CN207665419U - Full-automatic chip mounter bulk cargo component feeding assembling combination device - Google Patents

Full-automatic chip mounter bulk cargo component feeding assembling combination device Download PDF

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Publication number
CN207665419U
CN207665419U CN201721797237.2U CN201721797237U CN207665419U CN 207665419 U CN207665419 U CN 207665419U CN 201721797237 U CN201721797237 U CN 201721797237U CN 207665419 U CN207665419 U CN 207665419U
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China
Prior art keywords
jigsaw
component
encapsulation
encapsulation component
full
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CN201721797237.2U
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Inventor
孙军峰
贾斌
王继孔
高卫
李杨
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Xian Electronic Engineering Research Institute
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Xian Electronic Engineering Research Institute
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Abstract

The utility model is related to a kind of full-automatic chip mounter bulk cargo component feeding assembling combination devices, it is designed using assembling module, assembly is designed using two sides, and the small pallet jigsaw design of 0402,0603,0805,1206 (imperial sizing) capacitances of bulk cargo, resistive patch component size often occurs in the automatic assembling process of printed board in front basis.Surface mount elements placement location is in the identical array of row, column pitch on jigsaw, while being provided with location hole in each jigsaw same position, can fast and efficiently complete jigsaw positioning and place.The back side is fluted, Pasting length it is shorter can not normal use feeder tape package component for full-automatic chip mounter use.

Description

Full-automatic chip mounter bulk cargo component feeding assembling combination device
Technical field
The utility model belongs to printed board assembly surface mount field, specifically a kind of for loading scattered no standard pack Small size Surface Mount Component two-sided combined feeding device.
Background technology
Current most of printed board processing enterprises for possessing SMT (surface mounting technology) production line can use full-automatic paster Machine completes the surface mount process of PCB (printed circuit board) component.Surface mount specific process is:Quantity is determined SMC (element pasted on surface) and SMD (surface mount device) with intact packaging is put into be fed with what its packaged form matched In glassware, attachment program is loaded after feeder is loaded on the specific position of full-automatic chip mounter and is put into PCB to be assembled, is opened Machine is run, and full-automatic chip mounter automatically selects according to attachment program and draws the component on corresponding position in feeder and attachment On the respective pad position of printed board to be assembled.
The SMC and SMD used during surface mount, according to component package size, using can be used for automatically pasting The standardization that piece machine is assembled automatically is band-like or tubular wrapping can also use the packaging of tray form if size is larger.Its In band-like antistatic packaging be also referred to as braid, by carrier belt and top covering band form.There is the sky for placing component on carrier belt Cave and the gear hole to match with full-automatic chip mounter feeder play the role of placement and transport component.Covering band is being transported It carries surface and forms film, component can be prevented to be subjected to displacement, protect and fix component.Covering band is once breakage, just loses work With so that braid cannot be used directly for the automatic assembling of full-automatic chip mounter.Therefore, braid has the characteristics that disposable.
Since military enterprise is more demanding to the quality and reliability of product, needed before carrying out PCB assemblings to attachment member Device carries out postsearch screening.Since belt packaging has the characteristics that disposable, component is once removed, just can not be direct It is assembled for full-automatic chip mounter, becomes bulk cargo.Meanwhile small lot do not use standard tape package component dispatching and The operation of feeder feeding also results in the generation of bulk cargo.Current packless attachment component must be carried out using antistatic box It preserves, uses the Surface Mount Components such as 0402,0603,0805,1206 (imperial sizings) of braid encapsulation due to size originally It is small, tubulose and pallet feeder feeding can not be used, surface mount can only be carried out by the way of artificial hand benefit.If quantity is slightly Greatly, man efficiency is unable to get guarantee with quality conformance, and assembly defect probability of occurrence can be made to improve, lead to subsequent Welder There is mass defect in sequence.Simultaneously as bulk cargo component size is smaller, easily loses, caused not in storage and moving process Necessary loss.To solve the above-mentioned problems, it needs a kind of component that meets to process antistatic requirement, can be used for automatically pasting The component bulk cargo loading attachment that installation assembles automatically.
Invention content
Technical problems to be solved
In order to which the bulk cargo component for solving to generate since tape package is damaged can not use full-automatic placement equipment to carry out PCB The problem of surface mount, the utility model proposes a kind of based on full-automatic chip mounter disc type feeder feeding function, combinable Scattered component loads and feeding tool.
Technical solution
A kind of full-automatic chip mounter bulk cargo component feeding assembling combination device, it is characterised in that including pilot pin, bottom plate, 0402 encapsulation component jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and 1206 encapsulation component jigsaw; Arranged on bottom plate multiple 0402 encapsulation component jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and 1206 encapsulation component jigsaw, 0402 encapsulation component jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and 1206 encapsulation component jigsaw are fixed on using pilot pin in the location hole at bottom plate both ends, described 0402 encapsulation component The front that jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and 1206 encapsulate component jigsaw, which is equipped with, places Several apertures of corresponding encapsulation component, described 0402 encapsulation component jigsaw, 0603 encapsulation component jigsaw, 0805 Encapsulate component jigsaw and 1206 encapsulation component jigsaw the back side be equipped with groove, Pasting length it is shorter can not normal use feed The tape package component of glassware is used for full-automatic chip mounter.
The bottom plate, 0402 encapsulation component jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and The surface resistivity of 1206 encapsulation component jigsaw is 1.0 × 105~1.0 × 1011Ω。
Described 0402 encapsulates component jigsaw, 0603 encapsulation component jigsaw, 0805 encapsulation component jigsaw and 1206 The positive aperture for encapsulating component jigsaw is in the identical array arrangement of row, column pitch.
Advantageous effect
The utility model proposes a kind of full-automatic chip mounter bulk cargo component feeding assembling combination device, solve due to The scattered SMD components that packages in damaged condition generate can not be processed using full-automatic chip mounter feeder, and storage process is easily lost damage Bad problem.The present apparatus is simple in structure, of low cost, and capacity is big, can quick plate splicing positioning, be suitble to full-automatic chip mounter use, And improve its processing flexibility.900 scattered SMD components are at most loaded, production needs are fully met.It can promote the use of In the surface mount production line that all kinds of scattered components of appearance can not mount automatically, there is practicability and novelty.
(1) it solves bulk cargo storage problem, prevents bulk cargo component from losing, damage.
(2) it is based on disk and fills feeder function, full-automatic placement equipment can be coordinated to complete the SMD components print without standard pack Making sheet
Surface mount, improves the Flexible Manufacture ability of SMT production lines, and elimination manually mounts the uniform quality brought
Property difference problem, improve production efficiency and product quality.
(3) board-splicing type designs so that the utility model has sizes Surface Mount Component delivered payload capability, and is easy It replaces,
Tooling usage quantity is reduced, production cost is saved.
Description of the drawings
Fig. 1 bulk cargo component feeding assembling combination structure drawing of device of the present invention
1- pilot pins, 2- bottom plates, 3- jigsaw reverse side, 4-0402 encapsulate component jigsaw, 5-0603 encapsulates component jigsaw, 6-0805 encapsulates component jigsaw, 7-1206 encapsulation components jigsaw, 8- location holes.
Specific implementation mode
The utility model is further described in conjunction with embodiment, attached drawing:
Material selection:Tool is loaded as component, surface resistivity is chosen and meets《GJB3007-2009》Electrostatic consumption Dissipating material making, (surface resistivity is 1.0 × 105~1.0 × 1011Ω)。
Assembling module designs:It is designed using two sides, front basis bulk cargo often occurs in the automatic assembling process of printed board 0402,0603,0805,1206 (imperial sizing) capacitances, resistive patch component size small pallet jigsaw design.On jigsaw Surface mount elements placement location is in the identical array of row, column pitch, while being provided with location hole in each jigsaw same position, can quickly, Jigsaw positioning is efficiently completed to place.The back side is fluted, Pasting length it is shorter can not normal use feeder tape package Component is used for full-automatic chip mounter.
Pedestal designs:Bottom plate is mainly used for loading jigsaw, and size meets full-automatic chip mounter requirement.It is fixed to be designed with Position pin, can coaxially match insertion with the location hole of jigsaw, and component pitch is identical between adjacent panel when more jigsaw being made to be put into pedestal, Ensure that element coordinate is accurately positioned in full-automatic chip mounter, carries out automatic sucking and attachment work.
As shown in Figure 1, including pilot pin 1, bottom plate 2,0402 encapsulate component jigsaw 4,0603 encapsulate component jigsaw 5, 0805 encapsulation component jigsaw 6 and 1206 encapsulates component jigsaw 7;Multiple 0402 encapsulation component jigsaw are arranged on a base plate 2 4,0603 encapsulation component jigsaw 5,0805 encapsulates component jigsaw 6 and 1206 and encapsulates 7,0402 encapsulation component of component jigsaw Jigsaw 4,0603 encapsulates 5,0805 encapsulation component jigsaw of component jigsaw, 6 and 1206 encapsulation component jigsaw 7 and uses pilot pin 1 It is fixed in the location hole 8 at 2 both ends of bottom plate, 4,0603 encapsulation component jigsaw 5 of described 0402 encapsulation component jigsaw, The front that 0805 encapsulation component jigsaw 6 and 1206 encapsulates component jigsaw 7 is equipped with the several of the corresponding encapsulation component of placement A aperture, described 0402 encapsulation component jigsaw 4,0603 encapsulate component jigsaw 5,0805 and encapsulate 6 and of component jigsaw The back sides of 1206 encapsulation component jigsaw 7 are equipped with groove, Pasting length it is shorter can not normal use feeder tape package Component is used for full-automatic chip mounter.
Using steps are as follows:
(1) selection and the matched jigsaw 3,4,5,6,7 of SMD components bulk cargo package dimension to be mounted, from four end of jigsaw position It sets beginning and puts component in order.When loading shorter band-like packaging component using back side groove, the braid back side is glued It is attached to groove floor, tears covering band off.
(2) pilot pin 1 being caught in jigsaw location hole 8 on pedestal 2.
(3) it is placed on full-automatic placement equipment pallet feeder position.
(4) the absorption data in setting attachment program:
A. when being mounted using a kind of size bulk cargo jigsaw, first component locations coordinate, component spacing and number are determined Mesh.
B. when needing to mount two or more bulk cargos, bulk cargo is placed in different jigsaw, first component is respectively set Coordinate.
(5) start printing board surface attachment.

Claims (3)

1. a kind of full-automatic chip mounter bulk cargo component feeding assembling combination device, it is characterised in that including pilot pin (1), bottom plate (2), 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw (5), 0805 encapsulation component jigsaw (6) and 1206 envelopes Fill component jigsaw (7);Multiple 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw are arranged on bottom plate (2) (5), 0805 encapsulation component jigsaw (6) and 1206 encapsulation component jigsaw (7), 0402 encapsulation component jigsaw (4), 0603 envelope It is fixed using pilot pin (1) to fill component jigsaw (5), 0805 encapsulation component jigsaw (6) and 1206 encapsulation component jigsaw (7) In the location hole (8) positioned at bottom plate (2) both ends, described 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw (5), the front of 0805 encapsulation component jigsaw (6) and 1206 encapsulation component jigsaw (7) is equipped with placement corresponding encapsulation member device Several apertures of part, described 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw (5), the first device of 0805 encapsulation The back side of part jigsaw (6) and 1206 encapsulation component jigsaw (7) is equipped with groove.
2. a kind of full-automatic chip mounter bulk cargo component feeding assembling combination device according to claim 1, feature exist It is spelled in the bottom plate (2), 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw (5), 0805 encapsulation component The surface resistivity of plate (6) and 1206 encapsulation component jigsaw (7) is 1.0 × 105~1.0 × 1011Ω。
3. a kind of full-automatic chip mounter bulk cargo component feeding assembling combination device according to claim 1, feature exist In the described 0402 encapsulation component jigsaw (4), 0603 encapsulation component jigsaw (5), 0805 encapsulation component jigsaw (6) and The positive aperture of 1206 encapsulation component jigsaw (7) is in the identical array arrangement of row, column pitch.
CN201721797237.2U 2017-12-20 2017-12-20 Full-automatic chip mounter bulk cargo component feeding assembling combination device Active CN207665419U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721797237.2U CN207665419U (en) 2017-12-20 2017-12-20 Full-automatic chip mounter bulk cargo component feeding assembling combination device

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Application Number Priority Date Filing Date Title
CN201721797237.2U CN207665419U (en) 2017-12-20 2017-12-20 Full-automatic chip mounter bulk cargo component feeding assembling combination device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661164A (en) * 2019-01-14 2019-04-19 北京机械设备研究所 It is a kind of to automate mounted flexible tray for component in bulk

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661164A (en) * 2019-01-14 2019-04-19 北京机械设备研究所 It is a kind of to automate mounted flexible tray for component in bulk

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