JP5505658B2 - Electronic device manufacturing method, electronic component mounting frame, electronic component stored in mounting frame, and surface mounting device - Google Patents

Description

  The present invention relates to an electronic device manufacturing method, an electronic component mounting frame, an electronic component stored in a mounting frame, and a surface mounting device, and more particularly to a technique for efficiently mounting a minute chip-shaped electronic component on a wiring board.

  Along with the downsizing and thinning of electronic devices, the progress of downsizing and thinning of chip-shaped electronic components incorporated therein has become remarkable. Such a minute chip-shaped electronic component (hereinafter sometimes simply referred to as “chip” or “chip component”) generally has a large number of elements on one wafer or panel-shaped substrate in order to manufacture with high productivity. Are manufactured in a lump in a state of being arranged vertically and horizontally, and is manufactured by dicing and dividing into individual chips.

  In dicing, the assembled elements (chips) are attached to and supported by an adhesive sheet (hereinafter referred to as “dicing tape”) of a dicing frame, and this is cut by a dicing blade (cutting blade) or laser light. The divided chips are stored one by one in the pockets 52 of the tape material 51 as shown in FIG. 7, and are provided as reels in which the tape material 51 is wound in a roll shape. One reel stores, for example, about tens of thousands of chip parts. Further, reference numeral 53 in FIG. 7 is a feed hole for feeding the tape material 51.

  In general, chip components are mounted through solder printing on the wiring board, application of an adhesive, placement of the chip parts on the wiring board, and reflow. Alternatively, an automatic mounting machine called “Surface Mounter” (hereinafter sometimes referred to as “chip mounter” or simply “mounter”) is used. The chip mounter includes a mount head for disposing the chip on the wiring board at a high speed, and a supply device that is mounted with a reel storing the chip and supplies the chip to the mounter. The drawer and mount head take out the chip from the tape material pocket and place it on the wiring board.

  Moreover, there are the following patent documents as related to the mounting of such chip parts.

Japanese Unexamined Patent Publication No. 7-14861

  By the way, although the size of the chip component depends on the type, it is small, for example, the length is 0.25 mm, the width is 0.12 mm, and the height is about 0.1 mm. In the supply method, it is becoming difficult to stably store the chip in the pocket of the tape material and to stably take out the chip from the pocket at the time of mounting.

  In addition, the pocket needs to be slightly larger than the chip to allow the chip to be taken in and out, but this clearance reduces the position accuracy of the chip, and the chip is inverted in the pocket during transportation. In other words, there is a situation in which a tape material can no longer be used in a chip having a vertically asymmetric structure such as a bottom terminal type chip. Furthermore, the supply of parts using a tape material cannot be said to be a preferable form of supplying parts from the viewpoint of resource saving because a large amount of tape waste material is produced after mounting.

  On the other hand, instead of the tape material, it is also conceivable to use a bulk feeder in which chips stored in the case are arranged in a separated state and can be supplied to the mounter. However, in such a supply apparatus, there is a possibility that the chip may be damaged by collision between chips or generation of static electricity.

  Furthermore, as shown in FIG. 8, it may be possible to mount directly from the dicing frame 45, but the conventional dicing frame 45 has a relatively large aspect ratio in order to dice more chips 21 at the same time. Are almost square or circular in shape. For this reason, when many types of chips 21 are to be mounted on one wiring board 31, the dicing frame 45 arranged along the transport line 43 of the wiring board 31 corresponding to the number of types of chips 21 to be mounted has a horizontal width. W1 is taken, the moving distance of the mount head 41 becomes long, and the mounting efficiency decreases. In particular, with the increase in functionality and functionality of electronic devices, the types of electronic components to be mounted on a single wiring board tend to increase, and such problems become more apparent as the number of types of chips to be mounted increases. .

  Further, the invention described in Patent Document 1 is to transfer a plurality of types of elements formed on a single wafer to a lead frame for each type, so that various types of chips can be efficiently mounted on a wiring board. Absent.

  Accordingly, an object of the present invention is to efficiently supply a small chip-shaped electronic component to a surface mounting apparatus and increase the mounting efficiency of the chip component.

  In order to solve the above-described problems and achieve the object, an electronic device manufacturing method according to the present invention includes: (1) a plate-like support frame having a through-opening at a central portion, and the support so as to be stretched over the through-opening. A step of preparing a mounting frame having a pressure-sensitive adhesive sheet provided on the surface and having an adhesive layer on the surface and capable of attaching the chip-like electronic component; and (2) dicing the diced chip-like electronic component. An electronic component transfer step which is taken out from the frame and placed on the surface of the adhesive sheet of the mounting frame; (3) a step of mounting the mounting frame on which the chip-like electronic component is placed on a surface mounting device; A mounting step of mounting the chip-like electronic component disposed on the mounting frame on the wiring board using the surface mounting device;

  In the present invention, when a chip-like electronic component is mounted on a wiring board, a chip diced on a dicing frame is used instead of using a tape material or picking up and mounting directly from a dicing frame as in the prior art. The component is once transferred to a mounting-dedicated frame (mounting frame / electronic component mounting frame) and then mounted on the wiring board.

  The mounting frame used at this time is provided with a plate-like support frame having a through-opening at the center and an adhesive layer on the surface of the support frame so as to be stretched over the through-opening. And an adhesive sheet that can be attached.

  The method of transferring the chip from the dicing frame to the mounting frame will be described later in the description of the embodiment with reference to the drawings. For example, the method is performed by using a device such as a die picker that can adsorb or hold the chip. Alternatively, it is possible to use an adhesive means such as a member having an adhesive sheet or an adhesive layer.

  When using the adhesive means, for example, use the adhesive sheet of the mounting frame as the adhesive means, that is, from the dicing frame so that the adhesive sheet of the mounting frame is pressed and transferred to the chip after dicing. The chip can be transferred directly to the mounting frame. In addition to the adhesive sheet of the mounting frame as the adhesive means, an adhesive sheet and an adhesive member are prepared, and the chip is taken out from the dicing frame by these adhesive means, and then the chip is attached to the adhesive sheet of the mounting frame. May be attached.

  When transferring the chip using the adhesive means in this way, use the difference in adhesive force, specifically, the adhesive force at the tip movement destination is larger than the adhesive strength at the tip movement source. Then, the chip may be transferred. In addition, the adhesive layer of the transfer source is made of an adhesive whose adhesiveness is lost or lowered by ultraviolet rays or heat, and the adhesive force of the adhesive layer is lost or lowered by applying ultraviolet rays or heat when transferring the chip. Anyway.

  In transferring chips from the dicing frame to the mounting frame, the chips may be transferred one by one, but a plurality of chips may be collectively transferred to the mounting frame.

  Furthermore, in the above transfer operation, it is desirable that defective products remain or be discarded in the dicing frame, and only non-defective products are selectively transferred from the dicing frame to the mounting frame. This is because chip components are supplied to the chip mounter at a high yield rate. If such a process is performed in advance when supplying parts, it is possible to supply chips to the mounter at a non-defective product rate of 100% or close to it, so there is almost no need to eliminate defective chips on the mounter side. The mounting efficiency can be increased, and the manufacturing yield of the electronic device on which the chip component is mounted can be improved.

  In the manufacturing method according to the present invention, the support frame of the mounting frame has a substantially rectangular overall shape having a width smaller than the length, and in the mounting step, a plurality of mounting frames are arranged in the longitudinal direction. Mounting the chip-shaped electronic component by mounting it on the chip mounter so that the mounting frame crosses the wiring board transport direction (eg, substantially orthogonal) and the plurality of mounting frames are arranged along the wiring board transport direction. It is preferable to carry out.

  If a mounting frame with a small width is used, the mounting head movement distance can be shortened even when multiple mounting frames are arranged horizontally (along the conveyance direction of the wiring board) when mounting various products. Because you can. For the same reason, it is preferable that at least the width dimension of the mounting frame is smaller than the width dimension of the dicing frame.

  Furthermore, in one aspect of the manufacturing method according to the present invention, in the electronic component transfer step, a chip-like shape is formed on the surface of the pressure-sensitive adhesive sheet of the mounting frame with an interval wider than the interval between the chip-like electronic components on the dicing frame. Place electronic components.

  This is for facilitating pip-up (chip removal from the mounting frame) during mounting. After dicing, gaps corresponding to so-called cutting allowances (gap generated by cutting) are formed between the chips on the dicing frame. The chips should be arranged in the mounting frame with a gap larger than this gap. Thus, a specific chip can be taken out from the mounting frame more reliably during mounting.

  An electronic component mounting frame according to the present invention is a mounting frame that holds a plurality of chip-shaped electronic components and is mounted on a chip mounter and supplies the chip-shaped electronic components to the chip mounter. A plate-like support frame having an opening, and an adhesive sheet provided on the support frame so as to be stretched over the through-opening and having an adhesive layer on the surface and capable of attaching the chip-like electronic component. It is provided.

  This electronic component mounting frame has the same structure as that of the mounting frame used in the manufacturing method of the present invention, and if such a mounting frame is used, as described above, the efficiency of chip components can be improved. Implementation is possible. Also in this electronic component mounting frame, it is preferable that the support frame has a substantially rectangular overall shape having a width smaller than the length.

  Furthermore, the pressure-sensitive adhesive sheet of the electronic component mounting frame is preferably made of a stretchable material. This is to facilitate removal of the chip supported on the pressure-sensitive adhesive sheet. According to such an aspect, when picking up a chip, for example, by pushing up the chip from the lower surface side of the adhesive sheet with a pin, it is possible to easily take out only the desired chip.

  Moreover, the electronic component stored in the mounting frame according to the present invention is obtained by arranging a plurality of chip-shaped electronic components on the surface of the pressure-sensitive adhesive sheet of the electronic component mounting frame according to the present invention.

  If chip parts are stored in such a mounting frame, chip parts can be supplied without causing the above-mentioned problems with the tape material (problems associated with pocket insertion / removal or problems such as chip reversal during transportation). It becomes. The mounting frame can be used, for example, as a shipping form (packaging means) when a chip component manufacturer delivers a chip component to an electronic device assembler. Can be used by loading a mounting frame in which the chip component is stored in a chip mounter. Since each chip component is fixed by the adhesive sheet of the mounting frame, the chip component is not displaced or reversed during transportation. Therefore, it can be placed on the wiring board with high positional accuracy during mounting. .

  Further, the tape material has been conventionally discarded. However, according to the mounting frame, the support frame can be made recyclable by forming it with, for example, metal or resin, which can contribute to resource saving. Further, according to the present invention, chip parts can be stored in a small mounting frame compared to the dicing frame and the chip parts can be divided into so-called subpackaging. It becomes possible to use up in a day (when a large number of chips are stored like tape reels and dicing frames, they are often not used up and need to be stored in an opened state). It is possible to reduce labor and inventory management complexity.

  In addition, in the electronic component stored in the mounting frame, each chip-shaped electronic component is chip-shaped on the dicing frame after dicing so that the chip can be easily taken out from the mounting frame in the same manner as in one aspect of the manufacturing method. It is preferable to arrange on the surface of the pressure-sensitive adhesive sheet with an interval wider than the interval between the electronic components.

  A chip mounter (surface mounting apparatus) according to the present invention includes a substrate transport unit that transports a wiring board on which an electronic component is to be mounted, a component supply unit that can accommodate an electronic component mounting frame that stores the electronic component, and the component. A chip mounter including a mount head for taking out an electronic component from a frame for mounting an electronic component mounted on a supply unit and placing the electronic component on a surface of the wiring board, wherein the electronic component mounting frame has a through-opening at a central portion A plate-like support frame having an adhesive sheet, and an adhesive sheet that is provided on the support frame so as to be stretched over the through-opening and has an adhesive layer on the surface thereof, to which the chip-like electronic component can be attached. In addition, the support frame of the electronic component mounting frame has a substantially rectangular overall shape that is smaller in width than the length, and the component supply unit stores chip-shaped electronic components. The plurality of electronic component mounting frames are arranged so that the longitudinal direction thereof intersects the transport direction of the wiring board by the substrate transport section, and the plurality of electronic component mounting frames extend along the transport direction of the wiring board. The plurality of electronic component mounting frames can be accommodated so as to be arranged in a row.

  The type of chip-like electronic component referred to in the present invention is not particularly limited. As an example, there are a chip-shaped capacitor, inductor, resistor, varistor, diode, and various semiconductor elements, but the present invention can be applied to electronic components in various chip forms other than these.

  According to the present invention, it is possible to efficiently supply a small chip-shaped electronic component to a surface mounting apparatus and improve the mounting efficiency of the chip component.

  Other objects, features, and advantages of the present invention will become apparent from the following description of embodiments of the present invention described with reference to the drawings. In addition, in each figure, the same code | symbol shows the same or equivalent part.

FIG. 1 is a perspective view showing an electronic component mounting frame according to an embodiment of the present invention. FIG. 2 is a cross-sectional view (XX cross section in FIG. 1) showing the electronic component mounting frame according to the embodiment. FIG. 3 is a conceptual diagram showing a usage state of the electronic component mounting frame according to the embodiment. FIG. 4 is a conceptual diagram showing a method for transferring a chip component from the dicing frame to the electronic component mounting frame according to the embodiment. FIG. 5 is a conceptual diagram showing another method for transferring a chip component from the dicing frame to the electronic component mounting frame according to the embodiment. FIG. 6 is a conceptual diagram showing still another method for transferring a chip component from the dicing frame to the electronic component mounting frame according to the embodiment. FIG. 7 is a perspective view showing a tape material used in a conventional chip component supply method. FIG. 8 is a conceptual diagram showing a state in which chip components are directly supplied from the dicing frame to the wiring board.

  As shown in FIGS. 1 to 2, an electronic component mounting frame 11 according to an embodiment of the present invention is supported so as to close a plate-like support frame 12 having a through-opening 13 at the center and the through-opening 13. And an adhesive sheet 18 attached to the back surface of the frame 12. The support frame 12 is produced by punching a metal plate, for example, and has a substantially rectangular overall shape. The through-opening 13 also has a substantially rectangular planar shape like the support frame 12, and the chip component 21 can be attached to and supported by the surface of the adhesive sheet 18 through the through-opening 13.

  The pressure-sensitive adhesive sheet 18 includes a pressure-sensitive adhesive layer 19 on the front surface (upper surface), and is smaller than the support frame 12 but larger than the through-opening 13. The pressure-sensitive adhesive sheet 18 can be fixed to the support frame 12 by being attached to the part. The pressure-sensitive adhesive sheet 18 has elasticity. This is because by pushing up the pins 44 from the lower surface side of the pressure-sensitive adhesive sheet 18, only the desired chip 21 is picked up by the mount head 41 and can be easily removed from the surface of the pressure-sensitive adhesive sheet 18.

  In FIG. 1 and FIG. 2, the thickness of each part (the support frame 12, the adhesive sheet 18, etc.) and the chip component 21 of the mounting frame 11 is emphasized for easy understanding. For the same reason, the chip component 21 is greatly drawn in FIGS. The dimensions of each part of the mounting frame 11 can be set such that the length L is, for example, 200 mm, the width W is, for example, 60 mm, and the thickness T is, for example, about 1 mm, and the chip component 21 (length 0.2 mm, width 0. 1 mm) can be stored, for example, tens of thousands. Furthermore, as a material constituting the support frame 12, other materials such as a resin can be used in addition to the metal.

  Further, in order to protect the chip component 21 accommodated on the surface of the pressure-sensitive adhesive sheet 18 during transportation or storage, a protective pressure-sensitive adhesive sheet (not shown / hereinafter referred to as “not shown”) covering the upper surface of the support frame 12 including the pressure-sensitive adhesive sheet 18. It is desirable to further provide a protective sheet). When such a protective sheet is provided, the mounting frame 11 may be loaded into the mounter after peeling off the protective sheet during mounting.

  On the front end side of the support frame 12 (the side close to the wiring board 31 at the time of mounting), a notch 14 is formed so that both corners on the front end side are cut off obliquely. This is to prevent the corner of the frame 11 from being caught when the mounting frame 11 is loaded into the component supply unit 42 (see FIG. 3) of the mounter or when the mounting frame 11 is transported in the mounter. Similarly, both corners 15 on the rear end side of the support frame 12 are rounded.

  Further, an information description portion 16 including a barcode and an IC tag including information on the type of the stored chip component, the manufacturing rod number, and the stored number is provided on the surface of the support frame 12. The stored chip component 21 can be immediately identified by reading it with a reader.

  Further, a through hole 17 is formed in a corner portion on the rear end side of the support frame 12, and this through hole 17 can be used for positioning of the mounting frame 11 or a mounter component, for example. When a plurality of mounting frames 11 are stacked in a vertical direction (the thickness direction of the mounting frame 11) in a container (magazine) for storing the supply unit 42 or the mounting frame 11, the penetration is made. By applying light so as to pass through the hole 17, it can also be used to check whether there is a mounting frame 11 that is accommodated with the front and back reversed or the front and back reversed. That is, since the through-holes 17 are provided at positions deviated from the center lines in the front-rear direction and the left-right direction of the support frame 12 (in this example, closer to the right rear), all the mounting frames 11 are allowed to transmit light. It can be seen that there is a frame 11 that is correctly stored, and that there is a frame 11 that is upside down or reversed if light does not pass through.

  The support frame 12 is smaller than the dicing frame 45 and has a width W smaller than the length L. This is to prevent the width W2 from being taken when a plurality of mounting frames 11 are loaded on the chip mounter as shown in FIG. If the mounting frame 11 is configured so as to have an elongated shape with a small dimension (width W) in the conveyance direction (arrow A) of the wiring board 31 in the chip mounter, a plurality of types of chips 21 are mounted on the wiring board 31. Therefore, when the plurality of types of chip components 21 are respectively stored in the mounting frame 11 and the plurality of mounting frames 11 are loaded so as to be aligned along the substrate transport line 43 of the chip mounter, the mounting frame 11 The width W2 required for loading can be made smaller than the width W1 when the dicing frame 45 shown in FIG. 8 is loaded.

  Therefore, according to this embodiment, it is possible to reduce the moving distance of the mount head 41 that takes out the chip 21 from the mounting frame 11 and places it on the wiring board 31, and mounts the chip 21 on the wiring board 31. The mounting efficiency of the chip component 21 can be increased by shortening the time. In addition, the length of the chip mounter itself can be shortened to save space, and it is possible to cope with mounting of a wider variety of components.

  As a method for transferring the chip 21 from the dicing frame 45 to the mounting frame 11 according to the present embodiment, for example, the following modes can be considered.

(1) As a first method, as shown in FIG. 4, the chip 21 is transferred from the dicing frame 45 to the mounting frame 11 one by one. According to this method, for example, probing (electrical characteristic test) and appearance inspection are performed in a state of being placed on the dicing frame 45, and only non-defective products are picked up using a device such as a die picker, and the mounting frame 11 is advantageous in that it can be moved to 11.

(2) The second method is a method in which a plurality of chips 21 on the dicing frame 45 are collectively transferred to the mounting frame 11 as shown in FIG. In this method, for example, the pressure-sensitive adhesive sheet 18 of the mounting frame 11 may be used, and the pressure-sensitive adhesive layer 19 of the pressure-sensitive adhesive sheet 18 is placed in a certain section of the chip 21 arranged on the pressure-sensitive adhesive tape 46 of the dicing frame 45. The chip 21 is attached to the included chip group, and the chip 21 is transferred from the adhesive tape 46 (dicing frame 45) to the adhesive sheet 18 (mounting frame 11) using the adhesive force of the adhesive sheet 18. The adhesive sheet 18 may be attached to the support frame 12 of the mounting frame 11.

  In the second method, the adhesive force of the adhesive sheet 18 of the mounting frame 11 is set to be greater than the adhesive force of the adhesive tape 46 of the dicing frame 45. Further, as the adhesive tape 46 of the dicing frame 45, the adhesive tape whose adhesive strength is lost or reduced by ultraviolet rays or heat as described above is used, and the adhesive strength of the adhesive tape 46 is lost or reduced when transferred to the adhesive sheet 18. You may do it.

  This second method is more advantageous than the first method in terms of transfer efficiency, but defective products may be included in the group of chip components transferred in a batch. For example, the defective product may be picked up and removed after being transferred to the mounting frame 11.

  Further, in this second method, since the front and back of the chip 21 transferred to the mounting frame 11 is inverted with respect to the state on the dicing frame 45, it is disadvantageous for the chip component 21 having a vertically asymmetric structure. Become. Therefore, an adhesive sheet (not shown) different from the adhesive sheet 18 of the mounting frame 11 is prepared for the vertically asymmetric chip component 21 and the chip 21 is temporarily transferred from the dicing frame 45 to the other adhesive sheet. Then, the chip 21 may be transferred from the other adhesive sheet to the adhesive sheet 18 of the mounting frame 11. In this case as well, the chip 21 can be easily transferred if the difference in adhesive strength is utilized (the adhesive strength of the transfer destination is made stronger than the adhesive strength of the transfer source).

(3) In the third method, as shown in FIG. 6, dicing is performed into a strip shape in which a plurality of chips 21 are gathered, and the strip 22 connected to the plurality of chips is attached to the adhesive sheet 18. After being divided into individual chips 21, they are attached to the support frame 12. At the time of dicing, not only the wafer or substrate is cut into the strip shape, but also a cut groove is formed between the chips 21 in each strip 22.

  In this third method, if there is a defective product 21a, the defective product 21a may be picked up and removed after being divided (chiped) on the adhesive sheet 18 or after being transferred to the mounting frame 11. Although it is good, it is also possible to discard the strip 22 including the defective product 21a in the strip state.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to these, It is clear to those skilled in the art that a various change can be made within the range as described in a claim. .

DESCRIPTION OF SYMBOLS 11 Electronic component mounting frame 12 Support frame 13 Through-opening 14 Support frame front end side corner (notch)
15 Support frame rear end corner (rounded part)
DESCRIPTION OF SYMBOLS 16 Information description part 17 Through-hole 18 Adhesive sheet 19 Adhesive layer 21 Chip component 21a Defective product 31 Wiring board 41 Mount head 42 Component supply part 43 Wiring board conveyance line 44 Push-up pin 45 Dicing frame 46 Adhesive tape 51 Tape material 52 Chip part Storage pocket 53 Tape feed hole

Claims (4)

A plate-like support frame having a through-opening in the center, and an adhesive sheet that is provided on the support frame so as to be stretched over the through-opening and has a pressure-sensitive adhesive layer on the surface and can be attached to chip-like electronic components Preparing a mounting frame having:
Taking out the diced chip-like electronic component from the dicing frame and placing it on the surface of the adhesive sheet of the mounting frame,
A step of mounting the mounting frame on which the chip-like electronic components are arranged on a surface mounting device provided with a board transfer line for transferring a wiring board ;
Mounting a chip-like electronic component disposed on the mounting frame using the surface mounting device on the wiring board, and
The mounting frame support frame has a substantially rectangular overall shape having a width smaller than the length,
The mounting frame has at least a width dimension smaller than a width dimension of the dicing frame among a length dimension and a width dimension,
In the mounting step, the plurality of mounting frames are arranged on the substrate transport line at a side portion of the substrate transport line so that the longitudinal direction intersects the transport direction of the wiring board. method of manufacturing an electronic device which is characterized in that the wire is attached to the surface mount device to be sequence in the conveying direction of the substrate mounting the chip electronic component along. The method for manufacturing an electronic device according to claim 1, wherein in the electronic component transfer step, only non-defective products are selectively transferred from the dicing frame to the mounting frame. The electronic component transfer step includes disposing the chip-shaped electronic component on the surface of the pressure-sensitive adhesive sheet of the mounting frame with an interval wider than the interval between the chip-shaped electronic components on the dicing frame. The manufacturing method of the electronic device of description. A board transfer line for transferring a wiring board on which electronic components are to be mounted;
A component supply unit capable of accommodating an electronic component mounting frame storing electronic components;
A surface mounting apparatus comprising: a mounting head that takes out an electronic component from an electronic component mounting frame mounted on the component supply unit and places the electronic component on a surface of the wiring board;
The electronic component mounting frame includes a plate-like support frame having a through-opening at a central portion and a chip-like electronic component provided on the support frame so as to be stretched over the through-opening and having an adhesive layer on the surface. And an adhesive sheet that can be attached, and the support frame of the electronic component mounting frame has a substantially rectangular overall shape that is smaller in width than the length,
The component supply unit includes a plurality of electronic component mounting frames that store chip-shaped electronic components such that a longitudinal direction thereof intersects a conveyance direction of the wiring board by the substrate conveyance line , and the plurality of electronic components wherein the mounting frame is capable of accommodating the plurality of electronic component mounting frame as sequence in the conveying direction of the wiring board along the board conveying line at the side of the substrate transfer line Surface mount equipment.

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