JPH07149393A - Electronic component transfer tape - Google Patents

Abstract

PURPOSE:To provide an electronic component transfer tape for preventing the deformation of the stored electronic components by reinforcing the side wall of a pocket of carrier tape. CONSTITUTION:An electronic component transfer tape is provided with a carrier tape 3 having a pocket 2 for receiving a large-sized electronic component such as QFP type semiconductor integrated circuit device and a cover tape 5 for covering the pocket 2 from above after storing the electronic component. The pocket 2 is provided with corrugated side walls 2a, a recess part 2b in which the lead part of the semiconductor integrated circuit device is receivable and a supporting part 2d having a projecting part 2c for positioning the bottom surface of the semiconductor integrated circuit device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for transporting electronic components such as semiconductor integrated circuit devices, and more particularly to an electronic component transport tape that accommodates the electronic components in a pocket of a carrier tape.

[0002]

2. Description of the Related Art When shipping and carrying electronic parts such as semiconductor integrated circuit devices and transistors, an electronic parts carrying tape for containing the electronic parts includes a carrier tape having pockets for containing the electronic parts and the electronic tape. It is composed of a cover tape which covers the pocket from the top after accommodating the parts. Regarding this electronic component carrying tape, Japanese Patent Application Laid-Open No. 2-127256 and Japanese Utility Model Laid-Open No. 58-7289.
No. 8 publication.

Here, the side wall of the pocket is flat on all four sides, and the wall thickness of the side wall is only about 70% of the wall thickness of the pocket because the mold is often deeply drawn during molding. Not often very thin.

When the electronic components are shipped and transported,
First, the electronic component is housed in the pocket of the carrier tape, and the cover tape is sealed from above.

After that, the electronic-parts-conveying tape that has finished accommodating the electronic parts is shipped and conveyed while being wound on a predetermined reel.

[0006]

However, in the above-mentioned technique, when the electronic component carrying tape is wound on the reel, a winding pressure is applied to the bottom surface of the pocket of the carrier tape which is a constituent member of the electronic component carrying tape, The upper surface of the lower carrier tape pushes up the pocket. At this time, since the side wall of the pocket is often thin and fragile, the side wall of the pocket is crushed and the bottom surface of the pocket is deformed.

As a result, the electronic components housed therein are
For example, there is a problem that the leads of the semiconductor integrated circuit device are also deformed.

[0008] Further, since the wound electronic component carrying tape draws a circle along the reel winding core, the pocket may be curved and the contained electronic component may be deformed.
In particular, at a portion close to the reel core (from the beginning of winding to the second to third laps), the entire pocket is significantly curved along the reel core, so that the electronic component cannot be accommodated.

Therefore, there is a problem in that a portion near the reel winding core cannot store the electronic parts, which causes a very inefficient housing state.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component carrying tape which prevents deformation of an electronic component housed therein by strengthening a side wall of a pocket of the carrier tape.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0012]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, there is provided an electronic component carrying tape for housing electronic components, the carrier tape having a plurality of pockets for housing the electronic components, and a cover tape for covering the pockets from above after housing the electronic components. The side wall of the pocket has a corrugated shape in a direction perpendicular to the height direction of the side wall, or the side wall of the pocket is provided with a rib parallel to the height direction of the side wall. is there.

[0014]

According to the above-mentioned means, the side wall of the pocket of the carrier tape, which is a constituent member of the electronic component carrying tape, is formed in a corrugated shape in the direction perpendicular to the height direction of the side wall, or By providing ribs parallel to the height direction of the side wall on the side wall, the strength in the height direction of the side wall is increased. Even if the pocket is pushed and loaded, the pocket is not easily crushed, and as a result, the deformation of the electronic component can be prevented.

Further, since the strength in the height direction of the side wall of the pocket is increased, the strength of the entire pocket is also increased,
When the electronic component carrying tape is wound on a reel, the strength of the pocket is higher than the strength of the parts other than the pocket (the part between the pockets). It is possible to make the polygonal shape of the tape for winding the electronic component carrying tape instead of the circle. As a result, the pocket is not curved, so that the deformation of the electronic component can be prevented.

Furthermore, since the pocket does not bend,
Location near the reel core (from the beginning of winding to the 2nd to 3rd laps)
Also, since the electronic parts can be housed, an efficient housing situation can be created.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a partial perspective view showing an example of the structure of an electronic component carrying tape according to an embodiment of the present invention, and FIG. 2 is an electronic component carrying tape according to an embodiment of the present invention. FIG. 4 is a partial plan view showing an example of the electronic component accommodation state in FIG. 3, and FIG. 3 is a partial conceptual diagram showing an example of the winding state of the electronic component carrying tape which is an embodiment of the present invention.

First, the configuration of the electronic component carrying tape of the first embodiment will be described with reference to FIGS. 1 and 2.
A carrier tape 3 having a pocket 2 for accommodating a large-sized electronic component 1 such as an FP type semiconductor integrated circuit device, and a cover tape 5 for covering the pocket 2 from above after accommodating the electronic component 1. Further, the pocket 2 has a corrugated side wall 2a, a recess 2b for accommodating a lead portion of the semiconductor integrated circuit device, and a protrusion 2c for positioning the bottom surface of the semiconductor integrated circuit device.
And a pedestal portion 2d provided with.

Here, the corrugation of the side wall 2a is wavy in a direction perpendicular to the height direction of the side wall 2a, and when the semiconductor integrated circuit device is accommodated in the pocket 2, the semiconductor integrated circuit device has a corrugated shape. The side wall 2a, the recess 2b, the protrusion 2c, and the base 2 are arranged so that the lead portion does not contact the side wall 2a.
It is a wave shape with clearance taken into consideration with respect to d.

Further, the carrier tape 3 is provided with a sprocket gear hole 4 used when the carrier tape 3 is conveyed.

Next, the operation of the electronic component carrying tape according to the first embodiment will be described with reference to FIGS. 1, 2 and 3.

First, the semiconductor integrated circuit device which is the electronic component 1 is housed in the pocket 2 of the carrier tape 3. At this time, the lead portion of the semiconductor integrated circuit device fits in the recess 2b of the pocket 2, and the bottom surface of the semiconductor integrated circuit device is positioned by the protrusion 2c provided on the base 2d of the pocket 2. Further, since the lead portion of the semiconductor integrated circuit device has a corrugated shape in which clearance is taken into consideration so as not to contact the side wall 2a of the pocket 2, the transport of the electronic component transport tape containing the semiconductor integrated circuit device (electronic component 1) is performed. Even if vibration or the like occurs therein, the lead portion of the semiconductor integrated circuit device does not come into contact with the side wall 2a to be deformed.

Subsequently, after the semiconductor integrated circuit device (electronic component 1) is accommodated, the cover tape 5 is sealed from above the pocket 2 to complete the electronic component carrying tape in which the semiconductor integrated circuit device is accommodated.

Further, the reel winding core 6 is wrapped with an electronic component carrying tape containing the semiconductor integrated circuit device (electronic component 1). At this time, since the side wall 2a of the pocket 2 forms a corrugated shape in a direction perpendicular to the height direction of the side wall 2a, the strength of the side wall 2a in the height direction is increased. When the carrier tape is wound around the reel winding core 6, the pocket 2 is not easily crushed even if the carrier tape 3 is pressed by the lower carrier tape 3 and a load is applied, and as a result, the electronic component 1 is deformed (semiconductor integrated circuit). It is possible to prevent deformation of the lead portion of the device.

Further, since the strength of the side wall 2a in the height direction is increased, the strength of the entire pocket 2 is also increased, and when the electronic component carrying tape is wound around the reel winding core 6, a portion other than the pocket 2 ( Since the strength of pocket 2 is higher than the strength of (the location between pocket 2 and pocket 2),
The waist of the electronic component carrying tape is broken at a place other than the pocket 2 (a place between the pocket 2 and the pocket 2),
The state in which the electronic component carrying tape is wound is not a circle,
It can be polygonal. As a result, since the pocket 2 is not curved, the deformation of the electronic component 1 can be prevented.

Further, since the pocket 2 is not curved, the electronic component 1 can be housed even in a portion close to the reel winding core 6 (from the beginning of winding to the second to third laps), so that the housing condition is efficient. Can be generated.

(Embodiment 2) FIG. 4 is a partial perspective view showing an example of the structure of an electronic component carrying tape according to another embodiment of the present invention.

The configuration of the electronic component carrying tape according to the second embodiment will be described with reference to FIG. 4. A pocket for accommodating a large electronic component 1 (see FIG. 2) such as a QFP type semiconductor integrated circuit device. 2 and a cover tape 5 covering the pocket 2 from above after housing the electronic component 1, and the pocket 2 further includes a side wall 2a provided with ribs 7 on the outer periphery thereof. Recessed portion 2b for accommodating the lead portion of the semiconductor integrated circuit device or the like
And a pedestal portion 2d having a protrusion 2c for positioning the bottom surface of the semiconductor integrated circuit device.

Here, the ribs 7 provided on the outer periphery of the side wall 2a are provided in parallel to the height direction of the side wall 2a, and when the semiconductor integrated circuit device is housed in the pocket 2, the semiconductor integrated circuit is formed. The lead portion of the circuit device is the side wall 2a.
The clearance is considered among the side wall 2a, the recess 2b, the protrusion 2c, and the base 2d so as not to come into contact with.

Further, the carrier tape 3 is provided with a sprocket gear hole 4 used when the carrier tape 3 is conveyed.

Next, the operation of the electronic component carrying tape according to the second embodiment will be described with reference to FIGS. 3 and 4.

First, the semiconductor integrated circuit device which is the electronic component 1 is accommodated in the pocket 2 of the carrier tape 3. At this time, the lead portion of the semiconductor integrated circuit device fits in the recess 2b of the pocket 2, and the bottom surface of the semiconductor integrated circuit device is positioned by the protrusion 2c provided on the base 2d of the pocket 2. Further, since the clearance is taken into consideration so that the lead portion of the semiconductor integrated circuit device does not come into contact with the side wall 2a of the pocket 2, during the transportation of the electronic component transport tape containing the semiconductor integrated circuit device (electronic component 1), Even if vibration or the like occurs, the lead portion of the semiconductor integrated circuit device does not come into contact with the side wall 2a to be deformed.

Then, after the semiconductor integrated circuit device is accommodated, the cover tape 5 is sealed from above the pocket 2 to complete the electronic component carrying tape in which the semiconductor integrated circuit device is accommodated.

Further, the reel winding core 6 is wrapped with an electronic component carrying tape containing the semiconductor integrated circuit device (electronic component 1). At this time, since the ribs 7 parallel to the height direction of the side wall 2a are provided on the outer periphery of the side wall 2a of the pocket 2, the strength of the side wall 2a in the height direction is increased. When the component carrying tape is wound around the reel winding core 6, the pocket 2 is not easily crushed even if it is pushed by the lower carrier tape 3 and a load is applied. As a result, the electronic component 1 is deformed (semiconductor integrated circuit). It is possible to prevent deformation of the lead portion of the circuit device.

Further, since the strength of the side wall 2a in the height direction is increased, the same operation as that described in the first embodiment works. That is, when the electronic component carrying tape is wound around the reel core 6, the waist of the electronic component carrying tape is broken at a place other than the pocket 2 (a place between the pocket 2 and the pocket 2), and the electronic component carrying tape is wound. The state of being drawn can be made into a polygon instead of a circle. As a result, since the pocket 2 is not curved, the deformation of the electronic component 1 can be prevented.

Further, since the pocket 2 is not curved, the electronic component 1 can be housed even in a portion close to the reel winding core 6 (from the beginning of winding to the second to third laps), so that the housing condition is efficient. Can be generated.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, although the rib described in the second embodiment is provided on the outer circumference of the side wall, it may be provided on the inner circumference of the side wall.

In this case, the actions and effects obtained are the same in both cases.

[0041]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). By forming the side wall of the pocket of the carrier tape in the electronic component carrying tape in a wavy shape perpendicular to the height direction of the side wall, or on the side wall of the pocket, ribs parallel to the height direction of the side wall are formed. Since the strength in the height direction of the side wall is increased by being provided, the pocket is easily crushed even when a load is applied by being pushed by the lower carrier tape when the electronic component carrying tape is wound on the reel. As a result, it is possible to prevent deformation of the electronic component (semiconductor integrated circuit device or the like).

(2). Since the strength of the side wall of the pocket of the carrier tape in the electronic component carrying tape is increased in the height direction, the strength of the entire pocket is also increased. Since the strength of the pocket is higher than the strength of (the portion between the pocket and the pocket), the waist of the electronic component carrying tape is broken at a place other than the pocket and the winding state of the electronic component carrying tape is not a circle but a large number. It can be rectangular. As a result, since the pocket is not curved, it is possible to prevent deformation of the electronic component (semiconductor integrated circuit device or the like).

(3). Since the pockets of the carrier tape in the electronic component carrying tape are not curved, the electronic components can be accommodated even in a portion close to the reel winding core (from the beginning of winding to the second to third laps), so that the electronic components can be efficiently stored ( It is possible to accommodate a semiconductor integrated circuit device, etc.).

[Brief description of drawings]

FIG. 1 is a partial perspective view showing an example of the structure of an electronic component carrying tape according to an embodiment of the present invention.

FIG. 2 is a partial plan view showing an example of a state where electronic components are accommodated in the electronic component carrying tape according to the embodiment of the present invention.

FIG. 3 is a partial conceptual diagram showing an example of a winding state of an electronic component carrying tape according to an embodiment of the present invention.

FIG. 4 is a partial perspective view showing an example of the structure of an electronic component carrying tape according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component (semiconductor integrated circuit device) 2 Pocket 2a Side wall 2b Recess 2c Projection 2d Stand 3 Carrier tape 4 Sprocket gear hole 5 Cover tape 6 Reel core 7 Rib

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display H05K 13/02 B

Claims (2)

[Claims] 1. A carrier tape for storing electronic components, comprising: a carrier tape having a plurality of pockets for storing the electronic components; and a cover tape for covering the pockets from above after containing the electronic components. And a side wall of the pocket having a corrugated shape in a direction perpendicular to a height direction of the side wall. 2. An electronic component carrying tape for housing electronic components, comprising: a carrier tape having a plurality of pockets for housing the electronic components; and a cover tape for covering the pockets from above after housing the electronic components. And a rib parallel to the height direction of the side wall is provided on the side wall of the pocket.