JPH09270433A - Electronic part container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation or contamination of lead terminals and the like of electronic parts when a tape type electronic part container containing the electronic parts is rolled around a reel. SOLUTION: IC chips of BGA type or the like are placed in a plurality of container portions 12, formed in a tape type substrate 11 in a lengthwise direction of the substrate 11, and the container portions 12 are sealed by a top cover tape 13. Among four inner side surfaces of each container portion 12, two inner side surfaces, parallel to each other along the lengthwise direction of the substrate 11, respectively have a step portion 16 for supporting lower ends of an IC chip when the chip is placed. Further, a plurality of protruding lines 21 are formed on the bottom surface of each container portion 12 along the lengthwise direction of the tape type substrate 11. As rigidity of the container portions 12 is enhanced by these protruding lines 21, even in a state where the tape type substrate 11 is rolled around a reel, the bottom surfaces of the container portions 12 are not greatly curved toward the inside. Thus, contact between the solder bumps of the IC chips and the bottom surfaces of the container portions 12 can be prevented.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC (Integrated C
ircuit: integrated circuit) The present invention relates to an electronic component container for accommodating and transporting a large number of electronic components such as chips.

[0002]

2. Description of the Related Art Conventionally, as a container of this type, a plurality of recessed electronic component accommodating portions are formed on a tape-shaped base material which can be wound around a take-up reel, and ICs are respectively provided in these accommodating portions. Some have a chip.

FIG. 11 shows a specific structure of a conventional electronic component container 100 for an IC chip called an embossed carrier tape. It should be noted that the IC chip is not shown in this figure for convenience of description. The electronic component container 100 includes a tape-shaped base material 101, and a plurality of storage parts 1 are arranged at predetermined intervals in the longitudinal direction of the base material 101.
02 is formed. A top cover tape 103 is attached to the surface of the base material 101, and
Covers the opening. A large number of sprocket holes 104 are formed in the base material 101 at regular intervals along both side edges thereof. These sprocket holes 1
Reference numeral 04 denotes the entire electronic component container 100 in the longitudinal direction (winding direction in the drawing) when winding it on a winding reel (not shown).
Used to transport to.

The bottom surface 105 of the accommodating portion 102 is a flat surface without irregularities. The electronic component container 100 accommodates an IC chip (not shown in FIG. 1) of a BGA (Ball Grid Aray) type or the like in a container 102, and then encloses the IC chip with a top cover tape 103 in a sprocket hole. It is adapted to be sequentially wound on a take-up reel (not shown) via 104.

[0005]

FIG. 12 is a partially cutaway view showing a state in which a BGA type IC chip 106 is accommodated in the accommodating portion 102 viewed from the direction of arrow B in FIG. As described above, the bottom surface 105 of the housing portion 102
Has a flat surface without any unevenness, so when the container 100 is wound up on a winding reel (not shown),
As shown in FIG. 12, the bottom surface 105 is easily deformed and curved inward of the housing portion 102. Therefore, the IC chip 10
There is a problem that the solder bumps (solder balls) 106a arranged as the lead terminals on the lower surface of 6 come into contact with the bottom surface 105, causing the solder bumps 106a to become dirty or deformed. Further, since the base material 101 is formed to contain carbon or the like in order to prevent the generation of static electricity, the contamination of the solder bumps 106a may cause a contact failure when the IC chip 106 is soldered to the printed board. There is Further, the deformation of the solder bumps 106a may cause a soldering failure such as a short circuit with another terminal. This is BGA
Not only the type of IC chip, but also other types (for example, types including ordinary lead terminals) similarly cause a problem.

The present invention has been made in view of the above problems, and an object thereof is to accommodate electronic components in a large number of accommodating portions, respectively, and even when the electronic components are wound on a take-up reel. An object of the present invention is to provide an electronic component container capable of effectively preventing deformation and contamination of lead terminals and the like.

[0007]

An electronic component container according to the present invention is provided with a plurality of electronic components for accommodating electronic components along the longitudinal direction of a tape-shaped substrate having a flexibility such that it can be wound up. In the case where the recess-shaped accommodating portion is formed,
The reinforcing structure is provided on the inner surface of each of the plurality of accommodating portions so as to impart rigidity that can resist the strain force applied to the bottom surface of the accommodating portion when the tape-shaped base material is wound.

In this electronic component container, the tape-shaped base material can be wound without bending the inner bottom surface of the container by the reinforcing structure formed on the inner surface of the container.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an external configuration of an electronic component container 10A according to an embodiment of the present invention. here,
The electronic component container 10A is described as being used for carrying a BGA type IC chip, for example, and the IC chip is not shown in FIG. 1 for convenience of description.

The electronic component container 10A has a tape-shaped base material 11. A plurality of accommodating portions 12 are formed on the base material 11 at predetermined intervals (for example, a multiple of 8 mm or a multiple of 4 mm) along the longitudinal direction by, for example, embossing. The top cover tape 1 is provided on the surface of the base material 11.
3 is attached and covers the opening of each accommodation portion 12. A large number of sprocket holes 14 are formed in the base material 11 at regular intervals along both side edges thereof. These sprocket holes 14 are used for transporting the entire electronic component container 10A in the longitudinal direction (winding direction in the drawing) when winding the unwound winding reel.

The substrate 11 is made of a resin such as PVC (polyvinyl chloride), PS (polystyrene) or PET (polyethylene terephthalate), and its width is, for example, 8, 16, 24, 32, 44 or 56 m.
m, the thickness is about 0.1 to 0.5 mm. Base material 11
Is formed to contain carbon or the like for preventing generation of static electricity. The top cover tape 13 is, for example, PE
It is a film having a laminated structure using a resin such as T as a base material, and its width is such that it does not cover the sprocket holes 14 formed in the base material 11, and the thickness is, for example, 0.2 to It is about 0.3 mm. Although the top cover tape 13 is depicted as transparent in this figure, it may be translucent or opaque.

FIG. 2 shows the electronic component housing portion 10A in FIG.
3 shows a state in which the housing portion 12 of FIG.
In the sectional structure along the line AA ′ in FIG.
This shows a state in which the IC chip 17 is housed. As shown in these drawings, of the four inner wall surfaces of the housing portion 12, two surfaces parallel to the longitudinal direction of the housing body 10A have a lower side of the IC chip 17 when the IC chip 17 is housed. Stepped portions 16 for supporting both ends are formed.

On the bottom surface 15 of the accommodating portion 12, a plurality of (in this case, four) linear protrusions 21 are formed parallel to each other along the longitudinal direction of the tape-shaped substrate 11. Each of the ridges 21 is a pair of vertical walls 21a, 21b and a pair of vertical walls 21a, 21b which are respectively perpendicular to the bottom surface 15 of the housing portion 12.
It is constituted by a horizontal wall 21c that connects the tip portions of 21b. In addition, these ridges 21 have the width W and the height H shown in FIG.
It is preferable to set the thickness to be 1 or more,
The processing method is not limited to this.

The accommodating portion 12 has, for example, a step portion 16
It can be formed by using a mold having an uneven shape corresponding to the protrusions 21 and the like, and vacuum-adsorbing the base material 11 on the inner surface of the mold.

In the electronic component container 10A according to the present embodiment having the above-mentioned structure, the BG is provided in each container 12.
An A type IC chip 17 is housed and both sides thereof are supported by the step portion 16. Next, these IC chips 1
After 7 is enclosed by the top cover tape 13, it is sequentially wound on a winding reel (not shown).

Here, in this electronic component container 10A,
As a reinforcing structure for the bottom surface 15 of the housing portion 12, a plurality of ridge portions 21 each including vertical walls 21a and 21b and a horizontal wall 21c are provided. Therefore, the presence of these protrusions 21 increases the rigidity of the electronic component container 10A in the longitudinal direction. Therefore, even in a state of being wound up on a winding reel (not shown), there is no possibility that the bottom surface 15 of the housing portion 12 is greatly curved inward as in the conventional case. Therefore,
It is possible to prevent the solder bumps 17a of the IC chip 17 from coming into contact with the bottom surface 15 to stain or deform the solder bumps 17a.

In the present embodiment, the description has been made assuming that the number of the protrusions 21 formed on the accommodating portion 12 is four, but the number can be increased or decreased as necessary. For example,
If the protrusions 21 are formed according to the pitch between the solder bumps 17 a provided on the IC chip 17, the depth of the accommodating portion 12 can be reduced.

Further, in this embodiment, the IC chip 17
Among the four inner wall surfaces of the accommodating portion 12, the step portion 16 for supporting the 2 is provided parallel to the longitudinal direction of the tape-shaped base material 11.
Although it is formed only on one surface, instead of this, a step for the same purpose may be formed on two surfaces orthogonal to the longitudinal direction of the electronic component container 10A. Of course, a stepped portion for IC support may be formed on all of the four inner wall surfaces of the housing portion 12.

FIG. 4 shows a sectional shape of the housing portion 22 of the electronic component housing 10B according to another embodiment of the present invention. In addition, in the present embodiment, the planar shape of the housing portion 22 is the same as that shown in FIG. 2, so illustration thereof will be omitted, but FIG. 4 corresponds to a cross section taken along the line AA ′ in FIG. ing.

In the present embodiment, the bottom surface 15 of the accommodating portion 22 is
The vertical wall and the horizontal wall are connected in a stepwise manner, and a ridge portion 31 having a pyramid cross-sectional shape with the central portion as the top is formed. As shown in the figure, the electronic component container 10B is applied to an IC chip 29 of a type in which the solder bumps 27a are arranged on both sides of the lower surface of the IC chip 29 but not in the central portion. Suitable for In this case, the height from the bottom surface 15 to the top of the ridge portion 31 and the height of the step portion 16 are made equal to each other so that the top portion 31a of the ridge portion 31 contacts the lower surface of the IC chip 29. The chip 29 can be supported more stably. Since the protrusions 31 provide rigidity in the longitudinal direction of the base material 11, even when the electronic component container 10B is wound around a winding reel (not shown), the bottom surface 15 of the housing part 22 is located inside. The solder bumps 29 of the IC chip 29 do not bend significantly
There is no risk of a coming into contact with the bottom surface 15 of the housing portion 22.

FIG. 5 shows a sectional shape of a housing portion 23 of an electronic component housing 10C according to still another embodiment of the present invention. Note that, also in the present embodiment, the housing portion 2
The planar shape of 3 is the same as that shown in FIG. 2, and therefore its illustration is omitted, but FIG. 5 corresponds to the cross section taken along the line AA ′ in FIG.

As shown in this figure, in the present embodiment, the step difference portion at the central portion of the ridge portion 31 in the embodiment shown in FIG. 4 is formed by reversing it downward (outside). Thus, two ridge portions 32 and 33 each having a pyramid cross-sectional shape are formed. In such an electronic component container 10C, the height from the bottom surface 15 to the tops of the protrusions 32 and 33 can be made lower than in the case of FIG. 4, so that the solder bumps 17a are arranged even in the central portion as shown in the figure. When applied to the IC chip 17 that has
A sufficient distance between the top of 3 and the solder bump 19 can be secured.
Then, the ridge portions 32 and 33 cause the electronic component container 10
Since the rigidity is imparted in the longitudinal direction of C, the bottom surface 15 of the housing portion 23 does not curve inward even when the electronic component container 10C is wound on the take-up reel. Therefore, there is no fear that the solder bumps 17a of the IC chip 17 and the bottom surface 15 of the housing portion 23 come into contact with each other.

FIG. 6 shows a planar shape of the housing portion 24 of the electronic component housing 10D according to still another embodiment of the present invention. In the present embodiment, the bottom surface 15 of the housing portion 24
The ridges 41, 42 formed in the shape of a rectangular corridor surrounding the central portion of the bottom surface 15. That is, the cross section of the base material 11 taken along the line AA ′ in the width direction has the repeating shape of the uneven portions as in the case shown in FIG. Similarly, a cross section (not shown) along line B ′ also has a repeating shape of uneven portions.
The other structure is similar to that of the above-mentioned embodiment.

In the present embodiment, the bottom surface 15 of the accommodating portion 24 is
In addition, since the rigidity is imparted not only to the longitudinal direction of the base material 11 but also to the width direction thereof, it is possible to reduce the curvature of the bottom surface 15 in this width direction.

FIG. 7 shows a planar shape of the housing portion 25 of the electronic component housing 10E according to still another embodiment of the present invention. In the present embodiment, the protrusions 51 and 52 formed on the bottom surface 15 of the housing portion 25 each have a concentric oval shape centered on the central portion of the bottom surface 15. That is, the cross section taken along the line AA ′ in the width direction of the electronic component container 10E has the repeating shape of the concave and convex portions as in the case shown in FIG. Similarly, a cross section (not shown) taken along the line B-B ′ of FIG. The other structure is similar to that of the above-mentioned embodiment.

In the present embodiment, the bottom surface 15 of the housing portion 25 is
Since rigidity is imparted not only to the longitudinal direction of the base material 11 but also to all other directions, the curvature of the bottom surface 15 of the housing portion 25 in all directions can be reduced.

Note that, in FIG. 7, the planar shape of the protrusions 51 and 52 formed on the bottom surface 15 may be a perfect circle instead of an ellipse. As a modified example of the embodiment shown in FIG. 6 or 7, a cross section taken along the line AA ′ of FIG.
It is also possible to have a pyramid cross-sectional shape as shown in FIG. 5 or a shape as shown in FIG.

In each of the embodiments described above, the reinforcing structure for imparting rigidity to the bottom surfaces of the accommodating portions 12, 22 to 25 is formed only on the bottom surface, but the present invention is not limited to this. It may be formed not only on the side surface but also on the side surface. For example, the electronic component container 10 shown in FIG.
As in F, in addition to forming the ridges 21 on the bottom surface 15 of the accommodating portion 26, the ridges 61 extending in the longitudinal direction of the base material 11 are also formed on the side surfaces, or the electron shown in FIG. Like the component container 10G, the protrusion 3 is formed on the bottom surface 15 of the container 27.
In addition to forming No. 1, a ridge 61 extending in the longitudinal direction of the base material 11 may be formed on the side surface. This is Figure 5
The same applies to the side surface of the housing portion 23 shown in FIG. By forming the protruding portion 61 on this side surface, the accommodating portion 26,
27 has higher rigidity as a whole, and has a structure that is stronger against deformation. 8 and 9
In the above, the number of the ridge portions 61 is one, but it may be larger. Further, if sufficient rigidity can be obtained only by the ridges 61 formed only on the side surfaces, the ridges may not be formed on the bottom surface 15.

FIG. 10 shows a planar shape of the housing portion 28 of the electronic component housing 10H according to still another embodiment of the present invention. In the present embodiment, a plurality of ridges 62 extending in the depth direction are provided on the step portion 16 provided in the housing portion 28.
Are formed. Due to the presence of these ridges 62,
The rigidity of the accommodation portion 28 against the compressive force in the depth direction also increases,
It is possible to prevent the accommodation portion 28 from being crushed when it is wound around a take-up reel (not shown) or when a load is applied from above such as when a plurality of electronic component accommodation bodies 10H are stacked. The ridge portion 62 extending in the depth direction is not limited to the surface of the accommodating portion 28 on which the step portion 16 is formed.
It may be formed on all four inner wall surfaces of the housing portion 12.

As described above, the present invention has been described with reference to some embodiments. However, the present invention is not limited to these embodiments, and can be variously modified within an equivalent range. For example, in the electronic component container 10 </ b> A of FIG. 3, the protrusion 21 formed on the bottom surface 15 of the container 12 is the container 1
Although it protrudes to the inside of 2 (upper side of the bottom surface 15), it may conversely project to the outside of the housing portion 12 (below the bottom surface 15). This also applies to the other embodiments (FIGS. 4 and 5). FIG.
The ridge portion 61 shown in FIG. 9 and the ridge portions 61 shown in FIG.
It may be one that protrudes to the outside.

In the above embodiments, the case where the IC chip is used as the electronic component has been described.
It is needless to say that the present invention is not limited to this and can be applied to other electronic components.

[0033]

As described above, according to the electronic parts container of the present invention, since the reinforcing structure for maintaining the rigidity of the bottom surface is provided on the inner surface of each housing part, the tape-shaped base material It is possible to reduce the distortion of the bottom surface of the accommodating portion at the time of winding, and it is possible to prevent the accommodating portion from being bent and the electronic components such as the IC chip stored therein being contaminated or deformed.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining an external structure of an electronic component container according to an embodiment of the present invention.

FIG. 2 is a plan view showing a housing portion of the electronic component housing body of FIG. 1 in an enlarged manner.

FIG. 3 is a cross-sectional view showing an example of a cross-sectional shape taken along the line AA ′ in FIG.

FIG. 4 is a cross-sectional view showing another example of the cross-sectional shape along the line AA ′ in FIG.

5 is a cross-sectional view showing still another example of the cross-sectional shape along the line AA ′ in FIG.

FIG. 6 is a plan view showing another example of the housing portion of the electronic component housing.

FIG. 7 is a plan view showing still another example of the housing portion of the electronic component housing.

8 is a sectional view showing still another example of the sectional shape taken along the line AA ′ of FIG.

9 is a cross-sectional view showing still another example of the cross-sectional shape along the line AA ′ in FIG.

FIG. 10 is a plan view showing still another example of the housing portion of the electronic component housing.

FIG. 11 is a perspective view for explaining an external configuration of a conventional electronic component container.

FIG. 12 is a cross-sectional view of a housing portion in a state where the electronic component housing body of FIG. 1 is wound on a reel.

[Explanation of symbols]

10A to 10G ... Electronic component container, 11 ... Base material, 12,
22, 23, 24, 25, 26, 27, 28 ... Housing section,
Reference numeral 13 ... Top cover tape, 14 ... Sprocket hole, 15 ... Bottom surface, 16 ... Step portion, 17, 29 ... IC chip, 17a, 29a ... Solder bump 21, 31, 32,
33, 41, 42, 51, 52 ... Projections, 61, 62 ...
Protrusion

Claims (8)

[Claims] 1. An electronic component container in which a plurality of recessed accommodating portions for accommodating electronic components are formed along a longitudinal direction of a tape-shaped base material having a flexibility enough to be wound up. In the above, it is preferable that the inner surface of each of the plurality of accommodating portions has a reinforcing structure for imparting rigidity capable of resisting a strain force applied to the bottom surface of the accommodating portion during winding of the tape-shaped base material. Electronic component container. 2. The reinforcing structure comprises one or a plurality of ridges linearly formed from a front end to a rear end of a bottom surface of the accommodating portion in a winding direction of the base material. Item 1. The electronic component container according to item 1. 3. A pair of vertical walls having a cross-sectional shape in a direction orthogonal to the winding direction of the tape-shaped base material of the protrusions perpendicular to the bottom surface of the accommodating portion, and tip portions of these vertical walls. The electronic component container according to claim 2, wherein the electronic component container comprises a horizontal wall connecting the two. 4. The electronic component container according to claim 3, wherein the protrusion is formed by molding a tape-shaped base material together with the container. 5. The electronic component container according to claim 4, wherein the height and the width of the protrusion have a value at least larger than the thickness of the container. 6. The electronic component container according to claim 1, wherein the reinforcing structure is one or a plurality of ridges formed in a rectangular shape, an elliptical shape, or a circular shape on a bottom surface of the housing portion. 7. The reinforcing structure is one or a plurality of ridges formed on an inner surface of the accommodating portion along a winding direction of the tape-shaped base material.
The electronic component container described. 8. The reinforcing structure for imparting rigidity to an inner surface of each of the accommodating portions so as to resist a compressive force applied in a depth direction of the accommodating portion.
The electronic component container described.