KR100825491B1 - Carrier tape having plural row pocket - Google Patents

Carrier tape having plural row pocket Download PDF

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Publication number
KR100825491B1
KR100825491B1 KR1020060084826A KR20060084826A KR100825491B1 KR 100825491 B1 KR100825491 B1 KR 100825491B1 KR 1020060084826 A KR1020060084826 A KR 1020060084826A KR 20060084826 A KR20060084826 A KR 20060084826A KR 100825491 B1 KR100825491 B1 KR 100825491B1
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South Korea
Prior art keywords
carrier tape
pocket
row
tape
electronic component
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KR1020060084826A
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Korean (ko)
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KR20080021422A (en
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남창원
배종현
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(주)코스탯아이앤씨
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Priority to KR1020060084826A priority Critical patent/KR100825491B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)

Abstract

내부에 더욱 많은 물량의 전자부품을 담을 수 있는 다열 포켓을 갖는 캐리어 테이프에 관해 개시한다. 이를 위해 본 발명은 톱니바퀴 홀이 형성된 캐리어 테이프 본체와, 상기 캐리어 테이프 본체 중앙에 형성되고 전자부품이 담겨지는 포켓으로 이루어진 전자부품 포장을 위한 캐리어 테이프에 있어서, 상기 포켓은 2개 이상의 다열인 것을 특징으로 하는 다열 포켓을 갖는 캐리어 테이프를 제공한다. Disclosed is a carrier tape having a multi-row pocket that can contain a larger amount of electronic components therein. To this end, the present invention provides a carrier tape for packaging an electronic component consisting of a carrier tape body having a gear hole formed therein and a pocket formed at the center of the carrier tape body in which electronic components are contained, wherein the pockets are two or more rows. A carrier tape having multiple rows of pockets is provided.

캐리어 테이프, 다열, 포켓, 받침대, 접착테이프. Carrier tape, row, pocket, base, adhesive tape.

Description

다열 포켓을 갖는 캐리어 테이프{Carrier tape having plural row pocket}Carrier tape having plural row pocket

도 1은 일반적으로 반도체 패키지가 운반되는 과정을 설명하기 위한 사시도이다.1 is a perspective view illustrating a process in which a semiconductor package is generally transported.

도 2는 종래 기술에 의한 캐리어 테이프를 설명하기 위한 평면도이다.2 is a plan view for explaining a carrier tape according to the prior art.

도 3은 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프를 설명하기 위한 평면도이다.3 is a plan view for explaining a carrier tape having a multi-row pocket according to a preferred embodiment of the present invention.

도 4는 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프에서 포켓 내부의 구조를 설명하기 위한 분해 사시도이다.4 is an exploded perspective view for explaining the structure inside the pocket in a carrier tape having a multi-row pocket according to a preferred embodiment of the present invention.

도 5는 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프에 전자부품이 탑재되는 형태를 설명하기 위한 사시도이다.5 is a perspective view for explaining the form in which the electronic component is mounted on a carrier tape having a multi-row pocket according to a preferred embodiment of the present invention.

본 발명은 반도체 패키지 제조공정에 사용되는 소재에 관한 것으로, 더욱 상세하게는 반도체 패키지와 같은 전자부품의 포장에 사용되는 캐리어 테이프(carrier tape)에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to materials used in semiconductor package manufacturing processes, and more particularly, to carrier tapes used for packaging electronic components such as semiconductor packages.

반도체 칩 상태에서 반도체 패키지와 같은 전자 부품으로 조립이 완료되면, 이를 사용자에게 안전하게 전달하기 위해 여러 가지 형태의 포장재가 사용된다. 이러한 포장재로 가장 일반적으로 사용되는 것이 캐리어 테이프이다. 상기 캐리어 테이프는 반도체 패키지와 같은 전자부품을 내부에 형성된 포켓(pocket)에 담아 반도체 패키지가 취급 혹은 이송 중에 외부의 충격으로부터 보호되게 하는 역할을 수행한다.When the assembly is completed with an electronic component such as a semiconductor package in a semiconductor chip state, various types of packaging materials are used to safely deliver it to a user. The carrier tape is most commonly used as such a packaging material. The carrier tape holds electronic components such as semiconductor packages in pockets formed therein to protect the semiconductor packages from external shocks during handling or transportation.

도 1은 일반적으로 반도체 패키지가 운반되는 과정을 설명하기 위한 사시도이다.1 is a perspective view illustrating a process in which a semiconductor package is generally transported.

도 1을 참조하면, 외부 충격에 리드(lead)와 같은 반도체 패키지의 일부가 예민하게 손상되는 QFP(Quad Flat Package)와 같은 반도체 패키지는 캐리어 테이프(53)에 오목한 형상으로 만들어진 포켓(57)에 담겨진다. 그 후 포켓(57) 상부는 커버 테이프(55)에 의해 밀봉 처리되어 취급된다. 그 후, 릴(reel, 51)에 감겨져 사용자에게 전달되고, 사용자는 반도체 패키지를 인쇄회로기판(PCB) 등에 실장하기 위해 상기 커버 테이프(55)를 다시 떼어내서 커버 테이프(55)의 포켓(57) 내부에 있는 반도체 패키지를 꺼내 사용하게 된다. 도면에서 참조부호 59는 톱니바퀴형 구멍(sprocket hole)으로써, 캐리어 테이프(53)를 감거나 풀 때, 혹은 커버 테이프(55)를 붙이거나 떼어낼 때 사용하게 된다. 또한 참조부호 65는 포켓(57) 내부로 공기가 자유롭게 드나들 수 있도록 형성된 중앙홀(center hole)을 가리킨다.Referring to FIG. 1, a semiconductor package such as a quad flat package (QFP), in which a part of a semiconductor package such as a lead is sensitively damaged by an external impact, is formed in a pocket 57 formed in a concave shape in a carrier tape 53. Is contained. Thereafter, the upper portion of the pocket 57 is sealed by the cover tape 55 and handled. Then, it is wound on a reel 51 and delivered to the user, and the user detaches the cover tape 55 again to mount the semiconductor package on a printed circuit board (PCB) or the like, and then pockets 57 of the cover tape 55. The semiconductor package inside is taken out and used. In the figure, reference numeral 59 is a sprocket hole, which is used when winding or unwinding the carrier tape 53 or when attaching or detaching the cover tape 55. Also, reference numeral 65 denotes a center hole formed so that air can freely flow into the pocket 57.

도 2는 종래 기술에 의한 캐리어 테이프를 설명하기 위한 평면도이다.2 is a plan view for explaining a carrier tape according to the prior art.

도 2를 참조하면, 기존에 사용하고 있는 캐리어 테이프(53)의 포켓(57)은, 전자부품의 크기가 소형인 경우에도 획일적으로 캐리어 테이프(53) 내에 1 열(row) 로 담겨져 포장된다. 따라서 캐리어 테이프의 폭(width)을 효율적으로 사용하지 못하고, 내부에 보다 많은 반도체 패키지를 포장하는 것이 부족한 문제점이 있다.Referring to FIG. 2, the pocket 57 of the carrier tape 53 that is used in the past is uniformly packed in one row in the carrier tape 53 even when the size of the electronic component is small. Therefore, there is a problem that it is not possible to efficiently use the width of the carrier tape, and to pack more semiconductor packages therein.

본 발명이 이루고자 하는 기술적 과제는 상술한 문제점들을 해결할 수 있도록 캐리어 테이프 내에 보다 많은 전자부품을 담아서 포장하는 것이 가능하고, 커버 테이프를 사용하지 않아도 되는 다열 포켓을 갖는 캐리어 테이프를 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a carrier tape having a multi-row pocket capable of packaging more electronic components in a carrier tape so as to solve the above problems and without using a cover tape.

상기 기술적 과제를 달성하기 위해 본 발명에 의한 다열 포켓을 갖는 캐리어 테이프는, 톱니바퀴 홀이 형성된 캐리어 테이프 본체와, 상기 캐리어 테이프 본체 중앙에 형성되고 전자부품이 담겨지는 포켓으로 이루어진 전자부품 포장을 위한 캐리어 테이프에 있어서, 상기 포켓은 2개 이상의 다열인 것을 특징으로 한다. In order to achieve the above technical problem, a carrier tape having a multi-row pocket according to the present invention includes a carrier tape body having a gear hole formed therein, and an electronic component packaging comprising a pocket formed at the center of the carrier tape body and containing electronic components. In the carrier tape, the pocket is characterized by two or more rows.

본 발명의 바람직한 실시예에 의하면, 상기 다열 포켓의 열(row) 사이에는 커버 테이프이 접착되는 공간이 마련된 것이 적합하다.According to a preferred embodiment of the present invention, a space in which the cover tape is adhered is suitably provided between rows of the multi-row pockets.

또한 본 발명의 바람직한 실시예에 의하면, 상기 포켓은 전자부품이 놓이는 받침대(pedestal)가 있고 상기 받침대 위에는 전자부품을 고정시키기 위한 접착테이프가 형성된 것이 적합하다.According to a preferred embodiment of the present invention, the pocket has a pedestal on which the electronic component is placed and an adhesive tape for fixing the electronic component is suitable on the pedestal.

바람직하게는, 상기 캐리어 테이프 본체는 그 폭이 8, 12, 16, 24㎜중에 하나인 것이 적합하며, 상기 캐리어 테이프 본체는 1 X E5 ~ 1 x E11 Ω/sq 범위의 전기 저항값을 갖는 고분자 수지조성물인 것이 적합하다. Preferably, the carrier tape body is suitably one of 8, 12, 16, 24 mm in width, the carrier tape body is a polymer having an electrical resistance value in the range of 1 X E5 ~ 1 x E11 kW / sq It is suitable that it is a resin composition.

본 발명에 따르면, 캐리어 테이프 내에 다열 포켓을 형성하여 캐리어 테이프 내에 보다 많은 개수의 전자부품을 포함시켜 포장하는 것이 가능하고, 포켓 내부에 별도의 받침대와 접착테이프를 설치하여 커버 테이프를 사용하지 않고도 반도체 패키지를 포장할 수 있다.According to the present invention, a multi-row pocket can be formed in the carrier tape to include a larger number of electronic components in the carrier tape and can be packaged, and a separate pedestal and adhesive tape can be installed inside the pocket without using a cover tape. Package can be packed.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 그러나, 아래의 상세한 설명에서 개시되는 실시예는 본 발명을 한정하려는 의미가 아니라, 본 발명이 속한 기술분야에서 통상의 지식을 가진 자에게, 본 발명의 개시가 실시 가능한 형태로 완전해지도록 발명의 범주를 알려주기 위해 제공되는 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments disclosed in the following detailed description are not meant to limit the present invention, but to those skilled in the art to which the present invention pertains, the disclosure of the present invention may be completed in a form that can be implemented. It is provided to inform the category.

도 3은 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프를 설명하기 위한 평면도이다.3 is a plan view for explaining a carrier tape having a multi-row pocket according to a preferred embodiment of the present invention.

도 3을 참조하면, 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프(100)는, 톱니바퀴 홀(112)이 형성된 캐리어 테이프 본체(102)와, 상기 캐리어 테이프 본체(102)의 중앙에 형성되고 반도체 패키지와 같은 전자부품이 담겨지는 포켓(104A, 104B)으로 이루어진다. 이때, 본 발명에 의한 캐리어 테이프(100)는 상기 포켓(104)이 보다 많은 전자부품을 담기 위하여 1열이 아닌 2열 이상의 다열인 특징이 있다. 도 3의 실시예는 2열인 것을 예시적으로 나타냈으나, 이는 3열 혹은 그 이상으로 열로 변형 적용이 가능하다.Referring to FIG. 3, a carrier tape 100 having a multi-row pocket according to a preferred embodiment of the present invention includes a carrier tape main body 102 having a gear hole 112 and a center of the carrier tape main body 102. And pockets 104A and 104B formed therein and containing electronic components such as semiconductor packages. At this time, the carrier tape 100 according to the present invention is characterized in that the pocket 104 is not more than one row, but more than two rows in order to contain more electronic components. 3 exemplarily shows two rows, but it is possible to apply deformation to columns in three rows or more.

상기 캐리어 테이프 본체(102)는 고분자 수지 조성물로서 전자부품에 정전기에 의한 손상을 방지하기 위해 1 X E5 -1 x E11Ω/sq 범위의 표면 저항값을 갖는 것이 적합하다. 또한 상기 캐리어 테이프 본체(102)는 그 폭(W)이 비교적 작은 캐리어 테이프로서 8, 12, 16, 24㎜중에 하나인 것이 적합하다.The carrier tape body 102 is preferably a polymer resin composition having a surface resistance value in the range of 1 × E5 −1 × E11 μs / sq to prevent damage to the electronic component by static electricity. In addition, the carrier tape main body 102 is suitably one of 8, 12, 16, and 24 mm as a carrier tape whose width W is relatively small.

한편, 본 발명의 바람직한 실시예에 의한 캐리어 테이프(100)에 커버 테이프이 부착될 경우, 캐리어 테이프(100)의 양쪽 가장자리와 포켓(104)의 열과 열 사이(도면의 110)에 커버 테이프가 부착되는 공간이 마련된 것이 적합하다. 따라서 캐리어 테이프(102) 내에서 커버 테이프가 부착되는 공간은, 캐리어 테이프(102) 내부에 형성된 열 + 1이 된다. 도면에서는 2개의 포켓(104)열이 형성되었기 때문에 2+1로서 3개의 영역(111A, 111, 111B)에 커버 테이프가 부착된다. 상기 톱니바퀴 홀(112)은 도면에는 상부에 하나의 열로 형성되었으나, 이는 하부의 110B 영역에 하나의 열이 더 추가된 형태로 변형될 수 있다.On the other hand, when the cover tape is attached to the carrier tape 100 according to a preferred embodiment of the present invention, the cover tape is attached between both edges of the carrier tape 100 and the rows and columns of the pocket 104 (110 in the drawing) It is suitable that space is provided. Therefore, the space where the cover tape is attached in the carrier tape 102 becomes heat + 1 formed in the carrier tape 102. In the figure, since two pockets 104 rows are formed, the cover tape is attached to three regions 111A, 111, and 111B as 2 + 1. The gear hole 112 is formed in one row at the top in the drawing, but this may be modified in a form in which one row is further added to the bottom 110B region.

도 4는 본 발명의 바람직한 실시예에 의한 다열 포켓을 갖는 캐리어 테이프에서 포켓 내부의 구조를 설명하기 위한 분해 사시도이고, 도 5는 전자부품이 탑재되는 형태를 설명하기 위한 사시도이다.4 is an exploded perspective view for explaining a structure inside a pocket in a carrier tape having a multi-row pocket according to a preferred embodiment of the present invention, Figure 5 is a perspective view for explaining the form in which the electronic component is mounted.

도 4 및 도 5를 참조하면, 본 발명에 의한 다열 포켓을 갖는 캐리어 테이프(100)는 포켓(104내부에 별도의 받침대(pedestal, 108)를 형성하고, 상기 받침대(108)에 접착 테이프(110)를 설치하여 커버 테이프를 사용하지 않아도 되는 캐리어 테이프의 형태로 변형이 가능하다. 즉, 도 3은 내부 담겨진 반도체 패키지와 같은 전자부품(120)을 위에서 커버 테이프가 밀봉하는 형태로 포장하였으나, 도 4 및 도 5와 같이 포켓(104A, 104B) 내부에 있는 접착테이프(110)가 전자부품(120)의 밑면에 부착되어 고정하는 방식으로 변형할 수 있다.4 and 5, the carrier tape 100 having the multi-row pocket according to the present invention forms a separate pedestal 108 inside the pocket 104, and the adhesive tape 110 on the pedestal 108. 3) can be modified in the form of a carrier tape that does not require the use of a cover tape, that is, while FIG. 3 shows an electronic component 120 such as a semiconductor package contained therein in a form in which a cover tape is sealed from above. As shown in FIG. 4 and FIG. 5, the adhesive tape 110 inside the pockets 104A and 104B is attached to the bottom surface of the electronic component 120 and fixed in a manner of fixing.

상기 접착 테이프(110)는 양면 접착테이프로서 전자부품(120)이 붙는 윗면과 받침대(108)와 붙는 아랫면이 각각 존재할 수 있다. 이때, 상기 양면 접착 테이프(110)의 접착력은 윗면보다 아랫면이 더욱 강하게 설계되어 전자부품(120)을 떼어낼 때, 접착 테이프(110)가 동시에 떨어지는 것을 방지할 수 있다. 또한 도면에서 참조부호 106은 중앙홀을 가리키고, 112는 톱니바퀴 홀을 가리키고, 130은 전자부품(120)의 이송을 위해 사용되는 진공흡착수단을 가리킨다.The adhesive tape 110 may be a double-sided adhesive tape, each having an upper surface to which the electronic component 120 is attached and a lower surface to which the pedestal 108 is attached. At this time, the adhesive force of the double-sided adhesive tape 110 is designed to be stronger than the top surface when the electronic component 120 is removed, it is possible to prevent the adhesive tape 110 to fall at the same time. Also, in the drawing, reference numeral 106 denotes a central hole, 112 denotes a cog wheel hole, and 130 denotes a vacuum suction means used for transferring the electronic component 120.

본 실시예의 도면은 QFP(Quad Flat Package)를 전자 부품의 일 예로 사용하였으나, 이는 리드(lead)를 갖지 않은 다른 전자부품, 가령 저항, 콘덴서 등에도 적용이 가능하고, 다른 형태의 리드를 갖는 전자부품에도 사용이 가능하다.Although the drawing of this embodiment uses QFP (Quad Flat Package) as an example of an electronic component, it is applicable to other electronic components such as resistors and capacitors that do not have leads, and electrons having other types of leads. Can also be used for parts.

본 발명은 상기한 실시예에 한정되지 않으며, 본 발명이 속한 기술적 사상 내에서 당 분야의 통상의 지식을 가진 자에 의해 많은 변형이 가능함이 명백하다.The present invention is not limited to the above embodiments, and it is apparent that many modifications can be made by those skilled in the art within the technical spirit to which the present invention belongs.

따라서, 상술한 본 발명에 따르면, 캐리어 테이프 내에 다열 포켓을 형성하여 캐리어 테이프 내에 보다 많은 개수의 전자부품을 포함시켜 포장하는 것이 가능하다. 상기 다열 포켓의 내부에 별도의 받침대와 접착테이프를 설치하여 커버 테이프를 사용하지 않고도 반도체 패키지를 포장할 수 있다. Therefore, according to the present invention described above, it is possible to form a multi-row pocket in the carrier tape and to pack a larger number of electronic components in the carrier tape. By installing a separate pedestal and adhesive tape inside the multi-row pocket, the semiconductor package can be packed without using a cover tape.

Claims (5)

톱니바퀴 홀이 형성된 캐리어 테이프 본체;A carrier tape body in which a gear hole is formed; 상기 캐리어 테이프 본체 중앙에 형성되고 전자부품이 담겨지는 포켓으로 이루어진 전자부품 포장을 위한 캐리어 테이프에 있어서,A carrier tape for packaging an electronic component comprising a pocket formed at a center of the carrier tape body and containing the electronic component, 상기 포켓은 2개 이상의 다열이고, The pocket is two or more rows, 상기 다열 포켓의 열(row) 사이는, 커버 테이프가 접착되는 공간이 마련된 것을 특징으로 하는 다열 포켓을 갖는 캐리어 테이프.Carrier tape having a multi-row pocket, characterized in that the space between the rows of the multi-row pocket, the space to which the cover tape is bonded. 삭제delete 제1항에 있어서, The method of claim 1, 상기 포켓은, The pocket, 전자부품이 놓이는 받침대(pedestal)가 있고 상기 받침대 위에는 전자부품을 고정시키기 위한 접착테이프가 형성된 것을 특징으로 하는 다열 포켓을 갖는 캐리어 테이프.A carrier tape having a multi-row pocket, characterized in that there is a pedestal on which the electronic component is placed and an adhesive tape is formed on the pedestal to fix the electronic component. 제1항에 있어서, The method of claim 1, 상기 캐리어 테이프 본체는, The carrier tape body, 그 폭이 8, 12, 16, 24㎜중에 하나인 것을 특징으로 하는 다열 포켓을 갖는 캐리어 테이프.A carrier tape having a multi-row pocket, the width of which is one of 8, 12, 16, and 24 mm. 제1항에 있어서, The method of claim 1, 상기 캐리어 테이프 본체는, The carrier tape body, 1 X E5 ~ 1 x E11 Ω/sq 범위의 전기 저항값을 갖는 고분자 수지조성물인 것을 특징으로 다열 포켓을 갖는 캐리어 테이프.A carrier tape having a multi-row pocket, characterized in that the polymer resin composition has an electrical resistance value in the range of 1 X E5 to 1 x E11 dl / sq.
KR1020060084826A 2006-09-04 2006-09-04 Carrier tape having plural row pocket KR100825491B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990044681A (en) * 1995-09-15 1999-06-25 스프레이그 로버트 월터 Component Carrier Tape with Electrostatic Dissipation
JP2000025709A (en) * 1998-07-13 2000-01-25 Hitachi Ltd Production of semiconductor device, and carrier tape and semiconductor production device used therein
KR20010083925A (en) * 1998-10-27 2001-09-03 마츠시타 덴끼 산교 가부시키가이샤 Component affixing method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990044681A (en) * 1995-09-15 1999-06-25 스프레이그 로버트 월터 Component Carrier Tape with Electrostatic Dissipation
JP2000025709A (en) * 1998-07-13 2000-01-25 Hitachi Ltd Production of semiconductor device, and carrier tape and semiconductor production device used therein
KR20010083925A (en) * 1998-10-27 2001-09-03 마츠시타 덴끼 산교 가부시키가이샤 Component affixing method and apparatus

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