KR0170579B1 - Method of manufacturing chip-type electronic components carrier tape substrate - Google Patents

Abstract

A carrier tape prepared by preparing a base paper having a density of 0.8 to 1.5 g / cm 2, and applying a polyvinylacetate or an acrylic polymer-based water-soluble adhesive to an interlayer adhesive to 5 to 20 g / m 2 and laminating to 2 to 7 ply. Substrate is an excellent carrier tape substrate that can be freely controlled in thickness, excellent in internal bonding strength, stiffness strength, excellent in dimensional stability and recyclable.

Description

Method for manufacturing a chip type electronic component carrier tape base material

1 is a perspective view schematically showing a chip type electronic component carrier tape substrate.

* Explanation of symbols for main parts of the drawings

1 carrier tape base material 2 cover tape

3: bottom tape 4: round hole for transport

5: Hole for mounting rectangular chip parts W: Width (8 mm)

T: Thickness (0.5 ~ 1.5mm)

[Technical Field]

The present invention relates to a carrier tape used for storage and transportation of chip-type electronic components. More particularly, the thickness of the carrier tape can be easily controlled, and the internal bonding strength, stiffness, dimensional stability is excellent, and production cost is low. The present invention relates to a method for producing a carrier tape base material that can be recycled.

[Prior art]

In recent years, with the miniaturization of electronic products, the production of small chip-shaped parts having a size of 1 to 2 mm has increased, and the packaging form for storing and transporting these chip parts has also been changed in various ways. Among the methods for storing and transporting such chip components, in particular, the carrier tape packaging method is widely used in favor of standardized automated operations compared to other methods. The structure of the chip-type electronic component carrier tape is a cover tape covering the upper portion of the carrier tape base material 1 on which the chip part mounting holes 5 are formed to store the electronic parts, and the carrier tape base material in which the electronic parts are stored, as shown in the drawing. (2) and bottom tape (3) covering the lower part and perforation holes (4) for transportation. Among the properties required for such a chip type electronic component carrier tape, the important physical properties include thickness, strong internal bonding strength between layers so that the mounted parts cannot escape during handling, moderate flexibility and stiffness when using automatic equipment. , Tape adhesive strength to seal both sides of perforated hole and proper adhesive tape peeling strength, especially dimensional stability in response to temperature and humidity or physical external environment, perforated surface condition, etc. And tensile strength.

There are various kinds of carrier tapes as described above, and a general type includes an amboose carrier tape formed by using a thermoplastic polymer or a pulp mold as a material, and a planar carrier tape (hereinafter referred to as carrier tape). Among them, planar carrier tapes, which are relatively inexpensive, are made of a flexible material that is long and thinly cut due to the nature of work, and the punching process is carried out to mount chip parts. The flat carrier tape may be made of rubber, metal foil, or polymer material. However, paper and thermoplastic resins are widely used. In consideration of the ease of operation, environmental friendliness through recycling, and especially the cost, Paper is the most advantageous in view, and to date, carrier tapes using paper materials are generally suitable for chip parts of 100 μm or less.

Japanese Patent Application Laid-Open No. H3-249300 discloses a method for manufacturing a carrier tape by using a multi-layer paperboard paper using kraft and paper pulp to improve the separation of layers generated in the automatic mounting process of parts. The formulation of the raw materials and the beating treatment conditions are illustrated, and the optimum relationship between the stiffness, internal bond strength and thickness for producing the quality required for workability is revealed. However, when the paper products manufactured by the above manufacturing method are used, the dimensional stability in the thickness direction decreases depending on the temperature and humidity, and the cover tape adhesion deteriorates after long-term storage, which often causes peeling by itself. Occurs. Japanese Patent Laid-Open No. Hei 4-128147 discloses a technique for producing a carrier tape by mixing a thermoplastic resin and an inorganic layer material. This manufacturing technology explains that the generation of shares during the drilling work, which is a problem of paper products, can improve the adhesion of fiber residues, the limitation of thickness, and the dimensional stability according to the temperature and humidity. However, the above technique has a problem in that additional costs due to replacement are brought about due to the rapid wear of the punching die due to the inorganic filler used to reduce the stiffness strength and reduce the manufacturing cost. US Patent No. 5,150,787 discloses a technique for bonding non-woven fabrics using thermoplastic polymer fibers, and US Patent No. 4,298,120 introduces a technique using metal foil and rubber, but these methods are more expensive than paper products. This is much higher, there is no market in the country, it is difficult to recycle resources, there is a big disadvantage that does not meet the environment-friendly aspects.

And now in Korea, we have secured the chip manufacturing technology of electronic parts, which is a high value-added area in the future, and started commercialization through facility investment, and the production capacity is expected to increase significantly every year. There is no domestic manufacturing technology of carrier tape, which is a means and a key medium of automated manufacturing process, and shows production imbalance.

[PROBLEMS TO BE SOLVED BY THE INVENTION]

The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to produce a substrate of various thicknesses that can be mounted chip parts by laminating a high-density base paper through the paper, chip specifications It keeps excellent internal bond strength that does not cause wrinkles or breaks in the process of sealing the open sides of both sides with hot melt tape and perforating to reel and a series of processes wound on the reel, and especially affects the quality of the chip. In order to provide a method for producing a carrier tape base material having excellent dimensional stability with little change in temperature and humidity in consideration of storage and workability, and minimizing possible problems such as equity and component discoloration. do. Another object of the present invention is to provide a carrier tape base material which can be recycled while having excellent physical properties as described above.

[Means for solving the problem]

In order to achieve the object of the present invention as described above, the present invention is to prepare a base paper having a density of 0.8 ~ 1.5 g / ㎠, 5 ~ 20 g / polyvinylacetate or acrylic polymer-based water-soluble adhesive as an interlayer adhesive on the base paper It provides a method for producing a carrier tape base material comprising the step of applying to m 2 and laminating to 2 to 7 ply.

In the present invention described above, when the bleached kraft pulp is used as the raw material, the long paper and the short fiber are blended in a ratio of 1: 9 to 5: 5, and solid starch or polyacrylamide is used as a raw material. It is preferably prepared by adding 1 to 3%, and beating the Yeosu degree within the range of 350 to 450 ml CSF.

[Action]

Carrier tape manufacturing method according to the present invention consists of two steps, the step of laminating the substrate of various thickness using the original paper production step and the existing paper through the conventional long-term paper machine. The physical properties of the carrier tape are not independently adjustable at each stage and should be considered in relation to each other. However, the internal bonding strength, the perforated state ash and the tensile strength of the carrier tape are largely dependent on the first stage because the physical properties of the base paper dominate. .

When bleached kraft pulp is used as a raw material, the long fibers and the short fibers are blended in a ratio of 1: 9 to 5: 5, and the Yeosu-do is subjected to beating in the range of 350 to 450 ml CSF. If the long fiber in the pulp is too small than the above range, the thickness and stiffness are disadvantageous, and in many cases, the remaining fiber remains on the perforated surface during drilling, which causes unstable position fixing when mounting the component, which causes the failure of automatic setting work. This problem can be solved somewhat by confession, but considering the reduction in thickness, power consumption, and reduction in strength, which is a force corresponding to surface bursting when the substrate is bent, confession below the appropriate degree of freedom Is rather disadvantageous. In order to maintain the high surface strength of the substrate surface in relation to the adhesion of the cover tape, and to minimize the use of inorganic materials such as Talc and calcium carbonate, which are commonly added during papermaking, to minimize the wear of the punching die and the occurrence of stake, the ash content is 5%. It is desirable to keep it below. Throughout the chip component process, the interlayer bonding strength of the substrate, that is, the internal bonding strength, is the most important physical property and is greatly influenced by the conditions such as the degree of freedom of the raw material, the addition of internal strength enhancers, and wet compression. In particular, when adding the strength increasing agent, natural and artificial polymers are generally added to the wet part in the papermaking process. It is preferable to add cationic starch or polyacrylamide as a solid content of 1 to 3% based on the raw material. . The internal bond strength is inversely proportional to the thickness. Carrier tape substrates are more than twice as thick as general cardboard products, while the internal bond strength is more than twice as large as 100 times to 180 times when evaluated according to TAPPI Standard Test Method T541. It should be ft.1b _t / 1000in ² . If it is smaller than this range, it is difficult to use the layer separation easily, and when it is over the range, the stiffness becomes too high, the flexibility required for use when wound on the reel is lost, and the workability is reduced, and the layer separation phenomenon occurs during drilling. In addition, smoothness of the base paper is important to ensure uniform adhesive application and thickness uniformity during lamination, and in particular, in order to satisfy the appropriate peel strength level (15-70 g) required for peeling after adhering the hot-melt cover tape, TAPPI T479 Smoothness by 50sec. Make it ideal. In addition, the density of the base paper is manufactured at a relatively high density level of 0.8 ~ 1.2 g / ㎠ through wet compression, to ensure a strong internal bonding force to minimize the remaining fibers of the perforated surface during drilling, the carrier tape when the density within this range It is cut and used with 8mm width, and it can give strong stiffness or resilience as well as flexibility.

It is difficult to produce a carrier tape substrate having a high basis weight and a corresponding thickness standard by using a conventional conventional paper machine, so that the paper is carried out to the next step by using the base paper having the characteristics described above. A water-soluble adhesive of polyvinylacetate and acrylic polymer is used for bonding between the base sheets. The coating amount of the adhesive is 5 ~ 20 g / ㎡, when less than this range, the interlaminar bonding force is lowered and a lot of residual fibers are generated during the drilling. If the coating amount is larger than this, curling occurs during the production of the substrate and the thickness is not uniform. In particular, the adhesive component affects the water content of the entire laminated substrate, resulting in deterioration of the dimensional stability. In addition, the adhesives of the above-described series, which are commercially available and used, have no influence on the properties of the paper due to the change of the compounding ingredients. Affects strength; Therefore, it is important to apply an appropriate amount of adhesive to obtain the properties of the carrier tape required quality. The uniformity of the overall paper thickness (± 0.001mm) is secured by the application of the base paper and the uniform adhesive, and the carrier tape base products of various thickness specifications of 0.5 ~ 1.5mm are produced through the appropriate combination using multi-layer paper.

The final moisture content of the carrier tape substrate is 7-9%. Carrier tape manufactured by the conventional cardboard manufacturing method is used by mixing the deodorizing paper in the inner layer and the lower layer other than the surface layer and by adding starch and polyacrylamide to improve the interlayer bonding strength, the water content varies according to the surrounding environment If proper constant temperature and humidity is not maintained, the change of dimension is large, moisture may be generated inside the cover tape after sealing, the cover tape may fall by itself, and always maintain 8 ~ 10% moisture, especially with respect to stiffness characteristics. In order to maintain the best quality, the substrate prepared by the method of the present invention is made of 100% kraft pulp, and the special moisture management is achieved due to the dimensional stability contribution of the adhesive coated at 5-20 g / m2 when laminated. It is not necessary and the storage stability of chip parts is excellent.

[Preferred embodiment]

Hereinafter, examples and comparative examples of the present invention are described. However, the following examples are only preferred embodiments of the present invention to aid in understanding the present invention, and the present invention is not limited to the following examples.

Example 1

Using bleached kraft pulp as raw material, SwBKP (Soft wood bleached kraft pulp) was beaten to Yeosu, 450 ml CSF, and HwBKP (Hard wood bleached kraft pulp) was beaten to 400 ml CSF and mixed at a ratio of 10:90. Starch was added to 1% of the raw material, and base paper was produced with a basis weight of 173 g / m 2 and a thickness of 198 μm. Using polyvinyl acetate as an adhesive, the coating amount was maintained at 18 g / m 2, and the paper was laminated in five layers while operating the paper at a speed of 50 m / min and a tension of 100 kg / m 2. A phosphor carrier tape substrate was prepared.

Example 2

A carrier tape base material having a thickness of 0.75 ± 0.05 mm was prepared using the same paper and lamination method as in Example 1, except that the paper was laminated in four layers in Example 1.

Example 3

A thickness of 0.60 ± 0.05 mm was obtained using substantially the same lamination method as in Example 1, except that the paper prepared in Example 1 described above was used in a basis weight of 139 g / m 2 and a thickness of 154 μm under the same raw material conditions. A carrier tape substrate was prepared.

Example 4

The raw material treated by Yeosu-do 450mlCSF was blended with 50% SwBKP and 50% HwBKP, and 2% of polyacrylamide-based wet strength enhancer was added, and the basis weight was 133 g / m 2 and thickness was 152 μm. Prepared. And the laminating conditions were substantially the same as in Example 1 described above, the carrier tape base material of the same standard as in Example 2 was prepared with an adhesive coating amount of 8 g / ㎡.

Comparative Example 1

Carrier tape (STD80-OJH95) manufactured by Japan Oku Itoku Co., Ltd., which is the most used in Korea at 0.95 ± 0.05 mm size, was used.

Comparative Example 2

Carrier tape (STD80-OJH75) manufactured by Japan Oku-Itoku Co., Ltd., the most widely used in Korea, was used as 0.75 ± 0.05 mm standard.

Comparative Example 3

The carrier tape (STD80-OJH60) manufactured by Japan Oku Itoku Co., Ltd., which is the most used in Korea, was used as the 0.60 ± 0.05 mm standard.

Carrier tape substrates prepared according to the above examples and comparative examples were subjected to the required key physical property tests through the test methods described below, and the results are shown in the following table.

(1) internal bond strength

As a measure of interlaminar bonding force, it is measured by the method specified in T541 of the TAPPI Standard Test Method.

(2) stiffness (strength)

Measured by the method specified in TAPPI Standard Test Method T489 as a measure of the resilience required for drilling and component loading workability.

(3) Peel strength of cover tape

Cut the carrier tape to a width of 8 ± 0.01mm and drill the mounting holes, and then attach the cover tape of Japan Matai to the surface of the carrier tape in the range of 140 ~ 170 ℃, and measure it with the reverse peel strength meter of General Production Devices of USA. .

(4) Dimensional stability

In order to grasp the change of specification according to temperature and humidity, it is left in a constant temperature and humidity chamber at 40 ℃, 90% RH for 48 hours, and the thickness and width are measured to calculate the rate of change from the dimensions at room temperature.

(5) Perforated surface state

30m of carrier tapes perforated with Tokyo Weld Corporation (model name TWA-6000) were cut into 30m lengths and visually confirmed. If it is more than 10%, it is divided into 3 grades (not available).

[effect]

As can be seen from the results shown in the above table, the 0.95T specification currently used in the carrier tape market is compared with Example 1 and Comparative Example 1, and the 0.75T specification is compared with Example 2 and Comparative Example 2. When compared with Example 3 and Comparative Example 3, the 0.60T standard has a good carrier tape base material produced by the method of the present invention, which has excellent internal bonding strength and stiffness, and thus, when used as a carrier tape, It is clear that it is more suitable than the product. In particular, the change in the dimensions according to the temperature and humidity is less than 2% in the case of the embodiment is judged to be excellent in the dimensional stability during storage and handling.

Existing methods make it impossible to produce products of high basis weight and high thickness because they utilize conventional paper machines, and it is difficult to secure quality such as internal bonding and dimensional stability, but the application of the present invention enables production of various thicknesses. It is possible to produce products with internal bonding strength and stiffness, which are suitable for the properties of carrier tape.

In particular, the carrier tape base material produced by the method of the present invention supports the existing dimensional stability according to the temperature and humidity by using the base paper made of 100% kraft pulp and applying the dimensional stability of the adhesive coated at 5 to 20 g / m 2 when laminated. Compared to the carrier tape using the material, it is superior to the carrier tape, and no special moisture management is required, and the storage stability of the chip parts is excellent, so that the quality reliability of the mounted chip parts can be increased, and the problems caused by the poor standard specification change Can be greatly reduced.

In addition, the existing foreign products made of thermoplastic polymer, metal foil, rubber, etc., the manufacturing cost is very high and difficult to recycle, while the carrier tape produced by the present invention is manufactured using the pulp raw material, it is possible to recycle, resources and environmental conservation It is advantageous from the side.

By applying the method of the present invention to supply the carrier tape to the domestic market, it is possible to replace the foreign products that are imported at a high price, and to solve the instability of supply and demand currently experienced by the demand supplier. It is expected to bring cost savings.

The paper made by the manufacturing method of the present invention can be mainly used in carrier tapes of MLCC (Multilayer Chip Capacitor) and CR (Chip Resister) of 0.5 to 1.0 mm in size, and can be applied to other similar types of industrial fields.

At present, the usage of chip-type electronic component carrier tape in Korea is increasing rapidly in proportion to the investment in production equipment of electronic components industry. However, due to the special properties required, there are no suppliers due to difficulties in manufacturing and processing with existing paper equipment. to be. Therefore, the demand industry relies solely on imports, and is produced worldwide by Honshu Paper in Japan and exclusively supplied by several agencies. In the future, chip type electronic parts are expected to be applied to related industries through standardized batch automatic process using carrier tape as a transportation medium, but various limitations of carrier tape supply capacity and monopoly production are expected. If the production method of the present invention is applied instead of the existing production method, which is impossible to produce, it is possible to replace domestic imports, especially in terms of quality. There is no storage and handling problems can be improved.

Claims (2)

Preparing a paper having a density of 0.8 to 1.5 g / cm 2; Polyvinylacetate or acrylic polymer-based water-soluble adhesives are applied to the base paper to 5 to 20 g / m 2 and laminated to 2 to 7 ply; A method for producing a carrier tape base material comprising a step. According to claim 1, wherein the base paper is when the bleached kraft pulp is used as a raw material long fibers and short fibers in a ratio of 1: 9 to 5: 5, solid starch 1 or polyacrylamide based on the raw material 1 A method of producing a carrier tape base material, wherein the carrier tape is added at -3% and the Yeosu-do is prepared by beating in the range of 350-450 mL CSF.