九、發明說明： 【發明所屬之技術領域】 技術領域 本發明係有關於一種紙製之收納晶片型電子零件之紙 板’詳而言之’本發明係有關於一種與頂包覆帶之接著強 度優異’剝離頂包覆帶時可防止紙板起毛之收納晶片型電 子零件之紙板。IX. OBJECTS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a paper-based cardboard containing electronic components for wafer type. In detail, the present invention relates to a bonding strength with a top cladding tape. Excellent paperboard for accommodating wafer-type electronic parts when the top cover tape is peeled off.
I：先前技術：J 背景技術 收納晶片型電子零件之紙板係晶片型電子零件之載具 (收納保持用具）’且通常紙板用厚紙係依照下列步驟加工處 理製造。 (1) 將紙板用厚紙裁成預定寬度的帶。 (2) 於所得之厚紙帶上形成預定大小的角孔及圓孔。角 孔係用於收納晶片型電子零件，而圓孔係可使紙板於零件 填充機中僅行進預定距離。 (3) 紙板裏面（底側）接著有底包覆帶，形成角孔及圓孔 的底面。另外，也可於紙板帶上進行預定大小的角狀壓花 加工形成有底的孔來代替穿出角孔，此時可省略本步驟 (3)。接著包覆帶於紙板時，使用所謂的熱封法，係將包覆 帶重疊於紙板之裏面，再從包覆帶上施加熱及壓力的方法。 (4) 將晶片型電子零件填充至前述紙板内的角孔中。 (5) 以熱封法將頂包覆帶接著於紙板表面（頂側）以封閉 角孔。 (6) 將所彳寸之收納晶片厚紙帶卷捲繞於預定大小的匣式 捲軸，與晶片型電子零件一同裝運。 (7) 由最終使用者從紙板表面剝除頂包覆帶而使角孔呈 開口狀，然後取出收納於其中之晶片型電子零件。 由上述使用步驟來看，收納紙板的品質必須具備：（1) 不會對填充於其中的晶片零件產生不良影響；（2)具有可承 受各種對紙進行之處理的強度；(3)可良好地接著頂包覆 ▼，且為了取出晶片型電子零件而撕開頂包覆帶時，不會 產生起毛現象等。 至今，雖然已有開發檢測包覆帶未接著部分的裝置以 作為剝離頂包覆帶時可防止起毛之料(特許文獻丨）；以及 非防止未接著部的根本方法，而是對於使㈣膠基材作為 基材者之破㈣策(料文獻2、3、彳）；或是非改善紙製載 帶之剝離所引_防止起毛性，而是藉由規定針葉木與闊 葉木的配合比、或以塗膠壓具將澱粉塗於兩面來防止起 毛的方法(特#文獻5)等，但未見注目於可明顯改善紙製收 、内曰a片型電？零件紙板之防土起毛性並揭*其有效解決方 法的公開文獻。 特許文獻1 :特開平9—315486號公報 特許文獻2 :特開平11-105181號公報 特許文獻3 :特開平9_156684號公報 特許文獻4 :特開平8_258888號公報 特許文獻5 :特開2000-175966號公報 【發^明内笔^】 1329066 發明揭示 發明所欲解決之課題 本發明係一種紙製的收納晶片型電子零件之紙板，目 的在於提供一種與頂包覆帶之接著性優異，且剝離頂包覆 5 帶時可防止紙板起毛之收納晶片型電子零件之紙板。 解決課題之手段 本發明人發現對於紙製之收納晶片型電子零件之紙 板，為了防止起毛使塗布於表層之表面處理劑充分地滲透 紙層，且滲透之表面處理劑更強化纖維間的結合，可極有 10 效地防止起毛現象的發生，而完成了本發明。 本發明之收納晶片型電子零件之紙板，係具有複數個 可收納晶片型電子零件之凹穴的紙板，且該紙板於接合可 封閉前述凹穴之頂包覆帶的纸板表面，形成有塗布層，而 該塗布層含有選自於由苯乙烯-順丁烯二酸共聚樹脂、烯烴 15 -順丁烯二酸共聚樹脂、丙烯酸酯-丙烯酸共聚樹脂、苯乙烯 -烯烴-丙烯酸共聚樹脂之至少1種所構成之防止起毛性樹 脂。 本發明之收納晶片型電子零件之紙板，其中前述塗布 層中之前述防止起毛性樹脂的含有量以0.0001〜2.Og/m2為 20 佳。 本發明之收納晶片型電子零件之紙板，其中前述塗布 層中，除了前述防止起毛性樹脂外，宜更包含至少含有1種 水溶性高分子化合物之水溶性樹脂。 本發明之收納晶片型電子零件之紙板，其中前述水溶 7 性樹脂宜包含選自於聚乙烯醇、澱粉及聚丙烯醯胺之至少1 種0 本發明之收納晶片型電子零件之紙板，其中相對於前述 防止起毛性樹脂100質量份’前述塗布層中之前述水溶性樹脂 的含有量在100〜10000質量份之範圍内為佳。 發明之效果 本發明之收納晶片型電子零件之紙板係與頂包覆帶之 接著強度優異，於剝離頂包覆帶時，實質上紙板不會產生 起毛現象者。 【貧施方式3 實施發明之最佳型態 在本發明之收納晶片型電子零件之紙板中，為了提昇 與紙板表層之頂包覆帶間的接著性，且更提高紙板的表面 強度，於紙板表面形成有塗布層，其係含有選自於由苯乙 烯-順丁烯二酸共聚樹脂、烯烴_順丁烯二酸共聚樹脂、丙烯 酸酯-丙烯酸共聚樹脂、苯乙烯-烯烴_丙烯酸共聚樹脂之至 少1種所構成之防止起毛性樹脂者。防止起毛性樹脂所包含 的苯乙烯-順丁烯二酸共聚樹脂、烯烴順丁烯二酸共聚樹 脂、丙烯酸酯-丙烯酸共聚樹脂、及苯乙烯_烯烴_丙烯酸共 聚樹脂，皆在其等之共聚物分子中具有疏水性基及親水性 基，藉由於紙板表面塗上含有上述樹脂之塗液形成塗布 層，可達到遮罩紙板表面的效果，且，塗液滲透至紙層中， 可使防止起毛性樹脂之共聚物分子中為親水基之羧基形成 紙漿纖維之羥基與氫鍵而成纖維間交聯之狀態，大幅地提 昇纖維間結合度。藉由上述提昇纖維間結合度，可強化紙 漿纖維的剝離強度而防止纖維脫落成為起毛現象，且，可 提升剝除頂包㈣時之紙漿纖__抵抗力。 τ 使用於本發明之防止起毛性樹脂於塗布層中，以含有 5 0.0001〜2.Gg/m2之含有量為佳，則顧叫5咖2尤佳更 以0.01〜1.0g/m2最佳。 又，在本發明之枚納晶片型電子零件之紙板中，將含 有由選自於苯乙稀-順丁稀二酸共聚樹脂、稀煙-順丁稀二酸 共聚樹脂、丙稀酸酿-丙烯酸共聚樹脂、苯乙稀-稀煙·丙稀 10酸共⑽狀至少構紅防止料《m與水溶性 高分子化合物混合塗布’可更有效果地防止起毛現象發 生。亦即，藉由含有水溶性高分子，該水溶性高分子可對 由本發明所使用之防止起毛性樹脂與紙漿纖維所形成之交 聯狀態31塊間作用為黏結劑，而有效地防止起毛。此外， 15本發明所使用之防止起毛性樹脂藉由與水溶性高分子化合 物共存，可降低水溶性高分子化合物的表面張力，均一地 分布於紙板之表面，同時深入滲透至内部，可提升防止由 紙層内部起毛的效果。 在本發明中，使用於防止起毛性樹脂之苯乙烯順丁烯 20二酸共聚樹脂、烯烴-順丁烯二酸共聚樹脂的玻璃化溫度以 10〜50 c為佳。若玻璃化溫度小於1〇〇c，會因為貼封頂包 覆帶時的貼封溫度而使以交聯狀態存在於紙漿纖維間之苯 乙烯-順丁烯二酸共聚樹脂及烯烴_順丁烯二酸共聚樹脂之 結合變弱，故不甚佳。又，當玻璃化溫度大於刈它時，則 會與紙聚纖維間之交聯構造變硬，使剝除包覆帶時之壓力 損壞塗布層’而有可能使破損部產生起毛現象。 由於同樣的理由，苯乙烯-烯烴-丙烯酸共聚樹脂的玻璃 化溫度以60〜1〇〇。^為佳。 又’在本發明之收納晶片型電子零件之紙板中，於紙 板表面形成含有本發明所使用的防止起毛性樹脂、及可因 應必要而含有的水溶性樹脂之塗布層時，可採用例如：棒 塗機、刮刀塗布機、氣刀式塗布機、棍塗機、閘輥塗布機 或施膠壓塗機、壓光塗布機等之輥塗機、雙面刮刀塗布機、 輥刀合一塗布機等。 使用於本發明之收納晶片型電子零件之紙板之原料紙 毁無特別限制，可使用例如：化學紙漿（闊葉木、針葉木）、 機械紙衆、舊紙紙漿、非木材纖維紙漿、合成紙漿等。可 單一使用上述紙漿，也可混合兩種以上使用。關於抄造紙 用内添藥品’可使用本發明所使用的防止起毛性樹脂及水 溶性樹脂’也可因應需要，使用例如松香、苯乙烯_順丁烯 二酸、烯基丁二酸酐、烷基乙烯酮二聚體等膠劑，各種紙 力增強劑、排水度提昇劑、聚醯胺聚胺環氧氯丙烷等对水 化劑，及/肖泡劑、滑石等之填料、染料等。 製造本發明之收納晶片型電子零件之紙板的製造裝 置、製造條件並無特別限制，可選擇適合各製造裝置之製 la條件冑ie·出本發明之製品。可使用例如圓網抄紙機及 長網抄紙機之組合抄紙，可製造出具有添加前述之添加用 藥品、或由塗布機由外添加之表層的紙板。 1329066 本發明之收納晶片型電子零件之紙板中，可依必要使 用各種内添藥品。可使用例如：松香系膠劑、苯乙烯•順 丁烯二酸共聚物、烷基乙烯酮二聚體、烯基丁二酸酐等天 然及合成之製紙用内添膠劑，各種紙力增強劑、排水度提 5 昇劑、聚醯胺聚胺環氧氣丙烷等耐水化劑，及消泡劑、滑 石等之填料、染料等。 又，本發明之收納晶片型電子零件之紙板中，為了提 昇與底包覆帶間之接著性及防止起毛的效果，可適當地於 紙板裏面塗布聚乙烯醇、澱粉、聚丙烯醯胺、丙烯酸系樹 10 脂、苯乙烯•丁二烯系樹脂、苯乙稀•異戊二烯系樹脂、 聚酯系樹脂、乙烯-乙酸乙烯系樹脂、乙酸乙烯-乙烯醇系樹 脂、胺曱酸酯系樹脂等必要的藥品。此外，關於塗布方法， 可使用例如：棒塗機、刮刀塗布機、氣刀式塗布機、棍塗 機、閘輥塗布機或施膠壓塗機、壓光塗布機等之輥塗機、 15 雙面刮刀塗布機、輥刀合一塗布機等。 本發明之收納晶片型電子零件之紙板之坪量，係由收 納於其中之晶片型電子零件大小來決定，一般為200〜 1000g/m2左右。由於為上述坪量範圍，故抄造方法以容易 產生良好紙質之多層抄造為佳。 20 實施例 以下述實施例詳細說明本發明，但本發明不限定於該 等實施例中。另，顯示配合、濃度等數值係固體成份或有 效成分之質量基準數值。又，以JIS P8111為基準對全例之 抄造後的紙施行前處理後，測定剝離強度。剝離強度的詳 11 1329066 細測定條件如下。 <剝離強度的測定方法> 將收納晶片型電子零件之紙板切成8mm寬的帶，使用 曰東電工(株)製之「N0.318H-14A」（商標）〔共押出聚對苯 5 二曱酸乙二醇酯(PET)及乙烯.乙酸乙烯酯共聚物(EVA)之 層疊片：寬5.25mm、厚53μιη〕作為包覆帶，包覆紙板之一 側邊緣，接著使用亍7夕一產業（株）製之熱封測試器 「TP701S」，在熱封溫度155°C、施加於試料之熱封壓力為 1.5MPa、熱封時間0.2秒之條件下，從以包覆帶包覆之側緣 10 往内側〇.5mm的位置開始，以寬幅〇.4mm將該包覆帶熱封於 紙板面成間隔3.〇mm的轨道狀’接著，約1小時後，依以jis C 0806-3為基準之方法（剝離速度300mm/mm測定時間12 秒)測定包覆帶的剝離強度複數次，求出該平均值。 <起毛度> 15 以目視觀察測定剝離強度後之包覆帶部（面積： a8cm2) ’如下判定防止起毛現象發生度並記錄。 7 .完全沒有起毛。 6 : 1根織毛。 5 : 2根絨毛。 20 4 : 3〜5根、織毛。 3 : 6〜8根蛑毛。 2 : 9〜1G根部分起毛。 1 :全面地起毛。 實施例1 12 1329066 由彼此紙漿組成各異之表層、中層、裏層所構成之三 層抄造法製造收納晶片型電子零件之紙板用厚紙板。此 時，混合NBKP30%、LBKP70%，調製CSF(Canada Standard Freeness)400ml的紙漿用於表層；配合NBKP20%、 5 LBKP20%、上質舊紙20%、舊報紙40%，調製CSF350ml的 紙漿用於中層；配合NBKP25%、LBKP25%、舊報紙50%， 調製CSF400ml的紙漿用於裏層。於各紙漿中添加硫酸鋁， 調整其pH值為為6.0，添加0.3%聚丙烯酸胺（商標：求口只 卜口 /1250，荒川化學工業製）作為内添紙力增強劑。以圓 10網3層合抄抄造機將上述條件之紙漿’分別抄造成表層 l〇〇g/m2、中層200g/m2、裏層5〇g/m2,再以設製於抄紙機之 平滑化處料(料行平滑化處賴，料層表面塗上 ™A法駭玻璃化溫度苯乙稀·順丁稀二酸共聚樹 脂（商標：PM382，荒川化學工業製)〇.9〆作為防止起毛 15用處理劑，製造出坪量350g/m2 m η 吁里g/m、厚〇.42mm之收納晶片型電 子零件之紙板。測定結果如第丨表所示。 實施例2 20 以與實施例1同樣的方法製造出收納晶片型電子零件 =板。自’於表層表面形戍含有由玻璃化溫度_之苯 ^ 丁稀二酸共聚樹脂(商標：pM482,荒川化學工業製） 防止起毛性樹脂之塗布層，作 作為防止起毛用處理劑。 測定結果如第1表所示。 實施例3 以與實施例1同樣的方法製造出收納晶片型電子零件 13 之、我板。但，混合聚丙稀酸胺（商標：pS117 ,荒川化學工 業製）100質量份、苯己婦·順丁歸二酸共聚樹脂（商標： PM382,0丨化學工業製)2〇質量份，調製成防止表層表面 起毛用處理劑。 5 測定結果如第1表所示。 實施例4 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但’混合聚乙稀醇（商標：PVA117，夕y卜製）100 質里份、苯乙烯-順丁烯二酸共聚樹脂（商標：pM382，荒川 10化學工業製)2.0質量份，調製成防止表層表面起毛用處理 劑。 測定結果如第1表所示。 實施例5 以與實施例1同樣的方法製造出收納晶片型電子零件 15之紙板。但，混合聚丙烯酸胺（商標：PS117，荒川化學工 業製）100質量份、玻璃化溫度24。〇之苯乙烯-順丁烯二酸共 聚樹脂（商標：PM385，荒川化學工業製；)2.〇質量份，調製 成防止表層表面起毛用處理劑。 測定結果如第1表所示。 20 實施例6 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合氧化澱粉（商標：AceA，王子c〇rnstarch 製）100質量份、苯乙烯_順丁烯二酸共聚樹脂（商標： PM382 ’荒川化學工業製)2 〇質量份，調製成防止表層表面 14 1329066 起毛用處理劑。 測定結果如第1表所示。 實施例7 以與實施例1同樣的方法製造出收納晶片型電子零件 5 之紙板。但，混合陽離子化澱粉（商標：Ace K-250，王子 Cornstarch製）100質量份、苯乙烯-順丁稀二酸共聚樹脂（商 標：PM382，荒川化學工業製)2.0質量份，調製成防止表層 表面起毛用處理劑。 測定結果如第1表所示。 10 實施例8 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合尿素磷酸酯化澱粉(商標·· AceP230，王 子Cornstarch製）100質量份、苯乙烯-順丁烯二酸共聚樹脂 (商標：PM382，荒川化學工業製)2.0質量份，調製成防止 15 表層表面起毛用處理劑。 測定結果如第1表所示。 實施例9 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，使用玻璃化溫度110°C之丙烯酸酯-丙烯酸共 20 聚樹脂（商標：SS2560，星光PMC製），作為表層表面之防 止起毛用處理劑。 測定結果如第1表所示。 實施例10 以與實施例1同樣的方法製造出收納晶片型電子零件 15 1329066 之紙板。但’混合聚丙稀酸胺（商標：PS117，荒川化學工 業製）1〇〇質量份、丙浠酸酯-丙稀酸共聚樹脂（商標： SS2560，星光PMC製)2.0質量份，調製成防止表層表面起 毛用處理劑。 5 測定結果如第1表所示。 實施例11 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合聚乙烯醇（商標：PVAU7，夕歹b製）ι〇〇 質量份、丙烯酸酯-丙稀酸共聚樹脂（商標：SS256〇，星光 10 PMC製)2.0質量份，調製成防止表層表面起毛用處理劑。 測定結果如第1表所示。 實施例12 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但’混合氧化澱粉（商標：AceA，王子C0rnstarch 15製）100質量份、丙烯酸酯-丙烯酸共聚樹脂（商標：SS2560， 星光PMC製）2.0質量份，調製成防止表層表面起毛用處理 劑。 測定結果如第1表所示。 實施例13 20 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合陽離子化澱粉（商標：Ace κ_250，王子 Cornstarch製）100質量份、丙烯酸酯_丙烯酸共聚樹脂（商 標.SS2560，星光PMC製)2.〇質量份，調製成防止表層表 面起毛用處理劑。 16 1329066 測定結果如第1表所示。 實施例14 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合尿素填酸醋化澱粉(商標：Ace P230，王 5 子Cornstarch製）100質量份、丙烯酸酯-丙烯酸共聚樹脂（商 標：SS2560，星光PMC製）2.0質量份，調製成防止表層表 面起毛用處理劑。 測定結果如第1表所示。 實施例15 1〇 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，使用玻璃化溫度100°C之苯乙烯-烯烴-丙烯酸 共聚樹脂（商標：SS2910，星光PMC製），作為表層表面之 防止起毛用處理劑。 測定結果如第1表所示。 15 實施例16 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合聚丙烯酸胺（商標：PS117，荒川化學工 業製）100質量份、苯乙烯-烯烴-丙烯酸共聚樹脂（商標： SS2910，星光PMC製）2.0質量份，調製成防止表層表面起 20 毛用處理劑。 測定結果如第1表所示。 實施例17 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合聚乙烯醇（商標：PVA117，夕歹b製）100 17 1329066 質量份、苯乙稀-稀烴-丙稀酸共聚樹脂（商標：SS2910，星 光PMC製)2.0質量份，調製成防止表層表面起毛用處理劑。 測定結果如第1表所示。 實施例18 5 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合氧化澱粉（商標：AceA，王子c〇rnstarch 製）100質量份、苯乙烯-烯垣-丙烯酸共聚樹脂（商標： SS2910，星光PMC製）2.0質量份，調製成防止表層表面起 毛用處理劑。 10 測定結果如第1表所示。 實施例19 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，混合陽離子化澱粉（商標：Ace κ_25〇，王子 Cornstarch製）1〇〇質量份、苯乙烯-烯烴-丙烯酸共聚樹脂（商 15標：SS2910，星光PMC製)2.〇質量份，調製成防止表層表 面起毛用處理劑。 測定結果如第1表所示。 實施例20 以與實施例1同樣的方法製造出收納晶片型電子零件 20之紙板。但’混合尿素磷酸酯化澱粉(商標：Ace P230，王 子Cornstarch製）100質量份、苯乙烯-烯烴_丙烯酸共聚樹脂 (商標·· SS2910，星光PMC製)2·〇質量份，調製成防止表層 表面起毛用處理劑。 測定結果如第1表所示。 18 1329066 比較例1 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，以聚乙烯醇（商標：PVA117,夕7卜製）0_9g/m2 之塗量塗上，作為表層表面用處理劑。 5 測定結果如第1表所示。 比較例2 以與實施例1同樣的方法製造出收納晶片型電子零件 之紙板。但，以聚乙烯醇（商標：PVA117，夕7卜製）0.3g/m2 之塗量塗上，作為表層表面用處理劑。 10 測定結果如第1表所示。 19 1329066 00 菰MS LO 卜 〇 m Ο Ο to 1 卜 ! ίβ CM ! 鷀一 _:渺 m 〇 tn 〇 tn CO ΙΛ LO U0 Γ0 〇 iO 〇 卜 〇 tn 〇 1C 07 〇 C0 〇 00 00 03 寸 C0 CO cn ^τ to 03 in 〇 〇 〇 Ο Ο 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 ο ο 〇 ο Ο ο 塗布童 (g/m2) 〇 〇 a σ> G5 σ> 〇 〇 ο Oi 〇 〇 ο ο Oi 〇 C5 05 CO 〇 〇 〇 ο ο 〇 〇 〇 〇 ο 〇 〇 〇 Ο 〇 〇 ο ο Ο Ο ο 防止表層表面發生起毛現象處理劑 _____ ________....................... ...........___ 苯乙烯-順丁烯二酸共聚樹脂 烯烴-順丁烯二酸共聚樹脂 :苯乙烯-順丁烯二酸共聚樹脂/聚丙烯酸胺 t苯乙烯-傾丁烯二酸共聚樹脂/聚乙烯醇 苯乙烯-順丁烯二酸共聚樹脂/聚丙烯酸胺 苯乙烯-順丁烯二酸共聚樹脂，氧化務粉 苯乙烯-順丁烯二酸共聚樹脂/陽離子化澱粉 苯乙烯-順丁烯二酸共聚樹脂/尿素磷酸酯化澱粉 丙烯酸酯-丙烯酸共聚樹脂 丙烯酸酯-丙烯酸共聚樹脂/聚丙烯酸胺 丙烯酸酯-丙烯酸共聚樹脂/聚乙烯醇 丙烯酸酯-丙烯酸共聚樹脂，氣化殺粉 丙烯酸酯-丙烯酸共聚樹脂/陽離子化澱粉 丙烯酸酯-丙烯酸共聚樹脂/尿素磷酸酯化殺粉 苯乙烯-烯烴-丙烯酸共聚樹脂 狴 趙 K 联 鋰 m Μ ai IE a 畦 K1 勸 η ΙΌ 嵌 m m 联 饀 SI E 褰 ή ί0 m 苯乙烯-烯烴-丙烯酸共聚樹脂/氧化澱粉 m nm m 豳 鋰 Μ 嵌 趙 理 Κ ύ μ 擀 m 安 m 饀 態 m m m B m 想 线 κ m at ή 拼 聚乙烯醇 聚乙烯醇 |實施例1 I |實施例2 1 r^l^J3 Ί 1實施例4 |贲施例5 I 實施例6 |實施例7 1 贲施例8 實施例9 !寶施例】〇 1實施例11 | 實施例12 ! !實施例13 1 實施例14 1實施例15 宜施例16 i贲施例17 實施例18 音施例19 宜施例20 比铰例1 比铰例2I. Prior art: J Background Art A paperboard-based electronic component carrier (storage holder) for accommodating a wafer type electronic component is usually manufactured by the following steps. (1) Cut the cardboard into thick strips of paper of a predetermined width. (2) A corner hole and a circular hole of a predetermined size are formed on the obtained thick paper tape. The corner holes are used to house wafer-type electronic parts, and the round holes allow the board to travel only a predetermined distance in the part filling machine. (3) Inside the cardboard (bottom side), there is a bottom cladding tape to form the corner holes and the bottom surface of the circular holes. Alternatively, the embossing of a predetermined size may be performed on the cardboard belt to form a bottomed hole instead of the corner hole. This step (3) may be omitted. Next, when the tape is coated on the paperboard, a so-called heat sealing method is employed in which the coating tape is superposed on the inside of the cardboard, and heat and pressure are applied from the coated tape. (4) Fill the wafer type electronic parts into the corner holes in the aforementioned cardboard. (5) The top cover tape is attached to the surface of the paperboard (top side) by heat sealing to close the corner holes. (6) Wrap the wrapped wafer thick paper tape around a predetermined size of the reel and ship it together with the chip-type electronic parts. (7) The end user peels off the top cover tape from the surface of the cardboard to make the corner holes open, and then takes out the wafer-type electronic components housed therein. From the above-mentioned use steps, the quality of the storage board must have: (1) no adverse effect on the wafer parts filled therein; (2) strength to withstand various types of processing on paper; (3) good The ground is covered with a top cover ▼, and when the top cover tape is torn apart in order to take out the wafer type electronic component, no fluffing phenomenon or the like occurs. Heretofore, although a device for detecting a non-adjacent portion of a cover tape has been developed as a peeling top cover tape to prevent fluffing material (a privileged document); and a non-preventing non-adhesive portion is essential, but for making a (four) glue The substrate is used as the substrate to break (four) policy (materials 2, 3, 彳); or the non-improvement of the stripping of the paper carrier tape to prevent fluffing, but by specifying the mixing ratio of softwood and hardwood, Or a method of applying starch to both sides to prevent fuzzing by using a glue presser (Specific #5), but it is not noticed that the paper can be significantly improved, and the inner sheet is made. The open-text literature on the anti-soil fluffing of parts and boards and their effective solutions. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION The present invention is a paper-based paper-packaged electronic component paperboard, which is intended to provide excellent adhesion to a top cladding tape and a peeling top. When the 5-belt is covered, the cardboard for accommodating the wafer-type electronic parts can be prevented from being raised by the cardboard. Means for Solving the Problem The present inventors have found that in paper-based paper-based electronic components, the surface treatment agent applied to the surface layer sufficiently penetrates the paper layer to prevent pilling, and the infiltrated surface treatment agent strengthens the bonding between the fibers. The present invention has been completed in an extremely effective manner to prevent the occurrence of fluffing. The paperboard for accommodating a wafer-type electronic component of the present invention has a plurality of cardboards for accommodating the recesses of the wafer-type electronic components, and the cardboard is bonded to form a surface of the cardboard covering the top cladding of the recesses to form a coating layer. And the coating layer contains at least one selected from the group consisting of a styrene-maleic acid copolymer resin, an olefin 15-maleic acid copolymer resin, an acrylate-acrylic copolymer resin, and a styrene-olefin-acrylic copolymer resin. The anti-pilling resin is composed of the species. In the paperboard containing the wafer type electronic component of the present invention, the content of the above-mentioned anti-pilling resin in the coating layer is preferably 0.0001 to 2. Og/m2. In the paper board containing the wafer type electronic component of the present invention, the coating layer further contains a water-soluble resin containing at least one water-soluble polymer compound in addition to the above-mentioned hair-preventing resin. The paper-based electronic component paperboard according to the present invention, wherein the water-soluble resin preferably comprises at least one selected from the group consisting of polyvinyl alcohol, starch, and polyacrylamide. It is preferable that the content of the water-soluble resin in the coating layer is 100 to 10,000 parts by mass in 100 parts by mass of the above-mentioned anti-pilling resin. Advantageous Effects of Invention The paperboard-based electronic component of the present invention has excellent strength in the subsequent strength of the paperboard and the top cover tape, and substantially does not cause fluffing when the top cover tape is peeled off. [The mode of implementation of the invention] In the paperboard for accommodating wafer type electronic parts of the present invention, in order to improve the adhesion between the top cover tape of the surface layer of the cardboard and to improve the surface strength of the paperboard, The surface is formed with a coating layer selected from the group consisting of a styrene-maleic acid copolymer resin, an olefin-maleic acid copolymer resin, an acrylate-acrylic copolymer resin, and a styrene-olefin-acrylic copolymer resin. At least one of the materials for preventing hair raising resin. The styrene-maleic acid copolymer resin, the olefin maleic acid copolymer resin, the acrylate-acrylic copolymer resin, and the styrene-acrylic copolymer resin contained in the hair raising resin are all copolymerized therein. The object has a hydrophobic group and a hydrophilic group. By coating the surface of the paperboard with a coating liquid containing the above resin to form a coating layer, the effect of masking the surface of the paperboard can be achieved, and the coating liquid can penetrate into the paper layer to prevent it. The carboxyl group which is a hydrophilic group in the copolymer of the fuzzing resin forms a state in which the hydroxyl group of the pulp fiber is crosslinked with the hydrogen bond to form a fiber, and the degree of fiber-to-fiber bonding is greatly enhanced. By the above-mentioned degree of bonding between the fibers, the peel strength of the pulp fibers can be strengthened to prevent the fibers from falling off and the fluffing phenomenon can be improved, and the pulp fiber __ resistance can be improved when the top pack (4) is peeled off. τ The anti-pilling resin used in the present invention is preferably contained in the coating layer in an amount of 5 0.0001 to 2. Gg/m 2 , and more preferably 0.01 to 1.0 g/m 2 . Further, in the paperboard of the wafer type electronic component of the present invention, it is contained by a copolymer resin selected from the group consisting of styrene-cis-succinic acid copolymer, a dilute-succinic acid copolymer resin, and acrylic acid- Acrylic copolymer resin, styrene-distilled-acrylic-acrylic acid 10 (10)-like at least red-blocking material "m and water-soluble polymer compound mixed coating" can more effectively prevent the occurrence of fluffing. In other words, by containing a water-soluble polymer, the water-soluble polymer acts as a binder between the blocks of the cross-linking state formed by the anti-pilling resin and the pulp fibers used in the present invention, thereby effectively preventing fuzzing. In addition, the anti-pilling resin used in the present invention can reduce the surface tension of the water-soluble polymer compound by coexisting with the water-soluble polymer compound, uniformly distribute on the surface of the paperboard, and penetrate deeply into the interior to enhance the prevention. The effect of raising hair from the inside of the paper layer. In the present invention, the glass transition temperature of the styrene-butylene phthalic acid copolymer resin and the olefin-maleic acid copolymer resin used for preventing the hair raising resin is preferably 10 to 50 c. If the glass transition temperature is less than 1 〇〇c, the styrene-maleic acid copolymer resin and the olefin-butylene which are present in the crosslinked state between the pulp fibers due to the sealing temperature when the top cover tape is applied The combination of the diacid copolymer resin is weak, so it is not very good. Further, when the glass transition temperature is higher than that of ruthenium, the crosslinked structure between the paper fibers and the paper fibers is hardened, and the pressure at the time of peeling off the coated tape is damaged by the coating layer', which may cause fluffing of the damaged portion. For the same reason, the glass transition temperature of the styrene-olefin-acrylic copolymer resin is 60 to 1 Torr. ^ is better. Further, in the paperboard containing the wafer-type electronic component of the present invention, when a coating layer containing the anti-pilling resin used in the present invention and a water-soluble resin which can be contained as necessary is formed on the surface of the paperboard, for example, a rod can be used. Coating machine, knife coater, air knife coater, stick coater, brake roll coater or size press machine, calender coater, etc. roll coater, double-sided blade coater, roll-to-roll coater Wait. The raw material paper used for the paper-based electronic component of the present invention is not particularly limited, and for example, chemical pulp (hardwood, softwood), mechanical paper, old paper pulp, non-wood fiber pulp, synthetic pulp, etc. can be used. . The above pulp may be used singly or in combination of two or more. For the papermaking internal medicine, the anti-hairing resin and the water-soluble resin used in the present invention can be used. For example, rosin, styrene-maleic acid, alkenyl succinic anhydride, or alkyl group can also be used as needed. A ketene dimer and other glues, various paper strength enhancers, drainage improvers, polyamidamine polyamine epichlorohydrin and other hydrating agents, and / or foaming agents, talc and other fillers, dyes and the like. The manufacturing apparatus and manufacturing conditions of the paperboard for accommodating the wafer type electronic component of the present invention are not particularly limited, and a product suitable for each manufacturing apparatus can be selected. A paperboard having a combination of a cylinder paper machine and a long-wire paper machine can be used, and a paperboard having the above-mentioned additive medicine added or a surface layer externally added by a coater can be produced. 1329066 In the paperboard for accommodating wafer type electronic parts of the present invention, various internal medicines can be used as necessary. For example, rosin-based glue, styrene-maleic acid copolymer, alkyl ketene dimer, alkenyl succinic anhydride, and the like, natural and synthetic paper-based internal adhesives, various paper strength enhancers can be used. The drainage degree is 5 liters, polyamine amine polyamine epoxide and other water resistance agents, and antifoaming agents, talc and other fillers, dyes, and the like. Further, in the paperboard for accommodating the wafer type electronic component of the present invention, in order to improve the adhesion to the undercoating tape and prevent the effect of raising, the polyvinylidene, starch, polypropylene decylamine, acrylic acid may be appropriately coated on the cardboard. Tether 10, styrene butadiene resin, styrene/isoprene resin, polyester resin, ethylene-vinyl acetate resin, vinyl acetate-vinyl alcohol resin, amine phthalate Necessary drugs such as resins. Further, as for the coating method, for example, a bar coater, a knife coater, an air knife coater, a stick coater, a gate roll coater, a size press coater, a calender coater, or the like can be used, 15 Double-sided blade coater, roll-to-roll coater, and the like. The amount of the cardboard of the wafer-type electronic component of the present invention is determined by the size of the wafer-type electronic component received therein, and is generally about 200 to 1000 g/m2. Since it is the above-mentioned range of the amount of the flat, the method of making the paper is preferably a multi-layered paper which is easy to produce a good paper. 20 EXAMPLES The present invention will be specifically described by the following examples, but the present invention is not limited to the examples. In addition, the numerical values of the solid components or the effective components of the values such as the compounding and the concentration are shown. Further, the paper after the papermaking of the whole example was subjected to pretreatment according to JIS P8111, and the peeling strength was measured. Detailed peeling strength 11 1329066 The following conditions are as follows. <Measurement method of peeling strength> The paper sheet containing the wafer type electronic component was cut into a belt of 8 mm width, and "N0.318H-14A" (trademark) manufactured by Toyo Electric Co., Ltd. was used. a laminate of ethylene glycol diacetate (PET) and ethylene. vinyl acetate copolymer (EVA): a width of 5.25 mm and a thickness of 53 μm as a covering tape, covering one side edge of the paperboard, and then using the 亍7 eve The heat seal tester "TP701S" manufactured by the company was coated with a coated tape at a heat sealing temperature of 155 ° C, a heat seal pressure applied to the sample of 1.5 MPa, and a heat seal time of 0.2 seconds. The side edge 10 starts at the position of the inner side 〇.5mm, and the cover tape is heat-sealed to the cardboard surface at a width of 〇4mm to form a track of 3. 〇mm. Then, after about 1 hour, the jis C is pressed. The method of the reference 0806-3 (peeling speed 300 mm/mm measurement time 12 seconds) was measured in the peeling strength of the coating tape several times, and the average value was calculated|required. <Fining degree> 15 The tape portion (area: a8 cm2) after the peel strength was measured by visual observation was determined as follows. 7. No fluffing at all. 6 : 1 woven wool. 5: 2 fluff. 20 4 : 3 to 5 roots, woven wool. 3: 6 to 8 manes. 2: 9~1G root part fluffing. 1: Fully raised. Example 1 12 1329066 A cardboard paperboard for accommodating wafer type electronic parts was produced by a three-layer papermaking method comprising a surface layer, a middle layer and an inner layer which are composed of different pulps. At this time, mix NBKP30%, LBKP70%, prepare CSF (Canada Standard Freeness) 400ml pulp for the surface layer; mix NBKP20%, 5 LBKP20%, 20% old paper, 40% old newspaper, and prepare CSF 350ml pulp for the middle layer. With NBKP 25%, LBKP 25%, old newspaper 50%, CSF 400ml pulp was prepared for the inner layer. Aluminum sulfate was added to each pulp to adjust the pH to 6.0, and 0.3% polyacrylamide (trademark: Shoukou only Bukou / 1250, manufactured by Arakawa Chemical Industries Co., Ltd.) was added as an internal paper strength enhancer. The pulp of the above conditions was separately copied into the surface layer l〇〇g/m2, the middle layer 200g/m2, the inner layer 5〇g/m2, and then smoothed in a paper machine by a round 10 mesh 3-layer papermaking machine. The material is smoothed, and the surface of the material layer is coated with TMA method, vitrification temperature, styrene-butadiene dicarboxylic acid copolymer resin (trademark: PM382, manufactured by Arakawa Chemical Industry Co., Ltd.) 〇.9〆 as a fluff prevention 15 Using a treating agent, a paperboard for storing wafer type electronic parts having a basis weight of 350 g/m2 m η 里 g g/m and a thickness of 42 mm was produced. The measurement results are shown in the table. Example 2 20 In the same way, a wafer-type electronic component=plate is produced. The surface of the surface layer contains a styrene-based dicarboxylic acid copolymer resin (trademark: pM482, manufactured by Arakawa Chemical Industry Co., Ltd.). The coating layer was used as a treatment agent for preventing pilling. The measurement results are shown in Table 1. Example 3 A board in which the wafer-type electronic component 13 was housed was produced in the same manner as in Example 1. However, the polypropylene was mixed. Acid amine (trademark: pS117, manufactured by Arakawa Chemical Industry Co., Ltd.) 100 parts by mass, benzene A bismuth succinic acid copolymer resin (trademark: PM382, manufactured by Tosoh Chemical Industry Co., Ltd.) was prepared in an amount of 2 parts by mass to prepare a treatment agent for preventing surface surface raising. 5 The measurement results are shown in Table 1. Example 4 In the same manner as in Example 1, a paperboard containing a wafer type electronic component was produced. However, 'mixed polyethylene glycol (trademark: PVA117, 夕 yb) 100 mascara, styrene-maleic acid copolymer resin (trademark (pM382, manufactured by Arakawa Chemical Co., Ltd.), 2.0 parts by mass, prepared into a treatment agent for preventing surface surface raising. The measurement results are shown in Table 1. Example 5 A wafer-type electronic component was produced in the same manner as in Example 1. 15 cardboard. However, mixed with polyacrylamide (trademark: PS117, manufactured by Arakawa Chemical Industry Co., Ltd.), 100 parts by mass, glass transition temperature 24. styrene-maleic acid copolymer resin (trademark: PM385, manufactured by Arakawa Chemical Industry Co., Ltd. (2) 〇 mass parts, prepared into a treatment agent for preventing surface buffing. The measurement results are shown in Table 1. 20 Example 6 A board containing a wafer type electronic component was produced in the same manner as in Example 1. , mixed oxidized starch (trademark: AceA, prince c〇rnstarch) 100 parts by mass, styrene-maleic acid copolymer resin (trademark: PM382 'Arakawa Chemical Industry Co., Ltd.) 2 parts by mass, prepared to prevent surface surface 14 1329066 The treatment agent for raising hair. The measurement results are shown in Table 1. Example 7 A cardboard containing the wafer-type electronic component 5 was produced in the same manner as in Example 1. However, mixed cationized starch (trademark: Ace K-250) The styrene-cis-succinic acid copolymer resin (trademark: PM382, manufactured by Arakawa Chemical Industries Co., Ltd.) was prepared in an amount of 2.0 parts by mass, and was prepared into a treatment agent for preventing surface surface raising. The measurement results are shown in Table 1. 10 Example 8 A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. In addition, the mixture of the urethane-maleic acid copolymer resin (trademark: PM382, manufactured by Arakawa Chemical Industry Co., Ltd.) was added in an amount of 100 parts by mass of urea-phosphorylated starch (trademark: AceP230, manufactured by Prince Cornstarch). A treatment agent for raising the surface of the surface layer. The measurement results are shown in Table 1. (Example 9) A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, an acrylate-acrylic copolymer 20-poly resin (trademark: SS2560, manufactured by Starlight PMC) having a glass transition temperature of 110 ° C was used as a treatment agent for preventing the raising of the surface of the surface layer. The measurement results are shown in Table 1. Example 10 A cardboard containing a wafer type electronic component 15 1329066 was produced in the same manner as in the first embodiment. However, 'mixed polyacrylamide (trademark: PS117, manufactured by Arakawa Chemical Industries Co., Ltd.), 1 part by mass, propionate-acrylic acid copolymer resin (trademark: SS2560, manufactured by Starlight PMC), 2.0 parts by mass, prepared to prevent surface layer Surface treatment agent for raising hair. 5 The measurement results are shown in Table 1. (Example 11) A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, mixed polyvinyl alcohol (trademark: PVAU7, manufactured by 歹 歹 b), ι mass parts, acrylate-acrylic copolymer resin (trademark: SS256 〇, Starlight 10 PMC) 2.0 parts by mass, prepared to prevent surface surface A treatment agent for raising hair. The measurement results are shown in Table 1. (Example 12) A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. In addition, 2.0 parts by mass of acrylate-acrylic copolymer resin (trademark: SS2560, manufactured by Starlight PMC) was added in an amount of 2.0 parts by mass of a mixed oxidized starch (trademark: AceA, Prince C0rnstarch 15) to prepare a treatment agent for preventing surface surface raising. The measurement results are shown in Table 1. Example 13 20 A cardboard containing a wafer type electronic component was produced in the same manner as in Example 1. However, 100 parts by mass of a mixed cationized starch (trademark: Ace κ_250, manufactured by Prince Cornstarch), an acrylate-acrylic copolymer resin (trademark: SS2560, manufactured by Starlight PMC), 2 parts by mass, prepared into a treatment agent for preventing surface surface raising. . 16 1329066 The results of the measurements are shown in Table 1. (Example 14) A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, a mixed urea filled with acidified starch (trademark: Ace P230, manufactured by King 5 Cornstarch), 100 parts by mass, and an acrylate-acrylic copolymer resin (trademark: SS2560, manufactured by Starlight PMC) of 2.0 parts by mass was prepared to prevent surface surface fuzzing. Use a treatment agent. The measurement results are shown in Table 1. Example 15 1 A cardboard containing a wafer type electronic component was produced in the same manner as in Example 1. However, a styrene-olefin-acrylic copolymer resin (trademark: SS2910, manufactured by Starlight PMC) having a glass transition temperature of 100 ° C was used as a treatment agent for preventing hair raising on the surface of the surface layer. The measurement results are shown in Table 1. 15 Example 16 A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, 100 parts by mass of a polyacrylamide (trademark: PS117, manufactured by Arakawa Chemical Industries Co., Ltd.) and 2.0 parts by mass of a styrene-olefin-acrylic copolymer resin (trademark: SS2910, manufactured by Starlight PMC) were mixed to prepare a surface layer for preventing 20 coats. Treatment agent. The measurement results are shown in Table 1. (Example 17) A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, mixed polyvinyl alcohol (trademark: PVA117, manufactured by 歹 歹b) 100 17 1329066 parts by mass, styrene-diuretic-acrylic acid copolymer resin (trademark: SS2910, manufactured by Starlight PMC), 2.0 parts by mass, prepared to prevent A treatment agent for raising the surface of the surface layer. The measurement results are shown in Table 1. [Example 18] A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, 100 parts by mass of a mixed oxidized starch (trademark: AceA, manufactured by Prince C〇rnstarch) and 2.0 parts by mass of a styrene-olefin-acrylic copolymer resin (trademark: SS2910, manufactured by Starlight PMC) were prepared to prevent surface surface raising. Agent. 10 The measurement results are shown in Table 1. Example 19 A cardboard containing a wafer type electronic component was produced in the same manner as in Example 1. However, mixed cationized starch (trademark: Ace κ_25〇, manufactured by Prince Cornstarch), 1 part by mass, styrene-olefin-acrylic copolymer resin (manufactured by 15: SS2910, manufactured by Starlight PMC), 2 parts by mass, prepared into A treatment agent for preventing the surface of the surface layer from being raised. The measurement results are shown in Table 1. (Example 20) A cardboard containing the wafer type electronic component 20 was produced in the same manner as in the first embodiment. However, 'mixed urea phosphate esterified starch (trademark: Ace P230, manufactured by Prince Cornstarch) 100 parts by mass, styrene-olefin-acrylic copolymer resin (trademark · SS2910, manufactured by Starlight PMC) 2 parts by mass, prepared to prevent surface layer Surface treatment agent for raising hair. The measurement results are shown in Table 1. 18 1329066 Comparative Example 1 A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, it was coated with a coating amount of polyvinyl alcohol (trademark: PVA117, manufactured by U.S.A.) at 0_9 g/m2 to obtain a treatment agent for the surface layer. 5 The measurement results are shown in Table 1. Comparative Example 2 A cardboard containing a wafer type electronic component was produced in the same manner as in the first embodiment. However, it was coated with a coating amount of 0.3 g/m 2 of polyvinyl alcohol (trademark: PVA 117, manufactured by Nippon Buddhism Co., Ltd.) as a treatment agent for the surface layer of the surface layer. 10 The measurement results are shown in Table 1. 19 1329066 00 菰MS LO 〇m Ο Ο to 1 卜! ίβ CM ! 鹚一_:渺m 〇tn 〇tn CO ΙΛ LO U0 Γ0 〇iO 〇卜〇tn 〇1C 07 〇C0 〇00 00 03 inch C0 CO cn ^τ to 03 in 〇〇〇Ο Ο 〇〇〇〇〇〇〇〇〇〇ο ο 〇ο Ο ο coated children (g/m2) 〇〇a σ> G5 σ> 〇〇ο Oi 〇〇ο ο Oi 〇C5 05 CO 〇〇〇ο ο 〇〇〇〇ο 〇〇〇Ο 〇〇ο ο Ο Ο ο Preventing the occurrence of fuzzing on the surface of the surface _____ ________............ .............................___ Styrene-maleic acid copolymer resin olefin-maleic acid copolymer resin: styrene-butylene Acid copolymer resin / polyacrylic acid amine t styrene - palladium dicarboxylic acid copolymer resin / polyvinyl alcohol styrene - maleic acid copolymer resin / polyacrylic acid amine styrene - maleic acid copolymer resin, oxidized powder Styrene-maleic acid copolymer resin/cationized starch styrene-maleic acid copolymer resin/urea phosphate esterified starch acrylate-acrylic copolymer resin acrylic acid -Acrylic copolymer resin / polyacrylic acid amine acrylate - acrylic copolymer resin / polyvinyl alcohol acrylate - acrylic copolymer resin, gasification powdered acrylate - acrylic copolymer resin / cationized starch acrylate - acrylic copolymer resin / urea phosphate esterification Powder-killing styrene-olefin-acrylic copolymer resin 狴Zhao K Lithium m Μ ai IE a 畦K1 ηη ΙΌ Embedded mm 饀 E SI E 褰ή ί0 m Styrene-olefin-acrylic copolymer resin/oxidized starch m nm m 豳Lithium Μ 赵 Κ Κ ύ μ 擀m 安m m state mmm B m imaginary line κ m at ή 聚乙烯 polyvinyl alcohol polyvinyl alcohol | Example 1 I | Example 2 1 r ^ l ^ J3 Ί 1 Example 4 Example 5 I Example 6 | Example 7 1 Example 8 Example 9 Example 1 实施 1 Example 11 | Example 12 ! Example 13 1 Example 14 1 Example 15 Example 16 i 贲 Example 17 Example 18 Sound Example 19 Suitable Example 20 Specific Example 1 Reaming Example 2
20 1329066 實施例1〜20、比較例卜2之剝離強度平均值如第1表所示。 為本發明之收納晶片型電子零件之紙板的實施例1〜20較 比較例1、2具較強的剝離強度，且起毛現象也明顯較少。 產業上利用之可能性 5 本發明之收納晶片型電子零件之紙板係與頂包覆帶之 接著強度優異，且從其表層表面剝離頂包覆帶時，不會產 生起毛現象，或明顯地較少發生起毛現象，具收納晶片型 電子零件之紙板優異實用性者。 【圖式簡單說明3 10 無 【主要元件符號說明】 益 *»»、 2120 1329066 The average peel strengths of Examples 1 to 20 and Comparative Example 2 are shown in Table 1. Examples 1 to 20 of the paperboard for accommodating wafer type electronic parts of the present invention have stronger peeling strength than Comparative Examples 1 and 2, and the fluffing phenomenon is also remarkably small. Industrial Applicability 5 The paperboard-based electronic component of the present invention has excellent adhesion strength to the top cover tape, and when the top cover tape is peeled off from the surface of the surface layer, no fluffing phenomenon occurs or is significantly higher. There is little occurrence of fluffing, and it is excellent in practical use of cardboard containing electronic components for wafers. [Simple diagram of the diagram 3 10 None [Key component symbol description] Benefit *»», 21