TW201840457A - Carrier tape for electronic components - Google Patents
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- TW201840457A TW201840457A TW107106463A TW107106463A TW201840457A TW 201840457 A TW201840457 A TW 201840457A TW 107106463 A TW107106463 A TW 107106463A TW 107106463 A TW107106463 A TW 107106463A TW 201840457 A TW201840457 A TW 201840457A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
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Abstract
Description
本揭露大致上關於可用於電子組件封裝應用之載帶。 This disclosure relates generally to carrier tapes that can be used in electronic component packaging applications.
隨著電子設備小型化,電子組件之儲存、處理、及運送變得更加重要。一般而言,電子組件係在一載帶中經運送至一裝配位置,該載帶具有形成於其中之複數個凹穴以固持電子組件。該載帶可由覆蓋帶或膜覆蓋。載帶常常是在熱成型操作或壓紋操作中製造,在該操作中一熱塑性聚合物之帶材(web)經傳遞至一模具,該模具於載帶中形成組件凹穴。覆蓋膜可沿著載帶邊緣連續地經熱密封以將電子組件密封於載帶凹穴內。 With the miniaturization of electronic equipment, the storage, handling, and transportation of electronic components have become more important. Generally speaking, electronic components are transported to a mounting position in a carrier tape having a plurality of recesses formed therein to hold the electronic components. The carrier tape may be covered by a cover tape or a film. Carrier tapes are often manufactured in a thermoforming operation or an embossing operation, in which a web of thermoplastic polymer is passed to a mold that forms a component cavity in the carrier tape. The cover film may be continuously heat-sealed along the edge of the carrier tape to seal the electronic component within the carrier tape cavity.
電子組件係於電子設備之裝配或分裝配期間,經安裝於稍後將用於建立電子設備的印刷電路板(PCB)或其他基材上。覆蓋膜係於此裝配程序期間自載帶移除以暴露出位於載帶凹穴內的電子組件。組件一般是由自動精密置放機自凹穴中拾起並安裝至所裝配之PCB或基材。 Electronic components are mounted on an electronic device during assembly or sub-assembly and are mounted on a printed circuit board (PCB) or other substrate that will be used later to build the electronic device. The cover film is removed from the carrier tape during this assembly process to expose the electronic components located in the recesses of the carrier tape. The components are generally picked up from the cavity by an automatic precision placement machine and installed on the assembled PCB or substrate.
根據一些實施例,一種用於運送預定之複數個組件的可撓性載帶包括沿著該載帶的一縱軸延伸的可撓性之一基材。複數個間 隔開的凹穴係沿著該載帶的該縱軸形成在可撓性之該基材中,各凹穴經組態以接收並儲存預定之一組件並包含低於該基材的一底壁。至少一通道係形成在可撓性之該基材中,並且實質上圍繞該等複數個凹穴中的一對應凹穴。該通道具有低於該凹穴之該底壁的一底壁。該通道及該凹穴界定於其等之間的一橋接件,該橋接件實質上與該至少一通道共延伸。該橋接件的一頂部表面高於該基材的一頂部表面。當該等複數個凹穴中的一第一凹穴接收並儲存預定之一組件,且對應於該至少一通道的該凹穴相對於該第一凹穴定中心並放置在該第一凹穴上,而該凹穴之該底壁面向該組件時,該通道減少該對應凹穴的該底壁與儲存在該第一凹穴中的該組件之間的接觸。 According to some embodiments, a flexible carrier tape for transporting a predetermined plurality of components includes a flexible one of the substrates extending along a longitudinal axis of the carrier tape. A plurality of spaced-apart cavities are formed in the flexible substrate along the longitudinal axis of the carrier tape, and each cavity is configured to receive and store a predetermined one of the components including A bottom wall. At least one channel is formed in the flexible substrate and substantially surrounds a corresponding one of the plurality of recesses. The channel has a bottom wall that is lower than the bottom wall of the cavity. A bridge is defined between the channel and the cavity, and the bridge extends substantially with the at least one channel. A top surface of the bridge is higher than a top surface of the substrate. When a first cavity among the plurality of cavities receives and stores a predetermined component, the cavity corresponding to the at least one channel is centered with respect to the first cavity and placed in the first cavity When the bottom wall of the cavity faces the component, the channel reduces the contact between the bottom wall of the corresponding cavity and the component stored in the first cavity.
一些實施例係關於一種用於運送預定之複數個組件的可撓性載帶。該載帶包括沿著該載帶的一縱軸延伸的可撓性之一基材。複數個間隔開的凹穴係沿著該載帶的該縱軸形成在可撓性之該基材中。各凹穴具有經組態以接收並儲存預定之一組件的一主凹穴。各凹穴具有圍繞該主凹穴的一輔凹穴。該主凹穴及該輔凹穴界定在該基材之相同側上的開口,並且藉由於其等之間界定的一橋接件彼此隔離。當該主凹穴接收並儲存預定之一組件時,該橋接件防止該組件移入該輔凹穴中。 Some embodiments relate to a flexible carrier tape for transporting a predetermined plurality of components. The carrier tape includes a flexible substrate extending along a longitudinal axis of the carrier tape. A plurality of spaced apart pockets are formed in the flexible substrate along the longitudinal axis of the carrier tape. Each pocket has a main pocket configured to receive and store a predetermined one of the components. Each pocket has a secondary pocket surrounding the main pocket. The main recess and the auxiliary recess define openings on the same side of the substrate, and are isolated from each other by a bridge defined therebetween. When the primary pocket receives and stores a predetermined one of the components, the bridge prevents the component from moving into the secondary pocket.
從下文實施方式將可容易明白本申請案之此等及其他態樣。然而,在任何情況下皆不應將上述發明內容視為對所主張之標的之限制,該標的僅由隨附申請專利範圍單獨定義。 These and other aspects of the application will be readily apparent from the following embodiments. However, under no circumstances should the above-mentioned summary be considered as a limitation on the claimed subject matter, which is defined solely by the scope of the accompanying patent application.
100‧‧‧載帶 100‧‧‧ Carrier tape
101‧‧‧組件 101‧‧‧components
101b‧‧‧組件 101b‧‧‧component
102‧‧‧縱軸 102‧‧‧Vertical axis
110‧‧‧基材 110‧‧‧ substrate
111‧‧‧頂部表面 111‧‧‧ top surface
120‧‧‧凹穴 120‧‧‧Dent
120a‧‧‧凹穴 120a‧‧‧Dent
120b‧‧‧凹穴 120b‧‧‧Dent
121‧‧‧底壁 121‧‧‧ bottom wall
122‧‧‧開口 122‧‧‧ opening
130‧‧‧通道/凹穴 130‧‧‧channel / recess
131‧‧‧底壁 131‧‧‧ bottom wall
132‧‧‧開口/頂部開口 132‧‧‧opening / top opening
140‧‧‧橋接件 140‧‧‧bridge
141‧‧‧頂部表面 141‧‧‧Top surface
142‧‧‧縱軸 142‧‧‧Vertical axis
150‧‧‧列 150‧‧‧columns
160‧‧‧覆蓋帶/載帶 160‧‧‧ Cover tape / carrier tape
180‧‧‧鏈齒孔 180‧‧‧ sprocket hole
W1‧‧‧寬度 W1‧‧‧Width
W2‧‧‧寬度 W2‧‧‧Width
圖1係根據一些實施例之可撓性載帶的透視圖;圖2係沿著可撓性載帶的縱軸所取之圖1的可撓性載帶的截面圖;圖3顯示根據一些實施例之堆疊在第二載帶上的第一載帶;圖4係根據一些實施例之載帶及覆蓋帶的透視圖;及圖5係沿著載帶的縱軸所取之圖5的載帶及覆蓋帶的截面圖。 FIG. 1 is a perspective view of a flexible carrier tape according to some embodiments; FIG. 2 is a cross-sectional view of the flexible carrier tape of FIG. 1 taken along the longitudinal axis of the flexible carrier tape; The first carrier tape of the embodiment stacked on the second carrier tape; FIG. 4 is a perspective view of a carrier tape and a cover tape according to some embodiments; and FIG. 5 is a view of the carrier tape of FIG. 5 taken along the longitudinal axis of the carrier tape Sectional view of carrier tape and cover tape.
圖式非必然按比例繪製。在圖式中所使用的類似數字指稱類似組件。但是,將明白,在給定圖式中使用元件符號指稱組件,並非意圖限制在另一圖式中具有相同元件符號之組件。 The drawings are not necessarily drawn to scale. Similar numbers used in the drawings refer to similar components. It will be understood, however, that the use of an element symbol to refer to a component in a given drawing is not intended to limit a component that has the same element symbol in another drawing.
隨著半導體及/或其他電子組件變得更小且更薄,電子組件可能會在運輸及處理期間移出載帶之凹穴,特別是透過取放機移動時。在電子組件被設置在載帶中並由覆蓋帶及/或第二載帶覆蓋的情境中,當載帶中的電子組件黏著到覆蓋帶或到第二載帶的底部時,可能有問題。本文中所述之實施例解決有關於設置在載帶中之電子組件的此等及其他挑戰。 As semiconductors and / or other electronic components become smaller and thinner, the electronic components may move out of the pockets of the carrier tape during transportation and handling, especially when moving through a pick and place machine. In the case where the electronic component is set in the carrier tape and covered by the cover tape and / or the second carrier tape, there may be a problem when the electronic component in the carrier tape is stuck to the cover tape or to the bottom of the second carrier tape. The embodiments described herein address these and other challenges related to electronic components disposed in a carrier tape.
圖1係根據一些實施例之可撓性載帶100的透視圖。圖2係沿著可撓性載帶100的縱軸102所取之可撓性載帶100的截面圖。 FIG. 1 is a perspective view of a flexible carrier tape 100 according to some embodiments. FIG. 2 is a cross-sectional view of the flexible carrier tape 100 taken along the longitudinal axis 102 of the flexible carrier tape 100.
可撓性載帶100經組態以運送預定之複數個組件101。可撓性載帶100包括沿著載帶100的縱軸102延伸的可撓性基材 110。凹穴120的一列150係形成在可撓性基材110中。該等複數個凹穴的凹穴120係沿著載帶100的縱軸102間隔開。各凹穴120可經組態以接收並儲存預定組件101。各凹穴120包括底壁121,該底壁低於基材110的頂部表面111。 The flexible carrier tape 100 is configured to carry a predetermined plurality of components 101. The flexible carrier tape 100 includes a flexible substrate 110 extending along a longitudinal axis 102 of the carrier tape 100. A row 150 of the recesses 120 is formed in the flexible substrate 110. The cavities 120 of the plurality of cavities are spaced apart along the longitudinal axis 102 of the carrier tape 100. Each pocket 120 may be configured to receive and store a predetermined component 101. Each pocket 120 includes a bottom wall 121 that is lower than the top surface 111 of the substrate 110.
至少一通道130係形成在可撓性基材110中,並且實質上圍繞對應凹穴120a。當載帶100經定向成如圖1和圖2所示時,通道130包括低於凹穴120a的底壁121之底壁131。根據一些實施例,至少一通道130包含形成於可撓性基材110中的複數個通道,各通道130實質上圍繞該等複數個凹穴中的對應凹穴120。 At least one channel 130 is formed in the flexible substrate 110 and substantially surrounds the corresponding cavity 120a. When the carrier tape 100 is oriented as shown in FIGS. 1 and 2, the channel 130 includes a bottom wall 131 that is lower than the bottom wall 121 of the recess 120 a. According to some embodiments, the at least one channel 130 includes a plurality of channels formed in the flexible substrate 110, and each channel 130 substantially surrounds the corresponding cavity 120 of the plurality of cavities.
在平行或垂直於載帶100之縱軸102的平面中之至少一通道130的截面中,通道130的開口頂部132具有寬度W1,並且通道130的底壁121具有寬度W2。根據一些實施例,W2大於W1。根據一些實施例,通道130可經如此定形狀並定尺寸以不能接收並儲存組件101。 In a cross section of at least one channel 130 in a plane parallel or perpendicular to the longitudinal axis 102 of the carrier tape 100, the open top 132 of the channel 130 has a width W1, and the bottom wall 121 of the channel 130 has a width W2. According to some embodiments, W2 is greater than W1. According to some embodiments, the channel 130 may be shaped and sized so as not to receive and store the component 101.
通道130和凹穴120界定於其等之間的橋接件140。橋接件140可與通道130部分地、實質上、或完全共延伸。根據一些實施例,至少一通道130完全圍繞對應於至少一通道130的凹穴120。在一些實施方案中,橋接件140的頂部表面141高於基材110的頂部表面111。橋接件140的頂部表面141可係實質上平坦的,或可在實質上垂直於橋接件140的縱軸142的平面中具有彎曲截面。 The channel 130 and the recess 120 define a bridge 140 therebetween. The bridge 140 may be partially, substantially, or completely coextensive with the channel 130. According to some embodiments, the at least one channel 130 completely surrounds the recess 120 corresponding to the at least one channel 130. In some embodiments, the top surface 141 of the bridge 140 is higher than the top surface 111 of the substrate 110. The top surface 141 of the bridge 140 may be substantially flat or may have a curved cross section in a plane substantially perpendicular to the longitudinal axis 142 of the bridge 140.
現參照圖1,根據一些態樣,通道130形成圍繞主凹穴120的輔凹穴。主120和輔130凹穴界定在基材110之相同側上的開 口122、132。主120和輔130凹穴係藉由界定於其等之間的橋接件140彼此分離或隔離。現參照圖2的截面圖,當主凹穴120a接收並儲存預定組件101時,橋接件140防止組件101移入輔凹穴130中。 Referring now to FIG. 1, according to some aspects, the channel 130 forms a secondary cavity surrounding the primary cavity 120. The main 120 and auxiliary 130 pockets define openings 122, 132 on the same side of the substrate 110. The main 120 and auxiliary 130 pockets are separated or isolated from each other by a bridge 140 defined between them. Referring now to the cross-sectional view of FIG. 2, when the main cavity 120 a receives and stores the predetermined component 101, the bridge 140 prevents the component 101 from moving into the auxiliary cavity 130.
圖3顯示堆疊在第二載帶上的第一載帶,使得s凹穴120a相對於凹穴120b定中心並放置在凹穴120b上。參照圖3,當複數個凹穴120中的第一凹穴120b接收並儲存預定組件101b,且對應於至少一通道130之第二凹穴120a相對於第一凹穴120b定中心並放置在該第一凹穴上,而第二凹穴120a之底壁121面向組件101b時,對應於第二凹穴120a的通道130減少凹穴120a的底壁121與儲存在第一凹穴120b中的組件101b之間的接觸。 FIG. 3 shows a first carrier tape stacked on a second carrier tape such that the s-cavities 120a are centered with respect to the cavities 120b and placed on the cavities 120b. Referring to FIG. 3, when the first cavity 120b of the plurality of cavities 120 receives and stores the predetermined component 101b, the second cavity 120a corresponding to at least one channel 130 is centered with respect to the first cavity 120b and placed in the same. When the bottom wall 121 of the second cavity 120a faces the component 101b on the first cavity, the channel 130 corresponding to the second cavity 120a reduces the bottom wall 121 of the cavity 120a and the component stored in the first cavity 120b Contact between 101b.
再次參照圖3,根據一些實施例,當複數個凹穴120中的第一凹穴120b接收並儲存預定組件101b,且對應於至少一通道130的凹穴120a相對於第一凹穴120b定中心並放置在該第一凹穴上,而凹穴120a之底壁121面向組件101時,通道130防止對應凹穴120a的底壁121與儲存在第一凹穴120b中的組件101b之間的任何接觸。 Referring again to FIG. 3, according to some embodiments, when the first recess 120b of the plurality of recesses 120 receives and stores the predetermined component 101b, and the recess 120a corresponding to the at least one channel 130 is centered relative to the first recess 120b When the bottom wall 121 of the cavity 120a faces the component 101, the channel 130 prevents any between the bottom wall 121 of the corresponding cavity 120a and the component 101b stored in the first cavity 120b. contact.
複數個凹穴120可經如此定形狀並定尺寸,使得當複數個凹穴120中的第一凹穴120b接收並儲存預定組件101b,且複數個凹穴120中的第二凹穴120a相對於第一凹穴120b定中心並放置在該第一凹穴上,而第二凹穴120a之底壁121面向組件101b時,第二凹穴120a的通道130減少第二凹穴120a之底壁121與儲存在第一凹穴120b中的組件101b之間的接觸或防止其等之間的任何接觸。 The plurality of recesses 120 may be shaped and dimensioned such that when the first recess 120b of the plurality of recesses 120 receives and stores the predetermined component 101b, and the second recess 120a of the plurality of recesses 120 is opposite to When the first cavity 120b is centered and placed on the first cavity, and the bottom wall 121 of the second cavity 120a faces the component 101b, the channel 130 of the second cavity 120a reduces the bottom wall 121 of the second cavity 120a Contact with the component 101b stored in the first recess 120b or prevent any contact therebetween.
圖4及圖5繪示其中載帶100與覆蓋帶160使用的實施例。圖4係載帶100及覆蓋帶160的透視圖。圖5係沿著載帶100的縱軸102所取之載帶100及覆蓋帶160的截面圖。參照圖2、圖4及圖5,當使用覆蓋帶160時,覆蓋帶160可經設置並黏附至載帶100之橋接件140及基材110的頂部表面141、111上。當對應於至少一通道130的凹穴120接收並儲存預定組件101時,載帶160(示於圖4和圖5中)可將凹穴120自通道130完全隔離。 FIG. 4 and FIG. 5 show an embodiment in which the carrier tape 100 and the cover tape 160 are used. FIG. 4 is a perspective view of the carrier tape 100 and the cover tape 160. 5 is a cross-sectional view of the carrier tape 100 and the cover tape 160 taken along the longitudinal axis 102 of the carrier tape 100. Referring to FIGS. 2, 4 and 5, when the cover tape 160 is used, the cover tape 160 may be disposed and adhered to the bridge members 140 of the carrier tape 100 and the top surfaces 141 and 111 of the substrate 110. When the pocket 120 corresponding to the at least one channel 130 receives and stores the predetermined component 101, the carrier tape 160 (shown in FIGS. 4 and 5) can completely isolate the pocket 120 from the channel 130.
參照圖1,光學鏈齒孔180促進載帶100的機械性操作。在一些實施例中,其他推進結構(例如切口或印刷標記)可用以代替鏈齒孔180,或除了鏈齒孔180外亦使用其他推進結構。例如,推進結構(包括鏈齒孔)可沿著載帶100之一或二個縱向邊緣設置。推進結構可與鏈齒驅動器上之鏈齒接合(未顯示),如可存在於精密置放設備之驅動總成中,用以自載帶之凹穴移除電子組件。推進結構係用以推進載帶至一規定位置以使電子組件能被置放於載帶之凹穴內或自載帶之凹穴移除。 Referring to FIG. 1, the optical sprocket hole 180 facilitates the mechanical operation of the carrier tape 100. In some embodiments, other propulsion structures (such as cutouts or printed marks) may be used in place of the sprocket holes 180, or other propulsion structures may be used in addition to the sprocket holes 180. For example, a propulsion structure (including sprocket holes) may be provided along one or both longitudinal edges of the carrier tape 100. The propulsion structure can be engaged with the sprocket on the sprocket driver (not shown). If it exists in the drive assembly of a precision placement device, it can be used to remove the electronic component from the recess of the carrier tape. The advancing structure is used to advance the carrier tape to a prescribed position so that the electronic component can be placed in or removed from the cavity of the carrier tape.
用於實施本揭露之載帶及覆蓋帶可由任何適合之材料製成,包括例如熱塑性聚合材料、紙板、及/或金屬箔。此外,可用於載帶組分之材料應係尺寸穩定、耐用、且容易成形為所欲構形。較佳地,材料包含具有足夠厚度及可撓性之熱塑性聚合材料以允許其可捲繞於儲存捲盤(storage reel)之轂(hub)。適合的熱塑性聚合材料包括,但不限於,聚酯(例如乙二醇改質之聚對苯二甲酸乙二酯、或聚對苯二甲酸丁二酯)、聚碳酸酯、聚丙烯、聚苯乙烯、聚氯乙烯、丙烯腈- 丁二烯-苯乙烯、非晶質聚對苯二甲酸乙二酯、聚醯胺、聚烯烴(例如聚乙烯、聚丁烯、或聚異丁烯)、改質聚(苯醚)、聚胺甲酸酯、聚二甲基矽氧烷、丙烯腈丁二烯-苯乙烯樹脂、及聚烯烴共聚物。 The carrier tape and cover tape used to implement the present disclosure may be made of any suitable material, including, for example, thermoplastic polymeric materials, cardboard, and / or metal foil. In addition, the materials that can be used for the carrier tape component should be dimensionally stable, durable, and easily shaped into the desired configuration. Preferably, the material comprises a thermoplastic polymeric material of sufficient thickness and flexibility to allow it to be wound around a hub of a storage reel. Suitable thermoplastic polymeric materials include, but are not limited to, polyesters (e.g., ethylene glycol modified polyethylene terephthalate, or polybutylene terephthalate), polycarbonate, polypropylene, polybenzene Ethylene, polyvinyl chloride, acrylonitrile-butadiene-styrene, amorphous polyethylene terephthalate, polyamide, polyolefin (e.g. polyethylene, polybutene, or polyisobutylene), modification Poly (phenylene ether), polyurethane, polydimethylsiloxane, acrylonitrile butadiene-styrene resin, and polyolefin copolymer.
在一些實施例中,該材料具有在400 F(204 C)至630 F(332 C)範圍內的熔融溫度。載帶可以係光學清透的、著色的或經改質以係散電性(electrically dissipative)的。在後者情況中,載帶可包括電傳導材料(例如碳黑或五氧化二釩),該電傳導材料係分散於樹脂材料內或塗布於所形成之載帶之(多個)表面上。電傳導材料幫助耗散放電,該放電可能發生於覆蓋膜移除期間或自儲存卷軸解開載帶總成期間,因而幫助避免損壞容置於載帶之凹穴內的電子組件。此外染料、著色劑、顏料、UV穩定劑、或其他添加物可於形成載帶前添加至樹脂材料。 In some embodiments, the material has a melting temperature in the range of 400 F (204 C) to 630 F (332 C). The carrier tape may be optically clear, colored, or modified to be electrically dissipative. In the latter case, the carrier tape may include an electrically conductive material, such as carbon black or vanadium pentoxide, which is dispersed in a resin material or coated on the surface (s) of the formed carrier tape. Electrically conductive materials help dissipate electrical discharges that may occur during the removal of the cover film or during the unwinding of the carrier tape assembly from the storage reel, thereby helping to avoid damage to the electronic components contained in the pockets of the carrier tape. In addition, dyes, colorants, pigments, UV stabilizers, or other additives can be added to the resin material before forming a carrier tape.
根據本揭露之載帶可具有適用於特定所欲電子組件之任何尺寸。例如,在一些實施例中,該等凹穴之中心可相距1.6cm。 The carrier tape according to the present disclosure may have any size suitable for a particular desired electronic component. For example, in some embodiments, the centers of the cavities may be 1.6 cm apart.
本文中所揭示之實施例包括: Examples disclosed herein include:
實施例1.一種用於運送預定之複數個組件的可撓性載帶,包含:可撓性之一基材,其沿該載帶之一縱軸延伸;複數個間隔開的凹穴,其等沿著該載帶的該縱軸形成在可撓性之該基材中,各凹穴經組態以接收並儲存預定之一組件並包含低於該基材的一底壁;及至少一通道,該至少一通道形成在可撓性之該基材中,並實質上圍繞該等複數個凹穴中的一對應凹穴,且包含低於該凹穴之 該底壁的一底壁,該至少一通道及該凹穴界定於其等之間實質與該至少一通道共延伸的一橋接件,該橋接件之一頂部表面高於該基材之一頂部表面,使得當該等複數個凹穴中之一第一凹穴接收並儲存預定之一組件,且對應於該至少一通道之該凹穴相對於該第一凹穴定中心並放置在該第一凹穴上,而該凹穴之該底壁面向該組件時,該通道減少該對應凹穴的該底壁與儲存在該第一凹穴中的該組件之間的接觸。 Embodiment 1. A flexible carrier tape for transporting a predetermined number of components, comprising: a flexible substrate extending along a longitudinal axis of the carrier tape; and a plurality of spaced-apart cavities, And the like is formed in the flexible substrate along the longitudinal axis of the carrier tape, each recess is configured to receive and store a predetermined component and includes a bottom wall lower than the substrate; and at least one A channel, the at least one channel is formed in the flexible substrate and substantially surrounds a corresponding one of the plurality of cavities, and includes a bottom wall lower than the bottom wall of the cavity, The at least one channel and the recess are defined between a bridge member that substantially extends with the at least one channel. A top surface of one of the bridge members is higher than a top surface of the substrate. One of the recesses receives and stores a predetermined one of the components, and the recess corresponding to the at least one channel is centered with respect to the first recess and placed on the first recess, and the recess When the bottom wall of the cavity faces the component, the channel reduces the bottom wall of the corresponding cavity and is stored in the first The contact between the component pockets.
實施例2.如實施例1之可撓性載帶,其中該至少一通道完全圍繞對應於該至少一通道的該凹穴。 Embodiment 2. The flexible carrier tape of Embodiment 1, wherein the at least one channel completely surrounds the cavity corresponding to the at least one channel.
實施例3.如實施例1至2中任一者之可撓性載帶,其中該橋接件與該至少一通道完全共延伸。 Embodiment 3. The flexible carrier tape of any of Embodiments 1 to 2, wherein the bridge member is completely coextensive with the at least one channel.
實施例4.如實施例1至3中任一者之可撓性載帶,其中該橋接件的該頂部表面係實質上平坦的。 Embodiment 4. The flexible carrier tape of any of Embodiments 1 to 3, wherein the top surface of the bridge is substantially flat.
實施例5.如實施例1至31中任一者之可撓性載帶,其中該橋接件的該頂部表面在實質上垂直於該橋接件的一縱軸的一平面中具有一彎曲截面。 Embodiment 5. The flexible carrier tape of any one of Embodiments 1 to 31, wherein the top surface of the bridge has a curved cross section in a plane substantially perpendicular to a longitudinal axis of the bridge.
實施例6.如實施例1至5中任一者之可撓性載帶,其中當該等複數個凹穴中的該第一凹穴接收並儲存預定之該組件,且對應於該至少一通道的該凹穴相對於該第一凹穴定中心並放置在該第一凹穴上,而該凹穴之該底壁面向該組件時,該通道防止該對應凹穴的該底壁與儲存在該第一凹穴中的該組件之間的任何接觸。 Embodiment 6. The flexible carrier tape according to any one of Embodiments 1 to 5, wherein when the first cavity in the plurality of cavities receives and stores a predetermined component, the component corresponds to the at least one The cavity of the channel is centered relative to the first cavity and placed on the first cavity, and when the bottom wall of the cavity faces the component, the channel prevents the bottom wall and storage of the corresponding cavity Any contact between the components in the first cavity.
實施例7.如實施例1至6中任一者之可撓性載帶,其中該至少一通道包含形成於可撓性之該基材中的複數個通道,各通道實質上圍繞該等複數個凹穴中的一對應凹穴。 Embodiment 7. The flexible carrier tape of any one of Embodiments 1 to 6, wherein the at least one channel includes a plurality of channels formed in the flexible substrate, and each channel substantially surrounds the plurality of channels. One of the pockets corresponds to the pocket.
實施例8.如實施例1至7中任一者之可撓性載帶,其中在平行或垂直於該載帶之該縱軸的一平面中之該至少一通道的一截面中,該通道的一開口頂部具有一寬度W1,該通道的該底壁具有大於W1的一寬度W2。 Embodiment 8. The flexible carrier tape of any of Embodiments 1 to 7, wherein in a cross section of the at least one channel in a plane parallel or perpendicular to the longitudinal axis of the carrier tape, the channel The top of an opening has a width W1, and the bottom wall of the channel has a width W2 greater than W1.
實施例9.如實施例1至8中任一者之可撓性載帶,其中當對應於該至少一通道的該凹穴接收並儲存預定之一組件,且一覆蓋帶經設置在該橋接件及該基材的該等頂部表面上並黏附至該等頂部表面時,該覆蓋帶將該凹穴自該通道完全隔離。 Embodiment 9. The flexible carrier tape as in any one of Embodiments 1 to 8, wherein when a predetermined component is received and stored in the cavity corresponding to the at least one channel, and a cover tape is provided on the bridge When the component and the top surface of the substrate are adhered to the top surface, the cover tape completely isolates the cavity from the channel.
實施例10.如實施例1至9中任一者之可撓性載帶,其中該至少一通道經如此定形狀並定尺寸以不能接收並儲存預定之該組件。 Embodiment 10. The flexible carrier tape of any of Embodiments 1 to 9, wherein the at least one channel is shaped and sized so as to be unable to receive and store a predetermined component.
實施例11.一種用於運送預定之複數個組件的可撓性載帶,包含:可撓性之一基材,其沿該載帶之一縱軸延伸;複數個間隔開的凹穴,其等沿著該載帶的該縱軸形成在可撓性之該基材中,各凹穴經組態以接收並儲存預定之一組件並包含低於該基材的一底壁;及至少一通道,該至少一通道形成在可撓性之該基材中,並實質上圍繞該等複數個凹穴中的一對應凹穴,且包含低於該凹穴之 該底壁的一底壁,該至少一通道及該凹穴界定於其等之間實質與該至少一通道共延伸的一橋接件,該橋接件的一頂部表面高於該基材的一頂部表面,其中該等複數個凹穴經如此定形狀並定尺寸使得當該等複數個凹穴中的一第一凹穴接收並儲存預定之一組件,且該等複數個凹穴中的一第二凹穴相對於該第一凹穴定中心並放置在該第一凹穴上,而該第二凹穴之該底壁面向該組件時,該第二凹穴的一通道減少該第二凹穴的該底壁與儲存在該第一凹穴中的該組件之間的接觸。 Embodiment 11. A flexible carrier tape for transporting a predetermined number of components, comprising: a flexible substrate extending along a longitudinal axis of the carrier tape; and a plurality of spaced apart pockets, And the like is formed in the flexible substrate along the longitudinal axis of the carrier tape, each recess is configured to receive and store a predetermined component and includes a bottom wall lower than the substrate; and at least one A channel, the at least one channel is formed in the flexible substrate and substantially surrounds a corresponding one of the plurality of cavities, and includes a bottom wall lower than the bottom wall of the cavity, The at least one channel and the recess are defined between a bridge member extending substantially co-extensively with the at least one channel, a top surface of the bridge member is higher than a top surface of the substrate, wherein the plurality of recesses The cavity meridian is shaped and dimensioned such that when a first cavity of the plurality of cavities receives and stores a predetermined component, and a second cavity of the plurality of cavities is relative to the first When the cavity is centered and placed on the first cavity, and the bottom wall of the second cavity faces the component A channel of the second cavity reduces contact between the bottom wall of the second cavity and the component stored in the first cavity.
實施例12.如實施例11之可撓性載帶,其中該第二凹穴的該通道防止該第二凹穴的該底壁與儲存在該第一凹穴中的該組件之間的任何接觸。 Embodiment 12. The flexible carrier tape of Embodiment 11, wherein the channel of the second cavity prevents any between the bottom wall of the second cavity and the component stored in the first cavity. contact.
實施例13.一種用於運送預定之複數個組件的可撓性載帶,包含:可撓性之一基材,其沿該載帶之一縱軸延伸;及複數個間隔開的凹穴,其等沿著該載帶的該縱軸形成在可撓性之該基材中,各凹穴包含:一主凹穴,其經組態以接收並儲存預定之一組件;及一輔凹穴,其圍繞該主凹穴,該主凹穴及該輔凹穴界定在該基材之一相同側上的開口,並藉由於其等之間界定的一橋接件彼此隔離,使得當該主凹穴接收並儲存預定之一組件時,該橋接件防止該組件移入該輔凹穴中。 Embodiment 13. A flexible carrier tape for transporting a predetermined plurality of components, comprising: a flexible substrate that extends along a longitudinal axis of the carrier tape; and a plurality of spaced-apart cavities, They are formed in the flexible substrate along the longitudinal axis of the carrier tape, and each recess includes: a main recess configured to receive and store a predetermined one of the components; and an auxiliary recess It surrounds the main cavity, the main cavity and the auxiliary cavity define an opening on the same side of the substrate, and are isolated from each other by a bridge defined between them, so that when the main cavity When the cavity receives and stores a predetermined one of the components, the bridge prevents the component from moving into the auxiliary cavity.
實施例14.如實施例13之可撓性載帶,其中該橋接件的一頂部表面高於該基材的一頂部表面。 Embodiment 14. The flexible carrier tape of Embodiment 13, wherein a top surface of the bridge member is higher than a top surface of the substrate.
如本文所使用,用語「高於(higher)」、「低於(lower)」、「上(up)」、「下(down)」、「垂直(vertical)」、及「水平(horizontal)」係指當載帶經水平敷設且凹穴開口經定向朝向上表面(即,面向上方)時之定向。應理解,載帶的其他定向係可行的。 As used herein, the terms "higher", "lower", "up", "down", "vertical", and "horizontal" Refers to the orientation when the carrier tape is laid horizontally and the pocket openings are oriented toward the upper surface (ie, facing upward). It should be understood that other orientations of the carrier tape are possible.
除非另有所指,本說明書及申請專利範圍中用以表達特徵之尺寸、數量、以及物理性質的所有數字,皆應理解為在所有情況下以用語「約(about)」修飾之。因此,除非另有相反指示,否則在前述說明書以及隨附申請專利範圍中所提出的數值參數係近似值,其可依據所屬技術領域中具有通常知識者運用本文所揭示之教示所欲獲得的所欲特性而有所不同。使用端點來敘述之數字範圍包括所有歸於該範圍內的數字(例如,1至5包括1、1.5、2、2.75、3、3.80、4及5)以及該範圍內的任何範圍。 Unless otherwise indicated, all numbers used to express the dimensions, quantities, and physical properties of features in this specification and the scope of patent applications are to be understood as modified in all cases by the term "about". Therefore, unless otherwise indicated to the contrary, the numerical parameters set forth in the foregoing description and the scope of the accompanying patent application are approximate values that can be obtained according to what one of ordinary skill in the art would like to obtain using the teachings disclosed herein. Features vary. The range of numbers stated using endpoints includes all numbers that fall into that range (for example, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and any range within that range.
本發明之各種修改及變更對於所屬技術領域中具有通常知識者而言當為顯而易見,且應理解本揭露之此範疇不受限於本文中所提出的說明性實施例。舉例而言,除非另有指示,讀者應假設一項揭示之實施例的特徵亦可應用於全部其他揭示之實施例。 Various modifications and changes of the present invention will be obvious to those having ordinary knowledge in the technical field, and it should be understood that this category of the disclosure is not limited to the illustrative embodiments proposed herein. For example, unless otherwise indicated, the reader should assume that the features of one disclosed embodiment can also be applied to all other disclosed embodiments.
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PCT/CN2017/075143 WO2018157280A1 (en) | 2017-02-28 | 2017-02-28 | Carrier tape for electronic components |
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TWI757436B TWI757436B (en) | 2022-03-11 |
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US5648136A (en) * | 1995-07-11 | 1997-07-15 | Minnesota Mining And Manufacturing Co. | Component carrier tape |
JP2000203630A (en) * | 1999-01-13 | 2000-07-25 | Miyagi Oki Denki Kk | Embossed carrier tape and embossed carrier taping method |
US7611016B2 (en) * | 2007-07-31 | 2009-11-03 | 3M Innovative Properties Company | Non-nesting component carrier tape |
TWM347375U (en) * | 2008-04-30 | 2008-12-21 | Yuan Deng Metals Ind Co Ltd | SMT parts strip structure |
JP2013039946A (en) * | 2011-08-17 | 2013-02-28 | Shin Etsu Polymer Co Ltd | Carrier tape |
JP5791532B2 (en) * | 2012-01-31 | 2015-10-07 | 株式会社ソシオネクスト | Container and reel |
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JP3203897U (en) * | 2016-02-10 | 2016-04-21 | 藤森工業株式会社 | Storage case and tray |
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