JP2006273372A - Chip-type electronic component storage mount of press die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly operative chip-type electronic component storage mount of a press die having a recess for storing a chip-type electronic component with a failure prevented in inserting and taking out the component. <P>SOLUTION: A paper base material for the chip-type electronic component storage mount for a press die made of multilayered paper has a ratio of 0.80-1.00 of the narrowest part T2 to the longest part T1 in the MD direction of a cavity after left for 24 hours under a temperature of 23°C and relative humidity of 50%. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a paper chip-type electronic component storage board, and more specifically, a press-type chip in which a concave portion for storing a chip-shaped electronic component with excellent workability that prevents defective insertion and removal of the chip component is formed. The present invention relates to a mold electronic component storage mount.

The press-type chip-type electronic component storage board is usually processed as follows and used as a carrier for chip-type electronic components.
(1) Slit to a predetermined width.
(2) Press work and round holes of a predetermined size. The press part is for storing chip-type electronic components, and the round hole is for feeding in the filling machine.
(3) The chip type electronic component is filled.
(4) A cover tape is bonded to the surface (top side) of the mount by a heat seal method.
(5) It is wound around a cassette reel of a predetermined size and shipped with a chip-type electronic component.
(6) The top user peels off the top cover tape and takes out the chip-type electronic component.

  Since it is used as described above, the quality required for the storage board does not adversely affect the filled chip parts, and the paper surface has smoothness so that the cover tape can be satisfactorily adhered. In addition, it is required to have strength that can withstand various types of processing on paper, and that the shape of the press portion into which the chip component is inserted is accurate.

  Among these, one of the problems as a quality defect of the storage board is a defective insertion and removal of a chip-type electronic component due to a defective shape of the press part.

Conventionally, as a cavity forming property, a method for improving the cavity forming property with the density of paper as disclosed in JP 2000-43975 A (see Patent Document 1) and JP 2002-53195 A (see Patent Document 2). Or a method for managing cavity workability by breaking elongation in the vertical and horizontal directions of paper as disclosed in Japanese Patent Application Laid-Open No. 2003-95320 (see Patent Document 3). This was not to prevent the cavity shape from changing due to the return of the inner wall surface of the press section after processing and aging.
JP 2000-43975 A JP 2002-53195 A JP 2003-95320 A

  The present invention relates to a press-type chip-type electronic component storage that controls a shape of a press portion (cavity) for storing the chip component and prevents defective insertion and removal of the chip-type electronic component in a paper-type chip-type electronic component storage mount. The purpose is to provide a mount.

  In the conventional paper press-type chip-type electronic component storage board, the inventors have found that chip-type electronic component insertion and removal defects are extremely reduced by controlling the shape of the press portion in a constant temperature and humidity environment. The headline and the present invention were completed. The present invention includes the following inventions:

(1) The narrowest part in the MD direction of the cavity after leaving for 24 hours at a temperature of 23 ° C. and a relative humidity of 50% in a chip-type electronic component storage board substrate made of multilayer paperboard for storing chip-type electronic components Is a press-type chip-type electronic component storage board having a ratio of 0.80 to 1.00.

(2) The press-type chip-type electronic component storage board according to (1), wherein the ratio of the narrowest portion to the longest portion in the MD direction of the press portion is 0.90 to 1.00.

(3) The dynamic elastic modulus in the MD direction determined from the ultrasonic wave propagation speed of the substrate is 10.0 to 24.0 GPa, and the tensile breaking elongation is determined by the paper and paperboard-tensile property test method specified in JIS P8113. The press-type chip-type electronic component storage board according to (1) or (2), which is 1.9 to 3.0%.

(4) The base material is a multilayer paper having a basis weight of 200 to 1000 g / m ^{2 formed} by combining at least two layers, preferably three or more layers with a short mesh or a long mesh wire (1) to (3) The press-type chip-type electronic component storage board according to any one of (3).

(5) After adding 0.5 to 5% by mass of polyacrylamide having a molecular weight of 150 to 500,000 to the pulp and stirring, 0.2 to 2% by mass of amphoteric polyacrylamide having a molecular weight of 2 to 4 million is screened and / or inlet. The press-type chip-type electronic component storage board according to any one of (1) to (4), which is added in front.

(6) When cavity molding is performed with a substrate sandwiched between one mold and the other mold of the press machine, the ratio of the substrate density to the pressing pressure on the substrate by one mold and the other mold is set to 0. The press-type chip-type electronic component storage board according to any one of (1) to (5), which is manufactured by being embossed as .8 to 1.5 × 10 ⁻⁶ / cm.

(7) A chip-type electronic component storage base material made of multilayer paper having a basis weight of 200 to 1000 g / m ² is sandwiched between one mold and the other mold of an embossing press machine. A press-type chip-type electronic component, characterized in that embossing is performed with the ratio of the base material density to the press force applied to the base material by one mold and the other mold being 0.8 to 1.5 × 10 ⁻⁶ / cm A method of manufacturing a storage board.

  The chip-type electronic component storage board of the present invention is controlled so that the shape of the press part constituting the cavity is maintained constant without being deformed over time, so that there is no prevention of defective insertion and removal of chip components, Workability is excellent.

  The narrowest part in the MD direction of the cavity after being left for 24 hours at a temperature of 23 ° C. and a relative humidity of 50% in a press-type chip-type electronic component storage board base material made of multilayer paperboard for storing chip-type electronic components By controlling the ratio with respect to the longest part to 0.80 to 1.00, it is possible to prevent chip component insertion and removal failure. When the ratio of the narrowest part to the longest part in the MD direction is 0.90 to 1.00, the effect is further increased.

  In other words, it prevents the chip-type electronic components from getting caught by preventing back-up (a phenomenon in which the pulp fibers pushed in during press processing swell) that occur on the inner wall surface of the press section that houses the chip-type electronic components. it can

  In the present invention, the dynamic elastic modulus in the MD direction determined from the ultrasonic wave propagation speed of the base material is 10.0 to 24.0 GPa, and the paper and paperboard-tensile property test method specified in JIS P8113 is used. If the elongation at break is 1.9 to 3.0%, it is more preferable that the return generated on the wall surface of the press part can be reduced.

  That is, the press-type chip-type electronic component storage board is subjected to a large tension in the MD direction during press forming and in the process of inserting or removing the chip-type electronic component. If the dynamic elastic modulus is less than 10.0 GPa, the wall surface of the press part is likely to return due to a difference in tension between insertion and removal of the chip and a pressing pressure of the base material during pressing. On the other hand, if it exceeds 25.0 GPa, the substrate becomes too hard to handle.

Further, in the present invention, between one mold and the other mold when the concave part is formed by sandwiching the base material between the one mold and the other mold when forming the pressed portion (concave) of the substrate. It is preferable to process the ratio of the substrate density to the pressing pressure to the substrate at 0.8 to 1.5 × 10 ⁻⁶ / cm. If the ratio of the base material density to the presser pressure is less than 0.8 × 10 ⁻⁶ / cm, there is a problem in that the base material loses the press pressure, the base material thickness decreases, and the inner wall also returns. On the other hand, if it exceeds 1.5 × 10 ⁻⁶ / cm, burrs and burrs are likely to occur on the inner wall. The substrate density is 0.70 to 1.20 g / cm ³ , preferably 0.80 to 1.00 g / cm ³ . If it is less than 0.70 g / cm ³ , the bond between fibers is weak and paper dust is generated during processing. If it exceeds 1.20 g / cm ³ , the bonding area between fibers becomes too large, and the dimensional change of the recesses becomes large due to environmental changes.

  Various raw pulps can be used in the present invention. For example, chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, etc. may be used alone or in combination. However, it is preferable to use a pulp having a uniform fiber form. That is, it is preferable to use hardwood pulp having a uniform fiber form alone. Further, these pulps may be used in appropriate combination with various beating machines.

  There are no particular limitations on the beater used in the production of the raw pulp used in the present invention, and various beaters such as beater, Jordan, deluxe refiner (DF), double disc refiner (DDR), etc. are used. Is done. Further, although the degree of beating is not particularly limited, it is preferable that beating processing of about 250 to 550 ml is performed by Canadian Standard Freeness in view of suitability for papermaking.

  Various internal chemicals can be used as necessary. For example, rosin sizing agent, styrene / maleic acid, styrene / acrylic, olefin / maleic acid, alkyl ketene dimer, alkenyl succinic anhydride, etc., internal sizing agent for natural and synthetic papermaking, various paper strength enhancers, filter Water retention improvers, water resistant agents such as polyamide polyamine epichlorohydrin, antifoaming agents, fillers such as talc, dyes, etc. can be used, but in the present invention, polyacrylamide having a molecular weight of 150,000 to 500,000 is used for pulp. After adding and dispersing 0.5 to 5% by mass, it is preferable to add 0.2 to 2% by mass of amphoteric polyacrylamide having a molecular weight of 2 to 4 million before the screen or inlet just before the sheet is formed on the wire. By adding and dispersing low molecular weight polyacrylamide, a small floc is formed to give a certain paper strength, and by adding high molecular weight amphoteric polyacrylamide near the sheet formation on the wire, no large floc is formed. Strong fiber-to-fiber bonds can be obtained in a uniform pulp dispersion state, and return that occurs inside the press section can be prevented.

  Further, in the present invention, in order to improve the adhesiveness to the bottom tape and the cover tape and the anti-feathering effect, polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene-butadiene resin on the front and back surfaces of the storage board, Necessary chemicals such as a styrene-isoprene resin, a polyester resin, an ethylene-vinyl acetate resin, a vinyl acetate-vinyl alcohol resin, and a urethane resin can be appropriately applied. Further, as a coating means, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a roll coater such as a size press or a calendar coater, a bill blade coater, a velbapa coater and the like can be appropriately employed. .

The basis weight of the chip-type electronic component storage board of the present invention is determined by the size of the chip-type electronic component stored therein, but is generally about 200 to 1000 g / m ² . Due to such a basis weight range, the base paper making method is preferably a multi-layer paper making that is easy to obtain a texture, and a short net that can control the aspect ratio and can control the tensile elongation at break. It is preferable to make a paper sheet of at least one layer with a long wire.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these. In addition, the numerical value which shows a mixing | blending, a density | concentration, etc. is a numerical value based on the mass of a solid part or an active ingredient. Further, unless otherwise specified, the paper made was subjected to pretreatment according to JIS P8111 and then subjected to measurement and testing. Details of the measurement and test are as follows.

<Ratio of substrate density to presser pressure to substrate during press working and cavity shape measurement method>
Slit into an 8mm wide tape, conforming to JIS C 0806-3, as shown in FIG. 1, with an embossing machine at intervals of 2mm, CD direction 0.66mm, MD direction 0.36mm, Z axis direction 0.35mm Then, the ratio of the base material density (Dg / cm ³ ) of reference numeral 3 to the presser pressure (Pg / cm ² ) of reference numeral 1 at that time was calculated.

  Next, after the electronic component storage board is left in an environment of 23 ° C. and 50% for 24 hours, the cavity is scaled with an electron microscope and photographed from the concave cross section, as shown in FIG. Part (T1 mm) and the narrowest part in the MD direction (T2 mm) were measured, and T2 / T1 was calculated.

<Measurement of dynamic elastic modulus>
ANSI / ASTM F89-68 “Standard test Method for MODULUS OF
In accordance with “FLEXIBLE BARRIER MATERIAL BY SONIC METHOD”, using an ultrasonic wave velocity meter (SST-210A, manufactured by Nomura Shoji), the sound velocity of one 8 mm wide slit product (250 mm length) is measured, and E = The dynamic elastic modulus in the MD direction was determined from ρ × c ² . Where E is the dynamic elastic modulus (GPa), ρ is the density (g / cm ³ ), and c is the speed of sound (km / s).

<Measurement of tensile elongation at break>
It was measured with a sample 8 mm wide slit product (250 mm length) according to the paper and paperboard-tensile property test method specified in JIS P8113.

<Implementation test>
An operation of filling a pressed sample with a capacitor chip having a length of 0.6 mm, a width of 0.3 mm, and a height of 0.30 mm, and then applying a cover tape to the surface is "TWA6601" manufactured by Tokyo Wells Co., Ltd. Made using. The conditions for applying the cover tape to the surface were a heat seal temperature of 190 ° C., a heat seal pressure of 3.5 kg, and a taping speed of 2400 tact / min. Next, “Panasert MSR” manufactured by Matsushita Electric Industrial Co., Ltd. is used in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and 20,000 are mounted at a mounting speed of 600 / min. The number of chip mounting mistakes was counted.

Example 1
Hardwood bleached kraft pulp is used for the surface layer, middle layer, and back layer, and the surface layer is beaten with a double disc refiner to prepare 460 ml of CSF (Canadian Standard Freeness), and the middle layer is also a double disc refiner. This was beaten to prepare 380 ml of CSF (Canadian Standard Freeness), and the back layer was beaten to 470 ml of CSF (Canadian Standard Freeness) with a double disc refiner. To each pulp slurry, 2.0% by mass of sulfuric acid band was added to the pulp, and 0.50% by mass of size pine N-771 (Arakawa Chemical Industries, rosin emulsion sizing agent) was added as a sizing agent. Polystron 117 (trade name: manufactured by Arakawa Chemical Industry Co., Ltd., polyacrylamide-based paper strength agent) was added by 1.5% by mass, stirred, and then added to 0.25% by mass pulp slurry in front of the screen with Polystron 1250 (trade name: Arakawa Chemical Industries, Ltd., amphoteric polyacrylamide paper strength agent) was added in an amount of 0.5% by mass. The pulp slurry under the above conditions was combined with a long-mesh three-layer papermaking machine with a J / W ratio of 1.15, a surface layer of 100 g / m ² , a middle layer of 234 g / m ² , and a back layer of 50 g / m ² , Apply 1.0 g / m ² of polyvinyl alcohol having a saponification degree of 88 mol% and a polymerization degree of 1000 as a dry coating amount with a size press machine, and smoothing with a smoothing machine (machine calendar) installed in the paper machine A paperboard with a basis weight of 385 g / m ² is manufactured, and the sample is slit into a tape with a width of 8 mm under an environment of a temperature of 23 ° C. and a relative humidity of 50%, and an embossing machine according to JIS C 0806-3. in the same time a round drilling diameter 1.54mm, 4mm spacing, CD direction at 2mm intervals 0.66 mm, MD direction 0.36 mm, Z-axis direction 0.35mm of the cavity by press-molding a basis weight of 385 g / m ² The press die of the chip-type electronic component storing Mount thickness 0.42mm was produced. The base material pressing pressure at the time of press molding was 7.36 × 10 ⁵ g / cm ² .

Example 2
Example 1 except that a short mesh 1 layer and a circular K K homer 2 layer paper making machine were used to make a paper sheet with a surface layer of 100 g / m ² , an intermediate layer of 234 g / m ² , and a back layer of 50 g / m ^2. A press-type chip-type electronic component storage board having a basis weight of 385 g / m ² and a thickness of 0.42 mm was manufactured.

Example 3
A press-type chip-type electronic component storage board having a basis weight of 385 g / m ² and a thickness of 0.42 mm was manufactured in the same manner as in Example 1 except that the J / W ratio was 1.10.

Example 4
A basis weight of 385 g / m ² , thickness was obtained in the same manner as in Example 1 except that 1.5% by mass of Polystron 1260 (trade name: manufactured by Arakawa Chemical Industry Co., Ltd., polyacrylamide type paper strength agent) was added as a strength agent. A press-type chip-type electronic component storage board having a thickness of 0.42 mm was manufactured.

Example 5
For the surface layer, hardwood bleached kraft pulp is beaten alone with a double disc refiner to prepare 480 ml of CSF (Canadian Standard Freeness). For the middle layer, hardwood bleached craft 70% by weight of pulp and 30% of conifer thermomechanical pulp are mixed and beaten with a double disc refiner to prepare 390 ml of CSF (Canadian Standard Freeness). For the back layer, hardwood bleached kraft pulp is used as a double disc. Beat up to 480 ml of CSF (Canadian Standard Freeness) with a refiner. To each pulp slurry, 2.0% by mass of a sulfuric acid band was added to the pulp, and 0.50% by mass of size pine N-771 (trade name: Arakawa Chemical Industries, Ltd., rosin emulsion sizing agent) was added as a sizing agent. Polystrone PS1260 (trade name: Arakawa Chemical Industry Co., Ltd., polyacrylamide type) was added after stirring and adding 1.0% by mass of Polystron PS117 (trade name: Arakawa Chemical Industries Co., Ltd., polyacrylamide paper strength agent). Paper strength agent) 0.5 mass% was added to the 0.28 mass% pulp slurry immediately before the inlet. The pulp slurry under the above conditions was combined with a circular mesh forward flow butt three-layer paper making machine at a surface layer of 100 g / m ² , an intermediate layer of 149 g / m ² , and a back layer of 50 g / m ² , and the substrate pressing pressure during press molding A press-type chip-type electronic component storage board having a basis weight of 300 g / m ² and a thickness of 0.42 mm was manufactured in the same manner as in Example 1 except that was changed to 5.71 × 10 ⁵ g / cm ² .

Example 6
A press-type chip-type electronic having a basis weight of 385 g / m ² and a thickness of 0.42 mm in the same manner as in Example 2 except that the substrate pressing pressure during press molding was set to 6.32 × 10 ⁵ g / cm ^2. Manufactured parts storage mount

Comparative Example 1
A press-type chip-type electronic having a basis weight of 385 g / m ² and a thickness of 0.42 mm in the same manner as in Example 4 except that the substrate pressing pressure during press molding was 5.75 × 10 ⁵ g / cm ^2. Parts storage board was manufactured.

Comparative Example 2
A press-type chip-type electronic having a basis weight of 385 g / m ² and a thickness of 0.42 mm in the same manner as in Example 5 except that the substrate pressing pressure at the time of press molding was 4.46 × 10 ⁵ g / cm ^2. Parts storage board was manufactured.

Comparative Example 3
As a paper strength agent, Polystron 117 (trade name: manufactured by Arakawa Chemical Industry Co., Ltd., polyacrylamide type paper strength agent) is added in an amount of 0.5% by mass, and the substrate pressing pressure during press molding is 14.0 ×. A press-type chip-type electronic component storage board having a basis weight of 385 g / m ² and a thickness of 0.42 mm was manufactured in the same manner as in Example 2 except that the amount was 10 ⁵ g / cm ² .

  The narrowest part / longest part of the cavity of the obtained sample in the MD direction, dynamic modulus, tensile elongation at break, base material density, base material pressing pressure during press molding, base material density / base material during press molding The presser foot pressure and mounting test were evaluated by the methods described above. The evaluation results are shown in Table 1.

  As shown in Table 1, the base material that satisfies the requirements regarding the cavity shape defined in the present invention has shown extremely good results in a mounting test as a press-type chip-type electronic component storage board.

The figure explaining the method to measure the cavity shape of a base material. The figure which shows the method of measuring the ratio of the narrowest part with respect to the longest part in MD direction of the cavity of a base material.

Claims (7)

  The longest part of the narrowest part in the MD direction of the cavity after leaving for 24 hours at a temperature of 23 ° C. and a relative humidity of 50% in a chip-type electronic component storage board base material made of multilayer paperboard for storing chip-type electronic components A press-type chip-type electronic component storage board with a ratio of 0.80-1.00.   The press-type chip-type electronic component storage board according to claim 1, wherein the ratio of the narrowest portion in the MD direction of the press portion to the longest portion is 0.90 to 1.00.   The dynamic elastic modulus in the MD direction determined from the ultrasonic wave propagation speed of the substrate is 10.0 to 24.0 GPa, and the tensile elongation at break is 1.9 according to the paper and paperboard-tensile property test method specified in JIS P8113. The press-type chip-type electronic component storage board according to claim 1 or 2, which is -3.0%. Press die according to claim 1 the substrate is a short network or Fourdrinier multi-made paper having a basis weight of 200 to 1000 g / m ² being papermaking by combining Extract at least two layers with a wire Chip-type electronic component storage mount.   Add 0.5 to 5% by mass of polyacrylamide with a molecular weight of 150,000 to 500,000 to the pulp and stir, then add 0.2 to 2% by mass of amphoteric polyacrylamide with a molecular weight of 2 to 4 million before the screen and / or the inlet. 5. The press-type chip-type electronic component storage board according to claim 1, wherein any one of claims 1 to 4 is provided. When cavity molding is performed with a substrate sandwiched between one mold and the other mold of a press machine, the ratio of the substrate density to the pressing pressure on the substrate by one mold and the other mold is 0.8 to 6. The press-type chip-type electronic component storage board according to any one of claims 1 to 5, which is manufactured by embossing as 1.5 × 10 ⁻⁶ / cm. A die-type electronic component storage base material made of multilayer paper having a basis weight of 200 to 1000 g / m ² is sandwiched between one die of the embossing press and the other die, and one die of the press Of the press-type chip-type electronic component storage board, wherein the ratio of the substrate density to the pressing force to the substrate by the other mold is 0.8 to 1.5 × 10 ⁻⁶ / cm Production method.

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