JPH07122145B2 - Etching processing method - Google Patents

Description

The present invention relates to an etching processing method for forming a predetermined processing pattern on a metal processing surface.

[Prior Art] In recent years, amorphous (amorphous) metals have been paid attention academically and industrially. Amorphous metal is produced by melting alloy material and then ultra-quenching or sputtering using high frequency, high hardness, tensile strength, electric resistance,
Since it has excellent corrosion resistance and magnetic properties, it is being put to practical use as a new industrial material.

Amorphous metals are produced in the form of thin films, ribbons, powders, and fine wires according to the production method, and thus must be processed according to the application. For example, when considering the use as a core material for magnetic heads, saturable reactors, power transformers, high-frequency transformers, etc., paying attention to high electrical resistance and excellent magnetic characteristics, a thin plate of amorphous metal can be formed into a desired shape. It is necessary to process into a desired thickness and laminate to a desired thickness, but when manufacturing an amorphous metal material by the single roll method with excellent mass productivity, the plate thickness is 20 ~
Since the thickness is as thin as 50 μm, there is a disadvantage that the punching process causes a working strain in the peripheral portion of the thin plate and deteriorates the electrical and magnetic characteristics.

Therefore, a processing method using an etching technique has been devised for processing a thin plate of a metal material.

The etching process used for processing the above-mentioned amorphous metal thin plate is a process in which a resist layer having a predetermined pattern is provided on a metal processing surface, and the processing surface is etched with an etching solution so that the processing can be performed into a predetermined pattern. Then, the resist layer has a role of protecting the portion set as the non-processed portion of the processed object from the etching solution during the etching process.

As a method of forming the above resist layer, a photoresist having a photosensitive material such as a photosensitive resin as a base material is exposed to obtain a resist layer having a predetermined pattern, and an etching resist ink is printed by screen printing or the like. In order to obtain a resist layer by exposing the photoresist to the photoresist layer, high-precision processing can be performed, but the cost of the resist material is high and the exposure step Since there is a drawback in that the number of steps is increased and all the steps are intermittent, a printing method using an etching resist ink has been considered, which makes the cost of the resist material low and the number of processing steps small.

[Problems to be solved by the invention]

However, there is a problem in that a printing method capable of obtaining a thick resist layer on a processed surface has a limit of accuracy and a fine pattern cannot be processed.

That is, when the resist layer is provided by the etching resist ink, the thickness of the resist layer that obtains sufficient resistance to the etching solution is required to be about 5 to 20 μm, and the material for which the resist layer is provided in this etching process is It is a metal film of a printed circuit board (flexible or rigid), a metal wafer, a nameplate, etc., and it has a high rigidity and poor flexibility compared to ordinary printed materials (paper, film, etc.). The printing method for providing a resist layer having a certain thickness is limited to screen printing.

Furthermore, if an attempt is made to provide a thick resist layer using a screen printing method, the plate film must be supported by a screen, and it is very difficult to support a small plate film. The problem is that it cannot be installed in the.

[Means for solving problems]

The present invention has been made in consideration of the above-mentioned conventional problems, in which a metal-worked surface is provided with a desensitizing layer by an ink repellent substance that does not accept an etching resist ink, and the metal-worked surface is desensitized. It is divided into an ink non-receptive part consisting of a layer and an ink accepting part of a predetermined pattern that accepts etching resist ink. By providing and etching the metal-worked surface with an etching solution, the conventional problems are solved.

[Work]

In the present invention, an ink-repellent substance that does not receive an etching resist ink is applied by printing onto a metal-working surface, and the metal-working surface is divided into an ink receiving portion and an ink non-receiving portion, and a predetermined processing including an ink receiving portion is performed. The etching resist ink was selectively transferred to the pattern portion, and the ink non-receptive portion other than the resist layer was etched by the etching solution to obtain an industrial material having a predetermined shape.

〔Example〕

Next, the present invention will be described in detail based on the embodiments shown in FIGS. 1 to 11.

FIG. 1 is a schematic view of an apparatus for carrying out the etching method of the present invention, and the illustrated example is a case where a stator core of a generator is made of an amorphous metal.

A strip 1 as a processed material is wound around the reel A, and the strip 1 is continuously and slowly unwound by a pulling means (not shown). A device B for printing the ink-repellent substance and a device C for applying the etching resist ink are provided on one side of the strip at the position on the outlet side of the reel.

The device B for printing the ink-repellent substance has a container B ₁ containing the ink-repellent substance, a roll B ₂ which rotates while being immersed in the ink-repellent substance, a roll B ₃ which rotates while being in contact with the roll B ₂ , and a surface thereof. a roll B ₄ that rotates while being in contact with the roll B ₃ has a rubber processing pattern, roll B ₅ which presses driven across the strip against the roll B ₄ in the opposite side of the strip
It is composed of and.

On the other hand, the device C for applying the etching resist ink is
Roll that rotates while immersed in etching resist ink
C ₁ , a roll C ₂ which rotates while contacting the roll C ₁ and applies the etching resist ink to the strip plate, and a roll which is in the range of the strip plate and is pressed against the roll C ₂ with the strip plate sandwiched between them. It is composed of C ₃ and.

The printing coating pattern provided on the surface of the roll B ₄ of the device B is a processing pattern desired to be obtained by etching, or a reverse pattern of the shape pattern of the component, that is, the shape of the portion where the strip plate is etched by the etching solution. In the case of the stator core of the generator as in the embodiment, the pattern a is shown by the diagonal lines in FIGS. Note that Fig. 2 (a) (b)
, B, ... Are processed pieces, and transport holes are formed on both sides of the strip at regular intervals.

A lamp D is provided downstream of the apparatus C along the traveling direction of the strip plate to dry and cure the etching resist ink applied to the strip plate as necessary. Further, a transport roller E for transporting the strip is provided further downstream in the traveling direction of the strip.

F is a spray nozzle that sprays the etching liquid on both sides of the strip, G is a roll that winds the strip with the strip removed, H is a belt that conveys the strip, and I is a receiving box that receives the strip. Is.

If the strip plate is a flexible printed circuit board in which only one metal surface is processed into a predetermined pattern, the belt H
And the inbox I is unnecessary.

Next, a method of etching the strip plate by the above apparatus will be described.

While the strip 1 that is continuously drawn from the reel A moves, the device B prints an ink-repellent substance in a predetermined pattern on the processing surface side, and the device C applies the etching resist ink. Then, the etching resist ink is dried and cured by the lamp D.

The strip 1 thus coated with the etching resist ink
Is carried by the carrying roller E and spray nozzle F
The etching liquid is sprayed from. When the etching liquid is sprayed, the unnecessary portions are etched and the processed pieces fall out of the strip 1 (when the strip is a flexible printed board as described above, a wiring pattern is formed on the metal surface. It will be stored in the inbox.

FIG. 3 shows a state in which the ink-repellent substance is printed by the device B during the above-mentioned etching process. The ink-repellent substance is applied to the portion of the metal working surface 20 of the metal material 2 of the strip 1 which is etched by the etching liquid. A desensitizing layer 3 made of a substance is provided, and by providing the desensitizing layer 3, the metal working surface 20 is divided into an ink receiving portion 4 and an ink non-receiving portion 5.

Then, as shown in FIG.
When the etching resist ink is applied to, the etching resist ink is selectively transferred. That is, the etching resist ink is not accepted by the desensitizing layer 3 which constitutes the ink rejecting portion 5, but is transferred only by the ink accepting portion 4 without the desensitizing layer 3. Then, a resist layer 6 made of an etching resist ink is formed in the ink receiving portion 4, and the resist layer 6 is dried and hardened by being irradiated with light from a lamp.

When the strip 1 on which the resist layer 6 has been cured is conveyed and the etching liquid is sprayed, the desensitizing layer 3 is dissolved or peeled off, and the processed surface of the ink non-receptive portion 5 is etched (fourth, fifth,
(See Figure 6). Then, by removing the resist layer 6 with an alkali, a solvent or the like, it is possible to obtain a part stamped into a predetermined shape on the support.

As shown in FIGS. 7 to 11, one in which the metal material 2 is laminated on the support 10 (see FIG. 7), one in which the metal material 2 is provided on both front and back surfaces of the support 10 (see FIG. 8). (See FIG. 9), a combination of only two metal materials 2 (see FIG. 9), and one metal material 2
It is also possible to use the only one (see FIG. 10) and perform the etching process from both front and back sides thereof.

In the embodiment shown in FIGS. 1 to 6, the resist layer 6 made of the etching resist ink is provided on the surface of the strip 1 on which the etching solution is sprayed, but as shown in FIG. A resist layer may be provided, and in this case, the etching solution can be prevented from scattering and adhering to the feed roll to prevent unnecessary etching by the etching solution. Also, instead of etching resist ink,
The protective layer may be formed of copper foil, polyester, polyimide or the like having resistance to the etching liquid.

The etching resist ink used in the present invention is a commercially available oil-based etching resist ink and is not specified, and any oil-based etching resist ink can be used. These oil-based etching resist inks include solvent drying type and UV curing type due to the difference in ink drying method, and solvent dissolution removal type, solvent swell release type, alkali dissolution removal type and alkali swell release type due to difference in resist layer removal method. Etc., but either can be used. Depending on the type of the etching resist ink used, there is a slight difference in the wettability and the adhesion to the desensitized layer, and the UV curable type is preferable to the solvent dry type.

The ink-repellent substance that forms the desensitizing layer used in the present invention must be one that does not interfere with the etching of the etching solution. A water-based ink that uses a water-soluble polymer as a vehicle. As water-soluble polymers, natural polymers such as gum arabic and tragacanth, CMC (carboxymethyl cellulose), HEC (hydroxyethyl cellulose) and MEC
Cellulose derivatives such as (methylethyl cellulose),
It is possible to use synthetic polymers such as alginic acid and its derivatives, PVC (polyvinyl chloride), polyacrylic acid, and maleic anhydride copolymer, and various water-soluble polymers. The content of these water-soluble polymers is about 0.
5 to 35% by weight. Adjust the solubility of these polymers,
An alkali or an acid can be added to adjust the viscosity and fluidity of the printing ink, and a pigment can be added to adjust the fluidity of the printing ink. As other additives, it is possible to use a colorant for visually confirming the printing position and a foam suppressor / antifoaming agent for suppressing ink foaming during printing.

The printing method of the ink repellent substance is not particularly limited,
It is necessary to print as thinly as possible in order to reduce etching defects and stains of the etching solution during etching. In the present invention, since the material to be printed is a metal or the like and requires precise printing, dry offset, flexo or gravure offset is preferable. Further, it is preferable to dry the ink-repellent substance after printing to thicken the desensitized layer. The preferred dry state of the desensitized layer is about 10 to 50% by weight of water after the completion of the drying of the desensitized layer.

After forming the desensitizing layer (after drying), the etching resist ink is applied. The method of applying the etching resist ink will be described in the case where it is once transferred onto the roll and then applied to the surface to be processed later as described above. A roll coater or a gravure coater can also be used. In addition, various coating methods such as brush coating, brush coating, fluidized coating, and dipping in a liquid tank can be used. Furthermore, the etching resist ink can be applied multiple times to increase the thickness of the resist layer.

The etching method of the present invention is not limited to the method of continuously etching a continuous strip plate as in the above-described embodiment, but one or several metal plates can be used. It is also possible to prepare a sheet-shaped metal plate having a predetermined shape so that parts can be obtained, and perform etching.

Next, examples of etching processing using various metal thin plates will be shown.

(Example 1) Water-soluble desensitizing ink using polyvinyl alcohol as a vehicle was dry-offset printed in the same pattern on opposite sides of an amorphous metal thin plate in the same pattern, air-dried at 50 ° C for 10 seconds, and then solvent-dried. The etching resist ink was roll-coated.

The portion printed with the water-soluble desensitizing ink repelled the etching resist ink and could be applied in a predetermined pattern. After drying, etching was performed with a ferric chloride solution to obtain an amorphous metal thin plate stamped into a predetermined shape.

(Example 2) Carboxymethyl cellulose (CMC) 5% vehicle and calcium carbonate 8% on a flexible printed circuit board.
The aqueous desensitized ink containing was printed by flexographic printing. After printing, the ink was gelated by air-drying at 60 ° C. for 10 seconds, and the UV-curable etching resist ink was roll-coated.

The part printed with the water-soluble desensitizing ink repelled the UV-curable etching resist ink and could be applied in a predetermined pattern.

After curing the UV-curable etching resist ink, the thickness of the resist layer is 15 μm. When cooled and etched with ferric chloride solution, it is not affected by the desensitizing layer, and it is printed on the flexible printed circuit board. A shaped copper foil pattern was obtained.

(Example 3) Water-soluble desensitizing ink using polyvinylamine as a vehicle was subjected to dry offset printing in the same pattern on opposite sides of a stainless steel thin plate, dried at 50 ° C. for 10 seconds, and then solvent-dried etching resist ink. Was roll coated.

The portion printed with the water-soluble desensitizing ink repelled the solvent-drying etching resist ink and could be applied in a predetermined pattern. After drying, etching was carried out with a ferric chloride solution to obtain a stainless plate die-cut into a predetermined shape without being affected by the desensitizing layer.

〔The invention's effect〕

As described above, according to the present invention,
An ink receptive material that does not accept etching resist ink is applied by printing to form a desensitizing layer, and the metal-working surface has an ink non-receptive part consisting of the desensitizing layer and an ink receiving part with a predetermined pattern that accepts etching resist ink. The metal-worked surface is coated with an etching resist ink to form a thick resist layer of the etching resist ink on the ink receiving portion, and the metal-worked surface is dissolved and removed by an etching solution. There is no need to use a limited printing method for thickly depositing the etching resist ink directly on the processed surface, and the printing method for forming the resist layer becomes free, and appropriate printing is performed according to the work piece and processing accuracy. The method can be used to apply an etching resist ink. Further, since the desensitizing layer is provided, the etching resist ink can be applied in a predetermined pattern, and the etching resist ink can be overprinted any number of times without alignment, so that a sufficiently thick resist layer can be easily formed. Can be formed. Furthermore, since an inexpensive etching resist ink is used, the processing cost of the processing material is reduced, and there is no exposure step in the case of using a photoresist, and continuous processing can be performed. It is a thing.

[Brief description of drawings]

FIG. 1 is a schematic process diagram showing an embodiment of the etching method of the present invention, FIGS. 2 (a) and (b) are explanatory views showing a strip plate used in the embodiment, and FIG. FIG. 4 is an explanatory view showing a state in which an emulsified layer is provided, FIG. 4 is an explanatory view showing a state in which a resist layer according to the present invention is provided, FIG. 5 is an explanatory view showing a state in which an etching solution is sprayed, and FIG. 6 is etching. FIG. 7 to FIG. 10 show another example of the strip plate, FIG. 7 is an explanatory diagram showing the strip plate having a metal material on the surface of the support, and FIG. 8 shows the support. An explanatory view showing a strip having a metal material on the front and back of the body, FIG. 9 is an explanatory view showing a strip made by combining two metal materials only, and FIG. 10 is an explanation showing a strip made of only one metal material. FIG. 11 and FIG. 11 are explanatory views of an example in which a resist layer is provided on the back surface of a metal material. 1 ... Strip plate 2 ... Metal material 3 ... Desensitizing layer 4 ... Ink receiving part 5 ... Ink receiving part 6 ... Resist layer

Claims (1)

[Claims] 1. A metal working surface is provided with a desensitizing layer made of an ink repellent substance that does not accept an etching resist ink, and the metal working surface receives an ink non-receptive portion comprising the desensitizing layer and an etching resist ink. It is divided into an ink receiving portion having a predetermined pattern, an etching resist ink is applied to the metal processed surface, a thick resist layer made of an etching resist ink is provided in the ink receiving portion, and etching is performed with the metal processed surface etching liquid. Etching method.