JPS6333582A - Etching method - Google Patents

Abstract

PURPOSE:To continuously produce products patterned by etching with superior shape accuracy by printing patterns of an ink repelling substance on the surface of an amorphous metallic strip, coating etching resist ink and carrying out etching with an etching soln. CONSTITUTION:A thin amorphous metallic strip 1 is continuously drawn from a reel A and patterns of a substance repelling etching resist ink are printed on the surface of the strip 1 with a printer B in accordance with a pattern formed on the surface of a roll B4. The etching resist ink is coated on the parts not covered with the ink repelling substance with a coater C and the ink is dried and cured with a lamp D. An etching soln. is then sprayed from spray nozzles F to etch the patterns of the ink repelling substance. The resulting patterned products of the etching resist ink are put in a product receiving box I through a conveyor H.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an etching method for forming a predetermined patterned pattern on a processed metal surface.

[Conventional technology]

In recent years, amorphous metals have attracted academic and industrial attention. Amorphous metals are manufactured by melting an alloy material and then ultra-quenching it or sputtering it using high frequency, and have high hardness, tensile strength, electrical resistance,
Due to its excellent corrosion resistance and magnetic properties, it is beginning to be put into practical use as a new industrial material.

Because amorphous metals are manufactured in the form of thin films, ribbons, powders, and thin wires, they must be processed according to the purpose of use. For example, if we focus on high electrical resistance and excellent magnetic properties and use it as an iron core material for magnetic heads, saturable reactors, electrocadrans, high frequency transformers, etc., it is possible to shape thin sheets of amorphous metal into desired shapes. However, when manufacturing amorphous metal materials using the single roll method, which has excellent productivity, the plate thickness is 20 mm.
Since it is as thin as ~50 μm, there is a disadvantage that processing distortion occurs in the periphery of the thin plate during hammer processing, resulting in deterioration of electrical and ceramic properties.

Therefore, a processing method that uses etching technology to shape a thin plate of metal material has also been devised.

The etching process used to process the above-mentioned amorphous metal thin plates is a process in which a resist layer with a predetermined pattern is provided on the processed surface of the metal, and this processed surface is etched with an etching solution to process it into a predetermined pattern. , the resist layer has the role of protecting a portion of the workpiece set as an unprocessed portion from the etching solution during etching.

The above resist layer can be formed by exposing a photoresist based on a photosensitive material such as a photosensitive resin to obtain a resist layer with a predetermined pattern, or by printing an etching resist ink using screen printing, etc. The photoresist is exposed to light to obtain a resist layer with a predetermined pattern.However, although the resist layer is obtained by exposing the photoresist to light, high-precision processing can be performed, but the cost of the resist material is high and the exposure Since this method has the disadvantage of increasing the number of man-hours required for the process and making the entire process intermittent, it has been considered that a printing method using etching resist ink, which would reduce the cost of the resist material and reduce the number of processing steps, was considered.

[Problem that the invention seeks to solve]

However, the printing method that allows a thick resist layer to be formed on the curved L surface has a limitation in accuracy and has the problem that fine patterns cannot be processed.

That is, when forming a resist layer using etching resist ink, the thickness of the resist layer must be about 5 to 20 μm to provide sufficient resistance to the etching solution, and the material on which the resist layer is to be formed in this etching process must be These are metal films of printing substrates (flexible, rigid), metal wafers, nameplates, etc., and because they are more rigid and less flexible than normal printing materials (paper, film, etc.), the materials have a thickness of 5 to 20 μm. The printing method for providing a resist layer with a certain thickness is limited to screen printing or the like.

Furthermore, when attempting to form a thick resist layer using screen printing, the printing plate must be supported by a screen. It is especially difficult to support a small printing plate, and the resist layer is formed into a predetermined pattern. The problem is that it cannot be installed in

(Means for Solving the Problems) The present invention has been made in consideration of the above-mentioned conventional problems, and is made by applying an ink-repellent material that does not accept etching resist ink to the metal processing surface to make it insensitive. The metal processed surface is divided into an ink non-receiving part made of the desensitized layer and an ink receiving part of a predetermined pattern that receives etching resist ink, and the etching resist ink is applied to the metal processed surface to form an ink receiving part. The conventional problems are solved by providing a thick resist layer made of etching resist ink on the metal surface and etching the processed metal surface with an etching solution.

[For production]

In the present invention, an ink-repellent substance that does not receive etching resist ink is printed and coated on the processed metal surface, and the processed metal surface is divided into an ink receiving area and an ink non-accepting area. The etching resist ink was selectively transferred to the evaporation portion, and the ink-unreceiving portions other than the resist layer were etched away by the etching solution to obtain a T-work material having a predetermined shape.

〔Example〕

Next, the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 11.

FIG. 1 is a schematic diagram of an apparatus for carrying out the etching method of the present invention, and the illustrated example is a case where the stator core of a generator is manufactured from an amorphous metal.

A strip plate 1, which is a processed material, is wound around the reel 8, and the strip plate 1 is continuously and slowly unwound from the reel by a tensioning means (not shown). A device B for printing an ink repellent substance on one side of the strip and a device C for applying etching resist ink are provided on the exit side of the reel.

'4 & Place B for printing an ink repellent material consists of a container B1 containing the ink repellent material, a roll B2 that rotates while immersed in the ink repellent material, a roll B3 that rotates while contacting the roll B, and a rubber surface. It is composed of a roll B4 which has a preformed evaporation turn and rotates while contacting the roll B3, and a driven roll B5 which is located on the opposite side of the band plate and presses against the roll B4 with the band plate interposed therebetween.

On the other hand, the device WC for applying etching resist ink is an O-
A roll C2 that rotates while in contact with the roll C1 and applies etching resist ink to the strip, and a driven roll C3 that is in the range of the strip and presses against the roll C2 with the strip sandwiched therebetween. It is composed of.

The printed coating pattern provided on the surface of the roll B4 of the device B is a reversal pattern of the processed pattern or the shape pattern of the part to be obtained by etching, that is, the shape of the part to be etched into the strip by the etching solution. As shown in the example, in the case of the stator core of a generator, Figure 2 (a) and (b)
This results in pattern a indicated by diagonal lines. In FIGS. 2(a) and 2(b), b, . . . are processed pieces, and holes for conveyance are bored at regular intervals on both sides of the strip.

A lamp D is provided on the downstream side of the apparatus C along the traveling direction of the strip for drying and curing the etching resist ink applied to the strip as necessary. Furthermore, a conveyance roller E for conveying the strip is provided further downstream in the traveling direction of the strip.

E is a spray nozzle that sprays etching liquid onto the processed side of the strip, G is a roller that rolls up the strip from which the processed piece has fallen, H is a belt that conveys the processed piece, and I is the processed piece. The receiving box is the box.

In addition, if the belt plate is a flexible printed circuit board that processes only the metal surface of one side into a predetermined pattern, the belt H
Box I is not necessary for this and Uke.

Next, a method of etching a strip using the above-mentioned apparatus will be explained.

As the strip 1 is continuously pulled out from the reel A and moves, an ink-repellent substance is printed in a predetermined pattern on the processing surface side by an apparatus B, and an etching resist ink is applied by an apparatus C. Then, the etching resist ink is dried and hardened by the lamp D.

Strip plate 1 coated with etching resist ink in this way
is conveyed by the conveyance roller E and spray nozzle F
Etching solution is sprayed from When the etching liquid is sprayed, unnecessary parts are etched and the processed piece falls off from the strip 1 (as mentioned above, if the strip is a flexible printed circuit board, a wiring pattern is formed on the metal surface). ), the uke is stored in a box.

FIG. 3 shows a state in which an ink-repellent material is printed by the device B in the etching culm, and the ink-repellent material is printed on the part of the metal processed surface 20 of the metal material 2 of the band plate 1 to be etched by the etching solution. A desensitized layer 3 made of a substance is provided, and by providing this desensitized layer 3, the metal processing surface 20 is divided into an ink receiving section 4 and an ink non-accepting section 5.

Next, as shown in FIG.
When etching resist ink is applied to the substrate 0, the etching resist ink is selectively transferred. That is, the etching resist ink is not received by the desensitized layer 3 constituting the ink non-accepting portion 5, but is received and transferred only to the ink receiving portion 4 where the desensitized layer 3 is not present. A resist layer 6 made of etching resist ink is formed in the ink receiving portion 4, and the resist layer 6 is dried and hardened by being irradiated with light from a lamp.

When the strip 1 with the hardened resist layer 6 is transported and sprayed with an etching solution, the desensitized layer 3 is dissolved or peeled off, and the processed surface of the ink non-receptive area 5 is etched (4th.
(See Figure 5.6). Then, by removing the resist layer 6 with an alkali, solvent, etc., it is possible to obtain a part molded into a predetermined shape on the support.

In addition, as shown in FIGS. 7 to 11, there are cases in which the metal material 2 is laminated on the support 10 (see FIG. 7), and the metal material 2 is provided on both the front and back surfaces of the support 10 (see FIG. 8). (see figure), a combination of two pieces of metal material 2 only (see figure 9), and a piece of only one piece of metal material 2 (see figure 10), and perform etching from both the front and back sides. You can also do it.

In the embodiments shown in FIGS. 1 to 6, a resist layer 6 made of etching resist ink was provided on the surface of the band plate 1 to which the etching solution was sprayed, but as shown in FIG. A resist barrier may be provided, and in this case, scattering of the etching solution and unnecessary etching due to the etching solution adhering to the feed roll can be prevented. Further, instead of the etching resist ink, the protective layer may be formed of copper foil, polyester, polyimide, etc., which are resistant to etching liquid.

The etching resist ink used in the present invention is not a commercially available oil-based etching resist ink specified in b, but any oil-based etching resist ink can be used. Due to the difference in ink drying methods, these oil-based etching resist inks are available in solvent-dried type V.
Depending on the method of removing the resist layer, there are a hardening type, a solvent dissolution removal type, a solvent swelling removal type, an alkali dissolution removal type, and an alkali swelling removal type, and any of them can be used. There are some differences in wettability and adhesion to the desensitized layer depending on the type of etching resist ink used, and tJVIZ type is preferable to solvent drying type.

The ink-repellent substance forming the desensitized layer used in the present invention must be one that does not interfere with the etching of the etching solution. This is a water-based ink that uses a polymer as a vehicle. Water-soluble polymers include natural polymers such as gum arabic and tragane rubber, and cellulose-based polymers such as CMC (carboxymethylcellulose), l-IEC (hydroxyethylocellulose), and MEC (methylethylcellulose). ', alginic acid and its derivatives, PVC (polyvinyl chloride), polyacrylic acid,
Synthetic polymers such as maleic anhydride copolymers and various water-soluble polymers can be used. The content of these water-soluble polymers is approximately 0.5 to 35% by weight of the printing ink.

Alkali or acids can be added to adjust the solubility of these polymers and adjust the viscosity and fluidity of the printing ink, and pigments can be added to adjust the fluidity of the printing ink. Can be done. Other additives that may be used include coloring agents for visually confirming printing position, and foam inhibitors/antifoaming agents for suppressing ink foaming during printing.

The printing method of the above ink repellent material is not particularly limited, but
In order to reduce etching defects and stains of the etching solution during etching, it is necessary to print as neatly as possible. In the present invention, dry offset, flexo, or gravure A' offset is preferred because the printing material is metal or the like and requires precise printing. It is also preferable to print and dry an ink-repellent substance to thicken and gel the desensitized layer. A preferable dry state of the desensitized layer is such that the water content after drying of the desensitized layer is approximately 10 to 50% by weight.

The etching resist ink is applied during the formation of the desensitized layer (drying process), but the method for applying this etching resist ink is as follows:-F As mentioned above, the etching resist ink is first transferred onto a roll and then applied to the surface to be processed. A roll coater or a gravure coater can also be used. In addition, various application methods can be used, such as application with bristles, whistle, etc., flow application, and dipping in a liquid bath. Furthermore, the etching resist layer can be applied multiple times to increase the thickness of the resist layer.

Note that the etching method of the present invention is not limited to the method of continuously etching a continuous band plate as in the embodiment described above, but the etching process of etching one or several pieces from one metal plate. It is also possible to prepare a sheet of metal plate in a predetermined shape and perform etching to obtain a part.

Next, examples of etching using various metal thin plates will be shown.

(Example 1) Water-soluble desensitized ink using polyvinyl alcohol as a vehicle was dry-offset printed in the same pattern on opposite sides of the front and back sides of an amorphous metal thin plate.
After air drying for a few seconds, a solvent drying type etching resist ink was roll coated.

The area printed with the water-soluble desensitized ink repelled the etching resist ink and could be applied in a predetermined pattern. After drying, etching was performed with a ferric chloride solution to obtain an amorphous metal thin plate molded into a predetermined shape.

(Example 2) On a flexible printed circuit board, 5% carboxymethylcellulose (CMC) vehicle and 8% calcium carbonate were added.
% water-based desensitized ink was printed by Fregisography. After printing, the ink was air-dried at 60° C. for 10 seconds to gel, and LIV curing type etching resist ink was roll coated.

The area printed with the water-soluble fat-desensitized ink repelled the U-curing type etching resist ink and was able to be applied in a predetermined pattern.

After forming the UVM type positive etching resist ink, the thickness of the resist layer was 15 μm. After cooling, etching was performed with ferric chloride solution. A shaped copper foil pattern was obtained.

(Example 3) Dry offset printing of water-soluble desensitized insulator 4 made of polyvinylamine as a vehicle was carried out in the same pattern on opposite positions of the front and back sides of a thin stainless steel plate, and after air drying at 50°C for 10 seconds, solvent dry etching was performed. Roll coated with resist ink.

The area printed with the water-soluble desensitized ink repelled the solvent-dried etching resist ink and could be applied in a predetermined pattern. After drying, it was etched with a ferric chloride solution to obtain a stainless steel plate that was molded into a predetermined shape without being affected by the desensitized layer.

〔Effect of the invention〕

As explained above, according to the present invention, on the metal processing surface,
A desensitized layer is provided by printing and applying an ink repellent substance that does not accept etching resist ink, and the metal processed surface is formed into an ink non-receptive area made of the desensitized layer and an ink receiving area of a predetermined pattern that accepts the etching resist ink. The etching resist ink is applied to the metal processed surface, a thick resist layer made of the etching resist ink is provided in the ink receiving part, and the metal processed surface is dissolved and removed with an etching liquid. It is no longer necessary to use a limited printing method to apply a thick layer of etching resist ink directly onto the processing surface, and the printing method for forming the resist layer can be freely selected, allowing for printing as appropriate depending on the workpiece and processing precision. The method can be used to apply an etch resist ink. Additionally, since a desensitized layer is provided, the etching resist ink can be applied in a predetermined pattern, and the etching resist ink can be distorted over and over again without alignment, making it easy to create a sufficiently thick resist layer. can be formed into Furthermore, since we use inexpensive etching resist ink, processing costs for processed materials are reduced, and there is no exposure process when using photoresists, allowing continuous processing, which makes it far more practical. It is something to play.

[Brief explanation of the drawing]

Fig. 1 is a process schematic diagram showing an embodiment of the etching method of the present invention, Figs. FIG. 4 is an explanatory diagram showing a state in which a resist layer according to the present invention is provided. FIG. 5 is an explanatory diagram showing a state in which an etching solution is sprayed. FIG. 6 is an explanatory diagram showing a state in which an etching solution is sprayed. Explanatory drawings showing the state, FIGS. 7 to 10 show other examples of the strip, FIG. 7 is an explanatory drawing showing a strip having a metal material on the surface of the support, and FIG. 8 shows the support. An explanatory view showing a band plate having metal materials on the front and back of the body, Fig. 9 an explanatory view showing a band plate made of two metal materials only, and Fig. 10 an explanatory view showing a band plate made of only one metal material. 11 are explanatory diagrams of an example in which a resist layer is also provided on the top surface of the metal material. 1... Strip plate 2... Metal material 3... Desensitized layer 4... Ink receiving section 5... Ink non-accepting section 6...Resist layer patent applicant Trapin Moore Co., Ltd. (A) WIa Figure 4 @ Figure 5 Figure 6t! 1 Figure 7

Claims (1)

[Claims] A desensitized layer is provided on the metal surface using an ink-repellent substance that does not accept etching resist ink, and the metal surface is formed into an ink-receptive area consisting of the desensitized layer and a predetermined pattern of ink receiving areas that accept the etching resist ink. An etching process characterized by applying etching resist ink to the metal processed surface, providing a thick resist layer made of etching resist ink in the ink receiving part, and etching the metal processed surface with an etching solution. Method.