JP2003226393A - Package of electronic component - Google Patents
Package of electronic componentInfo
- Publication number
- JP2003226393A JP2003226393A JP2002025920A JP2002025920A JP2003226393A JP 2003226393 A JP2003226393 A JP 2003226393A JP 2002025920 A JP2002025920 A JP 2002025920A JP 2002025920 A JP2002025920 A JP 2002025920A JP 2003226393 A JP2003226393 A JP 2003226393A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- resin
- paper
- cover tape
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品梱包体に
関し、特に、紙毛羽の発生率が低く、カバーテープを剥
離する際の剥離強度の安定性が高い電子部品梱包体に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic parts package, and more particularly to an electronic parts package having a low occurrence of paper fluff and a high stability of peel strength when a cover tape is peeled off.
【０００２】[0002]
【従来技術】アセンブリメーカーにおいて、電子部品を
部品挿入装置や部品実装装置に供給する際には、電子部
品を一定の方向に揃えて１個ずつ供給する必要がある。
このためキャリアテープやカセットケースなどに電子部
品を梱包したものを部品メーカーからアセンブリメーカ
ーへ供給する形態が一般的になっている。2. Description of the Related Art In an assembly maker, when supplying electronic components to a component insertion device or a component mounting device, it is necessary to align the electronic components in a certain direction and supply them one by one.
For this reason, it is common practice to supply electronic components packed in a carrier tape or a cassette case from a component maker to an assembly maker.
【０００３】このうちキャリアテープを用いた梱包体と
しては、紙テープをキャリアテープとし、そのキャリア
テープにチップ収納孔としての凹部を長さ方向に複数配
列させ、電子部品を収納したチップ収納孔の開口部を塞
ぐようにしてキャリアテープの表面に樹脂などで作製さ
れたカバーテープを接着したものがある。Among them, as a package using a carrier tape, a paper tape is used as a carrier tape, and a plurality of recesses as chip storage holes are arranged in the carrier tape in the length direction to open a chip storage hole for storing electronic parts. In some cases, a cover tape made of resin or the like is adhered to the surface of the carrier tape so as to close the portion.
【０００４】従来、カバーテープとキャリアテープを接
着する方法としては、樹脂接着剤を用いたものがあっ
た。図６(ａ)、(ｂ)は、樹脂を接着剤として用いた電子
部品梱包体を説明する図である。図６(ａ)はカバーテー
プの一部を破断した電子部品梱包体の一部を示す平面図
であり、図６(ｂ)は図６(ａ)のＸ−Ｘ線断面図である。Conventionally, as a method of adhering the cover tape and the carrier tape, there has been a method using a resin adhesive. FIGS. 6A and 6B are views for explaining an electronic component package using resin as an adhesive. 6A is a plan view showing a part of the electronic component package in which a part of the cover tape is broken, and FIG. 6B is a sectional view taken along line XX of FIG. 6A.
【０００５】図６(ａ)の電子部品梱包体１のように、チ
ップ収納孔５と送り孔７が長尺状のキャリアテープ２に
形成されている。チップ収納孔５は、チップ状の電子部
品６を収納するための孔であり、送り孔７は部品実装ラ
インで電子部品梱包体１を送る際に、送り爪を噛み合わ
せるための孔である。送り孔７はキャリアテープ２の裏
まで貫通しているが、チップ収納孔５は図６(ｂ)に示す
ように裏面まで貫通していない。もちろん収納孔５もキ
ャリアテープ２の裏まで貫通していてもよい。この場合
はキャリアテープ２の裏面に、長尺状のバックテープ
(図示せず)を貼着すればよい。長尺状カバーテープ３は
チップ収納孔５の開口部を閉成するように接着されてい
るが、送り孔７までは覆っていない。また、カバーテー
プ３を接着する際は、図６(ａ)に示すように、カバーテ
ープ３の表面にあらかじめ樹脂接着剤層を設けておき、
キャリアテープ２の上にカバーテープ３を貼付けた後
に、テープ長さ方向に沿って一定ピッチ毎に図６(ａ)、
(ｃ)で斜線を施した部分をヒートシールアイロンでカバ
ーテープ３を加熱加圧することでカバーテープ３とキャ
リアテープ２とを熱溶着している。As in the electronic component package 1 shown in FIG. 6A, the chip storage hole 5 and the feed hole 7 are formed in the long carrier tape 2. The chip housing hole 5 is a hole for housing the chip-shaped electronic component 6, and the feed hole 7 is a hole for engaging the feed claws when the electronic component package 1 is fed on the component mounting line. The feed hole 7 penetrates to the back side of the carrier tape 2, but the chip housing hole 5 does not penetrate to the back side as shown in FIG. 6B. Of course, the storage hole 5 may also penetrate to the back of the carrier tape 2. In this case, a long back tape is provided on the back surface of the carrier tape 2.
(Not shown) may be attached. The long cover tape 3 is adhered so as to close the opening of the chip storage hole 5, but does not cover the feed hole 7. When the cover tape 3 is adhered, a resin adhesive layer is previously provided on the surface of the cover tape 3 as shown in FIG.
After the cover tape 3 is attached on the carrier tape 2, the cover tape 3 is attached at a constant pitch along the tape length direction as shown in FIG.
The cover tape 3 and the carrier tape 2 are heat-welded by heating and pressing the cover tape 3 with a heat-sealing iron in the shaded portion in (c).
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、樹脂接
着剤４を用いてカバーテープ３とキャリアテープ２とを
熱溶着した電子部品梱包体１にあっては、製造された個
々の梱包体間における接着力のばらつきが大きいという
問題があった。従来の電子部品梱包体１では、接着力の
ばらつきが大きいので、大きな接着力で接着されたカバ
ーテープ３と小さな接着力で接着されたカバーテープ３
とでは、その接着強度に大きな開きがあった。However, in the electronic component package 1 in which the cover tape 3 and the carrier tape 2 are heat-sealed by using the resin adhesive 4, the adhesiveness between the produced individual package bodies is high. There was a problem that the variation in power was large. In the conventional electronic component package 1, since the adhesive strength varies widely, the cover tape 3 adhered with a large adhesive strength and the cover tape 3 adhered with a small adhesive strength.
Then, there was a big difference in the adhesive strength.
【０００７】そのため、カバーテープ３の接着力が大き
な電子部品梱包体１では、カバーテープ３をキャリアテ
ープ２から剥離する際に、カバーテープ３が切れたり、
キャリアテープ２の表面がカバーテープ３にくっついて
剥がれたりすることがあった。カバーテープ３が切れた
場合には、部品実装ラインを停止させてカバーテープ３
の巻き取り機構に再度カバーテープ３の端を掴ませ、巻
き取り可能にしなければならなかった。また、キャリア
テープ２の表面がカバーテープ３にくっついて剥がれた
場合には、図６（ｃ）に示すように、キャリアテープ２
の表面やカバーテープ３の裏面にファイバー状の紙繊維
である紙毛羽８が発生したり粉塵が飛散する。このよう
な紙毛羽８や粉塵が発生すると、部品吸着用の吸引ノズ
ルの詰まり等による部品実装装置の動作不良が発生する
ことがあった。また、紙毛羽８や粉塵が発生すると、ク
リーンルームが汚染されたり、実装基板のパッド部や電
子部品のリードにそれらが付着して半田付け不良が発生
することがあった。さらには、キャリアテープ２の表面
の剥がれが大きいと、部品供給を中断しなければなら
ず、部品実装ラインを停止させてメンテナンスを行なう
頻度が増加するので生産効率が低下するなどの問題があ
った。Therefore, in the electronic component package 1 having a large adhesive force of the cover tape 3, when the cover tape 3 is peeled from the carrier tape 2, the cover tape 3 may be cut off,
The surface of the carrier tape 2 was sometimes stuck to the cover tape 3 and peeled off. When the cover tape 3 is cut off, the component mounting line is stopped and the cover tape 3 is cut off.
It was necessary to make the end of the cover tape 3 again be made to be able to be wound by the winding mechanism of (3). Further, when the surface of the carrier tape 2 sticks to the cover tape 3 and is peeled off, as shown in FIG.
The paper fluff 8 which is a fibrous paper fiber is generated or dust is scattered on the front surface and the back surface of the cover tape 3. If such paper fluff 8 or dust is generated, malfunction of the component mounting apparatus may occur due to clogging of the suction nozzle for component suction or the like. Further, when the paper fluff 8 or dust is generated, the clean room may be contaminated, or they may be attached to the pads of the mounting board or the leads of the electronic components to cause defective soldering. Further, if the surface of the carrier tape 2 is largely peeled off, it is necessary to interrupt the component supply, and the frequency of performing maintenance by stopping the component mounting line is increased, so that there is a problem that the production efficiency is reduced. .
【０００８】また、カバーテープ３の剥離強度が低い
と、カバーテープ３をキャリアテープ２に接着する際や
電子部品梱包体１の輸送時、電子部品梱包体１を部品実
装装置に実装する際に、図６（ｄ）に示すようなカバー
テープ３の自然剥離９が発生し、電子部品６がキャリア
テープ２から脱落し、機器の停止を招いたり、数量不足
になる恐れがあった。When the peeling strength of the cover tape 3 is low, when the cover tape 3 is adhered to the carrier tape 2, the electronic component package 1 is transported, or the electronic component package 1 is mounted on a component mounting apparatus. As shown in FIG. 6D, the natural peeling 9 of the cover tape 3 occurs, and the electronic component 6 may drop from the carrier tape 2, leading to a stop of the device or a shortage of the quantity.
【０００９】また、カバーテープ３とキャリアテープ２
の間において、各接着領域毎に接着力のばらつきがある
と、カバーテープ３を剥離させる際にその剥離力が安定
しないために振動が発生するので、キャリアテープ２内
の電子部品６が振動して飛び出したり、収納位置がずれ
たりし、吸着ノズルで電子部品６を吸着する際、吸着で
きなかったり、吸着不良を起こし、実装基板へ実装でき
ないことがあった。Further, the cover tape 3 and the carrier tape 2
In the meantime, if there is a variation in the adhesive force between the adhesive regions, vibration occurs because the peeling force is not stable when the cover tape 3 is peeled, and the electronic component 6 in the carrier tape 2 vibrates. There are cases in which the electronic component 6 cannot be mounted or cannot be mounted on the mounting board when the electronic component 6 is sucked by the suction nozzle because of popping out or the storage position is displaced.
【００１０】本発明は上記の従来の欠点に鑑みてなされ
たものであり、その目的とするところは、カバーテープ
剥離時における紙テープ表面からの紙毛羽や粉塵の発生
が少なく、カバーテープと紙テープとの接着強度ないし
剥離強度の安定性の高い電子部品梱包体を提供すること
にある。The present invention has been made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to reduce the generation of paper fluff and dust from the surface of the paper tape when the cover tape is peeled off, and to provide the cover tape and the paper tape. An object of the present invention is to provide an electronic component package having high stability of adhesive strength or peel strength.
【００１１】[0011]
【発明の開示】本発明の請求項１にかかる電子部品梱包
体は、複数個の収納凹部が形成された紙テープの表層部
に樹脂を含浸させ、当該紙テープの収納凹部に電子部品
を収納して該収納凹部の開口部をカバーテープにより覆
い、このカバーテープを前記含浸樹脂層によって紙テー
プに接着させたことを特徴としている。DISCLOSURE OF THE INVENTION In an electronic component package according to claim 1 of the present invention, a surface layer portion of a paper tape having a plurality of storage recesses is impregnated with resin, and the electronic components are stored in the storage recesses of the paper tape. The opening of the storage recess is covered with a cover tape, and the cover tape is adhered to the paper tape with the impregnated resin layer.
【００１２】請求項１にかかる発明によれば、樹脂を表
層部に含浸させた紙テープを用いているので、紙テープ
の表面の剛性が向上する。このため、紙テープに含浸さ
せた樹脂によってカバーテープを紙テープにヒートシー
ル法などで接着する際には、紙テープの表層部において
ヒートシールアイロン等の先端部の食い込みが安定する
ので、カバーテープ剥離時の毛羽立ちを抑制できるとと
もにカバーテープと紙テープとの接着力のばらつきが減
少する。よって、紙の短繊維や紙粉塵の発生、飛散を防
止でき、吸着ノズルの詰まりを防止できるのみならず、
カバーテープの剥離強度が安定するので、カバーテープ
を剥離させる際に振動が発生しにくくなり、吸着ノズル
等により電子部品を保持する際に保持ミスを起こしにく
くなる。According to the first aspect of the invention, since the paper tape having the surface layer portion impregnated with the resin is used, the rigidity of the surface of the paper tape is improved. For this reason, when the cover tape is adhered to the paper tape by the heat-sealing method or the like by the resin impregnated in the paper tape, the bite of the tip of the heat-sealing iron or the like in the surface layer of the paper tape is stabilized, so Fluffing can be suppressed and the variation in adhesive force between the cover tape and the paper tape is reduced. Therefore, it is possible to prevent the generation and scattering of paper short fibers and paper dust and prevent clogging of the suction nozzle.
Since the peeling strength of the cover tape is stable, vibration is less likely to occur when the cover tape is peeled off, and a holding error is less likely to occur when the electronic component is held by the suction nozzle or the like.
【００１３】また、紙テープの表層部に樹脂を含浸させ
て紙テープの表面剛性を高くしているので、カバーテー
プの上からヒートシールアイロン等を押し当てても、そ
の先端部が深く食い込みにくく、過剰溶融によってカバ
ーテープの強度が低下しにくく、カバーテープが切れに
くくなる。Further, since the surface of the paper tape is impregnated with resin to increase the surface rigidity of the paper tape, even if a heat seal iron or the like is pressed from above the cover tape, the tip of the paper tape does not easily bite deeply, resulting in excess Due to the melting, the strength of the cover tape is less likely to decrease and the cover tape is less likely to break.
【００１４】また、紙テープの表面には樹脂が含浸され
ていて紙テープの表面の剛性が高くなっているので、カ
バーテープを剥がした時に、紙テープの表面が剥がれて
紙毛羽が発生しにくくなる。Further, since the surface of the paper tape is impregnated with resin and the rigidity of the surface of the paper tape is high, when the cover tape is peeled off, the surface of the paper tape is peeled off and paper fluff is less likely to occur.
【００１５】本発明の請求項１にかかる電子部品梱包体
にあっては、前記紙テープにおける前記樹脂含浸層の深
さを、紙テープの表面から３０μｍ以上５０μｍ以下
（より好ましくは、約４０μｍ程度）にすることが望ま
しい。樹脂含浸層の深さが３０μｍよりも小さい場合に
は、紙テープの表面の剛性の向上が十分でないため、カ
バーテープと紙テープとの接着強度のばらつきを十分に
小さくできず、また、カバーテープを剥離させた時に紙
テープの表面に紙毛羽が発生し易くなるからである。ま
た、樹脂含浸層の深さが５０μｍよりも大きい場合に
は、樹脂含浸層の含浸深さや樹脂含浸量のばらつきが大
きくなり、カバーテープと紙テープとの接着強度のばら
つきを十分に小さくできないからである。In the electronic component package according to claim 1 of the present invention, the depth of the resin-impregnated layer in the paper tape is 30 μm or more and 50 μm or less (more preferably about 40 μm) from the surface of the paper tape. It is desirable to do. When the depth of the resin-impregnated layer is less than 30 μm, the rigidity of the surface of the paper tape is not sufficiently improved, so that the variation in the adhesive strength between the cover tape and the paper tape cannot be sufficiently reduced, and the cover tape is peeled off. This is because paper fluffs are likely to occur on the surface of the paper tape when the tape is allowed to move. Further, when the depth of the resin-impregnated layer is larger than 50 μm, variations in the impregnation depth of the resin-impregnated layer and the amount of resin impregnated become large, and variations in the adhesive strength between the cover tape and the paper tape cannot be sufficiently reduced. is there.
【００１６】本発明の請求項３にかかる電子部品梱包体
は、複数個の収納凹部が形成された紙テープの表層部に
樹脂を含浸させ、当該紙テープの収納凹部に電子部品を
収納して該収納凹部の開口部をカバーテープにより覆
い、主として前記含浸樹脂の上において紙テープとカバ
ーテープとを接着剤によって接着させたことを特徴とし
ている。According to a third aspect of the present invention, in an electronic component package, a resin is impregnated in a surface layer portion of a paper tape having a plurality of storage recesses, and electronic components are stored in the storage recess of the paper tape. The opening of the recess is covered with a cover tape, and the paper tape and the cover tape are mainly adhered on the impregnated resin with an adhesive.
【００１７】請求項３にかかる発明によれば、樹脂を表
層部に含浸させた紙テープを用いているので、紙テープ
の剛性が向上し、カバーテープを接着剤によって接着す
る際に、カバーテープと紙テープとの接着力のばらつき
が減少する。よって、カバーテープを剥離する際にカバ
ーテープが切れにくくなる。また、紙の短繊維や紙粉塵
の発生、飛散を防止でき、吸着ノズルの詰まりを防止で
きるのみならず、カバーテープの剥離強度が安定するの
で、カバーテープを剥離させる際に振動が発生しにくく
なり、吸着ノズル等により電子部品を保持する際に保持
ミスを起こしにくくなる。According to the third aspect of the invention, since the paper tape in which the surface layer portion is impregnated with the resin is used, the rigidity of the paper tape is improved, and when the cover tape is adhered by the adhesive, the cover tape and the paper tape are used. The variation in adhesive strength with Therefore, when peeling off the cover tape, the cover tape is less likely to break. In addition, it is possible to prevent the generation and scattering of short fibers of paper and paper dust, and to prevent clogging of the suction nozzle, as well as the peel strength of the cover tape is stable, so vibration does not occur easily when peeling the cover tape. Therefore, it becomes difficult to cause a holding error when holding the electronic component by the suction nozzle or the like.
【００１８】また、紙テープの表層部に樹脂を含浸させ
て紙テープの表面剛性を高くしているので、カバーテー
プの上からヒートシールアイロン等を押し当てても、そ
の先端部が深く食い込みにくく、カバーテープの強度が
低下しにくくなる。Since the surface layer of the paper tape is impregnated with resin to increase the surface rigidity of the paper tape, even if a heat seal iron or the like is pressed from above the cover tape, the tip portion of the paper tape does not easily dig into the cover tape. The strength of the tape is less likely to decrease.
【００１９】また、紙テープの表面には樹脂が含浸され
ていて紙テープの表面の剛性が高くなっているので、カ
バーテープを剥がした時に、紙テープの表面が剥がれて
紙毛羽や粉塵が発生しにくくなる。Further, since the surface of the paper tape is impregnated with resin and the rigidity of the surface of the paper tape is high, the surface of the paper tape is peeled off when the cover tape is peeled off, and paper fluff and dust are less likely to occur. .
【００２０】本発明の請求項３にかかる電子部品梱包体
にあっては、前記紙テープにおける樹脂含浸層の深さ
を、紙テープの表面から２０μｍ以上３０μｍ以下にす
ることが望ましい。樹脂含浸層の深さが２０μｍよりも
小さい場合には、紙テープの表面の剛性の向上が十分で
ないため、カバーテープと紙テープとの接着強度のばら
つきを十分に小さくできず、また、カバーテープを剥離
させた時に紙テープの表面に紙毛羽が発生し易くなるか
らである。また、樹脂含浸層の深さが３０μｍよりも大
きい場合には、樹脂含浸層の含浸深さや樹脂含浸量のば
らつきが大きくなり、カバーテープと紙テープとの接着
強度のばらつきを十分に小さくできないからである。In the electronic component package according to claim 3 of the present invention, it is desirable that the depth of the resin impregnated layer in the paper tape is 20 μm or more and 30 μm or less from the surface of the paper tape. When the depth of the resin-impregnated layer is less than 20 μm, the rigidity of the surface of the paper tape is not sufficiently improved, so that the variation in the adhesive strength between the cover tape and the paper tape cannot be sufficiently reduced, and the cover tape is peeled off. This is because paper fluffs are likely to occur on the surface of the paper tape when the tape is allowed to move. Further, when the depth of the resin impregnated layer is larger than 30 μm, variations in the impregnation depth of the resin impregnated layer and the amount of resin impregnated become large, and variations in the adhesive strength between the cover tape and the paper tape cannot be sufficiently reduced. is there.
【００２１】請求項５にかかる電子部品梱包体は、請求
項１、２、３、４に記載の発明において、前記紙テープ
に含浸させた樹脂量が、０.００１ｇ／ｃｍ３以上０.１
ｇ／ｃｍ３以下であることを特徴するものである。特
に、紙テープに含浸させる樹脂量は、０.０２５ｇ／ｃ
ｍ３以上０.０５ｇ／ｃｍ３以下が望ましい。含浸樹脂
量が０.００１ｇ／ｃｍ３よりも少ない場合には、紙テ
ープの表面の剛性が不足するからであり、樹脂含浸量が
０.１ｇ／ｃｍ３より多いと、紙テープの剛性が高くな
り過ぎて紙テープの取り扱いが困難になったり、樹脂含
浸に時間が掛かったりするためである。According to a fifth aspect of the present invention, in the electronic component packaging body according to the first, second, third , and fourth aspects, the amount of resin impregnated in the paper tape is 0.001 g / cm 3 or more and 0.1 or more.
It is characterized by being g / cm 3 or less. In particular, the amount of resin impregnated into the paper tape is 0.025 g / c
It is desirable that m 3 or more and 0.05 g / cm 3 or less. This is because when the amount of impregnated resin is less than 0.001 g / cm 3 , the rigidity of the surface of the paper tape is insufficient, and when the amount of resin impregnated is more than 0.1 g / cm 3 , the rigidity of the paper tape becomes too high. This makes it difficult to handle the paper tape, and it takes time to impregnate the resin.
【００２２】[0022]
【発明の実施の形態】本発明の電子部品梱包体の断面図
である図１〜図３を参照して、本発明の各実施形態を説
明する。但し、本発明において、電子部品梱包体のチッ
プ収納孔５や送り孔７等の基本的な構造は従来技術で説
明した構造と同じであるので、ここでは説明を省略す
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to FIGS. 1 to 3 which are cross-sectional views of an electronic component package according to the present invention. However, in the present invention, the basic structure of the chip housing hole 5, the feed hole 7, etc. of the electronic component package is the same as the structure described in the prior art, and therefore the description thereof is omitted here.
【００２３】（第１の実施形態）図１は、本発明による
電子部品梱包体１１における第１の実施形態を説明する
図である。図１に示す電子部品梱包体１１は、紙テープ
からなる長尺状キャリアテープ２と樹脂製の長尺状カバ
ーテープ３とからなり、キャリアテープ２の上面にカバ
ーテープ３が接着されている。キャリアテープ２には、
電子部品６を挿入するためのチップ収納孔５が長さ方向
に沿って一定ピッチ毎に複数配列されており、電子部品
６を納めたチップ収納孔５の開口部を覆うようにしてキ
ャリアテープ２の上面にカバーテープ３が貼り付けられ
ている。(First Embodiment) FIG. 1 is a diagram for explaining a first embodiment of an electronic component package 11 according to the present invention. The electronic component package 11 shown in FIG. 1 comprises a long carrier tape 2 made of a paper tape and a long cover tape 3 made of resin, and the cover tape 3 is bonded to the upper surface of the carrier tape 2. On the carrier tape 2,
A plurality of chip accommodating holes 5 for inserting the electronic components 6 are arranged at a constant pitch along the length direction, and the carrier tape 2 covers the opening of the chip accommodating holes 5 accommodating the electronic component 6. A cover tape 3 is attached to the upper surface of the.
【００２４】キャリアテープ２の表層部の全面もしくは
少なくともカバーテープ３が接着される領域には、樹脂
を含浸させて樹脂含浸層１２が形成されている。樹脂含
浸層１２に含浸させる樹脂は、ＰＶＡ(ポリビニルアル
コール)、ＰＥ(ポリエチレン)、ＰＥＴ(ポリエチレンテ
レフタレート)などの軟質樹脂を用いることが望ましい
が、これらに限るものではない。A resin-impregnated layer 12 is formed by impregnating a resin on the entire surface of the carrier tape 2 or at least in the region where the cover tape 3 is bonded. The resin to be impregnated in the resin impregnated layer 12 is preferably a soft resin such as PVA (polyvinyl alcohol), PE (polyethylene), PET (polyethylene terephthalate), but is not limited thereto.
【００２５】また、樹脂含浸層１２の含浸深さＤは、テ
ープ表面から３０μｍ〜５０μｍの範囲が望ましく、特
に４０μｍ程度が最適である。また、樹脂含浸層１２の
含浸深さＤは、キャリアテープ２の厚みＴの２％以上１
０％以下が望ましい。すなわち、
０.０２ ≦ Ｄ／Ｔ ≦ ０.１
の関係を満たすことが望ましい。樹脂含浸層１２の含浸
深さＤを３０μｍ〜５０μｍとすることにより、カバー
テープ３の剥離強度のばらつきを小さくすることがで
き、特に比較的高いヒートシール温度でも、剥離強度の
ばらつき（＝最大値−最小値）を２０ｇｆ以下にするこ
とが可能となる。また、カバーテープ３の適正な剥離強
度は１０ｇｆ以上３０ｇｆ以下であるが、樹脂含浸層１
２の含浸深さを３０μｍ〜５０μｍとすることにより、
約１６０℃以下の温度範囲でカバーテープ３の剥離強度
をこの適正剥離強度内に納めることができる。また、樹
脂含浸層１２に含浸させる樹脂量は、０.００１〜０.１
ｇ／ｃｍ３、特に、０.０２５〜０.０５ｇ／ｃｍ３が好
ましい。Further, the impregnation depth D of the resin impregnated layer 12 is preferably in the range of 30 μm to 50 μm from the tape surface, and most preferably about 40 μm. The impregnation depth D of the resin impregnated layer 12 is 2% or more of the thickness T of the carrier tape 2 1
0% or less is desirable. That is, it is desirable that the relationship of 0.02 ≤ D / T ≤ 0.1 is satisfied. By setting the impregnation depth D of the resin-impregnated layer 12 to 30 μm to 50 μm, it is possible to reduce the variation in peel strength of the cover tape 3, and particularly, even at a relatively high heat seal temperature, the variation in peel strength (= maximum value). -Minimum value) can be set to 20 gf or less. The proper peel strength of the cover tape 3 is 10 gf or more and 30 gf or less, but the resin impregnated layer 1
By setting the impregnation depth of 2 to 30 μm to 50 μm,
The peel strength of the cover tape 3 can be kept within this proper peel strength in the temperature range of about 160 ° C. or less. The amount of resin impregnated in the resin impregnated layer 12 is 0.001 to 0.1.
g / cm 3, in particular, 0.025~0.05g / cm 3 are preferred.
【００２６】キャリアテープ２とカバーテープ３を接着
する際には、キャリアテープ２の上にカバーテープ３を
重ね、ヒートシールアイロン等でカバーテープ３を押え
てカバーテープ３の樹脂含浸層１２表面を溶融させるこ
とにより、チップ収納孔５の両側縁に沿って一定ピッチ
毎にカバーテープ３をキャリアテープ２の表面に溶着さ
せる。このとき、キャリアテープ２の表層部には樹脂含
浸層１２が形成されているので、キャリアテープ２の表
面の剛性ないし強度が向上してキャリアテープ２の表層
部におけるヒートシールアイロン先端部の食い込みが減
少し、カバーテープ３をキャリアテープ２から剥離させ
るときの剥離強度の減少と安定性が向上する。その一方
で、カバーテープ３はキャリアテープ２の表面に含浸さ
れた樹脂含浸層１２に主として溶着されることになるの
で、カバーテープ３とキャリアテープ２との接着が確実
となり、カバーテープ３の剥離強度のばらつきが小さく
なる。When the carrier tape 2 and the cover tape 3 are adhered, the cover tape 3 is placed on the carrier tape 2, and the cover tape 3 is pressed by a heat seal iron or the like so that the surface of the resin impregnated layer 12 of the cover tape 3 is covered. By melting, the cover tape 3 is welded to the surface of the carrier tape 2 at regular intervals along both side edges of the chip storage hole 5. At this time, since the resin-impregnated layer 12 is formed on the surface layer portion of the carrier tape 2, the rigidity or strength of the surface of the carrier tape 2 is improved, and the tip of the heat-sealing iron in the surface layer portion of the carrier tape 2 is cut in. When the cover tape 3 is peeled from the carrier tape 2, the peel strength is reduced and the stability is improved. On the other hand, the cover tape 3 is mainly welded to the resin-impregnated layer 12 with which the surface of the carrier tape 2 is impregnated, so that the cover tape 3 and the carrier tape 2 are reliably bonded and the cover tape 3 is peeled off. Variations in strength are reduced.
【００２７】こうしてカバーテープ３の剥離強度のばら
つきが小さくなる結果、カバーテープ３を剥離する際に
カバーテープ３が切れにくくなり、カバーテープ３の破
断によって部品実装ラインが停止したりしにくくなる。
また、電子部品梱包体の輸送時や実装時などにカバーテ
ープの自然剥離が発生しにくくなり、電子部品の脱落が
起きにくくなり、電子部品の吸着ミスや数量不足を防止
することができる。さらには、カバーテープの剥離強度
が安定するので、カバーテープを剥離させる際に振動が
発生しにくくなり、収納孔５からの飛び出しや位置ずれ
が防止でき、吸着ノズル等により電子部品を保持する際
に保持ミスを起こしにくくなる。As a result of the variation in the peeling strength of the cover tape 3 thus reduced, the cover tape 3 is less likely to break when the cover tape 3 is peeled off, and the component mounting line is less likely to stop due to breakage of the cover tape 3.
Also, the natural peeling of the cover tape is less likely to occur during the transportation or mounting of the electronic component package, the electronic components are less likely to fall off, and it is possible to prevent the electronic components from being sucked in error or insufficient in quantity. Furthermore, since the peeling strength of the cover tape is stable, vibration is less likely to occur when peeling the cover tape, and it is possible to prevent the cover tape from popping out of the storage hole 5 and misalignment, and to hold electronic components by a suction nozzle or the like. It is difficult to make a mistake in holding.
【００２８】また、キャリアテープ２の表面には樹脂含
浸層１２が形成されていてキャリアテープ２の剛性が高
くなっているので、カバーテープ３を剥がした時に、キ
ャリアテープ２の表面が剥がれて層間剥離を起こし、紙
毛羽や紙の粉塵が発生することが少なくなる。この結
果、部品吸着用の吸引ノズルの詰まり等による部品実装
装置の動作不良を避けることができ、また、クリーンル
ーム等の汚染を防止することでき、紙毛羽や粉塵の付着
による半田付け不良も防止することができる。Further, since the resin impregnated layer 12 is formed on the surface of the carrier tape 2 and the rigidity of the carrier tape 2 is high, when the cover tape 3 is peeled off, the surface of the carrier tape 2 is peeled off and the interlayer is removed. Peeling and paper dust and paper dust are less likely to occur. As a result, it is possible to avoid malfunction of the component mounting device due to clogging of the suction nozzle for component suction, prevent contamination of the clean room, etc., and also prevent soldering defects due to paper fluff or dust adhesion. be able to.
【００２９】図２は上記実施形態による電子部品梱包体
の変形例を示す概略断面図である。図１に示した電子部
品梱包体１３では、電子部品６のチップ収納孔５は、キ
ャリアテープ２を貫通させることなく作製しているが、
図２のように、紙テープ１４にチップ収納孔５を貫通さ
せて形成し、この紙テープ１４の裏面にバックテープ１
５を樹脂接着剤２２で接着させてチップ収納孔５の底面
開口を塞ぐようにしてもよい。FIG. 2 is a schematic sectional view showing a modification of the electronic component package according to the above embodiment. In the electronic component package 13 shown in FIG. 1, the chip storage hole 5 of the electronic component 6 is manufactured without penetrating the carrier tape 2.
As shown in FIG. 2, the paper tape 14 is formed by penetrating the chip storage holes 5, and the back tape 1 is formed on the back surface of the paper tape 14.
5 may be bonded with a resin adhesive 22 to close the bottom opening of the chip storage hole 5.
【００３０】（第２の実施形態）図３は、本発明の第２
の実施形態による電子部品梱包体１６の断面を示す図で
ある。図３に示す電子部品梱包体１６にあっては、紙テ
ープからなる長尺状キャリアテープ２と樹脂製のカバー
テープ３とからなり、キャリアテープ２の上面にカバー
テープ３が接着されている。キャリアテープ２の上面に
は、電子部品６を挿入するためのチップ収納孔５が長さ
方向に沿って一定ピッチ毎に複数配列されている。カバ
ーテープ３は、キャリアテープ２の上面もしくはカバー
テープ３の下面に塗布された樹脂接着剤１７によってキ
ャリアテープ２に接着されており、電子部品６を納めた
チップ収納孔５の開口部を覆っている。(Second Embodiment) FIG. 3 shows a second embodiment of the present invention.
It is a figure which shows the cross section of the electronic component package 16 by embodiment of this. The electronic component package 16 shown in FIG. 3 includes a long carrier tape 2 made of a paper tape and a cover tape 3 made of resin, and the cover tape 3 is adhered to the upper surface of the carrier tape 2. On the upper surface of the carrier tape 2, a plurality of chip accommodating holes 5 for inserting the electronic components 6 are arranged at a constant pitch along the length direction. The cover tape 3 is adhered to the carrier tape 2 with a resin adhesive 17 applied to the upper surface of the carrier tape 2 or the lower surface of the cover tape 3, and covers the opening of the chip storage hole 5 in which the electronic component 6 is stored. There is.
【００３１】キャリアテープ２の表層部の全面もしくは
少なくともカバーテープ３を接着される領域には、樹脂
を含浸させて樹脂含浸層１２が形成されている。樹脂含
浸層１２に含浸させる樹脂は、ＰＶＡ(ポリビニルアル
コール)、ＰＥ(ポリエチレン)、ＰＥＴ(ポリエチレンテ
レフタレート)などの軟質樹脂を用いることが望ましい
が、これらに限るものではない。カバーテープ３は、こ
の樹脂含浸層１２の上面もしくはカバーテープ３の下面
に塗布された樹脂接着剤１７によってキャリアテープ２
の表面に接着される。A resin-impregnated layer 12 is formed by impregnating a resin on the entire surface of the carrier tape 2 or at least in the region where the cover tape 3 is bonded. The resin to be impregnated in the resin impregnated layer 12 is preferably a soft resin such as PVA (polyvinyl alcohol), PE (polyethylene), PET (polyethylene terephthalate), but is not limited thereto. The cover tape 3 is formed on the carrier tape 2 by the resin adhesive 17 applied to the upper surface of the resin impregnated layer 12 or the lower surface of the cover tape 3.
Glued to the surface of.
【００３２】この実施形態の場合には、樹脂含浸層１２
の含浸深さＤは、テープ表面から２０μｍ〜３０μｍの
範囲が望ましい。この実施形態では、カバーテープ３を
樹脂接着剤１７によって接着するので、樹脂含浸層１２
の含浸深さは第１の実施形態の場合よりも薄くすること
ができる。In the case of this embodiment, the resin impregnated layer 12
The impregnation depth D of is preferably in the range of 20 μm to 30 μm from the tape surface. In this embodiment, since the cover tape 3 is adhered by the resin adhesive 17, the resin impregnated layer 12
The impregnation depth of can be made thinner than in the case of the first embodiment.
【００３３】図３のような実施形態による電子部品梱包
体１６にあっても、第１の実施形態と同様な作用効果を
奏することができ、カバーテープ３の剥離強度のばらつ
きを小さくすることができる。すなわち、キャリアテー
プ２の表面の剛性を高くしてカバーテープ３の剥離強度
のばらつきを小さくできるので、カバーテープ３とキャ
リアテープ２の接着が不十分で電子部品が脱落したり、
カバーテープ３の剥離強度が大き過ぎてカバーテープ３
が破断したり、カバーテープ３の剥離時に紙毛羽や紙粉
塵が発生したり、カバーテープ３の剥離時の振動が大き
くなったりといった従来からの不具合を解消することが
できる。Even in the electronic component package 16 according to the embodiment as shown in FIG. 3, the same effects as those of the first embodiment can be obtained, and the variation in the peel strength of the cover tape 3 can be reduced. it can. That is, since the rigidity of the surface of the carrier tape 2 can be increased and the variation in the peeling strength of the cover tape 3 can be reduced, the adhesiveness between the cover tape 3 and the carrier tape 2 is insufficient, and the electronic component may fall off.
The peeling strength of the cover tape 3 is too great and the cover tape 3
It is possible to eliminate the conventional problems such as breakage of paper, generation of paper fluff or paper dust when the cover tape 3 is peeled, and large vibration when the cover tape 3 is peeled.
【００３４】なお、上記各実施形態においては、カバー
テープ３として樹脂製テープを用いているが、カバーテ
ープ３の材質はこれに限るものではない。In each of the above embodiments, the resin tape is used as the cover tape 3, but the material of the cover tape 3 is not limited to this.
【００３５】[0035]
【実施例】第１の実施形態に相当する本発明の電子部品
梱包体を作製し、カバーテープとキャリアテープとの剥
離強度と紙毛羽の発生率を測定した。以下、この実施例
と測定結果について説明する。紙テープにチップ収納孔
を形成したキャリアテープの表面に樹脂を含浸させて含
浸深さが３０μｍ〜５０μｍの樹脂含浸層を形成した。
ついで、ヒートシールアイロンによる接着温度を１４０
℃〜２００℃の範囲で１０℃ずつ異ならせて、ヒートシ
ールアイロンによりキャリアテープの樹脂含浸層にカバ
ーテープを接着させて本発明のサンプルを作製した。こ
の後、カバーテープをキャリアテープから剥離する際の
剥離強度と紙毛羽発生率を測定した。Example An electronic component package of the present invention corresponding to the first embodiment was produced, and the peel strength between the cover tape and the carrier tape and the occurrence rate of paper fluff were measured. Hereinafter, this example and the measurement results will be described. A resin was impregnated on the surface of a carrier tape having chip storage holes formed in a paper tape to form a resin impregnated layer having an impregnation depth of 30 μm to 50 μm.
Then, set the adhesion temperature by heat seal iron to 140
The sample of the present invention was produced by adhering the cover tape to the resin-impregnated layer of the carrier tape with a heat-sealing iron while changing the temperature in the range of ℃ to 200 ℃ by 10 ℃. Then, the peel strength and the paper fluff generation rate when the cover tape was peeled from the carrier tape were measured.
【００３６】一方、紙テープからなるキャリアテープの
表面に１０μｍ〜１００μｍの厚みで樹脂接着剤を塗布
し、この樹脂接着剤を用いてキャリアテープの表面にカ
バーテープを接着して従来例のサンプルを作製した。こ
の従来例のサンプルについても、カバーテープをキャリ
アテープから剥離する際の剥離強度と紙毛羽発生率を測
定した。On the other hand, a resin adhesive is applied to the surface of a carrier tape made of a paper tape in a thickness of 10 μm to 100 μm, and a cover tape is adhered to the surface of the carrier tape using this resin adhesive to prepare a sample of a conventional example. did. Also in this sample of the conventional example, the peel strength and the paper fuzz generation rate when the cover tape was peeled from the carrier tape were measured.
【００３７】図４は本発明のサンプルと従来例のサンプ
ルについて剥離強度を測定した結果を示すグラフであっ
て、横軸はヒートシールアイロンの温度を示し、縦軸が
カバーテープとキャリアテープの剥離強度を示してい
る。尚、破線で結ばれている本発明のサンプルのデータ
と従来例のサンプルのデータとは、同一接着温度で測定
されたものであり、本発明のサンプルの場合における■
のマークと、従来例のサンプルの場合における●のマー
クとは、剥離強度の平均値を示している。FIG. 4 is a graph showing the results of measuring the peel strength of the sample of the present invention and the sample of the conventional example. The horizontal axis represents the temperature of the heat-sealing iron, and the vertical axis represents the peeling of the cover tape and carrier tape. Shows strength. The data of the sample of the present invention and the data of the sample of the conventional example, which are connected by a broken line, are measured at the same bonding temperature.
The mark and the mark ● in the case of the sample of the conventional example show the average value of the peel strength.
【００３８】図４から分かるように、ヒートシールアイ
ロンの接着温度域全体にわたって本発明のサンプルで
は、従来例のサンプルよりも剥離強度のばらつきが小さ
くなっていることが分かる。特に、本発明のサンプルに
おける剥離強度の最大値は、いずれも従来例のサンプル
の剥離強度最大値よりも小さく、且つ、本発明のサンプ
ルにおける剥離強度の最小値は、いずれも従来例のサン
プルの剥離強度最小値よりも大きくなっている。しか
も、本発明のサンプルの場合においては、最大値でも６
０ｇｆ以下の剥離強度を達成でき、最小値では５ｇｆ以
上の剥離強度となる。特に、接着温度が１５０℃〜１６
０℃くらいの領域では、最小値〜最大値が１０ｇｆ〜３
０ｇｆという適正な剥離強度を得ることができた。As can be seen from FIG. 4, in the sample of the present invention, the variation of the peel strength is smaller than that of the sample of the conventional example over the entire bonding temperature range of the heat-sealing iron. In particular, the maximum value of the peel strength of the sample of the present invention is smaller than the maximum value of the peel strength of the sample of the conventional example, and the minimum value of the peel strength of the sample of the present invention is The peel strength is larger than the minimum value. Moreover, in the case of the sample of the present invention, the maximum value is 6
A peel strength of 0 gf or less can be achieved, and a minimum value is a peel strength of 5 gf or more. Particularly, the adhesion temperature is 150 ° C to 16
In the region of 0 ° C, the minimum value-maximum value is 10 gf-3
An appropriate peel strength of 0 gf could be obtained.
【００３９】次に、図５は紙毛羽の発生率を測定した結
果を表わしている。これは紙毛羽全体に対して長さが
０.０３ｍｍ以上の紙毛羽の発生率を調べたものであ
る。図５から明らかなように、どのヒートシールアイロ
ンの接着温度においても、従来のサンプルに比べ、本発
明におけるサンプルの方が紙毛羽の発生率が半分かそれ
以下になっており、ヒートシールアイロンの接着温度が
高温になれば、紙毛羽の発生を抑制する効果は顕著にな
っている。しかも、紙毛羽発生率を最高で１０％以下に
することが可能となっている。Next, FIG. 5 shows the result of measuring the occurrence rate of paper fluff. This is an examination of the occurrence rate of paper fluff having a length of 0.03 mm or more with respect to the entire paper fluff. As is clear from FIG. 5, at any bonding temperature of the heat-sealing iron, the sample of the present invention has a generation rate of paper fluff that is half or less than that of the conventional sample. When the bonding temperature becomes high, the effect of suppressing the generation of paper fluff becomes remarkable. Moreover, it is possible to reduce the paper fluff occurrence rate to 10% or less at the maximum.
【００４０】また、本発明のサンプルにおいては、カバ
ーテープの自然剥離も全く発生しなかった。In the sample of the present invention, spontaneous peeling of the cover tape did not occur at all.
【００４１】なお、本発明の第２の実施形態に相当する
本発明のサンプルを作製して、同様に剥離強度と紙毛羽
発生率を測定した場合にも、図４、図５と同様な結果が
得られた。更に、その場合には、従来品のサンプルと比
較して、キャリアテープの剛性は２０％向上し、層間強
度は１０％向上した。Even when the sample of the present invention corresponding to the second embodiment of the present invention was prepared and the peel strength and the occurrence rate of paper fluff were measured in the same manner, the same results as in FIGS. 4 and 5 were obtained. was gotten. Further, in that case, the rigidity of the carrier tape was improved by 20% and the interlayer strength was improved by 10% as compared with the conventional sample.
【００４２】[0042]
【発明の効果】本発明の電子部品梱包体にあっては、樹
脂含浸層によって紙テープの表面の剛性が向上している
ので、紙テープに含浸させた樹脂によってカバーテープ
を紙テープにヒートシール法などで接着する際には、紙
テープの表層部においてヒートシールアイロン等の先端
部の食い込みが安定するので、カバーテープと紙テープ
との接着力のばらつきが減少する。よって、カバーテー
プを剥離する際にカバーテープが切れにくくなる。ま
た、電子部品梱包体の輸送時や実装時などにカバーテー
プの自然剥離が発生しにくくなり、電子部品の脱落が起
きにくくなる。さらには、カバーテープの剥離強度が安
定するので、カバーテープを剥離させる際に振動が発生
しにくくなり、吸着ノズル等により電子部品を保持する
際に保持ミスを起こしにくくなる。In the electronic component package of the present invention, the rigidity of the surface of the paper tape is improved by the resin-impregnated layer. Therefore, the cover tape is heat-sealed to the paper tape by the resin impregnated in the paper tape. At the time of bonding, the biting of the tip of the heat-sealing iron or the like is stabilized in the surface layer of the paper tape, so that the variation in the adhesive force between the cover tape and the paper tape is reduced. Therefore, when peeling off the cover tape, the cover tape is less likely to break. Further, the peeling of the cover tape is less likely to occur when the electronic component package is transported or mounted, and the electronic component is less likely to drop off. Furthermore, since the peeling strength of the cover tape is stable, vibration is less likely to occur when the cover tape is peeled off, and a holding error is less likely to occur when the electronic component is held by the suction nozzle or the like.
【００４３】また、紙テープの表層部に樹脂を含浸させ
て紙テープの表面剛性を高くしているので、カバーテー
プの上からヒートシールアイロン等を押し当てても、そ
の先端部が深く食い込みにくく、過剰溶融によってカバ
ーテープの強度が低下しにくく、カバーテープが切れに
くくなる。Further, since the surface layer of the paper tape is impregnated with resin to increase the surface rigidity of the paper tape, even if a heat seal iron or the like is pressed from above the cover tape, the tip portion of the paper tape does not easily bite deeply, resulting in excess. Due to the melting, the strength of the cover tape is less likely to decrease and the cover tape is less likely to break.
【００４４】また、紙テープの表面には樹脂が含浸され
ていて紙テープの表面の剛性が高くなっているので、カ
バーテープを剥がした時に、紙テープの表面が剥がれて
紙毛羽や粉塵が発生しにくくなる。Further, since the surface of the paper tape is impregnated with resin and the rigidity of the surface of the paper tape is high, when the cover tape is peeled off, the surface of the paper tape peels off and paper fluff and dust are less likely to occur. .
【図１】本発明の電子部品梱包体における、第１の実施
形態を説明する断面図である。FIG. 1 is a sectional view illustrating a first embodiment of an electronic component package according to the present invention.
【図２】同上の実施形態の変形例を説明する断面図であ
る。FIG. 2 is a cross-sectional view illustrating a modified example of the above embodiment.
【図３】本発明の電子部品梱包体における、第２の実施
形態を説明する断面図である。FIG. 3 is a sectional view illustrating a second embodiment of an electronic component package according to the present invention.
【図４】本発明の実施例における、カバーテープと紙と
の剥離強度を示すグラフである。FIG. 4 is a graph showing the peel strength between the cover tape and the paper in the example of the present invention.
【図５】同上の実施例における、カバーテープ剥離時の
紙毛羽発生率を示すグラフである。FIG. 5 is a graph showing a paper fluff occurrence rate when the cover tape is peeled off in the example of the same.
【図６】従来の電子部品梱包体を説明する図であって、
（ａ）は従来の電子部品梱包体の一部破断した平面図、
（ｂ）は（ａ）のＸ−Ｘ線断面図、（ｃ）はカバーテー
プを剥がした状態の平面図、（ｄ）はカバーテープの一
部が自然に剥がれた状態を示す平面図である。FIG. 6 is a diagram illustrating a conventional electronic component package,
(A) is a partially broken plan view of a conventional electronic component package,
(B) is a cross-sectional view taken along line XX of (a), (c) is a plan view in a state where the cover tape is peeled off, and (d) is a plan view showing a state in which a part of the cover tape is naturally peeled off. .
１１ 電子部品梱包体 １２ キャリアテープ １３ カバーテープ １５ チップ収納孔 １６ 電子部品 ２０ 樹脂含浸層 ２１ 樹脂接着剤 11 Electronic parts package 12 carrier tape 13 cover tape 15 Chip storage hole 16 electronic components 20 Resin impregnation layer 21 Resin adhesive
フロントページの続き Ｆターム(参考） 3E096 AA06 BA08 CA14 DA14 DB06 DC01 EA01X EA02Y FA14 FA27 GA05 Continued front page F term (reference) 3E096 AA06 BA08 CA14 DA14 DB06 DC01 EA01X EA02Y FA14 FA27 GA05
Claims (5)
の表層部に樹脂を含浸させ、当該紙テープの収納凹部に
電子部品を収納して該収納凹部の開口部をカバーテープ
により覆い、このカバーテープを前記含浸樹脂層によっ
て紙テープに接着させた電子部品梱包体。1. A surface layer of a paper tape having a plurality of storage recesses formed therein is impregnated with a resin, an electronic component is stored in the storage recess of the paper tape, and an opening of the storage recess is covered with a cover tape. An electronic component package in which a tape is adhered to a paper tape by the impregnated resin layer.
深さを、紙テープの表面から３０μｍ以上５０μｍ以下
にしたことを特徴とする、請求項１に記載の電子部品梱
包体。2. The package of electronic parts according to claim 1, wherein the depth of the resin-impregnated layer in the paper tape is 30 μm or more and 50 μm or less from the surface of the paper tape.
の表層部に樹脂を含浸させ、当該紙テープの収納凹部に
電子部品を収納して該収納凹部の開口部をカバーテープ
により覆い、主として前記含浸樹脂の上において紙テー
プとカバーテープとを接着剤によって接着させたことを
特徴とする電子部品梱包体。3. A surface layer of a paper tape having a plurality of storage recesses formed therein is impregnated with a resin, an electronic component is stored in the storage recess of the paper tape, and an opening of the storage recess is covered with a cover tape. A package for electronic parts, characterized in that a paper tape and a cover tape are adhered on an impregnated resin with an adhesive.
を、紙テープの表面から２０μｍ以上３０μｍ以下にし
たことを特徴とする、請求項３に記載の電子部品梱包
体。4. The package of electronic parts according to claim 3, wherein the depth of the resin-impregnated layer in the paper tape is 20 μm or more and 30 μm or less from the surface of the paper tape.
０.００１ｇ／ｃｍ３以上０.１ｇ／ｃｍ３以下であるこ
とを特徴とする、請求項１、２、３又は４に記載の電子
部品梱包体。5. The amount of resin impregnated in the paper tape is
It is 0.001 g / cm 3 or more and 0.1 g / cm 3 or less, The electronic component package according to claim 1, 2, 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002025920A JP4096572B2 (en) | 2002-02-01 | 2002-02-01 | Electronic parts package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002025920A JP4096572B2 (en) | 2002-02-01 | 2002-02-01 | Electronic parts package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003226393A true JP2003226393A (en) | 2003-08-12 |
| JP4096572B2 JP4096572B2 (en) | 2008-06-04 |
Family
ID=27747925
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002025920A Expired - Lifetime JP4096572B2 (en) | 2002-02-01 | 2002-02-01 | Electronic parts package |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182417A (en) * | 2004-12-28 | 2006-07-13 | Oji Paper Co Ltd | Chip type electronic component storage mount |
| JP2006182418A (en) * | 2004-12-28 | 2006-07-13 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component package |
| JP2008207878A (en) * | 2007-01-31 | 2008-09-11 | Oji Paper Co Ltd | Chip-type electronic component-storing pasteboard |
| JP2019051950A (en) * | 2017-09-13 | 2019-04-04 | 王子ホールディングス株式会社 | Paper base material for foamed heat-insulation paper container, sheet for foamed heat-insulation paper container and foamed heat-insulation paper container |
-
2002
- 2002-02-01 JP JP2002025920A patent/JP4096572B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006182417A (en) * | 2004-12-28 | 2006-07-13 | Oji Paper Co Ltd | Chip type electronic component storage mount |
| JP2006182418A (en) * | 2004-12-28 | 2006-07-13 | Shin Etsu Polymer Co Ltd | Cover tape and electronic component package |
| JP2008207878A (en) * | 2007-01-31 | 2008-09-11 | Oji Paper Co Ltd | Chip-type electronic component-storing pasteboard |
| JP2011213419A (en) * | 2007-01-31 | 2011-10-27 | Oji Paper Co Ltd | Chip-type electronic component storage pasteboard |
| TWI418500B (en) * | 2007-01-31 | 2013-12-11 | Oji Paper Co | Wafer type electronic parts storage paper seat |
| KR101419829B1 (en) * | 2007-01-31 | 2014-07-16 | 오지 홀딩스 가부시키가이샤 | Container paper board for containing electronic chips |
| JP2019051950A (en) * | 2017-09-13 | 2019-04-04 | 王子ホールディングス株式会社 | Paper base material for foamed heat-insulation paper container, sheet for foamed heat-insulation paper container and foamed heat-insulation paper container |
| JP2021176784A (en) * | 2017-09-13 | 2021-11-11 | 王子ホールディングス株式会社 | Paper base material for foamed heat-insulation paper container, sheet for foamed heat-insulation paper container, and foamed heat-insulation paper container |
| JP7117090B2 (en) | 2017-09-13 | 2022-08-12 | 王子ホールディングス株式会社 | Paper substrate for foam insulation paper container, sheet for foam insulation paper container and foam insulation paper container |
| JP7251575B2 (en) | 2017-09-13 | 2023-04-04 | 王子ホールディングス株式会社 | Paper substrate for foam insulation paper container, sheet for foam insulation paper container and foam insulation paper container |
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| Publication number | Publication date |
|---|---|
| JP4096572B2 (en) | 2008-06-04 |
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