JP2004284645A - Taping package and its manufacturing method - Google Patents

Taping package and its manufacturing method Download PDF

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Publication number
JP2004284645A
JP2004284645A JP2003079291A JP2003079291A JP2004284645A JP 2004284645 A JP2004284645 A JP 2004284645A JP 2003079291 A JP2003079291 A JP 2003079291A JP 2003079291 A JP2003079291 A JP 2003079291A JP 2004284645 A JP2004284645 A JP 2004284645A
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Japan
Prior art keywords
tape
electronic component
packaging material
taping
printed
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JP2003079291A
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JP3965431B2 (en
Inventor
Yoshio Inomata
芳夫 猪股
Toshiyuki Yamazaki
利行 山崎
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TDK Corp
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TDK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a merged usage of different component parts and different types of electronic component parts even if a taping package is pulled out of a reel or partially cut out and used in a manufacturing line in advance by a method wherein a product name and an identification symbol of the electronic component parts are printed and displayed through a laser beam irradiation of a tape-like packaging material for use in storing the electronic component parts. <P>SOLUTION: A storing tape 21 provided with storing concave parts 22 for storing an electronic component 1, an upper cover tape 23 and a lower cover tape 24 are applied as a tape-like packaging material. After the upper and lower cover tapes 23, 24 are press fitted to the storing tape 21 to package the electronic component 1, the lower cover tape 24 is irradiated with a laser beam to cause either one of a product name or an identification symbol of the stored electronic component 1 or both the product name and the identification symbol to be printed at a position P. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、テープ状の包装材で電子部品を包装したテーピング包装品及びその製造方法に係り、とくにテープ状の包装材にレーザ光照射印字にて品名や識別記号を表示したテーピング包装品及びその製造方法に関する。
【0002】
【従来の技術】
従来、電気・電子機器のプリント配線基板には、抵抗、コンデンサ、コイル、バリスタ、サーミスタ、ダイオード等の表面実装形の電子部品が使用されてきているが、プリント配線基板面へ電子部品を実装する場合、製造の自動化の観点から、図5のようなテープ状の包装材で電子部品1を包装したテーピング包装品10(電子部品連とも言う)の形態が採られ、実装されるべきそれぞれの電子部品1の品名、識別記号は、テーピング包装品10を巻き取ったリールの外面にのみ表示されている。
【0003】
表面実装形の電子部品が現出した当初においては、それらの寸法が大きかったこともあり、それぞれの電子部品面に品名、識別記号を印字することが可能であったが、携帯電話に例を見るように、機器の軽薄短小化が促進され、使用される表面実装形の電子部品も幅、長さ、厚さ寸法がそれぞれ1mmを下回る程に迄小型化してきており、製造ラインにおいて重要な電子部品の品名、識別記号を、電子部品面に印字することが困難になってしまったことが、その背景にある。
【0004】
なお、テーピング包装品の具体的な構成としては、大別して、図5に示したように、電子部品1を収納する凹部(抜き穴)12及び送り穴15を形成した収納テープ11の上下面をそれぞれカバーテープ13,14で覆った3層構成、あるいは、電子部品を収納する有底凹部を形成した収納テープ(エンボス付テープ)の上面をカバーテープで覆った2層構成がある。
【0005】
テーピング包装品の公知例としては、下記特許文献1、特許文献2がある。
【0006】
【特許文献1】特開平7−76364号公報
【特許文献2】特開2001−278334号公報
【0007】
特許文献1では電子部品毎にキャリアテープ底面にバーコードを付しているが、電子部品が小型になると、電子部品毎にバーコードを付すことは不可能になる。
【0008】
【発明が解決しようとする課題】
ところで、製造ラインにおいては、電子部品を収納したテーピング包装品を巻き取るリールから引き離したり、リールから引き出したテーピング包装品の一部を切り取ったりして使用せざるを得ない場合が往々にして生じる。少数単位のプリント配線基板の製作に当る場合等で、一旦、リールからテーピング包装品を引き離したり、一部を切り取ったりした場合、当該電子部品の品名、識別記号がテーピング包装品を巻き取るリールの外面にラベルの利用等による表示しかされていないため、製造ラインにおいて、異部品、異品種の電子部品の混同使用を防ぎ切れず重大な不具合事故を引き起こすという問題が多々発生している。
【0009】
本発明は、上記の点に鑑みてなされたものであり、電子部品を収納するテープ状の包装材に、当該電子部品の品名、識別記号をレーザ光照射で印字表示することにより、製造ラインにおいて、リールからテーピング包装品を引き離したり、一部を切り取ったりして使用した場合でも、異部品、異品種の電子部品の混同使用を未然に防ぐことを可能にしたテーピング包装品を提供することを目的とするとともに、当該包装品の安価で、確実なる製造方法を提供することを目的とする。
【0010】
本発明のその他の目的や新規な特徴は後述の実施の形態において明らかにする。
【0011】
【課題を解決するための手段】
上記目的を達成するために、本願請求項1の発明に係るテーピング包装品は、テープ状の包装材で電子部品を包装した構成において、前記テープ状の包装材の片面又は両面にレーザ光照射印字にて前記電子部品の品名、識別記号のいずれか又は両方を表示したことを特徴としている。
【0012】
本願請求項2の発明に係るテーピング包装品の製造方法は、テープ状の包装材で電子部品を包装してテーピング包装品を作製する場合に、前記テープ状の包装材で電子部品を包装した後に、前記テープ状の包装材にレーザ光照射により前記電子部品の品名、識別記号のいずれか又は両方を印字することを特徴としている。
【0013】
本願請求項3の発明に係るテーピング包装品の製造方法は、請求項2において、前記テープ状の包装材が、収納テープにカバーテープを貼り合わせた構造を有し、前記カバーテープが薄葉紙に樹脂ラミネートを施したものであり、前記レーザ光照射により前記薄葉紙を焦がして印字することを特徴としている。
【0014】
本願請求項4の発明に係るテーピング包装品の製造法は、請求項2において、前記レーザ光照射により、前記収納テープを焦がして印字することを特徴としている。
【0015】
【発明の実施の形態】
以下、本発明に係るテーピング包装品及びその製造方法の実施の形態を図面に従って説明する。
【0016】
図1及び図2は本発明の第1の実施の形態であって、図1はテーピング包装品の底面側を上向きとした斜視図、図2(A)は正断面図、(B)は底面図をそれぞれ示す。これらの図において、テーピング包装品20は、チップ状の電子部品1を1個ずつ収納するための複数個の収納凹部22がその長さ方向に分布するように設けられた収納テープ21と、上カバーテープ23と、下カバーテープ24とをテープ状の包装材として用いる。前記収納テープ21には、収納凹部22と相関する配列ピッチをもって、複数個の送り穴25が設けられる。このような収納テープ21は、一般に、紙、ポリスチレン、ポリエステルなどの材料から構成されるが、上述した収納凹部22は、収納テープ21の厚み方向に貫通する穴として設けられるため、収納凹部22の下面開口を閉じるように、下カバーテープ24が収納テープ21底面側に接着(圧着)される。また、収納凹部22内に1個ずつ電子部品1が収納された後、収納凹部22の上面開口を閉じるように、上カバーテープ23が収納テープ21に接着(圧着)される。
【0017】
本実施の形態においては、下カバーテープ24として、薄葉紙を基材として樹脂ラミネート加工を施しかつ帯電防止加工を施したものを使用する。そして、前記テープ状の包装材(収納テープ21、上カバーテープ23、下カバーテープ24)で電子部品1を包装した後に、前記下カバーテープ24にレーザ光を照射することにより収納した前記電子部品の品名、識別記号のいずれか又は両方を、例えば図中一点鎖線で示す位置Pに印字する。この場合、ラミネートされた樹脂を通して下カバーテープ24の基材である薄葉紙を焦がす(焼印を形成する)ことで、良好な視認性を確保できる。なお、薄葉紙を基材とした樹脂ラミネート加工は薄葉紙の片面又は両面のどちらでもよいが、片面の場合には薄葉紙の外側面に樹脂ラミネート加工を施す。
【0018】
以下にレーザ光照射印字の実験例を示す。
▲1▼ 下カバーテープの条件:
単位面積当たりの重量14gf/mの薄葉紙を基材として、厚さ20μmで半透明梨地のポリエチレンフィルムのラミネート加工を施しかつ帯電防止加工を施したものを使用。下カバーテープは収納テープに圧着される。
▲2▼ レーザ光照射印字の条件:
印字速度:200mm/秒
レーザ出力:18%(レーザ印字装置の定格出力を100%としたとき)
加工面出力:2W(下カバーテープ面での照射強度)
フォーカス:下カバーテープに焦点を合わせる
印字時間:0.28秒
【0019】
図3は、テーピング包装品の下カバーテープへのレーザ光照射印字の上記実験例の印字の状態を示す。レーザ光照射により、下カバーテープを焦がし(薄葉紙の一部が焦げている)、明瞭な印字が得られている。
【0020】
レーザ印字装置をテーピング機に組み合わせると、テープ状の包装材で電子部品を包装するテーピング包装工程とレーザ光照射による印字工程とをほぼ同時に行う(連動させる)ことができる。例えば、電子部品の特性測定工程→編集工程→テーピング包装工程→レーザ印字工程→リールへの巻取り工程の順で、又は特性測定工程→テーピング包装工程→レーザ印字工程→リールへの巻取り工程の順で各工程を連動させて実行できる。
【0021】
この第1の実施の形態によれば、次の通りの効果を得ることができる。
【0022】
(1) 少数単位のプリント配線基板の製作に当る場合等で、製造ラインにおいて、リールからテーピング包装品を引き離したり、一部を切り取ったりして使用した場合、異部品、異品種の電子部品の混同使用を未然に防ぐことを可能ならしめ、手直し作業がなくなり、製造コストの低減化に繋がる。
【0023】
(2) レーザ光照射による印字は、簡単なコンピュータシステムで制御・管理ができる利点がある。また、レーザ光でテープ状の包装材の表面を炭化させて文字、記号を発現させる方法であり、レーザ光焦点がシャープであり、小さな文字でも印字でき、さらに複雑な制御も可能である。従って、レーザ光照射でテープ状の包装材の平坦面に、小さな文字でも見易く印字出来るため、異部品、異品種の電子部品の混同使用を未然に防ぐことを可能ならしめ、電子部品の装着工程の確実性を保持することができ、結果として製造コストの低減化に繋がる。
【0024】
(3) レーザ光照射による印字のため、印字速度が速く、電子部品の特性測定工程→テーピング包装工程→印字工程→リールへの巻取り工程を連動でき生産性向上に寄与し得る。
【0025】
(4) レーザ光照射による印字のため、インキを使用した印字方式と異なり、産業廃棄物を伴わないという副次的な利点も大きい。
【0026】
(5) テープ状の包装材のカバーテープを、薄葉紙に樹脂ラミネートを施したものとすることによって、レーザ光照射により前記薄葉紙を焦がして印字することが可能であり、視認性を良好にすることができる。
【0027】
図4は本発明の第2の実施の形態を示す。テーピング包装品20Aは、電子部品1を1個ずつ収納するための複数個の収納凹部22がその長さ方向に分布するように設けられた収納テープ21と、下カバーテープ24Aと、上カバーテープ23とをテープ状の包装材として用いる。ここで、下カバーテープ24Aは第1の実施の形態とは異なり、薄葉紙の基材は使用せず、樹脂テープのみの構造であり、収納テープ21として紙製の台紙テープを用いる。
【0028】
そして、テープ状の包装材(収納テープ21、上カバーテープ23、下カバーテープ24A)で電子部品1を包装した後に、前記下カバーテープ24Aにレーザ光を照射することにより品名、識別記号のいずれか又は両方を、例えば図中一点鎖線で示す位置Pに印字する。この場合、下カバーテープ24Aを通して収納テープ21を成す台紙テープ表面を焦がすことで、良好な視認性を確保できる。
【0029】
なお、その他の構成は前述の第1の実施の形態と同様であり、同様の作用効果が得られる。
【0030】
上記各実施の形態では、収納テープと、上カバーテープと、下カバーテープとからなるテープ状の包装材の下カバーテープ側にレーザ光を照射してテープ状の包装材の底面側に印字したが、上カバーテープ側にレーザ光を照射してテープ状の包装材の上面側に印字する構成でも同様の作用効果が得られる。さらに、前記テープ状の包装材の上面及び下面の両側にレーザ光照射による印字を施してもよい。
【0031】
また、上記上記各実施の形態では、収納テープと、上カバーテープと、下カバーテープとからなる3層構造のテープ状の包装材の場合を例示したが、電子部品を収納する有底凹部を形成した収納テープ(エンボス付テープ)の上面をカバーテープで覆った2層構造ののテープ状の包装材を使用する場合にも、本発明は適用可能である。
【0032】
以上本発明の実施の形態について説明してきたが、本発明はこれに限定されることなく請求項の記載の範囲内において各種の変形、変更が可能なことは当業者には自明であろう。
【0033】
【発明の効果】
以上説明したように、本発明に係るテーピング包装品は、テープ状の包装材で電子部品を包装する構成において、前記テープ状の包装材の片面又は両面にレーザ光照射印字にて前記電子部品の品名、識別記号のいずれか又は両方を表示しており、以下の効果を奏することができる。
【0034】
(1) 少数単位のプリント配線基板の製作に当る場合等で、製造ラインにおいて、リールから前記テーピング包装品を引き離したり、一部を切り取ったりして使用した場合であっても、前記テープ状の包装材に収納している電子部品の品名や識別記号が表示されているため、異部品、異品種の電子部品の混同使用を未然に防ぐことを可能ならしめ、手直し作業がなくなり、製造コストの低減化に繋がる。
【0035】
(2) レーザ光照射による印字であり、テープ状の包装材の平坦面に、小さな文字でも見易く印字出来る。
【0036】
また、本発明に係るテーピング包装品の製造方法は、テープ状の包装材で電子部品を包装した後(包装動作とほぼ同時)に、前記テープ状の包装材にレーザ光照射により前記電子部品の品名、識別記号のいずれか又は両方を印字するようにしており、以下の効果を奏することができる。
【0037】
(1) レーザ光照射による印字は、簡単なコンピュータシステムで制御・管理ができる利点があり、また、レーザ光でテープ状の包装材の表面を炭化させて文字、記号等を発現させる方法であるので、レーザ光焦点がシャープであり、小さな文字でも印字でき、さらに複雑な制御も可能である。従って、レーザ光照射でテープ状の包装材の平坦面に、小さな文字でも見易く印字出来るため、異部品、異品種の電子部品の混同使用を未然に防ぐことを可能ならしめ、電子部品の装着工程の確実性を保持することができ、結果として製造コストの低減化に繋がる。
【0038】
(2) レーザ光照射による印字のため、印字速度が速く、電子部品の特性測定工程→テーピング包装工程→印字工程→リールへの巻取り工程を連動でき生産性向上に寄与し得る。
【0039】
(3) レーザ光照射による印字のため、インキを使用した印字方式と異なり、産業廃棄物を伴わないという副次的な利点も大きい。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態であって、電子部品を収納したテープ状の包装材面に当該電子部品の品名、識別記号をレーザ光照射により印字表示したテーピング包装品を示す斜視図である。
【図2】第1の実施の形態であって、(A)は前記テーピング包装品の断面図、(B)は底面図である。
【図3】テープ状の包装材面に対するレーザ光照射印字の実験結果を示す拡大写真図である。
【図4】本発明の第2の実施の形態であって、(A)はテーピング包装品の断面図、(B)は底面図である。
【図5】テーピング包装品の1例を示す斜視図である。
【符号の説明】
1 電子部品
10,20,20A テーピング包装品
11,21 収納テープ
12,22 凹部
13,14,23,23A,24 カバーテープ
25 送り穴
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a taping package in which electronic components are packaged with a tape-like packaging material and a method for manufacturing the same, and in particular, a taping package product in which a product name or an identification symbol is displayed on a tape-like packaging material by laser light irradiation printing, and a method for manufacturing the same. It relates to a manufacturing method.
[0002]
[Prior art]
Conventionally, surface-mounted electronic components such as resistors, capacitors, coils, varistors, thermistors, and diodes have been used for printed wiring boards of electric and electronic devices, but electronic components are mounted on the printed wiring board surface. In the case, from the viewpoint of automation of manufacturing, a form of a taping package 10 (also referred to as a series of electronic components) in which the electronic component 1 is packaged with a tape-like packaging material as shown in FIG. The product name and identification symbol of the component 1 are displayed only on the outer surface of the reel on which the taping package 10 has been wound.
[0003]
When surface-mounted electronic components first appeared, their dimensions were so large that it was possible to print the product name and identification symbol on the surface of each electronic component. As can be seen, devices are becoming lighter, thinner and smaller, and the surface-mounted electronic components used are becoming smaller, with widths, lengths, and thicknesses less than 1 mm each. The background is that it has become difficult to print the names and identification symbols of electronic components on the surface of the electronic components.
[0004]
The specific configuration of the taping packaged product is roughly divided into, as shown in FIG. 5, the upper and lower surfaces of a storage tape 11 having a recess (hole) 12 for storing the electronic component 1 and a feed hole 15 formed therein. There is a three-layer configuration in which cover tapes 13 and 14 cover each, or a two-layer configuration in which the upper surface of a storage tape (tape with embossment) having a bottomed recess for storing electronic components is covered with a cover tape.
[0005]
Known examples of the taping package include the following Patent Documents 1 and 2.
[0006]
[Patent Document 1] JP-A-7-76364 [Patent Document 2] JP-A-2001-278334
In Patent Literature 1, a bar code is attached to the bottom surface of the carrier tape for each electronic component. However, if the electronic component becomes smaller, it becomes impossible to attach a bar code to each electronic component.
[0008]
[Problems to be solved by the invention]
By the way, in a production line, it often occurs that the taping package containing the electronic components has to be used after being separated from the reel on which the electronic component is wound or by cutting off a part of the taping package extracted from the reel. . In the case of manufacturing a small number of printed wiring boards, for example, once the tape packaging product is separated from the reel or cut off partly, the product name and identification code of the electronic component are changed to the reel on which the tape packaging product is wound. Since only the label is displayed on the outer surface of the product, there are many problems that a mixed use of different components and different types of electronic components cannot be prevented in a production line, causing serious troubles.
[0009]
The present invention has been made in view of the above points, and in a manufacturing line by printing and displaying the product name and identification symbol of the electronic component on a tape-shaped packaging material for storing the electronic component by laser light irradiation. The present invention provides a taping package that can prevent mixed use of different parts and different kinds of electronic components even when the taping package is separated from a reel or cut out and used. An object of the present invention is to provide an inexpensive and reliable manufacturing method of the packaged product.
[0010]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, a taping package according to the invention of claim 1 of the present application has a configuration in which electronic components are packaged in a tape-like packaging material, and one side or both sides of the tape-like packaging material is printed by laser irradiation. In the above, one or both of the product name and the identification code of the electronic component are displayed.
[0012]
The method of manufacturing a taping package according to the invention of claim 2 of the present application is a method of manufacturing a taping package by packaging an electronic component with a tape-like packaging material, after packaging the electronic component with the tape-like packaging material. One or both of the electronic component name and the identification code are printed on the tape-like packaging material by laser light irradiation.
[0013]
The method of manufacturing a taping package according to the invention of claim 3 of the present application is the method of claim 2, wherein the tape-shaped packaging material has a structure in which a cover tape is attached to a storage tape, and the cover tape is made of a thin paper. The thin paper is printed by being burned by the laser beam irradiation.
[0014]
The manufacturing method of a taping package according to the invention of claim 4 of the present application is characterized in that, in claim 2, the storage tape is burned and printed by the laser beam irradiation.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a taping package and a method of manufacturing the same according to the present invention will be described with reference to the drawings.
[0016]
1 and 2 show a first embodiment of the present invention. FIG. 1 is a perspective view in which the bottom side of a taping package is directed upward, FIG. 2A is a front sectional view, and FIG. The figures are shown respectively. In these figures, a taping package 20 includes a storage tape 21 provided with a plurality of storage recesses 22 for storing the chip-shaped electronic components 1 one by one so as to be distributed in the length direction thereof. The cover tape 23 and the lower cover tape 24 are used as a tape-like packaging material. The storage tape 21 is provided with a plurality of feed holes 25 at an arrangement pitch correlated with the storage recess 22. Such a storage tape 21 is generally made of a material such as paper, polystyrene, or polyester. However, since the storage recess 22 described above is provided as a hole that penetrates in the thickness direction of the storage tape 21, The lower cover tape 24 is bonded (pressed) to the bottom surface side of the storage tape 21 so as to close the lower opening. After the electronic components 1 are stored one by one in the storage recess 22, the upper cover tape 23 is bonded (pressed) to the storage tape 21 so as to close the upper opening of the storage recess 22.
[0017]
In the present embodiment, as the lower cover tape 24, a material obtained by applying a resin laminating process using thin paper as a base material and performing an antistatic process is used. Then, after packaging the electronic component 1 with the tape-shaped wrapping material (the storage tape 21, the upper cover tape 23, and the lower cover tape 24), the electronic component stored by irradiating the lower cover tape 24 with a laser beam. Is printed at a position P indicated by a dashed line in the figure, for example. In this case, good visibility can be ensured by scoring (forming a branding) the thin paper as the base material of the lower cover tape 24 through the laminated resin. The resin lamination using the thin paper as the base material may be performed on one side or both sides of the thin paper. In the case of one side, the resin lamination is performed on the outer surface of the thin paper.
[0018]
An experimental example of laser beam irradiation printing is shown below.
(1) Conditions for the lower cover tape:
A thin paper having a weight of 14 gf / m 2 per unit area is used as a base material, and a 20 μm-thick translucent polyethylene film laminated and subjected to antistatic processing is used. The lower cover tape is crimped to the storage tape.
(2) Conditions for laser beam irradiation printing:
Printing speed: 200 mm / sec Laser output: 18% (when the rated output of the laser printer is 100%)
Processing surface output: 2W (irradiation intensity on lower cover tape surface)
Focus: focus on lower cover tape Printing time: 0.28 seconds
FIG. 3 shows the state of printing in the above experimental example of laser light irradiation printing on the lower cover tape of the taping package. The lower cover tape is scorched (part of the thin paper is scorched) by laser light irradiation, and clear printing is obtained.
[0020]
When a laser printing apparatus is combined with a taping machine, a taping and packaging step of packaging electronic components with a tape-like packaging material and a printing step by laser beam irradiation can be performed almost simultaneously (linked). For example, in the order of the characteristic measurement process of the electronic component → the editing process → the taping and packaging process → the laser printing process → the winding process on the reel, or the characteristic measuring process → the taping and packaging process → the laser printing process → the winding process on the reel The steps can be executed in conjunction with each other in order.
[0021]
According to the first embodiment, the following effects can be obtained.
[0022]
(1) In the case where a small number of printed wiring boards are manufactured, for example, when a taping package is separated from a reel or cut off from a reel in a production line and used, a different part or a different kind of electronic part may be used. As a result, confusion can be prevented beforehand, and there is no need for rework, leading to a reduction in manufacturing costs.
[0023]
(2) There is an advantage that printing by laser beam irradiation can be controlled and managed by a simple computer system. Also, this is a method in which the surface of the tape-shaped packaging material is carbonized with laser light to express characters and symbols. The laser light focus is sharp, even small characters can be printed, and more complicated control is possible. Therefore, even small letters can be easily printed on the flat surface of the tape-shaped packaging material by laser light irradiation, making it possible to prevent the mixed use of different parts and different kinds of electronic parts beforehand, Can be maintained, and as a result, manufacturing costs can be reduced.
[0024]
(3) Since printing is performed by laser beam irradiation, the printing speed is high, and the process of measuring the characteristics of the electronic component → the taping / packaging process → the printing process → the winding process onto the reel can be linked, thereby contributing to an improvement in productivity.
[0025]
(4) Unlike the printing method using ink, there is a great secondary advantage that no industrial waste is involved because printing is performed by laser light irradiation.
[0026]
(5) By making the cover tape of the tape-shaped wrapping material resin-laminated on the thin paper, the thin paper can be scorched and printed by laser light irradiation, and the visibility is improved. Can be.
[0027]
FIG. 4 shows a second embodiment of the present invention. The taping package 20A includes a storage tape 21 provided with a plurality of storage recesses 22 for storing the electronic components 1 one by one so as to be distributed in a length direction thereof, a lower cover tape 24A, and an upper cover tape. 23 is used as a tape-shaped packaging material. Here, unlike the first embodiment, the lower cover tape 24A does not use a thin paper base material, has a structure of only a resin tape, and uses a paper mount tape as the storage tape 21.
[0028]
After wrapping the electronic component 1 with a tape-shaped wrapping material (the storage tape 21, the upper cover tape 23, and the lower cover tape 24A), the lower cover tape 24A is irradiated with a laser beam to obtain either the product name or the identification code. One or both are printed, for example, at a position P indicated by a dashed line in the figure. In this case, good visibility can be secured by scoring the surface of the mounting tape forming the storage tape 21 through the lower cover tape 24A.
[0029]
The other configuration is the same as that of the first embodiment, and the same operation and effect can be obtained.
[0030]
In each of the above embodiments, the storage tape, the upper cover tape, and the lower cover tape, the lower cover tape side of the tape-shaped packaging material was irradiated with laser light and printed on the bottom side of the tape-shaped packaging material. However, a similar effect can be obtained by a configuration in which laser light is irradiated on the upper cover tape side and printing is performed on the upper surface side of the tape-shaped packaging material. Further, the upper surface and the lower surface of the tape-shaped packaging material may be printed by laser beam irradiation.
[0031]
Further, in each of the above-described embodiments, the case of the tape-like packaging material having a three-layer structure including the storage tape, the upper cover tape, and the lower cover tape has been described. The present invention is also applicable to a case where a tape-like packaging material having a two-layer structure in which the upper surface of the formed storage tape (embossed tape) is covered with a cover tape is used.
[0032]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims.
[0033]
【The invention's effect】
As described above, the taping package according to the present invention is configured such that the electronic component is packaged with the tape-shaped packaging material, and the electronic component is formed by laser light irradiation printing on one or both surfaces of the tape-shaped packaging material. Either or both of the product name and the identification symbol are displayed, and the following effects can be obtained.
[0034]
(1) In the case where a small number of printed wiring boards are manufactured, for example, when the taping package is separated from a reel or cut off and used in a production line, the tape-shaped package is used. Since the product names and identification symbols of the electronic components stored in the packaging material are displayed, it is possible to prevent the mixed use of different components and different types of electronic components beforehand, eliminating the need for rework and reducing manufacturing costs. It leads to reduction.
[0035]
(2) Printing is performed by laser beam irradiation, and even small characters can be printed on a flat surface of a tape-shaped packaging material in a legible manner.
[0036]
Further, in the method of manufacturing a taping package according to the present invention, after packaging the electronic component with the tape-like packaging material (almost at the same time as the packaging operation), the tape-like packaging material is irradiated with a laser beam to thereby form the electronic component. Either or both of the product name and the identification symbol are printed, and the following effects can be obtained.
[0037]
(1) Printing by laser light irradiation has the advantage that it can be controlled and managed by a simple computer system, and is a method in which characters, symbols, etc. are expressed by carbonizing the surface of a tape-like packaging material with laser light. Therefore, the laser beam focus is sharp, even small characters can be printed, and more complicated control is possible. Therefore, even small letters can be easily printed on the flat surface of the tape-shaped packaging material by laser light irradiation, making it possible to prevent the mixed use of different parts and different kinds of electronic parts beforehand, Can be maintained, and as a result, manufacturing costs can be reduced.
[0038]
(2) Since printing is performed by laser beam irradiation, the printing speed is high, and the process of measuring the characteristics of the electronic component → the taping / packaging process → the printing process → the winding process onto the reel can be linked, thereby contributing to an improvement in productivity.
[0039]
(3) Since printing is performed by laser beam irradiation, unlike the printing method using ink, there is a great secondary advantage that no industrial waste is involved.
[Brief description of the drawings]
FIG. 1 shows a taping package according to a first embodiment of the present invention, in which a product name and an identification code of the electronic component are printed and displayed by laser light irradiation on a tape-like packaging material surface containing the electronic component. It is a perspective view.
FIG. 2 is a first embodiment, in which (A) is a sectional view of the taping package and (B) is a bottom view.
FIG. 3 is an enlarged photograph showing an experimental result of laser light irradiation printing on a tape-shaped packaging material surface.
FIG. 4 is a second embodiment of the present invention, in which (A) is a sectional view of a taping package and (B) is a bottom view.
FIG. 5 is a perspective view showing an example of a taping package.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component 10, 20, 20A Taping package 11, 21, Storage tape 12, 22, Depression 13, 14, 23, 23A, 24 Cover tape 25 Feed hole

Claims (4)

テープ状の包装材で電子部品を包装したテーピング包装品において、前記テープ状の包装材の片面又は両面にレーザ光照射印字にて前記電子部品の品名、識別記号のいずれか又は両方を表示したことを特徴とするテーピング包装品。In a taping package in which electronic components are wrapped in a tape-shaped packaging material, one or both of the electronic component name and identification symbol are displayed by laser light irradiation printing on one or both surfaces of the tape-shaped packaging material. Taping packaged products. テープ状の包装材で電子部品を包装するテーピング包装品の製造方法において、前記テープ状の包装材で電子部品を包装した後に、前記テープ状の包装材にレーザ光照射により前記電子部品の品名、識別記号のいずれか又は両方を印字することを特徴とするテーピング包装品の製造方法。In the method of manufacturing a taping package for packaging an electronic component with a tape-like packaging material, after packaging the electronic component with the tape-like packaging material, the name of the electronic component by laser light irradiation on the tape-like packaging material, A method for producing a taping package, wherein one or both of the identification symbols are printed. 前記テープ状の包装材が、収納テープにカバーテープを貼り合わせた構造を有し、前記カバーテープが薄葉紙に樹脂ラミネートを施したものであり、前記レーザ光照射により前記薄葉紙を焦がして印字する請求項2記載のテーピング包装品の製造方法。The tape-shaped wrapping material has a structure in which a cover tape is attached to a storage tape, and the cover tape is made by laminating a thin paper with a resin, and the thin paper is burned by the laser beam irradiation and printed. Item 4. A method for producing a taping package according to Item 2. 前記レーザ光照射により、前記収納テープを焦がして印字する請求項2記載のテーピング包装品の製造方法。The method according to claim 2, wherein the laser beam irradiation irradiates and prints the storage tape.
JP2003079291A 2003-03-24 2003-03-24 Manufacturing method of taping package Expired - Fee Related JP3965431B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007145374A (en) * 2005-11-29 2007-06-14 Junichi Mizutani Packaging material displaying bar code and merchandise packaged using the same
JP2021002601A (en) * 2019-06-21 2021-01-07 パナソニックIpマネジメント株式会社 Component tape management device, component tape management system, and component tape management method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007145374A (en) * 2005-11-29 2007-06-14 Junichi Mizutani Packaging material displaying bar code and merchandise packaged using the same
JP2021002601A (en) * 2019-06-21 2021-01-07 パナソニックIpマネジメント株式会社 Component tape management device, component tape management system, and component tape management method
JP7345130B2 (en) 2019-06-21 2023-09-15 パナソニックIpマネジメント株式会社 Component tape management device, component tape management system, and component tape management method

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