JP6389597B2 - Carrier tape mount for chip electronic component and carrier tape for chip electronic component - Google Patents

Description

  The present invention relates to a carrier tape mount for chip-shaped electronic components and a carrier tape for chip-shaped electronic components. More specifically, the present invention relates to a chip-shaped electronic component carrier tape mount and a chip-shaped electronic component carrier tape in which swelling due to a change in humidity environment of a concave or perforated loading portion for loading a chip-shaped electronic component is suppressed.

  2. Description of the Related Art Conventionally, chip-type electronic components are automatically mounted on a printed circuit board in order to achieve automatic production of various electronic devices. In the automatic mounting process of chip-shaped electronic components, a chip-shaped electronic component is supplied to the printed wiring board one by one using a chip component mounting machine or the like and automatically mounted on the printed wiring board. In this automatic mounting process, in order to easily handle the chip-shaped electronic component, a taping package in which individual chip-shaped electronic components are packaged with a tape-shaped carrier is used.

  The taping package forms a concave or perforated loading portion (hereinafter simply referred to as “loading portion”) for loading chip-like electronic components on a carrier tape mount at regular intervals. After a predetermined chip-shaped electronic component is loaded on, the cover is encapsulated with a cover tape. The loading unit is generally provided in a square shape and may be referred to as a press pocket or a cavity.

  The taping package loaded with chip-shaped electronic components is transported in a reel shape, the cover tape is continuously peeled off by an automatic machine for mounting the chip-shaped electronic components, and the chip-shaped electronic components are sequentially taken out from the carrier tape mount. Is automatically mounted at a predetermined position on the printed wiring board.

  Carrier tape mounts are roughly classified into plastic and paper. Paper is desirable in terms of manufacturing cost, non-charging properties, and easy disposal after use. As the carrier tape mount made of paper, one made of single-layer or multilayer paperboard is known (see, for example, Patent Documents 1 to 3).

  In these paper carrier tape mounts, the shape of the loading portion is required to be accurately maintained. However, the wall surface of the loading unit may swell due to changes in the humidity environment, resulting in a problem that the shape of the loading unit cannot be accurately maintained. When the loading portion is deformed, mistakes in loading and unloading chip-shaped electronic components occur, causing operational troubles. In particular, the speed of the loading process of chip-shaped electronic components and the miniaturization of the loading unit have been made in recent years, and the minute deformation of the loading unit has an effect on the efficiency in the loading process of the chip-shaped electronic component, causing operational problems. It has become.

JP 09-188385 A JP 2005-313946 A JP 2008-230651 A

  In view of such a problem, an object of the present invention is to provide a carrier tape mount for chip-shaped electronic components in which swelling of a loading portion due to a change in humidity environment is suppressed. Furthermore, another object of the present invention is to provide a carrier tape mount excellent in processability.

  Other objects and operational effects of the present invention will be easily understood by those skilled in the art by referring to the following description.

  In order to solve the above problems, the carrier tape mount for chip-shaped electronic component of the present invention is made of a base paper mainly composed of pulp, and the moisture content is 8.5 to 12 as a measured value defined by JIS P 8127. Mass%. Here, the moisture content is a value measured after conditioning for 24 hours under the conditions of 23 ° C. and 50% RH. With such a configuration, it is possible to suppress swelling of the loading portion due to changes in the humidity environment, and as a result, there is little change in the shape of the loading portion, and it is possible to suppress mistakes in loading and unloading chip-shaped electronic components.

  In the present invention, the base paper may contain a wet paper strength enhancer. By setting it as such a structure, the shape change of a loading part can be suppressed further.

  In the present invention, the base paper may contain a wet paper strength enhancer of 0.4 to 1.2 parts by mass with respect to 100 parts by mass of pulp. By setting it as such a structure, the shape change of a loading part can be suppressed further.

  The carrier tape mount for chip-shaped electronic components of the present invention can be used as a carrier tape for chip-shaped electronic components by forming concave or perforated loading portions for loading chip-shaped electronic components at regular intervals. .

  According to the carrier tape mount for chip-shaped electronic components of the present invention, the swelling of the loading portion due to changes in the humidity environment can be suppressed, and as a result, there is little change in the shape of the loading portion, and mistakes in loading and unloading of chip-shaped electronic components are suppressed. can do. Furthermore, the carrier tape mount of the present invention is excellent in processability.

  Next, the present invention will be described in detail with reference to embodiments, but the present invention is not construed as being limited to these descriptions. As long as the effect of the present invention is exhibited, the embodiment may be variously modified.

  The carrier tape mount for chip-shaped electronic components of the present invention is made of a base paper whose main component is pulp. Although it does not specifically limit as raw material pulp used for a base paper, Wood pulp can be used conveniently. Wood pulp includes chemical pulp such as softwood bleached kraft pulp (NBKP), softwood unbleached kraft pulp (NUKP), hardwood bleached kraft pulp (LBKP), hardwood unbleached kraft pulp (LUKP), groundwood pulp (GP) and thermo Examples include mechanical pulp such as mechanical pulp (TMP), and waste paper pulp such as deinked pulp. One or more selected from these raw material pulps can be used. Among these, it is particularly preferable to use NBKP and LBKP alone or in combination. For example, what contains 80-100 mass% or 90-100 mass% of LBKP in a pulp slurry can be used.

  The raw pulp is made into a pulp slurry having an appropriate degree of beating using a disintegrator and a beater. In this invention, it is preferable to set it as CFS300ml -800ml by Canadian standard freeness (JIS P8121: 1995 pulp freeness test method). More preferably, it is CFS350-600ml, More preferably, it is CSF380-480ml.

  A pulp slurry adjusted to an appropriate beating degree is used as a raw slurry, and a paper machine is used to make a base paper for a carrier tape mount. A known paper machine can be used as the paper machine. That is, papermaking can be performed by a long net paper machine, a circular net paper machine, a hybrid former, a gap former, or the like. The configuration of the base paper may be a single layer or a multilayer of two or more layers, for example, three layers. In the case of two or more layers, paper may be made by applying starch between the layers for the purpose of improving the interlayer strength.

  In the present invention, the moisture content of the carrier tape mount obtained by drying the base paper is set to 8.5 to 12% by mass. Preferably it is 9-11 mass%, More preferably, it is 9.5-10.5 mass%. By setting the moisture content in such a range, it is possible to suppress swelling of the loading portion due to a change in humidity environment. The reason for this is not clear, but as described in the above-mentioned Patent Document 3, a general carrier tape mount contains 6 to 8% by mass of water under an environmental condition of 23 ° C. and 50% RH. However, it can be inferred that by making the moisture content relatively high, it becomes difficult for the carrier tape mount to absorb moisture in the air even under relatively high humidity conditions, and as a result, the loading portion is less likely to swell. Is done. When the moisture content is less than 8.5% by mass, it is not possible to suppress the swelling of the loaded portion due to a change in humidity environment. On the other hand, if the moisture content exceeds 12% by mass, the moisture content is too high and the paper becomes weak and the processing suitability at the time of cutting may be inferior. Furthermore, there is a possibility that the electronic parts loaded in the loading unit may be adversely affected, such as corrosion.

  The method for adjusting the moisture content is not particularly limited, and a known method used in the papermaking industry can be used, but it can be adjusted mainly in the base paper drying step. The method for drying the base paper is not particularly limited, and hot air drying, infrared drying, drum drying, and the like can be used. On the paper machine, it is possible to dry the cylinder dryer alone or in combination, and it is preferable that the drying temperature is appropriately set in the range of 120 to 200 ° C.

  In the present invention, the base paper may contain a wet paper strength enhancer. By including the wet paper strength enhancer, the swelling of the loading portion can be further suppressed. The reason for this is not clear, but it is thought that it works as follows. That is, as described above, the carrier tape mount for chip-shaped electronic components of the present invention has a relatively high moisture content compared to a general carrier tape mount. As the moisture content increases, the flexibility of the paper increases, and the wall surface of the loading unit tends to bulge inside the loading unit over time depending on the punching or embossing method. The wet paper strength enhancer generally has an effect of improving the dimensional stability when the paper is wet. However, the carrier tape mount for chip-shaped electronic components of the present invention has a relatively high moisture content, so when wet. Although not as remarkable as in the case of the above, it is considered that the dimensional change due to the increased flexibility of the paper is suppressed. In any case, the carrier tape mount of the present invention suppresses the swelling of the loading part due to the humidity change by setting the moisture content range described above, and additionally contains a wet paper strength enhancer. It is possible to suppress swelling of the loading portion.

  The type of wet paper strength enhancer is not particularly limited, and known ones such as polyamide epichlorohydrin resin, polyamide epoxy resin, melamine resin, melamine formaldehyde resin, urea formaldehyde resin can be used. Of these, polyamide epichlorohydrin resins and polyamide epoxy resins are preferred, and polyamide epichlorohydrin resins are particularly preferred because they do not adversely affect electronic components loaded in the loading section. Specifically, examples of the polyamide epichlorohydrin resin include the WS series manufactured by Seiko PMC. Examples of the polyamide epoxy resin include Sumirez (registered trademark) Resin 650 (30) manufactured by Sumitomo Chemical Co., Ltd. 675A, 6615, SLX-1, and the like.

  The addition amount of the wet paper strength enhancer should not exceed 1.2 parts by mass with respect to 100 parts by mass of the raw material pulp used for the base paper. Furthermore, it is preferably 0.4 to 1.2 parts by mass, 0.5 to 1.0 parts by mass, and more preferably 0.6 to 0.9 parts by mass. When the amount is less than 0.4 part, the effect of suppressing the swelling of the loading part may be poor. On the other hand, even if it is added in an amount of more than 1.2 parts, the effect of suppressing the swelling of the loading part reaches its peak, which not only increases the cost but also causes contamination in the paper making process and may cause foreign substances to be mixed into the base paper. There is. The method for applying the wet paper strength enhancer to the base paper is not particularly limited, but it is preferably used by internally adding to the raw slurry.

  In addition to the wet paper strength enhancer, it is preferable to add a paper strength enhancer to the base paper. By adding a paper strength enhancer, sufficient interlayer strength can be secured, and the generation of creases can be suppressed. Although it does not specifically limit as a paper strength enhancer, It is preferable to use starch, modified starch, polyacrylamide-type resin, and polyvinyl alcohol-type resin. It is particularly preferable to use cationic starch. The paper strength enhancer is preferably used by being added internally to the raw slurry. By internally adding the paper strength enhancer, it is possible to suppress paper dust from the wall surface and the cut surface of the loading portion of the chip-shaped electronic component. The addition amount of the paper strength enhancer is preferably 0.3 to 20 parts by mass, more preferably 0.5 to 10 parts by mass with respect to 100 parts of pulp. Further, as other papermaking additives, it is also possible to use an internal sizing agent, a filler, a yield improver, a dye, a sulfuric acid band, and the like.

  Moreover, it is preferable that the carrier tape mount for chip-shaped electronic components according to the present invention is neutral paper so as not to adversely affect the chip-shaped electronic components loaded in the loading section, such as metal corrosion.

A surface paper strength enhancer may be applied to the base paper. By applying the surface paper strength enhancer, it is possible to suppress fluffing of the surface and generation of paper dust when the carrier tape mount is used. As the surface paper strength enhancer, one or more kinds of starch, modified starch, polyacrylamide resin and polyvinyl alcohol resin can be used. The method for applying the surface paper strength enhancer is not particularly limited, and a two-roll size press, a gate roll size press, and a metering size press can be used. Among these, it is preferable to use a two-roll size press from the viewpoints of production efficiency, processability, surface strength, and paper layer strength. The coating amount of the surface paper strength agent, 0.5 to 5 g / ^{m 2} on both sides per solid equivalent of the base paper, preferably in the range of 1~3.5g / ^{m 2.}

  In the present invention, the dried base paper may be smoothed as necessary. The method of the smoothing process is not particularly limited, and a machine cander, a soft calender, a super calender, or the like can be used. When the base paper is heated during the smoothing treatment, the moisture content of the base paper can be adjusted here.

The thickness of the carrier tape mount varies depending on the size of the chip-shaped electronic component to be loaded, but is preferably 50 to 1200 μm, more preferably 200 to 900 μm. Moreover, it is preferable that a basic weight shall be 200-1200 g / m < ² >, More preferably, it is 250-1100 g / m < ² >.

  The carrier tape mount for chip-shaped electronic components of the present invention forms a loading portion for loading the chip-shaped electronic components at regular intervals, and after loading the chip-shaped electronic components in the loading portion, encloses with a cover tape, Used as a carrier tape for chip-shaped electronic components. The loading portion may be a bottomed recess formed by embossing or a through hole formed by punching. In the case of the through hole, a bottom tape is attached to one surface of the carrier tape mount to close one of the through holes, thereby forming a loading portion.

  Next, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. Further, “parts” and “%” in the examples indicate “parts by mass” and “% by mass” in terms of solid content, respectively, unless otherwise specified.

<Example 1>
Canadian Standard Freeness (CSF) 430 ml of LBKP 100 parts pulp slurry, 0.5 parts of sulfuric acid band, cationic starch (trade name: Neotac # 110M / manufactured by Nippon Food Processing Co., Ltd.), rosin emulsion sizing agent (product) (Name: CC-1404 / manufactured by Seiko PMC) 0.4 part was added to obtain a raw material slurry. Using the obtained raw material slurry, a wet paper of three layers consisting of a surface layer, an intermediate layer and a back layer was made by using a circular paper machine to make a base paper. Then, a carboxyl group-modified polyvinyl alcohol (GOHSENAL T-350 / manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 4% size liquid was applied with a two-roll size press so that it would be 3 g / m ² per both sides of the base paper. It was dried with a cylinder dryer so that the content rate was 9.5%, and the target carrier tape mount for chip-shaped electronic components was obtained. Incidentally, the basis weight of each layer, the surface layer of 80 g / ^{m 2,} the middle layer 240 g / ^{m 2,} the backing layer was 80 g / ^{m 2.} The basis weight of the entire carrier tape mount was 403 g / m ² and the thickness was 411 μm.

<Example 2>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the moisture content was 10.5% and the substrate was dried with a cylinder dryer.

<Example 3>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the moisture content was 9%, and drying was performed with a cylinder dryer.

<Example 4>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the moisture content was 11%, and the content was 11%.

<Example 5>
Carrier for chip-like electronic component in the same manner as in Example 1 except that 0.6 parts of polyamide epichlorohydrin resin (trade name: WS4020 / manufactured by Seiko PMC) was further added to the raw material slurry as a wet paper strength enhancer. A tape mount was obtained.

<Example 6>
Carrier for chip-shaped electronic component in the same manner as in Example 1 except that 0.9 part of polyamide epichlorohydrin resin (trade name: WS4020 / manufactured by Seiko PMC) was further added to the raw slurry as a wet paper strength enhancer. A tape mount was obtained.

<Example 7>
Carrier for chip-like electronic component as in Example 1, except that 0.5 part of polyamide epichlorohydrin resin (trade name: WS4020 / manufactured by Seiko PMC) was further added to the raw slurry as a wet paper strength enhancer. A tape mount was obtained.

<Example 8>
Carrier for chip-like electronic component as in Example 1, except that 1.0 part of polyamide epichlorohydrin resin (trade name: WS4020 / manufactured by Seiko PMC) was further added to the raw slurry as a wet paper strength enhancer. A tape mount was obtained.

<Example 9>
A chip-like electronic device as in Example 1 except that 0.6 parts of a polyamide epoxy resin (trade name: Sumirez (registered trademark) Resin 6615 / manufactured by Sumitomo Chemical Co., Ltd.) was further added to the raw slurry as a wet paper strength enhancer. The carrier tape mount for parts was obtained.

<Comparative Example 1>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the moisture content was 8%, and the content was 8%.

<Comparative Example 2>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1 except that the moisture content was 13% and the product was dried with a cylinder dryer.

  Table 1 shows the evaluation results of the carrier tape mounts for chip-shaped electronic components obtained in the examples and comparative examples. In addition, the moisture content and evaluation in Table 1 were performed by the following methods.

<Moisture content>
Regarding carrier tape mount for chip-like electronic components conditioned for 24 hours under environmental conditions of 23 ° C. and 50% RH, in accordance with JIS P 8127: 2010 “Paper and paperboard—lot water test method—method using dryer” The value of average moisture obtained by measurement was taken as the moisture content.

<Degree of swelling of loading part>
The obtained carrier tape mount for chip-shaped electronic components was slit to a width of 8 mm, and then a square hole having a length of 1 mm and a width of 0.5 mm was formed to provide a loading portion. Then, it was allowed to stand for 24 hours under an environmental condition of 23 ° C. and 50% RH, and then allowed to stand for 24 hours under an environmental condition of 30 ° C. and 90% RH, and the degree of swelling of the loaded portion was visually evaluated. The evaluation was made in 5 stages, with 5 being the smallest swelling of the wall surface of the loading section and 1 being the largest. Those with an evaluation of 2 to 5 were acceptable levels with no practical problems, and those with an evaluation of 1 were unacceptable levels with practical problems.

<Applicability for cutting>
The cutting process aptitude when the obtained carrier tape mount for chip-shaped electronic components was cut into a strip shape having a width of 2 cm and a length of 20 cm was evaluated. The evaluation criteria are as follows.
○: Good cutting processability, no problem in practical use.
X: The paper is twisted at the time of the level difference, the accuracy of the cutting dimension is low, and there are practical problems.

  As shown in Table 1, the carrier tape mounts for chip-shaped electronic components obtained in Examples 1 to 9 all had a satisfactory degree of swelling of the loading portion, and were of a level causing no practical problems. Further, the carrier tape mount for chip-shaped electronic components of Examples 5 to 9 to which the wet paper strength enhancer was added was the carrier tape mount for chip-shaped electronic components of Examples 1 to 4 to which the wet paper strength enhancer was not added. Compared to the above, the swelling of the loading part was less. On the other hand, the carrier tape mount for chip-shaped electronic components obtained in Comparative Example 1 had a too low moisture content, so the swelling of the loading portion was large and there was a practically problematic level. Further, since the carrier tape mount for chip-shaped electronic parts obtained in Comparative Example 2 has a too high moisture content, there is a problem in practical use due to the occurrence of twisting at the time of cutting and the accuracy of the cutting dimensions. It was.

Claims (5)

It consists of a base paper containing pulp as a main component and containing a wet paper strength enhancer, and the base paper contains 0.4 to 1.2 parts by weight of a wet paper strength enhancer with respect to 100 parts by weight of pulp. In a carrier tape mount for chip-shaped electronic components whose moisture content is 8.5 to 12% as measured according to JIS P 8127 (measured value at 23 ° C. and environmental conditions of 50% RH for 24 hours) A carrier tape mount for chip-shaped electronic components, wherein concave or perforated loading portions for loading chip-shaped electronic components are formed at regular intervals.   The carrier tape mount for chip-shaped electronic components according to claim 1, wherein the wet paper strength enhancer is a polyamide epichlorohydrin resin or a polyamide epoxy resin. The chip-like electronic component according to claim 1 or 2, wherein the base paper contains 0.6 to 0.9 parts by mass of a wet paper strength enhancer with respect to 100 parts by mass of pulp. Carrier tape mount. The base paper contains 0.4 to 1.2 parts by weight of a wet paper strength enhancer with respect to 100 parts by weight of pulp, and the water content is JIS P 8127. The chip is mounted on a carrier tape mount for chip-like electronic components that has been dried so that the measurement value (measurement value adjusted for 24 hours at 23 ° C. and 50% RH environmental conditions) is 8.5 to 12%. A method for producing a carrier tape mount for chip-shaped electronic components, wherein concave or perforated loading portions for loading the electronic components are formed at regular intervals. The carrier for chip-shaped electronic components according to claim 4 , wherein the base paper contains 0.6 to 0.9 parts by mass of a wet paper strength enhancer with respect to 100 parts by mass of pulp. Manufacturing method of tape mount.