JP7245148B2 - CARRIER TAPE BASE FOR CHIP-LIKE ELECTRONIC PARTS AND MANUFACTURING METHOD THEREOF - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a carrier tape mount for chip-shaped electronic components and a manufacturing method thereof. More particularly, it relates to a carrier tape mount for chip-shaped electronic components and a carrier tape for chip-shaped electronic components, in which variation in peel strength is small when the cover tape is peeled off and fluffing from the mount is suppressed.

2. Description of the Related Art Conventionally, chip-shaped electronic components are automatically mounted on printed circuit boards in order to achieve automatic production of various electronic devices. In the step of automatically mounting chip-like electronic components, chip-like electronic components are supplied one by one to a printed wiring board using a chip component mounter or the like, and are automatically mounted on the printed wiring board. In this automatic mounting process, in order to facilitate handling of the chip-like electronic components, a tape-like packaging body is used in which individual chip-like electronic components are wrapped in a tape-like carrier.

In the taping package, concave or perforated loading portions (hereinafter sometimes simply referred to as “loading portions”) for loading chip-like electronic components are formed on a carrier tape mount at regular intervals, and the loading portions are After loading predetermined chip-shaped electronic components into the container, the container is sealed with a cover tape. The loading section is generally provided in a rectangular shape and is sometimes called a press pocket, a pocket, a cavity, or the like.

The taped package loaded with chip-shaped electronic components is conveyed in a reel shape, the cover tape is continuously peeled off by an automatic machine for mounting chip-shaped electronic components, and the chip-shaped electronic components are sequentially taken out from the carrier tape mount. automatically mounted at a predetermined position on the printed wiring board.

Carrier tape mounts are roughly classified into those made of plastic and those made of paper. Paper is desirable in terms of manufacturing cost, non-static property, ease of disposal after use, and the like. As a carrier tape mount made of paper, one made of single-layer or multi-layer paperboard is known (see, for example, Patent Documents 1 to 3).

Japanese Patent Application Laid-Open No. 09-188385 JP 2005-313946 A JP-A-2008-230651

Paper-made carrier tape mounts such as those disclosed in Patent Documents 1 to 3 are required to have small variations in the peel strength of the cover tape. However, it cannot be solved only by changing the chemical applied to the surface, nor can it be dealt with only by changing the adhesive temperature, pressure, speed, etc. In addition, increasing the peel strength causes fuzz to occur, making it difficult to balance quality. is a major operational problem.

In addition, if the carrier tape mount made of paper is poor in texture, there will be a difference in the distribution of the pulp amount at the time of papermaking, and unevenness will occur due to local differences in the pulp amount. Even paper with poor texture is generally made uniform in thickness by calendering. and locally low-density portions. In such a situation, after the carrier tape mount is made into paper, the uneven state of the surface may change due to factors such as atmospheric humidity and aging until the taped package is manufactured using the carrier tape mount. . For example, when moisture is added due to atmospheric humidity, etc., the unevenness of the surface may become larger than the unevenness of the surface immediately after papermaking, because the locally dense areas of paper with poor formation tend to swell more easily. . On the other hand, when moisture is released due to atmospheric humidity, etc., the unevenness of the surface may become larger than the unevenness of the surface immediately after papermaking, because the locally low-density parts of paper with poor formation tend to shrink more easily. . In addition, due to the restoring force of paper over time, the unevenness of the surface flattened by calendering may be restored, and the unevenness of the surface may become larger than the unevenness of the surface immediately after papermaking. For this reason, in paper with poor texture, the unevenness of the surface at the time of manufacturing (papermaking) of the carrier tape mount or at the time of shipment, and the surface unevenness at the time of manufacturing the taping package using the carrier tape mount. It may be different from the uneven state. Therefore, it has been desired to easily perform texture evaluation that is not affected by changes in the uneven state of the surface of the mount due to factors such as atmospheric humidity and aging.

In addition, the texture of the paper affects variations in the peel strength when the cover tape is peeled off from the taped package formed using the carrier tape mount and the generation of fluff from the mount. For example, the better the formation, that is, the smaller the formation index, the smaller the variation in peel strength. tends to be easier. On the other hand, the worse the formation, that is, the higher the formation index, the greater the variation in peel strength. There is a tendency. Therefore, it has been desired to provide a carrier tape mount that causes less fluffing while reducing variations in peel strength.

In view of such problems, the present disclosure can easily perform formation evaluation that is not affected by changes in the unevenness of the surface due to factors such as atmospheric humidity or aging, and the peel strength when peeling off the cover tape. To provide a carrier tape mount for chip-like electronic components, which has small variations and suppresses fluff from the mount. Another object of the present disclosure is to provide a carrier tape mount that is excellent in processability.

Other objects and effects of the present disclosure will be easily understood by those skilled in the art by referring to the following description.

In order to solve the above problems, the present inventors set the formation index measured by the total β-ray ground to 1 or less to reduce the variation in the peel strength when the cover tape is peeled off, while reducing the variation in the peel strength of the cover tape of the base paper. The inventors have found that fluffing from the backing paper can be suppressed by adding a water-soluble polymer to the surface in contact with the base paper, and have completed the present invention. That is, the carrier tape mount for chip-shaped electronic components according to the present invention has a base paper containing pulp as a main component, the ash content of the base paper is 1% or less, and the basis weight of the base paper is 350 g/m. In the carrier tape mount for chip-like electronic components of less than ² , the surface of the base paper in contact with the cover tape contains a water-soluble polymer, and the texture index measured by the total β-ray ground is 0.5 or more and 1 or less. It is characterized by By adopting such a configuration, variations in peel strength when the cover tape is peeled off are small, and fluffing from the backing paper can be suppressed.

In the carrier tape mount for chip-like electronic parts according to the present invention, it is preferable that the water-soluble polymer contains at least one selected from starch, modified starch, and polyvinyl alcohol resin. With such a configuration, it is possible to suppress fluff from the mount.

In the carrier tape mount for chip-shaped electronic components according to the present invention, the coating amount of the water-soluble polymer on the surface in contact with the cover tape is 0.25 to 3.0 g/m ² in terms of solid content. preferable. The occurrence of fluff can be further suppressed.

In the carrier tape mount for chip-shaped electronic components according to the present invention, it is preferable that the base paper is a multi-layered paper having three or more layers. The formation index measured by the β-ray ground total can be set to 1 or less more reliably.

In the carrier tape mount for chip-shaped electronic components according to the present invention, it is preferable that the carrier tape mount for chip-shaped electronic components has a moisture content of 6 to 11% by mass. The cushioning property of the mount becomes appropriate, and the adhesion of the cover tape becomes easy. Further, in the carrier tape mount for chip-shaped electronic components according to the present invention, it is preferable that the peel strength variation R, which is obtained as the difference between the maximum value and the minimum value of the cover tape peel strength, is 0.3 N or less.

In the method for producing a carrier tape mount for chip-shaped electronic components according to the present invention, the base paper contains pulp as a main component, the ash content of the base paper is 1% or less, and the basis weight of the base paper is less than 350 g/m ² . In the method for producing a carrier tape mount for chip-like electronic components, the raw material concentration at the entrance of the paper machine of each layer is 0.1% by mass or more and 0.9% by mass or less, and the surface of the base paper in contact with the cover tape is highly water-soluble The surface of the base paper in contact with the cover tape has a texture index of 0.5 or more and 1 or less as measured by the total β-ray texture.

In the method for manufacturing a carrier tape mount for chip-shaped electronic components according to the present invention, it is preferable that the base paper is a multi-layered paper having three or more layers. The formation index measured by the β-ray ground total can be set to 1 or less more reliably. Further, in the method for manufacturing the carrier tape mount for chip-shaped electronic components according to the present invention, it is preferable that the peel strength variation R, which is obtained as the difference between the maximum value and the minimum value of the cover tape peel strength, is 0.3 N or less. .

According to the present disclosure, it is possible to easily perform formation evaluation that is not affected by changes in the unevenness of the surface due to factors such as atmospheric humidity or aging, and the peel strength when peeling off the cover tape is small. It is possible to provide a carrier tape mount for chip-shaped electronic components that can suppress fluffing. Furthermore, the carrier tape mount of the present disclosure is excellent in processability.

Next, the present invention will be described in detail with reference to embodiments, but the present invention should not be construed as being limited to these descriptions. Various modifications may be made to the embodiments as long as the effects of the present invention are achieved.

The carrier tape mount for chip-shaped electronic components according to the present embodiment has a base paper containing pulp as a main component, the ash content of the base paper is 1% or less, and the basis weight of the base paper is less than 350 g/m ² . In the carrier tape mount for chip-like electronic components, the surface of the base paper in contact with the cover tape contains a water-soluble polymer, and the texture index measured by the total β-ray texture is 1 or less.

The carrier tape mount for chip-shaped electronic components according to the present embodiment has a base paper containing pulp as a main component. Here, the term "main component" refers to the component with the highest content on a mass basis among the components constituting the base paper. In the present embodiment, pulp accounts for preferably 50% by mass or more, more preferably 70% by mass or more, of the components constituting the base paper. The raw material pulp used for the base paper is not particularly limited, but wood pulp can be preferably used. As wood pulp, chemical pulp such as softwood bleached kraft pulp (NBKP), softwood unbleached kraft pulp (NUKP), hardwood bleached kraft pulp (LBKP), hardwood unbleached kraft pulp (LUKP), groundwood pulp (GP) and thermo Examples include mechanical pulp such as mechanical pulp (TMP) and waste paper pulp such as deinked pulp. One or more selected from these raw material pulps can be used. Among these, it is particularly preferable to use NBKP and LBKP alone or in combination. For example, the pulp slurry preferably contains 70 to 100% by mass of LBKP, more preferably 90 to 100% by mass.

The raw material pulp is made into a pulp slurry having an appropriate degree of beating using a disintegrator and a beating machine. In the present invention, CSF is preferably 300 ml to 800 ml in terms of Canadian standard freeness (JIS P 8121: 1995 pulp freeness test method). CSF is more preferably 350-600 ml, and still more preferably CSF 410-580 ml.

A pulp slurry adjusted to an appropriate beating degree is used as a raw material slurry, and paper is made by a paper machine to form a base paper for a carrier tape mount. A known paper machine can be used as the paper machine. That is, paper can be made by a fourdrinier paper machine, a cylinder paper machine, a hybrid former, a gap former, or the like. The structure of the base paper may be a single layer or multiple layers of two or more layers, for example, three layers. In the case of forming a multi-layered paper having two or more layers, starch may be applied between the layers for the purpose of improving the interlaminar strength. Here, in order for the formation index measured by the total β-ray ground to be 1 or less in the present embodiment, the formation of each layer is improved as the number of layers increases, so three or more layers are preferable, more preferably four layers. As mentioned above, it is more preferable to have 5 or more layers. Although the upper limit of the number of layers is not particularly limited, it is preferably 7 layers or less, more preferably 6 layers or less. In the case of a fourdrinier paper machine, the use of a shaking device or the like improves the formation, which is preferable because it contributes to the formation index of 1 or less.

It is preferable to add a paper strength agent to the base paper. By adding a paper strength agent, sufficient interlaminar strength can be ensured, and the occurrence of fluff and creases can be suppressed. Although the paper strength agent is not particularly limited, it is preferable to use starch, modified starch, polyacrylamide-based resin, or polyvinyl alcohol-based resin. Cationic starch and amphoteric starch are particularly preferred. Moreover, it is preferable to use the paper strength enhancer by internally adding it to the raw material slurry. By internally adding the paper strength agent, it is possible to suppress not only fluff on the surface but also paper dust from the wall surface of the loading portion of the chip electronic component and the cut surface. The amount of the paper strength enhancer to be added is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 2 parts by mass, per 100 parts by mass of pulp. Other papermaking additives such as internal sizing agents, fillers, retention aids, dyes, and aluminum sulfate may also be used. However, from the viewpoint of suppressing fluff and paper dust, the filler is preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, per 100 parts by mass of pulp.

In this embodiment, the moisture content of the carrier tape mount obtained by drying the base paper is preferably 6 to 11% by mass. More preferably, it is 7 to 10% by mass. By setting the moisture content in such a range, the cushioning property of the backing paper becomes appropriate, which facilitates the adhesion of the cover tape. If the moisture content is less than 6% by mass, the backing paper itself becomes hard and the cover tape is affected by the unevenness of the backing paper and becomes difficult to adhere. On the other hand, if the moisture content exceeds 11% by mass, the moisture content is too high and the stiffness of the paper becomes weak, which may result in poor workability such as cutting. Furthermore, there is a possibility that the electronic components loaded in the loading section are likely to be corroded.

The method for adjusting the moisture content is not particularly limited, and a known method used in the paper industry can be used, but it can be adjusted mainly in the drying process of the base paper. The method for drying the base paper is not particularly limited, and hot air drying, infrared drying, drum drying, and the like can be used. Drying can be performed on a paper machine using a single cylinder dryer or a combination of multiple cylinder dryers, and the drying temperature is preferably set appropriately in the range of 80 to 200°C, more preferably in the range of 80 to 160°C.

Further, the carrier tape mount for chip-shaped electronic components of the present invention is preferably neutral paper so as not to exert an adverse effect such as metal corrosion on the chip-shaped electronic components loaded in the loading section.

The surface of the base paper with which the cover tape is in contact is one of the surfaces of the base paper. A water-soluble polymer is applied to at least the surface of the base paper that is in contact with the cover tape. In this embodiment, the formation index measured by the total β-ray ground is 1 or less. When the formation index is 1 or less, the variation in the peel strength of the cover tape is reduced, but the contact area between the surface of the backing paper and the adhesive of the cover tape is increased, and fluffing tends to occur. Therefore, in the present embodiment, by adding a water-soluble polymer to the surface of the base paper with which the cover tape is in contact, the surface strength of the base paper is increased, and the adhesive of the cover tape penetrates into the base paper appropriately. Since the adhesion between the surface and the adhesive of the cover tape is moderate, it is possible to suppress the generation of fluff due to peeling of the cover tape. In addition, by applying the water-soluble polymer, it is possible to form a coating layer of the water-soluble polymer on the surface in contact with the cover tape, compared to the case where the water-soluble polymer is contained only internally. , it is possible to suppress fluff on the surface when used as a carrier tape mount. As the water-soluble polymer, it is preferable to use one or more selected from starch, modified starch, and polyvinyl alcohol resin. Among polyvinyl alcohol resins, anionic polyvinyl alcohol resins are preferred. The cationic polyvinyl alcohol resin strongly forms a film on the surface of the base paper, and the adhesive of the cover tape does not enter, and the adhesiveness to the cover tape may be lowered. Among the water-soluble polymers, polyacrylamide resin penetrates the backing paper surface and does not remain on the surface. As a result fluff occurs. Therefore, it is not preferable to use a polyacrylamide-based resin alone. In this embodiment, the surface of the base paper opposite to the surface in contact with the cover tape may be coated with a water-soluble polymer.

The method of applying the water-soluble polymer is not particularly limited, and two-roll size press, gate roll size press, and metering size press can be used. Among these, it is preferable to use a two-roll size press from the viewpoint of production efficiency, processability, improvement of surface strength, and improvement of paper layer strength. The coating amount of the water-soluble polymer is preferably in the range of 0.5 to 5 g/m ² , more preferably 1.0 to 3.5 g/m ² in terms of solid content, on both sides of the base paper. The coating amount of the water-soluble polymer on the surface in contact with the cover tape is preferably 0.25 to 3.0 g/ ^m2 in terms of solid content, and 0.7 to 2.5 g/m2 in terms of solid content. ² , and more preferably more than 1.0 g/m ² and 1.75 g/m ² in terms of solid content. In particular, when modified starch is used alone as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface in contact with the cover tape is preferably 0.7 to 3.0 g/m ² in terms of solid content. , 1.0 to 2.3 g/m ² . When a polyvinyl alcohol-based resin is used alone as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface in contact with the cover tape is preferably 0.7 to 1.8 g/m ² in terms of solid content. , 0.9 to 1.4 g/m ² . When two or more of starch, modified starch and polyvinyl alcohol-based resin are mixed and used as the water-soluble polymer, the coating amount of the water-soluble polymer on the surface in contact with the cover tape is 1.0 in terms of solid content. It is preferably 3 to 3.0 g/m ² , more preferably 1.7 to 2.4 g/m ² .

Further, in the present embodiment, the base paper after drying may be smoothed if necessary. The smoothing method is not particularly limited, and machine calendar, soft calendar, super calendar, etc. can be used. When the base paper is heated during the smoothing treatment, it is also possible to adjust the moisture content of the base paper here.

The thickness of the carrier tape mount varies depending on the size of the chip-like electronic component to be loaded, but is preferably 50-400 μm, more preferably 200-380 μm. Also, the basis weight is preferably 200 g/m ² or more and less than 350 g/m ² , more preferably 250 to 345 g/m ² .

In the method for manufacturing a carrier tape mount for chip-shaped electronic components according to the present embodiment, the base paper contains pulp as a main component, the ash content of the base paper is 1% or less, and the basis weight of the base paper is 350 g/m ^{2 .} In the method for producing a carrier tape mount for chip-like electronic components of less than 0.1% by mass, the raw material concentration at the entrance of the paper machine of each layer is 0.1% by mass or more and 0.9% by mass or less, and the surface of the base paper in contact with the cover tape is water-soluble The surface of the base paper in contact with the cover tape has a texture index of 1 or less as measured by total β-ray texture.

In the carrier tape mount for chip-shaped electronic components according to this embodiment, the ash content of the base paper is 1% or less. If the ash content of the base paper exceeds 1%, intralayer peeling of the carrier tape mount or fluffing may occur. In order to avoid corroding and damaging the chip, the amount of inorganic substances should be as small as possible, and by setting the ash content of the base paper to 1% or less, it is possible to prevent the mixing of inorganic substances into the pockets. The ash content of the base paper is measured in accordance with JIS P8251:2003 "Paper and paperboard-Ash content test method-525°C combustion method". More preferably, the ash content of the base paper is 0.6% or less. Although the lower limit of the ash content of the base paper is not particularly limited, ash may be unintentionally mixed in due to raw material pulp. Therefore, considering this unintentional ash content, the lower limit of the ash content of the base paper is preferably 0.1% or more, more preferably 0.2% or more, and more preferably 0.3%. % or more is particularly preferable.

In the carrier tape mount according to the present embodiment, the surface of the carrier tape mount in contact with the cover tape has a formation index of 1 or less as measured by the total β-line ground. The formation index is preferably 0.8 or less, more preferably 0.6 or less. Although the lower limit of the formation index is not particularly limited, it is preferably 0.3 or more, more preferably 0.5 or more. If the formation index exceeds 1, the variation in peel strength becomes large, making it difficult to control the adhesion of the cover tape, which poses a practical problem. Here, the variation in peel strength is indicated by the difference R between the maximum value and the minimum value, which is preferably 0.3N or less, more preferably 0.2N or less, and most preferably 0.15N or less. Although the lower limit of the peel strength variation R is not particularly limited, it is preferably 0.01 N or more, more preferably 0.05 N or more.

As a method for making the formation index measured by the total β ray ground total 1 or less, the density of the raw material at the inlet of the paper machine (hereinafter sometimes referred to as raw material concentration) is lowered to improve the formation of the backing paper, resulting in It is preferred to reduce the formation index. In the case of a cylinder paper machine, the raw material concentration in the vat at the inlet, and in the case of a Fourdrinier paper machine, the inlet concentration of the headbox corresponds to this, but it is preferably 0.9% by mass or less, more preferably 0.5% by mass or less. 0.3% by mass or less is even better. If it exceeds 0.9% by mass, the formation index will not fall within the desired range, and the peel strength of the cover tape will vary greatly. If the raw material concentration is less than 0.1% by mass, it becomes difficult to separate the sheet from the wire and the yield on the wire also decreases, so 0.1% by mass is the substantial lower limit. More preferably, the lower limit of the raw material concentration is 0.15% by mass. Particularly in the case of multi-layer papermaking, it is preferable that the raw material concentrations of the surface layer and the back layer fall within this range.

The ground total used in the measurement of the formation index in this embodiment is the β-ray ground total, that is, the ground total using the β-ray radiation source, and shows the distribution of basis weight (also called rice basis weight). is. The widely used texture is based on light transmission, but it is not suitable for texture evaluation because pulp components, types and amounts of fillers, hue, whiteness, degree of beating of pulp, etc. are also variables. As described above, the paper carrier tape mount may have a larger surface unevenness than the surface unevenness generated during the production of the carrier tape mount (during papermaking) due to factors such as atmospheric humidity and aging. Therefore, the present inventors have found that the formation can be easily measured by using the β-line ground sum without being affected by changes in the unevenness of the surface caused by factors such as atmospheric humidity and aging. The formation index measured using the β-ray ground total is an index of the difference in basis weight (referred to as unit basis weight) measured at a diameter of 1 mm of the carrier tape mount. Therefore, it is not affected by the uneven state of the surface. Therefore, regardless of the magnitude of the formation index, the formation index measured using the β-line total sum is the same before and after the uneven state of the surface changes due to factors such as atmospheric humidity or time. If the formation index measured using the β-ray ground total is 1 or less, the difference in local grammage is small, so the amount of change in the unevenness of the surface due to factors such as atmospheric humidity and aging is also small. On the other hand, when the texture index measured using the β-ray ground total exceeds 1, there is a large difference in local basis weight, so the amount of change in the unevenness of the surface due to factors such as atmospheric humidity and aging increases. Since the total β-ray base weight of 350 g/m ² or more lacks accuracy, the carrier tape mount for chip-like electronic components having a basis weight of the base paper of less than 350 g/m ² is targeted in this embodiment. bottom.

The taping package is manufactured through, for example, a raw fabric manufacturing process, a slitting process, a loading section forming process, a chip loading process, and a chip enclosing process. The raw fabric manufacturing process is generally carried out at a paper manufacturing company in many cases, and is a process in which paper that will be the carrier tape base is made and wound into a roll with a width of 500 to 3000 mm. The slitting process is generally performed by a slitting company in many cases, and is a process in which the original fabric is slit to a width (for example, 8 mm wide) suitable for a carrier tape mount. Here, in general, instead of slitting the raw material directly to a width suitable for the carrier tape backing paper, a step of slitting to a predetermined width (for example, 70 to 170 mm width) (referred to as primary slitting) is performed. After passing through, it is slit to a width suitable for the carrier tape backing paper (called final slit). Note that the number of primary slits may be divided into two or more times instead of one. The loading section forming process is often performed by a slit processing company following the slitting process, and is a process in which loading sections are formed at regular intervals on the carrier tape mount after the final slitting. The chip loading process and the chip encapsulation process are generally performed by electronic chip manufacturing companies in many cases, and are processes in which a predetermined chip-like electronic component is loaded into the loading section and then encapsulated with a cover tape. A roll paper having a predetermined width (for example, 70 to 170 mm width) that has undergone the primary slitting process has more stable moisture changes and surface irregularities than immediately after the base paper is made. When the inventors of the present invention measured the formation index using the total β-line texture for roll paper of a predetermined width (for example, 70 to 170 mm width) that had undergone the primary slitting process, the formation index was It was confirmed that the formation index was almost the same as that of paper.

In this embodiment, the formation index is obtained, for example, as follows. The basis weight (referred to as unit basis weight) measured with a diameter of 1 mm of the carrier tape mount for chip-shaped electronic components was measured at a pitch of 3.5 mm × 3.5 mm for a measurement area of 70 mm × 70 mm. The standard deviation of the basis weight and the weighted average value of the basis weight are obtained for each unit basis weight value. Then, the basis weight normalized standard deviation (nsd=normalized standard deviation) calculated according to the following formula (Equation 1) is taken as the formation index.
(Formula 1) Standard deviation of basis weight (g/m) = standard deviation of basis weight (g/m ² )/weighted average value of basis weight (g/m ² ) ^1/2

In addition to the method of controlling the raw material concentration, it is preferable to control the pressing pressure and smoothing such as calendering. A press part is provided between the paper machine and the dryer part for the purpose of water constriction, and the number of press nips is preferably 3 or more. If the value is 2 or less, the water becomes abruptly constricted, and blanket marks called felt marks are deeply engraved, resulting in an increase in minute non-contact portions. Although the upper limit of the number of nips in the press part is not particularly limited, it is preferably 6 or less, more preferably 5 or less. Also, the total pressing force of the press part nip is preferably 100 to 500 kN/m, more preferably 200 to 420 kN/mm. The calender is preferably 2 nips or more. This is because, with one nip, there is no calendering effect, and there is no smoothing effect due to friction. Therefore, it is preferable to perform a plurality of nips with a multistage calender rather than performing a single nip method a plurality of times. Although the upper limit of the number of calender nips is not particularly limited, it is preferably 5 or less, more preferably 3 or less. The pressing force of the calender nip is preferably 20 to 150 g/cm, more preferably 40 to 130 kg/cm. When there are two calendering devices, it is preferable to set each to 25 to 100 kg/cm. Controlling the press pressure and controlling the calendering pressure tend to decrease the formation index as the pressure increases, but the backing paper becomes harder and the control becomes difficult when the cover tape is adhered. It is preferable to control the mount density within the range of 0.8 to 1.1 g/cm ³ . More preferably, it is 0.9 to 1.1 g/cm ³ . However, as mentioned above, control of press pressure and control of smoothing such as calendering cannot correct the basis weight distribution, but when the carrier tape mount is used for manufacturing the taped package relatively soon after production, It is an effective means.

In the carrier tape mount for chip-shaped electronic components according to the present embodiment, loading portions for loading chip-shaped electronic components are formed at regular intervals. It is used as a carrier tape (also called a taping package) for chip-shaped electronic components. The loading portion may be either a bottomed recess formed by embossing or a through hole formed by punching. When a through-hole is used, a bottom tape is attached to one surface of the carrier tape mount to close one of the through-holes to form a loading portion.

EXAMPLES Next, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. In addition, "parts" and "%" in the examples indicate "mass parts" and "mass%", respectively, unless otherwise specified. The number of parts to be added is a value in terms of solid content.

<Example 1>
0.3 parts of aluminum sulfate, 1 part of cationic starch (trade name: Neotac #30T/manufactured by Nihon Shokuhin Kako Co., Ltd.), rosin emulsion sizing agent (product Name: CC-1404/manufactured by Seiko PMC Co., Ltd.) was added to obtain a raw material slurry. Using the raw material slurry thus obtained, five layers of wet paper consisting of one surface layer, three intermediate layers and one back layer were combined by a cylinder paper machine to form a base paper. After that, the water was narrowed by 3 nips with a total pressing force of 300 kN / m in the press part, and after drying, a carboxyl group-modified polyvinyl alcohol (Gohsenal T-350 / manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) was used as a water-soluble polymer with a two-roll size press. ) A 6% sizing liquid is applied to both sides of the base paper so that the solid content is 3 g/m ² , dried with a cylinder dryer so that the moisture content is 9%, and a pressing force of 100 kg / with a multi-stage calender. The target carrier tape mount for chip-like electronic components was obtained by performing a smoothing treatment of 2 nips at 1 cm. The coating amount of the water-soluble polymer on the surface in contact with the cover tape was 1.4 g/m ² in terms of solid content. The basis weight of each layer was 60 g/m ² for the surface layer, 60 g/m ² for the middle layer, totaling 180 g/m ² for three layers, and 60 g/m ² for the back layer. The concentration in the vat of the cylinder paper machine (corresponding to the raw material concentration at the entrance of the paper machine for each layer) was 0.2% for all layers. The ash content was 0.3% and is believed to be from the pulp.

<Example 2>
Three layers of wet paper consisting of one surface layer, one middle layer, and one back layer are combined to make paper, and the basis weight of each layer is 60 g/m ² for the surface layer and 180 g/m ² for the middle layer. A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the back layer was 60 g/m ² . The concentration in the vat of the cylinder paper machine was 0.2% for the surface and back layers and 0.6% for the middle layer.

<Example 3>
4 layers of wet paper consisting of 1 surface layer, 2 middle layers and 1 back layer are combined to make paper, and the total basis weight of each layer is 60 g/m ² for the surface layer and 90 g/m ² for the middle layer. A carrier tape mount for chip-like electronic components was obtained in the same manner as in Example 1, except that the weight was 180 g/m ² and the back layer was 60 g/m ² . The concentration in the vat of the cylinder paper machine was 0.2% for the surface and back layers and 0.4% for the middle layer.

<Example 4>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the coating amount of the sizing liquid was 3 g/m ² to 2 g/m ² on both sides of the base paper. The coating amount of the water-soluble polymer on the surface in contact with the cover tape was 1.0 g/m ² in terms of solid content.

<Example 5>
A carrier tape mount for chip-like electronic components was obtained in the same manner as in Example 1, except that the amount of the sizing liquid applied was 3 g/m ² to 4 g/m ² on both sides of the base paper. The coating amount of the water-soluble polymer on the surface in contact with the cover tape was 2.0 g/m ² in terms of solid content.

<Example 6>
Same as Example 1 except that the sizing liquid was changed from 6% carboxyl group-modified polyvinyl alcohol (Gohsenal T-350/manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) to 7% oxidized starch (MS3800/manufactured by Nippon Shokuhin Kako Co., Ltd.). A carrier tape mount for chip-shaped electronic components was obtained. The coating amount of the water-soluble polymer on the surface in contact with the cover tape was 1.6 g/m ² in terms of solid content.

<Example 7>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1, except that the smoothing treatment was not performed.

<Example 8>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1, except that the number of press nips was changed from 3 to 1.

<Example 9>
A carrier tape mount for chip-shaped electronic parts was obtained in the same manner as in Example 1, except that the concentration in the vat of the cylinder paper machine was changed from 0.2% to 0.4% in all layers.

<Example 10>
A carrier tape mount for chip-like electronic components was obtained in the same manner as in Example 1, except that the cylinder paper machine was changed to a fourdrinier multi-layer paper machine using a shaking device.

<Example 11>
A carrier tape mount for chip electronic components was obtained in the same manner as in Example 1, except that the moisture content was changed from 9% to 6%.

<Example 12>
A carrier tape mount for chip electronic components was obtained in the same manner as in Example 1, except that the moisture content was changed from 9% to 11%.

<Comparative Example 1>
A carrier tape mount for chip-like electronic components was obtained in the same manner as in Example 1, except that fourdrinier single-layer paper was made and the basis weight of the single layer was 300 g/m ² . The Fourdrinier paper machine inlet concentration was 1.0%.

<Comparative Example 2>
Carrier tape mounts for chip-like electronic components were obtained in the same manner as in Example 1, except that the coating amount of the sizing liquid was changed from 3 g/m ² to no coating on both sides of the base paper. The coating amount of the water-soluble polymer on the surface in contact with the cover tape was 0 g/m ² in terms of solid content.

<Comparative Example 3>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1, except that 2 parts of light calcium carbonate (TP121: manufactured by Okutama Kogyo Co., Ltd.) was added to the pulp slurry of Example 1 to adjust the ash content to 2%. rice field.

<Comparative Example 4>
A carrier tape mount for chip-like electronic parts was obtained in the same manner as in Example 1, except that the concentration in the vat of the cylinder paper machine was changed from 0.2% to 1.0% in all layers.

<Formation index>
The unit basis weight is measured at the following measurement pitch using a beta formation tester manufactured by AMBERTEC, and the basis weight normalized standard deviation (nsd = normalized standard deviation) is used as an index according to the following calculation formula (Equation 1). It was used as a terrain index.
(Formula 1) Basis weight normalization standard deviation (g/m) = basis weight standard deviation (g/m ² )/{basis weight (g/m ² )} ^1/2
Measurement conditions: measurement area 70 mm × 70 mm, measurement pitch 3.5 mm × 3.5 mm

<Measurement of peel strength of cover tape>
A cover tape ((No381H-14A: manufactured by Nitto Denko) was adhered to the carrier tape mount obtained in Examples and Comparative Examples using a taping device (PST-150Air, manufactured by PALMEC), and a peel strength tester (PFT- 50, manufactured by PALMEC) Taping conditions: Adhesion temperature 140° C., 4 mm×50 times stamp/seal length 200 mm, peel strength measurement conditions: peel speed 300 mm/30 seconds, peel angle 170° The variation R was calculated from the obtained maximum and minimum values of the peel strength, and the evaluation criteria are as follows: When the variation R is 0.2 or less, it is a practical level, and when the variation R exceeds 0.2. When the variation R was 0.3 or less, it was taken as the lower limit level for practical use, and when the variation R exceeded 0.3, it was taken as an impractical level.

<Fluffy evaluation>
The surface of the sample subjected to cover tape peel strength measurement was visually observed. Evaluation criteria are as follows.
◯: Good with no fluff observed. (Practical level)
Δ: Slight fluff is observed. (Practical lower limit level)
x: fluff is clearly observed. (impossible level)

<Ash content>
The ash content was measured in accordance with JIS P8251:2003 "Paper and paperboard-ash content test method-525°C combustion method".

As shown in Table 1, the chip-shaped electronic component carrier tape mounts obtained in Examples 1 to 12 all had good cover tape peel strength and fluff evaluation, and were of a level that poses no practical problem. rice field. The carrier tape mount for chip-shaped electronic components obtained in Example 11 had more variations in peel strength than in Example 1, which was at the practical lower limit level. In addition, the carrier tape mount for chip-like electronic components obtained in Example 12 was weaker in stiffness than that in Example 1, was difficult to cut, and had fluff evaluation at the lowest level for practical use. On the other hand, since the carrier tape mount for chip-shaped electronic components obtained in Comparative Example 1 was a single layer, the raw material concentration at the inlet was high, and the texture was greatly deteriorated. As a result, the formation index exceeded 1, and the variation in peel strength of the cover tape was problematic in practice. In addition, since the carrier tape mount for chip-like electronic components obtained in Comparative Example 2 was not coated with a water-soluble polymer, fluff was generated, which was a practical problem. The carrier tape mount for chip-like electronic components obtained in Comparative Example 3 had an ash content of more than 1%, and thus fluff was generated, which was a problem in practical use. In Comparative Example 4, since the raw material concentration at the inlet was high, the formation index exceeded 1, and the variation in the peel strength of the cover tape was problematic in practice.

Claims (9)

A carrier tape mount for chip-shaped electronic components, which has a base paper containing pulp as a main component, the ash content of the base paper is 1% or less, and the basis weight of the base paper is less than 350 g/m ² ,
A carrier for chip-shaped electronic components, wherein the surface of the base paper in contact with the cover tape contains a water-soluble polymer and has a texture index measured by total β-ray texture of 0.5 or more and 1 or less. tape mount. 2. The carrier tape mount for chip-like electronic components according to claim 1, wherein said water-soluble polymer contains at least one selected from starch, modified starch and polyvinyl alcohol resin. 3. The chip-like electronic device according to claim 1, wherein the coating amount of the water-soluble polymer on the surface in contact with the cover tape is 0.25 to 3.0 g/m ² in terms of solid content. Carrier tape mount for parts. The carrier tape mount for chip-shaped electronic components according to any one of claims 1 to 3, wherein the base paper is a multi-layer paper having three or more layers. The carrier tape mount for chip-shaped electronic components according to any one of claims 1 to 4, wherein the carrier tape mount for chip-shaped electronic components has a moisture content of 6 to 11% by mass. The chip-shaped electronic component according to any one of claims 1 to 5, wherein the variation R of the peel strength obtained as the difference between the maximum value and the minimum value of the cover tape peel strength is 0.3 N or less. Carrier tape backing paper. A method for producing a carrier tape mount for chip-shaped electronic components, wherein the base paper is mainly composed of pulp, the ash content of the base paper is 1% or less, and the basis weight of the base paper is less than 350 g/m ² ,
Each layer has a paper machine inlet raw material concentration of 0.1% by mass or more and 0.9% by mass or less,
A step of applying and drying a water-soluble polymer to the surface of the base paper in contact with the cover tape,
A method for producing a carrier tape mount for chip-like electronic components, wherein the surface of the base paper with which the cover tape is in contact has a texture index measured by total β-ray ground of 0.5 or more and 1 or less. 8. The method of manufacturing a carrier tape mount for chip-shaped electronic components according to claim 7 , wherein the base paper is a multi-layer paper having three or more layers. 9. The carrier tape mount for chip-shaped electronic components according to claim 7 or 8, wherein the peel strength variation R, which is obtained as the difference between the maximum and minimum peel strengths of the cover tape, is 0.3 N or less. Production method.