JPS61120500A - Magazine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a magazine that is effective when applied to the storage and transportation of electronic components, such as semiconductor devices.

[Background Art] A finished product of a semiconductor device has a cross-sectional shape corresponding to the package shape of the semiconductor device, and is often transported or stored in a so-called magazine that can store a plurality of semiconductor devices in the length direction.

The reason for storing completed semiconductor devices in magazines is to facilitate transportation and storage of the product, to prevent defects in appearance due to overlapping of glued pins, etc. during transportation, and to prevent external electrical noise. This is to protect the semiconductor device.

By the way, electronic components, especially semiconductor devices, stored in the magazine have the property of being extremely susceptible to electrostatic damage. This property is particularly noticeable in a semiconductor device formed of a package that is less likely to be charged, such as a resin mold package type semiconductor device.

In order to prevent such electrostatic damage to semiconductor devices, it is known to form the magazine by mixing carbon or the like into polyvinyl chloride resin to make it conductive.

However, this hard PVC resin becomes opaque when carbon etc. are mixed in to make it conductive.
Contained products cannot be identified externally with the naked eye.

Therefore, it is conceivable to form a part of the magazine from transparent hard polyvinyl chloride that does not contain carbon, so that product identification can be easily made from the outside with the naked eye.

However, because the magazine is provided with a transparent part that does not contain carbon, the package of the semiconductor device comes into contact with the transparent part during transportation, etc., and this causes the transparent part to become charged, resulting in electrostatic damage to the semiconductor device. It has been revealed by the inventor that the original problem of causing .

By the way, when the magazine accommodates a dual in-line package type semiconductor device, for example, the magazine has a substantially trapezoidal cross-sectional shape, has a mouth-shaped product storage space inside, and has a central part of the bottom facing upward. It is conceivable that a protruding product support surface is formed in the longitudinal direction.

However, magazines with such a cross-sectional shape are unstable when stacked vertically in multiple stages, and as a result, the magazines stacked above may fall and the products contained therein may be damaged. revealed by.

An example of the problem of electrostatic damage in semiconductor devices is the Industrial Research Association, published on January 15, 1980.
"IC Mounting Technology" (Japan Microelectronics Association & I), p.167.

[Object of the Invention] An object of the present invention is to provide a technique for preventing electrostatic damage to electronic components due to charging of the transparent part in a magazine having a transparent part.

Another object of the present invention is to provide a technique that allows semiconductor devices to be transported and stored safely and rationally.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] The outline of typical inventions disclosed in this application is as follows.

That is, the electronic component storage magazine is formed of a conductive material, a transparent part is formed in a part, and an antistatic agent is applied to at least the inner surface of the transparent part to prevent electrostatic damage to the electronic components to be stored. be able to.

In addition, by forming a convex part on the magazine and making the top surface of the convex part a transparent part, it is possible to store electronic components in the magazine without contacting the transparent part. Suppresses the generation of static electricity due to friction in bright areas, reducing static electricity on electronic components! This can prevent damage.

[Embodiment 1] FIG. 1 is a partial perspective view of a magazine according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof.

In the first embodiment, the magazine 1 accommodates a product 2 such as a dual in-line package type semiconductor device 2F.

This magazine 1 has a substantially trapezoidal cross-sectional shape, and is made up of a frame 3 and a transparent section 4. It has a structure in which a mouth-shaped product storage space is formed, and a product support surface 5 is formed in the longitudinal direction with the center part of the bottom surface projecting upward. Furthermore, an antistatic agent 6 is applied to the inner surface of the upper transparent portion 4. The frame 3 of the magazine 1 is manufactured by extrusion molding, for example, plasticine made of polyvinyl chloride resin mixed with carbon, and the transparent part 4 is made of polyvinyl chloride resin. It becomes more.

As described above, according to the first embodiment, the antistatic agent 5 is applied to the inner surface of the transparent part 4, which is easily charged by contact with the product 2. Therefore, the surface of the product 2 and the transparent part 4
(to prevent the generation of static electricity,
Electrostatic damage to the product 2 can be effectively prevented.

[Embodiment 2] FIG. 3 is a sectional view showing a magazine according to another embodiment of the present invention.

The magazine 11 of the second embodiment accommodates a product 12 such as a chip carrier type semiconductor device.

This magazine 11 has a substantially rectangular cross-sectional shape,
It consists of a frame body 13 and a transparent part 14, and a convex part 15 is provided at the center of the upper surface of the frame body 13, and the transparent part 14 is attached to the upper surface of the convex part 15. On the other hand, the bottom surface is provided with a downwardly recessed portion 16, and the width a of the bottom portion of the recessed portion 16 is approximately the same length as the width of the convex portion 15 provided on the top surface of the magazine. The frame body 13 is manufactured by extrusion molding a plastic such as polyvinyl chloride resin mixed with carbon, for example, as in the previous embodiment, and the transparent portion 14 is made of polyvinyl chloride resin.

As described above, according to the second embodiment, since the transparent part 14 is formed on the upper surface of the convex part 15 provided in the magazine 11, when the product 12 is stored in the magazine 11, the transparent part 14 and The product 12 can be maintained in a non-contact state, the generation of static electricity can be prevented, and electrostatic damage to the product 12 can be extremely effectively prevented.

In addition, since the width a of the bottom of the recess 16 provided on the bottom of the magazine 11 is the same as the width of the protrusion 15 on the top of the magazine 11, when the magazines 11 are stacked vertically in multiple stages, The convex portion 15 on the top surface of the magazine 11 fits into the concave portion 16 on the bottom of the magazine 11 stacked thereon.
Stable transportation and storage of magazines is possible without causing any misalignment between magazines.

[Effects] (1) In a magazine for storing electronic components that has a partially transparent part and the other part is made of a conductive material, by applying an antistatic agent to at least the inner surface of the transparent part. The generation of static electricity due to friction between the transparent part and the product can be suppressed, and electrostatic damage to the product can be prevented.

+21.1 By forming the bright part on the top surface of the convex part provided in the magazine, when a product is stored in the magazine,
The transparent part and the product can be maintained in a non-contact state, preventing generation of static electricity and preventing damage to the product due to static electricity.

(3) By forming the bottom width of the recess provided on the bottom of the magazine to be approximately the same length as the width of the protrusion on the top surface of the magazine, when magazines are stacked in multiple stages vertically, the top surface of the magazine can be Since the convex part fits into the concave part at the bottom of the magazines stacked above it, stable transportation and storage of the magazines is possible without causing any misalignment between the magazines.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in Example 1, a case has been described in which the antistatic agent is applied only to the inner surface of the transparent portion, but the present invention is not limited to this, and the antistatic agent may be applied to the entire inner surface of the magazine.

In addition, in Example 2, as in Example 1, an antistatic agent was coated at least on the transparent part.
.

It may be.

Furthermore, in the embodiment, a magazine for accommodating a dual in-line cage type semiconductor device or a chip carrier type semiconductor device has been described.1. <The shape of the socket is not limited to this, and may be a magazine that accommodates any semiconductor device, such as a flat package type.

[Field of Application] In the above description, the invention made by the present inventor has been mainly applied to the field of application which is the background thereof, which is the field of application, which is the background of the invention, but the invention is not limited to this. It is not a technology that is effective when applied to magazines that house other electronic components.

A detailed explanation of the open plane. Fig. 1 is a partial perspective view showing a magazine according to the first embodiment of the present invention. Fig. 2 is a sectional view showing a magazine according to the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing the magazine according to the first embodiment of the present invention. FIG. 3 is a sectional view showing a magazine according to a second embodiment of the present invention.

l・・Magazine, 2...Product, 3...°Outer frame, 4
...Transparent part, 5...Product support surface, 6...Antistatic agent, 11...Magazine, 12...Product, 13...
Frame body, 14... Transparent part, 15... Convex part, 16...
recess.

Claims (1)

[Claims] 1. A magazine for storing electronic components, which has a transparent part in part, and the other parts are made of a conductive material, and at least the inner surface of the transparent part is coated with an antistatic agent. A magazine for storing electronic components. 2. The electronic component storage magazine according to claim 1, wherein the transparent portion is formed on the upper surface of a convex portion provided on the magazine. 3. The transparent part is formed on the upper surface of a convex part provided in the magazine, and a concave part is formed on the inner side of the convex part facing the outside, and the width of the bottom of the concave part is such that the width of the convex part is The magazine for storing electronic components according to claim 1, characterized in that the magazine has a width that is approximately the same as the width of the section.