MY134656A - Container paper board for containing electronics chips - Google Patents

Container paper board for containing electronics chips

Info

Publication number
MY134656A
MY134656A MYPI20040443A MY134656A MY 134656 A MY134656 A MY 134656A MY PI20040443 A MYPI20040443 A MY PI20040443A MY 134656 A MY134656 A MY 134656A
Authority
MY
Malaysia
Prior art keywords
paper board
base paper
cover tape
chip
container paper
Prior art date
Application number
Inventor
Taketo Okutani
Manabu Yamamoto
Kanako Inaki
Original Assignee
Oji Paper Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Paper Co filed Critical Oji Paper Co
Publication of MY134656A publication Critical patent/MY134656A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Wrappers (AREA)

Abstract

A CONTAINER PAPER BOARD FOR CONTAINING ELECTRONIC CHIP, APPROPRIATE FOR HIGH SPEED CHIP-TAKING UP PROCEDURE, INCLUDES A BASE PAPER BOARD (2), A TOP COVER TAPE (3) HEAT BONDED TO A FRONT SURFACE OF THE BASE PAPER BOARD AT TWO STRIPE PATTERNED AREA (7,8) WITH A WIDTH OF 0.5 + 0.15 MM AND A BOTTOM COVER TAPE (6), AND HAS A PLURALITY OF CHIP-CONTAINING PERFORATIONS AND SPROCKET PERFORATIONS, WHEREIN THE BASE PAPER BOARD FRONT SURFAEC HAS A CENTER-LINE MEAN ROUGHNESS (Ra) OF 2.5 TO 4.0 µM, THE AVERAGE PEELING STRENGTH ( P ave) BETWEEN THE BASE PAPER BOARD AND THE TOP COVER TAPE IS 0.1 TO 0.6N AND THE PEELING STRENGTH SIGNAL TO NOUSE (SN) RATIO [ ( Pmax - Pmin) /Pave] IS 0.40 OR LESS.(FIG 1)
MYPI20040443 2003-02-13 2004-02-12 Container paper board for containing electronics chips MY134656A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003035382 2003-02-13

Publications (1)

Publication Number Publication Date
MY134656A true MY134656A (en) 2007-12-31

Family

ID=34308292

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20040443 MY134656A (en) 2003-02-13 2004-02-12 Container paper board for containing electronics chips

Country Status (5)

Country Link
JP (1) JP4228929B2 (en)
KR (1) KR100806844B1 (en)
CN (1) CN100457570C (en)
MY (1) MY134656A (en)
TW (1) TWI319759B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4444814B2 (en) * 2004-12-28 2010-03-31 信越ポリマー株式会社 Cover tape and electronic component packaging
JP4844571B2 (en) * 2007-01-31 2011-12-28 王子製紙株式会社 Chip-type electronic component storage mount
JP5472005B2 (en) * 2010-09-21 2014-04-16 王子ホールディングス株式会社 Chip-type electronic component storage mount
CN104648816A (en) * 2013-11-18 2015-05-27 罗姆股份有限公司 Electronic component packaging body
CN106516422B (en) * 2015-09-09 2018-10-12 京元电子股份有限公司 Electronic building brick winding belt package structure and method to pack electronic building brick
CN109625386A (en) * 2019-01-29 2019-04-16 珠海隆鑫科技有限公司 A kind of auto spring braider paper braid and braid method
JP7429129B2 (en) 2020-02-26 2024-02-07 信越ポリマー株式会社 Carrier tape lid

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045586B2 (en) * 1981-06-02 1985-10-11 株式会社麗光 packaging film
JPH01112599A (en) * 1987-10-26 1989-05-01 Matsushita Electric Ind Co Ltd Semiconductor storage device
JP2991740B2 (en) * 1989-08-30 1999-12-20 大日本印刷株式会社 Bottom material of carrier for electronic components
JP3181188B2 (en) * 1995-03-23 2001-07-03 住友ベークライト株式会社 Cover tape for embossed carrier tape for surface mounting
JP3059370B2 (en) * 1995-12-07 2000-07-04 住友ベークライト株式会社 Cover tape for packaging electronic components
JP2914269B2 (en) * 1996-01-08 1999-06-28 王子製紙株式会社 Carrier tape paper for chip-shaped electronic components
CN1226500A (en) * 1998-02-18 1999-08-25 日本超包株式会社 Packaging box
JP3954188B2 (en) * 1998-02-25 2007-08-08 ローム株式会社 How to package electronic components in tape
JP3289245B2 (en) * 2001-04-17 2002-06-04 北越製紙株式会社 Carrier tape paper for electronic chips
JP4569043B2 (en) * 2001-05-21 2010-10-27 住友ベークライト株式会社 Cover tape for packaging electronic parts

Also Published As

Publication number Publication date
TW200500276A (en) 2005-01-01
CN100457570C (en) 2009-02-04
CN1521095A (en) 2004-08-18
JP4228929B2 (en) 2009-02-25
TWI319759B (en) 2010-01-21
KR100806844B1 (en) 2008-02-22
KR20040073381A (en) 2004-08-19
JP2004262550A (en) 2004-09-24

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