CN105366096A - Packaging structure and feeder for SMT type electronic elements - Google Patents
Packaging structure and feeder for SMT type electronic elements Download PDFInfo
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- CN105366096A CN105366096A CN201410421532.2A CN201410421532A CN105366096A CN 105366096 A CN105366096 A CN 105366096A CN 201410421532 A CN201410421532 A CN 201410421532A CN 105366096 A CN105366096 A CN 105366096A
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- electronic element
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Abstract
The invention provides a packaging structure for SMT type electronic elements. The packaging structure comprises a packaging belt. At least one element groove is formed in the packaging belt. The element grooves extend front and back in the length direction of the packaging belt. The element grooves are used for containing a plurality of sheet elements distributed front and back in the length direction of the packaging belt side by side. The cross sections of the element grooves are in polygonal or circular or oval shapes. When the cross sections of the element grooves are in the polygonal shapes, the longest diagonal line of the cross sections of the element grooves is smaller than the body diagonal line of the sheet elements. When the cross sections of the element grooves are in the circular or oval shapes, the maximum diameter of the cross sections of the element grooves is smaller than the body diagonal line of the sheet elements. Upward element placing openings are formed in the upper ends of the element grooves. When the packaging structure for the SMT type electronic elements is used for packaging the sheet elements, the packaging density is very high, and therefore packaging materials are saved. The sheet elements can be conveniently placed in the element grooves without using expensive and special packaging machines. Meanwhile, the packaging belt is simple in structure and easy to machine, and the packaging cost is greatly reduced accordingly.
Description
Technical field
The present invention relates to the packaging field of surface patch element, particularly relate to a kind of chip electronic element packaging structure and feed appliance.
Background technology
Structure to be as shown in Figure 1 applied to the chip electronic element (hereinafter referred to as " slice component ") of surface patch mounting process, what this slice component 1 generally included component body in cuboid 101 and was positioned at component body 101 end can bonding tip 102, by this slice component directly can being attached and is welded on the surface of PC board by bonding tip 102, not only eliminate contact conductor, and save the usable floor area of PC board.
US Patent specification US3608711 discloses a kind of blank for packing electronic devices and components carrier band, US Patent specification US4298120 discloses and to be a kind ofly placed in the compartment of carrier band by chip electronic component afterwards, then carrier band is wound on the technical scheme on reel.Particularly, as shown in Figure 2, the tape package 2 of slice component is made up of flexible carrier band 201 and reel 202, described carrier band 201 comprises a series of matrix element lattice 203 and sprocket hole 204 that are spacedly distributed along carrier band 201 length direction, the surface of described carrier band 201 is provided with one and is used for sealing a placement slice component in coverlay 205, matrix element lattice 203 of matrix element lattice 203.
Under normal circumstances, the carrier band of various sizes according to after professional standard injection mo(u)lding or punch forming, then to transport to element manufacturer by the manufacturer of carrier band.Slice component is one by one filled in the matrix compartment of carrier band by element manufacturer again, the opening of matrix compartment is sealed afterwards with a coverlay equal with carrier band length, the one side of coverlay is provided with adhesive layer, pressurization or heating on adhesive layer, thus make coverlay be fixedly attached on carrier band, then carrier band is wound on reel, slice component is transported to wiring board manufacturer.
Can use on the automatic assembling chip mounter of all parts of the world in order to ensure weaving into the slice component after carrier band, electron trade cuncil such as EIA (EIA) and JEDEC (Joint Electronic Device Engineering Council) has formulated the specific standards of carrier band.Such as, EIA standard EIA-481-B specifies the size of 8mm to 200mm injection mo(u)lding carrier band and 8mm to 12mm punch forming carrier band in detail, the matrix element lattice deposited comprising slice component and the size of sprocket hole and tolerance, to ensure that slice component is in packed and transported and use procedure, it can not be subjected to displacement and turn in matrix compartment, and by the guiding of sprocket hole with drive the position of specifying carrier band single-frame being sent to chip mounter, be convenient to chip mounter pick-up head and from matrix element lattice, slice component taken out.
The major defect adopting above-mentioned carrier band to add the tape package structure of reel is that packed bulk density is low, needs to consume a large amount of raws MAT'L.Such as: according to the regulation of electron trade standard EIA-481-B, the minimum interval held between two the matrix element lattice being of a size of 8 mm wide injection moulding carrier bands of the 1206 model slice components of 3mm × 1.5mm × 1.5mm is 2mm; Or the minimum interval held between two the matrix element lattice being of a size of 8 mm wide perforated tapes of 0603 model of 1.5mm × 0.75mm × 0.75mm is 1mm, two kinds of manner of packings are equivalent to every cm3 respectively and pack the slice component of 30 1206 models or the slice component of 100 0603 models.In other words, the slice component of each 1206 models approximately needs the packaging volume of own vol 5 times, and the slice component of each 0603 model approximately needs the packaging volume of own vol 11 times, and as can be seen here, its packed bulk density is very low.Particularly for the less slice component of size, its packaging volume can reach more than 100 times of packaged product volume.Data display according to statistics, consumes the paper pulp being equivalent to more than 100 ten thousand trees in 2007 for the paper carrying belt packing SMD electric capacity and paster type resistor.In addition, because matrix element lattice each in carrier band can only hold a slice component, and often kind of slice component all needs the matrix element lattice of corresponding size, therefore the maker of slice component must lay in the carrier band of a large amount of different size, is used for packing the slice component of different size.And carrier band itself has features such as volume is large, lightweight, single use, thus cause the transport of slice component maker and slice component user, storage and reclaim burden.
For these problems, the patent No. is that 4889229 US Patent specification disclose a kind of method adopting hard plastic magazine 3 as shown in Figure 3 to pack slice component, and each hard plastic magazine 3 is only provided with an element inlet 301 and a component outlet 302.Although this manner of packing can save packing, packaging time and storage and transport cost in large quantities, but multiple slice component leaves in the same space without isolation, can cause the collision between slice component and friction.Particularly for the slice component being similar to chip ceramic condenser and chip ceramic inductance be made up of soft metal electrode tip and hard ceramic body, the soft metal electrode tip of slice component and hard ceramic surface mutually collide and rub extremely easily damage slice component can bonding tip, and cause the metallic pollution of surface of ceramic body.In addition, slice component in described plastic casing random discharge after be difficult in the finite space of feed appliance by all slice components in a direction marshalling, provide in order.Therefore, the packing method of described hard plastic magazine is used not popularized so far.
Certainly, also there is at present some other slice component packaging structure and packing method, such as flat pattern pallet and long strip type plastic conduit are widely used in (only needing installation one or several on each wiring board) the large scale surface mount device packed and supply usage quantity is less, as encapsulated IC and package module etc., but this type of packing method is not suitable for packaging that is a large amount of, small size slice component.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of structure simple and the chip electronic element packaging structure that packed bulk density is high.
For achieving the above object, the invention provides a kind of chip electronic element packaging structure, comprise strap, at least one member slot is offered in described strap, described member slot extends before and after the length direction of strap, described member slot is for accommodating multiple slice component distributed side by side before and after strap length direction, the cross-sectional plane of described member slot is that polygon is circular or oval, when the cross-sectional plane of member slot is polygon, the most long-diagonal of member slot cross-sectional plane is less than the body diagonal of slice component; When the cross-sectional plane of member slot is circular or oval, the maximum gauge of member slot cross-sectional plane is less than the body diagonal of slice component; The upper end of described member slot is provided with an opening up element and puts into mouth.
Preferably, the width that mouth put into by described element is less than the width of slice component.
Preferably, the width that mouth put into by described element is greater than the width of slice component, and the upper surface of described strap is provided with and covers the upper cover that mouth put into by described element, rear formation one braid bonding with strap of this upper cover.
Further, also comprise a reel, this reel comprises spool and is located at the back-up ring at spool two ends, and two form one in circular host cavity between back-up ring and reel, described strap is arranged in this host cavity and reels on said reel.
Further, the lower surface of described upper cover be provided with at least one protrude downwards and the card article extended before and after upper cover length direction, the upper surface of described strap offers and extends and the draw-in groove suitable with card article before and after the length direction of strap, described card article and draw-in groove fasten.
Preferably, described card article comprises the neck being placed in upper end and the head being placed in lower end, and described card article and upper cover are structure as a whole.
Preferably, described member slot has multiple, multiple member slot along strap Width about be arranged side by side.
Further, described strap can conduct electricity or the inside face of strap that contacts with slice component through conductive processing.
Preferably, described upper cover is mutually bonding with strap by adhesives.
Preferably, described strap and upper cover are made by nonrigid material.
As mentioned above, the chip electronic element packaging structure that the present invention relates to, has following beneficial effect:
This chip electronic element packaging structure is when packing slice component, packed bulk density is very high, thus save packing, it is also without the need to using expensive specialized package machine just slice component can be put into member slot easily, and this strap structure simple, be easy to processing, and then greatly reduce packing cost.
Another object of the present invention is to provide a kind of be convenient to slice component to take out from described strap and slice component can be sent to the chip electronic element feed appliance of chip mounter specified location.
For achieving the above object, the invention provides a kind of chip electronic element feed appliance, comprise feed appliance body, described feed appliance body is provided with chip electronic element packaging structure as above, described feed appliance also comprises the connecting gear for pulling strap to move forward, positioning plate, be fixed on the sensor on positioning plate aft end face, and controller, described sensor is equal with the number of member slot, and sensor is positioned at directly over member slot, the front end of described strap is bent downwardly and is placed in connecting gear, described positioning plate is positioned at the front end of strap downward bend, for limiting the reach of slice component, described sensor is all connected with controller with connecting gear.
Further, described connecting gear comprises drive roll and the driven voller of the first free roll and pair of opposing, described first free roll is positioned at the lower end of strap, strap is bent downwardly from the first free roll and is placed between drive roll and driven voller, described drive roll is driven by the first drive motor, and this first drive motor is connected with controller.
Further, when being coated with upper cover on the upper surface of strap, described feed appliance body is also installed a mechanism for stripping for being peeled off from strap by upper cover, described mechanism for stripping comprises the second free roll and tension rolling wheel, described strap passes from the below of the second free roll, described upper cover from after strap is peeled off from the top of the second free roll through rear by rolling tension rolling wheel, described tension rolling wheel is arranged on feed appliance body, and tension rolling wheel is driven by the 3rd motor, 3rd motor is connected by tension force power-transfer clutch between taking turns with tension rolling.
As mentioned above, the chip electronic element feed appliance that the present invention relates to, has following beneficial effect:
Slice component can be taken out by this chip electronic element feed appliance from the strap of its packaging structure, and the specified location that slice component can be sent to chip mounter is picked up for the pick-up head of chip mounter, thus facilitates the use of chip electronic element packaging structure.
Another object of the present invention is to provide a kind of and is convenient to slice component to take out from strap and slice component marshalling can be sent to the chip electronic element feed appliance of chip mounter specified location.
For achieving the above object, the invention provides a kind of chip electronic element feed appliance, comprise feed appliance body, described feed appliance body is provided with chip electronic element packaging structure as above, described feed appliance also comprises the connecting gear for pulling strap to move forward, sorting mechanism, a gate sheet moving up and down, multiple sensor and the controller for slice component being sorted, and the front end of described strap is bent downwardly and is placed in connecting gear, described sorting mechanism comprises supporting, and a belt conveyor, described belt conveyor is enclosed within two delivery wheels, a delivery wheel in two delivery wheels is driven by the second drive motor, described belt conveyor is provided with a sequence passage, described supporting offer equal with member slot number, and the element delivery chute be connected with member slot, the rear end of supporting is positioned at the downward bend of strap, the front end of supporting is positioned at the rear end of belt conveyor, the length of the multiple element delivery chutes on supporting reduces from left to right or from right to left successively, the left and right sides of each element delivery chute rear end is equipped with the directing plate be obliquely installed, described directing plate is placed on the upper surface of belt conveyor, and the rear end of directing plate all extends to sequence passage place, described gate sheet is positioned at the front end of the shortest element delivery chute of length, sensor is positioned at directly over sequence passage, described sensor, connecting gear, gate sheet, second drive motor is all connected with controller.
As mentioned above, the chip electronic element feed appliance that the present invention relates to, has following beneficial effect:
Slice component can be taken out by this chip electronic element feed appliance from the strap of its packaging structure, and by sorting mechanism, multiple slice component shifted out from strap is sorted, by multiple slice component from left and right distribution sorting side by side become before and after the distribution of straight line, and the specified location slice component that multiple tandem distributes being sent to chip mounter is picked up for the pick-up head of chip mounter, thus facilitate the use of chip electronic element packaging structure.
Accompanying drawing explanation
Fig. 1 is the structural representation of slice component.
Fig. 2 is the structural representation of slice component tape package in prior art.
Fig. 3 is for packing the structural representation of the hard plastic magazine of slice component in prior art.
Fig. 4 is the structural representation of chip electronic element packaging structure in the present invention.
Fig. 5, Fig. 6, Fig. 7 are the different embodiments of strap in the present invention.
Fig. 8, Fig. 9 are the different embodiments of braid in the present invention.
Figure 10 is the structural representation of chip electronic element feed appliance in the present invention.
Figure 11 is the structural representation of connecting gear in Figure 10.
Figure 12 is another embodiment of chip electronic element feed appliance in the present invention.
Figure 13 is the structural representation of positioning plate and strap in Figure 10.
Figure 14 is the structural representation of gate sheet and supporting in Figure 12.
Figure 15 is the structural representation of mechanism for stripping in Figure 10.
Element numbers explanation
1 slice component
101 component bodies
102 can bonding tip
2 tape packages
201 carrier bands
202 reels
203 matrix element lattice
204 sprocket holes
205 coverlays
3 hard plastic magazines
301 element inlet
302 component outlet
4 straps
41 member slot
Mouth put into by 42 elements
43 draw-in grooves
5 upper covers
51 card articles
52 necks
53 heads
6 reels
61 spools
62 back-up rings
63 host cavities
7 feed appliance bodies
8 connecting gears
81 first free rolls
82 drive rolls
83 driven vollers
9 positioning plates
91 first grooves
92 first limiting sections
10 sensors
11 sorting mechanism
111 supportings
112 element delivery chutes
113 belt conveyor
114 sequence passages
115 delivery wheels
116 tilting sections
117 linear portions
12 gate sheets
121 second grooves
122 second limiting sections
13 pick-up heads
14 directing plates
141 first directing plates
142 second directing plates
143 the 3rd directing plates
144 the 4th directing plates
145 the 5th directing plates
15 mechanism for stripping
151 second free rolls
152 tension rolling wheels
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification sheets can understand other advantages of the present invention and effect easily.
Notice, structure, ratio, size etc. that this specification sheets institute accompanying drawings illustrates, content all only in order to coordinate specification sheets to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification sheets as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
The invention provides a kind of chip electronic element packaging structure, for packing chip electronic element (hereinafter referred to as " slice component ").As shown in Figure 4, this chip electronic element packaging structure comprises strap 4, at least one member slot 41 is offered in described strap 4, described member slot 41 extends before and after the length direction of strap 4, and described member slot 41 is for accommodating multiple slice component 1 distributed side by side before and after strap 4 length direction.The cross-sectional plane of described member slot 41 is that polygon is circular or oval, when the cross-sectional plane of member slot 41 is polygon, see Fig. 5 and Fig. 6, then the most long-diagonal of member slot 41 cross-sectional plane is less than the body diagonal of slice component 1, preferably, the cross-sectional plane of described member slot 41 is oblong or square or regular hexagon, when the cross-sectional plane of member slot 41 is circular or oval, see Fig. 7, the maximum gauge of member slot 41 cross-sectional plane is less than the body diagonal of slice component 1, thus slice component 1 cannot be overturn and turn in member slot 41, therefore slice component 1 can only to load in member slot 41 by its length direction and along its length or the length direction of member slot 41 successively form a line, it can not tuning in member slot 41, can avoid the metal of slice component 1 can collision between bonding tip 102 and component body 101 and friction, can also ensure in follow-up automatic feeding and automatic chip mounting process simultaneously, after slice component 1 is taken out by feed appliance from the member slot 41 of strap 4, slice component 1 can be placed correctly under the desired location in PC board according to the direction of specifying, thus ensure accuracy and the paster efficiency of paster.
Further, as shown in Figure 8, the upper end of described member slot 41 is provided with an opening up element and puts into mouth 42, put into mouth 42 by this element and slice component 1 can be put into member slot 41 easily, shift out outside member slot 41 to prevent slice component 1 from putting into mouth 42 from element after slice component 1 is put into simultaneously, the width that mouth 42 put into by described element is less than the width of slice component 1, when putting into slice component 1, element is put into mouth 42 and is slightly out of shape under the effect of external force, struts with both sides to the left and right, thus slice component 1 is put into member slot 41; Putting into slice component 1 and after removing external force, element is put into mouth 42 and resiled under the effect of its own resilient, slice component 1 to be remained in member slot 41.More preferably, the width that mouth 42 put into by described element can be greater than the width of slice component 1, the upper surface of strap 4 is provided with and covers the upper cover 5 that mouth 42 put into by described element, after this upper cover 5 is bonding with strap 4, slice component 1 to be enclosed in member slot 41 and to form a braid.
In the chip electronic element packaging structure that the present invention relates to, described member slot 41 has multiple, and multiple member slot 41 along strap 4 Width about be arranged side by side, preferably, described member slot 41 has 2 ~ 8; The slice component 1 be arranged side by side before and after multiple length direction along member slot 41 (i.e. the length direction of strap 4) is all placed with in each member slot 41, therefore this strap 4 can pack more slice component 1, its packed bulk density is very high, thus save packing, simultaneously, in the process of packaging slice component 1, just slice component 1 can be put into member slot 41 easily without the need to using expensive specialized package machine, and strap 4 structure simple, be easy to processing, and then greatly reduce packing cost.
Such as, when using this packaging structure to pack the slice component 1 of 0603 model, slice component 1 is of a size of 1.5mm × 0.75mm × 0.75mm, strap 4 is provided with 4 member slot 41, strap 4 is connected the braid of rear formation overall width with upper cover 5 is 4.0mm, thickness is 1.2mm, the width of each member slot 41 is 0.8mm, then the slice component 1 of 0603 model is joined end to end according to its length direction and load successively after in member slot 41, maximum packed bulk density is every cm3 550 slice components 1, it is equivalent to 5.5 times of traditional carrier band packaging structure, packaging volume needed for every slice component 1 is 4.8 times of itself volume, it is compared with traditional carrier band packaging structure, packaging volume saves 60%.The packaging structure that the present invention relates to is compared with duroplasts box packaging structure of the prior art, and slice component 1 can load in member slot 41 according to its length direction by an orderly manner, can avoid the collision between adjacent slice component 1 and friction simultaneously.
Further, as shown in Figure 4, also comprise a reel 6, this reel 6 comprises spool 61 and is located at the back-up ring 62 at spool 61 two ends, one is formed in circular host cavity 63 between two back-up rings 62 and reel 6, when on strap 4 not bonding upper cover 5 time, then strap 4 is arranged in this host cavity 63 and is wound on described spool 61; When on strap 4 during bonding upper cover 5, then the braid formed by strap 4 and upper cover 5 is arranged in host cavity 63 and braid is wound on described spool 61, thus greatly can reduce the space shared by braid, facilitates the storage of braid, deposits and transport.
Preferably, described upper cover 5 can be Split type structure, also can for integral structure, when upper cover 5 is Split type structure, the element of each member slot 41 is put into mouth 42 place and is all coated with a upper cover 5 be connected with strap 4, and namely the number of upper cover 5 is equal with the number of member slot 41; Or, the number of upper cover 5 is greater than 1 and is less than the number of member slot 41, now, a upper cover 5 can cover at least 2 elements be disposed adjacent and put into mouth 42, and as when a strap 4 is provided with 4 member slot 41, then corresponding element is put into mouth 42 and is also 4,4 upper covers 5 then can be set, each upper cover 5 covers an element and puts into mouth 42, or arranges 2 upper covers 5, and each upper cover 5 covers 2 elements be disposed adjacent and puts into mouth 42.More preferably, described upper cover 5 is integral structure, then mouth 42 put into by the element that upper cover 5 can cover member slot 41 all on a strap 4, and the width of upper cover 5 is equal with the width of strap 4.In the present embodiment, described upper cover 5 is mutually bonding with strap 4 by adhesives, peel strength (i.e. the bind strength of adhesives) between strap 4 and upper cover 5 should lower than the material damage intensity of strap 4 and upper cover 5, both can be separated from both bonding parts by upper cover 5 and strap 4.Described strap 4 and upper cover 5 are made by nonrigid material, and as plastics, rubber, paper etc., it has certain elasticity, can be convenient to after upper cover 5 and strap 4 are supported braid, be convenient to braid be wound on spool 61; Described strap 4 is in flats, so that rolling, and thermoplastic material all to be extruded by the mode of Shooting Technique and formed by strap 4 and upper cover 5 continuously, can add foaming effect in the process extruded, to save material and to regulate the soft or hard degree of product.
Further, as shown in Figure 9, the lower surface of described upper cover 5 be provided with at least one protrude downwards and the card article 51 extended before and after upper cover 5 length direction, the upper surface of described strap 4 offers and extends and the draw-in groove 43 suitable with card article 51 before and after the length direction of strap 4, described card article 51 fastens, so that opened repeatedly from strap 4 by upper cover 5 and fit with draw-in groove 43.In the present embodiment, described card article 51 comprises the neck 52 being placed in upper end and the head 53 being placed in lower end, and described card article 51 is structure as a whole with upper cover 5, to ensure the engaging intensity between card article 51 with draw-in groove 43.
Further, described strap 4 can conduct electricity or the inside face of strap 4 that contacts with slice component 1 through conductive processing, or, described strap 4 and upper cover 5 all can conduct electricity or the inside face of the inside face of strap 4 that contacts with slice component 1 and upper cover 5 all through conductive processing, to eliminate electrostatic, prevent the adsorption because electrostatic produces, this little to sizes of memory, lightweight slice component 1 is particularly important, can also prevent the damage because stored charge causes slice component 1 simultaneously.
In sum, the chip electronic element packaging structure packed bulk density that the present invention relates to is high, more packing can be saved, and this packaging structure integral structure simple, be easy to processing and manufacturing, can avoid the mutual collision between adjacent slice component 1 and friction, it is with the promotion of good sense simultaneously.
The present invention also provides a kind of chip electronic element feed appliance, and this feed appliance has two kinds of different embodiments.
Embodiment one, as shown in Figure 10 and Figure 11, described chip electronic element feed appliance comprises feed appliance body 7, described feed appliance body 7 is provided with chip electronic element packaging structure as above, described feed appliance also comprises the connecting gear 8 for pulling strap 4 to move forward, positioning plate 9, be fixed on the sensor 10 on positioning plate 9 aft end face, and controller, described sensor 10 is equal with the number of member slot 41, and sensor 10 is positioned at directly over member slot 41, the front end of described strap 4 is bent downwardly and is placed in connecting gear 8, described positioning plate 9 is positioned at the front end of strap 4 downward bend, for limiting the reach of slice component 1, described sensor 10, mechanism for stripping 15 is all connected with controller with connecting gear 8.When being coated with upper cover 5 on the upper surface of strap 4, described feed appliance body 7 is also installed a mechanism for stripping 15 for being peeled off from strap 4 by upper cover 5.
Above-mentioned chip electronic element feed appliance is used for slice component 1 to take out from strap 4, and the pick-up head 13 slice component 1 of taking-up being supplied chip mounter picks up.Connecting gear 8 is by strap 4 toward while drop-down, and strap 4 can move forward, and the upper surface of upper cover 5 from strap 4 is peeled off by mechanism for stripping 15 simultaneously, puts into mouth 42 expose to make the slice component 1 in member slot 41 from element; The front end of slice component 1 is provided with positioning plate 9, can prevent slice component 1 from moving forward under the effect of inertia by positioning plate 9.Whether sensor 10 has the position of slice component 1 and slice component 1 in the member slot 41 of the front end at strap 4 turning for perception, and by signal feedback to controller, controller controls the action of connecting gear 8; When sensor 10 detect have a slice component 1 in row's member slot 41 of front end, strap 4 turning time, then controller control connecting gear 8 stops action, slice component 1 position signal that chip mounter also feeds back according to sensor 10 controls the action of pick-up head 13, makes pick-up head 13 correctly from member slot 41, pick up slice component 1.When sensor 10 detect there is no a slice component 1 in row's member slot 41 of front end, strap 4 turning time, then controller instruction connecting gear 8 action, drive strap 4 to move forward, until expose slice component in the front end at strap 4 turning.
So, slice component 1 can be taken out by this chip electronic element feed appliance from the strap 4 of its packaging structure, and the specified location that slice component 1 can be sent to chip mounter supplies the pick-up head 13 of chip mounter to pick up, thus facilitates the use of chip electronic element packaging structure.Preferably, as shown in figure 13, described positioning plate 9 is provided with the first groove 91 that multiple appearance strap 4 passes through and the first limiting section 92 between adjacent two the first grooves 91, and described first limiting section 92 is placed in member slot 41.
Embodiment two, as shown in figure 12, described chip electronic element feed appliance comprises feed appliance body 7, described feed appliance body 7 is provided with chip electronic element packaging structure as above, described feed appliance also comprises the connecting gear 8 for pulling strap 4 to move forward, sorting mechanism 11, gate sheet 12 moving up and down, multiple sensor 10 and the controller for slice component 1 being sorted, and the front end of described strap 4 is bent downwardly and is placed in connecting gear 8, described sorting mechanism 11 comprises supporting 111, and a belt conveyor 113, described belt conveyor 113 is enclosed within two delivery wheels 115, a delivery wheel 115 in two delivery wheels 115 is driven by the second drive motor, described belt conveyor 113 is provided with a sequence passage 114, described supporting 111 offer equal with member slot 41 number, and the element delivery chute 112 be connected with member slot 41, the rear end of supporting 111 is positioned at the downward bend of strap 4, the front end of supporting 111 is positioned at the rear end of belt conveyor 113, the length of the multiple element delivery chutes 112 on supporting 111 reduces from left to right or from right to left successively, the left and right sides of each element delivery chute 112 rear end is equipped with the directing plate 14 be obliquely installed, described directing plate 14 is placed on the upper surface of belt conveyor 113, and the rear end of directing plate 14 all extends to sequence passage 114 place, described gate sheet 12 is positioned at the front end of the shortest element delivery chute 112 of length, sensor 10 is positioned at directly over sequence passage 114, described sensor 10, mechanism for stripping 15, connecting gear 8, gate sheet 12, second drive motor is all connected with controller.When being coated with upper cover 5 on the upper surface of strap 4, described feed appliance body 7 is also installed a mechanism for stripping 15 for being peeled off from strap 4 by upper cover 5.
In this embodiment, connecting gear 8 is by strap 4 toward while drop-down, and strap 4 can move forward, and the upper surface of upper cover 5 from strap 4 is peeled off by mechanism for stripping 15 simultaneously, puts into mouth 42 expose to make the slice component 1 in member slot 41 from element; Connecting gear 8 continues by strap 4 toward drop-down, then the slice component 1 at strap 4 turning enters in the element delivery chute 112 of supporting 111, drops on the upper surface of belt conveyor 113 again under the effect of follow-up slice component 1 thrust; Belt conveyor 113 moves forward, then slice component 1 auto-sequencing under the effect of directing plate 14 enters in sequence passage 114, finally shifts out from sequence passage 114 in the mode of tandem, picks up for the pick-up head 13 being positioned at sequence passage 114 front.Whether described sensor 10 is for having slice component 1 in perception sequence passage 114, when sensor 10 detect have a slice component 1 in sequence passage 114 time, then controller controls connecting gear 8 and stops action, simultaneously control door plate 12 to move down, under the effect of inertia, reach is continued to stop the slice component 1 in element delivery chute 112, the second electric machine rotation is controlled with Time Controller, namely belt conveyor 113 continues to move forward, so that slice component 1 is transferred to pick-up head 13 place.When sensor 10 detect there is no a slice component 1 in sequence passage 114 time, then controller control door plate 12 moves up, control connecting gear 8 simultaneously and move forward a distance, this distance is equal with the length of a slice component 1, then strap 4 is drawn out the distance equal with the length of a slice component 1, therefore a row sheet type element 1 of element delivery chute 112 front end is pushed on belt conveyor 113, export with auto-sequencing under the effect of directing plate 14.
So, slice component 1 can be taken out by this chip electronic element feed appliance from the strap 4 of its packaging structure, and by sorting mechanism 11, multiple slice component 1 shifted out from strap 4 is sorted, by multiple slice component 1 from left and right distribution sorting side by side become before and after the distribution of straight line, and the specified location that the slice component 1 distributed by multiple tandem is sent to chip mounter supplies the pick-up head 13 of chip mounter to pick up, thus facilitate the use of chip electronic element packaging structure.As shown in figure 14, described gate sheet 12 is provided with the second groove 121 that multiple appearance strap 4 passes through and the second limiting section 122 between adjacent two the second grooves 121, and described second limiting section 122 is placed in element delivery chute 112.
In the present embodiment, as shown in figure 12, described supporting 111 is structure as a whole with directing plate 14, supporting 111 is fixed on feed appliance body 7 by support, simultaneously in order to reduce the friction force between directing plate 14 lower surface and belt conveyor 113 upper surface, the lower surface of described directing plate 14 and the upper surface of belt conveyor 113 are smooth surface.In addition, 4 member slot 41 are provided with in described strap 4, then also be provided with 4 element delivery chutes 112 accordingly in supporting 111, the length of 4 element delivery chutes 112 shortens from left to right successively, described directing plate 14 has 5, be followed successively by the first directing plate 141 from left to right, second directing plate 142, 3rd directing plate 143, 4th directing plate 144 and the 5th directing plate 145, then the second directing plate 142, 3rd directing plate 143, the length of the 4th directing plate 144 and the 5th directing plate 145 is elongated successively, and be all obliquely installed towards left, first directing plate 141 is obliquely installed towards right, thus the sequence passage 114 formed comprises the tilting section 116 being positioned at rear end and the linear portion 117 being positioned at front end, described tilting section 116 is connected with the front end transition of linear portion 117 at the first directing plate 141.
In two embodiments of above-mentioned feed appliance, described connecting gear 8 is all identical with the structure of mechanism for stripping 15.As shown in figure 11, described connecting gear 8 comprises drive roll 82 and the driven voller 83 of the first free roll 81 and pair of opposing, described first free roll 81 is positioned at the lower end of strap 4, strap 4 is turned downwards and is placed between drive roll 82 and driven voller 83 from the first free roll 81, described drive roll 82 is driven by the first drive motor, and this first drive motor is connected with controller.Described first free roll 81 for the sense of motion of the band 4 that changes package, and drive roll 82 and driven voller 83 clamp strap 4 and rotate after, strap 4 can be pulled down, thus realize supply slice component 1.
The structure of described mechanism for stripping 15 is, as shown in Figure 10 and Figure 15, mechanism for stripping 15 comprises the second free roll 151 and tension rolling wheel 152, described strap 4 passes from the below of the second free roll 151, described upper cover 5 is taken turns 152 by rolling at tension rolling through rear from the top of the second free roll 151 after strap 4 is peeled off, described tension rolling wheel 152 is arranged on feed appliance body 7, in an initial condition, the end winding support of upper cover 5 by manual removal, and is taken turns on 152 at tension rolling after peeling off by upper cover 5; Described tension rolling wheel 152 is driven by the 3rd motor, 3rd motor with and tension rolling take turns 152 between be connected by tension force power-transfer clutch, when strap 4 stops mobile, winding tension increases, then tension force power-transfer clutch makes the 3rd motor and tension rolling take turnss 152 to be separated, rolling stopping; When strap 4 moves forward, winding tension reduces, then tension force power-transfer clutch closes, and cause the 3rd driven by motor tension rolling wheel 152 to rotate, rolling continues again, thus upper cover 5 is constantly stripped and rolling with the reach of strap 4.
Further, when with braid, the mode be wound on reel 6 loads on feed appliance body 7 packaging structure, then can reel 6 be installed in rotation on feed appliance body 7, then while pulling strap 4, reel 6 rotates under the effect of pulling force, to export strap 4.
In sum, the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (14)
1. a chip electronic element packaging structure, comprise strap (4), it is characterized in that: in described strap (4), offer at least one member slot (41), described member slot (41) extends before and after the length direction of strap (4), described member slot (41) is for accommodating multiple slice component (1) distributed side by side before and after strap (4) length direction, the cross-sectional plane of described member slot (41) is that polygon is circular or oval, when the cross-sectional plane of member slot (41) is polygon, the most long-diagonal of member slot (41) cross-sectional plane is less than the body diagonal of slice component (1), when the cross-sectional plane of member slot (41) is circular or oval, the maximum gauge of member slot (41) cross-sectional plane is less than the body diagonal of slice component (1), the upper end of described member slot (41) is provided with an opening up element and puts into mouth (42).
2. chip electronic element packaging structure according to claim 1, is characterized in that: the width that mouth (42) put into by described element is less than the width of slice component (1).
3. chip electronic element packaging structure according to claim 1, it is characterized in that: the width that mouth (42) put into by described element is greater than the width of slice component (1), the upper surface of described strap (4) is provided with and covers the upper cover (5) that mouth (42) put into by described element, this upper cover (5) rear formation one braid bonding with strap (4).
4. chip electronic element packaging structure according to claim 1, it is characterized in that: also comprise a reel (6), this reel (6) comprises spool (61) and is located at the back-up ring (62) at spool (61) two ends, form one between two back-up rings (62) and reel (6) in circular host cavity (63), described strap (4) is arranged in this host cavity (63) and is wound on described spool (61).
5. chip electronic element packaging structure according to claim 3, it is characterized in that: the lower surface of described upper cover (5) be provided with at least one protrude downwards and the card article (51) extended before and after upper cover (5) length direction, the upper surface of described strap (4) offers and extends and the draw-in groove (43) suitable with card article (51) before and after the length direction of strap (4), described card article (51) and draw-in groove (43) fasten.
6. chip electronic element packaging structure according to claim 5, it is characterized in that: described card article (51) comprises the neck (52) being placed in upper end and the head (53) being placed in lower end, described card article (51) and upper cover (5) are structure as a whole.
7. chip electronic element packaging structure according to claim 1, is characterized in that: described member slot (41) has multiple, multiple member slot (41) along strap (4) Width about be arranged side by side.
8. chip electronic element packaging structure according to claim 1, is characterized in that: described strap (4) can conduct electricity or the inside face of strap (4) that contacts with slice component (1) through conductive processing.
9. chip electronic element packaging structure according to claim 3, is characterized in that: described upper cover (5) is mutually bonding with strap (4) by adhesives.
10. chip electronic element packaging structure according to claim 3, is characterized in that: described strap (4) and upper cover (5) are made by nonrigid material.
11. 1 kinds of chip electronic element feed appliances, comprise feed appliance body (7), it is characterized in that: described feed appliance body (7) is provided with the chip electronic element packaging structure as described in any one of claim 1-10, described feed appliance also comprises the connecting gear (8) for pulling strap (4) to move forward, positioning plate (9), be fixed on the sensor (10) on positioning plate (9) aft end face, and controller, described sensor (10) is equal with the number of member slot (41), and sensor (10) is positioned at directly over member slot (41), the front end of described strap (4) is bent downwardly and is placed in connecting gear (8), described positioning plate (9) is positioned at the front end of strap (4) downward bend, for limiting the reach of slice component (1), described sensor (10) is all connected with controller with connecting gear (8).
12. chip electronic element feed appliances according to claim 11, it is characterized in that: described connecting gear (8) comprises the first free roll (81), and the drive roll of pair of opposing (82) and driven voller (83), described first free roll (81) is positioned at the lower end of strap (4), strap (4) is bent downwardly from the first free roll (81) and is placed between drive roll (82) and driven voller (83), described drive roll (82) is driven by the first drive motor, this first drive motor is connected with controller.
13. chip electronic element feed appliances according to claim 11, it is characterized in that: when being coated with upper cover (5) on the upper surface of strap (4), described feed appliance body (7) is also installed a mechanism for stripping (15) for being peeled off from strap (4) by upper cover (5), described mechanism for stripping (15) comprises the second free roll (151) and tension rolling wheel (152), described strap (4) passes from the below of the second free roll (151), described upper cover (5) is taken turns (152) by rolling at tension rolling through rear from the top of the second free roll (151) after strap (4) is peeled off, described tension rolling wheel (152) is arranged on feed appliance body (7), and tension rolling wheel (152) is driven by the 3rd motor, 3rd motor is taken turns with tension rolling between (152) and is connected by tension force power-transfer clutch.
14. 1 kinds of chip electronic element feed appliances, comprise feed appliance body (7), it is characterized in that: described feed appliance body (7) is provided with the chip electronic element packaging structure as described in any one of claim 1-10, described feed appliance also comprises the connecting gear (8) for pulling strap (4) to move forward, for the sorting mechanism (11) that slice component (1) is sorted, one gate sheet moving up and down (12), multiple sensor (10), and controller, the front end of described strap (4) is bent downwardly and is placed in connecting gear (8), described sorting mechanism (11) comprises supporting (111), and a belt conveyor (113), described belt conveyor (113) is enclosed within two delivery wheels (115), a delivery wheel (115) in two delivery wheels (115) is driven by the second drive motor, described belt conveyor (113) is provided with a sequence passage (114), described supporting (111) offer equal with member slot (41) number, and the element delivery chute (112) be connected with member slot (41), the rear end of supporting (111) is positioned at the downward bend of strap (4), the front end of supporting (111) is positioned at the rear end of belt conveyor (113), the length of the multiple element delivery chutes (112) on supporting (111) reduces from left to right or from right to left successively, the left and right sides of each element delivery chute (112) rear end is equipped with the directing plate (14) be obliquely installed, described directing plate (14) is placed on the upper surface of belt conveyor (113), and the rear end of directing plate (14) all extends to sequence passage (114) place, described gate sheet (12) is positioned at the front end of the shortest element delivery chute (112) of length, sensor (10) is positioned at directly over sequence passage (114), described sensor (10), connecting gear (8), gate sheet (12), second drive motor is all connected with controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410421532.2A CN105366096A (en) | 2014-08-25 | 2014-08-25 | Packaging structure and feeder for SMT type electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410421532.2A CN105366096A (en) | 2014-08-25 | 2014-08-25 | Packaging structure and feeder for SMT type electronic elements |
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| CN105366096A true CN105366096A (en) | 2016-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410421532.2A Pending CN105366096A (en) | 2014-08-25 | 2014-08-25 | Packaging structure and feeder for SMT type electronic elements |
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| CN (1) | CN105366096A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110422363A (en) * | 2019-08-08 | 2019-11-08 | 李琼 | A kind of packing method and tape package device of electronic component |
| CN111867347A (en) * | 2019-04-24 | 2020-10-30 | 松下知识产权经营株式会社 | Component mounting device and pitch automatic detection method |
| CN114072339A (en) * | 2019-06-28 | 2022-02-18 | 罗姆股份有限公司 | Electronic component reel group, electronic component module and circuit |
-
2014
- 2014-08-25 CN CN201410421532.2A patent/CN105366096A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867347A (en) * | 2019-04-24 | 2020-10-30 | 松下知识产权经营株式会社 | Component mounting device and pitch automatic detection method |
| CN111867347B (en) * | 2019-04-24 | 2023-03-21 | 松下知识产权经营株式会社 | Component mounting device and pitch automatic detection method |
| CN114072339A (en) * | 2019-06-28 | 2022-02-18 | 罗姆股份有限公司 | Electronic component reel group, electronic component module and circuit |
| CN110422363A (en) * | 2019-08-08 | 2019-11-08 | 李琼 | A kind of packing method and tape package device of electronic component |
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Application publication date: 20160302 |