JPH10139090A - Package of parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable steps to be brought into contact with only the area where respective terminals are not formed and contain electronic parts in which a number of external terminals are arranged in a circuit face, by forming steps supporting parts, having respective specified shapes at respective corners and/or peripheral parts of the bottom face of respective recesses. SOLUTION: Respective steps 21 are formed at four corners of the bottom face 3C of the embossed parts 3, in a tape-form container body. When CSPs 22 are contained in the embossed parts 3 of the tape-form container body, the circuit faces 22B of the CSPs 22 contact only respective steps 21 to support the whole body of the CSPs 22. And hence, the area of the bottom face 3C of respective embossed parts 3 can be expanded. Even the CSP of which external terminals 22A are formed as far as the peripheral end of the circuit face 22B can be sufficiently contained in the embossed part 3 of the tape-form container body. And further, the CSP 22 in which relatively many external terminals 22A are arranged can be also contained by setting the steps corresponding to the contact extent of the four corners of the circuit face 22B of respective CSPs 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a component package,
In particular, Chip Size Package: C
SP) and Ball Grid Allay: B
It is suitable for use in a tape-like container used for transporting electronic components having external terminals formed on a circuit surface such as GA).

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, a tape-shaped container of this type is known. The tape-shaped container 1 is made of a flexible resin material.
And a flange portion 4 in which a step portion 2 for supporting components is provided in the width direction (hereinafter referred to as an embossed portion).

A plurality of embossed portions 3 are arranged at equal intervals along the longitudinal direction of the tape-shaped container 1, for example, a CSP.
Are used to store each one by one. This embossed part 3
A hole 3A having a predetermined diameter is formed in the center of the hole 3 so that whether or not an electronic component is stored in the embossed portion 3 can be confirmed through the hole 3A.

The flange portion 4 is used for connecting a stored lid to a tape-like lid (not shown) so that the stored electronic components do not come off from the opening during transportation. Are arranged at equal intervals.

In practice, this tape-shaped container 1 is a CSP
Is stored, the CSP is supported by the stepped portion 2.

[0006]

By the way, as shown in FIG. 6, the tape-like container 1 during the transport of the electronic component is wound around the reel 5 many times. The positional relationship between the embossed portions 3 at each position on the circumference of the tape-shaped container 1 wound around the reel 5 in this manner is shown in FIGS.
It is shown in (C).

As shown in FIGS. 7A to 7C, each embossed portion 3 adjacent in the radial direction is not necessarily in a positional relationship shifted in the radial direction with respect to the embossed portion 3 on the inner peripheral side. , Often offset in the circumferential direction. For this reason,
As shown in FIG. 8, the opening edge 3 of the embossed portion 3 on the inner peripheral side
B is often located on the bottom surface 3C of the embossed portion 3 on the outer peripheral side.

Here, the reel 5 may be subjected to various unexpected external forces, such as an impact due to dropping, during transportation.
A force may be applied in the radial direction of the reel 5 to compress the embossed portion 3 in the depth direction.

At this time, if the position of the opening edge 3B of the inner peripheral side embossed portion 3 and the position of the bottom edge of the outer peripheral side embossed portion 3 substantially coincide with each other, the parts are relatively high in strength. Deformation of the embossed portion 3 is hardly observed.

However, as shown in FIG. 8, when the opening edge 3B of the embossed portion 3 on the inner peripheral side is located on the bottom surface 3C of the embossed portion 3 on the outer peripheral side, the embossed portion 3 on the outer peripheral side is not used.
Since the strength of the bottom portion 3C in the radial direction is small, it could not be supported, and the bottom portion 3C of the embossed portion 3 could be deformed as shown in FIG.

Such a deformation is caused by the CSP
When the CSP and the BGA are stored, there is a problem that the external terminals of the CSP and the BGA may be damaged. As one method for solving this problem, a tape-like container 10 as shown in FIG.

The tape-shaped container 10 has an annular projection 11 at the center of the bottom surface 3C of each embossed portion 3 in a direction opposite to the depth direction of each embossed portion 3.

As shown in FIGS. 10B and 11, the protrusions 11 extend from the bottom surface 3C of the step 2 formed on both sides of each embossed portion 3 along the width direction of each embossed portion 3. It is formed to be lower than the height. Therefore CSP
When the CSP 12 is stored in the embossed portion 3, the CSP 12 is supported by the two steps 2.

The bottom 3CX of the bottom 3C, which is surrounded by the protrusions 11, has moats formed deeper than the bottom 3C on both sides of each embossed portion 3 along the longitudinal direction of the tape-shaped container 10. 13 is formed so as to have the same depth. The moat 13 absorbs external force applied to each embossed portion 3 from the width direction of each embossed portion 3.

A hole 3CY having a predetermined diameter is formed in the bottom surface 3CX so that it can be checked whether the CSP 12 is stored in the embossed portion 3.

The height from the step portion 2 to the bottom surface 3C of the embossed portion 3 is selected to be longer than the diameter of each external terminal 12A of the CSP 12, so that when the CSP 12 is stored in each embossed portion 3, , External terminal 12 of CSP 12
A is prevented from coming into contact with the bottom surface 3C.

Here, as shown in FIG.
Is formed on one surface (hereinafter, referred to as a circuit surface) 12B on which the external terminals 12A are formed, and a region 12C on which the external terminals 12A are not formed (hereinafter, referred to as a terminal non-formed region) 12C. I have.

Therefore, when the CSP 12 is housed in the embossed portion 3, the projection 11 forms an area smaller than the terminal non-forming area 12C at a position corresponding to the terminal non-forming area 12C, and It is formed on the bottom surface 3C of each embossed portion 3 so as to form a region corresponding to the shape (circular in this case) of the formation region 12C.

That is, this tape-shaped container 10 is
As shown in FIG. 1, a terminal non-forming region 12C is formed on the circuit surface 12B.
Is stored in each embossed portion 3.

Therefore, in this tape-shaped container 10, when it is wound around the reel 5 as shown in FIG. 6, for example, the opening edge 3B of the embossed portion 3 on the inner peripheral side becomes embossed on the outer peripheral side as shown in FIG. Even when an external force is applied to the reel 5 in a case where the winding is displaced such that it is located on the bottom surface 3C of the reel 3, the outer force is applied from the opening edge 3B of the embossed portion 3 on the inner peripheral side due to the external force. Is applied to the embossed portion 3 in the depth direction (approximately in the radial direction of the reel 5).
1, the force can be absorbed by the bottom portion 11A surrounded by the first portion 1, so that the force can be prevented from acting on the embossed portion 3 on the outer peripheral side.

However, the tape-shaped container 1 having the above-described structure is used.
0, since the step portions 2 formed on both sides of each embossed portion 3 occupy a relatively large area along the width direction of each embossed portion 3, the terminal non-forming region on the circuit surface 12B of the CSP 12 The present invention can be applied to the case where 12C is relatively wide with respect to the arrangement pattern of the external terminals 12A. May be difficult.

For this reason, there has been a problem that it is difficult to accommodate the CSP or BGA having relatively many external terminals in the tape-shaped container 10.

The present invention has been made in view of the above points, and is intended to propose a component package which can correspond to an electronic component having a relatively large number of external terminals disposed on a circuit surface. is there.

[0024]

According to the present invention, in order to solve the above-mentioned problems, concave portions are sequentially formed at predetermined intervals along a longitudinal direction of a flexible tape-shaped object. In a component package in which electronic components having a plurality of external terminals arranged in a predetermined pattern on a circuit surface are respectively housed, each of the concave portions has a predetermined shape at each corner and / or peripheral portion of the bottom surface portion. Steps for component support are formed, and when storing electronic components in the corresponding recesses,
The step is brought into contact only with a region where the external terminals are not formed on the circuit surface of the electronic component.

Thus, when the electronic component is stored in the concave portion of the component package, the circuit surface of the electronic component is brought into contact only with each of the corners and / or the peripheral portion formed on the bottom portion of the concave portion, and Since the whole is supported by the stepped portion, even an electronic component having a relatively large number of external terminals disposed on the circuit surface can be stored in the concave portion of the component package.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

In FIGS. 1A to 1C in which parts corresponding to those in FIGS. 10A to 10C are denoted by the same reference numerals, the tape-shaped container 20 is different from the conventional tape-shaped container 10. Have substantially the same configuration except that the shape and position of the step 21 formed on the bottom surface 3C of each embossed portion 3 are different.

In this case, the step portions 21 are formed at the four corners of the bottom surface 3C of each embossed portion 3, respectively, so that the area of the bottom surface 3C of each embossed portion 3 can be reduced.
It can be extended much more than the case of 0. Further, each of these steps 21 is set to a size such that each corner of the circuit surface of the CSP abuts when the CSP (not shown) is stored, and that the CSP can be sufficiently supported. .

As an object to be stored in the tape-shaped container 20, there is a CSP 22 as shown in FIG.
2 has more external terminals 22A than the external terminals 12A formed on the circuit surface 12B of the conventional CSP 12 (FIG. 11), and is formed up to the peripheral end of the circuit surface 22B.

Incidentally, when the CSP 22 is stored in the conventional tape-shaped container 10, the circuit surface 22 of the CSP 22 is used.
Since the predetermined number of external terminals 22A arranged on the outermost periphery of B abut on the stepped portion 2 formed along the width direction of the embossed portion 3, the CSP 22 cannot be stored in the tape-shaped container 10.

In the above configuration, the tape-like container 20
In FIG. 2, each step 21 is formed at each of four corners of the bottom surface 3C of the embossed portion 3, and as shown in FIG.
When the CSP 22 is stored in the embossed portion 3 of the
No. 2 circuit surface 22B is brought into contact only with each step portion 21, and the C
The entire SP22 is supported.

As described above, the small-sized step portions 21 are formed at the four corners of each embossed portion 3 of the tape-shaped container 20, respectively. 2, the area of the bottom surface 3C of each embossed portion 3 can be expanded.
Accordingly, even the CSP 22 having the external terminals 22A formed up to the peripheral end of the circuit surface 22B can be sufficiently accommodated in the embossed portion 3 of the tape-shaped container 20.

According to the above configuration, the circuit surface 22B of the CSP 22 is provided at each of the four corners of the bottom surface 3C of each embossed portion 3.
Steps 21 each having a size such that the four corners are in contact with each other are formed, and the respective steps 21 support the CSP 22, so that the CSP 22 provided with a relatively large number of external terminals 22A can also be taped. Can be stored in the shape-like container 20.

In the above-described embodiment, the case where the CSP 22 is housed in the tape-shaped housing body 20 having the step portions 21 formed at the four corners of the bottom surface 3C of each embossed portion 3 has been described. For example, FIG.
The tape-shaped container 30 shown in FIGS. 3A to 3C in which the same reference numerals are given to the portions corresponding to (A) to (C) may be used.

That is, in the tape-shaped container 30, step portions 31 are formed on both sides of each embossed portion 3 along the width direction of the bottom surface 3C of each embossed portion 3 (FIG. 3A). When the CSP 22 is housed as shown in FIG. 4, each step 31 comes into contact with a pair of corners of the circuit surface 22B of the CSP 22 and an edge between the corners, and
The size is set to such an extent that 2 can be sufficiently supported. In this manner, the same effects as those of the above-described tape-shaped container 20 can be obtained.

In the above embodiment, the CSP 22
Steps 21 are provided at predetermined positions on the bottom surface 3C of each embossed portion 3 so that the four corners of the circuit surface 22B, the pair of corners of the circuit surface 22B, and the edge between the corners come into contact with each other.
(FIG. 1 (A)) and 31 (FIG. 2 (A)) are described, but the present invention is not limited to this, and the CSP 22
If the CSP 22 can be supported by contacting each corner of the circuit surface 22B, the shape and size of the step formed on the bottom surface 3C of each embossed portion 3 may be various shapes and sizes. good.

The point is that the CSP 22 provided with a relatively large number of external terminals 22A can be accommodated in the tape-shaped container 20 at a predetermined position on the bottom surface 3C of each embossed portion 3. If a step is formed, the shape, size, and formation position of the step may be any.

Further, in the above-described embodiment, the case where the present invention is applied to the tape-like containers 20 and 30 for storing the CSP 22 has been described. However, the present invention is not limited to this.
The invention can be applied to tape-shaped housings for various electronic components, as long as the electronic components have external terminals formed on the circuit surface, such as BGA.

[0039]

As described above, according to the present invention, concave portions are sequentially formed at predetermined intervals along the longitudinal direction of a flexible tape-shaped object, and predetermined concave portions are formed on the circuit surface corresponding to the respective concave portions. In a component package in which electronic components provided with a plurality of external terminals are arranged in a pattern, a step for supporting a component having a predetermined shape is provided at each corner and / or periphery of the bottom surface of each recess. When the electronic component is housed in the corresponding concave portion, the step can be brought into contact with only the region where the external terminals are not formed on the circuit surface of the electronic component, and as a result, Even an electronic component having a relatively large number of external terminals disposed on its surface can be accommodated in the recess of the component package.

Thus, a component package having high protection of electronic components can be realized.

[Brief description of the drawings]

FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along line AA ′, FIG. 1B is a cross-sectional view taken along line BB ′, and FIG.

FIG. 2 is a cross-sectional view showing a state where a CSP is stored in an embossed portion in the embodiment.

3A is a top view, FIG. 3B is a cross-sectional view along line AA ′, and FIG. 3C is a cross-sectional view along line BB ′, showing the configuration of a tape-shaped container according to another embodiment.

FIG. 4 is a cross-sectional view showing a state where a CSP is stored in an embossed portion in another embodiment.

FIG. 5 is a schematic perspective view showing a configuration of a conventional tape-shaped container.

FIG. 6 is a plan view showing a form at the time of transporting the tape-shaped container.

FIG. 7 is a plan view showing a state where the tape-shaped container exposed from each opening of the reel is wound around the reel;

FIG. 8 is a plan view showing a state of a winding deviation occurring when the tape-shaped container is wound around a reel.

FIG. 9 is a schematic perspective view showing a state of deformation of an embossed portion caused by a winding deviation.

FIG. 10 is a top view (A), an AA 'sectional view (B), and a BB' sectional view (C) showing the configuration of a conventional tape-shaped container.

FIG. 11 is a cross-sectional view showing a state where a CSP is housed in a conventional embossed portion.

FIG. 12 is a schematic diagram illustrating a configuration of a CSP.

[Explanation of symbols]

1, 10, 20, 30 ... tape-shaped container, 2, 21,
31 ... stepped part, 3 ... embossed part (recess), 3A, 3C
Y: Hole, 3B: Opening edge, 3C, 3CX: Bottom, 4: Flange, 5: Reel, 11: Projection, 12, 22: CSP, 12A, 22A: Outside Terminals, 12B, 22B ... circuit surface, 12C, 22C ... terminal non-formed area, 13 ... moat.

Claims (3)

[Claims] A plurality of external terminals are formed in a predetermined pattern on a circuit surface corresponding to each of the concave portions, the concave portions being sequentially formed at predetermined intervals along a longitudinal direction of a flexible tape-shaped object. In the component package adapted to accommodate the electronic components, a step for supporting the component having a predetermined shape is formed at each corner and / or peripheral portion of the bottom surface of each of the concave portions, and the electronic component is formed. A component package, wherein the step portion contacts only a region where the external terminals are not formed on the circuit surface of the electronic component when stored in the corresponding concave portion. 2. The electronic component according to claim 1, wherein the region on the circuit surface of the electronic component where the external terminals are not formed is each corner and / or peripheral end of the circuit surface. Parts packaging. 3. The component package according to claim 1, wherein the electronic component is a chip-size package or a ball grid array.