TWI418500B - Wafer type electronic parts storage paper seat - Google Patents

Wafer type electronic parts storage paper seat Download PDF

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Publication number
TWI418500B
TWI418500B TW97102166A TW97102166A TWI418500B TW I418500 B TWI418500 B TW I418500B TW 97102166 A TW97102166 A TW 97102166A TW 97102166 A TW97102166 A TW 97102166A TW I418500 B TWI418500 B TW I418500B
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Taiwan
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treatment agent
paper
surface treatment
type electronic
electronic component
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TW97102166A
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Chinese (zh)
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TW200833565A (en
Inventor
Taketo Okutani
Hiroshi Suenaga
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Oji Paper Co
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Publication of TWI418500B publication Critical patent/TWI418500B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Paper (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)
  • Packages (AREA)

Description

晶片型電子零件收納紙座Wafer type electronic parts storage paper holder 技術領域Technical field

本發明係有關於一種紙製之晶片型電子零件收納紙座,詳而言之,本發明係有關於一種較少產生細毛且成形性優異之晶片型電子零件收納紙座。The present invention relates to a paper-based electronic component storage paper holder. In particular, the present invention relates to a wafer-type electronic component storage paper holder which is less likely to produce fine hair and has excellent formability.

本發明之晶片型電子零件收納紙座係與蓋帶之接著穩定性優異,且剝離蓋帶時可防止細毛自紙座脫落、或極少脫落者。The wafer-type electronic component storage paper holder of the present invention is excellent in adhesion stability to the cover tape, and can prevent the fine hair from falling off from the paper seat or rarely falling off when the cover tape is peeled off.

背景技術Background technique

晶片型電子零件收納紙座通常係藉由對紙座用厚紙板進行下述之加工處理,而形成為晶片型電子零件的載具。The wafer type electronic component storage paper holder is usually formed into a carrier for a wafer type electronic component by performing the following processing on the paperboard cardboard.

(1)將紙座用厚紙板縱切成預定寬度的帶狀。(1) The paperboard is cut longitudinally into a strip of a predetermined width.

(2)於所形成之紙板帶上形成預定大小的角孔(凹部或通孔)及圓孔(通孔)。角孔係用於收納晶片型電子零件,而圓孔係用以在裝填機內搬移收納電子零件之紙座。(2) An angular hole (recess or through hole) and a circular hole (through hole) of a predetermined size are formed on the formed cardboard tape. The corner hole is for accommodating the wafer type electronic component, and the round hole is for moving the paper seat for accommodating the electronic component in the loader.

(3)將蓋帶接著於紙座裡面(底側),封住角形通孔之底部開口部,以形成角形凹部。此外,亦可不形成角形通孔,而對紙座進行角狀壓花加工,形成預定大小的角形凹部。此時,可省略前述底側蓋帶之接著步驟。在將蓋帶接著於紙座時,係使用將蓋帶重疊於紙座上,再從蓋帶上施加熱及壓力來進行接著的方法,即所謂的熱封法。(3) The cover tape is attached to the inside of the paper holder (bottom side), and the bottom opening portion of the angular through hole is sealed to form an angular recess. Further, the paper holder may be angularly embossed without forming an angular through hole to form an angular recess of a predetermined size. At this time, the subsequent step of the aforementioned bottom side cover tape may be omitted. When the cover tape is attached to the paper holder, a method of attaching the cover tape to the paper holder and applying heat and pressure from the cover tape to perform the subsequent method, the so-called heat sealing method, is used.

(4)將晶片型電子零件通過其開口部裝填至前述角形凹 部中。(4) loading the wafer type electronic component through the opening portion to the aforementioned angular recess In the ministry.

(5)藉由熱封法將蓋帶接著於紙座表面(上側),以封住前述角形凹部之開口部,製作收納晶片型電子零件之紙座。(5) The cover tape is attached to the surface (upper side) of the paper holder by a heat sealing method to seal the opening of the angular recess, thereby producing a paper holder for accommodating the wafer type electronic component.

(6)將前述收納晶片型電子零件之紙座捲繞於預定大小的匣式捲軸並加以裝運。(6) The paper holder for accommodating the wafer type electronic component is wound around a predetermined size reel and shipped.

(7)由最後面之使用者從前述收納晶片型電子零件之紙座表面剝除上側蓋帶,然後從前述角形凹部中取出收納於其中之晶片型電子零件。(7) The user of the last face peels off the upper side cover tape from the surface of the paper holder that houses the wafer-type electronic component, and then takes out the wafer-type electronic component housed therein from the angular recessed portion.

為因應前述用途,收納紙座之品質需為:(1)不會對所裝填之晶片型電子零件產生不良影響;(2)紙座表面具充分平滑性,以使蓋帶可順利地接著且剝離;(3)具有可充分承受對紙座所進行之各種處理的高機械強度等。In order to meet the above-mentioned uses, the quality of the storage paper holder should be: (1) not adversely affecting the loaded wafer-type electronic components; (2) the surface of the paper holder is sufficiently smooth so that the cover tape can be smoothly followed. (3) High mechanical strength and the like which can sufficiently withstand various treatments performed on the paper holder.

收納紙座之品質缺陷事項之1係由紙層產生細毛。細毛係指由角孔之內壁面、及由最後面之使用者剝離蓋帶時,從紙座表面突出之細微紙漿纖維構成者。若電子零件收納用角孔之內側面、及在剝離蓋帶時之紙座表面產生細毛,就會成為妨礙晶片型電子零件之取出、堵塞貼片機之吸嘴、污染晶片型電子零件等各種阻礙產生的原因。In the case of the quality defect of the storage paper holder, fine hair is generated from the paper layer. Fine hair refers to a fine pulp fiber that protrudes from the surface of the paper seat when the inner wall surface of the corner hole and the user of the last surface peel off the cover tape. When the inner side surface of the corner hole for electronic component storage and the surface of the paper seat when the cover tape is peeled off, the wafer-type electronic component is taken out, the nozzle of the mounter is blocked, and the wafer-type electronic component is contaminated. The reason for the hindrance.

另外,當紙座與蓋帶之間的接著力不均一時,紙座會在將蓋帶剝離紙座時產生振動,而使電子零件從角形凹部飛出、及/或收納位置產生變動,因此,電子零件之取出操作就無法順利進行,產生安裝效率降低的問題。In addition, when the adhesion between the paper holder and the cover tape is not uniform, the paper holder vibrates when the cover tape is peeled off from the paper holder, and the electronic component flies out from the angular recess and/or the storage position changes. The removal operation of the electronic parts cannot be performed smoothly, resulting in a problem of reduced installation efficiency.

而且,最近用以將蓋帶貼附於紙座之黏貼機之黏貼速度正飛快地提昇當中。隨著此種黏貼速度的提昇,紙座與 蓋帶之間的接著強度就有變弱的傾向,所以可以高接著強度接著蓋帶之紙座的需求強烈。但是,會產生將前述接著強度增強,因剝離蓋帶所產生之細毛就會變多的問題。因此,而期望提供一種即使對於蓋帶之接著強度強,也不易產生細毛的紙座。Moreover, the pasting speed of the pasting machine for attaching the cover tape to the paper seat has been rapidly increasing. With the increase in the speed of this adhesive, the paper holder and The strength of the adhesive between the cover tapes tends to be weak, so that the strength of the paper holder which can be followed by the high strength and then the cover tape is strong. However, there is a problem that the above-mentioned adhesive strength is enhanced, and the fine hair generated by peeling off the cover tape is increased. Therefore, it is desirable to provide a paper holder which is less likely to generate fine hair even if the adhesive strength of the cover tape is strong.

至今,在特開平11-165786號公報(專利文獻1)及特開平10-218281號公報(專利文獻2)中,已揭示使樹脂浸透貫通孔內壁面的方法,作為晶片型電子零件收納用角孔之內壁面之細毛防止方法。又,在特開2002-53195號公報(專利文獻3)中,已揭示管理針葉木與闊葉木的調配比及紙基材之密度,來防止產生細毛的方法。另外,在特開2005-92910號公報(專利文獻4)中,已揭示使特定樹脂含於表層,以防止細毛的技術。而且,在特開2003-226393號公報(專利文獻5)中,已揭示於從紙座帶表面到30~50μm的深度浸漬樹脂,設置樹脂浸漬層者。上述方法在細毛之防止效果方面都不夠充分,無法解決產生於角孔內之細毛所造成之阻礙。In the method of impregnating the resin into the inner wall surface of the through hole, the method of accommodating the inner surface of the wafer type electronic component is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. The method of preventing fine hair on the inner wall of the hole. In JP-A-2002-53195 (Patent Document 3), a method of managing the blending ratio of softwood and hardwood and the density of a paper substrate to prevent the generation of fine hair has been disclosed. In JP-A-2005-92910 (Patent Document 4), a technique of containing a specific resin on a surface layer to prevent fine hair has been disclosed. In JP-A-2003-226393 (Patent Document 5), it has been disclosed that a resin impregnated layer is provided by impregnating a resin from the surface of the paper seat belt to a depth of 30 to 50 μm. The above method is insufficient in the effect of preventing the fine hair, and the obstruction caused by the fine hair generated in the corner hole cannot be solved.

【專利文獻1】特開平11-165786號公報 【專利文獻2】特開平10-218281號公報 【專利文獻3】特開2002-53195號公報 【專利文獻4】特開2005-92910號公報 【專利文獻5】特開2003-226393號公報[Patent Document 1] JP-A-11-165786 [Patent Document 2] Japanese Patent Publication No. Hei 10-218281 [Patent Document 3] JP-A-2002-53195 [Patent Document 4] JP-A-2005-92910 [Patent Document 5] JP-A-2003-226393

發明揭示Invention

本發明係提供一種晶片型電子零件收納紙座,係在由紙板構成且具有複數用以收納晶片型電子零件之凹部的紙座中,可抑制收納晶片型電子零件之凹部的內壁面產生細毛,且自紙座表面剝離蓋帶時,毛不會自紙座表面脫落、或極少脫落者。The present invention provides a wafer-type electronic component storage paper holder which is capable of suppressing generation of fine hair on an inner wall surface of a concave portion in which a wafer-type electronic component is housed in a paper holder which is formed of a cardboard and has a plurality of concave portions for accommodating the wafer-type electronic component. When the cover tape is peeled off from the surface of the paper seat, the hair does not fall off from the surface of the paper seat, or rarely falls off.

在由習知多層紙板構成之晶片型電子零件收納紙座中,本發明人在驗證電子零件收納凹部之內壁面及蓋帶剝離後之表面產生大量細毛的狀況後,已確認紙漿纖維會自由表面至相當於3根紙漿纖維粗之合計值之深度的部分脫離,及蓋帶之熱封劑浸透於由紙座表層到深40μm~50μm的部分而填充於形成於紙漿纖維間之空隙。本發明人還發現,藉由提高從紙座表面超過50μm之深度且至更深的部分纖維間結合力,固定由紙座表層之紙漿纖維構成之網狀結構,且在該部分留下紙漿纖維的空隙,可抑制凹部內壁面及蓋帶剝離後之表面的細毛,而完成本發明。In the wafer type electronic component storage paper holder which is composed of a conventional multi-layer cardboard, the inventors confirmed that the pulp fiber has a free surface after verifying that the inner wall surface of the electronic component housing recess and the surface of the cover tape are peeled off to generate a large amount of fine hair. The portion which is equivalent to the depth of the total of the three pulp fibers is separated, and the heat sealant of the cover tape is impregnated into the gap formed between the pulp fibers by the surface layer of the paper seat to a depth of 40 μm to 50 μm. The present inventors have also found that by increasing the depth of the fiber from the surface of the paper seat to a depth of more than 50 μm and to a deeper portion, the network structure composed of the pulp fibers of the surface layer of the paper seat is fixed, and the pulp fibers are left in the portion. The voids can suppress the fine hairs on the inner wall surface of the concave portion and the surface after peeling of the cover tape, and the present invention has been completed.

本發明之晶片型電子零件收納紙座係包含有紙基材、及形成於該紙基材之用以收納晶片型電子零件之複數凹部者,前述紙基材具有包含表層、中層及裡層的多層紙板結構,且含有水溶性高分子之表面處理劑從其前述凹部之開口側表面超過50μm的深度浸透於前述紙基材中,並且前述紙基材之前述凹部開口側表面之中心線平均粗糙度(Ra)調整為3μm以上。The wafer-type electronic component storage paper holder of the present invention includes a paper substrate and a plurality of concave portions formed on the paper substrate for accommodating the wafer-type electronic component, wherein the paper substrate has a surface layer, a middle layer, and an inner layer. a multi-layer paperboard structure, and a surface treatment agent containing a water-soluble polymer is impregnated into the paper substrate from a depth of the opening side surface of the concave portion by more than 50 μm, and the center line of the opening side surface of the concave portion of the paper substrate is rough The degree (Ra) is adjusted to be 3 μm or more.

在本發明之晶片型電子零件收納紙座中,前述表面處 理劑最好是具有調整為10mPa.s以下的黏度,且以小於1.1g/m2 之乾燥塗布量塗布於前述紙基材。In the wafer type electronic component storage paper holder of the present invention, the surface treatment agent preferably has an adjustment of 10 mPa. The viscosity below s is applied to the paper substrate at a dry coating amount of less than 1.1 g/m 2 .

在本發明之晶片型電子零件收納紙座中,前述表面處理劑中含有之水溶性高分子最好是選自於聚乙烯醇、澱粉及聚丙烯醯胺之至少1種。In the wafer-type electronic component storage paper holder of the present invention, the water-soluble polymer contained in the surface treatment agent is preferably at least one selected from the group consisting of polyvinyl alcohol, starch, and polypropylene decylamine.

在本發明之晶片型電子零件收納紙座中,前述表面處理劑最好是含有前述水溶性高分子,並含有苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂。In the wafer type electronic component storage paper holder of the present invention, the surface treatment agent preferably contains the water-soluble polymer and contains a styrene-maleic acid copolymer resin or an olefin-maleic acid copolymer. Resin.

在本發明之晶片型電子零件收納紙座中,形成前述紙基材之表層的紙漿纖維最好是闊葉木牛皮紙漿,且其內腔寬度(L1)/纖維寬度(L2)之比在0.4以下。In the wafer type electronic component storage paper holder of the present invention, the pulp fiber forming the surface layer of the paper substrate is preferably a hardwood kraft pulp, and the ratio of the inner cavity width (L1) / fiber width (L2) is 0.4 or less. .

本發明之晶片型電子零件收納用紙座係在其上形成用以形成電子零件收納用凹部的凹部或通孔時,不會或極少在該凹部或通孔之內壁面產生細毛,且在由紙座之前述凹部之開口部的表面剝離覆蓋其之蓋帶時,在該剝離面中,沒有細毛之產生或極少者。因此,本發明之晶片型電子零件收納用紙座具有以下效果,即:收納於前述凹部及/或自前述凹部取出之晶片型電子零件不會受到細毛污染,且由貼片機取出晶片時,吸嘴不會被細毛堵塞。In the wafer-type electronic component storage paper holder of the present invention, when a concave portion or a through hole for forming the concave portion for electronic component storage is formed thereon, fine hair is not generated on the inner wall surface of the concave portion or the through hole, and paper is generated. When the surface of the opening of the recessed portion of the seat is peeled off from the cover tape covering the cover, no fine hair is generated or extremely small in the peeling surface. Therefore, the wafer-type electronic component storage paper holder of the present invention has an effect that the wafer-type electronic component housed in the concave portion and/or taken out from the concave portion is not contaminated by fine hair, and is sucked when the wafer is taken out by the mounter. The mouth will not be blocked by fine hair.

實施發明之最佳形態Best form for implementing the invention

在本發明之晶片型電子零件收納用紙座中,將含有水溶性高分子之表面處理劑從紙基材之凹部之開口側表面超 過深50μm的深度浸透於紙基材中,以提高構成紙基材之紙漿纖維間之接著強度是很重要的。當紙基材中之表面處理劑浸透深度在50μm以下時,紙漿纖維間之結合力就會不足,而易產生細毛,且由於分布於基材表面之紙漿纖維粗細不一,故紙座與蓋帶之間的剝離力會不均。又,因藉由將表面處理劑浸透超過50μm深的深度,可固定紙基材表面具有足夠厚度的部分中之紙漿纖維的網狀結構,故可充分抑制紙座之凹部開口側表面及凹部內壁面產生細毛,且亦可充分抑制紙座與蓋帶之間之剝離力的不均。In the wafer type electronic component storage paper holder of the present invention, the surface treatment agent containing the water-soluble polymer is super-extended from the opening side surface of the concave portion of the paper substrate It is important to soak the depth of 50 μm deep into the paper substrate to increase the adhesion strength between the pulp fibers constituting the paper substrate. When the surface treatment agent in the paper substrate has a depth of 50 μm or less, the bonding force between the pulp fibers is insufficient, and fine hair is easily generated, and the paper seat and the cover tape are different due to the thickness of the pulp fibers distributed on the surface of the substrate. The peeling force between them will be uneven. Further, since the surface treatment agent is impregnated to a depth of more than 50 μm, the network structure of the pulp fibers in the portion having a sufficient thickness on the surface of the paper substrate can be fixed, so that the opening side surface and the concave portion of the concave portion of the paper holder can be sufficiently suppressed. Fine hair is generated on the wall surface, and unevenness in peeling force between the paper seat and the cover tape can be sufficiently suppressed.

目前,已提出各種用以使表面處理劑浸透於紙基材全體的技術、及使表面處理劑僅存在於紙基材表面的技術。以往,在將處理劑從紙基材表面深入浸透時,表面處理劑之浸透深度或浸透量之不均會增大。又,也已知在藉由表面處理劑固定紙座表面部之紙漿纖維的網狀結構時,會連纖維間的空隙也一起填充,此時蓋帶之接著性就會顯著地降低。而要消除上述的問題點,使表面處理劑之浸透狀態均勻,減少紙座與蓋帶之接著強度的不均,且使接著、剝離性提高,控制表面處理劑之黏度及其組成是很重要的。在本發明中,係將表面處理劑之黏度調整為4~10mPa.s,再塗佈或浸漬於紙基材表面,使其浸透於紙基材中。浸透深度比50μm深,比55μm深較佳,且比60μm深更佳。雖然越深越好,但深於100μm時,其效果會飽和,而在經濟上不利。即使將表面處理劑之黏度降低至小於4mPa.s,再將該表面處理劑深入浸透於紙基材中,若是所需量之表面處理 劑無法大致均等地分布於紙基體之表面處理劑浸透部分中,纖維間之結合強度也不能保持高水準。因此,需要將表面處理劑之黏度調整為4mPa.s以上。又,當前述黏度超過10mPa.s時,表面處理劑就會停留在紙基材之表面部分,而不易在紙基材中浸透至超過50μm的深度。表面處理劑之黏度可以B型黏度計測定。因表面處理劑之浸透性會受到黏度很大的影響,故在本發明中會嚴密地進行可對黏度產生影響之表面處理劑溫度的管理。在本發明中,某表面處理劑之處理溫度以管理在40℃~70℃內之範圍為佳,且管理溫度為60℃更佳,來作為表面處理劑之黏度安定的溫度。At present, various techniques for impregnating the entire surface of the paper substrate with the surface treatment agent and techniques for allowing the surface treatment agent to exist only on the surface of the paper substrate have been proposed. Conventionally, when the treatment agent is deeply penetrated from the surface of the paper substrate, the unevenness of the penetration depth or the amount of penetration of the surface treatment agent increases. Further, it is also known that when the network structure of the pulp fibers on the surface portion of the paper seat is fixed by the surface treatment agent, the voids between the fibers are also filled together, and the adhesion of the cover tape is remarkably lowered. In order to eliminate the above problems, the surface treatment agent is evenly immersed, the unevenness of the bonding strength between the paper holder and the cover tape is reduced, and the adhesion and the peelability are improved. It is important to control the viscosity and composition of the surface treatment agent. of. In the present invention, the viscosity of the surface treatment agent is adjusted to 4~10 mPa. s, recoated or impregnated onto the surface of the paper substrate to saturate it in the paper substrate. The penetration depth is deeper than 50 μm, preferably deeper than 55 μm, and better than 60 μm deep. Although the deeper the better, but deeper than 100 μm, the effect will be saturated, which is economically disadvantageous. Even if the viscosity of the surface treatment agent is reduced to less than 4mPa. s, the surface treatment agent is further deeply impregnated into the paper substrate, if the required amount of surface treatment The agent cannot be distributed substantially evenly in the surface treatment agent impregnation portion of the paper substrate, and the bonding strength between the fibers cannot be maintained at a high level. Therefore, it is necessary to adjust the viscosity of the surface treatment agent to 4mPa. s above. Also, when the aforementioned viscosity exceeds 10 mPa. At s, the surface treatment agent stays on the surface portion of the paper substrate and is not easily soaked in the paper substrate to a depth exceeding 50 μm. The viscosity of the surface treatment agent can be measured by a B-type viscometer. Since the permeability of the surface treatment agent is greatly affected by the viscosity, in the present invention, the management of the temperature of the surface treatment agent which affects the viscosity is strictly performed. In the present invention, the treatment temperature of a surface treating agent is preferably in the range of 40 ° C to 70 ° C, and the management temperature is preferably 60 ° C, which is a temperature at which the viscosity of the surface treating agent is stable.

又,表面處理劑之塗布量或浸漬量以0.1~1.1g/m2 為佳,且以0.6~1.1g/m2 更佳。只要大量地塗布或浸漬表面處理劑,就可依黏度從紙基材之表面深入浸透,但如此一來,就會在經濟上產生不利,且紙座表面之表面處理劑的附著量會過剩,而過度地填充於紙漿纖維間之空隙,導致對於蓋帶之接著強度降低的狀況產生。Further, the coating amount or the impregnation amount of the surface treatment agent is preferably 0.1 to 1.1 g/m 2 and more preferably 0.6 to 1.1 g/m 2 . As long as the surface treatment agent is coated or impregnated in a large amount, it can be deeply penetrated from the surface of the paper substrate according to the viscosity, but as a result, it is economically disadvantageous, and the surface treatment agent on the surface of the paper seat is excessively attached. Excessive filling of the gaps between the pulp fibers results in a situation in which the strength of the cover tape is lowered.

本發明所用之紙基材表面的平滑度最好是JIS B 0601所規定之中心線平均表面粗糙度(Ra)在3μm以上左右。當前述中心線平均表面粗糙度小於3μm而使得平滑性過高時,由於蓋帶之熱封成分接著於紙座表面的面積會增加,故蓋帶對於紙基材表面之接著強度就會過高,在剝離蓋帶時便難以剝離,且會增大對剝離蓋帶所需之剝離力的不均,而使紙座產生振動。又,當前述中心線平均表面粗糙度(Ra)超過6μm時,紙基材之平滑性就會過低,而使蓋帶與紙基 材表面的接著性過低。The smoothness of the surface of the paper substrate used in the present invention is preferably such that the center line average surface roughness (Ra) prescribed in JIS B 0601 is about 3 μm or more. When the average center roughness of the center line is less than 3 μm and the smoothness is too high, since the heat seal component of the cover tape is increased in area along the surface of the paper seat, the adhesive strength of the cover tape to the surface of the paper substrate is too high. When the cover tape is peeled off, it is difficult to peel off, and the unevenness of the peeling force required for peeling off the cover tape is increased, and the paper seat is vibrated. Moreover, when the average center roughness (Ra) of the center line exceeds 6 μm, the smoothness of the paper substrate is too low, and the cover tape and the paper base are made. The adhesion of the surface of the material is too low.

本發明所用之表面處理劑係含有水溶性高分子者。該水溶性高分子包括有具有水溶性之聚乙烯醇、澱粉、聚丙烯醯胺、丙烯酸系樹脂、苯乙烯-丁二烯系樹脂、苯乙烯-異戊二烯系樹脂、聚酯系樹脂、乙烯-乙酸乙烯系樹脂、乙酸乙烯-乙烯醇系樹脂、胺甲酸酯系樹脂等,在本發明中係使用含有選自於聚乙烯醇、澱粉及聚丙烯醯胺之至少1種者。其中,聚乙烯醇、澱粉及聚丙烯醯胺可有效率且便宜地提高紙漿纖維相互之接著強度,且對紙座表面之塗布適性亦佳。The surface treatment agent used in the present invention contains a water-soluble polymer. The water-soluble polymer includes polyvinyl alcohol having water solubility, starch, polypropylene decylamine, acrylic resin, styrene-butadiene resin, styrene-isoprene resin, polyester resin, In the present invention, at least one selected from the group consisting of polyvinyl alcohol, starch, and polypropylene decylamine is used in the ethylene-vinyl acetate resin, the vinyl acetate-vinyl alcohol resin, and the urethane resin. Among them, polyvinyl alcohol, starch and polypropylene decylamine can efficiently and inexpensively increase the mutual strength of the pulp fibers, and the coating suitability to the surface of the paper seat is also good.

上述水溶性高分子物質中之聚丙烯醯胺係分子內之醯胺基在與纖維素及半纖維素分子中之氫氧基之間、或聚丙烯醯胺本身之醯胺基相互之間形成氫鍵,使作用於纖維間之氫鍵的數量增加,藉此強化紙漿纖維網狀結構的結合,而可有效率地抑制細毛產生。又,含有分子量5萬~50萬之聚丙烯醯胺之表面處理劑易於調整其黏度,且對紙基材內部之浸透性優異。而且,具有5萬~30萬之分子量之聚丙烯醯胺對紙基材內部之浸透性高,特別適合作為本發明所用之表面處理劑使用。Among the above water-soluble polymer materials, the indoleamine group in the molecule of the polypropylene amide group is formed between the hydroxyl group in the cellulose and the hemicellulose molecule, or the amide group of the polypropylene decylamine itself. Hydrogen bonding increases the amount of hydrogen bonds acting between the fibers, thereby enhancing the bonding of the pulp fiber network structure, and efficiently suppressing the generation of fine hair. Further, the surface treatment agent containing polypropylene decylamine having a molecular weight of 50,000 to 500,000 is easy to adjust its viscosity and is excellent in permeability to the inside of the paper substrate. Further, the polypropylene decylamine having a molecular weight of 50,000 to 300,000 has high permeability to the inside of the paper substrate, and is particularly suitable for use as a surface treatment agent used in the present invention.

本發明所用之表面處理劑最好是含有苯乙烯-順丁烯二酸共聚物樹脂、或烯烴-順丁烯二酸共聚物樹脂,以提昇與蓋帶之接著性,且更提高紙座表面的強度。苯乙烯-順丁烯二酸共聚物樹脂及烯烴-順丁烯二酸共聚物樹脂具有疏水性基與親水性基兩者,藉由將其塗布於於紙座表面,可 形成覆蓋層,而且,浸透至紙基材層中,使為親水基之羧酸基與紙漿纖維形成氫鍵,而在纖維間形成交聯狀態,可大幅地提高纖維間之結合力。藉由纖維間結合力之提高,可提高從紙座表面剝離蓋帶時之阻力,強化剝離強度,且可防止成為細毛之纖維脫落。The surface treating agent used in the present invention preferably contains a styrene-maleic acid copolymer resin or an olefin-maleic acid copolymer resin to improve the adhesion to the cover tape and to improve the surface of the paper seat. Strength of. The styrene-maleic acid copolymer resin and the olefin-maleic acid copolymer resin have both a hydrophobic group and a hydrophilic group, which are coated on the surface of the paper seat. The cover layer is formed and penetrated into the paper base material layer to form a hydrogen bond between the carboxylic acid group which is a hydrophilic group and the pulp fiber, and a crosslinked state is formed between the fibers, whereby the bonding force between the fibers can be greatly improved. By increasing the bonding force between the fibers, the resistance at the time of peeling off the cover tape from the surface of the paper seat can be enhanced, the peel strength can be enhanced, and the fibers which become fine hair can be prevented from falling off.

另外,苯乙烯-順丁烯二酸共聚物樹脂及烯烴-順丁烯二酸共聚物樹脂的玻璃轉移溫度以10~50℃為佳。若該玻璃轉移溫度小於10℃,則在黏貼蓋帶時的黏貼溫度中,形成交聯狀態而存在於紙漿纖維間之苯乙烯-順丁烯二酸共聚物樹脂及/或烯烴-順丁烯二酸共聚物樹脂之纖維結合力就會不充分。又,當上述共聚物樹脂之玻璃轉移溫度大於50℃時,則紙漿纖維與共聚物樹脂之交聯體就會過硬,使紙座表面由於自蓋帶接著劑層紙座剝離時之壓力而受損,使該受損部產生細毛。Further, the glass transition temperature of the styrene-maleic acid copolymer resin and the olefin-maleic acid copolymer resin is preferably 10 to 50 °C. If the glass transition temperature is less than 10 ° C, a styrene-maleic acid copolymer resin and/or an olefin-butylene group which are present in a crosslinked state and exist between the pulp fibers in a bonding temperature at the time of adhering the cover tape The fiber bonding strength of the diacid copolymer resin may be insufficient. Further, when the glass transition temperature of the copolymer resin is more than 50 ° C, the crosslinked body of the pulp fiber and the copolymer resin is too hard, so that the surface of the paper seat is subjected to the pressure at the time of peeling off from the cover tape layer. Damage, causing the damaged part to produce fine hair.

在本發明中,藉由適宜地控制苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂之塗布量或浸漬量,可抑制細毛產生及得到蓋帶與紙座之接著強度所需等級。在表面處理劑中混合苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂進行塗布時,可適宜地調整與水溶性高分子之固形量比例,苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂之塗布量或浸漬量最好是在0.01~0.10g/m2 的範圍內。當苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂之塗布量或浸漬量大於0.10g/m2 時,其效果就會飽和,又,當其小於0.01g/m2 時, 其效果就無法明確地顯現出來。In the present invention, by appropriately controlling the coating amount or the impregnation amount of the styrene-maleic acid copolymer resin or the olefin-maleic acid copolymer resin, the generation of fine hair can be suppressed and the cover tape and the paper holder can be obtained. Then the required level of strength. When the styrene-maleic acid copolymer resin or the olefin-maleic acid copolymer resin is mixed in the surface treatment agent, the ratio of the solid content to the water-soluble polymer can be appropriately adjusted, and the styrene-cis is appropriately adjusted. The coating amount or impregnation amount of the butenedioic acid copolymer resin or the olefin-maleic acid copolymer resin is preferably in the range of 0.01 to 0.10 g/m 2 . When the coating amount or impregnation amount of the styrene-maleic acid copolymer resin or the olefin-maleic acid copolymer resin is more than 0.10 g/m 2 , the effect is saturated, and when it is less than 0.01 g When /m 2 , the effect cannot be clearly expressed.

在本發明之晶片型電子零件收納用紙座中,在紙座表面塗布或浸漬表面處理劑的機構可使用例如:棒塗機、刮刀塗布機、氣刀式塗布機、棍塗機、閘輥塗布機、施膠壓塗機(size press)或壓光塗布機等之輥塗機、雙面刮刀塗布機、輥刀合一塗布機等。其中,因施膠壓塗機及壓光塗布機可藉由夾壓將表面處理劑深入浸透至紙基材內,而較適合用於本發明。In the wafer-type electronic component storage paper holder of the present invention, the mechanism for applying or immersing the surface treatment agent on the surface of the paper holder can be, for example, a bar coater, a knife coater, an air knife coater, a stick coater, or a gate roll coating. A roll coater such as a size press or a calender coater, a double-sided blade coater, a roll-to-roll coater, or the like. Among them, the size applicator and the calender coater are more suitable for use in the present invention because the surface treatment agent is deeply impregnated into the paper substrate by nip.

用以形成本發明之晶片型電子零件收納紙座用紙基材之原料紙漿的種類只要可使表面處理劑之浸透性提高,可將表面之平滑性調整在特定範圍內即可,其他並無特別限制。即,紙基材形成用紙漿可使用例如;化學紙漿(闊葉木、針葉木)、機械紙漿、舊紙紙漿、非木材纖維紙漿及合成紙漿等。這些紙漿可使用單一種,亦可混合複數種使用。The type of the raw material pulp for forming the paper substrate for the wafer-type electronic component storage paper holder of the present invention can be adjusted to have a smoothness of the surface treatment agent, and the smoothness of the surface can be adjusted within a specific range. limit. That is, the paper substrate forming pulp can be used, for example, chemical pulp (hardwood, softwood), mechanical pulp, old paper pulp, non-wood fiber pulp, synthetic pulp, and the like. These pulps may be used singly or in combination of plural kinds.

在本發明中,將表面處理劑從紙基材表面超過50μm的浸透深度浸透於其中是很重要的,只要前述浸透深度超過50μm,可使用由前述之各種紙漿所形成之紙基材。但是,要使紙基材之表層的空隙結構均一,迅速且均勻地進行表面處理劑之浸透,最好是使用由闊葉木漂白牛皮紙漿(LBKP)形成之紙基材。在習知紙座中,係使用調配30%左右之針葉木漂白牛皮紙漿的紙基材,因針葉木漂白牛皮紙漿的纖維寬度較寬,而妨礙表面處理劑順利地浸透,故在本發明中,以使用針葉木漂白牛皮紙漿之含有率在20%以下的紙基材為佳,且以使用未含有針葉木漂白牛皮紙漿的 紙基材更佳。In the present invention, it is important to saturate the surface treatment agent from the surface of the paper substrate to a depth of penetration of more than 50 μm, and as long as the aforementioned penetration depth exceeds 50 μm, a paper substrate formed of the various pulps described above can be used. However, in order to make the void structure of the surface layer of the paper substrate uniform, and to quickly and uniformly impregnate the surface treating agent, it is preferred to use a paper substrate formed of hardwood bleached kraft pulp (LBKP). In the conventional paper holder, a paper substrate prepared by blending about 30% of softwood bleached kraft pulp is used, and since the fiber width of the softwood bleached kraft pulp is wide, the surface treatment agent is impeded to smoothly permeate, so in the present invention Preferably, a paper substrate having a softwood kraft pulp content of 20% or less is used, and a bleached kraft pulp containing no softwood is used. The paper substrate is better.

為使紙座用紙基材之表面部中之表面處理劑的浸透性提高,表層所含之闊葉木漂白牛皮紙漿(LBKP)最好是其內腔寬度(L1)/纖維寬度(L2)之比在0.40以下的紙漿纖維。前述比L1/L2的值越低,紙漿纖維之形態尺寸就越均一,結果可使形成網狀結構之紙漿纖維間的空隙均一,提高表面處理劑的浸透性。若使L1/L2比大於0.4之紙漿纖維含於紙基材中,則纖維寬度較寬之紙漿纖維就會妨礙表面處理劑之浸透。此外,一般而言,L1/L2比大之紙漿纖維其纖維間結合較強,而不易產生細毛,這是未使用表面處理劑時的情況,在如本發明一般塗布表面處理劑時,因表面處理劑所帶來之紙漿纖維的結合力提高效果明顯較高,故使用L1/L2高之紙漿纖維所帶來之纖維間結合力的增強效果及細毛防止效果微弱。又,L1/L2比在0.40以下時,紙基材之表層的彈性率會升高,而使將蓋帶從該紙基材剝離時之剝離強度變為適中。具有0.40以下之L1/L2值之紙漿可使用桉樹材及金合歡樹材之紙漿,桉樹材包含玫瑰桉、柳桉、藍桉樹材等,而金合歡樹材包含美蘭喜(meransii)樹材。根據卡亞尼(Kajaani)纖維長分布測定,以這些材種製造出之紙漿中,數平均纖維長0.1mm以下之短纖維成分(可稱為精細(fine)成分)的含有率為10%以下,此種精細成分少,也可有效促進表面處理劑之浸透。In order to improve the permeability of the surface treatment agent in the surface portion of the paper base material, the hardwood bleached kraft pulp (LBKP) contained in the surface layer preferably has a ratio of the inner cavity width (L1) / the fiber width (L2). Pulp fiber below 0.40. The lower the value of the ratio L1/L2, the more uniform the morphological size of the pulp fibers, and as a result, the voids between the pulp fibers forming the network structure can be made uniform, and the permeability of the surface treatment agent can be improved. If the pulp fibers having an L1/L2 ratio of more than 0.4 are contained in the paper substrate, the pulp fibers having a wide fiber width hinder the penetration of the surface treatment agent. Further, in general, L1/L2 has a stronger fiber-to-fiber bond than a large pulp fiber, and is less likely to produce fine hair, which is a case where a surface treatment agent is not used, and when a surface treatment agent is generally applied as in the present invention, The effect of improving the binding force of the pulp fibers by the treating agent is remarkably high, so that the reinforcing effect of the interfiber bonding force and the fine hair preventing effect by the L1/L2 high pulp fiber are weak. Further, when the L1/L2 ratio is 0.40 or less, the modulus of elasticity of the surface layer of the paper substrate increases, and the peel strength when the cover tape is peeled off from the paper substrate becomes moderate. The pulp having an L1/L2 value of 0.40 or less may be pulp of eucalyptus and acacia, the eucalyptus material including rose bud, willow, blue eucalyptus, etc., and the acacia tree containing meransii tree material. According to the Kajaani fiber length distribution measurement, the content of the short fiber component (which may be referred to as a fine component) having a number average fiber length of 0.1 mm or less in the pulp produced from these materials is 10% or less. The fine composition is small, and the surface treatment agent can be effectively promoted.

製造本發明之晶片型電子零件收納紙座的製造裝置及製造條件並無特別限制,可使用習知之製造裝置,選擇適 合其之製造條件,來製造本發明之產品。例如,可使用圓網抄紙機及長網抄紙機,藉由多層合抄法對本發明之紙作用多層結構紙基材進行抄紙,且可藉由前述內添法或塗布機之外添法,將所需之添加劑添加於其表層。The manufacturing apparatus and manufacturing conditions for manufacturing the wafer-type electronic component storage paper holder of the present invention are not particularly limited, and a conventional manufacturing apparatus can be used. The products of the present invention are manufactured in accordance with the manufacturing conditions thereof. For example, the paper-making multi-layer structure paper substrate of the present invention can be subjected to papermaking by a multi-layer combination method using a cylinder paper machine and a long-wire paper machine, and can be added by the above-mentioned internal addition method or coating machine. The required additives are added to the surface layer.

在本發明所用之多層結構紙基材中,可依需要添加各種內添劑。例如,可使用如松香系膠劑、烷基乙烯酮二聚體、烯基丁二酸酐等之製紙用天然及合成內添膠劑,以及各種紙力增強劑、排水度提昇劑、聚醯胺聚胺環氧氯丙烷等耐水化劑,及消泡劑、滑石等之填料及染料等。In the multilayer structured paper substrate used in the present invention, various internal additives may be added as needed. For example, natural and synthetic internal glues for paper making such as rosin-based glues, alkyl ketene dimers, alkenyl succinic anhydrides, and the like, as well as various paper strength enhancers, drainage improvers, and polyamines can be used. A water-resistant agent such as a polyamine epichlorohydrin, a filler such as an antifoaming agent or talc, and a dye.

在本發明之紙座中,為提高紙基材裡面之與底帶的接著性及細毛防止效果,亦可將選自於聚乙烯醇、澱粉、聚丙烯醯胺、丙烯酸系樹脂、苯乙烯-丁二烯系樹脂、苯乙烯-異戊二烯系樹脂、聚酯系樹脂、乙烯-乙酸乙烯系樹脂、乙酸乙烯-乙烯醇系樹脂、胺甲酸酯系樹脂等之1種以上適宜地塗布於紙基材裡面。又,上述裡面用塗布劑之塗布機構可使用例如棒塗機、刮刀塗布機、氣刀式塗布機、棍塗機、輥塗機(如閘輥塗布機、施膠壓塗機及壓光塗布機等)、及雙面刮刀塗布機或輥刀合一塗布機等。In the paper holder of the present invention, in order to improve the adhesion to the bottom tape and the fine hair preventing effect in the paper substrate, it may also be selected from the group consisting of polyvinyl alcohol, starch, polypropylene decylamine, acrylic resin, styrene- One or more types of the butadiene-based resin, the styrene-isoprene-based resin, the polyester-based resin, the ethylene-vinyl acetate-based resin, the vinyl acetate-vinyl alcohol-based resin, and the urethane-based resin are suitably coated. Inside the paper substrate. Further, as the coating means for the above-mentioned coating agent, for example, a bar coater, a knife coater, an air knife coater, a stick coater, a roll coater (such as a gate roll coater, a size press coater, and a calender coating) can be used. Machine, etc., and double-sided blade coater or roll-to-roller coater.

本發明之晶片型電子零件收納紙座之坪量(每單位面積之質量),係由收納於其中之晶片型電子零件的尺寸來決定,一般最好是200~1000g/m2 左右。具有此範圍內之坪量之紙基材的抄造方法最好是使用容易適應所期望之坪量的多層抄造。在本發明之紙座中,浸透有含有水溶性高分子之表面處理劑的表層最好是形成為50~150g/m2 範圍內之坪量。The amount of the wafer-type electronic component storage paper holder of the present invention (the mass per unit area) is determined by the size of the wafer-type electronic component housed therein, and is generally preferably about 200 to 1000 g/m 2 . The papermaking method of the paper substrate having the basis amount in this range is preferably a multi-layer papermaking which is easy to adapt to the desired basis weight. In the paper holder of the present invention, the surface layer impregnated with the surface treatment agent containing the water-soluble polymer is preferably formed in a range of from 50 to 150 g/m 2 .

【實施例】[Examples]

藉由下述實施例詳細說明本發明,但本發明之範圍不限定於該等實施例。另,顯示調配、濃度等數值係以固形量或有效成分之質量為基準的數值。又,在全例中,係依JIS P8111對業經抄造之紙進行前處理後,測定下述事項。這些事項之測定條件如下。The invention is illustrated in detail by the following examples, but the scope of the invention is not limited to the examples. In addition, values such as blending and concentration are displayed as values based on the solid amount or the mass of the active ingredient. Further, in the whole example, the paper was subjected to pretreatment according to JIS P8111, and the following matters were measured. The measurement conditions for these matters are as follows.

<表面處理劑之浸透深度的測定方法(1)> 以預定方法將相對於表面處理劑顏色調配2%之螢光染料(日本化藥(股)製Kayahor PBS Liquid)的表面處理劑塗布於紙座,使紙座切面中之表面處理劑發出螢光色,藉由顯微鏡測定其浸透深度。<Method for Measuring the Penetration Depth of Surface Treatment Agents (1)> Applying a surface treatment agent of 2% of a fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) to a paper holder in a predetermined manner to fluoresce the surface treatment agent in the cut surface of the paper seat Color, the depth of penetration was measured by a microscope.

<表面處理劑之浸透深度的測定方法(2)> 以超薄切片機製作試料之垂直切面,對所得之切面進行顯微ATR成像測定。顯微ATR成像裝置係使用Spotlight300(PerkinElmer公司製),在使用Ge結晶、分解能8cm-1 、像素尺寸1.56μm角、累計次數2次、測定波長區域4000~680cm-1 、測定面積200×150μm(128×96像素)的條件下,測定表面處理劑之浸透深度。<Method for Measuring the Penetration Depth of Surface Treatment Agent (2)> A vertical section of the sample was prepared by an ultramicrotome, and the obtained section was subjected to microscopic ATR imaging measurement. The imaging system using the microscopic ATR apparatus Spotlight300 (PerkinElmer Inc.), using the Ge crystal, the decomposition can 8cm -1, pixel size 1.56μm angle, accumulated times 2, measurement wavelength region of 4000 ~ 680cm -1, measurement area 200 × 150μm ( The penetration depth of the surface treatment agent was measured under the conditions of 128 × 96 pixels.

<表面處理劑之浸透深度的測定方法(3)> 以垂直切片機製作試料之垂直切面,在該切面上滴下10μl之碘-硼酸丙酮溶液(碘0.1%、硼酸飽和)使其呈色,滴流後進行呈色之狀態觀察,測定聚乙烯醇之浸透深度。<Method for Measuring the Penetration Depth of Surface Treatment Agents (3)> The vertical section of the sample was prepared by a vertical slicer, and 10 μl of an iodine-boric acid acetone solution (iodine 0.1%, boric acid saturation) was dropped on the cut surface to cause coloring, and the state of coloring was observed after dripping, and polyvinyl alcohol was measured. Soaking depth.

<表面處理劑之浸透深度的測定方法(4)> 以垂直切片機製作試料之垂直切面,將1%碘溶液裝入 燒杯,將切面向下載置於燒杯之開口面,以100℃進行加熱。進行此時之切面之呈色的狀態觀察,測定澱粉之浸透深度。<Method for Measuring the Penetration Depth of Surface Treatment Agents (4)> Prepare the vertical section of the sample with a vertical slicer and load the 1% iodine solution The beaker was placed on the open side of the beaker and heated at 100 °C. The state of coloration of the cut surface at this time was observed, and the penetration depth of starch was measured.

<平滑度之測定方法> 二維表面粗糙度儀:使用SurfcorderSE-3C(小坂研究所製),測定供試紙基材或紙座之凹部開口側表面(與蓋帶相接之表面)的中心線平均表面粗糙度(Ra)。<Method for measuring smoothness> Two-dimensional surface roughness meter: The center line average surface roughness (Ra) of the open side surface of the concave portion of the test paper substrate or the paper seat (the surface in contact with the cover tape) was measured using a Surfcorder SE-3C (manufactured by Otaru Laboratory). .

<黏度之測定方法> 使用B型黏度計測定表面處理劑之黏度。B型黏度計係在液體中使圓筒或圓盤旋轉時,測量作用於圓筒、圓盤之液體之抗黏性轉矩,以顯現液體之黏度。<Method for measuring viscosity> The viscosity of the surface treatment agent was measured using a B-type viscometer. The B-type viscometer measures the anti-adhesive torque of the liquid acting on the cylinder and the disc when the cylinder or the disc is rotated in the liquid to visualize the viscosity of the liquid.

<剝離強度之測定方法> 將收納晶片型電子零件之紙座切成8mm寬之帶狀,依電子資訊技術產業協會規格JEITA ET-7103,藉由壓製成型形成與電容器晶片大小0603相對應之袋狀凹部。使用日東電工(股)製之蓋帶(No.318H-14A(商標)、聚對苯二甲酸乙二酯(PET)與乙烯-乙酸乙烯酯共聚物(EVA)之共押出層疊膜:寬5.25mm、厚53μm)作為蓋帶,並使用日東電工(股)製之熱封材:商標NST-35,熱封溫度155℃、施加於試料之熱封壓力1.5MPa、38000拍(takt)的條件下,從由被蓋帶覆蓋之側緣至內側0.5mm的位置起,將前述蓋帶於紙座表面熱封成為寬0.4mm且間隔3.0mm之軌道狀。之後約1小時後,依JIS C 0806-3之方法(剝離速度300mm/min、測定時間12秒、供試試料數n:10個)測定紙座表面與蓋帶的剝離強 度,並求出測定值之平均值。<Method for measuring peel strength> The paper holder accommodating the wafer type electronic component was cut into a strip shape of 8 mm wide, and a pocket-shaped recess corresponding to the capacitor wafer size 0603 was formed by press molding according to the Electronic Information Technology Industry Association specification JEITA ET-7103. Nitto Electric Co., Ltd. cover tape (No.318H-14A (trademark), polyethylene terephthalate (PET) and ethylene-vinyl acetate copolymer (EVA) co-extruded laminated film: 5.25 wide Mm, thickness 53 μm) as a cover tape, and using the heat sealing material manufactured by Nitto Denko Co., Ltd.: trademark NST-35, heat sealing temperature 155 ° C, heat sealing pressure applied to the sample 1.5 MPa, 38000 beats (takt) Next, from the side edge covered by the cover tape to the inner side of 0.5 mm, the cover tape was heat-sealed on the surface of the paper seat to have a track shape of 0.4 mm in width and 3.0 mm in interval. After about 1 hour, the peeling strength of the surface of the paper seat and the cover tape was measured according to the method of JIS C 0806-3 (peeling speed 300 mm/min, measurement time 12 seconds, number of test materials n: 10). Degree, and the average value of the measured values is obtained.

<防止細毛產生性> 以目視確認測定剝離強度後之熱封部的細毛產生狀態。<Preventing fine hair production> The state of fine hair generation of the heat seal portion after the peel strength was measured was visually confirmed.

4:無法在觀察面上看到起毛。4: Unable to see fluff on the observation surface.

3:可在觀察面上看到起1~3根細毛。3: 1 to 3 fine hairs can be seen on the observation surface.

2:可在觀察面上看到起4~8根細毛。2: 4 to 8 fine hairs can be seen on the observation surface.

1:可在觀察面上看到全面起毛。1: Full fluff can be seen on the observation surface.

實施例1及2Examples 1 and 2

在各個實施例1及2中,藉由相異之紙漿形成紙基材之表層、中層、裡層。即,打碎分解LBKP100%,調製加拿大游離度(Canadian Standard Freeness)400ml的紙漿用於表層。此時,L1/L2比=0.34。調配NBKP20%、LBKP80%,進行混合打碎分解,調製加拿大游離度350ml的紙漿用於中層。分別在紙漿漿體中添加硫酸鋁,調整為pH6.0,再添加0.3%之聚丙烯醯胺(荒川化學製POLYSTRON-1250)作為內添紙力增強劑。將各上述紙漿漿體供至短網抄紙機,將坪重調製成表層:100g/m2 、中層:200g/m2 、及裡層:50g/m2 ,再藉由合抄法進行抄紙,將所得之3層原紙以設置於抄紙機之壓光機進行平滑化處理後,將含有由聚丙烯醯胺(荒川化學製POLYMERSET-512(商標)、分子量20萬)構成之表面處理劑的塗布液,調製成在實施例1中為溫度:60℃、表面處理劑濃度:3.6%、黏度:6mPa.s,在實施例2中為表面處理劑濃度:5.0%、黏度:8mPa.s,並將該塗布液塗布於原紙, 塗布量在實施例1中為0.72g/m2 ,在實施例2中為1.00g/m2 ,製造出實施例1及2皆為坪量350g/m2 、厚度0.42mm之晶片型電子零件收納紙座用紙基體。此時,表面處理劑之浸透深度(浸透深度之測定方法(2))在實施例1中為63μm,在實施例2中為52μm。在與上述相同之表面處理劑塗布液中調配2%之螢光染料(日本化藥(股)製Kayahor PBS Liquid),測定發出螢光色之浸透深度,結果浸透深度之測定值在實施例1中為65μm,在實施例2中為55μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)在實施例1中為3.35μm,在實施例2中為3.22μm。In each of Examples 1 and 2, the surface layer, the middle layer, and the inner layer of the paper substrate were formed by using different pulps. That is, the pulp was decomposed and decomposed into LBKP by 100%, and 400 ml of Canadian Standard Freeness was prepared for the surface layer. At this time, the L1/L2 ratio is = 0.34. The NBKP 20% and LBKP 80% were blended, and the mixture was broken and decomposed to prepare a pulp having a Canadian freeness of 350 ml for the middle layer. Aluminum sulfate was added to the pulp slurry to adjust to pH 6.0, and 0.3% of polyacrylamide (POLSTST-1250 manufactured by Arakawa Chemical Co., Ltd.) was added as an internal paper strength enhancer. Each of the above pulp pulps is supplied to a short-web paper machine, and the floor weight is adjusted into a surface layer: 100 g/m 2 , a middle layer: 200 g/m 2 , and an inner layer: 50 g/m 2 , and papermaking is carried out by a combination method. The obtained three-layer base paper was subjected to a smoothing treatment by a calender placed in a paper machine, and then coated with a surface treatment agent composed of polypropylene decylamine (POLYMERSET-512 (trademark) manufactured by Arakawa Chemical Co., Ltd., molecular weight: 200,000). The liquid was prepared to have a temperature of 60 ° C in the first embodiment, a surface treatment agent concentration of 3.6%, and a viscosity of 6 mPa. s, in Example 2, the surface treatment agent concentration: 5.0%, viscosity: 8 mPa. s, the coating liquid was applied to the base paper, and the coating amount was 0.72 g/m 2 in Example 1, and 1.00 g/m 2 in Example 2 , and both of Examples 1 and 2 were produced in a basis weight of 350 g/ A paper base for a wafer type electronic component storage paper holder having a m 2 and a thickness of 0.42 mm. At this time, the penetration depth of the surface treatment agent (method (2) for measuring the penetration depth) was 63 μm in Example 1, and 52 μm in Example 2. 2% of a fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) was blended in the same surface treatment agent coating liquid as described above, and the depth of penetration of the fluorescent color was measured. As a result, the measured value of the penetration depth was as in Example 1. The middle was 65 μm, and in Example 2, it was 55 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.35 μm in Example 1, and 3.22 μm in Example 2.

將分別在實施例1及2中所得到之紙基材裁切成寬8mm之帶狀,依JIS C 0806-3對其進行同時形成下述晶片型電子零件收納凹部及紙座移送圓孔(通孔)的步驟,製造出晶片型電子零件收納紙座。The paper substrate obtained in each of Examples 1 and 2 was cut into a strip shape having a width of 8 mm, and the following wafer type electronic component housing recess and paper holder transfer hole were simultaneously formed in accordance with JIS C 0806-3 ( The step of the through hole) is to manufacture a wafer type electronic component storage paper holder.

(1)形成收納凹部 形成凹部:使用壓花機(日本自動機械公司製,模型:AC505S型)及模具(日本自動機械公司製,模型0603)。 凹部形狀尺寸:CD方向:0.66mm MD方向:0.36mm深度:0.66mm之有底、角形壓製袋狀(1) Forming a housing recess The concave portion was formed: an embossing machine (manufactured by Nippon Seiki Co., Ltd., model: AC505S type) and a mold (manufactured by Nippon Kagaku Co., Ltd., model 0603) were used. Recessed shape size: CD direction: 0.66mm MD direction: 0.36mm Depth: 0.66mm bottomed, angled pressed bag

(2)紙座移送用圓形通孔:直徑1.55mm之通孔(2) Circular through hole for paper holder transfer: through hole with a diameter of 1.55mm

實施例3Example 3

以與實施例1~2相同的方法製造坪量350g/m2 、厚度0.42mm之晶片型電子零件收納紙座。其中,表面處理劑塗布液係將聚丙烯醯胺(荒川化學製POLYMERSET-512(商標)、分子量20萬)、與苯乙烯-順丁烯二酸共聚物樹脂(荒川化學製POLYMARON-382(商標))以固形量質量比率100:4混合,將表面處理劑塗布液調整成溫度:60℃、表面處理劑濃度:4.8%、黏度:7mPa.s,然後將其塗布於原紙。此時,塗布量為聚丙烯醯胺固形量:0.92g/m2 ,苯乙烯-順丁烯二酸共聚物樹脂固形量:0.04g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為77μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為80μm。又,所得之紙基體之表面的中心線平均粗糙度(Ra)為3.41μm。A wafer type electronic component storage paper holder having a basis weight of 350 g/m 2 and a thickness of 0.42 mm was produced in the same manner as in the first to second embodiments. Among them, the surface treatment agent coating liquid is polypropylene decylamine (POLYMERSET-512 (trademark) manufactured by Arakawa Chemical Co., Ltd., molecular weight: 200,000), and styrene-maleic acid copolymer resin (POLYMARON-382 (trademark, manufactured by Arakawa Chemical Co., Ltd.) )) The surface treatment agent coating liquid was adjusted to a temperature of 60 ° C, a surface treatment agent concentration of 4.8%, and a viscosity of 7 mPa in a solid mass ratio of 100:4. s, then apply it to the base paper. At this time, the coating amount was a solid amount of polypropylene decylamine: 0.92 g/m 2 , and a solid content of the styrene-maleic acid copolymer resin: 0.04 g/m 2 . The depth of penetration of the surface treatment agent at this time (measurement method (2) of the penetration depth) was 77 μm. A fluorescent dye (Kayahor PBS Liquid, manufactured by Nippon Kayaku Co., Ltd.) was prepared in the same surface treatment agent coating solution as that described above: 2%, and the penetration depth of the fluorescent color was measured. As a result, the measured value of the penetration depth was 80 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.41 μm.

實施例4Example 4

以與實施例3相同的方法製造晶片型電子零件收納紙座。其中,表面處理劑塗布液成分係使用烯烴-順丁烯二酸共聚物樹脂(荒川化學製POLYMARON-482(商標))來代替苯乙烯-順丁烯二酸共聚物樹脂,並使用表面處理劑濃度:4.6%、黏度:7mPa.s之塗布液。此時,塗布量在聚丙烯醯胺方面為0.89g/m2 ,在烯烴-順丁烯二酸共聚物樹脂方面為0.04g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為72μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測 定發出螢光色之浸透深度,結果浸透深度之測定值為75μm。又,所得之紙基材之中心線平均粗糙度(Ra)為3.40μm。A wafer type electronic component storage paper holder was produced in the same manner as in the third embodiment. In the surface treatment agent coating liquid component, an olefin-maleic acid copolymer resin (POLYMARON-482 (trademark) manufactured by Arakawa Chemical Co., Ltd.) is used instead of the styrene-maleic acid copolymer resin, and a surface treatment agent is used. Concentration: 4.6%, viscosity: 7mPa. s coating solution. At this time, the coating amount was 0.89 g/m 2 in terms of polypropylene decylamine and 0.04 g/m 2 in terms of olefin-maleic acid copolymer resin. The depth of penetration of the surface treatment agent (method (2) for measuring the penetration depth) at this time was 72 μm. A fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) was prepared in the same surface treatment agent coating solution as above: 2%, and the penetration depth of the fluorescent color was measured, and the measured value of the penetration depth was 75 μm. Further, the center line average roughness (Ra) of the obtained paper substrate was 3.40 μm.

實施例5Example 5

以與實施例3相同的方法製造晶片型電子零件收納紙座。其中,表面處理劑塗布液係使用將聚乙烯醇(Kuraray製PVA117(商標))、與苯乙烯-順丁烯二酸共聚物樹脂(荒川化學製、POLYMARON-382(商標))以固形量質量比率100:4的比例混合者,調製表面處理劑塗布液溫度:60℃、表面處理劑濃度:4.5%、黏度:7mPa.s的塗布液,然後將其塗布於前述厚紙。此時,塗布量在聚乙烯醇方面為0.86g/m2 ,在苯乙烯-順丁烯二酸共聚物樹脂方面為0.04g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為73μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為75μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為3.16μm。A wafer type electronic component storage paper holder was produced in the same manner as in the third embodiment. In the surface treatment agent coating liquid, polyvinyl alcohol (PVA117 (trademark) manufactured by Kuraray) and styrene-maleic acid copolymer resin (manufactured by Arakawa Chemical Co., Ltd., POLYMARON-382 (trademark)) were used in a solid mass. Ratio of 100:4 ratio mixture, modulation surface treatment agent coating liquid temperature: 60 ° C, surface treatment agent concentration: 4.5%, viscosity: 7 mPa. The coating liquid of s is then applied to the aforementioned thick paper. At this time, the coating amount was 0.86 g/m 2 in terms of polyvinyl alcohol and 0.04 g/m 2 in terms of styrene-maleic acid copolymer resin. The depth of penetration of the surface treatment agent (method (2) for measuring the penetration depth) at this time was 73 μm. A fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) was prepared in the same surface treatment agent coating solution as above: 2%, and the penetration depth of the fluorescent color was measured, and the measured value of the penetration depth was 75 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.16 μm.

實施例6Example 6

以與實施例1相同的方法製造坪量350g/m2 、厚度0.42mm之晶片型電子零件收納紙座。其中,塗布液用表面處理劑係使用聚乙烯醇(Kuraray製PVA117(商標)),調製溫度:60℃、聚乙烯醇濃度:3.7%、黏度:7mPa.s的塗布液,然後將其塗布於原紙。此時,塗布量在聚乙烯醇方面為0.75g/m2 。藉由浸透深度之測定方法(3)測定表面處理劑之 浸透深度,結果浸透深度為55μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為3.30μm。A wafer type electronic component storage paper holder having a basis weight of 350 g/m 2 and a thickness of 0.42 mm was produced in the same manner as in the first embodiment. The surface treatment agent for the coating liquid is polyvinyl alcohol (PVA117 (trademark) manufactured by Kuraray), and the preparation temperature is 60 ° C, the polyvinyl alcohol concentration is 3.7%, and the viscosity is 7 mPa. The coating liquid of s is then applied to the base paper. At this time, the coating amount was 0.75 g/m 2 in terms of polyvinyl alcohol. The penetration depth of the surface treatment agent was measured by the measurement method (3) of the penetration depth, and as a result, the penetration depth was 55 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.30 μm.

實施例7Example 7

以與實施例1相同的方法製造坪量350g/m2 、厚度0.42mm之晶片型電子零件收納紙座。其中,表面處理劑係使用澱粉(王子Cornstarch製Ace K(商標)),調製呈色溫度:60℃、澱粉濃度:4.2%、黏度:7mPa.s的塗布液,然後將其塗布於原紙。此時,塗布量在澱粉方面為0.70g/m2 。藉由測定方法(4)測定浸透深度,結果為53μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為3.25μm。A wafer type electronic component storage paper holder having a basis weight of 350 g/m 2 and a thickness of 0.42 mm was produced in the same manner as in the first embodiment. Among them, the surface treatment agent used starch (Ace K (trademark) made by Prince Cornstarch), and the color temperature was 60 ° C, the starch concentration was 4.2%, and the viscosity was 7 mPa. The coating liquid of s is then applied to the base paper. At this time, the coating amount was 0.70 g/m 2 in terms of starch. The depth of penetration was measured by the measurement method (4) and found to be 53 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.25 μm.

比較例1Comparative example 1

以與實施例2相同的方法製造晶片型電子零件收納紙座。其中,係打碎分解與實施例2中所用之LBKP不同之LBK100%,調製加拿大游離度:400ml之表層用紙漿。此時,L1/L2比=0.45。表面處理劑之塗布量為0.95g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為38μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為40μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為2.93μm。A wafer type electronic component storage paper holder was produced in the same manner as in the second embodiment. Among them, the LBK 100% which is different from the LBKP used in Example 2 was broken and the Canadian freeness: 400 ml of the surface layer pulp was prepared. At this time, the L1/L2 ratio = 0.45. The coating amount of the surface treatment agent was 0.95 g/m 2 . The penetration depth (method (2) for measuring the penetration depth) of the surface treatment agent at this time was 38 μm. A fluorescent dye (Kayahor PBS Liquid, manufactured by Nippon Kayaku Co., Ltd.) was added to the same surface treatment agent coating liquid as described above: 2%, and the penetration depth of the fluorescent color was measured. As a result, the measured value of the penetration depth was 40 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 2.93 μm.

比較例2Comparative example 2

以與實施例1相同的方法製造晶片型電子零件收納紙座。其中,表面處理劑係使用聚丙烯醯胺(荒川化學製、POLYMERSET-512(商標)、分子量20萬),調製溫度:20℃、 聚丙烯醯胺濃度:3.6%、黏度:11mPa.s的塗布液,然後將其塗布於原紙。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為37μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為40μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為2.80μm。A wafer type electronic component storage paper holder was produced in the same manner as in the first embodiment. Among them, the surface treatment agent is polypropylene decylamine (manufactured by Arakawa Chemical Co., Ltd., POLYMERSET-512 (trademark), molecular weight: 200,000), and the temperature is 20 ° C. Polyacrylamide concentration: 3.6%, viscosity: 11mPa. The coating liquid of s is then applied to the base paper. The depth of penetration of the surface treatment agent (method of measuring the depth of penetration (2)) at this time was 37 μm. A fluorescent dye (Kayahor PBS Liquid, manufactured by Nippon Kayaku Co., Ltd.) was added to the same surface treatment agent coating liquid as described above: 2%, and the penetration depth of the fluorescent color was measured. As a result, the measured value of the penetration depth was 40 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 2.80 μm.

比較例3Comparative example 3

以與實施例3相同的方法製造晶片型電子零件收納紙座。打碎分解與實施例3不同之LBKP100%,調製加拿大游離度400ml的紙漿用於表層。此時,L1/L2比=0.45。又,表面處理劑係將聚丙烯醯胺(荒川化學製、POLYMERSET-512(商標)、分子量20萬)、與苯乙烯-順丁烯二酸共聚物樹脂(荒川化學製、POLYMARON-382(商標))以固形量比率100:4的比例混合使用,調製塗布液溫度:60℃、表面處理劑濃度:4.8%、黏度:7mPa.s的塗布液,然後將其塗布於原紙。此時之塗布量在聚丙烯醯胺方面為0.90g/m2 ,在苯乙烯-順丁烯二酸共聚物樹脂方面為0.04g/m2 。本表面處理劑之浸透深度(浸透深度之測定方法(2))為45μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為48μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為2.89μm。A wafer type electronic component storage paper holder was produced in the same manner as in the third embodiment. The LBKP 100% different from that of Example 3 was broken up, and a pulp having a Canadian freeness of 400 ml was prepared for the surface layer. At this time, the L1/L2 ratio = 0.45. Further, the surface treatment agent is a polypropylene decylamine (manufactured by Arakawa Chemical Co., Ltd., POLYMERSET-512 (trademark), molecular weight: 200,000), and a styrene-maleic acid copolymer resin (manufactured by Arakawa Chemical Co., Ltd., POLYMARON-382 (trademark) )) mixed in a solid content ratio of 100:4, to prepare the coating liquid temperature: 60 ° C, surface treatment agent concentration: 4.8%, viscosity: 7 mPa. The coating liquid of s is then applied to the base paper. The coating amount at this time was 0.90 g/m 2 in terms of polypropylene decylamine and 0.04 g/m 2 in terms of styrene-maleic acid copolymer resin. The depth of penetration of the surface treatment agent (method for measuring the depth of penetration (2)) was 45 μm. A fluorescent dye (Kayahor PBS Liquid, manufactured by Nippon Kayaku Co., Ltd.) was prepared in the same amount of the surface treatment agent coating liquid as described above: 2%, and the penetration depth of the fluorescent color was measured. As a result, the measured value of the penetration depth was 48 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 2.89 μm.

比較例4Comparative example 4

以與實施例3相同的方法製造晶片型電子零件收納紙座。其中,表面處理劑係使用將聚丙烯醯胺(荒川化學製、POLYMERSET-512(商標)、分子量20萬)、與苯乙烯-順丁烯二酸共聚物樹脂(荒川化學製、POLYMARON-382(商標))以固形量比率100:4的比例混合者,調製表面處理劑濃度:6.0%、黏度:11mPa.s的塗布液,然後將其塗布於原紙。此時之塗布量在聚丙烯醯胺方面為1.11g/m2 ,在苯乙烯-順丁烯二酸共聚物樹脂方面為0.04g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為38μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值為40μm。又,所得之紙基材之中心線平均粗糙度(Ra)為2.78μm。A wafer type electronic component storage paper holder was produced in the same manner as in the third embodiment. Among them, a surface treatment agent is a polypropylene decylamine (manufactured by Arakawa Chemical Co., Ltd., POLYMERSET-512 (trademark), molecular weight: 200,000), and a styrene-maleic acid copolymer resin (manufactured by Arakawa Chemical Co., Ltd., POLYMARON-382 ( Trademark)) Mixing in a ratio of solid content ratio of 100:4, adjusting surface treatment agent concentration: 6.0%, viscosity: 11 mPa. The coating liquid of s is then applied to the base paper. The coating amount at this time was 1.11 g/m 2 in terms of polypropylene decylamine and 0.04 g/m 2 in terms of styrene-maleic acid copolymer resin. The penetration depth (method (2) for measuring the penetration depth) of the surface treatment agent at this time was 38 μm. A fluorescent dye (Kayahor PBS Liquid, manufactured by Nippon Kayaku Co., Ltd.) was added to the same surface treatment agent coating liquid as described above: 2%, and the penetration depth of the fluorescent color was measured. As a result, the measured value of the penetration depth was 40 μm. Further, the center line average roughness (Ra) of the obtained paper substrate was 2.78 μm.

比較例5Comparative Example 5

藉由不同之紙漿形成紙基材之表層、中層、裡層。即,在表層中,將NBKP30%、LBKP70%混合打碎分解,使用加拿大游離度:400ml的紙漿。此時,LBKP之L1/L2比=0.34。在中層中,調配NBKP20%、LBKP20%、上質舊紙20%、舊報紙40%,調製加拿大游離度:350ml的紙漿。在裡層中,調配NBKP25%、LBKP25%、舊報紙50%,調製Canada Standard Freeness:350ml的紙漿。於各層用紙漿漿體中添加硫酸鋁,將其pH值調整為6.0,並添加聚丙烯醯胺(荒川化學工業製POLYSTRON-1250):0.3%作為內添紙力增強 劑,將所得之各紙漿漿體供至短網抄紙機,合抄表層:100g/m2 、中層:200g/m2 、及裡層:500g/m2 形成各層原紙,然後將其以設置於抄紙機之壓光機進行平滑化處理後,使用將聚丙烯醯胺(荒川化學製PS117、分子量40萬)與苯乙烯-順丁烯二酸共聚物樹脂(荒川化學製、POLYMARON-382(商標))以100:4的比例混合者,調製成塗布液溫度:20℃、表面處理劑濃度:4.8%、黏度:11mPa.s的塗布液,然後將其塗布於原紙,此時之塗布量在聚丙烯醯胺方面為0.88g/m2 ,在苯乙烯-順丁烯二酸共聚物樹脂方面為0.02g/m2 。此時之表面處理劑之浸透深度(浸透深度之測定方法(2))為42μm。在與上述相同之表面處理劑塗布液中調配螢光染料(日本化藥(股)製Kayahor PBS Liquid):2%,測定發出螢光色之浸透深度,結果浸透深度之測定值在實施例1中為45μm。又,所得之紙基材之表面的中心線平均粗糙度(Ra)為2.97μm。The surface layer, the middle layer, and the inner layer of the paper substrate are formed by different pulps. That is, in the surface layer, NBKP 30% and LBKP 70% were mixed and broken, and a Canadian freeness: 400 ml of pulp was used. At this time, the L1/L2 ratio of LBKP is = 0.34. In the middle layer, NBKP 20%, LBKP 20%, 20% old paper and 40% old newspaper were prepared, and the Canadian freeness: 350 ml pulp was prepared. In the inner layer, NBKP 25%, LBKP 25%, and old newspaper 50% were prepared, and the Canadian Standard Freeness: 350 ml pulp was prepared. Aluminum sulfate was added to the pulp slurry in each layer, and the pH was adjusted to 6.0, and polypropylene decylamine (POLYSTRON-1250, manufactured by Arakawa Chemical Industry Co., Ltd.) was added: 0.3% as an internal paper strength enhancer, and the obtained pulp was obtained. The slurry is supplied to a short-web paper machine, and the surface layer is 100 g/m 2 , the middle layer is 200 g/m 2 , and the inner layer is 500 g/m 2 to form each layer of base paper, which is then subjected to a calender set in a paper machine. After the smoothing treatment, polypropylene decylamine (PS117 manufactured by Arakawa Chemical Co., Ltd., molecular weight: 400,000) and styrene-maleic acid copolymer resin (manufactured by Arakawa Chemical Co., Ltd., POLYMARON-382 (trademark)) were used at a ratio of 100:4. Proportioned mixture, prepared into coating liquid temperature: 20 ° C, surface treatment agent concentration: 4.8%, viscosity: 11 mPa. The coating liquid of s was then applied to the base paper at a time when the coating amount was 0.88 g/m 2 in terms of polypropylene decylamine and 0.02 g/m 2 in terms of styrene-maleic acid copolymer resin. The depth of penetration of the surface treatment agent (method (2) for measuring the penetration depth) at this time was 42 μm. A fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) was prepared in the same surface treatment agent coating solution as above: 2%, and the penetration depth of the fluorescent color was measured, and the measured value of the penetration depth was as in Example 1. The medium is 45 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 2.97 μm.

前述實施例及比較例之表層L1/L2比、表面處理劑之濃度、黏度、浸透深度、紙基材之中心線平均粗糙度(Ra)、平滑度、剝離強度及細毛產生狀態的測定結果顯示於表1。The measurement results of the surface layer L1/L2 ratio, the concentration of the surface treatment agent, the viscosity, the penetration depth, the center line average roughness (Ra) of the paper substrate, the smoothness, the peel strength, and the fine hair generation state of the above examples and comparative examples are shown. In Table 1.

由表1可知,即使剝離強度強,本發明之實施例1~7之晶片型電子零件收納紙座也不會產生細毛。本發明之晶片型電子零件收納紙座在從該處剝離用以封住電子零件收納凹部之開口部的蓋帶時,不會或極少產生細毛,因此具有以下效果:收納於前述凹部之晶片型電子零件不會受到細毛污染,且由貼片機取出晶片時,也不會發生吸嘴被細毛堵塞的狀況。As is clear from Table 1, even if the peeling strength is strong, the wafer-type electronic component storage paper holders of Examples 1 to 7 of the present invention do not generate fine hair. In the wafer-type electronic component storage paper holder of the present invention, when the cover tape for sealing the opening of the electronic component housing recess is peeled off from this point, fine hair is not generated or rarely generated, and therefore, the wafer type accommodated in the concave portion is obtained. Electronic parts are not contaminated by fine hair, and when the wafer is taken out by the placement machine, the nozzle is not blocked by fine hair.

產業上利用之可能性Industrial use possibility

本發明之晶片型電子零件收納紙座係電子零件不會受到該處所產生之細毛污染,也不會使貼片機之吸嘴堵塞,故具有很高的實用上的效果。The electronic component of the wafer type electronic component storage paper holder of the present invention is not contaminated by the fine hair generated in the place, and does not block the nozzle of the placement machine, so that it has a high practical effect.

Claims (3)

一種晶片型電子零件收納紙座,係包含有紙基材、及形成於該紙基材之用以收納晶片型電子零件之複數凹部者,前述紙基材具有包含表層、中層及裡層的多層紙板結構,且於前述基材之凹部開口側表面塗布有表面處理劑之紙座;前述表面處理劑,含有至少一種選自於聚乙烯醇、澱粉、聚丙烯醯胺之水溶性高分子,且具有調整至4~10mPa.s之黏度;前述表面處理劑之塗布量為0.1~1.1g/m2 ;前述經塗布之表面處理劑,於前述紙基材中,從前述表面浸透至50~100μm之深度;又,前述紙基材之前述凹部開口側表面之中心線粗糙度(Ra)調整為3μm~6μm。A wafer type electronic component storage paper holder comprising a paper substrate and a plurality of concave portions formed on the paper substrate for accommodating the wafer type electronic component, wherein the paper substrate has a plurality of layers including a surface layer, a middle layer and an inner layer a paperboard structure, wherein a surface of the concave side of the substrate is coated with a surface treatment agent; the surface treatment agent contains at least one water-soluble polymer selected from the group consisting of polyvinyl alcohol, starch, and polypropylene decylamine, and With adjustment to 4~10mPa. The viscosity of s; the coating amount of the surface treatment agent is 0.1 to 1.1 g / m 2 ; the coated surface treatment agent is soaked from the surface to a depth of 50 to 100 μm in the paper substrate; The center line roughness (Ra) of the opening side surface of the concave portion of the substrate is adjusted to be 3 μm to 6 μm. 如申請專利範圍第1項之晶片型電子零件收納紙座,其中前述表面處理劑含有前述水溶性高分子,並含有苯乙烯-順丁烯二酸共聚物樹脂或烯烴-順丁烯二酸共聚物樹脂。 The wafer type electronic component storage paper holder according to the first aspect of the invention, wherein the surface treatment agent contains the water-soluble polymer and contains a styrene-maleic acid copolymer resin or an olefin-maleic acid copolymer. Resin. 如申請專利範圍第1項之晶片型電子零件收納紙座,其中形成前述紙基材之表層的紙漿纖維為闊葉木牛皮紙漿,且其內腔寬度(L1)/纖維寬度(L2)之比在0.4以下。 The wafer type electronic component storage paper holder of claim 1, wherein the pulp fiber forming the surface layer of the paper substrate is a hardwood kraft pulp, and the ratio of the inner cavity width (L1) / the fiber width (L2) is 0.4 or less.
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