JP2009184684A - Chip type electronic component storing mount - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type electronic component storing mount which exhibits a strong peeling strength and suppresses fluffing from the mount when a cover tape is peeled away from the chip type electronic component storing mount. <P>SOLUTION: In the chip type electronic component storing mount formed of a multi-layered paper-processed board, the surface layer is the chip type electronic component storing mount containing an alkenyl ketene dimer. The alkenyl ketene dimer is preferably mixed with a water-soluble polymer to be applied. In addition, the water-soluble polymer is preferably at least one kind selected from polyvinyl alcohol, starch, and polyacrylamide. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a paper chip-type electronic component storage mount, and more particularly, to a chip-type electronic component storage mount that has excellent adhesive strength with a cover tape and prevents nicks from coming off when the cover tape is peeled off. It is.

The chip-type electronic component storage board is usually processed as follows and used as a carrier for the chip-type electronic component.
(1) Slit to a predetermined width.
(2) Open a square hole and a round hole of a predetermined size. The square hole is for storing chip-type electronic components, and the round hole is for feeding into the filling machine.
(3) Adhere the cover tape to the back side (bottom side) of the mount. In addition, square embossing of a predetermined size may be performed without making a square hole, and in this case, this step is omitted. A method of bonding the mount and the cover tape is performed by a so-called heat seal method in which the mount and the cover tape are overlapped and bonded by applying heat and pressure from the cover tape.
(4) The chip type electronic component is filled.
(5) A cover tape is bonded to the surface (top side) of the mount by a heat seal method.
(6) It is wound around a cassette reel of a predetermined size and shipped with a chip-type electronic component.
(7) The top user peels off the top cover tape and takes out the chip-type electronic component.

Since it is used as described above, the quality required for the storage board does not adversely affect the filled chip parts, it has the strength to withstand various treatments on paper, and the cover tape is well bonded. In addition, there is a case in which no chipping occurs when the top cover tape is peeled off when taking out the chip electronic component.

Up to now, as a means for preventing the occurrence of chipping when the cover tape is peeled off, the development of a device for detecting the unbonded portion of the tape (Patent Document 1) has not been a means for preventing the fundamental unbonded portion, or a plastic carrier The cover tape for the tape is not intended to improve the peeling of the paper carrier tape by measures against breakage (Patent Documents 2, 3, and 4), the provision ratio of conifers and hardwoods, and starch with a size press Although methods (Patent Document 5) have been used to prevent the occurrence of chipping by coating on both sides, these methods are not sufficient to obtain sufficient adhesiveness with the cover tape and to prevent chipping. There wasn't. Further, a chip-type electronic component storage board (Patent Document 6) is disclosed in which a surface treatment agent containing an alkenyl succinic anhydride derivative or an alkyl ketene dimer is applied to prevent eruption, but it is considered to be more effective. ing.
JP-A-9-315486 JP-A-11-105181 Japanese Patent Laid-Open No. 9-156684 JP-A-8-258888 JP 2000-175966 A JP 2007-1589 A

  It is an object of the present invention to provide a chip-type electronic component storage mount that is excellent in adhesiveness with a cover tape and that prevents the chip from being removed from the mount when peeled off. It is.

In the chip type electronic component storage board of multilayer paperboard, the surface treatment agent applied to the surface layer penetrates the paper layer deeply to prevent injuries, and the penetrated surface treatment agent strengthens the bond between fibers. As a result, it has been found that the occurrence of incision can be extremely prevented, and the present invention has been completed. The present invention includes the following inventions.
(1) A chip-type electronic component storage board, the surface layer of which comprises an alkenyl ketene dimer, in a chip-type electronic component storage board made of multilayer paperboard.

(2) The chip-type electronic component storage board according to (1), wherein the alkenyl ketene dimer is applied by mixing with a water-soluble polymer.

(3) The chip-type electronic component storage board according to (1) or (2), wherein the water-soluble polymer is at least one selected from polyvinyl alcohol, starch, and polyacrylamide.

(4) The chip-type electronic component storage board according to any one of (1) to (3), wherein the coating amount of the alkenyl ketene dimer is 0.01 to 2.0 g / m ² .

The chip-type electronic component storage board of the present invention is excellent in adhesive strength with the cover tape, and prevents chipping out of the mount sheet when the cover tape is peeled off.

In the present invention, an alkenyl ketene dimer is added to the surface layer of the mount in order to improve the adhesion to the cover tape and further increase the strength of the mount surface. Alkenyl ketene dimer has a hydrophobic group and a hydrophilic group. By coating and drying on the backing paper surface, it penetrates into the paper layer in addition to the surface covering, and the hydrophilic group forms hydrogen bonds with the pulp fiber. In this way, the fibers are cross-linked to greatly improve the bond between the fibers. By improving the bond between fibers, the resistance force when peeling the cover tape is improved, and the peeling strength is increased and the removal of fibers that become a fluff can be prevented.

Further, in the present invention, the alkenyl ketene dimer is more effective in preventing the occurrence of blemishes by being applied by mixing with a water-soluble polymer. That is, by containing a water-soluble polymer, the water-soluble polymer further binds lumped alkene ketene dimer and pulp fiber masses as a binder, and effectively prevents the occurrence of chipping. Furthermore, the alkenyl ketene dimer is present together with the water-soluble polymer, so that the surface tension of the water-soluble polymer is lowered, penetrates uniformly into the outermost surface of the mount, and penetrates deep into the inside, preferably exceeding 50 μm from the mount surface. By deeply penetrating, the effect of preventing the occurrence of chipping from the inside of the paper layer is expressed.

In the present invention, it is preferable that the water-soluble polymer is at least one selected from polyvinyl alcohol, starch, and polyacrylamide because the surface strength is increased and coating suitability is also good.
Preferably, it is blended at a ratio of 100 to 20000 parts by mass with respect to 100 parts by mass of the alkenyl ketene dimer. The coating amount, 0.01 to 2.0 g / m ² is preferred. No effect of the fluff suppression is less than 0.01 g / m ^2, the effect is not economical plateau be applied beyond 2.0 g / m ^2.

In the present invention, as means for applying the alkenyl ketene dimer to the mount surface, for example, bar coater, blade coater, air knife coater, rod coater, gate roll coater, roll coater such as size press and calendar coater, bill blade coater, There are bell vapor coaters.

  Various types of raw material pulp can be used for the chip-type electronic component storage board of the present invention, and examples include chemical pulp (hardwood, conifer), mechanical pulp, waste paper pulp, non-wood fiber pulp, and synthetic pulp. These pulps may be used alone or in combination of two or more. For paper making chemicals, in addition to the chemicals of the present invention, for example, sizing agents such as rosin, styrene / maleic acid, alkenyl succinic anhydride, alkyl ketene dimer, various paper strength enhancers, drainage yield An improver, a water-resistant agent such as polyamide polyamine epichlorohydrin, a defoaming agent, a filler such as talc, a dye, and the like can be used.

  There are no particular limitations on the manufacturing apparatus and manufacturing conditions for manufacturing the paper chip-type electronic component storage board of the present invention, and the product of the present invention can be manufactured by selecting the manufacturing conditions suitable for each manufacturing apparatus. . For example, a base paper having a surface layer that is made by combining with a circular paper machine or a long paper machine and to which a chemical is added by the aforementioned internal addition or external addition by a coater is manufactured.

  In the present invention, various internal additives can be used as necessary. For example, rosin sizing agent, styrene / maleic acid, alkyl ketene dimer, alkenyl succinic anhydride, etc., internal and internal sizing agents for paper making, various paper strength enhancers, drainage retention improver, polyamide polyamine epichlorohydrin, etc. Water-proofing agents, antifoaming agents, fillers such as talc, dyes and the like can be used.

  Further, in the present invention, in order to improve the adhesion with the bottom tape and the anti-feathering effect, polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene / butadiene resin, styrene / isoprene resin, Necessary chemicals such as polyester resins, ethylene-vinyl acetate resins, vinyl acetate-vinyl alcohol resins, and urethane resins can be appropriately applied. Further, as the application means, there are, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a roll coater such as a size press and a calendar coater, a bill blade coater, and a bellbapa coater.

The basis weight of the chip-type electronic component storage board of the present invention is determined by the size of the chip-type electronic component stored therein, but is generally about 200 to 1000 g / m ² . Due to such a basis weight range, the paper making method is preferably a multi-layer paper making that is easy to form.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by these. In addition, the numerical value which shows a mixing | blending, a density | concentration, etc. is a numerical value based on the mass of a solid part or an active ingredient. Moreover, the papers made for all the examples were subjected to pretreatment according to JIS P8111 and then subjected to peel strength measurement. Details of the peel strength measurement conditions are as follows.

<Measurement method of peel strength>
The mount for storing chip-type electronic components is cut into a tape with a width of 8 mm, and “No. 318H-14A” [polyethylene terephthalate (PET) and ethylene / vinyl acetate copolymer made by Nitto Denko Corporation] is used as a cover tape. (EVA) co-extruded laminate film: width 5.25 mm, thickness 53 μm] is used to cover one side edge of the mount, and then using a heat seal tester “TP701S” manufactured by Tester Sangyo Co., Ltd. With a heat seal temperature of 155 ° C., a heat seal pressure applied to the sample of 1.5 Mpa, and a heat seal time of 0.2 seconds, from a position 0.5 mm inward from the side edge covered with the cover tape, a width of 0.4 mm The cover tape was heat-sealed on the backing sheet in the form of rails with a spacing of 3.0 mm, and after about 1 hour, the peel strength was measured according to JIS C 08. 6-3 method based on (peeling speed 300 mm / min), measured at measurement time 12 seconds, it was determined between the mean values.

<Still standing>
The heat seal part after the measurement of the isolation strength is visually confirmed.
A: There is no flaking standing at all. ○: There is 1-2 flaking standing.
(Triangle | delta): There are 3-10 tinglings.
X: There is a flare standing on the entire surface.

Example 1
Pulp is used properly for the surface layer, middle layer, and back layer, NBKP 30% and LBKP 70% are mixed and beaten for the surface layer, and 400 ml of CSF (Canadian Standard Freeness) is prepared. A pulp of 350 ml of CSF was prepared with a blend of 20% and waste paper 40%, and a pulp of CSF 400 ml was blended with NBKP 25%, LBKP 25%, and newspaper waste 50% for the back layer. A sulfuric acid band was added to each pulp slurry to adjust the pH to 6.0, and 0.3% of polyacrylamide (trade name: Polystron 1260, manufactured by Arakawa Chemical Industries) was added as an internal paper strength enhancer. The smoothing machine installed in the paper machine was made by combining the pulp slurry of the above conditions with a circular three-layer paper making machine with a surface layer of 100 g / m ² , a middle layer of 200 g / m ² and a back layer of 50 g / m ^2. After smoothing with (machine calendar), the surface layer was coated with 0.9 g / m ^{2 of} alkenyl ketene dimer (trade name AS-1163, manufactured by Japan PMC) as a surface treatment agent, and the basis weight was 350 g / m ^2. A chip-type electronic component storage board having a thickness of 0.42 mm was manufactured.

Example 2
Except for preparing and mixing 100 parts by weight of polyacrylamide (trade name: PS117, manufactured by Arakawa Chemical Industries) and 2.0 parts by weight of alkenyl ketene dimer (trade name AS-1163, manufactured by Japan PMC) as a surface treatment agent. In the same manner as in Example 1, a chip-type electronic component storage board was manufactured.

Example 3
As a surface treating agent, polyvinyl alcohol (trade name: PVA117, manufactured by Kuraray) 100
A chip-type electronic component storage board was manufactured in the same manner as in Example 1 except that 2.0 parts by mass of alkenylketene dimer (trade name AS-1163, manufactured by Japan PMC) were mixed and prepared.

Example 4
Except for preparing and mixing 100 parts by mass of oxidized starch (trade name: Ace A, manufactured by Oji Constarch) and 2.0 parts by mass of alkenyl ketene dimer (trade name: AS-1163, manufactured by Nippon PMC) as a surface treatment agent. In the same manner as in Example 1, a chip-type electronic component storage board was manufactured.

Example 5
As the surface treatment agent, 100 parts by mass of cationized starch (trade name: Ace K-250, manufactured by Oji Constarch) and 2.0 parts by mass of alkenyl ketene dimer (trade name: AS-1163, manufactured by Japan PMC) were mixed and prepared. A chip-type electronic component storage board was manufactured in the same manner as Example 1 except for the above.

Example 6
As a surface treatment agent, urea phosphate esterified starch (trade name: Ace P230, manufactured by Oji Constarch) 100 parts by mass and alkenyl ketene dimer (trade name AS-1163, manufactured by Japan PMC) 2.0 parts by mass are mixed and prepared. A chip-type electronic component storage board was manufactured in the same manner as in Example 1 except that.

Reference example 1
Example except that 100 parts by weight of polyacrylamide (trade name: PS117, manufactured by Arakawa Chemical Industries) and 2.0 parts by weight of alkyl ketene dimer (trade name SKS2501, manufactured by Arakawa Chemical Industries) were mixed and prepared as a surface treatment agent. In the same manner as in Example 1, a chip-type electronic component storage board was manufactured.

Comparative Example 1
A chip-type electronic component storage board was manufactured in the same manner as in Example 1 except that polyvinyl alcohol (trade name: PVA117, manufactured by Kuraray Co., Ltd.) was applied as the surface treatment agent.

Comparative Example 2
A chip-type electronic component storage board was manufactured in the same manner as in Example 1 except that polyvinyl alcohol (trade name: PVA117, manufactured by Kuraray Co., Ltd.) was applied as a surface treatment agent in an amount of 0.3 g / m ² .

  Table 1 shows average peel strength values of Examples 1, 2, 3, 4, 5, and Comparative Examples 1 and 2. Examples 1, 2, 3, 4, and 5 which are chip-type electronic component storage boards of the present invention had a higher peel strength than that of Comparative Examples 1 and 2, and less erosion.

  As is clear from the comparison between the examples and the comparative examples, the paper base material that satisfies the requirements of the present invention has a high peel strength and a chip type that prevents the cover from peeling when the cover tape is peeled off. It shows that the suitability as an electronic component storage board is excellent.

Claims (4)

A chip-type electronic component storage board comprising a chip-type electronic component storage board base material made of multilayer paperboard for storing chip-type electronic components, wherein the surface layer of the mount contacting the cover tape contains an alkenyl ketene dimer . 2. The chip-type electronic component storage board according to claim 1, wherein the alkenyl ketene dimer is applied in a mixture with another water-soluble polymer. 3. The chip-type electronic component storage board according to claim 1, wherein the other water-soluble polymer is at least one selected from polyvinyl alcohol, starch, and polyacrylamide. The alkenyl as the alkenyl ketene dimer coating amount, the chip-type electronic component storing mount according to claim 1, characterized in that in the range of 0.01 to 2.0 g / m ^2.