portion of the surface of the metal foil 4, that is, the portion not coated with resist. The thickness can be obtained by electroplating according to the film thickness of the resist ink 3 until the desired plating thickness is achieved. The thickness of the electroplated layer 5 can be controlled with an accuracy of ±0.01 mm by adjusting the current applied and the required time. Next, the metal foil 4 electroplated with copper was passed through a copper etching solution (dissolving tank 8 in FIG. 7) to dissolve and remove at least the copper metal foil 4 serving as the seed plate. This state is shown in FIG. In this case, a portion of the electroplated layer 5 was also dissolved and removed, but the amount removed by dissolution was approximately the same as the thickness of the metal foil 4 serving as the seed plate, 0.02 mm. Therefore, it is only necessary to take this into account in advance and plate thickly during electroplating. Finally, the resist ink 3 present between the plating layers was removed through a resist ink removal tank 9. That state is the fifth
As shown in the figure. That is, FIG. 5 shows a copper metal frame 5 having a fine pattern. Incidentally, the following table shows an economic comparison between the method for manufacturing a metal frame based on this embodiment and the conventional pressing method and etching method for manufacturing a metal frame of the same material and size and shape.

【table】

[Table] From the above table, it is clear that the present invention is more economical than the etching method. Also, compared to the press method, when producing small quantities of 20,000 frames or less, the press method requires 3,000,000 ÷ 20,000 =
The cost is 150 yen, which shows that the present invention is more economical. [Effects of the Invention] As is clear from the above description, according to the frame pattern forming method of the present invention, a thin metal foil is prepared as a seed plate and plated, thereby forming a metal frame by plating. This is an economical method because it does not require preparing a metal foil of the required thickness as a starting material, and it is also an economical method that allows patterns to be formed continuously using a coil feeding method by using a seed plate as a carrier. Therefore, there is an effect that a metal frame having a fine pattern can be advantageously manufactured economically and extremely efficiently. Its industrial value is clear from the table, and the method of the present invention skillfully overcomes the drawbacks of conventional pressing and etching methods.

[Brief explanation of drawings]

FIG. 1 is a plan view of a metal frame according to an embodiment of the present invention, FIGS. 2 to 5 are explanatory diagrams showing each step of a method for forming a pattern of a metal frame according to an embodiment of the present invention, and FIG. 7 is a simple process diagram showing each step of the present invention, and FIG. 7 is an explanatory diagram of a method and apparatus for continuously manufacturing a metal frame according to an embodiment of the present invention. 1: copper metal frame, 2: opening, 3: resist ink, 4: metal foil, 5: plating layer, 6: roller coater, 7: electroplating tank, 8: dissolving tank, 9: resist removal tank, 10: Metal frame with a fine pattern.

Claims (1)

[Claims] 1 (a) Prepare a metal foil with a thickness of 0.1 mm or less as a seed plate and coiled carrier for pattern formation,
(b) A plating layer with a thickness of at least 0.2 mm of the metal foil by electroplating or chemical plating on the exposed part of the metal foil. a process of forming
Formation of a frame pattern characterized by comprising the steps of (c) removing the metal foil by electrolytic dissolution or chemical dissolution, and (d) removing the resist-printed portion by ultrasonic vibration or solvent immersion. Method.