CN111094150A

CN111094150A - Electronic component storage container and electronic component string

Info

Publication number: CN111094150A
Application number: CN201880060902.0A
Authority: CN
Inventors: 中川圣之
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2017-09-27
Filing date: 2018-09-26
Publication date: 2020-05-01
Anticipated expiration: 2038-09-26
Also published as: TW201919964A; DE112018004255T5; WO2019065734A1; CN111094150B; JP6950741B2; TWI681913B; JPWO2019065734A1

Abstract

An electronic component storage container (10) is provided with: a main body part (20) which has at least one storage recess part (22) and extends along the longitudinal direction, wherein the storage recess part (22) stores the electronic component and is opened towards one side; a cover (40) that covers the opening (223) of the storage recess (22); and a cover plate (30) that is sandwiched between the main body (20) and the cover (40), wherein the surface of the cover (40) that faces the main body (20) is not joined to the cover plate (30).

Description

Electronic component storage container and electronic component string

Technical Field

The invention relates to an electronic component container and an electronic component string.

Background

Conventionally, various electronic component storage containers have been developed which are configured to be able to store electronic components.

Japanese patent laid-open nos. 2006-206082 (patent document 1) and 2000-43977 (patent document 2) disclose electronic component containers that store a plurality of electronic components.

Japanese patent laid-open nos. 2002-96892 (patent document 3) and 2002-274593 (patent document 4) disclose electronic component storage cases each including a hard case for storing a plurality of electronic components in a storage container.

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 2006-206082

Patent document 2: japanese laid-open patent publication No. 2000-43977

Patent document 3: japanese laid-open patent publication No. 2002-96892

Patent document 4: japanese patent laid-open publication No. 2002-274593

Disclosure of Invention

Problems to be solved by the invention

However, in the electronic component storage containers disclosed in patent documents 1 and 2, an operator must open the storage bag and take out a plurality of electronic components from the opening portion, which makes it difficult to automatically open the storage bag. Further, when the electronic component to be stored is small, the electronic component may be caught by the edge of the opening portion and may not be taken out.

In the electronic component storage container disclosed in patent document 3 and patent document 4, a slide shutter for opening and closing an opening of the storage container is provided, and a groove portion for moving the shutter is provided on an inner peripheral surface of the storage container defining the opening. Therefore, when the plurality of electronic components housed in the housing container are small, the electronic components may be caught by the groove and may not be taken out.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component storage container and an electronic component string which are suitable for automatically opening the container and from which electronic components can be smoothly taken out.

Means for solving the problems

The electronic component accommodation container according to the present invention includes: a main body portion having one or more housing recesses that house electronic components and are open to one side, and extending in a longitudinal direction; a cover portion covering the opening of the accommodation recess; and a cover plate sandwiched between the main body portion and the lid portion. The surface of the cover portion facing the main body portion is not joined to the cover plate.

In the electronic component storage container according to the present invention, the main body may have a plurality of the storage recesses.

In the electronic component storage container according to the present invention, the main body portion, the lid plate, and the lid portion may have a rectangular shape in a plan view.

In the electronic component storage container according to the present invention, the cover plate may be wound around the lid portion so as to surround the lid portion.

In the electronic component storage container according to the present invention, the cover plate may be joined to at least a part of the main body portion located around the opening portion by thermal welding.

In the electronic component storage container according to the present invention, the lid portion may be provided so as to be movable relative to the main body portion along the longitudinal direction. In this case, a guide portion that guides relative movement of the lid portion in the longitudinal direction may be provided in at least one of the lid portion and the body portion.

In the electronic component storage container according to the present invention, the opening may have the following shape in a plan view: the shape of the outer edge of the opening does not include a linear side portion extending in a direction orthogonal to the longitudinal direction.

In the electronic component storage container according to the present invention, the main body may have a raised portion that is raised toward a side opposite to a depth direction of the storage recess in a portion located around the opening.

In the electronic component storage container according to the present invention, an opening edge portion of the storage recess portion adjacent to the opening portion may have a bent portion. In this case, the curvature radius of the curved portion is preferably 0.1mm or more and 0.7mm or less.

In the electronic component storage container according to the present invention, the storage recess may be formed of a resin. In this case, the surface resistivity of the inner surface of the housing recess is preferably 1E9 Ω/□ or less.

In the electronic component storage container according to the present invention, the surface resistivity of the lid plate is preferably 1E11 Ω/□ or less.

The electronic component string according to the present invention includes the electronic component storage container and the electronic component stored in the storage recess.

In the electronic component string according to the present invention, the housing recess may house a plurality of electronic components.

In the electronic component string according to the present invention, the main body may have a plurality of the storage recesses, and the storage recesses may be configured to be capable of storing a plurality of the electronic components. In this case, 2000 or more electronic components may be accommodated in each of the plurality of accommodation recesses. In addition, 6000 or more of the electronic components may be housed.

Effects of the invention

According to the present invention, it is possible to provide an electronic component storage container and an electronic component string which are suitable for automatically opening and from which an electronic component can be smoothly taken out.

Drawings

Fig. 1 is a diagram illustrating an electronic component string according to an embodiment.

Fig. 2 is a sectional view taken along line II-II shown in fig. 1.

Fig. 3 is a sectional view taken along the line III-III shown in fig. 1.

Fig. 4 is a perspective view showing a state in which the lid portion of the electronic component string according to the embodiment is slid with respect to the main body portion.

Fig. 5 is a sectional view showing a state where the electronic component is taken out from the electronic component string of the embodiment.

Fig. 6 is a cross-sectional view of an electronic component string according to another first embodiment.

Fig. 7 is a cross-sectional view showing a state where an electronic component is taken out from the electronic component string according to the other first embodiment.

Fig. 8 is a sectional view of an electronic component string according to another second embodiment.

Fig. 9 is a cross-sectional view showing a state where an electronic component is taken out from the electronic component string according to the other second embodiment.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments described below, the same or common portions are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated.

(embodiment mode 1)

An electronic component string 100 according to an embodiment will be described with reference to fig. 1 to 3.

As shown in fig. 1 to 3, the electronic component string 100 according to embodiment 1 includes a plurality of electronic components 1 (see fig. 2) and an electronic component storage container 10. As described later, the electronic component string 100 is configured such that the electronic components 1 stored in the storage recesses 22 can be taken out by sliding the lid portion 40 with respect to the main body portion 20.

The electronic component 1 is, for example, a laminated ceramic capacitor. The outer dimensions of the electronic component 1 in the longitudinal direction, the width direction, and the thickness direction are, for example, 1.0mm × 0.5mm × 0.5mm, 0.4mm × 0.2mm × 0.2mm, or 0.2mm × 0.1mm × 0.1 mm.

The electronic component storage container 10 includes a main body 20, a lid 30, and a lid 40. The electronic component accommodation container 10 has, for example, a longitudinal direction (DR1 direction) and a lateral direction (DR2 direction), and is formed in a long shape. The longitudinal direction is parallel to a sliding direction described later. The main body 20, the lid plate 30, and the lid 40 have a rectangular shape in plan view.

The main body 20 is provided along the longitudinal direction. The main body portion 20 includes a flat plate portion 21, a plurality of receiving recesses 22, and a plurality of raised portions 23. The main body 20 is formed by processing a sheet member, for example. As the material of the sheet member, polystyrene, polyethylene terephthalate, or the like doped with a conductive material such as carbon or a conductive paint can be used. The thickness of the sheet member is, for example, about 0.5 mm.

The flat plate portion 21 has a front surface 21a and a rear surface 21 b. The flat plate portion 21 is provided substantially parallel to an opening surface 224 of the housing recess 22 described later.

The plurality of housing recesses 22 are arranged side by side along the longitudinal direction DR 1. The plurality of housing recesses 22 are arranged in a row, but not limited to this, and may be arranged in two rows, or two or more rows. The plurality of housing recesses 22 may be arranged in a matrix, may be arranged in a staggered manner, or may be arranged randomly.

The housing recess 22 is configured to be able to house a plurality of electronic components 1. When the external dimensions of the electronic component 1 are 1.0mm × 0.5mm × 0.5mm, 2000 or more electronic components 1, for example, approximately 6000 electronic components 1 can be stored in 1 storage recess 22. When the external dimensions of the electronic component 1 are 0.4mm × 0.2mm × 0.2mm, approximately 100000 electronic components 1 can be accommodated in 1 accommodation recess 22.

The housing recess 22 is provided to be open toward one side. The housing recess 22 is provided so as to open toward the front face 21a side of the flat plate portion 21. The depth dimension in the depth direction (AR1 direction) of the housing recess 22 is larger than the thickness of the flat plate portion 21. The depth of the housing recess 22 is, for example, about 12 mm.

The housing recess 22 includes a bottom 221 and a peripheral wall 222, and an opening 223 is formed at a position facing the bottom 221. The bottom portion 221 is disposed substantially parallel to the flat plate portion 21. The peripheral wall portion 222 is erected from the peripheral edge of the bottom portion 221. An opening 223 is provided on an end side of the peripheral wall 222 connected to the flat plate portion 21.

The housing recess 22 is made of resin, and the surface resistivity of the inner surface of the housing recess 22 is preferably 0 Ω/□ or more and 1E09 Ω/□ or less, for example. This can prevent the electronic component 1 from being attached to the inner surface of the housing recess 22 by static electricity.

The opening 223 has a shape that does not include a side portion extending in a direction orthogonal to a relative sliding direction (AR2 direction in fig. 4) of the lid 40 described later in a plan view. That is, the opening 223 has the following shape: the outer edge of the sheet does not include a linear side portion extending in a direction orthogonal to the longitudinal direction. Specifically, the opening 223 has a substantially circular shape with a diameter of, for example, about 20mm in a plan view.

The opening 223 may have an elliptical shape in a plan view, or may have a polygonal shape not including a linear side portion extending in a direction orthogonal to the sliding direction of the lid 40. For example, the opening 223 may have a rhombic shape in which a pair of vertexes is arranged in the longitudinal direction (DR1 direction) and another pair of vertexes is arranged in the lateral direction (DR2 direction) in a plan view.

With such a shape of the opening 223, when the lid 40 is slid with respect to the body 20, the bonding area of the lid 30 to the body 20 in the portion around the opening 223 gradually changes along the peeling direction. This prevents the cover sheet 30 from being damaged by a large force instantaneously acting on the joint 33 when the cover sheet 30 is peeled off, or prevents the cover sheet 30 from being peeled off.

The bulge portion 23 is provided at the opening end of the opening portion 223. The raised portion 23 is provided in the main body portion 20 located around the housing recess 22. The raised portion 23 is raised toward the side opposite to the depth direction of the housing recess 22.

The bulge portion 23 is provided so as to surround the opening portion 223. The raised portion 23 has substantially the same shape as the peripheral edge portion of the predetermined opening 223 in a plan view. The opening edge of the housing recess 22 adjacent to the opening 223 has a curved portion. The raised portion 23 has a curved portion that curves in the depth direction of the storage recess 22 toward the bottom 221 of the storage recess 22 on the opening 223 side. The curvature radius R of the curved portion is preferably 0.1mm or more and 0.7mm or less. By having such a bent portion, when the plurality of electronic components 1 are taken out from the housing recess 22, the plurality of electronic components 1 can be prevented from being caught by the bump 23.

The height of the ridge 23 is 0.5mm to 1.2 mm. By providing the height of the raised portion 23 as described above, the electronic component 1 and the like can be prevented from being sandwiched between the cover portion 40 and the flat plate portion 21. The width of the ridge portion 23 is about 1mm to 2 mm. By setting the width of the raised portion 23 as described above, the force required to peel the cover plate 30 from the raised portion 23 can be reduced. This can suppress deformation of the lid portion 40 and the body portion 20, and can stably peel off the lid plate 30 from the raised portion 23.

The cover plate 30 has a band shape. The length of the lid plate 30 is longer than the length of the lid 40 in the longitudinal direction (direction DR 2). Preferably, the length of the cover 30 is more than twice the length of the body 20.

The cover 30 is windingly held by the lid 40. Specifically, the lid plate 30 is wound around the lid 40 around an axis having the short side direction (direction DR 2) as a winding axis. Thus, the cover 30 includes a portion 31 on the front surface 40a side of the cover 40 and a portion 32 on the back surface 40b side of the cover 40.

One end 30a and the other end 30b of the cover 30 are connected by an adhesive tape 50. The one end 30a of the cover 30 is an end of the cover 30 extending from one end side (left side in fig. 3) of the cover 40 toward the other end side (right side in fig. 3) of the cover 40 on the front surface 40a side of the cover 40. The other end 30b of the cover plate is an end of the cover plate 30 extending from the other end side (right side in fig. 3) of the cover 40 toward one end side (left side in fig. 3) of the cover 40 on the front surface 40a side of the cover 40. The cover 30 is connected in a state where one end 30a side and the other end 30b side overlap each other.

As described later, the cover sheet 30 is joined to each of the plurality of ridges 23 and then wound around the cover 40. Thereafter, both ends of the cap plate 30 are connected. The connection method is not limited to the above connection using the adhesive tape, as long as both ends of the cover 30 are connected.

The cover 30 is wound around the lid 40 so as to surround the lid 40 in conjunction with the relative sliding movement of the lid 40. When the lid 40 is relatively slid and moved in the sliding direction (AR2 direction in fig. 4), the lid 30 rotates around the lid 40 as shown in the DR3 direction in fig. 4.

The cover 30 is provided to cover the plurality of openings 223. The cover 30 has a joint 33, and the joint 33 is joined to at least a part of the main body 20 located around each of the plurality of openings 223. The cover 30 is detachably engaged with at least a part of the main body 20.

The cover 30 is preferably peeled off when a force of 0.05N or more and 5.00N or less is applied to the joint 33.

The cover 30 is made of, for example, a heat-weldable material, and is joined to each of the plurality of ridges 23 by heat welding. When the electronic component 1 is taken out from the housing recess 22, the adhesion of the cover 30 and the bump 23 in the joint 33 is preferably low in order to suppress the adhesion of the electronic component 1 to the peeled portion of the cover 30.

The cover plate 30 may be joined to each of the plurality of raised portions 23 by an adhesive. The cover 30 is preferably transparent, but may not be.

When the electronic component string 100 is manufactured by sealing the plurality of electronic components 1 in the housing recess 22 using the cover 30, the cover 30 is joined to the main body 20. When the cover plate 30 is joined to the plurality of raised portions 23, after the plurality of electronic components 1 are housed in one housing recess 22, the cover plate 30 is joined to the raised portion 23 of the portion corresponding to the one housing recess 22, and then, after the plurality of electronic components 1 are housed in the housing recess 22 located adjacent thereto, the cover plate 30 is joined to the raised portion 23 of the portion corresponding to the housing recess 22, and the above-described operation is repeated in order from one side in the longitudinal direction to the other side. Note that, after the plurality of electronic components 1 are stored in the plurality of storage recesses 22, respectively, and the plurality of storage recesses 22 are covered with the cover plate 30, the cover plate 30 may be joined to the plurality of ridges 23 by thermal fusion. When the plurality of housing recesses 22 are covered with the cover 30, the cover 30 is disposed on the body 20 along the longitudinal direction so that the cover 30 extends from both ends in the longitudinal direction. Next, the cover plate 30 is cut to a predetermined length. The predetermined length is a length that enables the cover 30 to be wound around the lid 40. Next, the lid portion 40 is disposed so as to sandwich the lid plate 30 positioned on the body portion 20 with the body portion 20. Next, as described above, the cover plate 30 of the portion extending from both ends of the body portion 20 is wound around the lid portion 40, and both ends of the cover plate 30 are joined to each other. In this way, the plurality of electronic components 1 are sealed in the plurality of housing recesses 22, and the electronic component string 1 is manufactured.

As a material constituting the cover 30, for example, polyethylene terephthalate, polycarbonate, acrylic, vinyl chloride, or the like can be used. In addition, the cover plate 30 may be coated with a metal.

The surface resistivity of the lid plate 30 is preferably 1E 11. omega./□ or less. This can prevent the electronic component 1 from being attached to the surface of the lid plate 30 by static electricity.

The lid portion 40 is disposed so as to sandwich a part of the lid plate 30 with the body portion 20 (more specifically, the ridge portion 23). The surface of the lid 40 facing the body 20 is not connected to the lid 30. Here, the term "unconnected" means unfixed and unjoined.

The cover 40 includes a plate-shaped portion 41 and a guide portion 42. The plate-like portion 41 extends in the longitudinal direction (DR1 direction). The plate portion 41 is provided substantially parallel to the flat plate portion 21. The cover plate 30 is wound around the plate-like portion 41.

The guide portions 42 are provided at both ends of the plate-like portion 41 in the short side direction (direction DR 2).

The guide portion 42 guides the sliding movement of the cover portion 40 while preventing the cover portion 40 from falling off the body portion 20. Specifically, the guide portion 42 is disposed at the end of the flat plate portion 21 with a gap therebetween so that the flat plate portion 21 is positioned between a portion facing the front surface 21a of the flat plate portion 21 and a portion facing the rear surface 21b of the flat plate portion 21.

The shape of the guide portion 42 may be appropriately changed as long as the lid portion 40 is slidable with respect to the body portion 20.

As a material constituting the lid portion 40, resin can be used. The resin member may be transparent or opaque. When the cover 40 and the cover 30 are transparent, it can be visually confirmed that the plurality of electronic components 1 are accommodated in the accommodation recess 22.

The length of the lid portion 40 is longer than the length of the body portion 20 in the longitudinal direction. The length of the lid 40 in the longitudinal direction is equal to or less than half the length of the cover 30.

Fig. 4 is a diagram showing a state in which the lid portion of the electronic component string according to the embodiment is slid with respect to the main body portion. Fig. 5 is a sectional view showing a state where the electronic component is taken out from the electronic component string of the embodiment. Note that, although fig. 4 illustrates the electronic component string 100 in a state where the opening 223 of the storage recess 22 is directed upward for convenience, when the electronic component 1 is taken out, the lid 40 is slid with respect to the main body 20 in a state where the electronic component string 100 is disposed in a state where the opening 223 of the storage recess 22 is directed downward, as illustrated in fig. 5. With reference to fig. 4 and 5, a case where the electronic component 1 is taken out from the electronic component string 100 according to the embodiment will be described.

As shown in fig. 4 and 5, in order to take out the plurality of electronic components 1 stored in the storage recess 22, the lid portion 40 is slid in the sliding direction (AR2 direction) with respect to the main body portion 20. Specifically, the lid 40 is fixed by a fixing device (not shown), and the main body 20 is slid and moved in a direction opposite to the AR2 direction (AR3 direction). The main body 20 is moved by a predetermined amount by a conveying device (not shown). The conveying device may be a conveyor type in which the main body 20 is placed and moved, or may be configured to move by gripping the main body 20.

When the lid portion 40 is relatively moved in the sliding direction (AR2 direction), first, a peeling force acts on the joint portion 33 located on the rear side in the relative sliding direction of the lid portion 40. Further, the lid 40 slides relatively, so that the lid 30 is gradually peeled off along the relative sliding direction of the lid 40.

At this time, as shown in the direction DR3, the lid plate 30 rotates around the lid 40 in conjunction with the relative sliding movement of the lid 40. Specifically, the cover is rotated about the winding shaft so that the portion 32 located on the back surface 40b side of the cover 40 moves toward the front surface 40a side of the cover 40 on the rear side in the relative sliding direction of the cover 40, and the portion 31 located on the front surface 40a side of the cover 40 moves toward the back surface 40b side of the cover 40 on the front side in the relative sliding direction of the cover 40.

When focusing attention on one storage recess 22, the cover 30 is peeled from the periphery of the opening 223 (the raised portion 23) from one end side toward the other end side in the relative sliding direction of the lid 40, thereby opening the storage recess 22. By opening the housing recess 22, the plurality of electronic components 1 drop downward from the opening 223 and are supplied to the supply destination.

At this time, the inner circumferential surface of the housing recess 22 is formed smoothly without a groove or the like. This can prevent the plurality of electronic components 1 from being caught on the inner peripheral surface of the storage recess 22, and can smoothly take out the plurality of electronic components 1 from the electronic component storage container 10.

The lid 40 is relatively slid in the AR2 direction from the one end 20a side toward the other end 20b side of the body 20, and the lid 30 is peeled from the ridge portion 23 from the one end 20a side toward the other end 20b side of the body 20, thereby opening the storage recesses 22 in order. Thereby, the plurality of electronic components 1 are sequentially taken out from the opened housing recess 22. The relative sliding movement of the lid 40 may be performed continuously or intermittently.

As described above, in the electronic component storage container 10 and the electronic component string 100 according to the present embodiment, the plurality of electronic components 1 can be smoothly taken out.

Further, since the surface of the lid portion 40 facing the body portion 20 is not joined to the lid plate 30, the lid portion 40 can be smoothly moved when the lid portion 40 is slid with respect to the body portion 20. Further, the cover plate 30 can be moved relative to the lid portion 40, and the cover plate 30 can be easily peeled off from the main body portion 20.

Further, by configuring such that the lid portion 40 holds the lid plate 30 and the lid portion 40 can be slid with respect to the main body portion 20, the storage recess 22 can be automatically opened using the fixing device and the conveying device. This enables the plurality of electronic components 1 to be automatically supplied to the supply destination.

Further, by configuring to hold the lid plate 30 by the lid portion 40 and to be able to slide the lid portion 40 relative to the main body portion 20 in the direction parallel to the opening surface 224, deformation of the lid portion 40 and the main body portion 20 can be suppressed when the lid plate 30 is peeled off.

(other first embodiment)

In the above-described embodiment, the case where the cover plate 30 is wound around the cover 40 to hold the cover plate 30 on the cover 40 has been described as an example, but the structure and the peeling method of the cover plate are not limited to this.

Fig. 6 is a cross-sectional view of an electronic component string according to another embodiment. As shown in fig. 6, the cover 30 may be held by the cover 40 by engaging the end 30b of the cover 30 located on the rear side of the relative sliding direction of the cover 40 with the cover 40. For example, the end 30b of the cover 30 is joined to the front surface 40a of the cover 40 while bypassing the end of the cover 40 on the rear side in the relative sliding direction of the cover 40, that is, the other end of the cover 40. The cover sheet has one end 30a not wound around the lid 40, but is positioned between the lid 40 and the body 20 on the side of the other end 20b of the body 20. The surface of the lid 40 facing the body 20 is not joined to the lid plate 30.

Fig. 7 is a cross-sectional view showing a state where an electronic component is taken out from the electronic component string according to the other first embodiment. Even in the case of the configuration as in the first embodiment, as shown in fig. 7, when the lid portion 40 is slid with respect to the main body portion 20, the lid plate 30 is peeled off along the relative sliding direction from the joint portion located on the rear side in the relative sliding direction (AR2 direction in fig. 7) of the lid portion 40.

(other second embodiment)

Fig. 8 is a sectional view of an electronic component string according to another second embodiment. As shown in fig. 8, the end portion 30b side of the lid plate 30 is joined to the main body portion 20 in a state where the lid portion 40 is wound. The cover plate 30 can be held as such. The end 30b of the cover 30 is joined to, for example, the end on the front side in the relative sliding direction of the lid 40, that is, the other end 20b side of the body 20. The one end 30a of the cover 30 is not wound around the lid 40, but is positioned between the lid 40 and the body 20 on the side of the other end 20b of the body 20. The surface of the lid 40 facing the body 20 is not joined to the lid plate 30.

Fig. 9 is a cross-sectional view showing a state where an electronic component is taken out from the electronic component string according to the other second embodiment. Even in the case of the configuration as in the second embodiment, as shown in fig. 9, when the lid portion 40 is slid with respect to the main body portion 20, the lid plate 30 is peeled off along the relative sliding direction from the joint portion located on the rear side in the relative sliding direction (AR2 direction in fig. 7) of the lid portion 40.

(other modification example)

In the above embodiment, the case where the lid portion 40 is fixed and the main body portion 20 is slidably moved has been described as an example, but the present invention is not limited to this, and the main body portion 20 may be fixed and the lid portion 40 may be slidably moved. When the lid 40 is fixed and the main body 20 is slid, the plurality of electronic components 1 can be stably supplied to the supply target portion without moving the installation position of the supply target portion.

In the above embodiment, the case where the main body portion 20 is configured to include the plurality of housing concave portions 22 has been described as an example, but the present invention is not limited thereto, and a single housing concave portion 22 may be configured.

In the above embodiment, the case where the storage recess 22 is configured to be able to store a plurality of electronic components 1 has been described as an example, but the present invention is not limited thereto, and a single electronic component 1 may be configured to be able to be stored.

In the above embodiment, the case where the raised portion 23 is provided in the portion of the main body portion 20 located around the opening 223 has been described as an example, but the present invention is not limited thereto, and the raised portion 23 may not be provided. In this case, the inner peripheral surface of the housing recess 22 defining the opening 223 has a curved portion that curves in the depth direction of the housing recess 22 toward the bottom 221 of the housing recess 22 at the opening edge. The curvature radius of the curved portion is preferably 0.1mm or more and 0.7mm or less.

In the above embodiment, the case where the guide portion 42 is provided in the cover portion 40 has been described as an example, but the present invention is not limited thereto, and may be provided in the body portion 20. In this case, the lid portion 40 is formed in a flat plate shape, and guide portions are formed on both ends of the flat plate portion 21 in the short-side direction of the main body portion 20. The guide portion is configured to be bent from the back surface 40b of the cover 40 to the front surface 40a of the cover 40 across the end surface of the cover 40.

The embodiments and modifications of the present invention are illustrative in all respects, and not restrictive. The scope of the present invention is indicated by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Description of reference numerals:

1 electronic component, 10 electronic component storage container, 20 main body part, 20a end, 21 flat plate part, 21a front surface, 21b back surface, 22 storage concave part, 23 raised part, 30 cover plate, 30a end, 30b other end, 33 joint part, 40 cover part, 40a front surface, 40b back surface, 41 plate part, 42 guide part, 50 adhesive tape, 100 electronic component string, 221 bottom part, 222 peripheral wall part, 223 opening part, 224 opening surface.

Claims

1. An electronic component storage container is provided with:

a main body portion having one or more housing recesses that house electronic components and are open to one side, and extending in a longitudinal direction;

a cover portion that covers an opening portion of the housing recess; and

a cover plate sandwiched between the main body portion and the lid portion,

a surface of the lid portion facing the body portion is not joined to the lid plate.

2. The electronic component accommodation container according to claim 1,

the main body portion has a plurality of the housing recesses.

3. The electronic component accommodation container according to claim 1 or 2,

the main body, the cover plate, and the lid have a rectangular shape in a plan view.

4. The electronic component accommodation container according to any one of claims 1 to 3,

the cover sheet is wound around the cover section so as to surround the periphery of the cover section.

5. The electronic component accommodation container according to any one of claims 1 to 4,

the cover plate has an engaging portion engaged with the main body portion,

the joint includes a thermal weld.

6. The electronic component accommodation container according to any one of claims 1 to 5,

the lid section is provided so as to be movable relative to the main body section along the longitudinal direction,

at least one of the lid and the body is provided with a guide portion for guiding relative movement of the lid in the longitudinal direction.

7. The electronic component accommodation container according to any one of claims 1 to 6,

the opening has the following shape in a plan view: the shape of the outer edge of the opening does not include a linear side portion extending in a direction orthogonal to the longitudinal direction.

8. The electronic component accommodation container according to any one of claims 1 to 7,

the body portion has a raised portion raised toward a side opposite to the depth direction of the housing recess in a portion located around the opening.

9. The electronic component accommodation container according to any one of claims 1 to 8,

an opening edge portion of the housing recess adjacent to the opening portion has a bent portion,

the curvature radius of the curved portion is 0.1mm to 0.7 mm.

10. The electronic component accommodation container according to any one of claims 1 to 9,

the receiving recess is made of resin,

the surface resistivity of the inner surface of the housing recess is 1E9 Ω/mouth or less.

11. The electronic component accommodation container according to any one of claims 1 to 10,

the surface resistivity of the cover plate is below 1E11 omega/port.

12. An electronic component string is provided with:

the electronic component accommodation container of any one of claims 1 to 11; and

the electronic component is accommodated in the accommodating recess.

13. The electronic component string of claim 12,

the housing recess houses a plurality of the electronic components.

14. The electronic component string of claim 13,

the main body portion has a plurality of the receiving recesses,

the plurality of housing recesses are configured to be capable of housing the plurality of electronic components,

2000 or more electronic components are accommodated in each of the plurality of accommodating recesses.