TW557282B - Base board for electronical chip-container board and container board using same - Google Patents

Abstract

A base board containing an adhesion modifier having solubility parameter in the range of 6.5 to 14.0 (preferably 8 to 12) (for example, rosin compounds, or styrene-acryl copolymers, wax compounds, or polyethyleneimine compounds) and distributed on at least one of the front and back surfaces of the base board preferably in an amount of 0.005 to 2.0 g/m<2>, is useful for container board for containing electronic chips, exhibits good peel strength when the base board is formed into a container board and a top tape or bottom tape is bonded thereto by heat-seal method even at high bonding speed, and is free from fluffs.

Description

557282 A7 £ 7 V. Description of the Invention (1) [Technical Field] (Please read the notes on the back before filling out this page) The present invention relates to a paper substrate for wafer-type electronic parts storage cardboard and the use of the paper substrate Paperboard, more specifically, relates to a wafer-type electronic component housing paperboard base material having excellent adhesion to at least the upper tape and / or the lower tape, and having a surface that does not fluff due to peeling of the upper tape, And cardboard obtained from the paper substrate. [Knowledge background] The paperboard containing the chip-type electronic parts is used as a carrier material (carrier) for the chip-type electronic parts, and is generally manufactured, shipped, and used by the following processing. (1) The paper substrate is slit to a predetermined width. (2) According to the predetermined design, form square holes and round holes and form cardboard. A square hole is a space for accommodating wafer-type electronic parts, and a round hole is a wafer loader for conveying cardboard. Square holes and round holes are formed by perforation method or engis method. A perforation is formed through the front and back surfaces of the paper substrate by a perforation method, and a dent (recess) on the surface side of the paper substrate is formed by a remote technique. (3) Adhesive tape on the inside (bottom side) of the above board. In addition, in general, a method for adhering a lower tape to a cardboard is a so-called heat sealing method, which is a method in which a lower tape is overlapped on a cardboard, and heat and pressure are applied to the lower tape to perform thermal compression bonding. (4) Fill the square holes of the aforementioned cardboard with wafer-type electronic parts. (5) Stick the tape on the surface (upper side) of the cardboard. (6) The obtained cardboard containing the wafer-type electronic parts is wound into a cassette roll ', and is shipped in the shape of a paper roll and transported to a destination. This paper size applies to China National Standard (CNS) A4 (210X297 mm) -4- 557282 A7 ____B7_ V. Description of the invention (2) (Please read the precautions on the back before filling this page) (7) The last user The roll-shaped cardboard containing the wafer-type electronic components is unrolled and the upper tape is peeled off, and the wafer-type electronic components contained in the square hole of the cardboard are taken out for use. In view of the above-mentioned manufacturing, transportation, and use methods, the important quality items of cardboard must have good adhesion between the surface of the paper substrate and the tape. If the adhesion is insufficient, the tape is peeled off and the wafer is stored in the square hole. There is a danger of falling off of the electronic components, and the protection of the wafer-type electronic components functioning for the purpose of storing cardboard can not be achieved. In addition, if the square hole penetrates through the surface of the paper substrate, and when the adhesion strength between the paper substrate and the lower tape is insufficient, it is the same as the case of the upper tape, and the chip-type electronic parts cannot be protected. The lower tape is adhered to the entire surface of the cardboard and does not peel off. However, in order to take out the wafer-type electronic parts, the upper tape is peeled from the surface of the cardboard, so it will not stick to the entire surface of the cardboard, but only adheres to the rows of square holes that house the wafer-type electronic parts. Therefore, the adhesive area of the upper tape is smaller than that of the lower tape. Therefore, the average adhesive strength per unit area between the upper tape and the surface of the cardboard is better than the average adhesive strength per unit area between the lower tape and the inside of the cardboard. In addition, in recent years, in order to reduce the cost of electronic products, it is required to increase the filling and packaging speed for wafer-type electronic parts that contain cardboard. However, the heating temperature and pressure values in the pasting process of the upper sheet and / or lower tape are similar to those in the past. the same. Therefore, the so-called adhesion in the process of tape application (sealing), which does not change the heating temperature and pressure, but only shortens the time, requires extremely strict heat-sealing conditions. In the past, in order to improve the tape on the top and bottom surfaces of the paper substrate for storage cardboard, the Chinese paper standard (CNS) A4 (210X297 mm) was applied to this paper. -5- 557282 A7 ___ _B7_ V. Description of the invention (3) and lower tape The method of improving the smoothness of the inside and outside of the paper substrate is carried out with the adhesiveness. This conventional method increases the adhesive strength of the paper substrate by increasing the effective contact area between the top and bottom surfaces of the paper substrate and the upper and lower tapes. However, since the filling speed of a wafer-type electronic component is remarkably increased, it is difficult to achieve a desired increase in adhesive strength only by increasing the smoothness'. Therefore, there is an urgent need to develop new methods to achieve the desired adhesion strength. Also, 'the storage cardboard containing electronic components and wound into a cassette roll is mounted on a wafer mounting machine when the electronic components are used, and the tape is peeled off from the cardboard.' The top of the wafer mounting machine takes out the electronic components stored in the cardboard, and The electronic part is mounted on a desired electronic component such as a printed circuit board. In this procedure, when the tape is peeled off from the cardboard, the paperboard fibers that are joined to the tape are fluffed and peeled off due to the stretching of the tape to cover the square holes of the cardboard. At this time, the top of the wafer mounter cannot remove the electronic parts from the cardboard. At this time, the effect of mounting the electronic component on a desired electronic component such as a printed circuit board, that is, the assembly rate is reduced. Conventional methods to prevent fluff and shedding of pulp fibers on the surface of paperboard, such as (1) a method of blending high-strength pulp with a paper substrate; (2) increasing the beating degree and reducing the freeness of the pulp for the paper substrate, Method for improving entanglement of pulp; (3) Method for adding paper strength enhancer to surface side layer of adhesive tape on adhesive base material, and (4) Coating surface strength enhancer on adhesive tape base material for surface The method and the like are known. However, in recent years, the level of adhesiveness on the surface of paperboard substrates has increased significantly. Therefore, the above methods (1) and (2) cannot fully meet the requirements, and even when methods (1) and (2) are used together, Cannot fully respond to the aforementioned requirements for the paper size to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page),? Τ--6- 557282 A7 ______B7_ 5. Description of the invention ( 4) Ask. Regarding the aforementioned method (3), the main component of the paper strength enhancer is a water-soluble high-molecular material ', and the SP value of the water-soluble high-molecular material is high, generally 15 or more, and more often 20 or more. Therefore, the difference between the sp value of the adhesive tape and the SP value of the surface of the substrate of the paperboard is increased, and therefore, there is a disadvantage that the affinity between the two decreases and the adhesion is deteriorated. Furthermore, the method (4) is also based on the same reason. Even if the fluff and fine hairs can be prevented from falling off, the adhesiveness between the upper tape and the substrate surface of the paperboard is deteriorated, so it cannot be used for practical use. [Problems to be Solved by the Invention] The present invention provides a board formed of a wafer-type electronic component storage board, and when the upper tape and / or the lower tape are adhered to the board under heating and addition, the south peeling strength (adhesive strength) is displayed. A paper substrate for a wafer-type electronic component storage cardboard, and a cardboard formed from the paper substrate. [Means for Solving the Problem] The paper substrate for the wafer-type electronic component storage cardboard used in the present invention is a paper substrate for the manufacture of paperboard containing wafer-type electronic components, and is distributed on at least one side of the surface of the paper substrate. 14.0 Solubility parameter (hereinafter referred to as SP value) viscosity adjuster. In the paper substrate of the present invention, it is preferable that the distribution of the adhesiveness adjusting agent on the surface or inside of the paper substrate is 0.005 to 2.0 g / m2. In the paper base material of the present invention, the paper base material may include a paper base material and a coating layer formed on at least one surface of the front and back surfaces thereof, and the coating layer may include the adhesiveness adjusting agent. In the paper substrate of the present invention, the coating layer may further contain a water-soluble fluorene molecular binder. This paper size applies to China National Standard (CNS) A4 specifications (210 &gt; &lt; 297 mm)

557282 A7 __ B7__ 5. Description of the invention (5) In the paper substrate of the present invention, a primer layer containing a water-soluble polymer binder may be further formed between the aforementioned paper substrate and the aforementioned coating layer. (Please read the notes on the back before filling this page) In the paper substrate of the present invention, the aforementioned paper substrate may also contain a water-soluble polymer binder. In the paper substrate of the present invention, the adhesiveness adjusting agent contains a polyethylene resin, a polypropylene resin, a polyethylene resin, a polycarbonate resin, a polyester resin, and a polyvinyl acetate resin. Polyacrylic resin, rosin-based compound, styrene-acrylic acid-based copolymer, Kan-based compound, styrene-butadiene copolymer, and polyethyleneimine-based compound are preferred. In the paper substrate of the present invention, the water-soluble polymer binder is made of starch, modified starch, casein, soy protein, carboxymethyl cellulose, hydroxyethyl cellulose, alginic acid soda, and polypropylene resin. A polyvinyl alcohol-based resin, a denatured water-soluble polyvinyl alcohol-based resin, and at least one selected from polyvinylpyrrolidone-based resins are preferred. In the paper substrate of the present invention, the coating amount of the coating layer containing the water-soluble polymer binder and the adhesiveness adjusting agent is preferably 0.05 to S. Og / m2. In the paper substrate of the present invention, the surface or the inside of the aforementioned paper substrate is at a temperature of 155 ° C, a pressure of 196 kPa (2.0 kgf / cm2), and an adhesion speed of 3.0 m / min (condition A) or 5.0 m / Under the condition of condition B (condition B), the two strip-shaped parts with a width of 0.5 mm and a width of 0.4 mm are pressed inward from both edges of the hot-melt covering tape with a width of 8 mm to the surface or the inside of the paper base material. The surface of the aforementioned paper substrate or the surface of the aforementioned paper substrate as measured by JIS C 0806 is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 557282 5. Description of the invention (6 or the peel strength between the lower tape, When the aforementioned adhesion speed is A condition, it is 100 mN or more, and when the aforementioned adhesion speed is B condition, it is preferably 70 mN or more. The wafer-type electronic component storage board of the present invention belongs to the present invention. The aforementioned paper substrate has a plurality of recesses formed on its surface side opening, or a plurality of perforations penetrating the front and back surfaces of the paper substrate. • In the present invention, the so-called dissolution parameter (Solubility 1) &amp; ^ 111 ) (31 &gt; value) refers to the binary solution The (Regular solution) of the square root of the cohesive energy density (unit (Cal: cnT3) 1/2). The dissolution parameter (SP value) can be obtained from Article 523 of the "Latest Paper Processing Manual" (published on August 20, 1988 (Showa 63), Tectimes (亍 y 彳 厶 夕 彳 厶 only)) It is calculated by the method disclosed in line 524 and the like. [Embodiments of the invention] The paper substrate (hereinafter referred to as a paper substrate) of the wafer-type electronic component storage cardboard of the present invention has a dissolution parameter (SP value) of 6.5 to 14 · 0 distributed on at least one of the front and back surfaces. Adhesive modifier. Generally speaking, the adhesive tape attached to the surface of the wafer-type electronic component storage cardboard (hereinafter referred to as cardboard) manufactured by the paper substrate of the present invention and the adhesive tape attached to the inside of the cardboard are made of polyethylene containing a main component as a main component. The melting point of hot-melt polyolefin resin is preferably in the range of 90 ~ 130 ° C, and more preferably in the range of 105 ~ 115 ° C. In order to improve the adhesion to the paper substrate of this hot-melt tape, the joint surface of at least one side is subjected to a corona discharge treatment or a chemical treatment (for example, a treatment with an acrylate or a quaternary ammonium salt). Generally speaking, the SP value of hot-melt tape for cardboard is 8 ~ This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Order _: Line — 557282 V. Description of the invention (7.12. Also, because the two substances have their respective "sp values increased to an approximate degree, therefore, the adhesive surface of the adhesive tape of the paper substrate is distributed with a sp value of 6.5 to 14.0. Substances are preferred as adhesion modifiers, and especially those whose SP value is 8 to 12. If the sp value of the adhesion modifier used in the present invention is less than 6.5 or greater than ^ 0, the above Adhesiveness under heat and pressure of the adhesive tape and / or the lower adhesive tape is insufficient. The adhesiveness adjusting agent used in the paper substrate of the present invention can be selected from polyethylene resin, polypropylene resin, polyvinyl resin, and polycarbonate. Among resins, polyester resins, polyvinyl acetate resins, polyacrylate resins, turpentine compounds, styrene-acrylic copolymers, polyethyleneimine compounds, and wax compounds, among them, Rosin-based compound Materials, styrene-acrylic copolymers, wax compounds, styrene-butadiene copolymers, and polyethyleneimine compounds are preferred. These materials may be used alone or in combination of two or more. The distribution amount on the surface or inside of the paper substrate of the adhesiveness adjusting agent is preferably 0.005 to 2.0g / m2, and more preferably 0.000 to le0g / m2. If the amount of the adhesiveness adjusting agent is less than 〇.〇〇5g / m2, the adhesive strength obtained on the adhesive surface is insufficient, and if the distribution is greater than 2g / m2, the adhesive strength is saturated, and it is economically disadvantageous. On the surface of the paper substrate (adhesive tape) The distribution amount of the adhesiveness adjusting agent is preferably from 0.005 to 2.0 g / m2. In one aspect of the present invention, the adhesiveness adjusting agent is distributed in the paper substrate, and part of the paper is exposed to the paper. The surface and / or the inside of the substrate. In this paper-based system, the paper-based system can disperse the adhesiveness adjuster in the pulp. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) ( (Please read the notes on the back before filling out this page)

• 、 Can I -10 · 557282 5. Description of the invention (in the mud (internal addition method), it can also be immersed in the desired face by external addition method. Or at least two paper layers are laminated to make a paper base In the paper making process of the surface paper layer and / or the inner paper layer, the adhesive adjuster can be dispersed in its pulp (internal addition method), or it can be immersed in the desired face by external addition method. In another aspect of the present invention, the paper substrate comprises a paper substrate and a coating layer formed on at least one surface of the surface thereof, and the aforementioned coating layer contains the aforementioned adhesiveness adjusting agent. This aspect is based on The desired surface of the paper substrate is coated (roller coating method, spray method, brush coating method, etc.) with the adhesive adjuster liquid and dried. In the form of forming the above coating layer, the coating layer may also contain a water-soluble high-knife adhesion. In particular, if the coating formed on the surface of the paper substrate (adhesive surface of the upper tape) contains a water-soluble polymer binder, when the upper tape is peeled off, the pulp fibers on the peeling surface can be prevented from fluffing and detaching. Reasons The system is presumed to be as follows. It can be understood that the water-soluble polymer binder is a highly polar substance, and its molecular structure contains functional groups (such as hydroxyl, carboxyl, amido, amine, and sulfonic acid groups) that form most hydrogen bonds. Therefore, if a water-soluble polymer binder is used, the aforementioned functional groups form argon bonds with the hydroxyl groups of cellulose molecules in the paper substrate, and the bonding points between the pulp fibers are increased, thereby increasing the bonding force between the fibers. In addition, the molecules of the water-soluble polymer adhesive also form hydrogen bonds with each other and exert the ability to form a thin film. Therefore, if the water-soluble polymer adhesive is coated on the surface of the paper substrate, the surface strength of the paper substrate itself Strengthening, as a result, can suppress the fluff and detachment of the pulp fiber. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)

................. Packing: (Please read the notes on the back before filling out this page). Order ·: Line-- 11- 557282 A7 _B7_ V. Description of the invention (9) (Please read the precautions on the back before filling this page) In the above aspect of the present invention, a water-soluble polymer can be formed between the aforementioned paper substrate and the aforementioned coating layer. The undercoat layer of the adhesive, or the aforementioned paper substrate may also contain a water-soluble polymer adhesive. The paper base contains a water-soluble polymer binder, which can be used for an internal addition method in which a water-soluble polymer slurry is mixed with pulp, or an external addition method can be applied by a coater or the like. In general, it is advantageous to control the amount of addition by the external addition method of coating. When the external addition method is used, any one of single-side coating, double-layer coating, and multi-step coating of three or more steps may be used, and the internal addition method and coating method may be used in combination. The water-soluble polymer binder used in the paper substrate of the present invention can be used, for example: temple powder, cationized temple powder, acetic acid ester transfer powder, oxidized temple powder, enzyme modified starch, acetate starch, hydroxyethylated starch. Modified starch, road protein, soy protein, carboxymethyl cellulose, hydroxyethyl cellulose, alginic acid soda, polypropylene ammonium resin, polyvinyl alcohol resin, monosilyl modified polyvinyl alcohol resin, carboxyl group Denatured polyvinyl alcohol resins such as denatured polyvinyl alcohol resins and polypyrrolidone-based resins. Among them, starch, a polyvinyl alcohol resin, and a polypropylene ammonium resin are preferred. These may be used alone or in combination of two or more. In the paper substrate of the present invention, a bar material coater, a blade coater, an air knife coater, a rod coater, or the like can be used to apply an adhesive adjuster and / or a water-soluble polymer binder to a paper substrate. Roller coater, axe knife coater, Bel-Bapa coater for weir roll coater or sizing machine. In order to form a coating with the desired function and economical rationality, this paper standard is applicable to China. Standard (CNS) A4 specification (210X297 mm) -12- 557282 A7 ________B7 _ V. Description of the invention (10) The coating amount of the coating of the aforementioned water-soluble polymer binder and adhesion adjuster is 0.1 ~ 5.0g / m2 is preferred, and i 0 to 25 g / m2 is particularly preferred. The mass ratio of the adhesiveness adjusting agent and the water-soluble polymer adhesive contained in the paper substrate of the present invention is preferably 1.99 to 80 to 20, and 1:20 to 50 to 50. It's better. If the above mass ratio is less than 1/99, the effect of improving the adhesiveness of the upper tape and the lower tape is insufficient. If it is greater than 80/20, the amount of fluff and detachment of the pulp fibers covering the peeling surface of the tape will increase. In addition, the total amount of the water-soluble polymer binder and the adhesiveness adjusting agent applied on the paper substrate is preferably within a range of 0.05 to 5.0 £ / π2, and 1.0 to 2.5 g / m2 is better. If the total amount is less than 0.1 g / m2, at least one of the adhesiveness adjustment effect and the effect for preventing fine hair is insufficient, and if the total amount is more than 5.0 g / m2 ', the effect is saturated and it is not economical. The pulp constituting the paper base material or the paper base body of the present invention is not particularly limited. Chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, synthetic pulp, etc. can be used. These pulps may be used alone or in combination of two or more kinds. In addition, various additives may be added to the above-mentioned pulp as needed, such as sizing agents such as turpentine, styrene · maleic acid, alkenyl succinic anhydride, alkylene dimer, and polypropylene amide. Series, starches such as oxidized starch, cationic powder, urea phosphate esterified starch, paper power enhancers such as polyvinyl alcohol, guar gum, etc. One or more anti-hydration agents such as amine polyamine epichlorohydrin, antifoaming agents, talc, etc., and dyes. Among the above-mentioned additives, the paper strength enhancer has inhibited the surface of the paper substrate.

557282 A7 ___B7 _ V. Description of the invention (11) (Please read the precautions on the back before filling out this page) The effect of fluff, especially by adding 0 · 5 ~ to the paper layer of the adhesive cover tape (upper tape or lower tape) The addition amount of 10kg / ton of pulp can improve the surface strength of the obtained paper substrate and suppress fluff. If the added amount is less than 0.5 kg / pulp ton, a sufficient effect cannot be obtained, and if the added amount is greater than 10 kg / pulp ton, the effect is saturated and a problem of contaminating the papermaking system occurs. Generally speaking, the basis weight of the paper substrate of the present invention is preferably 200 to 1000 g / m2. When manufacturing a paper substrate (or paper substrate) in this range, generally, the papermaking method uses two or more layers of papermaking. Of course, a single layer of papermaking can also be used. After papermaking, pressurize and dry with a desiccant. If the desiccant is treated with calendering, the smoothness of the surface of the paper substrate or paper substrate is improved. Therefore, as described above, it has the effect of strengthening the adhesive strength. The paper substrate of the present invention will have a width of 8mm under the conditions of a temperature of 155 ° C, a pressure of 196kPa (2.0kgf / cm2), and an adhesion speed of 3.0m / min (condition A) or 5.0m / min (condition B). The two edges of the hot-melt covering tape (upper tape or lower tape) are inward from 0.5mm wide and 0.4mm wide. The 2 strip-shaped parts are heated and pressed to the surface or inside (covering tape (upper or lower tape) (Adhesive surface), the peel strength between the surface of the aforementioned paper substrate and the cover tape (upper or lower tape) measured according to jIS C 0806 is 100π1N or more when the aforementioned adhesion speed is A, and at the aforementioned adhesion speed When the condition is B, it is preferable to be 70 mN or more. The peel strength is the average of the maximum and minimum values of the measured values. If the average value is smaller than this value, there will be insufficient bonding of the covering tape (adhesive tape or lower tape) at the minimum value. In addition, according to the size of the paper in accordance with the heat and pressure adhesion speed, the Chinese National Standard (CNS) A4 specification (2〗 〇 &gt; &lt; 297 mm) -14 · 557282 A7 B7 V. Description of the invention (12) is different but the minimum The reason why the necessary peel strength is different is generally considered as follows. That is, if the adhesion speed decreases, the pressing time between the cover tape (upper tape or lower tape) and the paper substrate increases, so the number of contact points between them increases. Therefore, if the same peel strength is compared, the adhesion If the speed is low, the adhesive strength between the covering tape (upper tape or lower tape) and the storage cardboard will decrease on average one contact point. Therefore, if the peeling strength is the same, if the adhesive strength is slow, the weaker adhesive strength tends to occur. Therefore, in order to ensure sufficient adhesive strength, it is generally considered necessary to increase the average of the average peel strength. According to the above reasons, in order to securely store and protect wafer-type components made of a paperboard made of a paper substrate, it is generally considered that the peel strength must be at least ι〇π1ν when the adhesion speed is A, and the condition b It must be 70mN or more. Also, if the peeling strength when the adhesion speed is condition a is greater than 1500mN, and the peeling strength when the adhesion speed is condition B is greater than 1050mN, the 'adhesive surface portion of the paper substrate will peel off from the lower part. . The paper substrate of the present invention is used to manufacture a wafer-type electronic component storage paper board. When manufacturing the storage cardboard, a predetermined space is vacated on the paper substrate, and a large number of indentations (square holes, recesses) of the surface (on the tape adhesive surface) for receiving the chip-type electronic parts are formed in a desired size along the length direction thereof. , Or through most of the through holes on the inside of the watch, and leave a predetermined interval to form the majority of the round holes for cardboard transportation. Generally speaking, the upper and lower adhesive tapes adhered to the storage cardboard of the present invention are composed of a base material and an adhesive layer, and the adhesive layer is made of polyethylene resin. The preferred melting point is 90 ~ 130 ° C, and the temperature is 105 ° C. ~ 115 ° C The best parylene tree paper size is applicable to Chinese National Standard (CNS) A4 (210X297 cm) (Please read the precautions on the back before filling this page). OK |: 线 -15- 557282 A7 B7 V. Description of the invention (13 (Please read the precautions on the back before filling this page) The grease is formed and can be adhered to the paper substrate by heat sealing. Generally speaking, it is adhered to the paper substrate The base material of the cover tape (upper tape) on the surface side is a polyester tape (thickness of 20 to 3 (^ m), and the base material of the lower tape is a tissue paper (rice volume: about 15g / m2). If Tissue paper is used as the base material of the lower tape. When the larger wafer-type electronic parts are taken out from the storage cardboard by vacuum, the electronic parts are lifted with a needle from below through the lower tape, thereby floating the electronic parts. It can be easily sucked out by vacuum. The heat sealing of the upper and / or lower tape is performed by a heat sealer. [Examples] The present invention will be described in detail by the following examples, but the present invention is not limited thereto. The values showing the blending ratio and concentration are based on the dry solid content or the mass of the active ingredient. Example 1 Using NBKP / LBKP The blending ratio of 60/40 is used as the pulp for the front side paper layer with adhesive tape, and the volume is adjusted to 160 g / m2, using NBKP / LBKP / deinked newspaper waste paper = 40/40 / The blending rate of 20 is used as the pulp for the intermediate paper layer, and the basis weight is adjusted to 31 g / m2. The blending rate of NBKP / LBKP / BCTMP = 40/40/20 is used as the inner paper layer. Pulp, and the basis weight is adjusted to 80g / m2, each paper layer is paper-made, laminated, pressed, dehydrated and dried with a desiccant, and a paper substrate having a surface / middle / back 3 paper layer structure is produced. Use a stick Coating machine, coating polystyrene-acrylic copolymer (trademark; polymalon (seeking y7C2 ^) 1308S) with an SP value of 10.5 on the surface paper layer of the paper substrate with a coating amount of 0.02 g / m2, Arakawa Chemical Industries, Ltd. (Manufactured), and desiccant drying and calendering. Paper size applicable to China Standard (CNS) A4 specification (210X297 mm) -16- 557282 A7 B7 V. Description of the invention (14) Principles for making wafer-type electronic parts with a volume of about 550g / m2 to store paper substrates for cardboard. (Please read the back Note that this page is to be filled in again.) Example 2 The same substrate as in Example 1 was used to make a paper substrate for wafer-type electronic parts storage cardboard. However, a polystyrene-acrylic copolymer (trademark; poly Ma Lun 1308S, manufactured by Arakawa Chemical Industry Co., Ltd., changed its coating amount to 0.01 g / m2. Example 3 The same procedure as in Example 1 was performed to produce a paper substrate for a wafer-type electronic component storage board. However, the coating amount of the polystyrene-acrylic acid co-polymer (trademark; Polymaron 1308S, manufactured by Arakawa Chemical Industries, Ltd.) with an SP value of 1G 5 was changed to 0.8 g / m2. Example 4 The same procedure as in Example i was performed to produce a paper substrate for a wafer-type electronic component storage board. However, the polyphenylene-co-acetic acid co: linear polymer (trademark, polyurethane 1308S, manufactured by Arakawa Chemical Industries, Ltd.) with an SP value of 1G 5 was changed to a wax compound (trademark; SP value; 7.5) The rubber material (廿 彳 彳 y) W-116Η (manufactured by Arakawa Chemical Industry Co., Ltd.) was used, and the coating amount was 0.2 g / m2. Example 5 The same procedure as in Example i was performed to produce a paper substrate for a wafer-type electronic component storage board. However, the polystyrene-acrylic copolymer (trademark; Polyurethane 1308S, manufactured by Arakawa Chemical Industry Co., Ltd.) having a ㈣ value of 10.5 was changed to a turpentine compound (trademark; RF rubber 88 ° L) with an SP value of 8.5. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -17- 557282 A7 ____ —__ B7_ V. Description of the invention (15) manufactured by Laisawa ('Gan 17) Ceramics Co., Ltd. 0.2 g / m 2 〇 Example 6 The same substrate as in Example 1 was used to prepare a paper substrate for a wafer-type electronic component storage board. However, to the pulp for the surface paper layer, a pine resin compound (trademark; rubber pine E-50) manufactured by Arakawa Chemical Industry Co., Ltd. with a sp value of 9 · 3 was added to 5 kg / ton of pulp and 3 kg of aluminum sulfate / paper. Example 7 A paper substrate for wafer-type electronic parts storage cardboard was produced in the same manner as in Example 6, except that a polystyrene-acrylic copolymer (trademark; polyurethane 1308S, manufactured by Arakawa Chemical Industries, Ltd.) was not coated. Comparative Example 1 The same paper-based boat as the paper-based boat of Example 1 (the former was coated) was used to form a paper substrate for wafer-type electronic component storage cardboard. Comparative Example 2 A paper substrate for a wafer-type electronic component storage board was prepared in the same manner as in Example 1. However, a fluorinated SP with a SP value of 6.2 (trademark; Asahi Kaide (Fangyi, Fangyi K) AG-55G, manufactured by Mingcheng Chemical Industry Co., Ltd.) was used in place of a polystyrene-acrylic acid copolymer with an SP value of 10.5 (Trademark; Jumaron 1308S, manufactured by Horikawa Chemical Industry Co., Ltd.). The coating amount was 0.2 g / m2. Comparative Example 3 The same substrate as in Example 1 was prepared to produce a paper substrate for a wafer-type electronic component storage board. However, the use of polyethynol resin with SP value of 23.4 (the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297)) (Please read the precautions on the back before filling this page)

-18- 557282 A7 ___B7__ V. Description of the invention (16) Standard; Cang Lei (Xi 7 b) Polyvinyl alcohol PVA-117, manufactured by Cang Lei Company) to replace the polystyrene-acrylic copolymer (trademark) with SP value of 10.5 Polyurethane 1308S, manufactured by Arakawa Chemical Industry Co., Ltd.), and the coating amount was made 0.2 g / m2. Jb Comparative Example 4 was prepared in the same manner as in Example 1 to produce a wafer-type electronic part storage board paper substrate. However, a polyacrylonitrile polymer with an SP value of 15.4 was coated with a coating amount of 0.2 g / m2 (inject and mix 100 parts of acrylonitrile, 180 parts of distilled water, and 4.5 parts of soap flakes into a polymerization container, and then Add 0.35 parts of hydrogen peroxide, 0.02 parts of ferric sulfate, 0.6 parts of stearic acid, 0.1 parts of sodium pyrophosphate, and 0.3 parts of potassium gas, and warm the mixture to 30 ° C, polyacrylonitrile water-dispersed polymer obtained by polymerizing for 24 hours while stirring, to replace polystyrene-acrylic copolymer (trademark; polymaton 1308S, SP value 10.5S, manufactured by Arakawa Chemical Industry Co., Ltd.) The peel strength of the paper substrate for the wafer-type electronic component storage cardboard obtained in 1 to 7 and Comparative Examples 1 to 4 is shown in Table 1. The measurement method is as follows. (Peel strength measurement method) On the test paper substrate The test paper substrate is cut into a tape shape with a width of 8mm in the long direction. Using a heat sealer (model: TST-1200, manufactured by Nitto Denko Corporation), the tape (trademark; 318H-14A, manufactured by Nitto Denko Corporation) will be applied. With both edges 0.5mm inward and 0.4mm wide 2 The band-shaped part is heat-sealed on the paper base tape. The heat-sealing condition is a heat-sealing temperature of 155 ° C and a heat-sealing speed of 3.0m / This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) --- -------------------- Equipment ...: Guang Zhu first read the precautions on the back before filling out this page)-、 可 | Line 丨 -19- 557282 A7 B7 V. Description of the invention (17) points (Condition A) and heat-sealing speed 5 cutting conditions Bu ㈣ _ strength tester (model: NPT-Japan Jiade (Li,-Bu) company), from the heat-sealed paper substrate will The cover tape was peeled off, and the peel strength was measured. The maximum value of the measured value and the minimum value &lt; the average value were taken as the heat seal strength (= peel strength). The test results are shown in Table 1. The measurement of peeling strength was performed in accordance with JIS C 0806. (Please read the notes on the back before filling in this page)-Order · This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -20- 557282 A7 B7 V. Description of invention (18) Table

^ «Z 225/190 121/105 469/388 226/192 243/227 323/256 247/179 48/36 2/0 18/6 27/17 Coating amount (g / m2) 0.2 0.01 00 〇0.2 &lt; N 〇0.2 1 1 0.2 (N 〇 (N 〇〇〇〇V-Η 〇VH 0000 〇1- &lt; 1 1 6.2 23.4 15.5 ingredients styrene-acrylic copolymer styrene-acrylic copolymer styrene Mono-acrylic copolymer Wax-based compound Rosin-based compound Styrene-Acrylic copolymer 1 1 Fluorine-based compound Polyvinyl alcohol resin Polyacrylonitrile polymer Internal additive (kg / pulp t) 1 1 1 1 1 to 1 1 1 1 1 1 1 1 1 9.3 m as 1 1 1 1 Ingredients 1 1 1 1 1 rosin-based compound rosin-based compound 1 1 1 1 Example 1 Example 2 Example 3 Example 4 Example 5 Example 5 6 Example 7 Comparative example 1 Comparative example 2 | _1 Comparative example 3 Comparative example 4 ...................... .: tr ------------------ line · (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 (Mm) -21-557282 A7 £ 7_ 5. Description of the invention (19) f 施 你 f 8 Use a blending ratio of NBKP / LBKP = 60/40 as the pulp for the front side paper layer with adhesive tape, and add 5kg / ton of water-soluble polymer paper strength agent polypropylene fluorene amine resin (trademark) ; Polysilon (seeking y only mouth ^) 1233, manufactured by Arakawa Chemical Industry Co., Ltd. and 2kg / ton of pulp of aluminum sulfate, and adjusting the surface weight of the paper layer to 160g / m2, and using NBKP / LBKP / Deinked newspaper waste paper = 40/40/20 The push ratio is used as the pulp for the intermediate paper layer, and 2 kg / ton of water-soluble polymer paper strength agent polypropylene ammonium resin (trademark; Polyester 1233, manufactured by Arakawa Chemical Industry Co., Ltd.) and 2 kg / pulp ton of aluminum sulfate, and the sizing amount of the intermediate paper layer was adjusted to 310 g / m2, and NBKP / LBKP / BCTMP = 40/40/20 The blending ratio is used as the pulp for the back side paper layer, and 2 kg / ton of pulp of water-soluble polymer paper strength agent polypropylene resin (trademark, Polyester 1233 'manufactured by Arakawa Chemical Industry Co., Ltd.) is added with 2kg / ton of pulp of aluminum sulfate, and adjust the floor weight of the inner paper layer to 80g / m2, and make paper separately Laminate, pressing, drying dehydration desiccant process to prepare a base paper for a table / intermediate / inner layer composed of. Using a bar coater, a water-soluble polymer polypropylene amine-based resin (trademark; X paint (Yiyibu 130), manufactured by Xingguang Chemical Industry Co., Ltd.) was applied to the paper substrate at a coating amount of 1.5 g / m2. Then, using a bar coater, it will contain a polypropylene ammonium resin (trademark; X Coating 130, manufactured by Xingguang Chemical Industry Co., Ltd.) with a blend ratio of 95/5 and polystyrene with an SP value of 10.5. An acrylic copolymer (trademark; Jumaron 1308S, manufactured by Arakawa Chemical Industry Co., Ltd.) is coated on it with a coating amount of 0.5g / m2, and the paper is dried. This paper applies the Chinese National Standard (CNS) A4 specification (210X297). (Mm) (Please read the precautions on the back before filling this page) -Order | -22- 557282 A7 ---- ~~ _87 _ V. Description of the invention (20) ---- ~ The agent is dried and polished Processing, to produce a wafer-type electronic parts containing cardboard paper base material of about 55Gg / m2. Example 9 A paper substrate for a wafer-type electronic component storage board was prepared in the same manner as in the Example. However, G.3g / m2 enzyme denaturing powder (trademark; Su Dayin (Y 々 Xi &lt; /) cs-50, manufactured by Daiwa Chemical Industry Co., Ltd.) was used to replace the water-soluble polymer polypropylene in the primer coating. Oralamine resin (trademark; χ Coating 130 'manufactured by Starlight Chemical Industry Co., Ltd.), undercoating with a bar coater, and using a bar coater at a coating amount of 15 g / m2 will be 15 / The blending ratio of 85 contains oxidized starch (trademark; top (work piece) eight, manufactured by Prince Corn Starch Company) and polystyrene-acrylic copolymer (trademark; polymalon 13 0 8) with an SP value of 105. S, manufactured by Arakawa Chemical Industry Co., Ltd.). Example 10 The same procedure as in Example 8 was carried out to produce a paper substrate for a wafer-type electronic component storage board. However, 8kg / pulp ton of cationized starch (trademark; Mamido (7-〆 彳 F) C-50, manufactured by Shikishimado powder) is used to replace the 5kg / pulp ton with high water solubility added to the surface paper layer Molecular paper strength agent Polyacrylamide resin (trademark; Polyester 1233, manufactured by Arakawa Chemical Industry Co., Ltd.) Polypropyleneamidine resin (trademark; X coating 130, Starlight Chemical Industry) used in coating formation Co., Ltd.) and polystyrene-acrylic copolymer (trademark; Polyurethane 1308S, manufactured by Arakawa Chemical Industries, Ltd.) with an SP value of 10.5 were changed to 9/1, and the coating amount was changed to ug / m2 , And then coated on the paper layer inside the paper substrate. This paper size is applicable to China National Standard (CNS) A4 specification (210X297 public love) .............. install-(Please read the Please fill out this page again) Order! : Line 丨 -23- 557282 A7 _B7_ V. Description of the Invention (21) Example 11 The same as Example 8 was made to make a paper substrate for wafer-type electronic parts storage cardboard. However, a water-soluble polymer polypropylene ammonium resin (trademark; X Coating 130, manufactured by Xingguang Chemical Industry Co., Ltd.) and a polystyrene-acrylic acid copolymer (trademark; polyurethane) 1308S were applied at a coating amount of 1.5 g / m2. Arakawa Chemical Industry Co., Ltd.) has a blending ratio of 75/25 to replace the water-soluble high-molecular-weight polypropylene ammonium resin (trademark; X Coating 130, manufactured by Starlight Chemical Industry Co., Ltd.), With a coating amount of 0.5g / m2, a polypropylene ammonium resin (trademark; Polyester 1233, manufactured by Arakawa Chemical Industries, Ltd.) and a wax compound (trademark; rubber compound W—116H with an SP value of 7.5) , Manufactured by Arakawa Chemical Industry Co., Ltd.), and a blending coating liquid having a blending ratio of 2/8 is coated thereon. Example 12 A blending ratio of NBKP / LBKP = 60/40 was used as the pulp for the front-side paper layer to which the tape was affixed, and 2 kg / pulp ton of aluminum sulfate was added thereto, and the basis weight was adjusted to 160 g / m2 In addition, NBKP / LBKP / deinked newspaper waste paper = 40/40/20 is used as the pulp for the intermediate paper layer, and 2 kg / t of water-soluble polymer paper strength agent polypropylene is added thereto. Phenylamine resin (trademark; Polyester 388, manufactured by Arakawa Chemical Industry Co., Ltd.) and 2 kg / pulp ton of aluminum sulfate, and the basis weight is adjusted to 310 g / m2, and NBKP / LBKP / BCTMP = 40/40 The blending ratio of / 20 is used as the pulp for the back side paper layer, and 2 kg / ton of water-soluble polymer paper strength agent polypropylene ammonium resin (trademark; Polyester 388, Arakawa Chemical Industry Co., Ltd.) is added thereto. (Manufactured) and 2kg / pulp ton of aluminum sulfate, and its volume is adjusted to the paper size to apply Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page) Order 丨-24- 557282 A7 B7 V. Description of the invention (22 80g / m2, papermaking, lamination, Dehydration and drying treatment with a desiccant to produce a paper substrate with 3 layers of surface / middle / inside. Using a rod coating machine, a water-soluble polymer polyvinyl alcohol resin (trademark; electrochemical polymerization) was used at a coating amount of 3.5 g / m2. Vinyl alcohol (# 17, manufactured by Denki Kagaku Kogyo Co., Ltd.) was coated on the front side paper layer of the paper substrate, and a water-soluble polymer was polymerized at a coating amount of 1.0 g / m2 using a bar coater. Blend of vinyl alcohol resin (trademark; electrochemical polyvinyl alcohol K-17C, manufactured by Denka Kogyo Co., Ltd.) and turpentine compounds (trademark; RF compound 880L-50, manufactured by Misawa Ceramics Corporation) with SP value of 8.5 A coating material having a ratio of 3/7 was coated thereon to form a coating layer, followed by drying with a desiccant and performing rich light treatment, and a wafer-type electronic component storage board substrate for a wafer type of about 550 g / m2 was produced. Example 13 Example 12 was the same to manufacture a wafer-type electronic part storage board paper substrate. However, an enzyme-modified starch (trademark; Sudain CS-50, manufactured by Daiwa Chemical Industry Co., Ltd. was coated with a bar coating machine at a coating amount of 2.5 g / m2. Polystyrene-acrylic copolymer with SP value of 10.5 (trademark; Polymaron 1308S, manufactured by Arakawa Chemical Industries, Ltd.) with a blending ratio of 6/4 to replace the water-soluble polymer polyethylene used in the primer Alcohol-based resin (trademark; electrochemical polyvinyl alcohol K-17C, manufactured by Denki Kagaku Kogyo Co., Ltd.), and then using a bar coating machine, polypropylene amine resin (trademark; X paint) was applied at a coating amount of 0.5 g / m2. 130, manufactured by Xingguang Chemical Industry Co., Ltd.). : Example 14 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 × 297 public love) .................................. ¥ —— (Please Read the precautions on the back before filling this page), OK | -line 丨 -25- 557282 A7 ____ B7__ V. Description of the invention (23) (Please read the precautions on the back before filling out this page) Make the same as in Example 12 A paper substrate for paperboard is housed to manufacture wafer-type electronic parts. However, with a coating amount of 0.5 g / m2, a water-soluble polymer polyvinyl alcohol-based resin (trademark; electrochemical polyvinyl alcohol K-17c, manufactured by Denki Kogyo Co., Ltd.) and a wax-based compound with a SP value of 7.5 (trademark Rubber compound W—116H, manufactured by Arakawa Chemical Industry Co., Ltd.) with a blending ratio of 7/3 is coated on the inner paper layer of the paper substrate. Comparative Example 5 The paper substrate of Example 8 was directly used as a paper substrate for cardboard. Comparative Example 6 Using a bar coater, an oxidized starch (trademark, Zenith A, manufactured by Prince Corn Starch Co., Ltd.) was coated on the surface paper layer of the paper substrate of Example a at a coating amount of 2.0 g / m2 to produce a wafer type. The electronic component stores a paper substrate for cardboard. Comparative Example 7 A paper substrate for a wafer-type electronic component storage board was prepared in the same manner as in Example 9. However, the coating amount of the enzyme-modified starch (trademark; Sudain CS-50, manufactured by Daiwa Chemical Industry Co., Ltd.) for primer coating was increased to 2.0 g / m2, and polyvinyl alcohol was applied at a coating amount of 0.5 g / m2. Series resin (trademark; electrochemical polyvinyl alcohol K-17C, manufactured by Denka Kogyo Kogyo Co., Ltd.) to replace oxidized starch (trademark; Top A, manufactured by Prince Corn Starch Co., Ltd.) and polystyrene-acrylic copolymer (trademark) ; Jumaron 1308S (Made by Arakawa Chemical Industry Co.)). Comparative Example 8 The same paper as in Example 12 was used to make a wafer-type electronic component storage board. The paper size was adapted to the Chinese National Standard (CNS) A4 specification (2) 〇 &gt; &lt; 297 mm. -26- 557282 A7 B7 V. Invention Explanation (24) Paper substrate 'However, the application of the primer coating and the top coating is not performed. Table 2 shows the evaluation results of the peel strength and fluff resistance of the substrates for the wafer-type electronic component storage cardboard obtained in Examples 8 to 14 and Comparative Examples 5 to 8, respectively. The test method is shown below. (Anti-fluffing property) The fluffing of the peeling surface of the paper-type electronic component storage cardboard base material measured under the condition of peeling strength measurement A was visually evaluated. 〇: No fluff at all. △: Partial fluffing. X: Fully fluffed. (Please read the precautions on the back before filling in this page) • Order ·: Line 丨 This paper size is applicable to China National Standard (CNS) A4 (21〇 &gt; &lt; 297mm) -27- 557282 A7B7 V. Invention Explanation (25) Table 2 II 0 △ ~ 〇I_ 0 0 0 0 0 &lt; 1 X &lt; 3 1 X 0 X Peel strength A Article ^ B condition (mN) 251/172 496/300 1_: _ 160 / 119 376/268 412/307 318/246 158/126 1 16/10 i I 1 39/18 12/7 | 42/31 Topcoat | Coating amount (ε / ιΛ 〇1〇 «μ» ca ir &gt; c &gt; 〇IO 〇 · i〇 € &gt; I 〇c &gt; i in d I component m 11 m mu ii w 赛 wmmi «II iRiSS m ii aisic ΙΕΚΙ ^ 舲 丨 丨 1 00 Μ ^ ^ 1 装 松 m &lt; ° m ^ Lithium lithium 丨 丨 mn K) ® Polypropylene amine resin ι ι ιι 松 ^ ^ ^ 爹 NM Dimension 1 Polyvinyl alcohol _mm_ I Primer 1 Coating amount (ί / ηΟ ΙΟ r— o '1 in IO CO IO CN 1 1 1 〇eg I Composition Polypropylene amine-based resin mm Stripe rattan 1 m KtO II Embedding pure polyvinyl alcohol-based resin ϋ S 线 Thread 丨 丨 ΚΙ Loose mm 1 1 1 Enzyme denaturation! Starch I Add paper strength agent 1 to the front side paper layer Adding amount in 10 00 10 1 1 1 ID 1 10 I Ingredient i Polypropylene amine based resin Polypropylene amine based resin _ Cationic starch polypropylene amine based resin 1 1 1 Polypropylene amine based resin 1 Polypropylene 醸Amine 1 series resin_] I Example 8 Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 Comparative Example 5 Ό 镒 Comparative Example 7 I Comparative Example 8 (Please read the precautions on the back before filling (This page)-ring-order-this paper size applies Chinese National Standard (CNS) A4 (210X297 mm) -2S- 557282 A7 B7 V. Description of the invention (26) Example 15 (Please read the precautions on the back before (Fill in this page) Use NBKP / LBKP = 60/40 as the blending rate for the paper on the front side and adjust the volume to 160g / m2. Use NBKP / LBKP / deinked newspaper waste paper == 40 / The blending ratio of 40/20 is used as the pulp for the intermediate paper layer, and the basis weight is adjusted to 310g / m2. The blending ratio of NBKP / LBKP / BCTMP == 40/40/20 is used as the inner paper layer. Use pulp and adjust the basis weight to 80g / m2, and then perform papermaking, lamination, pressing, dehydration and drying with desiccant, Worksheet / interlayer / sheet base 3 in layers. Using a bar coating machine, a styrene-acrylic-acrylic-acrylic acid copolymer (trademark; Jumaron 1301S, manufactured by Arakawa Chemical Industries, Ltd.) having an SP value of 10.0 was applied to the coating at a coating amount of 0.1 g / m2. On the inner paper layer of the paper substrate, a desiccant is dried and calendered to produce a wafer-type electronic component storage board paper substrate with a plateau weight of about 550 g / m2. Examples 16, 17, 18, 19, 20, and 21 in In each of Examples 16 to 21, the same substrate as in Example 15 was prepared to produce a wafer-type electronic component housing paperboard substrate. However, as shown in Table 3, the type of the internally added drug, its SP value, the component compound for coating, its SP value, and the amount of paint were changed. Example 22 The same procedure as in Example 15 was performed to produce a paper substrate for a wafer-type electronic component storage board. However, 5 kg / ton of pulp and 3 kg / ton of pulp of turpentine compounds (trademark; rubber pine E-50, manufactured by Arakawa Chemical Industry Co., Ltd.) with an SP value of 9.3 were added as internal medicines to the paper layers for the back side. In addition, the coating amount of Juma 1301S (trademark) for coating was changed to 0.05 / m2. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public love) -29- 557282 A7 __B7___ V. Description of the invention (27) Example 23 The same as Example 15 was made to make a paper substrate for wafer-type electronic parts storage cardboard . However, a polyimide-based resin with a SP value of 9.7 (trademark; polymine SN, manufactured by Japan BASF (dagger, one work, one work only 7)) 10 kg / ton of pulp is used as The internally added medicine is added to the pulp for the inner paper layer, and the coating of styrene-acrylic copolymer is not applied. Comparative Example 9 A paper substrate for a wafer-type electronic component storage board was prepared in the same manner as in Example 15. However, a coating of a styrene-acrylic copolymer was not applied. Comparative Examples 10, 11 and 12 Among the items of Comparative Examples 10 to 12, the same substrates as in Example 1 were prepared to produce wafer-type electronic component storage paper substrates. However, the coating was changed to the composition shown in Table 3. The peel strength of the inner surface of the wafer-type electronic component storage cardboard base material obtained in each of Examples 15 to 23 and Comparative Examples 9 to 12 was measured by the following method. The results are shown in Table 3. (Peel strength measurement method) The test paper substrate was cut into a tape shape having a width of 8 mm in the length direction of the test paper substrate. Using a heat sealer (model: TST — 1200, manufactured by Yoto Chemical Co., Ltd.), the two edges of the lower tape (trademark; CP6 — 18000, manufactured by Matthew Co., Ltd.) are 0.5 mm wide and 0.4 mm wide inward from both edges. Adhere to the test tape and heat seal it. The heat-sealing conditions at this time were performed under the conditions of a heating temperature of 155 ° C and a condition A with an adhesion speed of 3.0 m / min and a condition B with an adhesion speed of 5.0 m / min. The paper size is measured using the peel strength according to the Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling out this page)-Stable · Order · -30-^ 7282 5. Description of the invention ( 28 set machine (model ·· NPT — 100, oral * * made by 纟 嘉德 公司), obtained from :: belt: the tape to peel off the lower tape, and determine the peel strength. Use it to measure the large value of s The average value of the minimum value is taken as the heat seal strength (peel strength), and the 0 is shown on the table as 7F. In addition, the measurement conditions of the peel strength are based on JIS C 0806 〇 &gt; This paper size applies Chinese national standards (CNS ) A4 specification (210X297 mm) 557282 A7 B7 V. Description of the invention (29) Peel strength A condition / B condition m 195/172 1 108/85 1 359/277 1 183/156 1 205 / Π0 | 211/166 | 180/161 228/191 | 179/151 1 45/30 1 1__1Z〇__1 1 29/11 1 1 35/19 1 _ Fine coating amount (g / ffi d 0.01 I in db 〇 0.3 0.06 1 1 ddf · »〇 · 丨 SP 値 丨」 〇〇1 10.0 I 1 1 1 10-2 1 in 40 CO 10.0 / 23.4 10.0 1 1 CM e 1 23.4 1 t5.5 Component 1—Η I m * m 褰 r Κ] Lin 1 m 雔 St κ si Κ] 榊 im Charm IE κ κ Lin Lin polyethyleneimine resin [2] Ί〇 &lt; nm rn 4—J pine &lt; n gg r «H pine \« II Zhao ui | si S Kl Styrene-acrylic copolymer 1 1 I Fluoro compound [8] ϊ) Sg Μ bar 酏 ΚΙ m 1 polyacrylonitrile polymer [9] I 1 Internal additive 1 Internal addition (kf / pulp tJ II 1 II 1 IT) ο 1 1 1 1 SP 値 1 1 1 1 I 1 9.3 Bu α &gt; 1 1 1 1 Composition 1 1 1 1 1 I 1 ω XmmJ 1 Online shopping κι 1 1 1 1 Μ &lt; π VO i Ii Bank lion i Hold κ OC 1 Wei On i Bank m Dang 1 into Example 21 1 Example 22 1 Example 23 1 Comparative Example 9 1 Comparative Example 10 f— ^ m 镒 i2 i (_ 錤 阳 « (Skimmer ^^ ιιί ^: trenches) 05 FREE ^ ιί: 1ω] (_ Bismuth negative surface: _®) m-VAd®sfKl ^ ®i_ [SJ Wei Bi Bi Mo &lt; &lt; Office: 2 crocodiles M: Professional boat) 05-1088 Yi 醮 δ7】 (Please read the precautions on the back before filling in this page)

This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -32- 557282 A7 B7 V. Description of the invention (30 Example 24 Use the blending ratio of NBKP / LBKP = 60/40 as the adhesive The pulp on the surface side of the tape is adjusted to 160g / m2, and the blending ratio of NBKP / LBKP / deinked newspaper waste paper = 40/40/20 is used as the pulp for the intermediate paper layer. And the basis weight was adjusted to 310g / m2, and the blending ratio of NBKP / LBKP / BCTMP = 40/40/20 was used as the pulp for the inner paper layer, and the basis weight was adjusted to 80g / m2. The paper was laminated, pressed, dehydrated and dried with a desiccant to produce a paper substrate with a surface / middle / inner three-layer structure. Using a bar coater, the SP value was 10.5 with a coating amount of 0.2g / m2. Polystyrene-acrylic acid copolymer (trademark; Polyurethane 1308S, manufactured by Arakawa Chemical Industry Co., Ltd.) was coated on the front side paper layer of the paper substrate, and the styrene with an SP value of 10.0 was applied at a coating amount of 1.0 g / m2 An acrylic copolymer (trademark; polyurethane 1301S, manufactured by Arakawa Chemical Industries, Ltd.) is coated on the back side paper layer ， Drying with desiccant and calendering treatment to produce wafer-type electronic parts containing cardboard paper substrate with a volume of about 550g / m2. Example 25 Use a blending ratio of NBKP / LBKP = 60/40 as the adhesive The paper side of the tape is used for pulp, and 5 kg / ton of pulp of water-soluble polymer paper strength agent polypropylene ammonium resin (trademark; Polyester 1233, manufactured by Arakawa Chemical Industry Co., Ltd.) and 2 kg / ton of pulp are added thereto. Aluminum sulfate, and adjust the basis weight to 160g / m2, and use the blending ratio of NBKP / LBKP / deinked newspaper waste paper == 40/40/20 as the pulp for the intermediate paper layer, and use it Add 2kg / ton of pulp of water-soluble polymer paper strength agent Polyacrylamide resin This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -------------- --------- install ------------------, can ------------------ line. (Please read the precautions on the back before filling this page) -33- 557282 A7 _____ Β7 V. Description of the invention (31) (Trademark; Polyester 1233, manufactured by Arakawa Chemical Industry Co., Ltd.) and 2kg / pulp ton of sulfuric acid, And adjust its volume to 31 g / m2, and the blending ratio of NBKP / LBKP / BCTMP = 40/40/20 is used as the pulp for the inner paper layer, and 2 kg / ton of water-soluble polymer paper strength agent polypropylene is added thereto. Amine resin (trademark; Polyester 1233, manufactured by Arakawa Chemical Industry Co., Ltd.) and 2 kg / pulp ton of aluminum sulfate, and the volume of the amine resin was adjusted to 80 g / m2. Papermaking, lamination, pressing, and drying were performed separately. The agent is dehydrated and dried to produce a paper substrate consisting of three layers of top / middle / back. Using a bar coater, a water-soluble high molecular weight polypropylene ammonium resin (trademark; X paint 130, manufactured by Xingguang Chemical Industry Co., Ltd.) was primed on the paper of Examples 24 and 25 at a coating amount of 1.5 g / m2. On the surface of the substrate, a bar coater will be used to contain polypropylene resin (trademark; X coating 130, manufactured by Xingguang Chemical Industry Co., Ltd.) and SP at a blending ratio of 5/5 at a coating amount of 0.5 g / m2. A coating of polystyrene-acrylic copolymer (trademark; Polymaron 1308S, manufactured by Arakawa Chemical Industry Co., Ltd.) having a value of 10.5 was applied thereto, and a bar coater was used at a coating amount of 0.3 g / m2 to Coatings containing styrene-acrylic copolymer (trademark; polyurethane 1301S, manufactured by Arakawa Chemical Industry Co., Ltd.) and polyvinyl alcohol resin (trademark; Canglei polyvinyl alcohol PVA — 117) at a ratio of 1/2 It was coated on the inside of a paper substrate, dried with a desiccant, and calendered to produce a wafer-type electronic component storage cardboard paper substrate 'having a plateau weight of about 550 g / m2, and the peel strength between the surface and the inside was measured. The measurement method is the same as that used in Examples 1 to 23 and Comparative Examples 1 to 12. The results are shown in Table 4. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public love) (Please read the precautions on the back before filling this page). HVT-Reveal-34-557282 A7 B7 V. Description of the invention (32) Table 4 Anti-pilling properties 〇 &lt; 00 Zhu Z 〇 ^ W &lt; 1 00 Bu '—— 〇〇 ^ —— W &lt; &lt; N &lt; N — inch CN — real 1 〇 ΓΟ 〇 «W Ο 〇νδ CO ο Composition Stupid ethylene-acrylic acid copolymer κ3 肊 崦; g hair-block 丨 excited bismuth &lt; 0 11 &lt; S ¢ 1 «Ν 〇m ο« W • M ν8 SP value 10.5 23.1 / 10.5 ° 丨 Bronze Bismuth: g 发 $ t〇 丨 Scream Bismuth 丨 丨: n ¢ 1 1 w vg | vg: a into a paddle 1 _ 裟 二 ΐΐ ^ 1 Tea «: 1« a shout award 1 (Please read the notes on the back before filling this page)

， 可 I: Line 丨 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -35- 2 AJuly (33) ---- [Effect of the invention] It can be seen from the comparison between the examples and the comparative examples Paper substrates that meet the requirements of the present invention show high peel strength to the upper and lower tapes, that is, the (adherent) speed increases, and the adhesive strength to the upper or lower tapes is also different and does not fluff. (Please (Please read the notes on the back before filling this page). Ordering 丨 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -36-

Claims (1)

557282 Printed A8 Do '' * * * *. _ By the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Application for Drought Profit Scope ------- ~ Patent Application No. 091117784 Application for Amendment of Patent Scope Amendment Date: 1992 Month 1 · A wafer-type electronic component storage paperboard substrate is a paper substrate for manufacturing paperboard used to store wafer-type electronic components, and has 6_5 ~ 14 on at least one side of the surface of the paper substrate. Solubility parameter (hereinafter referred to as SP value) is an adhesive adjuster. 2. The paper substrate according to item 1 of the scope of patent application, wherein the distribution amount of the aforementioned adhesiveness adjusting agent on the surface or inside of the paper substrate is 0 to 2.0 g / m2. 3. The paper substrate according to item 丨 of the patent application range, wherein the aforementioned paper substrate comprises a paper substrate and a coating formed on at least one surface of the surface thereof, and the aforementioned coating contains the aforementioned adhesiveness adjusting agent By. 4. The paper substrate as described in the second item of the patent scope, wherein the aforementioned paper substrate contains a paper substrate and a coating formed on at least one surface of the surface thereof, and the aforementioned coating contains the aforementioned adhesiveness adjustment Agent. 5. The paper substrate as described in item 3 of the patent application, wherein the aforementioned coating further contains a water-soluble polymer binder. 6. The paper substrate according to item 4 of the patent application, wherein the aforementioned coating further contains a water-soluble polymer binder. 7. The paper substrate according to item 3 of the patent application scope, wherein an undercoat layer containing a water-soluble polymer binder is formed between the aforementioned paper substrate and the aforementioned coating layer. 8. The paper substrate according to item 4 of the scope of patent application, wherein an undercoat layer containing a water-soluble polymer binder is formed between the aforementioned paper substrate and the aforementioned coating layer. The size of this paper applies to China National Standard (CNS) A4 (2) 0 X 297 mm. Γ-. I —1 I-I ---- · 111111 Hr (Please read the precautions on the back before filling this page ) -37- 557282 VI. Application for profit-seeking scope 9. The paper base material such as the scope of patent application No. 3, wherein the aforementioned paper-based system contains a water-soluble polymer binder. 10. The paper substrate according to claim 4 of the patent scope, wherein the aforementioned paper-based system contains a water-soluble polymer binder. Matter 11 · If the paper substrate for which the patent is enumerated is declared, the aforementioned adhesiveness adjusting agent contains a polyethylene resin, a polypropylene resin, a polyethylene resin, a polycarbonate resin, and a polyester resin. Resin, polyvinyl acetate resin, polyacrylate resin, turpentine compound, styrene-acrylic copolymer, wax compound, styrene-butadiene copolymer and 5 ^ ethimine compound At least one of them. Line 12. The paper substrate according to any one of claims 5 to 10, wherein the water-soluble polymer binder is made of starch, modified starch, casein, big protein, carboxymethyl cellulose, Hydroxyethyl cellulose, alginic acid soda, polypropylene ammonium resin, polyvinyl alcohol-based resin, modified water-soluble polyvinyl alcohol-based resin, and polyethylene. It consists of at least j kinds of pyrrolidone resin. 13. The paper base material according to item 5 or 6 of the patent application scope, wherein the coating amount of the coating layer containing the aforementioned water-soluble polymer adhesive and the aforementioned adhesiveness adjusting agent is 0.05 to 5.0 g / m2. 14. The paper substrate according to item 1 of the scope of patent application, wherein the surface or inside of the aforementioned paper substrate is at a temperature of 155 ° C, a pressure of 196 kPa (2.0 kgf / cm2), and an adhesion speed of 3.0 m / min (A Condition) or 5.0m / min (condition B), from the two edges of the hot-melt covering tape with a width of 8mrn to the inner side of the strip of 0.5mm and the width of 0.4mm. The paper dimensions are subject to Chinese National Standards (CNS) A4 size (210 X 297) 38- 557282 For heat and pressure to adhere to the surface or inside of the paper substrate, the peel strength between the surface or inside of the paper substrate and the upper or lower tape measured according to ns C 0806 is determined when the aforementioned adhesion speed is A It is more than 100%, and it is more than 70% when the aforementioned adhesion speed is the B condition. 15. A paperboard for accommodating wafer-type electronic parts, which is formed by a plurality of recesses formed on a surface side of a paper base material as set forth in any one of patent claims 1 to 14. 16. A paperboard for storing electronic components of wafer type, which is formed on the paper base material of any one of the scope of application for patents by a plurality of perforations on both the front and back surfaces of the paper base material. Ί -------- Order --------'- line JAW— (Please read the note on the back? Matters before filling out this page) Printed on paper by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs Standards apply to China National Standard (CNS) A4 specifications (2) 0 X 297 mm -39-