JP2004262550A - Storage board for storing chip-type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a storage board for storing chip-state electronic components capable of preventing or restraining occurrence of vibration when a surface cover tape is peeled off from a base board, and of preventing the chip-state electronic components from being scattered from the board. <P>SOLUTION: The storage board stores chip-state electronic components and is suitable for a high-speed chip-removing process. The storage board comprises the base board (2), with the surface cover tape (3) and a reverse cover tape (6) being thermally bonded in two striped surface areas (7, 8), each having a width of 0.5±0.15mm, on the surface of the base pasteboard, while having a plurality of chip storing transparent holes and delivery holes. The average roughness along the center line of the surface of the base board is 2.5-4.0 μm, while the average peel strength (P<SB>ave</SB>) between the base board and the surface cover tape is 0.1-0.6 N, with its peel strength SN ratio [(P<SB>max</SB>-P<SB>min</SB>)/P<SB>ave</SB>] being 0.40 or lower. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a storage board for storing electronic components in the form of chips. More specifically, the present invention relates to a storage board for storing chip-type electronic components, and in this storage board, a front cover tape is attached to a base board with excellent adhesive stability. Being bonded, the base paper has a high resistance to the occurrence of vibrations when the front cover tape is peeled off from the base paper, so that due to this vibration, The chip-type electronic component can be prevented from dissipating from the storage board.

  A conventional storage (carrying) mount for chip-shaped electronic components is a mount base (where the mount base is a plurality of rectangular through holes for storing chip-shaped electronic components and a storage device for chip-shaped electronic components, Or a plurality of circular feed through holes for moving the base paper or the resulting storage paper in the unloader), a front cover tape bonded on the surface of the base paper, and And a back cover tape joined to the back of the base paper. The rectangular and circular through holes penetrate in a row from the front side to the back side of the base sheet along the longitudinal direction of the base sheet. The back side opening of the rectangular through hole is closed by a back cover tape, and the front side opening of the rectangular through hole is sealed by a front cover tape, for example, by a thermal bonding method.

  The rectangular through-holes may be replaced by rectangular holes or depressions, which open at the surface of the baseboard. The holes or depressions can be formed by embossing the base paper into a rectangular shape. In this case, the back surface of the base paper is not covered with the back cover tape.

Usually, the storage board is manufactured and used by the following method.
(1) The board paperboard for base paper is slit into a tape shape having a desired width.
(2) A plurality of holes or through holes for accommodating chip-shaped electronic components in the obtained base paper, and a plurality of circular shapes for moving the storage paper in the chip storage machine or unloader. A through hole is formed.
(3) Cover the back surface of the base paper with the back cover tape. At this time, the back cover tape is adhered to the back surface of the base paper under heat and pressure by a heat bonding method to close the opening on the back surface side of the rectangular through hole. When a plurality of rectangular holes or depressions are formed instead of the rectangular through holes of the base paper, the step of covering the back surface can be omitted.
(4) A plurality of chip-shaped electronic components are housed in the rectangular through-holes through the unclosed front opening.
(5) A front cover tape is adhered to the surface of the base paper by a heat sealing method to seal a front opening of the rectangular through hole.
(6) Wrap the storage board, which is obtained by the above steps and stores the chip-shaped electronic components, around the cassette reel.
The storage board wound around the cassette reel is shipped to a user.
(7) Before the chip-shaped electronic component is actually used, the front cover tape is peeled off from the surface of the base paper of the storage board, and the chip-shaped electronic component is taken out from the rectangular through hole.

In the manufacture and use of the conventional mounting paper for electronic component chips, it was believed that it was most important to firmly adhere the front cover tape to the mounting paper. JP-A-7-137,769 (Patent Document 1) discloses that the adhesive strength between the front cover tape and the surface of the base paper, the roughness (R _max ) of the surface of the base paper are specified values or less. It is disclosed that the control is performed to increase the power. Japanese Patent Application Laid-Open No. 3-212387 (Patent Document 2) discloses that the adhesive strength between the front cover tape and the surface of the base paper is such that a specific resin layer is formed on the surface of the base paper. Teach that it can be enhanced by:

  However, the above-mentioned improved storage board is not yet practically satisfactory. That is, when the front cover tape is peeled off from the base paper, vibration occurs in the base paper, and therefore, the chip-shaped electronic component passes through the front opening from the opened rectangular through hole. Dissipate. This problem is described in JP-A-63-281967 (Patent Document 3).

  In a punch-type storage board in which a plurality of rectangular through holes are formed in a base board by a punching method, both front and back surfaces of the base board are covered with front and back cover tapes. Further, in an embossed storage board in which a plurality of rectangular holes or depressions are formed in the base paper by the embossing method, only the surface of the base paper is covered with the front cover tape.

  In both types of storage boards, the front cover tape must be removed from the surface of the base paper in order to remove the chip-type electronic component from the hole or through hole of the storage board. That is, in order to stably hold the chip-type electronic component in the hole or through hole of the base paper, the front cover tape is strongly bonded to the surface of the base paper with high peel strength. For the purpose of easily removing chip-type electronic components from the holes or through holes in the base paper without causing vibrations in the base paper, The resistance to separation from the paper surface should be as low as possible. Therefore, the peel strength between the front cover tape and the base paper must be properly controlled so that the two conflicting objectives are achieved.

  Japanese Patent Laying-Open No. 2002-337975 (Patent Document 4) discloses a cover tape for packaging electronic components. This document discloses an improvement for binding a cover tape to an embossed storage tape containing a thermoplastic resin and appropriately controlling the peel strength between the cover tape and the thermoplastic resin storage tape. The disclosed adhesive is disclosed. When the cover tape is bonded to a thermoplastic resin storage tape with high surface smoothness, the peel strength between the cover tape and the storage tape can be easily controlled by selecting and using an appropriate adhesive. can do. However, if the thermoplastic resin storage tape is replaced by a paperboard having higher porosity and surface roughness than the thermoplastic resin storage tape, the cover tape as described above will be tightly bonded to the base paper. The requirement that the cover tape must be easily peeled off from the base paper without causing vibrations on the base paper, only by improving the adhesive to the cover sheet. , Can not be satisfied enough.

  Recently, the step of removing the chip-type electronic component from the storage board and the step of mounting the chip-type electronic component in an electronic device, for example, a substrate of a printed wiring board, are required to be performed at an increased speed than before. ing. This increased speed causes an increase in the speed of the step of peeling the front cover tape from the base paper, thereby promoting the vibration of the base paper. In addition, the size and weight of the individual chip-type electronic components are reduced, so that the degree of dissipation of the chip-shaped electronic components from the holes or through holes of the substrate due to the vibration of the substrate is significantly increased. ing. In particular, when the mounting base for storing the chip-type electronic components is made of a paperboard having a structural uniformity lower than that of the thermoplastic resin tape, the obtained mounting base is the mounting base for the chip-type electronic components. The degree of dissipation from the holes or through holes is increased. Therefore, this is a problem that must be solved.

JP-A-7-137770 JP-A-3-212387 JP-A-63-281967 JP-A-2002-337975

  An object of the present invention is to prevent or suppress the occurrence of vibration when the front cover tape is peeled off from the base paper, and therefore, the chip-type electronic component is dissipated from the storage paper by the vibration. It is an object of the present invention to provide a chip-type electronic component storage board that can prevent the occurrence of the electronic component.

The above object can be achieved by the mounting board of the present invention for storing chip-type electronic components. The storage board of the present invention is a storage board for storing chip-type electronic components,
A tape base having a width of 8 ± 1.0 mm;
5 comprising a heat fusible polymer material, extending along the longitudinal direction of the base paper, and measuring from one side edge of the base paper to the opposite side edge of the surface of the base paper. A front cover tape covering a portion having a width of .25 ± 0.25 mm; and a back cover tape extending along the longitudinal direction of the base paper and covering the back surface of the base paper. Including
(1) The front cover tape is thermally bonded to the surface of the base paper in two striped areas, and each of the two striped areas is in the longitudinal direction of the base paper. And a width of 0.5 ± 0.15 mm, a side edge of the front cover tape located on a side edge of the base paper, and The distance between the side edge of the one surface area facing the side edge of the front cover tape is 0.7 ± 0.20 mm, and the distance between the two striped surface areas is one another. The distance between the opposing side edges is 3.0 ± 1.0 mm,
(2) the base paper has a plurality of through-holes formed in an intermediate portion between the two striped surface areas and penetrating from the front surface to the back surface of the base paper;
(3) The surface of the base paper has a center line average roughness (Ra) of 2.5 to 4.0 μm measured according to JIS B601, and
(4) The average peel strength (P _ave ) between the base paper and the front cover tape that are thermally bonded to each other in the two striped surface areas is 0.1 to 0.6 N; The following formula:
SN ratio = ( _{Pmax- Pmin} ) / _Pave
[In the above formula, _Pmax represents the maximum peel strength between the base paper and the front cover tape, and _Pmin represents the minimum peel strength between the two.]
The signal-to-noise ratio of the peel strength calculated in accordance with the following formula is 0.40 or less.
It is characterized by the following.
In the storage board of the present invention, it is preferable that the base board further includes at least one selected from polyvinyl alcohol, polyacrylamide and starch, which is coated or impregnated on at least the surface or the surface portion thereof.
In the storage board of the present invention, the polyvinyl alcohol preferably has a saponification degree of 68 to 75 mol% and a number average polymerization degree of 800 to 1200.
In the storage board of the present invention, it is preferable that the base paper has a basis weight of 300 to 1,000 g / m ² .
In the storage board of the present invention, the front cover tape is formed from a laminated polymer sheet, and the laminated polymer sheet includes an ethylene-vinyl acetate copolymer layer and a polyethylene terephthalate layer laminated thereon. Preferably, the ethylene-vinyl acetate copolymer layer is heat-bonded to the surface of the base paper in the two striped areas.

The storage board of the present invention will be described with reference to FIGS. 1- (A) and (B) of the accompanying drawings. A storage board 1 for storing a chip-type electronic component (not shown) of the present invention includes a tape-shaped base paper 2 having a width (W ₁ ) of 8 ± 1.0 mm, and a front cover. The back cover tape 3 includes a tape 3 and a back cover tape 6. The front cover tape 3 includes a thermo-adhesive polymer material, extends along the longitudinal direction (indicated by an arrow 2 a) of the base paper 2, and Part of the surface of the base paper 2 (this part has a width (W ₂ ) of 5.25 ± 0.25 mm from the side edge 4 to the opposite side edge 5 of the base paper 2) The back cover tape 6 extends along the longitudinal direction (indicated by an arrow 2a) of the base paper 2 and covers the back surface of the base paper 2.

(1) In the storage board 1 of the present invention, the front cover tape 3 is thermally bonded to the surface of the base paper 2 in two striped areas 7 and 8, and the two striped areas are provided. Reference numerals 7 and 8 are defined by a pair of side edge lines 7a and 7b and a pair of other side edge lines 8a and 8b extending parallel to the longitudinal direction (indicated by an arrow 2a) of the base sheet 2. It is. Each of the surface areas 7 and 8 has a width (W ₃ ) of 0.5 ± 0.15 mm and a side edge 4 a of the front cover tape 3 located on the side edge 4 of the base sheet 2. The distance (D ₁ ) between one of the two striped surface areas 7 facing the side edge 4a of the front cover tape 3 and one side edge 7a is 0.7 ± 0.20 mm, The distance (D ₂ ) between the opposing side edges 7b and 8a of the two striped surface areas 7 and 8 is 3.0 ± 1.0 mm.
Therefore, the portion 2b that is not the cover Taimotoshi 2 has a width of _{2.75mm (W 4 = W 1 -W} 2).

(2) In the storage board 1 of the present invention, the base board 2 has a plurality of through holes 9 located from the front surface to the back surface, and these through holes 9 correspond to two holes of the base board 2. It is formed in an intermediate portion between the striped heat bonding surface areas 7 and 8.
The shape of the through hole 9 is not limited at all. Generally, the through hole 9 has a rectangular shape in its plan view. The rectangular through hole 9, preferably, the width of 0.20~4.0mm (W ₅₎ and 0.10~2.5mm length of (L), the depth of 0.10~1.5mm (D ₃ ). The center-to-center spacing (D4) of the through holes is usually 1 to ₄ mm, and is between the side edges 9a and 9b and the side edges 7b and 8a of the rectangular through hole 9, that is, 7b-9a and 8a-. 9b distance (D ₅₎ is preferably not more than 1.9 mm.
In the storage board of the present invention, as shown in FIGS. 1A and 1B, a plurality of circular through-holes 10 are usually formed in the uncovered portion 2b of the base board 2. .
The circular hole 10 is arranged in a single line in the longitudinal direction indicated by arrow 2a, and has a diameter of 1.40~1.60mm (D _7). The circular through hole 10 is used to feed and move the storage board in a chip filling machine or a chip unloading machine.
The distance D ₆ between the centers of the circular hole 10 is absolutely not limiting, typically the distance D ₆ is 2.0～4.5Mm.
The bottom of the circular through hole 10 is open and is not closed by the back cover tape 6.

  (3) Further, the center line average roughness (Ra) of the surface of the base paper 2 is 2.5 to 4.0 μm, preferably 2.70 to 3.80. The center line average roughness (Ra) is measured according to JIS B601.

(4) Further, the average peel strength (P _ave ) between the base paper and the front cover tape thermally bonded in the two striped areas is 0.1 to 0.6. , Preferably 0.10 to 0.40 N, and the signal-to-noise (SN) ratio of the peel strength is 0.4 or less, preferably 0.3 or less. The signal-to-noise (SN) ratio is calculated by the following equation.
SN ratio = ( _{Pmax- Pmin} ) / _Pave
In the above equation, _Pmax represents the highest peel strength between the base paper and the front cover tape, and _Pmin represents its lowest peel strength.

The peel strength between the front cover tape and the base paper was determined in accordance with JIS C 0803-1999 for the peel strength between the front cover tape and the base paper of a 130 mm long storage board test piece. It was measured at a speed of 300 m / min and a peeling time of 12 seconds. This measurement was performed on ten test pieces, and the average peel strength P _ave , maximum peel strength P _max and minimum peel strength P _min of the storage board were determined from the measurement data.

In the actual production of the storage board, the thermal bonding conditions between the base board and the front cover tape vary depending on the size of the chip-shaped electronic component and its packaging speed. Usually, the paperboard used as the backing paper for the backing paper is selected from paperboards having an upper surface whose center line average roughness (Ra) measured according to JIS P601 is in the range of 2.5 to 4.0 μm. Preferably, it is When preparing the test piece, the paperboard for the base paper was slit into a tape having a width of 9 mm to prepare a base paper, and a polyethylene terephthalate resin formed by a co-extrusion method. And a laminated film (trade name: No. 318H-14A, manufactured by Nitto Denko Corporation) having a thickness of 53 μm and a width of 5.25 mm including a lower layer containing ethylene-vinyl acetate copolymer resin and an upper layer containing ethylene-vinyl acetate copolymer resin. The formed front cover tape is thermally bonded to two striped surface areas of the base paper, each having a width of 0.4 mm and a length of 130 mm, and one of the striped surface areas is attached to the base paper. It is formed at a position 0.5 mm inward from the side edge of the base paper, and the other one is present at a distance of 30 mm from the striped surface area, and the thermal bonding is performed at a temperature of 155 ° C. and 1.5 MPa. This heat bonding is performed by heating and pressing for 2 seconds under pressure. From extent after 1 hour, the resulting test piece under the conditions, when subjected to the measurement of the peel strength to comply with JIS C 0806-3, the average peel strength of 0.1~0.6N (P _ave ), More preferably 0.1 to 0.4 N, and preferably an SN ratio of 0.40 or less, more preferably 0.3 or less.
In the method for measuring the peeling strength of the storage board, it is desirable to fairly determine whether the mounting board is suitable for a practical storage board.

The inventors of the present invention have conducted extensive research and analysis on the phenomenon in which chip-shaped electronic components are dissipated from the storage board when the front cover tape is peeled off from the base board. As a result, even if the speed at which the chip-shaped electronic component is incorporated into the electronic device is increased, the speed at which the front cover tape is peeled off from the base paper is increased, and the size and mass of the chip-shaped electronic component are small. Also, the dissipation phenomenon of the chip-shaped electronic component is controlled by controlling the center line average roughness (Ra) of the surface of the base paper within a specific range, and controlling the average peel strength (P _ave ) and the SN ratio respectively. It has been found that it can be prevented by regulating within a specific range. The present invention has been completed based on the above-mentioned headings.
When the average peel strength (P _ave ) is less than 0.1 N, the front cover tape is easily separated from the base paper at times other than the peeling step, so that the chip-shaped electronic component can be stored in the storage board. They may jump out and be lost. This must be prevented.
When the average peel strength (P _ave ) exceeds 0.6 N, the surface of the base paper is fluffed by the peeling step of the front cover tape, and sometimes the formed fluff is removed from the electronic component of the chip-shaped electronic component. This has an adverse effect on the process of assembling into equipment.

  When the S / N ratio exceeds 0.4, the resistance to peeling of the front cover tape from the base paper changes during the front cover tape peeling process, causing vibrations in the base paper. It facilitates the separation of the front cover tape from the base paper, and makes it very easy to separate the front cover tape, thereby dissipating the chip-shaped electronic components. Therefore, the SN ratio must be controlled to 0.4 or less. In particular, when a light chip that is easily dissipated is used, it is preferable to control the SN ratio to 0.3 or less. In a storage board with a controlled S / N ratio, dissipation of chip-shaped electronic components can be significantly restricted.

In order to control the average peel strength (P _ave ) to 0.1 to 0.6 N and to control the peel strength SN ratio to 0.4 N or less, it conforms to JIS B601 on the surface of the base paper. It is very beneficial to control the center line average roughness (Ra) to be 2.5 to 4.0 μm. When the center line average roughness (Ra) is higher than 4 μm, the pressure for thermally bonding the surface cover tape to the surface of the base paper is unevenly applied to the surface of the base paper. The adhesive strength and peel strength between the cover tape and the base paper become uneven. When the center line average roughness (Ra) is less than 2 μm, the binding between the front cover tape and the base paper is performed only in a plurality of small surface areas separated from each other. Therefore, the total bonding area becomes insufficient and the obtained thermal bonding strength becomes unsatisfactory.

  The peel strength between the front cover tape and the base paper is increased by allowing the surface portion of the base paper to include an adhesive containing at least one selected from polyvinyl alcohol, polyacrylamide and starch. , Can be enhanced. The reason for the increased peel strength is also not fully understood, because the layer of adhesive formed between the front cover tape and the backing paper is It is presumed that the adhesion between and is appropriately and stably controlled.

The center line average roughness (Ra) of the surface of the base paper can be set to a target value of 2.5 to 4.0 μm by any one of the conventional surface smoothing methods. For example, a smoothing machine (calender) is disposed in a papermaking system, and the center line average roughness (Ra) of the surface of the obtained paperboard is specified to a desired value. Alternatively, a smoothing machine (calender) is placed outside the papermaking system.
As still another method, a surface smoothing agent is applied or impregnated on or in a surface portion of the base paper. In this case, the center line average roughness (Ra) of the surface of the base paper can be controlled by controlling the application amount of the tape and the smoothing agent.

In order to make the surface portion of the base paper contain a smoothing agent, the surface layer of the paperboard is formed from a pulp slurry containing the smoothing agent by an internal addition method, or the smoothing agent is added by an external addition method. The coated coating solution is coated on the surface of the paperboard. This external addition method is advantageous in that it is easy to control the amount of the smoothing agent added to a desired value, and is therefore practically preferable.
The coating of the leveling agent is performed using a conventional coating means, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate coater, a roll coater, for example, a size press or calender coater, a bill blade coater or a bell coater coater. be able to.

The content of the leveling agent in the surface layer of the base paper varies depending on the type of the leveling agent and the method of application, and therefore should be set so as to obtain the best results. Usually, when the content of the leveling agent is in the range of 0.2 to 2.0 g / m ² , it is sufficient to obtain good results. When the content is less than 0.2 g / m ² , the leveling agent may not be able to exhibit a satisfactory leveling effect, and the obtained peel strength SN ratio may be insufficient. When the front cover tape is peeled off, the surface of the base paper may be fluffed by fibers raised from the surface. If this content exceeds 2.0 g / m ² , not only does the smoothing effect become saturated and economic disadvantages occur, but also the stiffness of the resulting base paper becomes too high, The mechanical properties of the base paper may be unbalanced.

The grammage of the mounting board for storing the chip-shaped electronic component is variable depending on the size of the chip-shaped electronic component to be stored, but is usually in the range of 300 to 1000 g / m ^2. . In order to produce a paperboard having the above-mentioned basis weight, a multilayer papermaking method is actually used rather than a single-layer papermaking method. The structure of the paperboard obtained by this multilayer papermaking method can be easily controlled.

  The surface smoothing agent for the base paper preferably contains at least one selected from polyvinyl alcohol, polyacrylamide and starch, and these smoothing compounds include, for example, high saponification degree polyvinyl alcohol, low saponification degree Polyvinyl alcohol, modified polyvinyl alcohol, modified polyacrylamide, unmodified starch, oxidized starch, and modified starch are included. In particular, when a low saponification degree polyvinyl alcohol having a saponification degree of 68 to 75 mol% and a polymerization degree of 800 to 1200 is used, the peel strength is controlled to a suitable value without generating fluff on the surface of the base paper. However, the peel strength SN ratio can be set to a low value.

  In the storage board of the present invention, the base paper is manufactured using a paper machine from a pulp material including at least one selected from chemical pulp, mechanical pulp, recycled pulp, non-wood pulp, and synthetic polymer pulp. Is done. The pulp slurry for forming the base paper may be, if necessary, for example, sizing agents such as rosin, styrene-maleic acid copolymer, alkenyl succinic anhydride and alkyl ketene dimer, paper strength enhancer, fixing aid, for example, It may also contain a hydration inhibitor such as polyamide polyamine ethichlorohydrin, a foaming inhibitor such as a filler such as talc, and an internal additive containing at least one selected from dyes.

  Although there is no limitation on the type of paper machine and the papermaking conditions used in the production of the baseboard paperboard that can be used in the present invention, usually, the baseboard paperboard is a multilayer paper machine or a short netting machine. In this case, a papermaking method in which a plurality of paper layers are combined into one piece of paperboard, and a surface paper layer containing the added additive is formed by an internal addition method or an external addition method using a coater at this time. Used.

Examples The present invention is further described by the following examples, which do not limit the scope of the invention.
In the following Examples and Comparative Examples, the content expressed in% and the concentration expressed in% are the solid content or active ingredient content expressed in mass%, and the solid content expressed in mass% or effective content, respectively. Component concentration.
The paper material subjected to the measurement of the peel strength or the mounting test (practical chip storage and removal test) was pretreated in accordance with JIS B8111.

The measurement of the peel strength and the mounting test were performed as follows.
(1) Measurement of Peeling Strength Ten pieces of base paper were prepared by slitting the paperboard material for the base paper into a tape shape having a width of 8 mm and a length of 130 mm.
Referring to FIGS. 1- (A) and (B), as a front cover tape, a polyethylene terephthalate lower layer produced by a co-extrusion lamination method and an ethylene-vinyl acetate copolymer (EVA) upper layer are included. Using a laminated tape (trade name: No. 318H-14A, manufactured by Nitto Denko Corporation) having a width of 5.25 mm and a thickness of 53 μm, place the front cover tape on each part of the base paper, At this time, as shown in FIGS. 1- (A) and (B), the EVA upper layer was brought into contact with the surface of the base paper, and these were made to have a width (W ₃ ) of 0.4 mm. And thermally bonded in two striped areas located at D ₁ = 0.5 mm and D ₂ = 3 mm. This heat bonding was performed using a heat sealing tester (model: TP701S, manufactured by Tester Sangyo Co., Ltd.) under the conditions of a heat bonding temperature of 155 ° C., a heat bonding pressure of 1.5 MPa, and a heat bonding time of 0.2 seconds, Test specimens were prepared. Next, one hour after the heat bonding, the test piece was subjected to measurement of the peel strength in accordance with JIS C 0806-3. The peeling speed in this measurement was 300 mm / min, and the measurement time was 12 seconds. From the measurement results, the average peel strength (P _ave ), the maximum peel strength (P _max ), and the minimum peel strength (P _min ) were determined, and the SN ratio was calculated according to the following equation.
SN ratio = ( _{Pmax- Pmin} ) / _Pave

(2) Mounting test (practical chip storage and removal test)
This will be described with reference to FIGS. 1- (A) and (B). A paperboard material having a length of 40 m was slit into a tape shape having a width (W ₁ ) of 8 mm. In the obtained base paper 2, a plurality of circular through-holes 10 having a diameter (D ₇ ) of 1.5 mm are formed at an interval (D ₆ ) of 4 mm, and the dimensions (L = 0.62 mm, W ₅ = A plurality of rectangular through-holes 9 (1.12 mm) were formed at an interval (D ₄ ) of 2 mm. As shown in FIGS. 1- (A) and (B), the back surface of the base paper having the through holes was covered with a back cover tape and sealed. An electric resistance chip having a length of 1.0 mm, a width of 0.5 mm, a height of 0.35 mm, and a mass of 0.59 mg was housed in the rectangular through-hole. Next, the surface of the base paper is covered with the same front cover tape as described above, and a heat sealing machine (model: TWA 6600, manufactured by Tokyo Weld Co., Ltd.) is used. Under the conditions of 49 MPa and an adhesive speed of 3 m / min, the front cover tape was mounted on the two striped surface areas 7 and 8 as shown in FIGS. 1- (A) and (B). Heat bonded to paper.
The chip-shaped electronic component storage and mounting board thus obtained is subjected to a practical chip removal process using a mounter (trade name: Panasert MSR, manufactured by Matsushita Electric Industrial Co., Ltd.), and 10,000 chips are mounted at a mounting speed of 600. Removed at chips / minute. During this removal process, the total number of chips dissipated from the backing paper, ie, the number of errors per 10,000 holes, was counted.

(3) Prevention of fluff formation After measuring the peel strength of the storage board test piece, the two striped surface areas of the base paper from which the thermally bonded front cover tape was peeled off were visually observed, and the following three steps were performed. Was evaluated.
Class fuzz occurrence 3 No fluff 2 Fuzz is observed in a part of the surface area 1 Fuzz is observed in the entire surface area

Manufacture of paperboard for baseboard A paperboard having a three-layer structure was manufactured. Each layer of the paperboard was different from each other in pulp composition. The pulp for the surface layer was prepared by subjecting a mixture of 30% by mass of NBKP and 70% by mass of LBKP to a cooking step to prepare a pulp having a Canadian Standard Freeness (CSF) of 400 ml. The pulp for the intermediate layer is obtained by subjecting a mixed pulp of 20% by mass of NBKP, 20% by mass of LBKP, 20% by mass of recycled wood pulp, and 40% by mass of recycled newspaper pulp to a digestion process. , With 350 ml of CSF. Further, the pulp for the back layer was prepared by subjecting a mixed pulp of 25% by mass of NBKP, 25% by mass of LBKP and 50% by mass of recycled pulp to a cooking process to a pulp having 400 ml of CSF. there were. Aluminum sulfate was mixed with the aqueous slurry of each pulp to adjust the pH value of the slurry to 6.0, and then an internal paper strength enhancer made of polyacrylamide (trade name: Polystron 1250, manufactured by Arakawa Chemical Industry Co., Ltd.) Was added in an amount of 0.3% by mass based on the dry mass of the pulp. The three pulp slurries were fed to a multilayer paper machine. The resulting composite paperboard has a surface layer having a basis weight of 100 g / m ² , an intermediate layer having a basis weight of 200 g / m ² , and a back layer having a basis weight of 50 g / m ² , laminated on each other. It was done. This paperboard was surface-smoothed by a smoothing machine (machine calender) arranged in combination with a paper machine. The resulting board paperboard had a basis weight of 350 g / m ² , a thickness of 0.4 mm, and a surface center line average roughness (Ra) of 3.5 μm.

Manufacture of paperboard for baseboard A paperboard having a three-layer structure was manufactured. Each layer of the paperboard was different from each other in pulp composition. The pulp for the surface layer was prepared by subjecting a mixture of 30% by mass of NBKP and 70% by mass of LBKP to a cooking step to prepare a pulp having a Canadian Standard Freeness (CSF) of 400 ml. The pulp for the intermediate layer is obtained by subjecting a mixed pulp of 20% by mass of NBKP, 20% by mass of LBKP, 20% by mass of recycled wood pulp, and 40% by mass of recycled newspaper pulp to a digestion process. , With 350 ml of CSF. Further, the pulp for the back layer was prepared by subjecting a mixed pulp of 25% by mass of NBKP, 25% by mass of LBKP and 50% by mass of recycled pulp to a cooking process to a pulp having 400 ml of CSF. there were. Aluminum sulphate was mixed with the aqueous slurry of each pulp to regulate the pH value of the slurry to 6.0. The three pulp slurries were fed to a multilayer paper machine. The resulting composite paperboard has a surface layer having a basis weight of 100 g / m ² , an intermediate layer having a basis weight of 200 g / m ² , and a back layer having a basis weight of 70 g / m ² , laminated on each other. It was done. The resulting paperboard had a basis weight of 370 g / m ² . Using a size press, 1.0 g / m 2 of a 70% by weight saponification degree and a low saponification degree polyvinyl alcohol (trademark: DR-0415, manufactured by Denki Kagaku Kogyo Co., Ltd.) having a degree of polymerization of 1000 using a size press. ^It was size-pressed with the dry amount of ² and then smoothed by a surface smoothing machine (machine calender). The resulting board paper had a thickness of 0.42 mm and a surface center line average roughness (Ra) of 2.8 μm.

Board paperboard was produced in the same manner as in Example 2. However, oxidized starch (trade name: Ace A, manufactured by Oji Constarch) was used in place of the low saponification degree polyvinyl alcohol for the size press process.
The resulting paperboard had a basis weight of 370 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 3.1 μm.

Board paperboard was produced in the same manner as in Example 2 (including the size press step and the calender step). However the surface layer, and change the basis weight of the intermediate layer and the back layer, respectively ^{100g / m 2, 190g / m} 2, 50g / m 2, were lightly degree of smoothing.
The resulting paperboard had a basis weight of 340 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 3.8 μm.
[Comparative Example 1]

Board paperboard was produced in the same manner as in Example 2. However the surface layer, the basis weight of the intermediate layer and the back layer, respectively changed to ^{100g / m 2, 100g / m} 2 and 50 g / m ^2, omitting the size press step, lightly the degree of calendering.
The resulting paperboard had a basis weight of 330 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 4.3 μm.
[Comparative Example 2]

Board paperboard was produced in the same manner as in Example 2. However the surface layer, the basis weight of the intermediate layer and the back surface layer, respectively ^{100g / m 2, 200g / m} 2, and then changed to 100 g / m ^2, were lightly the degree of calendering.
The resulting paperboard had a basis weight of 400 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 1.8 μm.
[Comparative Example 3]

Board paperboard was produced in the same manner as in Example 2. However, 100 parts by mass of completely saponified polyvinyl alcohol (trademark: PVA117, manufactured by Kuraray Co., Ltd.) and 75 parts by mass of a wax emulsion (trademark: Harikote C-300, Harima Kasei Co., Ltd.) were used instead of the low saponification degree polyvinyl alcohol for the size press process Was used at a dry weight of 2.0 g / m ² .
The resulting paperboard had a basis weight of 400 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 2.2 μm.
[Comparative Example 4]

Board paperboard was produced in the same manner as in Example 2. However, a completely saponified polyvinyl alcohol (trademark: P-7000, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) was used in place of the low saponification degree polyvinyl alcohol, and dried at 2.0 g / m ² using a size press. In a dry amount of 1.0 g / m ² using a machine calender, and the coated paperboard was calendered with a machine calender.
The resulting paperboard had a basis weight of 400 g / m ² , a thickness of 0.42 mm, and a surface centerline average roughness (Ra) of 1.0 μm.

  Table 1 shows the results of measuring the peel strength of the paperboards of Examples 1 to 4 and Comparative Examples 1 to 4.

Manufacture and Test of Storage Mount Each of the base paperboards of Examples 1 to 4 was subjected to the mounting test.
Table 1 shows the test results of the obtained storage board.
[Comparative Example 5]

Manufacture and Test of Storage Mount Each of the mount paperboards of Comparative Examples 1 to 4 was subjected to the mounting test (practical chip storage and removal test).
Table 1 shows the test results.

Notes in Table 1 Note 1: The SN ratio could not be calculated because the peel strength was extremely low.
Note 2: In the chip mounting test, when the mounting board is mounted in the chip mounter, the front cover tape actually separates from the base board, and as a result, the number of errors during the chip removal process is reduced. It could not be measured.

Table 1 includes a receiving mount with Taimoto paper of Example 1-4, P _ave of Taimoto paper satisfactory, the center line average roughness of the SN ratio and the surface indicates (Ra), and satisfactory fluff generator It showed prevention. In particular, the storage board using the base paper of Example 2 exhibited an SN ratio of less than 0.3, and thus exhibited an extremely high error prevention effect in the chip removal process.
In Comparative Example 2, the surface of the base paper had a center line average roughness (Ra) of less than 2.5 and a peel strength S / N ratio of more than 0.4. , Easily separated from the base paper.
In Comparative Example 4, the average peel strength (P _ave ) of the base paper was extremely low, so that the peel strength S / N ratio could not be calculated, and an error in the chip removal process could be tested. could not.
In Comparative Example 3, the P _ave and SN ratio were extremely high, which often caused an error in the chip take-out test, and the fuzz generation prevention was extremely low.

INDUSTRIAL APPLICABILITY The storage board of the present invention has a high degree of prevention against occurrence of an error and fluff in a chip removing step, and thus enables the chip removing step to be performed at a high speed.
Therefore, the storage board of the present invention is practically useful.

1A is a plan view illustrating one embodiment of the storage board of the present invention, and FIG. 1B is a cross-sectional view of the storage board of FIG. 1A taken along line AA. FIG.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Storage board 2 ... Mount base 2a ... Longitudinal direction 2b of mount base 3 Non-cover part 3 of mount base ... Front cover tape 4 ... One side edge 5 ... Opposite side edge 6 ... Back cover tape 7, 8 ... Striped surface area 9: rectangular through hole 10: circular through hole

Claims (5)

A storage board for storing chip-type electronic components,
A tape base paper (2) having a width of 8 ± 1.0 mm;
A heat fusible polymer material, extending along the longitudinal direction of the base paper, from one side edge (4) of the base paper to the opposite side edge (5) of the surface of the base paper; A front cover tape (3) covering a portion having a width of 5.25 ± 0.25 mm when measured toward the front, and extending along a longitudinal direction of the base paper, and a back surface of the base paper. A covering back cover tape (6);
(1) The front cover tape is heat-bonded to the surface of the base paper in two striped surface areas (7, 8), and each of the two striped surface areas is A side edge (4a) of the front cover tape, which extends along the longitudinal direction of the base paper and has a width of 0.5 ± 0.15 mm, and is located on a side edge (4) of the base base paper; The distance between the two striped surface areas and the side edge (7a) of one surface area (7) facing the side edge (4a) of the front cover tape is 0.7. ± 0.20 mm, and the distance between the opposing side edges (7b, 8a) of the two striped surface areas (7, 8) is 3.0 ± 1.0 mm. ,
(2) a plurality of through holes (9), wherein the base paper is formed in an intermediate portion between the two striped surface areas (7, 8) and penetrates from the front surface to the back surface of the base paper; Has,
(3) The surface of the base paper has a center line average roughness (Ra) of 2.5 to 4.0 μm measured according to JIS B601, and
(4) The average peel strength (P _ave ) between the base paper and the front cover tape that are thermally bonded to each other in the two striped surface areas is 0.1 to 0.6 N; The following formula:
SN ratio = ( _{Pmax- Pmin} ) / _Pave
[In the above formula, _Pmax represents the maximum peel strength between the base paper and the front cover tape, and _Pmin represents the minimum peel strength between the two.]
The signal-to-noise ratio of the peel strength calculated in accordance with the following formula is 0.40 or less.
A storage board for storing chip-type electronic components, characterized in that:   The storage board according to claim 1, wherein the base paper further includes at least one selected from polyvinyl alcohol, polyacrylamide and starch, which is coated or impregnated on at least a surface or a surface portion thereof.   The storage board according to claim 2, wherein the polyvinyl alcohol has a degree of saponification of 68 to 75 mol% and a number average degree of polymerization of 800 to 1200. It said platform base paper has a basis weight of 300~1,000g / m ^2, housing mount according to claim 1.   The front cover tape is formed from a laminated polymer sheet, and the laminated polymer sheet includes an ethylene-vinyl acetate copolymer layer and a polyethylene terephthalate layer laminated thereon, wherein the ethylene-vinyl acetate The storage board according to claim 1, wherein a polymer layer is thermally bonded to a surface of the base board in the two striped areas.

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