JPH11152164A - Emboss-carrier type taping, emboss-carrier tape and packaging method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a mounting terminal of a semiconductor device from being damaged and contaminated when the semiconductor device is transported in a form of a taping. SOLUTION: A semiconductor device of a BGA type package is placed in a recess 11 of an emboss-carrier tape 10, with mounting terminals 2 being oriented upwards. A top cover tape 8 is bonded to the upper surface of the tape 10 to form a taping. The recess 11 of the tape 10 comprises a square portion in conformity with the shape of the semiconductor device to be placed and an extended portion 11a is provided at least on each of the opposite sides of the square portion so as to be in contact with the square portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
(ball grid array) shape and LGA (land grid array)
TECHNICAL FIELD The present invention relates to a taping (packing body) in which a surface-mounted semiconductor device having a shape package is stored in an embossed carrier tape, an embossed carrier tape suitable for packing these semiconductor devices, and a method for packing these semiconductor devices.

[0002]

2. Description of the Related Art Surface mount semiconductor devices are often
It is stored in a tray or shipped in the form of an embossed carrier type taping, and the user mounts them on an automatic mounting apparatus. As shown in FIG. 3, the tray has a large number of rectangular recesses (pockets) 41 provided in a matrix. As shown in FIG. 4, in the embossed carrier type taping, a large number of recesses (pockets) 5 are arranged in a row via a spacing portion 6, and a semiconductor device is provided in a recess 5 of an embossed carrier tape 4 having a feed hole 7 in a peripheral edge portion. And a top cover tape 8 is adhered to the upper surface of the embossed carrier tape 4 to cover the concave portion 5. This is usually wound around a reel 9 and put in a decorative box such as a cardboard box. Ship.

[0003] When a surface-mount type semiconductor device is mounted by an automatic mounting apparatus, it is generally possible to mount the material in a form of an embossed carrier type taping at a much higher speed than in a tray. Shipments of embossed carrier taping are increasing. On the other hand, a package of a semiconductor device is desired to be smaller, highly integrated, and highly functional. In recent years, BGA type packages and packages similar to the BGA type (for example, LGA type) have been increasing.

A conventional example in which a semiconductor device such as a BGA type package is housed in an embossed carrier tape will be described with reference to the drawings. 5A and 5B are a schematic top view and a cross-sectional view showing a first conventional example, where FIG. 5A is a top view and FIG. 5B is a cross-sectional view. 4, the same components as those in FIG. 4 are denoted by the same reference numerals. 1 is a package body of a semiconductor device, 2
Is the mounting terminal of the semiconductor device (solder ball in this example),
Reference numeral 20 denotes an embossed carrier tape, and reference numeral 21 denotes a rectangular recess (pocket) formed on the embossed carrier tape 20 according to the shape of the semiconductor device to be housed. In the semiconductor device of this example, mounting terminals 2 are arranged on substantially the entire surface of the back surface of the package body 1 except for a small margin at the periphery thereof. A step 21 a for supporting the semiconductor device at the peripheral edge of the package body 1 is provided on the side surface of the concave portion 21.

In this embossed carrier type taping, a semiconductor device is housed in each recess 21 of an embossed carrier tape 20 with its mounting terminals 2 facing downward, and a top cover tape 8 is attached thereto. The semiconductor device is supported by the step portion 21 a at the peripheral edge of the package body 1, and the mounting terminal 2 does not contact the bottom of the concave portion 21.

FIG. 6 is a schematic sectional view showing a second conventional example. 4, the same components as those in FIG. 4 are denoted by the same reference numerals. Reference numeral 30 denotes an embossed carrier tape, and 31 denotes a rectangular recess (pocket) formed on the embossed carrier tape 30 according to the shape of the semiconductor device to be housed. In this example, the mounting terminals 2 are provided on substantially the entire back surface of the package body 1 of the semiconductor device, and there is no room at the peripheral edge.
Because it can not be supported by the step like the above example,
The semiconductor device is housed so that the mounting terminals 2 come into contact with the bottom of the recess 31.

[0007]

However, in a taping in which a semiconductor device in which mounting terminals are provided on substantially the entire back surface of a package as described above is housed in an embossed carrier tape with the mounting terminals facing down, Impacts may cause the mounting terminals (solder balls, etc.) to fall off or be damaged during transport, and carbon or the like added or applied to the embossed carrier tape for antistatic may adhere to the mounting terminals (especially Further, there is a problem that the appearance of the mounting terminal cannot be inspected after taping.

The present invention solves such a problem and improves the mounting reliability of a semiconductor device in which mounting terminals are provided on substantially the entire back surface of a package. It is an object to provide a carrier tape and a method for packing a semiconductor device.

[0009]

According to the present invention, there is provided a semiconductor device in which mounting terminals are provided on a lower surface of a package in a recess for storing articles of an embossed carrier tape. An embossed carrier type taping is provided in which the arrangement side is housed upward and a top cover tape is stuck on an upper surface of the embossed carrier tape.

In the present invention, in the embossed carrier tape in which the concave portions are arranged in a row, the concave portions are each formed of one of an article storage portion adapted to the shape of the article to be stored and a side surface of the article storage portion facing the side. The embossed carrier tape has at least one pair of overhanging portions, which project outwardly, and have at least a pair of overhanging portions that allow a chuck for holding the article when the article is stored in the article storage section.

The present invention also relates to a method of packing a semiconductor device in which mounting terminals are provided on a lower surface of a package, wherein the semiconductor device is provided in the concave portion of an embossed carrier tape in which concave portions for storing articles are arranged. A method of packing a semiconductor device, comprising: a step of housing the device with the mounting terminal arrangement side facing upward; and a step of attaching a top cover tape to an upper surface of the embossed carrier tape housing the semiconductor device.

That is, since the semiconductor device is stored with its mounting terminals facing upward, the mounting terminals come into contact only with the top cover tape made of a flexible and transparent plastic film, and the mounting terminals are not damaged. In addition to being hard to receive, the appearance inspection of the mounting terminal in the state of taping becomes possible.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are a schematic top view and a schematic sectional view showing an embodiment of the present invention, wherein FIG. 1A is a top view, and FIG.
Is a sectional view. In FIG. 1, reference numeral 1 denotes a package body of the semiconductor device, and 2 denotes a mounting terminal (solder ball in this example) of the semiconductor device 1. In the semiconductor device of this example, mounting terminals 2 are provided on substantially the entire back surface of the package body 1. Reference numeral 8 denotes a top cover tape, which is composed of a multilayer product of a transparent plastic film such as PET and polyethylene. In some cases, an adhesive is applied to the peripheral portion.

Reference numeral 10 denotes an embossed carrier tape.
It is a molded article of plastic such as VC, PET, and polycarbonate. Usually, carbon powder is mixed in or carbon coating is applied to prevent static electricity. The embossed carrier tape 10 has recesses (pockets) 11 for accommodating the semiconductor device formed at a constant pitch via the interval 6. 7 is a feed hole.

The concave portion 11 is a rectangular concave portion conforming to the shape of the semiconductor device to be housed. In this example, a projecting portion 11a is provided at the center of each side. this is,
When the semiconductor device to be housed is held by the mechanical chuck 3 as shown in FIG.
When the semiconductor device is housed with its mounting terminal 2 facing upward, the holding of the semiconductor device may be unstable by suction using a vacuum chuck. Therefore, an overhanging portion 11a is provided on the assumption that a mechanical chuck is used. It is. Therefore, if the semiconductor device to be housed can be adsorbed by the vacuum chuck, the overhang 11a is unnecessary. Further, the embossed carrier tape 10 may be provided not on all four sides but only on two opposing sides in either the width direction or the longitudinal direction of the embossed carrier tape 10 (that is, only one pair may be provided).

To package a semiconductor device as such an embossed carrier type taping, the semiconductor device is housed in each recess 11 of the embossed carrier tape 10 with the mounting terminals 2 facing upward, and the top cover tape 8 Is adhered by heat sealing or pressure sealing. Since the top cover tape 8 is transparent, it is possible to perform an appearance inspection (displacement of arrangement, variation in height, etc.) of the mounting terminals 2 in this form. Then, it is wound up on a reel and further put in a decorative box such as cardboard for shipment.

The present invention is not limited to the above examples,
Further, various modifications can be made.

[0018]

As described above, according to the present invention,
Prevents damage and contamination of mounting terminals during transportation, and enables visual inspection of mounting terminals after taping, even if the semiconductor device to be housed has mounting terminals arranged on almost the entire back surface of the package. An embossed carrier type taping, an embossed carrier tape, and a method of packing a semiconductor device can be provided, which contributes to improvement in reliability of semiconductor device mounting.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a taping of the present invention.

FIG. 2 is a schematic cross-sectional view showing chucking by a mechanical chuck.

FIG. 3 is a perspective view showing a tray.

FIG. 4 is a perspective view showing an embossed carrier type taping.

FIG. 5 is a schematic diagram showing a first conventional example.

FIG. 6 is a schematic sectional view showing a second conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 package body 2 mounting terminal 3 mechanical chuck 4, 10, 20, 30 embossed carrier tape 5, 11, 21, 31 concave portion 6 interval portion 7 feed hole 8 top cover tape 9 reel 11 a overhang portion 21 a step portion

Claims (4)

[Claims] 1. A semiconductor device having a mounting terminal disposed on a lower surface of a package in a recess for storing articles of an embossed carrier tape, the semiconductor device having the mounting terminal disposed side facing upward, and a semiconductor device having the mounting terminal disposed thereon facing upward. An embossed carrier type taping, characterized in that a top cover tape is adhered to the tape. 2. An embossed carrier tape in which recesses are arranged in a row, wherein the recesses have an article storage portion adapted to the shape of an article to be stored, and a part of each of opposing side surfaces of the article storage portion projects outward. An embossed carrier tape, comprising: at least a pair of overhanging portions, which serve as escapes of a chuck for holding the article when the article is stored in the article storage section. 3. A method for packing a semiconductor device, wherein mounting terminals are provided on a lower surface of a package, the semiconductor device being placed in a recess for storing articles of an embossed carrier tape, with the mounting terminal mounting side facing upward. A method for packing a semiconductor device, comprising: a step of housing; and a step of attaching a top cover tape to an upper surface of the embossed carrier tape housing the semiconductor device. 4. The method according to claim 3, further comprising the step of performing a visual inspection of mounting terminals of the semiconductor device housed in the recess while the top cover tape is adhered to an upper surface of the embossed carrier tape. Semiconductor device packaging method.