JPS6264759A - Tray for semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] iPa Tray for semiconductor devices.

□ ・Detailed description of the invention [[Technical field] 1 = 1'' The present invention relates to semiconductor devices (hereinafter simply referred to as IC).
): 1°J/IC1 This is a tray for storing SO, such as FP (7-rat package), and is especially applicable to ICs with narrow lead widths such as flat type 1°JP (Small Outline Package). 1. Concerning effective techniques.

[Background technology]

Electronic components such as ICs, especially flat type ICs that have external leads around the package body, use trays as jigs for transporting between multiple manufacturing processes or as final products. These trays are used to transport and stock ICs at once. Such a tray is known from Japanese Patent Application Laid-Open No. 58-91700. However, in such a tray, although it is true that the IC does not move in the vertical and horizontal directions once within the recess, there is no solution to the lead bending that occurs when the IC moves in the vertical direction. Therefore, the inventors of the present invention have conducted intensive studies to provide a tray that can more effectively prevent lead bending.

[Object of the Invention] An object of the present invention is to provide a jig that can prevent the occurrence of lead bending.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, by allowing the external leads of the IC to be supported and housed while being separated from the four sides and bottom of the tray, the external leads will not collide with the inner surface of the recess, thereby preventing deformation of the external leads. be.

〔Example〕

The first is a plan view of a tray that is one embodiment of the present invention;
The figure is an enlarged view of the main part of FIG. 1, FIG. 3 is a sectional view taken along the line I--II of FIG. 2, and FIG. 4 is a plan view of the IC used in this embodiment.

Hereinafter, it will be explained in detail using the drawings. The tray 10 is formed by hot pressing a thin resin plate, for example, by ICI 1 (
A plurality of recesses 12 are formed for accommodating the
In addition, projections 16 are formed to support the four corners of the base 14 in which the pellet 13 is sealed and to allow the external lead 15 to be separated from the bottom and side surfaces of the recess 12. Further, this protrusion 16 has grooves 1 that fit into and fix the four corners of the base body 14.
7 is formed so that the opening side (upper side) is wide and the recess bottom side (lower side) is narrow.

The width and depth of the four parts 12 are as follows: ICI 1 is the protrusion 16.
The base 14 and the external lead 1 are completely connected to each other while being supported and fixed to the
5 is considered to be accommodated.

Reference numeral 18 denotes a push-up hole formed on the bottom surface of the tray so that the ICI 1 accommodated in the tray can be easily taken out.

Next, the effect will be explained. ICI in the recess of tray 1o
1 is placed, the four corners of the base 14 are aligned with the grooves 17 of the projections 16.
to fit. This groove 17 is wide at the top and narrow at the bottom, making it easy to fit and securely fixed. Furthermore, the fixed ICII is connected to lead 15.
is completely separated from the inner surface of the recess and is not in contact with it.

Therefore, even if this tray 10 is used for transportation, the ICI
1 is loose in the concave portion 12 of the tray JO, so that bending of the lead does not occur.

〔effect〕

(1) By providing protrusions in the recess of the tray to support the four corners of the IC base and to separate the leads from the side and bottom surfaces of the recess, the impact applied to the leads can be reduced. can get.

(2) Protrusions are provided in the recess of the tray to support the four corners of the IC base and to separate the leads from the side and bottom surfaces of the recess, and grooves are formed in the projections to fit with the four corners of the base. As a result, the IC leads can be fixed within the recess while being completely separated from the inner surface, resulting in the effect that bending of the leads can be completely prevented.

(3) By forming the groove formed in the protrusion so that the upper side is wider and the lower side is narrower, the IC can be inserted into the recess (and securely fixed). Although the invention has been specifically explained based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist of the invention. For ICs with leads protruding from four directions, it is most effective to provide protrusions at the four corners, but for ICs with leads protruding from two directions, protrusions should be provided on the other two sides that do not protrude from the leads. A protrusion may be formed.Furthermore, the groove formed in the protrusion may have any shape as long as it can fit into the corner of the base.

Furthermore, the tray of the present invention is not only useful for transporting finished ICs (e.g., for aligning ICs after lead cutting).

It can be used in lead soldering process or visual inspection.

[Application field]

The above explanation mainly describes the invention made by the present inventor, which is the application field of the flant type I.
Although the case where the present invention is applied to a C tray has been described, the present invention is not limited thereto (, □ For example, the present invention can also be applied to other package-shaped ICs (chip carrier, pin grid array, etc.).

[Brief explanation of drawings]

FIG. 1 is a plan view of a tray that is an embodiment of the present invention, FIG. 2 is an enlarged view of the main parts of the tray in FIG. 1, and FIG. 4 is a plan view of an IC that can be used in this embodiment. 10... Tray, 11... IC, 12... Recessed part,
13...Bellet, 14...Base, 15...External lead (lead), 16...Protrusion, 17...Groove, 1
8... Hole for pushing up. Figure 2

Claims (1)

[Scope of Claims] 1. In a tray in which a recess is formed to house a semiconductor device having a base and an external lead protruding from the base, a part of the base is supported in the recess, and the external lead is provided in the recess. A tray for a semiconductor device, characterized in that a protrusion is formed that can be separated from a side surface and a bottom surface. 2. The tray for a semiconductor device according to claim 1, wherein the protrusion is formed at a corner of the recess, and grooves are provided for fitting and fixing the protrusion to the four corners of the base.