CN212075013U - Flexible carrier tape for transporting a plurality of components - Google Patents

Abstract

A flexible carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape. Spaced apart pockets are disposed along a longitudinal axis of the flexible substrate. Each pocket is configured to receive and store a component. A plurality of spaced apart pedestals are formed on the bottom wall of the pocket. The base is shaped such that when one of the components is disposed in the pocket, the base contacts a bottom surface of the component, and the protrusion on the bottom surface of the component is distal from the base.

Description

Flexible carrier tape for transporting a plurality of components

Technical Field

The present disclosure relates generally to carrier tapes, and in particular to carrier tapes for electronic components.

Background

As electronic devices become miniaturized, it is desirable to design and manufacture electronic components, such as Integrated Circuit (IC) chips, to be lighter in weight and smaller in size. Carrier tapes are used to transport electronic components, such as resistors, capacitors or integrated circuits, from a component manufacturer to a different manufacturer that assembles the components carried within the carrier tape. These electronic components are mounted to a Printed Circuit Board (PCB) or other substrate during assembly of the electronic device or a subassembly that will later be used to build the electronic device.

Disclosure of Invention

In some aspects of the present disclosure, a flexible carrier tape for transporting a plurality of components is provided. Each component includes a plurality of projections disposed on a bottom surface thereof. The flexible carrier tape includes a flexible substrate extending along a longitudinal axis of the carrier tape. A plurality of spaced apart pockets are formed in the flexible substrate along the longitudinal axis of the carrier tape. Each pocket is configured to receive and store one of the components. Each pocket includes a bottom wall that is lower than the top surface of the substrate. A plurality of spaced apart pedestals are formed on the bottom wall. The base is positioned and sized such that when one of the components is disposed in the pocket with the bottom surface of the component facing the bottom wall of the pocket, the base contacts the bottom surface of the component. The protrusion on the bottom surface of the component resides away from the base in a space defined by the bottom surface of the component, the bottom wall, the base, and one or more side walls of the pocket.

Drawings

Various aspects of the disclosure will be discussed in greater detail with reference to the accompanying drawings, in which,

fig. 1 schematically illustrates a flexible carrier tape having a plurality of spaced apart pockets according to some embodiments of the present disclosure;

fig. 2 schematically illustrates features of pockets of a carrier tape according to some aspects of the present disclosure;

FIG. 3 schematically illustrates a bottom view of a component to be disposed in a pocket of a flexible carrier tape;

FIG. 4 schematically illustrates assembly of an electronic component with another component;

fig. 5 and 6 schematically illustrate cross-sectional views of a carrier tape with components disposed therein, according to some embodiments of the present disclosure;

FIG. 7 shows an enlarged view of a sample of the pocket actually formed; and is

Fig. 8 schematically illustrates a dimensional relationship between features of pockets of a carrier tape according to some aspects of the present disclosure.

The figures are not necessarily to scale. Like numbers used in the figures refer to like parts. It should be understood, however, that the use of a number to refer to a component in a given figure is not intended to limit the component in another figure labeled with the same number.

Detailed Description

In the following description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration various embodiments. It is to be understood that other embodiments are contemplated and may be made without departing from the scope or spirit of the present description. The following detailed description is, therefore, not to be taken in a limiting sense.

The carrier tape according to the invention is usually used in combination with components, in particular electronic components. The carrier strip includes a plurality of pockets formed at regular intervals within the carrier strip. The pocket geometry is compatible with the component to be carried, and the component rests within the defined pocket. As semiconductors and/or other electronic components (particularly electronic components having bumps) become smaller and thinner, the electronic components may tilt out of the pockets of the carrier tape during transport and/or handling. Excessive tilting of such components can cause application problems and can also lead to component damage during transportation. Embodiments described herein address these and other challenges for electronic components disposed in a carrier tape.

Referring to fig. 1 and 2, a flexible carrier tape (100) is configured to transport a plurality of components (10). The flexible carrier tape (100) includes a flexible substrate (120) extending along a longitudinal axis (x-axis) of the carrier tape (100). A plurality of spaced apart pockets (30) are formed in the flexible substrate (120). The pockets (30) are spaced along the longitudinal axis (x-axis) of the carrier tape (100). In some aspects, the plurality of pockets (30) may be formed in rows in the flexible substrate (120). Each pocket (30) is configured to receive and store one of the components (10). Each pocket (30) includes a bottom wall (31) that is lower than a top surface (122) of the substrate (120).

An optional series of sprocket holes (110) are provided in the carrier tape (100) to facilitate the mechanical handling of the carrier tape. In some embodiments, other structures (e.g., notches or printed indicia) may be used instead of or in addition to the sprocket holes (110). The sprocket holes (110) may be disposed, for example, along one or both longitudinal edges of the carrier tape (100). The sprocket holes (110) may engage with teeth on a sprocket drive (not shown) that may be present in a drive assembly of a precision placement apparatus for removing parts from pockets of a carrier tape. The sprocket holes (110) are used to advance the carrier tape (100) to a prescribed position so that the components (10) can be placed in or removed from the pockets (30) of the carrier tape (100).

Referring to fig. 3, each component (10) includes a plurality of protrusions (11) disposed on a bottom surface (12) of the component (10). In some aspects, the protrusions may be electrodes disposed on the bottom surface (12) in a matrix or other configuration. In some embodiments, the protrusions (11) may be conductive molded bumps (die bumps), or in other embodiments conductive solder bumps (solder bumps), for allowing electrical and mechanical connection between the component (10) and another component (60) when assembled, as best shown in fig. 4.

The components (10) are placed in the respective pockets (30) such that the bottom surface (12) of each component (10) faces the bottom wall (31) of the respective pocket (30). Referring to fig. 2, a plurality of spaced pedestals (40) are formed on the bottom wall (31) of each pocket (30). The base (40) is positioned and sized such that the base (40) contacts the bottom surface (12) of the component (10) when one of the components (10) is disposed in the pocket (30). As best shown in fig. 5 and 6, the protrusion (11) on the bottom surface (12) of the component (10) resides in the space (50) away from the base (40). In some embodiments, the space (50) is defined by the bottom surface (12) of the component (10), the bottom wall (31) of the pocket (30), a base (40) formed on the bottom wall (31), and one or more side walls (32) of the pocket (30).

In some embodiments, as best shown in fig. 2 and 8, at least one base (40a) formed on the bottom wall (31) of each pocket may be attached to the side wall (32a) of the pocket. In the illustrated embodiment, at least three bases (40) are attached to the side wall (32a), each base being positioned and dimensioned such that when one of the components (10) is disposed in the pocket (30), the at least three bases contact the bottom surface (12) of the component (10) and the protrusions (11) on the bottom surface (12) of the component (10) do not contact the base (40). In some embodiments, each of the at least three bases may have a similar profile with dimensions fixed according to specifications. For example, each of the bases (40) attached to the sidewalls (32a) may have the same width and different lengths, and may be spaced apart from each other by a predetermined distance. In other cases, at least two of the at least three bases attached to the sidewall can have the same width and length. In some other cases, at least one of the bases (40a) attached to the sidewall (32a) may have a length along the first direction (x-axis) that is about twice the length of the other bases (40) to which the sidewall (32a) is attached. In the illustrated embodiment, the bases (40a) longer in the first direction (x-axis) are formed between the bases (40) shorter in length in the first direction (x-axis).

In some other embodiments, at least one base (40b) formed on the bottom wall (31) of each pocket is spaced apart from each side wall (32a) of the pocket. In some aspects, the base (40b) may be closer to some of the sidewalls (32a) than others. In some aspects, the base (40b) may be formed at a predetermined distance from the base (40a) attached to the sidewall (32a) of the pocket.

In other embodiments, at least one base (40c) formed on the bottom wall (31) of each pocket (30) is positioned at a corner of the pocket. In some aspects, each corner of the pocket may be provided with a base (40 c). The base (40c) disposed in one or more corners of the pocket (30) may be formed as a chamfered pad on which a corner of the bottom surface of the component (10) may rest.

As described elsewhere in this disclosure, the base (40, 40a, 40b, 40c) contacts the bottom surface (12) of the component (10), and the protrusion (11) on the bottom surface (12) of the component (10) resides away from the base (40, 40a, 40b, 40c) in a space (50) defined by the bottom surface (12) of the component (10), the bottom wall (31) of the pocket (30), the base (40) formed on the bottom wall (31) of the pocket (30), and one or more side walls (32) of the pocket (30).

In another embodiment, as best shown in fig. 8, at least two pedestals (40a, 40b) formed on the bottom wall of each pocket are elongated to have a greater length (L) and a lesser width (W). One of the at least two bases (40a) may be elongated in a first direction (x-axis) and another of the at least two bases (40b) may be elongated in a different second direction (y-axis). In some aspects, the first direction and the second direction are orthogonal to each other. In some embodiments, the length (L) of one of the at least two pedestals (40b) can be about 2cm, or about 1.9cm, or about 1.6cm to 1.8 cm. In some embodiments, the width (W) of one or each of the at least two pedestals (40a, 40b) can be about 0.5cm, or 0.45cm, or about 0.3cm to 0.4 cm.

A picture of the pedestals (40) actually formed in the bottom wall (31) of the pockets (30) in the base (120) of the carrier tape is shown in fig. 7.

Carrier tapes according to the present disclosure can have dimensions suitable for use with certain desired electronic components, and the pockets can be spaced apart from one another to suit a particular application. For example, in some embodiments, the center distance between two adjacent pockets (30) may be about 4 cm.

In other aspects, the pocket (30) may include a vacuum hole (55) in a bottom wall (31) of the pocket (30). Vacuum holes (55) may be used to apply a vacuum to the pocket (30) to allow the pocket to more efficiently load the electronic component (10). In addition, the vacuum holes (55) may also be used for visual inspection to confirm that the component (10) is present in the pocket (30). In the illustrated embodiment, as shown in fig. 2 and 8, a vacuum hole (55) is formed in the bottom wall (31) of the pocket (30) between the two elongated bases (40a, 40 b).

The carrier tape (100) of the present disclosure may be made of any suitable material, including, for example, thermoplastic polymer materials, cardboard, and/or metal foils. In addition, materials that can be used for the carrier band (100) can be dimensionally stable, durable, and easily shaped into a desired configuration. Preferably, the material comprises a thermoplastic polymer material having sufficient thickness and flexibility to allow it to be wound onto the hub of a storage reel. Suitable thermoplastic polymeric materials include, but are not limited to, polyesters (e.g., glycol-modified polyethylene terephthalate or polybutylene terephthalate), polycarbonates, polypropylenes, polystyrenes, polyvinyl chlorides, acrylonitrile-butadiene-styrene, amorphous polyethylene terephthalate, polyamides, polyolefins (e.g., polyethylene, polybutylene, or polyisobutylene), modified poly (phenylene ether), polyurethanes, polydimethylsiloxanes, acrylonitrile-butadiene-styrene resins, and polyolefin copolymers. In some embodiments, the material can have a melting temperature of about 400 ° F (204 ℃) to about 630 ° F (332 ℃). The carrier tape (100) may be manufactured in a thermoforming or embossing operation, for example, wherein a thermoplastic polymer web is delivered to a mold that forms the pockets (30) in the carrier tape (100). The carrier tape may be optically clear, colored or modified to have electrical dissipation properties. In the latter case, the carrier tape may include a conductive material, such as carbon black or vanadium pentoxide, dispersed within a resin material or coated on one or more surfaces of the formed carrier tape. The conductive material can help dissipate electrical discharges that may occur during removal of the cover film or unwinding of the carrier tape assembly from the storage spool, thereby helping to prevent damage to the electronic components housed within the pockets of the carrier tape. Further, dyes, colorants, pigments, UV stabilizers, or other additives may be added to the resin material prior to forming the carrier tape.

Various modifications and alterations will become apparent to those skilled in the art, and it should be understood that the scope of the disclosure is not limited to the illustrative embodiments described herein.

Claims (9)

1. A flexible carrier tape for transporting a plurality of components, each component comprising a plurality of protrusions disposed on a bottom surface thereof, wherein the flexible carrier tape comprises a flexible substrate extending along a longitudinal axis of the carrier tape and a plurality of spaced apart pockets formed in the flexible substrate along the longitudinal axis of the carrier tape, each pocket being configured to receive and store one of the components and comprising:

a bottom wall lower than a top surface of the substrate; and

a plurality of spaced apart pedestals formed on the bottom wall, the pedestals being positioned and sized such that when one of the components is disposed in the pocket and with the bottom surface of the component facing the bottom wall of the pocket, the pedestals contact the bottom surface of the component, and the protrusions on the bottom surface of the component reside away from the pedestals in a space defined by a bottom surface of the component, the bottom wall, the pedestals, and one or more side walls of the pocket.

2. The flexible carrier tape of claim 1, wherein the protrusions disposed on the bottom surface of each component are electrically conductive molded bumps for allowing electrical and mechanical connection between the component and another component.

3. The flexible carrier tape of claim 1, wherein the protrusions disposed on the bottom surface of each component are conductive solder bumps for allowing electrical and mechanical connection between the component and another component.

4. The flexible carrier tape of claim 1, wherein at least one of the bases formed on the bottom wall of each pocket is attached to a sidewall of the pocket.

5. The flexible carrier tape of claim 1, wherein at least one of the bases formed on the bottom wall of each pocket is spaced apart from each sidewall of the pocket.

6. The flexible carrier tape of claim 1, wherein at least one of the bases formed on the bottom wall of each pocket is positioned at a corner of the pocket.

7. The flexible carrier tape of claim 6, wherein at least one pedestal is formed on the bottom wall at each corner of the pocket.

8. The flexible carrier tape of claim 1, wherein at least two bases formed on the bottom wall of each pocket are elongated to have a length and a width, the width being less than the length, and wherein one of the at least two bases is elongated in a first direction and another of the at least two bases is elongated in a second, different direction.

9. The flexible carrier tape of claim 8, wherein the first direction and the second direction are orthogonal to each other.

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