JP3268522B2 - Carrier tape paper for electronic components - Google Patents

Carrier tape paper for electronic components

Info

Publication number
JP3268522B2
JP3268522B2 JP2001125370A JP2001125370A JP3268522B2 JP 3268522 B2 JP3268522 B2 JP 3268522B2 JP 2001125370 A JP2001125370 A JP 2001125370A JP 2001125370 A JP2001125370 A JP 2001125370A JP 3268522 B2 JP3268522 B2 JP 3268522B2
Authority
JP
Japan
Prior art keywords
paper
carrier tape
pulp
base paper
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001125370A
Other languages
Japanese (ja)
Other versions
JP2002046769A (en
Inventor
利幸 石川
克彦 福地
孝義 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuetsu Paper Mills Ltd
Original Assignee
Hokuetsu Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuetsu Paper Mills Ltd filed Critical Hokuetsu Paper Mills Ltd
Priority to JP2001125370A priority Critical patent/JP3268522B2/en
Publication of JP2002046769A publication Critical patent/JP2002046769A/en
Application granted granted Critical
Publication of JP3268522B2 publication Critical patent/JP3268522B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電子機器のプリント
回路板に用いるチップ状電子部品のキャリア用に用いる
チップ型電子部品収納台紙となる電子部品用キャリアテ
ープ紙に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape for electronic parts which is used as a carrier for chip-type electronic parts and used as a carrier for chip-type electronic parts used in a printed circuit board of electronic equipment.

【0002】[0002]

【従来の技術】各種の電子機器の自動生産化を図るため
に、回路基板に対してチップ状電子部品の自動装着がな
されるようになってきた。このチップ状電子部品の自動
装着の工程での電子部品の取り扱いを容易に行い得るよ
うに、個々のチップ状電子部品をテープ状の搬送体で包
装したテーピング包装体が利用されており、テーピング
包装体の形態で順次送り出されてくるチップ状電子部品
を、自動的に所定の回路基板に装着させる自動装着が行
われている。
2. Description of the Related Art In order to achieve automatic production of various electronic devices, chip-type electronic components have been automatically mounted on circuit boards. In order to facilitate the handling of the electronic components in the automatic mounting process of the chip-shaped electronic components, a taping package in which the individual chip-shaped electronic components are packaged in a tape-shaped carrier is used. 2. Description of the Related Art Automatic mounting has been performed in which chip-shaped electronic components sequentially sent out in the form of a body are automatically mounted on a predetermined circuit board.

【0003】上記のように、チップ状電子部品のキャリ
アテープには、プラスチック製のものと紙製のものとが
あるが、製造コスト、テープの重量による取り扱い容易
性、使用後の廃棄処理容易性、及び帯電防止性等の点に
おいて、紙製のキャリアテープの方が優れている。紙製
のキャリアテープは、以下のように加工処理を受け、キ
ャリアとしての役割を持つ。 幅8mmまたは規定の寸法にスリットする。 チップ状電子部品収納用の角穴(キャビティ
ー)、及びキャリアテープの充填機内送り用の丸穴を開
ける。 紙の裏面(ボトム側)にカバーテープを接着す
る。 チップ状電子部品を収納する。 紙の表面(トップ側)にカバーテープを接着す
る。 カセットリールに巻き付けて出荷する。 ユーザーにてトップ側カバーテープを剥がし、チ
ップ状電子部品を取り出す。
As described above, there are two types of carrier tapes for chip-shaped electronic components: those made of plastic and those made of paper. However, the production cost, the ease of handling due to the weight of the tape, and the ease of disposal after use. The carrier tape made of paper is superior in terms of the antistatic property and the antistatic property. The paper carrier tape is processed as described below and has a role as a carrier. Slit to a width of 8 mm or a specified size. A square hole (cavity) for storing chip-shaped electronic components and a round hole for feeding the carrier tape into the filling machine are formed. Adhere the cover tape to the back (bottom side) of the paper. Houses chip-shaped electronic components. Adhere the cover tape to the paper surface (top side). Shipped around a cassette reel. The user removes the top cover tape and takes out the chip-shaped electronic component.

【0004】また紙製のキャリアテープは、テープ状の
原紙にチップ状電子部品収納用の角穴(キャビティー)
を形成し、該角穴にチップ状電子部品を装填させるもの
であり、原紙の厚さ以上の嵩高の電子部品を装填するこ
とはできない。
[0004] A paper carrier tape is formed by forming square holes (cavities) for accommodating chip-like electronic components in a tape-like base paper.
Is formed, and a chip-shaped electronic component is loaded in the square hole, and a bulky electronic component having a thickness greater than the thickness of the base paper cannot be loaded.

【0005】紙製のキャリアテープに求められる品質と
しては、以下のような特性があげられる。 チップ状電子部品の包装用途に用いられる為、充
填したチップ状電子部品に静電気トラブルや金属腐食等
の悪影響を及ぼさないこと。 カバーテープが良好に接着されたり、剥がれたり
するように紙の表面は平滑性があること。 高速の自動機械で曲げ、しごきなどの力を受けて
も層間剥離、折れじわをおこさないこと。 紙テープでは打ち抜き加工の時に、穴内部に繊維
のケバが残ると、取りだしずらいというトラブルが起こ
ることもあるのでパンチング適性を有すること。 キャリアテープに対する各種応力に耐え得る強度
を有すること。 チップ状電子部品の自動装着工程で送りのピッチ
がずれると、マシントラブルを起こすことなどから原材
料の寸法安定性に優れていること。
[0005] The quality required for a carrier tape made of paper includes the following characteristics. Since it is used for packaging chip-shaped electronic components, the filled chip-shaped electronic components should not have any adverse effects such as electrostatic trouble or metal corrosion. The surface of the paper must be smooth so that the cover tape adheres or peels off. Do not cause delamination or folds even when subjected to bending, ironing or other forces with a high-speed automatic machine. When punching with paper tape, if fiber fluff remains inside the hole, it may be difficult to remove it, so it must have punching aptitude. It must be strong enough to withstand various stresses on the carrier tape. Excellent dimensional stability of raw materials, because if the feed pitch shifts during the automatic mounting process of chip-shaped electronic components, machine troubles may occur.

【0006】上記特性に対して、特開平10−5947
1号公報には剥離しない多層板紙について、特開平3−
249300号公報には高速の自動機械で曲げ、しごき
などの力を受けても層間剥離、折れじわをおこさない板
紙について、特開平8−26335号公報には十分な厚
さを有し、しかも効率良く生産することのできる原紙に
関する技術が記載されている。
In contrast to the above characteristics, Japanese Patent Application Laid-Open No. 10-5947
No. 1 discloses a multilayer paperboard that does not peel off.
Japanese Patent Application Laid-Open No. 8-26335 discloses a paperboard that does not cause delamination or fold even when subjected to bending or ironing by a high-speed automatic machine. It describes a technology relating to base paper that can be efficiently produced.

【0007】従来、厚さ1.0mmを超えるキャリアテ
ープ紙を製造する際の問題点として、紙層内での水蒸気
圧による内部フクレが起こり、紙層内剥離が発生する。
また原紙にしなやかさがなく、製品巻取り時に折れじわ
が発生し、製造することができないなどが挙げられてい
た。
Conventionally, as a problem in producing a carrier tape paper having a thickness of more than 1.0 mm, internal blistering occurs due to water vapor pressure in the paper layer, and peeling in the paper layer occurs.
In addition, it was cited that the base paper was not supple, and the product could not be manufactured due to folds occurring when the product was wound up.

【0008】[0008]

【発明が解決しようとする課題】本発明の解決課題は厚
さ1.00mm以上の多層抄き板紙を効率良く生産する
ことができ、製造時における巻物での層間剥離や、折れ
じわの発生を防止したチップ状電子部品のキャリアテー
プ紙を提供することにある。
SUMMARY OF THE INVENTION The object of the present invention is to efficiently produce a multi-layered paperboard having a thickness of 1.00 mm or more, and to cause delamination and creases in a roll during production. It is an object of the present invention to provide a carrier tape paper of a chip-shaped electronic component in which the occurrence of the carrier tape is prevented.

【0009】[0009]

【課題を解決するための手段】上記本発明の解決課題は
以下によって達成される。すなわち本発明は、 (1) 厚さ1.00mm以上の木材パルプを主体とした
多層抄き板紙であって、該多層抄き板紙原紙の全層また
は中層にリンターパルプを配合したこと。
The object of the present invention can be attained by the following. That is, the present invention provides: (1) Multi-layered paperboard mainly composed of wood pulp having a thickness of 1.00 mm or more, wherein linter pulp is blended in all or middle layers of the multi-layered paperboard base paper.

【0010】(2) 前記多層抄き板紙原紙の全層または
中層にリンターパルプを10〜70重量%配合したこ
と。
(2) 10 to 70% by weight of linter pulp is blended in all or middle layers of the multi-layered paperboard base paper.

【0011】(3) 前記全層または中層の各層に内添す
る澱粉、変性澱粉、ポリアクリルアミドなどの紙力増強
剤の添加量はパルプに対して固形分で1〜10%とした
こと。
(3) The amount of the paper strength enhancer such as starch, modified starch, polyacrylamide, etc., to be internally added to each of the whole layer or the middle layer is 1 to 10% in solid content with respect to pulp.

【0012】(4) JIS P8125によるテーバー
剛度のT/Y比が2.5以下、TAPPI T459に
よる表面強度が2A以上、JIS P8122によるス
テキヒトサイズ度が500秒以上としたことを特徴とす
る電子部品用キャリアテープ紙からなる。
(4) An electronic device characterized in that the T / Y ratio of Taber stiffness according to JIS P8125 is 2.5 or less, the surface strength according to TAPPI T459 is 2A or more, and the Stechigt size according to JIS P8122 is 500 seconds or more. It consists of carrier tape for parts.

【0013】本発明のキャリアテープ用原紙を製造する
ための使用材料及び製造条件について説明する。本発明
に用いられるパルプとしては、通常用いられるパルプが
各層に使用されるが本発明においては、フィルム状のカ
バーテープをシールした後に、カバーテープを剥がして
使用するため、表層の強度が必要であることからBKP
(晒クラフトパルプ)を使用する。特に紙の剛度とのバ
ランスを考慮するとNBKP(針葉樹晒クラフトパル
プ)とLBKP(広葉樹晒クラフトパルプ)の使用割合
を9:1〜1:9の割合で配合することが好ましい。パ
ルプの叩解度はカナダ標準濾水度(CSF)で250〜
620mlの範囲が適している。
The materials used for producing the base paper for carrier tape of the present invention and the production conditions will be described. As the pulp used in the present invention, pulp usually used is used for each layer, but in the present invention, after sealing the film-shaped cover tape, the cover tape is peeled off and used, so the strength of the surface layer is required. BKP because there is
(Bleached Kraft Pulp). In particular, considering the balance with the rigidity of the paper, it is preferable to mix NBKP (softwood bleached kraft pulp) and LBKP (hardwood bleached kraft pulp) at a ratio of 9: 1 to 1: 9. Pulp beating degree is 250 ~ Canadian Standard Freeness (CSF)
A range of 620 ml is suitable.

【0014】本発明において使用するリンターパルプと
は綿についている短毛(リンター)を精製したパルプで
あり、特殊紙の原料となる。原料調成方法は、リンター
パルプと木材パルプを叩解処理したものを原料とする。
この際、原紙の全層または中層にリンターパルプを10
〜70重量%配合し、テーバー剛度(T/Y)比を2.
5以下とした。好ましくはリンターパルプを20〜60
重量%配合するのが実用的に優れている。また原紙の全
層または中層に配合しても、カバーテープが良好に接着
されたり、剥がれたりするように紙の表面平滑性及び表
面強度が必要である。
The linter pulp used in the present invention is a pulp obtained by purifying short hair (linter) attached to cotton and is a raw material for special paper. In the raw material preparation method, linter pulp and wood pulp obtained by beating treatment are used as raw materials.
At this time, linter pulp is applied to all or middle layers of the base paper.
7070% by weight and a Taber stiffness (T / Y) ratio of 2.
5 or less. Preferably, linter pulp is 20-60
It is practically excellent to mix by weight%. Further, even when the cover tape is blended in all or the middle layers of the base paper, the surface smoothness and surface strength of the paper are required so that the cover tape can be satisfactorily adhered or peeled off.

【0015】リンターパルプ配合率が10重量%未満で
は、原紙にしなやかさがなく折れじわが発生する。反対
に70重量%を超えると層間強度が弱くなり、原紙品質
上好ましくない。またコストがかかり好ましくない。
[0015] If the linter pulp content is less than 10% by weight, the base paper is not supple and will have folds. Conversely, if it exceeds 70% by weight, the interlaminar strength becomes weak, which is not preferable in terms of base paper quality. In addition, it is costly and not preferable.

【0016】各層には層間強度と折れ防止の為、澱粉、
変性澱粉、ポリアクリルアミドなどの紙力増強剤を内添
することが必要である。しかし多量に用いると剛度を上
げ過ぎて層間強度が強いにもかかわらず、リールでの巻
取り時及び高速の自動機械で曲げ、しごきなどの力を受
けて層間剥離、折れじわを起こし易くなる。このため紙
力増強剤の添加率は薬品の種類により異なるがパルプに
対して固形分で1〜10%の添加が好ましい。
Each layer is made of starch,
It is necessary to internally add a paper strength enhancer such as modified starch and polyacrylamide. However, when used in a large amount, even if the stiffness is too high and the interlayer strength is strong, it is easy to be delaminated and creased by the force of bending and ironing when winding on a reel and high-speed automatic machine. . For this reason, the addition rate of the paper strength enhancer varies depending on the type of chemical, but it is preferable to add 1 to 10% as solid content to pulp.

【0017】本発明の原紙は乾燥工程の中間に設置され
るサイズプレス装置で水溶性高分子物質を主体とする表
面サイズ処理を行う。通常の2ロールのサイズプレスの
他、ゲートロールサイズプレスやメタリングサイズプレ
スも使用できる。表面サイズ処理用の水溶性高分子物質
としては、酸化澱粉、カチオン化澱粉、ヒドロキシエチ
ルエーテル化澱粉、酵素変性澱粉などが使用される。な
お、ポリビニルアルコール、カルボキシメチルセルロー
ス、メチルセルロース、その他樹脂ポリマーなど表面サ
イズ剤も使用できる。この表面サイズ処理用の水溶性高
分子物質をサイズプレスで両面に0.5〜4g/m
好ましくは1〜3g/mの範囲で塗布する。なお、表
面サイズ処理用の水溶性高分子物質は全表面サイズ剤量
の5〜100重量%の範囲である。
The base paper of the present invention is subjected to a surface sizing treatment mainly using a water-soluble polymer substance by a size press installed in the middle of a drying step. In addition to the usual two-roll size press, a gate roll size press and a metering size press can also be used. Examples of the water-soluble polymer for surface sizing include oxidized starch, cationized starch, hydroxyethyl etherified starch, and enzyme-modified starch. In addition, a surface sizing agent such as polyvinyl alcohol, carboxymethylcellulose, methylcellulose, and other resin polymers can also be used. This water-soluble polymer for surface sizing is coated on both sides with a size press at 0.5 to 4 g / m 2 ,
Preferably, it is applied in a range of 1 to 3 g / m 2 . The amount of the water-soluble polymer for surface sizing is in the range of 5 to 100% by weight of the total surface sizing agent.

【0018】本発明の多層抄き原紙抄造は、円網多筒式
抄紙機で3層から5層抄き合わせで行われるが、特にこ
の方式に限定されるものではない。原紙物性としては米
坪は800g/m以上の範囲が適している。紙厚は
1.00mm以上、原紙表面強度は2A以上、表面のス
ムスター平滑度は70cmHg以下、ステキヒトサイズ
度が500秒以上、テーバー剛度(T/Y)比は2.5
以下の適切な範囲にする必要がある。
The multi-layer base papermaking of the present invention is carried out in three to five layers by a round-mesh multi-cylinder paper machine, but is not particularly limited to this method. As the physical properties of the base paper, a range of 800 g / m 2 or more is suitable for rice tsubo. The paper thickness is 1.00 mm or more, the base paper surface strength is 2 A or more, the surface Smooster smoothness is 70 cmHg or less, the Stekigt sizing degree is 500 seconds or more, and the Taber stiffness (T / Y) ratio is 2.5.
It must be in the appropriate range below.

【0019】以上、本発明のキャリアテープ用原紙の提
供により、原紙製造時リールでの巻取り製品に層間剥
離、折れじわが発生しない。またカバーテープに対する
接着性、剥離性が良好であり、原紙の寸法安定性、層間
強度、剛性が実用レベル範囲にあるチップ型電子部品収
納台紙であるキャリアテープ紙が実用化できることにな
った。
As described above, by providing the base paper for a carrier tape of the present invention, delamination and creases do not occur in a product wound on a reel when the base paper is manufactured. In addition, carrier tape paper, which is a chip-type electronic component storage board having good adhesiveness and peelability to the cover tape and having dimensional stability, interlayer strength, and rigidity of the base paper within practical ranges, can be put to practical use.

【0020】[0020]

【発明の実施の形態】以下、本発明のチップ型電子部品
収納台紙であるキャリアテープ紙の具体的な構成を、実
施例に基づいて説明する。本発明はこれら実施例によっ
て制限を受けるものではない。なお特に断らない限り例
中の配合%、添加%及び重量は固形分換算での重量%を
示す。また全ての例について抄造した紙はJIS−P8
111に準じて前処理を行った後、紙質試験を行った。
更に実際にスリッターでの8mmスリットとパンチング
処理、カバーテープの接着を行い、パンチング処理後に
剥離発生の有無とトップカバーテープの接着性を確認し
た。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a specific structure of a carrier tape sheet as a chip-type electronic component storage board of the present invention will be described based on embodiments. The present invention is not limited by these embodiments. Unless otherwise specified, the blending percentages, addition percentages, and weights in the examples are weight percentages in terms of solid content. The paper made for all examples is JIS-P8
After performing the pretreatment according to 111, a paper quality test was performed.
Further, an 8 mm slit with a slitter, a punching process, and a cover tape were actually bonded, and after the punching process, the presence or absence of peeling and the adhesion of the top cover tape were confirmed.

【0021】 実施例1 原料配合 表層 NBKP 50%、LBKP 20% リンターパルプ 30% 中層 NBKP 50%、LBKP 20%、リンターパルプ 30% 裏層 NBKP 50%、LBKP 20% リンターパルプ 30% 上記原料の叩解度を500mlとし、紙力増強剤を対パ
ルプ1.0%、サイズ剤を対パルプ0.4%添加した。
またサイズプレスにおいて濃度5%の酸化澱粉を両面に
2〜3g/m(固形分)になるように塗布し、紙厚
1.28mm、坪量1013g/mの5層原紙を抄紙
し、本発明のキャリアテープ用原紙を得た。
Example 1 Raw Material Mixing Surface NBKP 50%, LBKP 20% linter pulp 30% Middle layer NBKP 50%, LBKP 20%, linter pulp 30% Back layer NBKP 50%, LBKP 20% linter pulp 30% Beating of the above raw materials The degree was set to 500 ml, and the paper strength enhancer was added to pulp at 1.0% and the sizing agent was added to pulp at 0.4%.
Also, in a size press, oxidized starch having a concentration of 5% was applied to both sides so as to have a concentration of 2 to 3 g / m 2 (solid content), and a 5-layer base paper having a paper thickness of 1.28 mm and a basis weight of 1013 g / m 2 was formed. A base paper for a carrier tape of the present invention was obtained.

【0022】実施例2 実施例1において、紙厚を1.36mm、坪量を105
4g/mとした以外は、実施例1と同様にして本発明
のキャリアテープ用原紙を得た。
Example 2 In Example 1, the paper thickness was 1.36 mm and the basis weight was 105.
A carrier tape base paper of the present invention was obtained in the same manner as in Example 1 except that the amount was changed to 4 g / m 2 .

【0023】実施例3 実施例1において、紙厚を1.43mm、坪量を112
1g/mとした以外は、実施例1と同様にして本発明
のキャリアテープ用原紙を得た。
Example 3 In Example 1, the paper thickness was 1.43 mm and the basis weight was 112.
A carrier tape base paper of the present invention was obtained in the same manner as in Example 1 except that the amount was changed to 1 g / m 2 .

【0024】実施例4 実施例1において、表層、中層、裏層の原料配合をNB
KP 50%、LBKP 40%、リンターパルプ 1
0%とした以外は、実施例1と同様にして本発明のキャ
リアテープ用原紙を得た。
Example 4 In Example 1, the raw materials for the surface layer, the middle layer and the back layer were mixed with NB.
KP 50%, LBKP 40%, linter pulp 1
A base paper for a carrier tape of the present invention was obtained in the same manner as in Example 1 except that 0% was used.

【0025】実施例5 実施例1において、表層、裏層の原料配合をNBKP
50%、LBKP 50%とした以外は、実施例1と同
様にして本発明のキャリアテープ用原紙を得た。
Example 5 In Example 1, the raw materials for the surface layer and the back layer were mixed with NBKP.
A base paper for a carrier tape of the present invention was obtained in the same manner as in Example 1 except that 50% and LBKP were set to 50%.

【0026】比較例1 実施例1において、表層、中層、裏層の原料配合をNB
KP 50%、LBKP 50%とした以外は、実施例
1と同様にして本発明のキャリアテープ用原紙を得た。
Comparative Example 1 In Example 1, the raw materials of the surface layer, the middle layer and the back layer were mixed with NB.
A base paper for a carrier tape of the present invention was obtained in the same manner as in Example 1, except that KP was 50% and LBKP was 50%.

【0027】比較例2 実施例2において、表層、中層、裏層の原料配合をNB
KP 50%、LBKP 50%とした以外は、実施例
2と同様にして本発明のキャリアテープ用原紙を得た。
Comparative Example 2 In Example 2, the raw materials of the surface layer, the middle layer and the back layer were mixed with NB.
A carrier tape base paper of the present invention was obtained in the same manner as in Example 2 except that KP was 50% and LBKP was 50%.

【0028】比較例3 実施例3において、表層、中層、裏層の原料配合をNB
KP 50%、LBKP 50%とした以外は、実施例
3と同様にして本発明のキャリアテープ用原紙を得た。
Comparative Example 3 In Example 3, the raw materials of the surface layer, the middle layer and the back layer were mixed with NB.
A carrier tape base paper of the present invention was obtained in the same manner as in Example 3 except that KP was 50% and LBKP was 50%.

【0029】比較例4 実施例5において、中層の原料配合をNBKP 50
%、LBKP 45%リンターパルプ 5%とした以外
は、実施例5と同様にして本発明のキャリアテープ用原
紙を得た。
Comparative Example 4 In Example 5, NBKP 50
%, LBKP 45%, linter pulp 5%, and a base paper for a carrier tape of the present invention was obtained in the same manner as in Example 5.

【0030】以下余白The following margin

【表1】 【table 1】

【0031】[0031]

【発明の効果】本発明のチップ状電子部品キャリアテー
プ用原紙は、原紙の全層または中層にリンターパルプ
を配合することにより、原紙製造時リールでの巻取り製
品に層間剥離や、折れじわが発生しない。原紙の表面
強度があり、カバーテープが良好に接着されたり、剥す
ことも簡単である。高速の自動機械で曲げ、しごきな
どの力を受けても層間剥離、折れじわをおこさない。
パンチング適性がある。寸法安定性に優れているキャ
リアテープ紙が実用化できることになった。
The base paper for a chip-shaped electronic component carrier tape of the present invention is obtained by blending linter pulp into all or the middle layer of the base paper to prevent delamination or creasing of a product wound on a reel at the time of base paper production. Does not occur. It has the surface strength of the base paper, and the cover tape is well adhered and easy to peel off. It does not delaminate or break even when subjected to bending, ironing or other forces by a high-speed automatic machine.
Suitable for punching. Carrier tape paper with excellent dimensional stability can be put to practical use.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開2000−203521(JP,A) 特開 平9−110071(JP,A) 特開 平9−188385(JP,A) 特開2000−43975(JP,A) (58)調査した分野(Int.Cl.7,DB名) D21H 11/00 - 27/42 B65D 73/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2000-203521 (JP, A) JP-A-9-110071 (JP, A) JP-A-9-188385 (JP, A) JP-A 2000-43975 ( JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) D21H 11/00-27/42 B65D 73/02

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 厚さ1.00mm以上の木材パルプを主
体とした多層抄き板紙であって、該多層抄き板紙原紙の
全層または中層にリンターパルプを配合したことを特徴
とする電子部品用キャリアテープ紙。
1. A multilayer paperboard mainly made of wood pulp having a thickness of 1.00 mm or more, characterized in that linter pulp is blended in all or the middle layer of the multilayer paperboard base paper. For carrier tape paper.
【請求項2】 上記多層抄き板紙原紙の全層または中層
にリンターパルプを10〜70重量%配合したことを特
徴とする請求項1記載の電子部品用キャリアテープ紙。
2. The carrier tape paper for electronic parts according to claim 1, wherein 10 to 70% by weight of linter pulp is blended in all or the middle layer of the multilayer paperboard base paper.
【請求項3】 上記全層または中層の各層に内添する澱
粉、変性澱粉、ポリアクリルアミドなどの紙力増強剤の
添加量はパルプに対して固形分で1〜10%であること
を特徴とする請求項1又は2記載の電子部品用キャリア
テープ紙。
3. The addition amount of a paper-strength enhancer such as starch, modified starch or polyacrylamide to be added to each of the whole layer or the middle layer is 1 to 10% in solid content based on pulp. The carrier tape paper for electronic parts according to claim 1 or 2, wherein
【請求項4】 JIS P8125によるテーバー剛度
のT/Y比が2.5以下、TAPPI T459による
表面強度が2A以上、JIS P8122によるステキ
ヒトサイズ度が500秒以上であることを特徴とする請
求項1、2又は3記載の電子部品用キャリアテープ紙。
4. The method according to claim 1, wherein the T / Y ratio of the Taber stiffness according to JIS P8125 is 2.5 or less, the surface strength according to TAPPI T459 is 2A or more, and the Steckigt sizing degree according to JIS P8122 is 500 seconds or more. 4. The carrier tape paper for electronic components according to 1, 2, or 3.
JP2001125370A 2001-04-24 2001-04-24 Carrier tape paper for electronic components Expired - Lifetime JP3268522B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001125370A JP3268522B2 (en) 2001-04-24 2001-04-24 Carrier tape paper for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001125370A JP3268522B2 (en) 2001-04-24 2001-04-24 Carrier tape paper for electronic components

Publications (2)

Publication Number Publication Date
JP2002046769A JP2002046769A (en) 2002-02-12
JP3268522B2 true JP3268522B2 (en) 2002-03-25

Family

ID=18974602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001125370A Expired - Lifetime JP3268522B2 (en) 2001-04-24 2001-04-24 Carrier tape paper for electronic components

Country Status (1)

Country Link
JP (1) JP3268522B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576144B2 (en) * 2004-03-31 2010-11-04 大王製紙株式会社 Carrier tape base paper and carrier tape
JP6911088B2 (en) * 2019-11-15 2021-07-28 大王製紙株式会社 Multilayer paper and its manufacturing method

Also Published As

Publication number Publication date
JP2002046769A (en) 2002-02-12

Similar Documents

Publication Publication Date Title
JP5685051B2 (en) Carrier tape paper
JP3383935B2 (en) Carrier tape paper for electronic devices
JP3268522B2 (en) Carrier tape paper for electronic components
JP4422115B2 (en) Carrier tape paper for chip-like electronic components
JP4687587B2 (en) Chip-type electronic component storage mount, chip-type electronic component storage mount paper base manufacturing method, and chip-type electronic component storage base paper base
JP4460870B2 (en) Carrier tape paper for chip electronic devices
JP3928127B2 (en) Chip-like electronic component carrier tape paper
JP3289245B2 (en) Carrier tape paper for electronic chips
JP3902218B1 (en) Carrier tape paper and carrier tape
JP5778417B2 (en) Carrier tape paper
JP4650877B2 (en) Chip-type electronic component storage mount
JP4228929B2 (en) Storage mount for storing chip-type electronic components
JP2007001589A (en) Chip-type electronic component storing mount
JP7253485B2 (en) CARRIER TAPE BASE FOR CHIP-LIKE ELECTRONIC PARTS AND MANUFACTURING METHOD THEREOF
JP7406453B2 (en) Packaging for paper products
JP4619993B2 (en) Carrier tape paper for chip-like electronic components
JP2003095320A (en) Carrier tape stencil for chip-like electronic component
JP3289244B2 (en) Carrier tape mount for chip-shaped electronic components
JP2008001378A (en) Carrier tape paper and carrier tape
JP4288291B2 (en) Carrier tape paper and carrier tape
JP2953391B2 (en) Chip-type electronic component storage board
JP2023119215A (en) Carrier tape mount for chip shaped electronic component and manufacturing method thereof
JP2023102542A (en) Manufacturing method of carrier tape mount for chip type electronic component
JPH0732453Y2 (en) Carrier tape for small electronic components and vulcanized fiber for carrier tape
JP5665520B2 (en) Carrier tape mount for chip-shaped electronic parts and method for manufacturing the same

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20011120

R150 Certificate of patent or registration of utility model

Ref document number: 3268522

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110118

Year of fee payment: 9

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110118

Year of fee payment: 9

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110118

Year of fee payment: 9

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130118

Year of fee payment: 11

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140118

Year of fee payment: 12

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term