JPS6233346Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a semiconductor device in which a semiconductor element is mounted on a package, and more specifically relates to a structure of a package in which the leads at the four corners of the package are made higher than the remaining leads. .

In a plug-in type semiconductor package, if the surface on which the element (die or chip) is mounted and the surface on which wire bonding is performed (the surface on which the metallized pattern is arranged) are on the same plane, that is, the surface on which the element should be mounted. However, if the recess is not formed, in a semi-finished product in which a wire is connected between the element and the metallized pattern, the wire or the element may come into contact with another article and damage either or both of them. be.
The present invention solves the above-mentioned problems experienced in the prior art, and it is possible to insert the leads to be placed in at least four corners of the package into the package when the leads are inserted and the predetermined process is completed. The part of the lead that protrudes above the base surface is designed to protrude higher than the height of the element and connected wires, so that even if the package is accidentally turned over, the element and wire are protected by the protruding part of the lead. It is something that will be done. An embodiment of the present invention will be described below using the accompanying drawings as an example.

1 and 2 show a plan view and a partially cut-away sectional view of a plug-in package according to the prior art. Package base 1 made of ceramic
A series of metallized patterns 2 are formed on the upper surface. A lead insertion hole 3 is formed at the end of each metallized pattern 2 adjacent to the outer edge of the package. Illustrated package base 1
In this case, no recess is formed for mounting the element 5, and as shown in the cross-sectional view, the element mounting surface and the wire bonding surface are on the same plane.
The element 5 and the metallized pattern are connected by a wire 6 as shown. To attach the lead 4, the lead 4 is inserted into the insertion hole 3, brazed, and plated. The cross-sectional view in FIG. 2 is along the - line in FIG. 1, with leads omitted except for those at the four corners.

The package shown in Figures 1 and 2 is a semi-finished product, which must be moved to the next process, such as packaging. If the package is accidentally turned over during handling, it is obvious that the element 5 and the wire 6, which are, so to speak, naked and exposed to the outside, will be damaged. The present invention is directed to a package structure which protects the element 5 and the wire 6 even in such a case.

Fig. 3 is a plan view of a semiconductor device in which a semiconductor element is mounted on a plug-in type package with leads attached according to the present invention, and Fig. 4 is along the - line in Fig. 3, with leads attached to the four corners in each case. FIG. In the figure, the element 5 and the metallized pattern 2 are connected by the wire 6 as described above. According to this invention,
Leads 4C to be inserted into the metallized pattern 2C at at least four corners (the lead insertion portions are shaded) are designed to have different lengths from the other leads 4 as follows. After the lead 4C is mounted in the same manner as described above, its upwardly projecting portion of the package base 1 is set to be higher than either the element 5 or the lead 6.
In the illustrated embodiment, the height h of the wire 6
is higher than the height of element 5, which is 0.8 mm,
The height H of the lead 4C from the surface of the package base 1 was set to 1.6 mm. With this structure, even if the semiconductor device is turned over from the state shown in FIG. Because it is located inside, it cannot be damaged.

As can be understood from the above explanation, according to the present invention, the leads to be attached to at least four corners of the package can be arranged such that the length of the part protruding from the surface of the package base is the height of the element or the wiring wire. The element and the connecting wires can be protected without adding any additional process compared to the conventional process, simply by setting the height to be approximately twice as high as the previous process. In addition, although the embodiment described the lead attached to the four corners of the package cage, for example, if the package cage is rectangular or one part is heavier than the other part, it may be necessary to attach the lead to the long side or the heavy part. The lead to be attached may be designed to be longer as described above. As described above, in the semiconductor device according to the present invention, the element mounted on the package and the element and the metallized pattern can be connected without adding any additional process to the conventional process and without adding any special protective member. wires are protected against accidental damage during handling of the package.

[Brief explanation of the drawing]

Figure 1 is a plan view of a conventional plug-in package, Figure 2 is a sectional view taken along the - line in Figure 1, with leads omitted except for the leads at the four corners of the package, and Figure 3 is a cross-sectional view taken along the - line in Figure 1. FIG. 4 is a plan view of a semiconductor device having a structure according to the present invention, and is a sectional view taken along the line , in FIG. 3, with leads other than those at the four corners of the package omitted. 1...Package base, 2...Metallized pattern, 2C...Metallized pattern at four corners of package, 3...Lead insertion hole, 4...Lead, 4
C...Reeds attached to the four corners of the pack cage, 5
...Element, 6...Wire for connection.

Claims (1)

[Claims for Utility Model Registration] A semiconductor element mounted on the surface of a package base, a plurality of leads that penetrate the base and lead out to the back side of the base, and a semiconductor element connected to the leads and formed on the surface of the base. It has a metallized pattern and a connecting wire that connects the metallized pattern and the element, and the height of the portion of the lead formed at least at the four corners of the base that protrudes above the surface of the base is determined by the connecting wire. A semiconductor device characterized by being approximately twice as high as the height of the semiconductor device.