TW201919964A - Electronic component storage container and serial electronic components - Google Patents

Electronic component storage container and serial electronic components Download PDF

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Publication number
TW201919964A
TW201919964A TW107134152A TW107134152A TW201919964A TW 201919964 A TW201919964 A TW 201919964A TW 107134152 A TW107134152 A TW 107134152A TW 107134152 A TW107134152 A TW 107134152A TW 201919964 A TW201919964 A TW 201919964A
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Taiwan
Prior art keywords
electronic component
cover
storage container
cover sheet
body portion
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TW107134152A
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Chinese (zh)
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TWI681913B (en
Inventor
中川聖之
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日商村田製作所股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D75/367Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00Lids or covers for rigid or semi-rigid containers
    • B65D43/02Removable lids or covers
    • B65D43/12Removable lids or covers guided for removal by sliding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D2075/361Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed the two sheets or blanks being mutually slidable or comprising slidable elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packages (AREA)

Abstract

This electronic component container (10) is provided with: a longitudinally extending main body section (20) having one or more storage concave parts (22) open on one side and serving to store electronic components; a lid section (40) covering the openings (223) of the storage concave parts (22); and a cover sheet (30) sandwiched between the main body section (20) and the lid section (40). The lid section (40) surface facing the main body section (20) is not joined to the cover sheet (30).

Description

電子零件收納容器及電子零件組Electronic parts storage container and electronic parts set

本發明係關於一種電子零件收納容器及電子零件組。The invention relates to an electronic component storage container and an electronic component group.

先前,業界已開發有各種設置為可收納電子零件之電子零件收納容器。 在日本特開2006-206082號公報(專利文獻1)、及日本特開2000-43977號公報(專利文獻2)中揭示有收納有複數個電子零件之電子零件收納容器。Previously, the industry has developed various electronic component storage containers that are configured to store electronic components. Japanese Patent Application Laid-Open No. 2006-206082 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2000-43977 (Patent Document 2) disclose electronic component storage containers that store a plurality of electronic components.

在日本特開2002-96892號公報(專利文獻3)、及日本特開2002-274593號公報(專利文獻4)中揭示有在收納容器收納有複數個電子零件之由硬殼體構成之電子零件收納殼體。 [先前技術文獻] [專利文獻]Japanese Unexamined Patent Publication No. 2002-96892 (Patent Document 3) and Japanese Unexamined Patent Publication No. 2002-274593 (Patent Document 4) disclose electronic parts composed of a hard case in which a plurality of electronic parts are stored in a storage container. Storage case. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2006-206082號公報 [專利文獻2]日本特開2000-43977號公報 [專利文獻3]日本特開2002-96892號公報 [專利文獻4]日本特開2002-274593號公報[Patent Document 1] JP 2006-206082 [Patent Document 2] JP 2000-43977 [Patent Document 3] JP 2002-96892 [Patent Document 4] JP 2002-274593 Bulletin

[發明所欲解決之問題][Problems to be solved by the invention]

然而,在專利文獻1及專利文獻2所揭示之電子零件收納容器中,必須作業者將收納袋開封而自開封部取出複數個電子零件,而難以自動地將收納袋開封。又,有當所收納之電子零件為小型時,電子零件鉤絆於開封部之邊緣而無法取出電子零件之情形。However, in the electronic component storage container disclosed in Patent Documents 1 and 2, it is necessary for an operator to open the storage bag and take out a plurality of electronic components from the unsealing portion, and it is difficult to automatically open the storage bag. In addition, when the electronic parts to be stored are small, the electronic parts may catch on the edge of the unsealed portion and the electronic parts cannot be taken out.

在專利文獻3及專利文獻4所揭示之電子零件收納容器中設置有用於開閉收納容器之開口部之滑動式閘門,在規定開口部之收納容器之內周面設置有用於供閘門移動之槽部。因而,有當收納於收納容器內之複數個電子零件為小型時,電子零件鉤絆於該槽而無法取出電子零件之情形。The electronic component storage container disclosed in Patent Documents 3 and 4 is provided with a sliding gate for opening and closing the opening portion of the storage container, and a groove portion for moving the gate is provided on the inner peripheral surface of the storage container having the predetermined opening portion. . Therefore, when the plurality of electronic parts stored in the storage container are small, the electronic parts may catch on the grooves and the electronic parts cannot be taken out.

本發明係鑒於如上述之問題而完成者,本發明之目的在於提供一種可適合於自動地開封且滑順地取出電子零件的電子零件收納容器及電子零件組。 [解決問題之技術手段]The present invention has been made in view of the problems described above, and an object of the present invention is to provide an electronic component storage container and an electronic component group which are suitable for automatically opening and smoothly taking out electronic components. [Technical means to solve the problem]

基於本發明之電子零件收納容器具備:在長度方向延伸之本體部,其具有1個以上收納電子零件且朝向一側開口之收納凹部;蓋部,其覆蓋上述收納凹部之開口部;及覆蓋片,其被夾入上述本體部與上述蓋部之間。與上述蓋部之上述本體部對向之面未與上述覆蓋片接合。An electronic component storage container according to the present invention includes: a main body portion extending in a longitudinal direction, which includes one or more storage recesses that store electronic components and are opened toward one side; a cover portion that covers the opening portion of the storage recess portion; and a cover sheet , Which is sandwiched between the body portion and the cover portion. The surface facing the body portion of the cover portion is not joined to the cover sheet.

在基於上述本發明之電子零件收納容器中,上述本體部可具有複數個上述收納凹部。In the electronic component storage container according to the present invention, the body portion may include a plurality of the storage recesses.

在基於上述本發明之電子零件收納容器中,上述本體部、上述覆蓋片、及上述蓋部在俯視時可具有矩形形狀。In the electronic component storage container according to the present invention described above, the body portion, the cover sheet, and the cover portion may have a rectangular shape in a plan view.

在基於上述本發明之電子零件收納容器中,上述覆蓋片可以周繞上述蓋部之周圍之方式捲繞於上述蓋部。In the electronic component storage container according to the present invention, the cover sheet may be wound around the cover portion so as to surround the periphery of the cover portion.

在基於上述本發明之電子零件收納容器中,上述覆蓋片可利用熱熔接接合於位於上述開口部之周圍之部分之上述本體部的至少一部分。In the electronic component storage container according to the present invention described above, the cover sheet may be bonded to at least a part of the main body portion located at a portion around the opening portion by heat welding.

在基於上述本發明之電子零件收納容器中,上述蓋部可設置為可沿上述長度方向相對於上述本體部移動。此時,可在上述蓋部及上述本體部之至少一者設置導引上述蓋部沿上述長度方向相對移動之導引部。In the electronic component storage container according to the present invention, the lid portion may be provided to be movable relative to the main body portion in the length direction. At this time, a guide portion that guides the relative movement of the cover portion in the longitudinal direction may be provided in at least one of the cover portion and the body portion.

在基於上述本發明之電子零件收納容器中,上述開口部在俯視時上述開口部之外緣之形狀可具有不包含在與上述長度方向正交之方向延伸之直線狀之邊部的形狀。In the electronic component storage container according to the present invention described above, the shape of the outer edge of the opening portion when viewed in plan may have a shape that does not include a linear side portion extending in a direction orthogonal to the longitudinal direction.

在基於上述本發明之電子零件收納容器中,上述本體部可在位於上述開口部之周圍之部分具有朝向與上述收納凹部之深度方向為相反側隆起之隆起部。In the electronic component storage container according to the present invention described above, the main body portion may have a bulged portion bulging toward a side opposite to a depth direction of the storage recessed portion at a portion located around the opening portion.

在基於上述本發明之電子零件收納容器中,與上述開口部相鄰之上述收納凹部之開口緣部可具有彎曲部。此時,上述彎曲部之曲率半徑為0.1 mm以上0.7 mm以下。In the electronic component storage container according to the present invention, an opening edge portion of the storage recessed portion adjacent to the opening portion may have a bent portion. At this time, the curvature radius of the bent portion is 0.1 mm to 0.7 mm.

在基於上述本發明之電子零件收納容器中,上述收納凹部可由樹脂構成。此時,上述收納凹部之內表面之表面電阻率較佳為1E9 Ω/□以下。In the electronic component storage container according to the present invention, the storage recessed portion may be made of resin. At this time, the surface resistivity of the inner surface of the storage recess is preferably 1E9 Ω / □ or less.

在基於上述本發明之電子零件收納容器中,上述覆蓋片之表面電阻率較佳為1E11 Ω/□以下。In the electronic component storage container based on the present invention, the surface resistivity of the cover sheet is preferably 1E11 Ω / □ or less.

基於本發明之電子零件組具備上述電子零件收納容器、及收納於上述收納凹部之上述電子零件。An electronic component set according to the present invention includes the electronic component storage container and the electronic component stored in the storage recess.

在基於上述本發明之電子零件組中,上述收納凹部可收納複數個上述電子零件。In the electronic component group based on the present invention, the storage recessed portion can store a plurality of the electronic components.

基於上述本發明之電子零件組可構成為上述本體部可具有複數個上述收納凹部,上述收納凹部可收納複數個上述電子零件。此時,可在複數個上述收納凹部各者收納2000個以上之上述電子零件。又,可收納6000個以上之上述電子零件。 [發明之效果]The electronic component group according to the present invention may be configured such that the main body portion may include a plurality of the storage recesses, and the storage recess may store a plurality of the electronic components. At this time, more than 2,000 of the above-mentioned electronic components can be stored in each of the plurality of the storage recesses. In addition, 6000 or more of the above-mentioned electronic components can be stored. [Effect of the invention]

根據本發明可提供一種可適合於自動地開封且滑順地取出電子零件的電子零件收納容器及電子零件組。According to the present invention, it is possible to provide an electronic component storage container and an electronic component group suitable for automatically unsealing and smoothly taking out electronic components.

以下,針對本發明之實施形態,參照圖詳細地說明。此外,在以下所示之實施形態中,針對同一或共通之部分在圖中賦予同一符號,且不重複其說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments shown below, the same or common parts are given the same reference numerals in the drawings, and descriptions thereof will not be repeated.

(實施形態1) 參照圖1至圖3,針對實施形態之電子零件組100進行說明。(Embodiment 1) An electronic component group 100 according to an embodiment will be described with reference to Figs. 1 to 3.

如圖1至圖3所示,實施形態1之電子零件組100具備複數個電子零件1(參照圖2)、及電子零件收納容器10。電子零件組100如後述般構成為藉由使蓋部40相對於本體部20相對地滑動移動而可取出收納於收納凹部22之電子零件1。As shown in FIGS. 1 to 3, the electronic component group 100 according to the first embodiment includes a plurality of electronic components 1 (see FIG. 2) and an electronic component storage container 10. As described later, the electronic component group 100 is configured so that the electronic component 1 stored in the storage recess 22 can be taken out by slidingly moving the cover portion 40 relative to the main body portion 20.

電子零件1係例如積層陶瓷電容器。電子零件1之外形之長度方向之尺寸、寬度方向之尺寸、及厚度方向之尺寸例如為1.0 mm×0.5 mm×0.5 mm、0.4 mm×0.2 mm×0.2 mm、或0.2 mm×0.1 mm×0.1 mm。The electronic component 1 is, for example, a multilayer ceramic capacitor. The dimensions of the external shape of the electronic component 1 in the length direction, the width direction, and the thickness direction are, for example, 1.0 mm × 0.5 mm × 0.5 mm, 0.4 mm × 0.2 mm × 0.2 mm, or 0.2 mm × 0.1 mm × 0.1 mm .

電子零件收納容器10具備本體部20、覆蓋片30、及蓋部40。電子零件收納容器10例如具有長度方向(DR1方向)、及寬度方向(DR2方向),且形成為長條狀。此外,長度方向與後述之滑動方向平行。在俯視時,本體部20、覆蓋片30、及蓋部40具有矩形形狀。The electronic component storage container 10 includes a main body portion 20, a cover sheet 30, and a lid portion 40. The electronic component storage container 10 has, for example, a longitudinal direction (DR1 direction) and a width direction (DR2 direction), and is formed in a long shape. The longitudinal direction is parallel to a sliding direction described later. The body portion 20, the cover sheet 30, and the cover portion 40 have a rectangular shape in a plan view.

本體部20設置為在上述長度方向延伸。本體部20包含平板部21、複數個收納凹部22、及複數個隆起部23。本體部20例如藉由加工片材構件而構成。作為片材構件之材料可採用揉入碳或導電塗料等之導電材料之聚苯乙烯、及聚對苯二甲酸乙二酯等。片材構件之厚度例如為0.5 mm左右。The main body portion 20 is provided so as to extend in the longitudinal direction. The main body portion 20 includes a flat plate portion 21, a plurality of storage recessed portions 22, and a plurality of raised portions 23. The main body portion 20 is configured by processing a sheet member, for example. As the material of the sheet member, polystyrene, which is a conductive material such as carbon or a conductive coating material, and polyethylene terephthalate can be used. The thickness of the sheet member is, for example, about 0.5 mm.

平板部21具有正面21a及背面21b。平板部21設置為大致平行於後述之收納凹部22之開口面224。The flat plate portion 21 includes a front surface 21a and a rear surface 21b. The flat plate portion 21 is provided substantially parallel to the opening surface 224 of the storage recessed portion 22 described later.

複數個收納凹部22沿上述長度方向DR1方向排列配置。複數個收納凹部22排列配置為一行,但並不限定於此,可以兩行配置,亦可以兩行以上配置。又,複數個收納凹部22可呈行列狀配置,亦可呈錯位狀配置,或可隨機地配置。The plurality of accommodating recesses 22 are arranged in line along the above-mentioned longitudinal direction DR1. The plurality of accommodating recesses 22 are arranged in a row, but it is not limited to this, and may be arranged in two rows or in two or more rows. In addition, the plurality of storage recesses 22 may be arranged in a matrix, may be arranged in an offset manner, or may be arranged randomly.

收納凹部22構成為可收納複數個電子零件1。若電子零件1之外形尺寸為1.0 mm×0.5 mm×0.5 mm,可在1個收納凹部22收納2000個以上之電子零件1,例如可收納大約6000個電子零件1。若電子零件1之外形尺寸為0.4 mm×0.2 mm×0.2 mm,可在1個收納凹部22收納大約100000個電子零件1。The storage recessed portion 22 is configured to be able to store a plurality of electronic components 1. If the external dimension of the electronic component 1 is 1.0 mm × 0.5 mm × 0.5 mm, more than 2000 electronic components 1 can be stored in one storage recess 22, for example, about 6000 electronic components 1 can be stored. If the external dimension of the electronic component 1 is 0.4 mm × 0.2 mm × 0.2 mm, about 100,000 electronic components 1 can be stored in one storage recess 22.

收納凹部22設置為朝向一側開口。收納凹部22設置為朝向平板部21之正面21a側開口。收納凹部22之深度方向(AR1方向)之深度尺寸大於平板部21之厚度。收納凹部22之深度尺寸為例如12 mm左右。The storage recess 22 is provided so as to open toward one side. The storage recessed portion 22 is provided to open toward the front surface 21 a side of the flat plate portion 21. The depth dimension of the accommodating recessed portion 22 (AR1 direction) is larger than the thickness of the flat plate portion 21. The depth dimension of the storage recess 22 is, for example, about 12 mm.

收納凹部22具備底部221及周壁部222,在與底部221對向之位置形成有開口部223。底部221設置為與平板部21大致平行。周壁部222係自底部221之周緣豎立設置。在連接於平板部21之周壁部222之端部側設置有開口部223。The storage recessed portion 22 includes a bottom portion 221 and a peripheral wall portion 222, and an opening portion 223 is formed at a position facing the bottom portion 221. The bottom portion 221 is provided substantially parallel to the flat plate portion 21. The peripheral wall portion 222 is erected from the peripheral edge of the bottom portion 221. An opening portion 223 is provided on an end portion side of the peripheral wall portion 222 connected to the flat plate portion 21.

收納凹部22係由樹脂構成,收納凹部22之內表面之表面電阻率例如較佳為0 Ω/□以上1E09 Ω/□以下。藉此,可抑制電子零件1因靜電而附著於收納凹部22之內表面。The storage recessed portion 22 is made of resin, and the surface resistivity of the inner surface of the storage recessed portion 22 is preferably 0 Ω / □ or more and 1E09 Ω / □ or less, for example. Thereby, the electronic component 1 can be prevented from adhering to the inner surface of the storage recessed portion 22 due to static electricity.

開口部223具有在俯視時不包含朝與後述之蓋部40之相對滑動方向(圖4中AR2方向)正交之方向延伸之邊部的形狀。亦即,開口部223具有其外緣之形狀不包含朝與上述長度方向正交之方向延伸之直線狀之邊部的形狀。具體而言,開口部223在俯視時例如具有直徑20 mm左右之大致圓形形狀。The opening portion 223 has a shape that does not include a side portion extending in a direction orthogonal to a relative sliding direction (AR2 direction in FIG. 4) of a cover portion 40 described later in a plan view. That is, the shape of the outer edge of the opening portion 223 does not include a straight side portion extending in a direction orthogonal to the longitudinal direction. Specifically, the opening 223 has a substantially circular shape with a diameter of, for example, about 20 mm in plan view.

此外,開口部223在俯視時可具有橢圓形狀,亦可具有不包含朝與蓋部40之相對性滑動方向正交之方向延伸之直線狀之邊部的多角形形狀。例如,開口部223在俯視時可具有在長度方向(DR1方向)配置有一對頂點、在寬度方向(DR2方向)配置有另一對頂點的菱形形狀。In addition, the opening portion 223 may have an elliptical shape in a plan view, or may have a polygonal shape that does not include a linear side portion extending in a direction orthogonal to the relative sliding direction of the cover portion 40. For example, the opening portion 223 may have a rhombus shape in which a pair of vertexes are arranged in the longitudinal direction (DR1 direction) and another pair of vertexes are arranged in the width direction (DR2 direction) in a plan view.

藉由開口部223具有此種形狀,而當使蓋部40相對於本體部20相對地滑動移動之情形時,覆蓋片30與位於開口部223之周圍之部分之本體部20的接合面積沿剝離方向緩和地變化。藉此,可防止當剝離覆蓋片30時較大之力瞬間作用於接合部33,使得覆蓋片30破裂或者覆蓋片30無法剝離。Since the opening portion 223 has such a shape, when the cover portion 40 is relatively moved relative to the main body portion 20, the joint area between the cover sheet 30 and the main body portion 20 located around the opening portion 223 is peeled off. The direction changes gently. Thereby, when the cover sheet 30 is peeled off, a large force can be prevented from acting on the joint portion 33 instantly, so that the cover sheet 30 is broken or the cover sheet 30 cannot be peeled off.

隆起部23設置於開口部223之開口端。隆起部23可設置於位於收納凹部22之周圍之部分之本體部20。隆起部23朝向與收納凹部22之深度方向為相反側隆起。The raised portion 23 is provided at an open end of the opening portion 223. The raised portion 23 may be provided on the main body portion 20 located in a portion around the storage recessed portion 22. The bulged portion 23 bulges on the side opposite to the depth direction of the storage recessed portion 22.

隆起部23設置為包圍開口部223。隆起部23在俯視時具有與規定開口部223之周緣部大致同樣之形狀。與開口部223相鄰之收納凹部22之開口緣部具有彎曲部。隆起部23在開口部223側具有以隨著朝向收納凹部22之底部221而沿收納凹部22之深度方向之方式彎曲之彎曲部。該彎曲部之曲率半徑R較佳為0.1 mm以上0.7 mm以下。藉由具有此種彎曲部,而可防止當自收納凹部22取出複數個電子零件1時,複數個電子零件1鉤絆於隆起部23。The raised portion 23 is provided to surround the opening portion 223. The bulged portion 23 has a shape substantially the same as the peripheral portion of the predetermined opening portion 223 in a plan view. An opening edge portion of the storage recessed portion 22 adjacent to the opening portion 223 has a curved portion. The bulging portion 23 has a bent portion on the side of the opening portion 223 so as to be curved in the depth direction of the receiving recessed portion 22 as it goes toward the bottom portion 221 of the receiving recessed portion 22. The curvature radius R of the bent portion is preferably 0.1 mm or more and 0.7 mm or less. By having such a curved portion, it is possible to prevent the plurality of electronic components 1 from catching on the raised portion 23 when the plurality of electronic components 1 are taken out from the storage recessed portion 22.

隆起部23之高度為0.5 mm以上1.2 mm以下。藉由將隆起部23之高度如上述般設定,而可抑制電子零件1等被夾入蓋部40與平板部21之間。又,隆起部23之寬度為1 mm以上2 mm以下程度。藉由將隆起部23設定為上述之寬度,而可減小自隆起部23剝離覆蓋片30時所需之力。藉此,可抑制蓋部40及本體部20變形,而可自隆起部23穩定地剝離覆蓋片30。The height of the raised portion 23 is 0.5 mm or more and 1.2 mm or less. By setting the height of the raised portion 23 as described above, the electronic component 1 and the like can be prevented from being caught between the cover portion 40 and the flat plate portion 21. The width of the raised portion 23 is approximately 1 mm to 2 mm. By setting the raised portion 23 to the width described above, the force required when peeling the cover sheet 30 from the raised portion 23 can be reduced. Thereby, deformation of the cover portion 40 and the main body portion 20 can be suppressed, and the cover sheet 30 can be stably peeled from the raised portion 23.

覆蓋片30具有帶狀形狀。在長度方向(DR2方向),覆蓋片30之長度長於蓋部40之長度。較佳的是,覆蓋片30之長度為本體部20之長度之2倍以上。The cover sheet 30 has a band shape. In the length direction (DR2 direction), the length of the cover sheet 30 is longer than the length of the cover portion 40. Preferably, the length of the cover sheet 30 is more than twice the length of the main body portion 20.

覆蓋片30捲繞於蓋部40而被保持。具體而言,覆蓋片30以寬度方向(DR2方向)為捲繞軸而軸繞於蓋部40。藉此,覆蓋片30包含位於蓋部40之正面40a側之部分31、及位於蓋部40之背面40b側之部分32。The cover sheet 30 is wound around the cover portion 40 and held. Specifically, the cover sheet 30 is wound around the cover portion 40 with the width direction (DR2 direction) as a winding axis. Accordingly, the cover sheet 30 includes a portion 31 on the front surface 40 a side of the cover portion 40 and a portion 32 on the back surface 40 b side of the cover portion 40.

覆蓋片30之一端30a與另一端30b係由接著膠帶50連接。此外,覆蓋片30之一端30a係在蓋部40之正面40a側自蓋部40之一端側(圖3中左側)朝向蓋部40之另一端側(圖3中右側)延伸的覆蓋片30之端部。覆蓋片之另一端30b係在蓋部40之正面40a側自蓋部40之另一端側(圖3中右側)朝向蓋部40之一端側(圖3中左側)延伸的覆蓋片30之端部。覆蓋片30之一端30a側與另一端30b側在重合之狀態下連接。One end 30 a and the other end 30 b of the cover sheet 30 are connected by an adhesive tape 50. In addition, one end 30a of the cover sheet 30 is on the front surface 40a side of the cover part 40 and extends from one end side (left side in FIG. 3) of the cover part 40 toward the other end side (right side in FIG. 3) of the cover part 40. Ends. The other end 30b of the cover sheet is the end of the cover sheet 30 extending from the other end side (right side in FIG. 3) of the cover part 40 toward the one end side (left side in FIG. 3) of the cover part 40 on the front surface 40a side of the cover part 40 . One end 30a side and the other end 30b side of the cover sheet 30 are connected in a state where they overlap.

覆蓋片30係如後述般在接合於複數個隆起部23各者後捲繞於蓋部40。之後,覆蓋片30之兩端被連接。只要覆蓋片30之兩端被連接,則其連接方法不限定於如上述之接著膠帶之連接。The cover sheet 30 is wound around the cover portion 40 after being joined to each of the plurality of raised portions 23 as described later. After that, both ends of the cover sheet 30 are connected. As long as the two ends of the cover sheet 30 are connected, the connection method is not limited to the connection by adhesive tape as described above.

覆蓋片30以與蓋部40之相對性滑動移動連動而周繞蓋部40之周圍之方式捲繞於蓋部40。覆蓋片30當蓋部40沿滑動方向(圖4中AR2方向)相對地滑動移動時如圖4中DR3方向所示般繞蓋部40旋轉。The cover sheet 30 is wound around the cover part 40 so as to surround the cover part 40 in association with the relative sliding movement of the cover part 40. The cover sheet 30 rotates around the cover portion 40 as shown in the direction of DR3 in FIG. 4 when the cover portion 40 slides relatively in the sliding direction (AR2 direction in FIG. 4).

覆蓋片30設置為覆蓋複數個開口部223。覆蓋片30具有接合部33,該接合部33接合於位於複數個開口部223各者之周圍之部分之本體部20的至少一部分。覆蓋片30可剝離地接合於上述本體部20之至少一部分。The cover sheet 30 is provided so as to cover the plurality of openings 223. The cover sheet 30 has a joint portion 33 that is joined to at least a part of the main body portion 20 located in a portion around each of the plurality of opening portions 223. The cover sheet 30 is releasably joined to at least a part of the body portion 20.

覆蓋片30較佳為當使0.05 N以上5.00 N以下之力作用於接合部33時被剝離。The cover sheet 30 is preferably peeled when a force of 0.05 N or more and 5.00 N or less is applied to the joint portion 33.

覆蓋片30例如由熱熔接性之材料構成,藉由熱熔接而接合於複數個隆起部23各者。當自收納凹部22取出電子零件1時,為了抑制電子零件1附著於覆蓋片30之剝離後之部分,而較佳為接合部33之覆蓋片30及隆起部23之黏著性為小。The cover sheet 30 is made of, for example, a heat-weldable material, and is joined to each of the plurality of raised portions 23 by heat-welding. When the electronic component 1 is taken out from the accommodating recessed portion 22, in order to suppress the peeled portion of the electronic component 1 from adhering to the cover sheet 30, it is preferable that the adhesiveness of the cover sheet 30 and the raised portion 23 of the joint portion 33 be small.

此外,覆蓋片30亦可藉由接著劑而接合於複數個隆起部23各者。覆蓋片30較佳者為透明,但亦可為不透明。The cover sheet 30 may be bonded to each of the plurality of raised portions 23 by an adhesive. The cover sheet 30 is preferably transparent, but may be opaque.

當使用覆蓋片30將複數個電子零件1密封在收納凹部22內而製造電子零件組100時,將覆蓋片30接合於本體部20。在將覆蓋片30接合於複數個隆起部23時,自長度方向之一側至另一側依次重複進行下述操作,即:在將複數個電子零件1收納於一個收納凹部22後,將覆蓋片30接合於與該一個收納凹部22對應之部分之隆起部23,其次在將複數個電子零件1收納於位於其隔壁之收納凹部22後,將覆蓋片30接合於與該收納凹部22對應之部分之隆起部23。此外,亦可在將複數個電子零件1收納於複數個收納凹部22各者,以覆蓋片30覆蓋複數個收納凹部22後,將覆蓋片30熱熔接而接合於複數個隆起部23。在以覆蓋片30覆蓋複數個收納凹部22時,以覆蓋片30自長度方向之兩端露出之方式將覆蓋片30沿長度方向配置於本體部20上。其次,將覆蓋片30切斷成特定之長度。特定之長度為可由覆蓋片30捲繞蓋部40之長度。繼而,以與本體部20夾入位於本體部20上之覆蓋片30之方式配置蓋部40。其次,如上述般,將自本體部20之兩端露出之部分之覆蓋片30捲繞於蓋部40,且將覆蓋片30之兩端彼此接合。如此,將複數個電子零件1密封在複數個收納凹部22內,而製造電子零件組1。When a plurality of electronic components 1 are sealed in the accommodating recessed portion 22 using the cover sheet 30 to manufacture the electronic component group 100, the cover sheet 30 is bonded to the body portion 20. When the cover sheet 30 is joined to the plurality of raised portions 23, the following operation is repeated in sequence from one side to the other in the longitudinal direction, that is, after the plurality of electronic components 1 are stored in one storage recess 22, the cover is covered. The sheet 30 is joined to the raised portion 23 of a portion corresponding to the one receiving recessed portion 22, and then the plurality of electronic components 1 are stored in the receiving recessed portion 22 located next to the receiving portion 22, and then the cover sheet 30 is joined to the corresponding receiving recessed portion 22. Part of the raised portion 23. In addition, after the plurality of electronic components 1 are stored in each of the plurality of storage recesses 22, the plurality of storage recesses 22 are covered with the cover sheet 30, and then the cover sheet 30 is thermally fused to be bonded to the plurality of raised portions 23. When the plurality of storage recesses 22 are covered with the cover sheet 30, the cover sheet 30 is arranged on the body portion 20 along the length direction so that the cover sheet 30 is exposed from both ends in the length direction. Next, the cover sheet 30 is cut to a specific length. The specific length is the length by which the cover portion 40 can be wound around the cover sheet 30. Then, the cover part 40 is arrange | positioned so that the cover sheet 30 located in the main-body part 20 may be sandwiched with the main-body part 20. Next, as described above, the cover sheet 30 that is exposed from both ends of the main body portion 20 is wound around the cover portion 40, and both ends of the cover sheet 30 are joined to each other. In this way, the plurality of electronic components 1 are sealed in the plurality of accommodating recesses 22 to manufacture the electronic component group 1.

作為構成覆蓋片30之材料,例如可採用聚對苯二甲酸乙二酯、聚碳酸酯、丙烯酸、及氯乙烯等。又,亦可對覆蓋片30施以金屬塗層。Examples of the material constituting the cover sheet 30 include polyethylene terephthalate, polycarbonate, acrylic, and vinyl chloride. A metal coating may be applied to the cover sheet 30.

覆蓋片30之表面電阻率較佳為1E11 Ω/□以下。藉此,可抑制電子零件1因靜電而附著於覆蓋片30之表面。The surface resistivity of the cover sheet 30 is preferably 1E11 Ω / □ or less. Thereby, the electronic component 1 can be prevented from adhering to the surface of the cover sheet 30 due to static electricity.

蓋部40係以在與本體部20(更特定而言係隆起部23)之間夾入覆蓋片30之一部分之方式配置。蓋部40之與本體部20對向之面與覆蓋片30不相連。此外,所謂不相連意味著未被固定、接合。The cover part 40 is arrange | positioned so that one part of the cover sheet 30 may be sandwiched with the main-body part 20 (more specifically, the bulge part 23). The surface of the cover portion 40 facing the body portion 20 is not connected to the cover sheet 30. The term "disconnected" means that it is not fixed or joined.

蓋部40包含板狀部41、及導引部42。板狀部41沿長度方向(DR1方向)延伸。板狀部41設置為與平板部21大致平行。在板狀部41捲繞有覆蓋片30。The cover portion 40 includes a plate-like portion 41 and a guide portion 42. The plate-like portion 41 extends in the longitudinal direction (DR1 direction). The plate-like portion 41 is provided substantially parallel to the flat plate portion 21. A cover sheet 30 is wound around the plate-like portion 41.

導引部42設置於寬度方向(DR2方向)之板狀部41之兩端。The guide portions 42 are provided at both ends of the plate-like portion 41 in the width direction (DR2 direction).

導引部42防止蓋部40自本體部20脫落,並導引蓋部40之滑動移動。具體而言,導引部42以平板部21位於與平板部21之正面21a對向之部分和與平板部21之背面21b對向之部分之間之方式隔開間隙地配置於平板部21之端部。The guide portion 42 prevents the cover portion 40 from falling off from the body portion 20 and guides the sliding movement of the cover portion 40. Specifically, the guide portion 42 is disposed on the flat plate portion 21 with a gap so that the flat plate portion 21 is located between a portion facing the front surface 21 a of the flat plate portion 21 and a portion facing the back surface 21 b of the flat plate portion 21. Ends.

此外,導引部42之形狀只要蓋部40可相對於本體部20相對地滑動移動便可適宜地變更。In addition, the shape of the guide portion 42 can be appropriately changed as long as the cover portion 40 can slide relative to the main body portion 20.

作為構成蓋部40之材料可採用樹脂。樹脂構件可為透明,亦可不透明。在將蓋部40及覆蓋片30設為透明之情形下,可以目視等確認在收納凹部22內收納有複數個電子零件1。A resin may be used as a material constituting the cover portion 40. The resin member may be transparent or opaque. When the cover part 40 and the cover sheet 30 are made transparent, it can be visually confirmed that the plurality of electronic components 1 are stored in the storage recess 22.

在長度方向,蓋部40之長度長於本體部20之長度。在長度方向,蓋部40之長度為覆蓋片30之長度之一半以下。In the length direction, the length of the cover portion 40 is longer than the length of the body portion 20. In the longitudinal direction, the length of the cover portion 40 is equal to or less than a half of the length of the cover sheet 30.

圖4係顯示使實施形態之電子零件組之蓋部相對於本體部相對地滑動移動之樣態之圖。圖5係顯示自實施形態之電子零件組取出電子零件之樣態之剖視圖。此外,在圖4中為了便於說明而圖示以收納凹部22之開口部223朝向上方之方式配置電子零件組100之狀態,但當取出電子零件1時,係如圖5所示般在以收納凹部22之開口部223朝向下方之方式配置電子零件組100之狀態下,使蓋部40相對於本體部20相對地滑動移動。參照圖4及圖5說明自實施形態之電子零件組100取出電子零件1之樣態。FIG. 4 is a diagram showing a state in which a cover portion of the electronic component group according to the embodiment is relatively moved relative to the main body portion. FIG. 5 is a cross-sectional view showing a state in which electronic components are taken out from the electronic component group of the embodiment. In addition, FIG. 4 illustrates a state in which the electronic component group 100 is arranged with the opening 223 of the storage recess 22 facing upward for convenience of explanation. However, when the electronic component 1 is taken out, the electronic component group 100 is stored in the storage state as shown in FIG. 5. In a state where the electronic component group 100 is arranged with the opening portion 223 of the recessed portion 22 facing downward, the cover portion 40 is relatively slidably moved relative to the main body portion 20. With reference to FIGS. 4 and 5, a description will be given of a state in which the electronic component 1 is taken out from the electronic component group 100 according to the embodiment.

如圖4及圖5所示,為了取出收納於收納凹部22之複數個電子零件1,而使蓋部40相對於本體部20沿滑動方向(AR2方向)相對地滑動移動。具體而言,利用固定裝置(未圖示)將蓋部40固定並使本體部20朝與AR2方向為相反方向(AR3方向)滑動移動。本體部20由搬送裝置(未圖示)移動特定量。搬送裝置可為如載置本體部20並使其移動之輸送機式,亦可為如固持本體部20並使其移動之構成。As shown in FIGS. 4 and 5, in order to take out the plurality of electronic components 1 stored in the storage recessed portion 22, the cover portion 40 is relatively moved in the sliding direction (AR2 direction) relative to the main body portion 20. Specifically, the cover portion 40 is fixed by a fixing device (not shown), and the body portion 20 is slid and moved in a direction opposite to the AR2 direction (AR3 direction). The main body portion 20 is moved by a specific amount by a transport device (not shown). The conveying device may be a conveyor type such as placing and moving the main body portion 20, or may be a structure such as holding and moving the main body portion 20.

當蓋部40沿滑動方向(AR2方向)相對地移動時,首先,剝離力作用於位於蓋部40之相對性滑動方向之後方側的接合部33。進而,藉由蓋部40相對地滑動移動,而覆蓋片30沿蓋部40之相對性滑動方向逐漸剝離。When the cover portion 40 is relatively moved in the sliding direction (AR2 direction), first, the peeling force acts on the engaging portion 33 located on the side behind the relative sliding direction of the cover portion 40. Furthermore, when the cover portion 40 slides relative to each other, the cover sheet 30 gradually peels off along the relative sliding direction of the cover portion 40.

此時,覆蓋片30與蓋部40之相對性滑動移動連動而如DR3方向所示般繞蓋部40旋轉。具體而言,以下述之方式繞上述捲繞軸旋轉,即:在蓋部40之相對性滑動方向之後方側,位於蓋部40之背面40b側之部分32朝蓋部40之正面40a側移動,在蓋部40之相對性滑動方向之前方側,位於蓋部40之正面40a側之部分31以朝蓋部40之背面40b側移動。At this time, the relative sliding movement of the cover sheet 30 and the cover portion 40 rotates around the cover portion 40 as shown in the DR3 direction. Specifically, it is rotated around the winding axis in such a manner that the portion 32 located on the back surface 40 b side of the cover portion 40 moves toward the front surface 40 a side of the cover portion 40 behind the relative sliding direction of the cover portion 40. The part 31 located on the front surface 40 a side of the cover part 40 is moved to the front surface 40 a side of the cover part 40 before the relative sliding direction of the cover part 40.

當著眼於一個收納凹部22時,藉由自蓋部40之相對性滑動方向之一端側直至另一端側自開口部223之周圍(隆起部23)剝離覆蓋片30,而將收納凹部22開封。藉由將收納凹部22開封,而複數個電子零件1自開口部223朝向下方落下而朝被供給部被供給。When focusing on one storage recess 22, the cover sheet 30 is peeled off from one end side of the relative sliding direction of the cover part 40 to the other end side from around the opening part 223 (the bulge part 23), and the storage recess part 22 is unsealed. When the storage recessed portion 22 is unsealed, the plurality of electronic components 1 fall downward from the opening portion 223 and are supplied to the supplied portion.

此時,收納凹部22之內周面不具有槽部等而平滑地形成。藉此,可抑制複數個電子零件1鉤絆於收納凹部22之內周面,而可自電子零件收納容器10滑順地取出複數個電子零件1。At this time, the inner peripheral surface of the storage recessed portion 22 is smoothly formed without a groove or the like. Thereby, the plurality of electronic components 1 can be prevented from being caught on the inner peripheral surface of the storage recess 22, and the plurality of electronic components 1 can be smoothly taken out from the electronic component storage container 10.

藉由蓋部40自本體部20之一端20a側朝向另一端20b側朝AR2方向相對地滑動移動,而自本體部20之一端20a側朝向另一端20b側自隆起部23逐漸剝離覆蓋片30,從而將收納凹部22依次開封。藉此,複數個電子零件1自經開封之收納凹部22被依次取出。此外,蓋部40之相對性滑動移動可連續地進行,亦可斷續地進行。The cover portion 40 slides relative to the AR2 direction from one end 20a side to the other end 20b side of the main body portion 20, and gradually peels the cover sheet 30 from the raised portion 23 from the one end 20a side to the other end 20b side of the main body portion 20. Thus, the storage recesses 22 are sequentially opened. Thereby, the plurality of electronic components 1 are sequentially taken out from the unsealed receiving recess 22. In addition, the relative sliding movement of the cover portion 40 may be performed continuously or intermittently.

如以上般,在本實施形態之電子零件收納容器10及電子零件組100中可滑順地取出複數個電子零件1。As described above, in the electronic component storage container 10 and the electronic component group 100 of this embodiment, a plurality of electronic components 1 can be smoothly taken out.

又,由於蓋部40之與本體部20對向之面未與覆蓋片30接合,故當使蓋部40相對於本體部20相對地滑動移動時,可使蓋部40滑順地移動。再者,覆蓋片30亦可相對於蓋部40移動,而可容易地進行覆蓋片30自本體部20之剝離。In addition, since the surface of the cover portion 40 facing the main body portion 20 is not engaged with the cover sheet 30, the cover portion 40 can be smoothly moved when the cover portion 40 is slid and moved relative to the main body portion 20. In addition, the cover sheet 30 can be moved relative to the cover portion 40, and the cover sheet 30 can be easily peeled from the main body portion 20.

又,藉由構成為利用蓋部40保持覆蓋片30,並使蓋部40可相對於本體部20相對地滑動移動,而可使用上述固定裝置及上述搬送裝置自動地進行收納凹部22之開封。藉此,可自動地對被供給部供給複數個電子零件1。Further, by holding the cover sheet 30 by the cover portion 40 and allowing the cover portion 40 to slide relative to the main body portion 20, the storage recess 22 can be unsealed automatically using the fixing device and the conveying device. Thereby, a plurality of electronic components 1 can be automatically supplied to the supplied part.

又,藉由構成為利用蓋部40保持覆蓋片30,並沿平行於開口面224之方向使蓋部40可相對於本體部20相對地滑動移動,而可在覆蓋片30之剝離時抑制蓋部40及本體部20變形。In addition, the cover portion 30 is held by the cover portion 40, and the cover portion 40 is slidably moved relative to the main body portion 20 in a direction parallel to the opening surface 224, thereby suppressing the cover when the cover sheet 30 is peeled off The portion 40 and the body portion 20 are deformed.

(其他第1實施形態) 此外,在上述之實施形態中例示藉由將覆蓋片30捲繞於蓋部40而覆蓋片30被保持於蓋部40之情形而進行了說明,但覆蓋片之構成及剝離方法並不限定於此。(Other 1st Embodiment) Moreover, although the said embodiment demonstrated the case where the cover sheet 30 was wound by the cover part 40, and the cover sheet 30 was hold | maintained at the cover part 40, the structure of the cover sheet was demonstrated. And the peeling method is not limited to this.

圖6係另一實施形態之電子零件組之剖視圖。如圖6所示,藉由位於蓋部40之相對性滑動方向之後方側的覆蓋片30之端部30b被接合於蓋部40,而覆蓋片30可被保持於蓋部40。例如,覆蓋片30之上述端部30b係以迂回繞入蓋部40之相對性滑動方向之後方側之端部亦即蓋部40之另一端之方式接合於蓋部40之正面40a。覆蓋片之一端30a未捲繞於蓋部40,而是在本體部20之另一端20b側位於蓋部40與本體部20之間。蓋部40之與本體部20對向之面未與覆蓋片30接合。FIG. 6 is a cross-sectional view of an electronic component set according to another embodiment. As shown in FIG. 6, the end portion 30 b of the cover sheet 30 located behind the relative sliding direction of the cover portion 40 is joined to the cover portion 40, and the cover sheet 30 can be held on the cover portion 40. For example, the above-mentioned end portion 30 b of the cover sheet 30 is joined to the front surface 40 a of the cover portion 40 in such a manner that the end portion on the other side of the cover portion 40, which is the other end of the cover portion 40, is detoured into the relative sliding direction. One end 30 a of the cover sheet is not wound around the cover portion 40, but is located between the cover portion 40 and the body portion 20 on the other end 20 b side of the body portion 20. The surface of the cover portion 40 facing the body portion 20 is not joined to the cover sheet 30.

圖7係顯示自其他第1實施形態之電子零件組取出電子零件之樣態之剖視圖。在如上述其他第1實施形態般構成之情形下亦然,如圖7所示般,當使蓋部40相對於本體部20相對地滑動移動時,覆蓋片30自位於蓋部40之相對性滑動方向(圖7中AR2方向)之後方側之接合部沿該相對性滑動方向被剝離。FIG. 7 is a cross-sectional view showing a state in which electronic components are taken out from an electronic component group of another first embodiment. The same applies to the case of the structure of the other first embodiment described above. As shown in FIG. 7, when the cover portion 40 is relatively moved relative to the body portion 20, the cover sheet 30 is positioned relative to the cover portion 40. The joint on the rear side in the sliding direction (AR2 direction in FIG. 7) is peeled off along the relative sliding direction.

(其他第2實施形態) 圖8係其他第2實施形態之電子零件組之剖視圖。如圖8所示般,覆蓋片30之端部30b側以捲繞蓋部40之狀態接合於本體部20。如此可保持覆蓋片30。覆蓋片30之端部30b例如接合於蓋部40之相對性滑動方向之前方側之端部、亦即本體部20之另一端20b側。覆蓋片30之一端30a未捲繞於蓋部40,而是在本體部20之另一端20b側位於蓋部40與本體部20之間。蓋部40之與本體部20對向之面未與覆蓋片30接合。(Other Second Embodiment) FIG. 8 is a cross-sectional view of an electronic component group according to another second embodiment. As shown in FIG. 8, the end portion 30 b side of the cover sheet 30 is joined to the main body portion 20 in a state where the cover portion 40 is wound. This keeps the cover sheet 30. The end portion 30 b of the cover sheet 30 is joined to, for example, the end portion on the side on the front side of the relative sliding direction of the cover portion 40, that is, the other end 20 b side of the main body portion 20. One end 30 a of the cover sheet 30 is not wound around the cover portion 40, but is located between the cover portion 40 and the body portion 20 on the other end 20 b side of the body portion 20. The surface of the cover portion 40 facing the body portion 20 is not joined to the cover sheet 30.

圖9係顯示自其他第2實施形態之電子零件組取出電子零件之樣態之剖視圖。在如上述其他第2實施形態般構成之情形下亦然,如圖9所示般,當使蓋部40相對於本體部20相對地滑動移動時,覆蓋片30自位於蓋部40之相對性滑動方向(圖7中AR2方向)之後方側之接合部沿該相對性滑動方向被剝離。FIG. 9 is a cross-sectional view showing a state in which electronic components are taken out from an electronic component group of another second embodiment. The same applies to the case of the structure of the other second embodiment described above. As shown in FIG. 9, when the cover portion 40 is relatively moved relative to the body portion 20, the cover sheet 30 is positioned relative to the cover portion 40. The joint on the rear side in the sliding direction (AR2 direction in FIG. 7) is peeled off along the relative sliding direction.

(其他之變化例) 在上述之實施形態中例示將蓋部40固定而使本體部20滑動移動之情形進行了說明,但並不限定於此,可將本體部20固定而使蓋部40滑動移動。此外,在將蓋部40固定而使本體部20滑動移動之情形下,可在使被供給部之設置位置不移動下穩定地對被供給部供給複數個電子零件1。(Other Modifications) In the embodiment described above, the case where the cover portion 40 is fixed and the main body portion 20 is slid is described, but it is not limited to this. The main body portion 20 may be fixed and the cover portion 40 may be slid mobile. In addition, when the cover portion 40 is fixed and the main body portion 20 is slid, the plurality of electronic components 1 can be stably supplied to the supplied portion without moving the installation position of the supplied portion.

在上述之實施形態中例示本體部20構成為包含複數個收納凹部22之情形進行了說明,但並不限定於此,可構成為包含單數個收納凹部22。In the embodiment described above, the case where the main body portion 20 is configured to include a plurality of storage recessed portions 22 has been described, but it is not limited thereto, and may be configured to include a single storage recessed portion 22.

在上述之實施形態中例示收納凹部22構成為可收納複數個電子零件1之情形進行了說明,但並不限定於此,可構成為可收納單數個電子零件1。In the embodiment described above, the case where the storage recessed portion 22 is configured to accommodate a plurality of electronic components 1 has been described, but it is not limited to this, and may be configured to accommodate a single electronic component 1.

在上述之實施形態中例示在本體部20中在位於開口部223之周圍之部分設置有隆起部23之情形進行了說明,但並不限定於此,可不設置隆起部23。此時,規定開口部223之收納凹部22之內周面在開口緣部具有以隨著朝向收納凹部22之底部221而沿收納凹部22之深度方向之方式彎曲之彎曲部。該彎曲部之曲率半徑較佳為0.1 mm以上0.7 mm以下。In the above-mentioned embodiment, the case where the raised portion 23 is provided in the portion located around the opening portion 223 in the main body portion 20 has been described, but it is not limited thereto, and the raised portion 23 may not be provided. At this time, the inner peripheral surface of the storage recessed portion 22 defining the opening portion 223 has a bent portion that is bent in the depth direction of the storage recessed portion 22 toward the bottom portion 221 of the storage recessed portion 22 at the opening edge portion. The curvature radius of the curved portion is preferably 0.1 mm or more and 0.7 mm or less.

在上述之實施形態中例示導引部42設置於蓋部40之情形進行了說明,但並不限定於此,可設置於本體部20。此時,蓋部40構成為平板狀,在本體部20之平板部21之寬度方向之兩端側形成有導引部。該導引部構成為跨於蓋部40之端面自蓋部40之背面40b彎折至蓋部40之正面40a。Although the case where the guide part 42 is provided in the cover part 40 was demonstrated in the said embodiment, it is not limited to this, It can be provided in the main-body part 20. At this time, the cover portion 40 is configured in a flat plate shape, and guide portions are formed on both end sides in the width direction of the flat plate portion 21 of the main body portion 20. The guide portion is configured to bend from the back surface 40 b of the cover portion 40 to the front surface 40 a of the cover portion 40 across the end surface of the cover portion 40.

以上,此次所發明之實施形態及變化例在所有方面均是例示,並非是限定性者。本發明之範圍係由申請專利範圍表示,並包含與申請專利範圍均等之含義及範圍內之所有變更。In the foregoing, the embodiments and modifications of the invention have been illustrated in all respects, and are not intended to be limiting. The scope of the present invention is expressed by the scope of patent application, and includes all changes within the meaning and scope equivalent to the scope of patent application.

1‧‧‧電子零件1‧‧‧Electronic parts

10‧‧‧電子零件收納容器10‧‧‧Electronic parts storage container

20‧‧‧本體部20‧‧‧Body

20a‧‧‧一端20a‧‧‧One end

20b‧‧‧另一端20b‧‧‧ the other end

21‧‧‧平板部21‧‧‧ Flat Department

21a‧‧‧正面21a‧‧‧front

21b‧‧‧背面21b‧‧‧Back

22‧‧‧收納凹部22‧‧‧Storage recess

23‧‧‧隆起部23‧‧‧ bulge

30‧‧‧覆蓋片30‧‧‧ Overlay

30a‧‧‧一端30a‧‧‧one end

30b‧‧‧另一端/端部30b‧‧‧ other end / end

31‧‧‧部分31‧‧‧part

32‧‧‧部分Section 32‧‧‧

33‧‧‧接合部33‧‧‧Joint

40‧‧‧蓋部40‧‧‧ cover

40a‧‧‧正面40a‧‧‧front

40b‧‧‧背面40b‧‧‧Back

41‧‧‧板狀部41‧‧‧ Plate

42‧‧‧導引部42‧‧‧Guide

50‧‧‧接著膠帶50‧‧‧ Adhesive tape

100‧‧‧電子零件組100‧‧‧Electronic parts group

221‧‧‧底部221‧‧‧ bottom

222‧‧‧周壁部222‧‧‧Zhou Bibei

223‧‧‧開口部223‧‧‧ opening

224‧‧‧開口面224‧‧‧ open face

AR1‧‧‧方向AR1‧‧‧direction

AR2‧‧‧方向AR2‧‧‧direction

AR3‧‧‧方向AR3‧‧‧ direction

DR1‧‧‧長度方向/方向DR1‧‧‧length direction / direction

DR2‧‧‧寬度方向/方向DR2‧‧‧Width direction / direction

DR3‧‧‧方向DR3‧‧‧ direction

R‧‧‧曲率半徑R‧‧‧ radius of curvature

II-II‧‧‧線Line II-II‧‧‧

III-III‧‧‧線III-III‧‧‧line

圖1係顯示實施形態之電子零件組之圖。 圖2係沿圖1所示之II-II線之剖視圖。 圖3係沿圖1所示之III-III線之剖視圖。 圖4係顯示使實施形態之電子零件組之蓋部相對於本體部相對地滑動移動之樣態之立體圖。 圖5係顯示自實施形態之電子零件組取出電子零件之樣態之剖視圖。 圖6係其他第1實施形態之電子零件組之剖視圖。 圖7係顯示自其他第1實施形態之電子零件組取出電子零件之樣態之剖視圖。 圖8係其他第2實施形態之電子零件組之剖視圖。 圖9係顯示自其他第2實施形態之電子零件組取出電子零件之樣態之剖視圖。FIG. 1 is a diagram showing an electronic component group according to the embodiment. FIG. 2 is a sectional view taken along the line II-II shown in FIG. 1. Fig. 3 is a sectional view taken along the line III-III shown in Fig. 1. FIG. 4 is a perspective view showing a state in which the cover portion of the electronic component group according to the embodiment is relatively moved relative to the main body portion. FIG. 5 is a cross-sectional view showing a state in which electronic components are taken out from the electronic component group of the embodiment. Fig. 6 is a sectional view of an electronic component set according to another first embodiment. FIG. 7 is a cross-sectional view showing a state in which electronic components are taken out from an electronic component group of another first embodiment. Fig. 8 is a sectional view of an electronic component set according to another second embodiment. FIG. 9 is a cross-sectional view showing a state in which electronic components are taken out from an electronic component group of another second embodiment.

Claims (14)

一種電子零件收納容器,其具備: 在長度方向延伸之本體部,其具有1個以上收納電子零件且朝向一側開口之收納凹部; 蓋部,其覆蓋前述收納凹部之開口部;及 覆蓋片,其被夾入前述本體部與前述蓋部之間;且 前述蓋部之與前述本體部對向之面未與前述覆蓋片接合。An electronic component storage container comprising: a main body portion extending in a longitudinal direction, which has one or more storage recesses that store electronic components and are open toward one side; a cover portion that covers the opening portion of the storage recess portion; and a cover sheet, It is sandwiched between the body portion and the cover portion; and a surface of the cover portion facing the body portion is not engaged with the cover sheet. 如請求項1之電子零件收納容器,其中前述本體部具有複數個前述收納凹部。The electronic component storage container according to claim 1, wherein the main body portion has a plurality of the storage recesses. 如請求項1或2之電子零件收納容器,其中前述本體部、前述覆蓋片、及前述蓋部在俯視時具有矩形形狀。The electronic component storage container according to claim 1 or 2, wherein the body portion, the cover sheet, and the cover portion have a rectangular shape in a plan view. 如請求項1或2之電子零件收納容器,其中前述覆蓋片以周繞前述蓋部之周圍之方式捲繞於前述蓋部。The electronic component storage container according to claim 1 or 2, wherein the cover sheet is wound around the cover portion so as to surround the periphery of the cover portion. 如請求項1或2之電子零件收納容器,其中前述覆蓋片具有接合於前述本體部之接合部;且 前述接合部包含熱熔接部。The electronic component storage container according to claim 1 or 2, wherein the cover sheet has a joint portion that is joined to the main body portion; and the joint portion includes a heat-welded portion. 如請求項1或2之電子零件收納容器,其中前述蓋部設置為可沿前述長度方向相對於前述本體部移動; 在前述蓋部及前述本體部之至少一者設置有導引前述蓋部沿前述長度方向相對移動之導引部。The electronic component storage container according to claim 1 or 2, wherein the cover portion is provided to be movable relative to the body portion in the length direction; at least one of the cover portion and the body portion is provided to guide the cover portion along The guide part for relative movement in the longitudinal direction. 如請求項1或2之電子零件收納容器,其中前述開口部具有在俯視時前述開口部之外緣之形狀不包含沿與前述長度方向正交之方向延伸之直線狀之邊部的形狀。The electronic component storage container according to claim 1 or 2, wherein the shape of the outer edge of the opening portion in plan view does not include a shape of a straight edge portion extending in a direction orthogonal to the longitudinal direction. 如請求項1或2之電子零件收納容器,其中前述本體部在位於前述開口部之周圍之部分具有朝向與前述收納凹部之深度方向為相反側隆起之隆起部。The electronic component storage container according to claim 1 or 2, wherein the main body portion has a bulged portion bulging toward a side opposite to a depth direction of the storage recessed portion at a portion located around the opening portion. 如請求項1或2之電子零件收納容器,其中與前述開口部相鄰之前述收納凹部之開口緣部具有彎曲部;且 前述彎曲部之曲率半徑為0.1 mm以上0.7 mm以下。The electronic component storage container according to claim 1 or 2, wherein the opening edge of the storage recess adjacent to the opening has a curved portion; and the curvature radius of the curved portion is 0.1 mm or more and 0.7 mm or less. 如請求項1或2之電子零件收納容器,其中前述收納凹部係由樹脂構成;且 前述收納凹部之內表面之表面電阻率為1E9 Ω/□以下。The electronic component storage container according to claim 1 or 2, wherein the storage recess is made of resin; and the surface resistivity of the inner surface of the storage recess is 1E9 Ω / □ or less. 如請求項1或2之電子零件收納容器,其中前述覆蓋片之表面電阻率為1E11 Ω/□以下。For example, the electronic component storage container of claim 1 or 2, wherein the surface resistivity of the aforementioned cover sheet is 1E11 Ω / □ or less. 一種電子零件組,其具備:如請求項1或2之電子零件收納容器;及 收納於前述收納凹部之前述電子零件。An electronic component group includes: an electronic component storage container according to claim 1 or 2; and the electronic component stored in the storage recess. 如請求項12之電子零件組,其中前述收納凹部收納有複數個前述電子零件。The electronic component group according to claim 12, wherein the storage recessed portion stores a plurality of the electronic components. 如請求項13之電子零件組,其中前述本體部具有複數個前述收納凹部;且 複數個前述收納凹部構成為可收納複數個前述電子零件; 在複數個前述收納凹部各者中收納有2000個以上之前述電子零件。For example, the electronic component set of claim 13, wherein the main body portion has a plurality of the aforementioned storage recesses; and the plurality of the aforementioned storage recesses are configured to accommodate the plurality of the aforementioned electronic parts; and each of the plurality of the aforementioned storage recesses contains more than 2000 The aforementioned electronic parts.
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