JPH0219292A - Face mounting type semiconductor package enclosure and method for manufacturing of semiconductor memory device - Google Patents

Abstract

PURPOSE:To achieve the technical feasibility of mounting semiconductor packages in a highly reliable manner and a high yield rate by providing a resin sealant for covering the semiconductor chip consisting of one electronic element and a part of the main surface thereof and a multiple layer film containing a sheet of metal sheet for isolating the semiconductor chip and the resin sealant from the outside. CONSTITUTION:A magazine 2 is placed in an inner paper case 1, packed with a plurality of face mounting type semiconductor packages 3 and provided at one end thereof with a stopper 4 for preventing the protrusion of the package 3 from the magazine. Silica gel 5 is placed between the wall of the inner case 1 and the side wall of the magazine 2, particularly on the side of an opening of the magazine 2. The reason is a good absorbing power of the silica gel effective in absorbing the external moisture to which the opening side of the magazine is first susceptible, when a lid 6 is covered with the flange 7 thereof folded inwardly of the inner case 1 and raised to take out the package 3. The inner case 1 is placed in a bag 8 and, after degassing, an opening 9 of the bag 8 is heat sealed. The bag 8 is a transparent, conductive bag consisting basically of the polyester having a moisture permeability of not more than 2.0g/m<2> for 24 hours.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique for preventing peeling and cracking at the interface of a surface-mounted semiconductor package when the package is mounted on a mounting board such as a printed circuit board.

[Conventional technology]

Surface-mount semiconductor packages such as small outline packages (SOP) and quartered flat packages (
QFP) and plastic leaped chip carriers (P
(LCC), as the semiconductor chips housed within the package have become larger, they have become increasingly smaller and thinner.
Package strength tends to decrease.

For this reason, it has been difficult to manufacture highly reliable thin resin-encapsulated ICs.

An example of a document that describes surface-mount packages is 1"IC, published by Industrial Research Association, January 15, 1980.
Examples include Embodiment Technology JP135-156.

Rainbow, Japanese Patent Publication Showa 6l-178877 (
Publication date: August 11, 1986), we put a desiccant inside the magazine and used a plastic transport tray.
Methods such as sealing the inside of the bag with a sheet have been considered.

[Problem to be solved by the invention]

According to an analysis by the inventor S of the mounting reliability and strength of these thin packages, when the package is surface-mounted on a mounting board such as a printed circuit board, for example, when soldering, heat is generated in the package. In this case, it has become clear that the moisture that has entered the package rapidly expands in volume, causing delamination and cracks at the package interface.

As a countermeasure, for example, heat the temperature at 125°C before soldering.
It is conceivable that pacing is performed for a long time, generally 16 to 24 hrs, but a furnace for pacing must be prepared, and above all, it requires a long period of pacing, which results in poor work efficiency. It is thought that.

According to the inventor S's analysis of the origin of the moisture that causes the above-mentioned cracks, it was found that after transfer molding of chip parts etc. with resin, in the environmental conditions in which the package is placed, before soldering 70-. It has become clear that this occurs when moisture enters the package and there is a condition where condensation is likely to occur.

In addition, although the method by Ohge et al. mentioned above can be expected to be quite effective, it is not suitable for the current state of products, which are becoming increasingly thinner, smaller, and encapsulated with larger chips, and for harsh environments such as transportation by aircraft. It became clear that it would be difficult to solve the problem using only these methods.

Therefore, an object of the present invention is to provide a technique for preventing package interface peeling cracks in surface-mounted packages.

One object of the present invention is to provide a highly reliable high-density packaging technique.

One object of the present invention is to provide an efficient solder 970 technique.

One object of the present invention is to provide an effective method for shipping electronic components.

One object of the present invention is to provide an effective preservation method for semiconductor devices encapsulated in thin resin packages.

One aim of the invention is to provide greater flexibility in the conditions under which the assembly process is carried out.

One object of the present invention is to provide an assembly suitable for surface mounting.
It is about providing a process.

One object of the present invention is to provide an efficient surface mounting technique.

One object of the present invention is to improve the moisture resistance of resin-sealed ICs and the like.

One object of the present invention is to provide resin sealing I suitable for automatic mounting.
Our goal is to provide packaging technology such as C.

One object of the present invention is to provide a method for preserving ICs, components, electronic devices, etc., which has excellent moisture resistance and does not require baking, even when stored for a long period of time.

One object of the present invention is to provide a method for backing electronic components such as ICs, which allows the presence of bottle holes to be easily determined.

One object of the present invention is to provide a space-saving moisture-proof packaging technique for ICs and the like.

One object of the present invention is to provide a moisture-proof packaging method that allows easy determination of moisture absorption of ICs and the like.

One object of the present invention is to provide a moisture-proof bag having a moisture absorption state display section such as an IC.

One object of the present invention is to provide a surface-mount package that allows the moisture absorption state of an IC or the like to be easily determined.

One object of the present invention is to provide an efficient surface mounting method for resin-sealed ICs and the like.

One object of the present invention is to create an assembly suitable for resin-sealed electronic components containing large chip-sized integrated circuits.
The objective is to provide a y process.

One object of the present invention is to provide a method for transporting electronic devices such as resin-sealed ICs suitable for transport by aircraft.

One object of the present invention is to provide moisture-proof packaging technology for resin-sealed ICs and the like that does not generate dew condensation even at low temperatures.

An object of the present invention is to provide a technique that allows checking the moisture absorption state inside a moisture-proof packaging bag from the outside.

The above and other objects and novel features of the present invention are:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

In the present invention, a surface-mounted package stored in a magazine is placed in an inner box, and the inner box is made into a moisture-permeable, for example, 2. Og/
The sample was placed in a transparent resin bag based on polyester having an rrf of 24 hrs or less and a surface resistivity of 106 Ω or less on the outside and 1011 Ω or less on the inside, and after degassing, the opening of the bag was heat-sealed. Furthermore, the inner box contains a moisture absorbent such as silica gel.

A brief overview of typical inventions disclosed in this application is as follows.

That is, it is a transparent moisture-proof packaging bag for moisture-proof packaging electronic components, and a humidity indicator for detecting the humidity inside the moisture-proof packaging bag is provided at a position visible from the outside.

According to the above-described means, since the humidity indicator for detecting the humidity inside the transparent moisture-proof packaging bag is provided at a position visible from the outside, it is possible to check the moisture absorption state inside the moisture-proof packaging bag from the outside.

Furthermore, another summary of the invention in the present application is as follows: A semiconductor chip on which at least one electronic element is formed, which is a packaging body having the following configuration, and a resin sealing product that covers at least a part of the main surface of the semiconductor chip. a moisture-proof bag made of a multilayer film including at least one metal sheet for shielding a body, the semiconductor chip, and the resin sealing body from the outside;

Furthermore, another outline of the invention of the present application is a package of resin-sealed semiconductor elements in which a large number of resin-sealed semiconductor elements S are housed in a plastic magazine, and the outside of the magazine is hermetically sealed with a moisture-resistant film.

Furthermore, another summary of the invention of the present application is as follows: A large number of resin-sealed semiconductor elements are housed in a single row in an airtight package made of a moisture-resistant film having the following configuration. A plurality of element storage magazines S and an inner box for arranging and storing the plurality of magazines S in close contact with each other, and a moisture-proof sheet material containing the inner box inside, and are airtightly sealed. a packaging bag and a desiccant contained in the packaging bag.

Furthermore, the outline of another invention of the present application is as follows: An outer box made of cardboard that is an airtight package for a large number of surface-mount resin-sealed semiconductor integrated circuit devices S having the following configuration; a hermetically sealed packaging bag made of a large number of moisture-resistant films; a plurality of paper inner boxes housed within the packaging bag; and a plurality of tubes for transporting semiconductor devices housed in each of the inner boxes. A summary of the other inventions of the present application includes a magazine having a shape, a large number of surface-mounting resin-sealed semiconductor integrated circuit devices stored in one row in each of the plurality of magazines, a desiccant stored in the inner box, and the other invention of the present application. A package made of an outer box that is an airtight package for a large number of surface-mount resin-sealed semiconductor integrated circuit devices having the following configuration, and a plurality of airtightly sealed moisture-resistant films housed in the outer box. A bag, at least one transporting auxiliary member for storing a large number of resin-sealed semiconductor devices stored in the packaging bag, and a large number of resin-sealed semiconductor integrated circuits accommodated in or on the auxiliary member. A circuit device and a desiccant contained in the packaging bag.

Furthermore, another summary of the invention of the present application includes: an airtight packaging bag made of a moisture-resistant film, which is an airtight packaging body for at least one resin-sealed semiconductor device having the following configuration; At least one transporting auxiliary member stored in the packaging bag, at least one resin-sealed semiconductor device stored in or on the auxiliary member, and a dryer stored in the packaging bag. Furthermore, another summary of the invention of the present application is as follows: An airtight packaging bag made of a moisture-resistant film, which is an airtight packaging body for at least one resin-sealed semiconductor device having the following configuration; At least one resin-sealed semiconductor device housed in a bag and a desiccant housed in the packaging bag.

Furthermore, another summary of the present invention is as follows: An airtight packaging bag made of a moisture-resistant film, which is an airtight packaging body for at least one resin-sealed semiconductor device having the following configuration; A member comprising at least one resin-sealed semiconductor device housed and a desiccant housed in the packaging bag or formed on the inner surface thereof.

Further, another aspect of the invention of the present application is a package having the following configuration: a semiconductor chip on which at least one electronic element is formed, a moisture-proof bag for shielding the semiconductor chip from the outside, and a moisture-proof bag inside the moisture-proof bag. The humidity display means that is provided and can be recognized from the inside, and the other invention of the present application is summarized as follows: A transportation magazine, a large number of resin-sealed semiconductor devices housed in the magazine, and a humidity display means provided in the magazine so as to be visible from the outside.

Furthermore, another summary of the invention of the present application is a resin-sealed semiconductor element package in which a large number of resin-sealed semiconductor elements S are hermetically sealed with a moisture-resistant film, and a humidity display means is provided inside the package so as to be visible from the outside. is provided.

The outline of another invention of the present application is as follows: A large number of resin-sealed semiconductor devices which are airtight packaging bodies made of a moisture-resistant film having the following configuration; The device storage magazine S is made of an inner box for arranging and storing the plurality of magazines S in close contact with each other, and a moisture-proof sheet material containing the inner box inside, and is hermetically sealed. a packaging bag; and a humidity display means provided inside the packaging bag so as to be visible from the outside.

The outline of other inventions of the present application is as follows: An outer box made of cardboard that is an airtight package for a large number of surface-mount resin-sealed semiconductor integrated circuit devices 517) having the following configuration, and the above-mentioned outer box. A hermetically sealed packaging bag made of a large number of moisture-resistant films is housed inside, a plurality of paper inner boxes are housed inside the packaging bags, and a semiconductor is housed in each of the inner boxes. A plurality of tubular magazines for transporting the tennos, a large number of resin-sealed semiconductors for surface mounting stored in one row in each of the plurality of magazines, and the above-mentioned packaging bag. A humidity display means inside the packaging bag is provided so as to be visible from the outside of the packaging bag, and the other invention of the present application is as follows: It is an airtight package for circuit equipment.

an outer box; a packaging bag made of a plurality of hermetically sealed moisture-resistant films that is housed under internal pressure of the outer box; and at least one packaging bag for protecting a large number of resin-sealed semiconductor devices housed in the packaging bag. A transporting auxiliary member, a large number of resin-sealed semiconductor integrated circuit devices housed in or on the auxiliary member, and a portion of the packaging bag provided in the packaging bag so as to be visible from the outside of the packaging bag. A means of displaying humidity.

Another summary of the invention of the present application is: an airtight packaging bag made of a moisture-resistant film, which is an airtight packaging body for at least one resin-sealed semiconductor device having the following configuration; and at least one resin-sealed semiconductor device housed in or on the auxiliary member and the packaging bag so as to be visible from the outside. and a humidity display means provided in the.

Summary of other inventions of this application.

This is an airtight package for at least one resin-sealed semiconductor device having the following configuration.

A hermetically sealed packaging bag made of a moisture-resistant film, at least one resin-sealed semiconductor device housed in the packaging bag, and a humidity display means provided in the packaging bag so as to be visible from the outside. .

Another summary of the invention of the present application is an airtight package for at least one resin-sealed semiconductor device, which is made of a moisture-resistant film and is hermetically sealed and housed in a next packaging bag and the above packaging bag. at least one resin-sealed semiconductor device and a drying member housed in the packaging bag or formed on the inner surface of the packaging bag so as to be visible from the outside.

Another summary of the invention of the present application is as follows: A carrier having an element storage recess S formed from a moisture-resistant first resin sheet, which is an airtight package for a large number of resin-sealed semiconductor devices having the following configuration. A tape, a resin-sealed semiconductor device S accommodated in the plurality of recesses S, and a moisture-resistant second resin sealed to cover the upper surface of the recess S and airtightly hold the inside of the recess S. With the sheet.

The outline of other inventions of the present application is as follows: A method for mounting a resin-sealed semiconductor device S comprising the following steps: a step of storing the resin-sealed device S in a moisture-proof bag rather than absorbing moisture; The step of taking out the resin-sealed device from the moisture-proof bag is to place the resin-sealed device on an Si wiring board and connect the leads of the resin-sealed device to the wiring on the board under conditions such that the resin-sealed portion receives thermal shock. The process of soldering.

Another summary of the invention of the present application is a method for transporting a large number of resin-sealed semiconductor devices by aircraft, in which the large number of resin-sealed semiconductor devices are hermetically sealed together with a desiccant in a moisture-proof bag during transportation. Characterized by points.

The outline of other inventions of the present application is as follows: A method for manufacturing a resin-sealed semiconductor device S, which includes the following steps: a step of sealing a semiconductor chip and an inner lead S with a resin; and marking with the resin-sealed body pressure ink. After the above-mentioned marking, a step of exposing the entire resin-sealed body to a high temperature due to the beta of the ink, and a step of hermetically sealing the device S after the above-mentioned marking in a moisture-proof bag before absorbing moisture.

Another summary of the invention of the present application is that a method for manufacturing a semiconductor memory device includes: a step of fixing the chip to a semiconductor chip holder formed from the same metal sheet as the lead via one main surface of the chip; A step of bonding the bonding pad s on the main surface of the chip with the inner lead Bf using a bonding wire. Coat at least the area where the memory cell S is formed on the other main surface of the chip with an organic resin that generates less alpha rays. Step of sealing the chip, wire s, chip holding part, and inner lead s'6 with resin to form a resin sealing body with a plurality of leads protruding from the sealing body. The process consists of moisture-proof packaging to prevent moisture absorption (7).

[Effect]

As a result, the surface mount package is housed in an inner box and an outer moisture-proof bag, and is completely sealed by degassing and heat sealing, so it is not affected by external humidity.
No troublesome beta work is required, and even solder lift 0-E7 does not cause package interface peeling or cracking. In particular, the present invention uses a polyester-based resin bag with a moisture permeability of 2.0 g/m"/24 hrs or less, so it has good moisture resistance and can be heat-sealed to prevent outside air from entering. Highly effective.In addition, the bag body has a surface resistivity of 1011Ω or less on the inner surface and 1011Ω or less on the outer surface to prevent static electricity.
06Ω or less. Furthermore, in the present invention, silica gel is placed between the magazine and the wall of the inner box, and the silica gel absorbs moisture, so the surface-mounted package is even more resistant to the influence of external moisture. I don't accept it. Further, [Examples] (],) General description of the embodiments [Example/■] Next, the present invention will be described based on the embodiments shown in the drawings.

A magazine 2 is stored in an inner box 1 made of paper as shown in FIG. An example of the magazine 2 is shown in FIG. As shown in FIG. 4, surface-mounted semiconductor packages 3 are packed in the magazine 2, and a stopper 4 is attached to the end of the magazine 2 to prevent the packages 3 from protruding outside the magazine.

A plurality of packages 3 are packed in the magazine 2.

Silica gel 5 is placed between the wall of the inner box 1 and the side of the magazine 2, as shown in FIG. The silica gel 5 is good for absorbing moisture when placed at the end of the magazine 2, and the flange 7 of the lid 6 is folded inside the inner box 1 to close the lid 6 and remove the lid. When lifting the lid 6 and removing the package 3, the opening side of the end of the lid 6 is first affected by the moisture in the outside air, so it is good to provide pressure on the opening side.

The inner box 1 is placed in a bag 8 as shown in FIG. 5, and after degassing, the opening 9 of the bag 8 is heat-sealed.

The bag body 8 has, for example, a moisture permeability of 2.0 g/rn"/24 hours.
It is composed of a transparent conductive bag based on polyester of RS or less.

The reason why the bag 8 is made transparent is that it is advantageous in terms of management when the product type, quantity, manufacturing lot N, etc. are written on the surface of the inner box 1.

An example of a resin film constituting the conductive film 8 is one in which polyethylene kneaded with an antistatic agent, a polyester film, a carbon conductive layer, and an acrylic resin protective layer are laminated from the inside, and a vinylitine chloride film is further layered on the film. Examples include those made by coating. In order to prevent the IC inside the conductive 8-chip package 3 from becoming static, the surface resistivity is set to 10Ω or less on the outer surface and 10II on the inner surface.
Ω or less.

On the surface of the conductive product 8, there is printed or pasted a label 10 with instructions to use it immediately after opening and to put it back in a low humidity environment.

According to the present invention, the surface-mounted package 3 is housed in a moisture-proof bag 8, and is completely sealed by degassing and heat sealing 9, and 22 minutes is absorbed by the silica gel 5 on the opening side. Since it is not affected by external moisture, it is possible to prevent peeling and cracking at the package interface even during solder reflow without requiring troublesome pasting work.

[Example・■]

Other embodiments of the present invention will be specifically described below with reference to the drawings.

In FIGS. 6 to 8 for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 6 is a perspective view showing the external structure of a transparent moisture-proof packaging bag according to an embodiment of the present invention.

The transparent moisture-proof packaging bag of this example, as shown in FIG.
It consists of a transparent bag-like moisture-proof member 11, and inside this bag-like moisture-proof member 11, an electronic component 1 such as a surface-mounted semiconductor device is placed.
A storage container 13 containing a plurality of containers 2 is stored in an inner box 14, the inner box 14 is inserted into a bag-like moisture-proof member 11, and both ends 11A and IIB are sealed [7] and moisture-proof packaged. .

When the moisture-proof packaging is carried out, as shown in FIGS. 6 and 7, a humidity indicator 15 is provided on the inner surface of the transparent bag-like moisture-proof member 11 for detecting the humidity inside the moisture-proof packaging bag 17. is installed in a position that can be seen from the outside.

An example of this humidity indicator 15 is shown below.

1. A cautionary note is printed on the inner surface of the transparent bag-shaped moisture-proof member 11 using ink containing a substance that changes color due to humidity, such as cobalt chloride, which becomes the humidity indicator 15. For example, this caution statement may read, ``If the color of this caution IF1!- changes from blue to light purple, remove the surface-mounted semiconductor device from the moisture-proof packaging bag and bake it at 125℃ for 24 hours.'' do.

2. As shown in FIGS. 6 and 7, a humidity indicator (humidity detection label) 15 is attached to the inside of the transparent bag-like moisture-proof member 11 with an adhesive member 16 having a ventilation hole 16A,
Make it visible from the outside.

This humidity detection label uses, for example, a piece of paper made from a bulb that absorbs a substance that changes color due to humidity, such as cobalt chloride.

3. As shown in FIG. 6, a humidity indicator (humidity detection label) 15t is placed on the inner box 14 inside the moisture-proof packaging bag 17.
- Paste or print a notice with a substance that turns blue in humidity, such as cobalt chloride.

In addition, the above 2. (Section 2) and 3. When pasting the humidity indicator (humidity detection label) 15 in (Section 3),
There is no need to write (print) Cautionary note J with a substance that changes color due to humidity, such as cobalt chloride.

Next, the structure of the transparent bag-shaped moisture-proof member 11 of the moisture-proof packaging bag 17 is made of a laminated plate as shown in FIG.

In FIG. 8, 18 is a polyethylene layer kneaded with an antistatic agent, and is the innermost layer of the moisture-proof packaging bag 17. This antistatic agent-mixed polyethylene layer 118 has a thickness of, for example, 63 μm, and has functions such as frictional electrification prevention, heat sealability, and openability. , a polyester film layer 19 having a pinhole-resistant function is provided.

On the polyester film layer 19, a polyester film layer 20 having a barrier layer having a function of preventing water vapor from entering is provided. The barrier layer 20 is, for example,
It consists of a vinylidene chloride film coating on a 14 μm thick polyester film. A polyester film (a4 μm) K is coated with vinylidene chloride, and then a polyester film layer (a2
μm.

A carbon conductive layer 22 having a thickness of, for example, 1 μm is provided thereon, and an acrylic protective layer 23 is further provided thereon.

The polyester film layer 21 has the function of reinforcing mechanical strength and dielectric strength, and the carbon conductive layer 22 has the function of preventing static electricity. Carbon conductor 14122 does not deteriorate over time and has no humidity dependence. Protective layer 2
The material No. 3 has a function of protecting the carbon conductive layer 22 and a function of preventing carbon flake dust generation, and has high abrasion resistance and good printability.

Next, how to use the humidity indicator 15 in the moisture-proof packaging bag 17 of this embodiment will be briefly explained.

First, as shown in FIG. 7, a humidity indicator 15 for detecting the humidity inside the moisture-proof packaging device 7 is provided on the inner surface of a transparent bag-like moisture-proof member 11 at a position visible from the outside. A member 11 is prepared. This bag-shaped moisture-proof member 11
A storage container 13 containing a plurality of electronic components 12 such as single-sided mounting type semiconductor devices is stored in an inner box 14, and the inner box 14 is inserted into the bag-like moisture-proof member 11, and both ends thereof are IIA and IIB are sealed and moisture-proof packaged.

When the color of the humidity indicator 15 or the cautionary note changes from blue to light purple when using the electronic component 12 such as a turntable semiconductor device, the electronic component 12 is removed from the moisture-proof packaging bag 17 (7). Pake at ℃ for 24 hours, then solder reflow using an infrared lamp or paper 7 Aisuri 7.
0- etc. to perform surface mounting etc.

As can be seen from the above description, according to this embodiment, the humidity indicator 15 for detecting the humidity inside the transparent moisture-proof packaging bag 17 is provided at a position visible from the outside. Since you can check the internal moisture absorption status from the inside, you can easily manage it. Furthermore, since the moisture-proof packaging bag 17 is not torn, there is no need to repackage it after checking.

[Example・■]

Other embodiments of the present invention and semiconductor processes common to the above two embodiments will be described below with reference to the drawings. The following description will mainly take DRAM as an example.

(a) Manufacturing process S bifurcation: Semiconductor chips (DRAM,
The structure and process S of logic (c) is USP 4.
612,565 (Us, 5eria11478353
1, filed Qct, 3.1985).

and US P 4,625,227 (U.S. 5e
real $744.151, filed ju
n, 13, 1985), this is incorporated into this description.

When the wafer process is completed, the wafer is divided into chips using a dicing method using a rotating blade. An overview of these pre- and post-processes can be found in Elec-tric Engineering.
egratedC1rcuitsJ johnA
llison, 1975 by McGraw-H
1 Book Company (7) 9.5-10%
For dicing techniques, see USP 4,016.855 (U, 8.
Ser 1a114608,733゜filed19
75. s, 28) K, respectively, and are incorporated herein by reference.

After this, each chip is bonded to a lead frame, and various packages are described in German Patent Publication DE 3116406A1; Japanese Patent Application Laid-Open No. 58-134452;
No.: JP 61-218150; Patent application 1988-209
No. 951; JP-A-60-257160; JP-A-61-
No. 32452 and Japanese Patent Application Laid-Open No. 61-78149, each of which is incorporated herein by reference.

Next, the inner lead ends of each bonding pad lead frame of each bullet are made of copper and aluminum.

Bonding wires made of Au etc. (thickness 30μ
(approximately 100 m) for bonding. These documents, (7) US patents and U.S. Pat.
ent Applications and US P4
, 564,734 (US 5erialj%476,2
68; filed Mar.

17.1983); U8P4,301,464 (US
Serial N155,070; filed j
UL, 5.1979); Japanese Patent Application No. 60-221832; British Patent Publication GB2157607A, which is incorporated herein by reference.

Furthermore, on the chip after bonding has been completed, a 20 μm to 200
A high purity polyimide layer or a silicone resin layer with a thickness of approximately μm is formed by botting. Regarding these resin coatings, the above-mentioned German patent publication DE 31164
Since it is described in 06A1, it is incorporated as part of the official publication description. Further, a resin coat for preventing soft defects caused by α rays may be formed during the wafer process. In this case, a thickness of about 10 μm to 80 μm is appropriate, and this is done by forming at least a combination of spin coating and photolithography so as to cover the memory cell mat.

After wire bonding and the like are completed, the lead frame is encapsulated in an epoxy resin material using a transfer molding method. These sealing techniques are covered by the above US Patents and US Patent App.
cations, and l'-VL8ITechno
logic J 8. M. Sze, 1983b
yMcgraw-Hill 13o*k Compan
y, p, 574-581, and is incorporated herein by reference.

Once the molding has been completed, the lead frame is taken out of the mold, and after completely removing the dust on the leads, the unnecessary parts of the lead frame are cut, the sealing body is not cut from the frame, and the leads are shaped into the desired shape. A process is performed.

After this step, the products are sorted and those that pass the test are marked. This marking work may be performed before cutting the leads or the like.

That is, after resin sealing, the exposed surface of the lead frame is plated with Sn or the like by electroplating. After that, the resin sealing body and the exposed lead frame surface are cleaned (washed with water) to remove the plating liquid adhering to the resin sealing body and the lead frame surface, and after drying, marks are applied using an automatic marking machine.

This marking is done by moving a lead frame, to which multiple semiconductor devices are fixed, in a fixed direction, and then using a rotating drum (
Marks indicating the type, grade, etc. of each sealed semiconductor device, such as a MOS type, are simultaneously attached to each resin-sealed body of the semiconductor device, such as a MOS type, by offset marking using a transfer drum (transfer drum) or direct marking by letterpress. At this time, static electricity is generated due to friction between the transfer drum or letterpress and the resin sealing body.
Since the entire frame is at the same potential, the entire frame is grounded without affecting the inside of the semiconductor bullet. Thereafter, the printed mark is burned or dried using an ultraviolet or infrared dryer or by simple heat treatment, and at the same time it is brought into close contact with the resin sealing body.

After that, each semiconductor device is separated and cut by punching, cutting, and bending, and at the same time, each lead wire of each semiconductor device such as a MOS type is made into an independent lead wire, and each lead wire is the same and is placed on the side. By bending it into an L-shape, an MO8 type semiconductor device such as a dual in-line type without electrostatic damage is completed.

As mentioned above, in the case of ink marking, 15
Baking is performed at 0° C. for 3-5 hours. On the other hand, laser marking does not require a special ink drying paste [7]. For racer markings, see European Patent Publication EP
157008A2, which is incorporated herein by reference.

After baking is completed, within 2-3 days, preferably within a few hours, into the moisture-proof bag as shown in the previous two examples.
Resin-sealed electronic devices S (integrated circuit devices, semiconductor devices) are air-filled with a desiccant such as silica gel, either directly or through appropriate auxiliary materials (magazine, tray T-tape & reel) according to the type of package. Seal.

Thereafter, the resin-sealed device S#'i, sealed in the bag, is packed in a cardboard box for transportation and shipped.

These semiconductor devices S are taken out from the moisture-proof bag immediately before mounting work. Under normal circumstances, it is appropriate to take it out within 2 to 3 days, preferably a few hours beforehand.

- The present inventors have revealed that when exposed to the outside air for more than a week, the moisture in the outside air is almost completely absorbed. Mounting work involves various solder reflow processes.
Implemented by.

(2) Details of the moisture-proof bag and the same day 1m; FIG. 9 is a perspective view showing the outer bag structure of an opaque moisture-proof packaging bag according to an embodiment of the present invention.

The opaque moisture-proof packaging bag of this embodiment, as shown in FIG. Parts 121! c The storage container 13 containing a plurality of containers is placed in the inner box 14.
The inner box 14 is inserted into the bag-shaped moisture-proof member 31, and both ends 32A and 32B are placed inside the bag-shaped moisture-proof member 31. It is sealed and moisture-proof packaged.

When the moisture-proof packaging is carried out, as shown in FIGS. 9 and 10, on the inner surface of the opaque bag-like moisture-proof member 31,
A humidity indicator 15 for detecting the humidity inside the moisture-proof packaging bag 31 is provided at a position visible from the outside.

An example of this humidity indicator 15 is shown below.

A humidity indicator 1 is provided on the inner surface of the transparent bag-like moisture-proof member 31.
The cautionary notes are printed with ink containing a substance that changes color due to humidity, such as cobalt chloride, which has a rating of 5.

For example, this warning may read, for example, [If the color of this warning changes from the back to light purple, remove the surface-mounted semiconductor device from the moisture-proof packaging bag and bake it at 125°C for 24 hours. .

As shown in FIGS. 9 and 10, the periphery of the humidity indicator (humidity detection label) 15 is directly attached with an adhesive to the inside of a transparent window provided in a part of the opaque bag-like moisture-proof member 31. Wear it so you can check it from the outside. This humidity detection label uses, for example, paper made from pulp that has absorbed a substance that changes color due to humidity, such as cobalt chloride. For example, at the position (7) corresponding to the window 33 on the surface of the inner box,
You can also swallow it.

As shown in FIGS. 9 and 10, a humidity indicator (humidity detection label) 1 is placed on the inner box 14 inside the moisture-proof packaging bag 31.
5 or print a cautionary note with a substance that changes color with humidity, such as cobalt chloride.

In addition, the humidity indicator (humidity detection label) 15
When pasting a ``caution'', there is no need to write (print) a ``caution'' with a substance that changes color due to humidity, such as cobalt chloride.

Next, the structure of the moisture-proof member C of the transparent window portion of the moisture-proof packaging bag is made of a laminated plate as shown in FIG.

On the other hand, the moisture-proof bag other than the transparent window 33 in FIG.
5 is made from an opaque sheet as shown in FIG.

In FIG. 11, there are 36 polyethylene layers kneaded with an antistatic agent, which is the innermost layer of the moisture-proof packaging bag 31. This antistatic agent-mixed polyethylene layer 36i has a thickness of, for example, 60 μm, and has functions such as frictional electrification prevention, heat sealability, and openability. On this polyethylene layer 36, an aluminum foil 35 having excellent moisture resistance is placed. Since aluminum is a metal, its permeability to water vapor is much lower than that of organic films, so its intrusion can be effectively blocked. The thickness of this aluminum is, for example, about 10 μm. Further on top of the aluminum is a thermoformable polyethylene film layer 39 with a thickness of about 20 μm. Furthermore, this polyethylene film has excellent mechanical strength and
A polyester film layer (2 μm thick) 38 with high dielectric strength is provided, and a carbon conductive layer 37 with a thickness of 1 μm, for example, is provided thereon, and an acrylic protective layer 40 is further provided thereon. It will be done. The polyester film layer 38 has the function of reinforcing mechanical strength and dielectric strength, and the carbon conductive layer 37 has the function of preventing static electricity. The carbon conductive layer 37 does not deteriorate over time and has no humidity dependence. The material of the film retaining layer 46 has the function of protecting the carbon conductive layer 37 and the function of preventing carbon 7 lake dust generation, and has high abrasion resistance and good printability.

Next, how to use the humidity indicator 15 in the moisture-proof packaging bag 31 of this embodiment will be briefly explained.

First, as shown in FIG. 10, a transparent bag-shaped moisture-proof member 11
A bag-like moisture-proof member 31 is provided on the inner surface of the bag-like moisture-proof member 31 at a position of a transparent window 33 so that a humidity indicator 15 for detecting the humidity inside the moisture-proof package 31 can be seen from the outside.

A plurality of electronic components 12 such as surface-mounted semiconductor devices are stored in this bag-shaped moisture-proof member 31 , and the storage container 13 is housed in an inner box 14 . It is inserted into the container, and both ends 32A and 32B are sealed and moisture-proof packaged.

When the electronic component 12 such as a surface-mounted semiconductor device is used, if the color of the humidity indicator 15 or the cautionary note changes from the back to light purple, the electronic component 12 is removed from the moisture-proof packaging bag 31 and heated to 125°C. After 24 hours of soldering, infrared lamp or paper 7Aisuri 70
- etc. to perform surface mounting etc.

As can be seen from the above description, according to this embodiment, the humidity indicator 15 for detecting the humidity inside the opaque moisture-proof packaging bag 31 is installed at a position visible from the outside as follows.
The moisture absorption status inside the moisture-proof packaging bag 31 can be checked from the outside. ? can be easily understood. Furthermore, since the moisture-proof packaging bag 31 is not torn, there is no need to repackage it after checking.

The present invention has been specifically explained above based on examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the gist thereof.

For example, the present invention can be applied to all packaging for electronic components that are affected by humidity, other than electronic components such as the surface-mounted semiconductor device.

(3) Details of the resin-encapsulated electronic device S to which the resin is applied;
It is called kage (SUP).

Figure 3 shows flat plastic pac
kage (PPP) also 1 quad flat
This is a surface mount package called GFP. Furthermore, FIG. 14 is a small outline J-b which is used especially for mesori etc.
It is called end package (SOJ).

Figure 15 shows plastic 1eaded chi.
It is called p car-rier (PLCC) and is used for high-density surface mounting. Figure 16 shows Butt 1e.
Belongs to ad type, m1ni-square pac
With kage (M8P)! It will be revealed.

Fig. 17 shows a type in which the lead is inserted into the hole S of the board, which is different from the previous ones, and belongs to the insert type, and is a general K dual 1n-1ine package (
DIP).

Above, in FIGS. 12 to 17, the semiconductor chip 42
It is fixed via Ag paste 43 onto a holding member such as a tab or island made of thin metal plate #7. Bonding pad S on the above chip,! : Ag
The inner end of the lead S (inner lead S) on which the 5-pot plating layer 44 is formed is made of Au wire 45 or the like (3
0 μm diameter), and ball life wedge bonding is performed using a capillary. The lead 46 is 42
It is formed by punching from an alloy or copper alloy film. These are made of epoxy resin41! vinegar,)
Lance 77+e molded.

(4) Details of the auxiliary transport member; A large number of resin-sealed devices are hermetically sealed after being accommodated in various auxiliary transport members, depending on their use.

These auxiliary members will be explained.

FIG. 18 shows the magazines 54 and how resin-sealed devices (transistors, ICs, LSIs) are stored therein. Inside, MAP type resin sealing devices 853 are stacked vertically, and at the ends.

A preliminary stopper 52 made of polyethylene and a main stopper made of hard nitrile rubber are packed. The magazine body is made of carbon-filled hard polystyrene or conductive soft vinyl chloride.

FIG. 9 shows a tray 55 as an auxiliary member. The tray is made of vinyl chloride treated with antistatic treatment.
A resin sealing device 53 is placed in the square depressions 56 arranged in an array. In this case, silica gel or the like may be directly put into each depression 56, and the upper surface may be hermetically sealed with a moisture-proof sheet. Generally, after stacking the trays, they are placed in a paper inner box and then sealed in a moisture-proof bag.

FIG. 20 shows what is called a long tape reel system, in which resin sealing devices 53 are held in a row on a carrier tape 57 wound around a reel 59 via an adhesive tape 58. This is wound around a reel 59 and hermetically sealed in a moisture-proof bag one reel at a time.

FIG. 21 shows another type of tape 6-reel system.

In this case, the resin sealing device 53 is housed within a row of square recesses 56 made in the carrier tape 57.
The top surface is heat sealed with cover tape 60. Then, in this state, it is wound onto a reel and sealed against moisture in the same way as above.

In this case as well, the cover tape 60 is made into a moisture-proof sheet as shown in FIG. 8 or FIG. 11, and <t! If silica gel or the like is placed in the groove 56, an external moisture-proof sheet is not required.

The details of the manufacture of the magazine, etc. are described in Japanese Patent Laid-Open No. 16378/1983, and this is incorporated herein by reference.

(5) -Details of shipping packaging for ICs, etc.; FIG. 22 shows a row of shipping packaging for resin-sealed devices 53 (insertion type or surface mount devices). A large number of resin sealing devices 53 are housed in one row within the tape-shaped magazine 2.
It is secured inside by the stopper pin 64 and the stopper claw 4. This magazine is a predetermined number of magazines.
It is stored in an inner box 1 made of paper or a sheet with low moisture absorption, and then stored in a bag made of a moisture-proof sheet as shown in FIG. Then, the moisture-proof bag is degassed so that it comes into close contact with the outer surface of the inner box, and the inner box is sealed airtight by applying pressure or heating. This is convenient because it not only facilitates storage in the outer box, but also saves storage space.

On the other hand, if a slightly pressurized dry N or the like is filled inside the container and the container is heated to create a gap between the moisture-proof sheet and the interior box, the presence or absence of pinholes can be easily determined.

The above explanation mainly uses magazines as an example, but trays and tape and reels can also be packed in almost the same way. Further, one resin-sealed IC or a plurality of resin-sealed ICs may be directly sealed in a moisture-proof bag.

Alternatively, the auxiliary member may be directly enclosed in the moisture-proof bag without using the inner box.

Furthermore, although the desiccant is placed inside the inner box in a paper bag or the like, it may also be placed in a suitable location within the recess of the magazine or carrier tape or other hermetic seal. For example, it may be applied and diffused on the inner surface of the moisture-proof sheet.

The moisture-proof bag airtightly sealed as described above is housed in a predetermined number of cardboard outer boxes 61, sealed with adhesive tape 62, and bound with a binding band 63 around the outer periphery before being shipped.

Regarding other airtight sealing methods, especially those using trays, please refer to the above-mentioned Japanese Patent Publication No. 17887-1987.
7, and this is incorporated into the description.

(6) Details of memory chip and DRAM device; The relationship between the cross-sectional structure and package of the memo IJ IC device of the present invention will be explained. Here, an example of an SOP type package will be explained.

In FIG. 23, a large number of FETs 5 constituting the DRAM are formed on the upper main surface of a Si substrate 71.

On the 3M substrate, there is an interlayer PSG (Phospho-5) field oxide film that forms these elements 3.
An insulating film (inorganic film) 72 made of tricate-glass or the like is formed. A number of A-no bonding pads 75 are provided thereon.

On the other hand, the lower main surface of the i9i substrate 71 is fixed to an island or tab portion 78 made of 4270 mm via an Ag paste 77. The size of this chip 71 is
It is approximately 10mm x 5rnm x 0.4mm (vertical x horizontal x thickness). Lead 80, same as Island 4
270A, and a partial Ag plating 79 is provided on the inner lead portion. The distance between the inner end of the lead 80 and the bonding pad is A u of 30 Amφ.
II! After the edge pounding on the ball surface is eliminated, a polyimide resin 73 is formed over almost the entire upper surface of the chip. Thereafter, these structures are transformer-molded with epoxy resin 76 in lead frame units. Solder plating 8 is applied to the lead portions protruding from the mold resin 76.

At this time, the thickness of the 4270I member of the lead and island part is 0.15 mm + the thickness of the sealing resin on the top surface of the package is about 1 mm + the thickness of the polyamide fi1m is about 0.
9llIII! 1, the thickness of the Ag paste is about 50 μm, and the thickness of the lower surface of the sealing resin is about 1−.

In a package sealed with such a thin resin, if a large amount of moisture is absorbed, moisture will first evaporate and expand on the lower surface of the tab 78 due to rapid heating during mounting. Subsequently, the resin and metal will separate and the package will swell. Inventor S revealed that package cracks occur if the resin cannot withstand the stress generated at this time.

(7) Details of the implementation process; First, we will provide an overview of the five-sided mounting process.

17. Desired wiring is formed on a substrate such as glass-epoxy using Cu film, etc., and soldering on the substrate is done using solder paste lath on the 7th print. I
S. Formed by a method such as lean printing, and then the resin-sealed device is placed on a vacuum chuck or the like and mounted on the solder paste, followed by soldering method, i.e., paper 7 Eisley method, heating furnace method. Soldering is performed by making the solder in the paste clear using an infrared ray 970 method or the like.

FIG. 24 shows how this is implemented. In the same figure, 9
1 is an SOJ type resin-sealed device.

92 indicates the SOP type, and 93 indicates the MSP type.

94 is a wiring board, 95 beam is flowed or
This is tipped solder.

FIG. 25 shows the solder dip method. In this case, the same (a
) and (MSP type resin sealing device 93
is fixed to the substrate 94 with an adhesive 96 so that its leads rest on the screen-printed solder paste.

Subsequently, as shown in (b), it dips downward into a solder jet 98, and then is cooled to the state shown in (c).

〔Effect of the invention〕

In surface mounting of thin resin packages such as resin-sealed memory ICs, moisture absorption of the resin before the mounting process causes heat shock during the soldering process, etc.
Package cracks occur frequently, but according to the present invention,
In the assembly process of resin-sealed devices, while the resin is dry, it is packaged in moisture-proof packaging and removed from the bag immediately before single-sided mounting, etc., and used for mounting. It is possible to reduce cracks during the process.

[Brief explanation of drawings]

1 is a perspective view of a package showing a first embodiment of the present invention; FIG. 2 is a perspective view of an inner box showing the above embodiment of the present invention; FIG. 3 is a perspective view of an example of a magazine; The figure is an explanatory sectional view of the end of the magazine, and FIG. 5 is an explanatory view of an example of the bag body. FIG. 6 is a perspective view showing the external structure of a transparent moisture-proof packaging bag according to the second embodiment of the present invention, and FIG. 7 is an enlarged cross-sectional view taken along the cutting line Ir=ff shown in FIG. Figure 8 is an enlarged cross-sectional view of the mounting part of the humidity indicator attached to the inner surface of the transparent bag-like moisture-proof member. It is a partially cutaway perspective view shown. FIG. 9 is a perspective view showing the external structure of a transparent moisture-proof packaging bag according to the third embodiment of the present invention, and FIG. FIG. 11 is an enlarged sectional view of the attachment part of the humidity indicator attached to the inner surface of the transparent bag-like moisture-proof member. FIG. 2 is a partially cutaway perspective view and a schematic diagram of the method. 1...Inner box, 2...Magazine, 3...Surface mount semiconductor cage, 4...Stopper 5...Silica gel (moisture absorbent), 6...Lid, 7...7 rank Department,
8...Bag body, 9...Bag body opening (heat seal), 1o
...Printing is just a label. FIG. 2 is an explanatory diagram showing details of the applied bag packaging method for resin-sealed semiconductor devices. Figure 7 Figure 3 Figure 4 Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure

Claims (1)

[Claims] 1. A package consisting of the following: (a) a semiconductor chip on which at least one electronic element is formed; (b) a resin encapsulant that covers at least a part of the main surface of the semiconductor chip; (c) 2.) a moisture-proof bag made of a multilayer film including at least one metal sheet for shielding the semiconductor chip and the resin sealing body from the outside; The package described in claim 1 above is:
The bag further comprises: (d) a desiccant housed in the bag; 3. In the package described in claim 2, a large number of the resin sealing bodies are housed in a tubular magazine in a row. 4. A package of resin-sealed semiconductor elements s, in which a large number of resin-sealed semiconductor elements s are housed in a plastic magazine, and the outside of the magazine is hermetically sealed with a moisture-resistant film. 5. In claim 4, the package has a desiccant sealed therein. 6. A package of resin-sealed semiconductor elements s, in which a large number of resin-sealed semiconductor elements s are hermetically sealed with a moisture-resistant film made of a multilayer film including at least one metal sheet. 7. In claim 6, the package does not contain any hygroscopic members other than the resin sealant s and the desiccant. 8. In claim 7, the package contains a desiccant inside. 9. An airtight package made of a moisture-resistant film comprising: (a) a large number of resin-sealed semiconductor devices; and (b) a plurality of device storage magazines in which the above-mentioned large number of resin-sealed semiconductor devices are housed in one row. (c) an inner box for arranging and storing the plurality of magazines s in close contact with each other; and (d) an airtight seal made of a moisture-proof sheet material containing the inner box inside. (e) a desiccant contained in the packaging bag; 10. In the airtight package according to claim 9, the inside of the package is evacuated to such an extent that the package comes into close contact with the outside of the inner box. 11. An airtight package for a large number of resin-sealed semiconductor integrated circuit devices for surface mounting consisting of the following: (a) an outer box made of cardboard; and (b) a large number of moisture-resistant containers housed in the outer box. (c) a plurality of paper inner boxes housed within the packaging bag; and (d) a plurality of paper inner boxes for transporting semiconductor devices housed in each of the inner boxes. 12. a tubular magazine; (e) a large number of surface-mount resin-sealed semiconductor integrated circuit devices stored in one row in each of the plurality of magazines; and (f) a desiccant stored in the inner box; In the package according to claim 11, the packaging bag is deaerated from the inside so as to be in close contact with the outer surface of the inner box, thereby making it easy to store the bag in the outer box. There is. 13. In the package according to claim 11, the gas in the packaging bag is replaced with dry gas. 14. In the package according to claim 13, the sealed gas is pressurized so that the presence of a pinhole in the packaging bag can be determined by the degree of bulge. 15. In the package according to claim 11, the plurality of magazines are housed in each inner box so that both ends thereof are substantially aligned and in close contact with each other. . 16. An airtight package for a large number of resin-sealed semiconductor integrated circuit devices for surface mounting, consisting of the following: (a) an outer box; and (b) a plurality of airtight and moisture-resistant packaging accommodated in the outer box. a packaging bag made of a film; (c) at least one transportation auxiliary member for protecting a large number of resin-sealed semiconductor devices housed in the packaging bag; and (d) within or on the auxiliary member. a large number of resin-sealed semiconductor integrated circuit devices housed; (e) a desiccant housed in the packaging bag; 17. In the package described in claim 16 above,
The above-mentioned auxiliary member is capable of handling a large number of the above-mentioned resin-sealed semiconductor devices in one.
It is a tube-shaped magazine that is stored in rows. 18. In the package described in claim 16, the auxiliary member is a tray on which the plurality of resin-sealed semiconductor devices are housed in an array. 19. In the package described in claim 16, the auxiliary member is a tape-shaped holding member that accommodates the plurality of resin-sealed semiconductor devices thereon or inside. 20. In the package described in claim 19, the tape-shaped holding member is housed in the packaging bag while being wound around a reel. 21. In the package described in claim 20, the plurality of resin-sealed semiconductor devices are adhered onto the tape at predetermined intervals. 22. An airtight package for at least one resin-sealed semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one packaged in the packaging bag. (c) at least one resin-sealed semiconductor device housed in the packaging bag and housed in or on the auxiliary member; and (d) housed in the packaging bag. Desiccant and 23. In the package described in claim 22 above,
The auxiliary member is a tubular magazine that accommodates the at least one resin-sealed semiconductor device in one row. 24. In the package described in claim 22, the auxiliary member is a tray on which the at least one resin-sealed semiconductor device is housed in an array. 25. In the package described in claim 22, the auxiliary member is a tape-shaped holding member on which or in which the at least one resin-sealed semiconductor device is housed. 26. In the package described in claim 25, the tape-shaped holding member is stored in the packaging bag in a state where it is wound around a reel. 27. In the package described in claim 26, the at least one resin-sealed semiconductor device is adhered onto the tape at predetermined intervals. 28. An airtight package for at least one resin-encapsulated semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one resin-sealed packaging bag contained within the packaging bag. (c) a desiccant contained in the packaging bag; 29. In the package described in claim 28 above,
The packaging bag is crimped and sealed while applying ultrasound or heat. 30. An airtight package for at least one resin-encapsulated semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one resin-sealed packaging bag contained within the packaging bag. 31. a resin-sealed semiconductor device; and (c) a desiccant member housed in or formed on the inner surface of the packaging bag. In the package described in claim 30, the packaging bag is sealed by pressure bonding while applying ultrasonic waves or heat. 32. In the package described in claim 31, pressurized gas is sealed so that the packaging bag is inflated by internal gas pressure. 33. A package consisting of: (a) a semiconductor chip on which at least one electronic element is formed; (b) a moisture-proof bag for shielding the semiconductor chip from the outside; and (c) a package provided inside the moisture-proof bag. Humidity display means that can be recognized from inside; 34. The package recited in claim 33 further comprises: (d) a desiccant housed in the bag; The package recited in claim 34 further comprises: (e) a resin encapsulant that covers at least a portion of the main surface of the semiconductor chip; 36. A package consisting of the following: (a) a tubular transport magazine for accommodating a large number of resin-sealed semiconductor devices in one row; and (b) a large number of resin-sealed semiconductor devices accommodated in the magazine. and (c) means for displaying the humidity inside the magazine, which is provided in the magazine so as to be visible from the outside; and 37. The package according to claim 36 above is:
It further comprises: (d) a desiccant housed in the magazine; and 38. The package according to claim 36 further comprises: (e) a moisture-proof bag that encloses the outside of the magazine and is hermetically sealed; 39. In a resin-sealed semiconductor device package in which a large number of resin-sealed semiconductor devices s are hermetically sealed with a moisture-resistant film,
A humidity display means is provided inside the package so as to be visible from the outside. 40. In claim 39, the package does not contain any hygroscopic members other than the resin sealant s and the desiccant. 41. In claim 40, the package contains a desiccant inside thereof. 42. An airtight package made of a moisture-resistant film comprising: (a) a large number of resin-sealed semiconductor devices; and (b) a plurality of device storage magazines in which the above-mentioned large number of resin-sealed semiconductor devices are housed in one row. (c) an inner box for arranging and storing the plurality of magazines s in close contact with each other; and (d) an airtight seal made of a moisture-proof sheet material containing the inner box inside. (e) a humidity display means provided in the packaging bag so as to be visible from the outside; 43. In claim 42, the airtight package further comprises: (f) a desiccant contained within the package; An airtight package for a large number of resin-sealed semiconductor integrated circuit devices for surface mounting consisting of the following: (a) an outer box made of cardboard; and (b) a large number of moisture-resistant containers housed in the outer box. a hermetically sealed packaging bag made of film; (c) a plurality of inner boxes made of paper housed within the packaging bag; and (d) a plurality of inner boxes for transporting semiconductor devices housed in each of the inner boxes. (e) a large number of surface-mount resin-sealed semiconductor integrated circuit devices housed in one row in each of the plurality of magazines, and (f) inside the packaging bag, visible from the outside of the packaging bag. Humidity display means inside the packaging bag provided as shown in 45. In claim 44, the airtight package further comprises: (g) a desiccant housed in the inner box; and 46. In the package according to claim 44, the packaging bag is deaerated from the inside so as to be in close contact with the outer surface of the inner box, thereby making it easy to store the bag in the outer box. There is. 47. In the package according to claim 44, the gas in the packaging bag is replaced with dry gas. 48. In the package according to claim 47, the sealed gas is pressurized so that the presence of a pinhole in the packaging bag can be determined by the degree of bulge. 49. In the package according to claim 45, the plurality of magazines are housed in each inner box so that both ends thereof are substantially aligned and in close contact with each other. . 50. An airtight package for a large number of resin-sealed semiconductor integrated circuit devices for surface mounting, consisting of the following: (a) an outer box; and (b) a plurality of airtight and moisture-resistant packaging accommodated in the outer box. a packaging bag made of film; (c) at least one transporting auxiliary member for protecting a large number of [5 to 6 or more] resin-sealed semiconductor devices stored in the packaging bag; and (d) the above-mentioned auxiliary member. a large number of resin-sealed semiconductor integrated circuit devices housed in or on the member; and (e) a display displaying the humidity inside the packaging bag, which is provided in the packaging bag so as to be visible from the outside of the packaging bag. Means and 51. In claim 50, the package further comprises: (f) a desiccant housed in the packaging bag; and 52. In the package described in claim 50 above,
The above-mentioned auxiliary member is capable of handling a large number of the above-mentioned resin-sealed semiconductor devices in one.
It is a tube-shaped magazine that is stored in rows. 53. In the package described in claim 50, the auxiliary member is a tray on which the plurality of resin-sealed semiconductor devices are housed in an array. 54. In the package described in claim 50, the auxiliary member is a tape-shaped holding member that accommodates the plurality of resin-sealed semiconductor devices thereon or in it. 55. In the package described in claim 54, the tape-shaped holding member is housed in the packaging bag while being wound around a reel. 56. In the package described in claim 55, the plurality of resin-sealed semiconductor devices are adhered onto the tape at predetermined intervals. 57. An airtight package for at least one resin-sealed semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one packaged in the packaging bag. (c) at least one resin-sealed semiconductor device housed in the packaging bag and housed in or on the auxiliary member; and (d) inside the packaging bag from the outside. visually provided humidity display means; 58. In claim 57, the package further comprises: (e) a desiccant housed in the packaging bag; In the package described in claim 57,
The auxiliary member is a tubular magazine that accommodates the at least one resin-sealed semiconductor device in one row. 60. In the package described in claim 57, the auxiliary member is a tray on which the at least one resin-sealed semiconductor device is housed in an array. 61. In the package described in claim 57, the auxiliary member is a tape-shaped holding member on which or in which the at least one resin-sealed semiconductor device is housed. 62. In the package described in claim 61, the tape-shaped holding member is housed in the packaging bag while being wound around a reel. 63. In the package described in claim 62, the at least one resin-sealed semiconductor device is adhered onto the tape at predetermined intervals. 64. An airtight package for at least one resin-encapsulated semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one resin-sealed packaging bag contained within the packaging bag. (c) humidity display means provided in the packaging bag so as to be visible from the outside; 65. In claim 64, the package further comprises: (d) a desiccant housed in the packaging bag; and 66. In the package described in claim 64,
The packaging bag is crimped and sealed while applying ultrasound or heat. 67. An airtight package for at least one resin-encapsulated semiconductor device comprising: (a) an airtight packaging bag made of a moisture-resistant film; and (b) at least one resin-sealed packaging bag contained within the packaging bag. 68. a resin-sealed semiconductor device; and (c) a drying member housed in the packaging bag or formed on the inner surface of the packaging bag so as to be visible from the outside. In claim 67, the package further comprises: (d) a member made of a desiccant housed in or formed on the inner surface of the packaging bag; 69. In the package described in claim 67, the packaging bag is sealed by pressure bonding while applying ultrasonic waves or heat. 70. In the package described in claim 69, pressurized gas is sealed so that the packaging bag is inflated by internal gas pressure. 71. An airtight package for a large number of resin-sealed semiconductor devices consisting of: (a) a carrier tape having a device-accommodating recess s molded from a moisture-resistant first resin sheet; and (b) a plurality of the above. a resin-sealed semiconductor device s accommodated in the recess s; and (c) a moisture-resistant second resin sheet sealed to cover the upper surface of the recess s and airtightly hold the inside of the recess s. 72. In claim 71, the package further comprises: (d) a drying member accommodated or provided in each of the recesses; 73. In claim 71, the package further comprises: (e) humidity display means provided inside at least one of the recesses s so as to be visible from the outside; 74. In claim 72, the package further comprises: (f) humidity display means provided in each of the recesses s so as to be visible from the outside; Resin-sealed semiconductor device consisting of the following steps
Mounting method: (a) Storing the resin-sealed device s in a moisture-proof bag to prevent it from absorbing moisture (b) Taking out the resin-sealed device s from the moisture-proof bag (c) Putting the resin-sealed device s into the moisture-proof bag 76. Soldering the leads of the resin-sealed device to the wiring on the board under conditions such that the resin-sealed portion is subjected to thermal shock when placed on a wiring board; In claim 75, the mounting method further comprises the following steps: (d) Between (a) and (b) above, the step of checking the humidity state inside the moisture-proof bag 77. In the mounting method according to claim 76, a desiccant is sealed in the moisture-proof bag. 78. A method for transporting a large number of resin-sealed semiconductor devices by aircraft has the following features: During transportation, the large number of resin-sealed semiconductor devices are hermetically sealed together with a desiccant in a moisture-proof bag. 79. Resin-sealed semiconductor device consisting of the following steps
Manufacturing method: (a) A step of sealing the semiconductor chip and the inner leads s with resin. (b) A step of marking the resin-sealed body with ink. (c) After making the mark, marking the ink. Step (d) of exposing the entire resin-sealed body to high temperature for the purpose of heating; and Step 80 of hermetically sealing the device s, which has been pasted, in a moisture-proof bag before absorbing moisture. In the manufacturing method according to claim 79, a desiccant is sealed in the moisture-proof bag. 81. A method for manufacturing a semiconductor memory device includes the following steps: (a) fixing the chip to a semiconductor chip holder formed from the same metal sheet as the lead via one main surface of the chip; (b) fixing the chip to a semiconductor chip holder formed from the same metal sheet as the lead; Step (c) of bonding the bonding pad s on the other main surface of the chip with the inner lead s using a bonding wire;
Step (d) of coating the region where the cell s is formed with an organic resin that generates less alpha rays; sealing the chip, the wire s, the chip holding part, and the inner lead s with a resin; Step (e) of forming a resin sealing body from which a plurality of leads protrude; Step of moisture-proof packaging the resin sealing body to prevent moisture absorption; step 82. In the method for manufacturing a semiconductor memory device according to claim 81, a desiccant is enclosed in the package.