KR20080071906A - Container paper board for containing electronic chips - Google Patents

Abstract

A paper board for receiving chip-type electronic parts is provided to restrain the chip-type electronic parts contained in a recessed part and/or taken out from the recessed part, from being polluted by naps and to prevent a suction nozzle from being stopped up by naps in taking out a chip by a mounter. A paper board is composed of paper base material and plural recessed parts formed on the paper base material to receive the chip-type electronic parts. The paper base material has the multi-layered board structure comprising surface, middle, and back layers. A surface treating agent containing water-soluble polymer permeates through the inside of the paper base material from the surface of an opening of the recessed part over the depth of 50 micrometers. Arithmetical average roughness of the surface of the opening of the recessed part is over 3 micrometers.

Description

Chip-type electronic parts storing mount {CONTAINER PAPER BOARD FOR CONTAINING ELECTRONIC CHIPS}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a chip-shaped electronic component storage mount, and more particularly, to a chip-type electronic component storage mount with less fluff and excellent moldability.

The chip type electronic component storage board of the present invention is excellent in the adhesive stability of the cover tape, and has no or very little fluffiness from the earth when the cover tape is peeled off.

The chip-like electronic component storage board is usually formed on the carrier of the chip-shaped electronic component by subjecting the cardboard sheet for earth to the following processing.

(1) The cardboard sheet for earth is cut into the tape shape of predetermined width.

(2) In the formed cardboard tape, angle holes (concave portions or through holes) and round holes (through holes) of a predetermined size are formed. Each hole is for storing a chip-shaped electronic component, and a round hole is used for shifting the mount housing the electronic component in the charger.

(3) A cover tape is adhered to the back surface (bottom side) of the earth to close the bottom opening of the rectangular through hole, thereby forming a rectangular recess. On the other hand, without forming a rectangular through hole, a rectangular embossing process may be formed on a sheet to form a rectangular recess of a predetermined size. In such a case, the step of bonding the bottom cover tape is unnecessary. In order to adhere | attach a board | substrate and a cover tape, the method of laminating | stacking a cover tape on a board | substrate, and apply | coating by applying heat and pressure on a cover tape, what is called a heat seal method is used.

(4) The chip-shaped electronic components are filled in the rectangular recesses through the openings.

(5) A cover tape is adhered to the surface (above) of the earth by the heat seal method to close the opening of the rectangular recess, and a mount containing chip electronic components is produced.

(6) The board | substrate which accommodates the said chip type electronic component is wound around the cassette reel of predetermined size, and shipped.

(7) The last user peels off the upper cover tape from the surface of the earth containing the chip-shaped electronic component and removes it, and takes out the chip-shaped electronic component stored therein from the rectangular recess.

The quality required for the storage board to be adapted for the above purposes should not (1) adversely affect the charged chip electronic components, and (2) the surface of the board should have sufficient smoothness so that the cover tapes can be adhered or peeled smoothly. And (3) have a high mechanical strength that can withstand various treatments performed on the ground.

One of the quality defects of the storage board is the occurrence of fluff from the paper layer. The fluff is composed of the inner wall surface of each hole and fine pulp fibers protruding from the ground surface when the end user peels off the cover tape. If lint is generated on the inner surface of each hole for storing electronic components and the surface of the earth when the cover tape is peeled off, it may interfere with the removal of the chip-shaped electronic components, block the suction nozzle of the mounter, or contaminate the chip-shaped electronic components. This can cause various obstacles.

In addition, when the adhesive force between the board and the cover tape is uneven, vibration occurs on the board when the cover tape is peeled off from the board, scattering electronic components from the rectangular recesses, and / or fluctuations in the storage position. Therefore, the operation of taking out the electronic parts is not smoothly performed, and the mounting efficiency is lowered.

In addition, the taping speed of the taping machine used for adhering the cover tape to the sheet has been greatly improved in recent years. With such an improvement in the taping speed, since the adhesive strength between the board and the cover tape tends to be weak, there is a great demand for a board capable of adhering the cover tape to a high adhesive strength. However, there also arises a problem that the occurrence of fluff on the surface of the earth due to the peeling of the cover tape having the increased adhesive strength increases. For this reason, although the adhesive strength with respect to a cover tape is strong, the provision of the board | substrate with which fluff does not generate | occur | produce is desired.

Until now, as a lint-free means in the inner wall surface of each hole for chip-type electronic component accommodation, Unexamined-Japanese-Patent No. 11-165786 and 10-218281 have resin which permeates resin into the inner wall surface of a through hole. A method is disclosed, and Japanese Patent Laid-Open No. 2002-53195 discloses a method of preventing the occurrence of fluff by managing the mixing ratio of coniferous and broadleaf trees and the density of paper substrate. Further, a technique for preventing lint by containing a specific resin in the surface layer is disclosed in Japanese Patent Laid-Open No. 2005-92910, and Japanese Patent Laid-Open No. 2003-226393 discloses a resin to a depth of 30 to 50 µm from the surface of the earth tape. It is disclosed that the resin impregnated layer was formed by impregnation. All of the above methods did not have sufficient lint-free effects, and did not solve the lint-free obstacles occurring in each hole.

The present invention is made of cardboard and has a plurality of recesses for accommodating a chip-shaped electronic component, wherein the occurrence of fluff on the inner wall surface of the recess for accommodating the chip-shaped electronic components is suppressed and the cover tape is peeled off from the surface of the substrate. In addition, the present invention provides a chip-shaped electronic component storage board with little or no fluff falling from the surface of the board.

The inventors of the present invention have verified the situation where a large amount of fluff occurs on the inner wall surface of the electronic component housing recess and the surface after peeling off the cover tape in the chip-shaped electronic component housing made of a conventional multilayer board. The pulp fibers are separated from the depth portion corresponding to the total value of, and the heat seal of the cover tape penetrates to fill the gaps formed between the pulp fibers in the depth portions of 40 μm to 50 μm from the surface of the earth. It confirmed that there was. The inventors also found that by increasing the interfiber bonding force from the surface of the earth to a depth beyond 50 μm, fixing the network of pulp fibers of the earth's surface layer, and leaving a gap between the pulp fibers in this portion, the inside of the recess It discovered that the fluff generation on the wall surface and the surface after peeling off the cover tape was restrained, and the present invention was reached.

The chip-shaped electronic component accommodating base of the present invention is a chip-type electronic component accommodating mat having a paper substrate and a plurality of recesses formed in the paper substrate for accommodating the chip electronic component, wherein the paper substrate is a surface layer, a middle layer and a double layer. And a surface treating agent containing a water-soluble polymer penetrating into the paper substrate over a depth of 50 μm from the opening side surface of the recess, and the recess opening side surface of the paper substrate. The center line average roughness Ra is adjusted to 3 µm or more.

In the chip-shaped electronic component housing of the present invention, the surface treatment agent has a viscosity adjusted to 10 mPa · s or less, and is preferably applied to the paper substrate with a dry coating amount of less than 1.1 g / m ² .

In the chip-shaped electronic component housing of the present invention, it is preferable that the water-soluble polymer contained in the surface treating agent is at least one selected from polyvinyl alcohol, starch and polyacrylamide.

In the chip type electronic component storage mount of the present invention, it is preferable that the surface treating agent contains a styrene maleic acid copolymer resin or an olefin maleic acid copolymer resin together with the water-soluble polymer.

In the chip-shaped electronic component housing according to the present invention, the pulp fibers forming the surface layer of the paper substrate are broadleaf kraft pulp, and the lumen width L1 / fiber width L2 is 0.4. It is preferable that it is the following.

When the recessed portion or through hole for forming the recess for forming an electronic component therein is formed therein, the chip-shaped electronic component housing according to the present invention has little or no fluff on the inner wall surface of the recess or through hole. When the cover tape covering the cover tape is peeled off from the surface of the recess opening side, there is little or no fluff on the peeling surface. Therefore, the chip-shaped electronic component storage board according to the present invention does not contaminate the chip-shaped electronic components stored in the recesses and / or taken out from the recesses by the lint, and attracted by the lint when the chips are taken out by the mounter. It has the effect of not causing clogging of the nozzle.

In the chip-like electronic component housing according to the present invention, the surface treatment agent containing a water-soluble polymer penetrates into the paper substrate to a depth of more than 50 µm from the opening side surface of the paper substrate recess, thereby forming the interposed pulp fibers constituting the paper substrate. It is important to increase the intensity. When the depth of penetration of the surface treatment agent in the paper substrate is 50 µm or less, the bonding force between the pulp fibers is insufficient, and fluff is easily generated, and the thickness of the pulp fibers distributed on the surface of the substrate is not regular. A difference occurs in the peel force. In addition, since the surface treatment agent penetrates deeper than 50 µm, the network of pulp fibers in the portion where the surface of the paper substrate has a sufficient thickness is fixed, so that the fluffs on the opening side surface of the recessed portion and the inner wall surface of the recessed portion are fixed. It can fully suppress generation | occurrence | production, and also it can fully reduce also that the peeling force between a mount and a cover tape becomes nonuniform.

Various proposals are made about the technique for making a surface treatment agent penetrate into the whole paper base material, and the technique which makes a surface treatment agent only on the surface of a paper base material. In the past, it was thought that when the treatment agent was to be penetrated deeply from the surface of the paper substrate, the penetration depth and the amount of penetration of the surface treatment agent were increased. It is also known that the surface treatment agent not only fixes the network of the pulp fibers of the ground surface portion but also fills the gaps between the fibers, whereby the adhesiveness of the cover tape is remarkably inferior. It is important to control the viscosity and composition of the surface treatment agent in order to solve the above problems, to make the penetration state of the surface treatment agent even, to reduce the variation in the adhesive strength between the earth and the cover tape, and to further improve the adhesion and peelability. In the present invention, the viscosity of the surface treatment agent is adjusted to 4 to 10 mPa · s to apply or impregnate the surface of the paper substrate, and to penetrate into the paper substrate. The penetration depth is deeper than 50 μm, preferably deeper than 55 μm, more preferably deeper than 60 μm. The deeper it is, the more preferable it is. When it exceeds 100 micrometers, the effect may be saturated and it may become economically disadvantageous. Even if the viscosity of the surface treatment agent is lowered to less than 4 mPa · s and the surface treatment agent is penetrated deeply into the paper substrate, if the required amount of the surface treatment agent is not evenly distributed in the surface treatment agent penetration portion of the paper substrate, the bond strength between fibers is increased. You can't keep it high. For this reason, it is necessary to adjust the viscosity of a surface treating agent to 4 mPa * s or more. Moreover, when the said viscosity exceeds 10 mPa * s, it will become difficult for a surface treating agent to stay in the surface part of a paper base material, and to penetrate into the paper base material to the depth exceeding 50 micrometers. The viscosity of a surface treating agent can be measured with a Brookfield viscometer. Since the permeability of the surface treating agent is greatly influenced by the viscosity, the present invention strictly manages the temperature of the surface treating agent that affects the viscosity. As the temperature at which the viscosity of the surface treatment agent is stabilized in the present invention, it is preferable to manage the treatment temperature of any surface treatment agent within the range of 40 to 70 ° C, and more preferable management temperature is 60 ° C.

Moreover, it is preferable that the application amount or impregnation amount of a surface treating agent is 0.1-1.1 g / m <^2> , More preferably, it is 0.6-1.1 g / m <^2> . If a large amount of the surface treatment agent is applied or impregnated, it may penetrate deeper than the surface of the paper substrate, depending on the viscosity. This may be economically disadvantageous, and the amount of surface treatment agent adhered on the ground surface may be excessive. Since the gap between the fibers is excessively filled, a problem may occur that causes a decrease in the adhesive strength to the cover tape.

As for the smoothness of the surface of the paper base material used by this invention, it is preferable that center line average surface roughness Ra prescribed | regulated to JISB0601 is about 3 micrometers or more. When the smoothness of the center line average surface roughness is less than 3 µm, the area where the heat seal component of the cover tape adheres to the surface of the sheet is increased, whereby the adhesive strength of the cover tape to the surface of the paper substrate becomes too high, and the cover When peeling off a tape, it becomes difficult to peel off, and the peeling force required for peeling off a cover tape increases, and the earth may generate | occur | produce vibration. Further, when the centerline average surface roughness Ra exceeds 6 µm and the smoothness of the paper base material is too low, the adhesion between the cover tape and the surface of the paper base material is too low.

The surface treating agent used by this invention contains a water-soluble polymer. As this water-soluble polymer, water-soluble polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene butadiene resin, styrene-isoprene resin, polyester resin, ethylene-vinyl acetate resin, vinyl acetate-vinyl alcohol system Resins, urethane resins, and the like, but in the present invention, those containing at least one selected from polyvinyl alcohol, starch, and polyacrylamide are used. Among these, polyvinyl alcohol, starch, and polyacrylamide can raise the adhesive strength of pulp fibers mutually at low cost efficiently, and also the coating aptitude to the earth surface is also favorable.

Among the above water-soluble high molecular materials, polyacrylamide has a hydrogen bond between the amide groups in the molecule and the hydroxyl group in the hemicellulose molecule or between the amide groups of the polyacrylamide itself, thereby increasing the number of hydrogen bonds acting between the fibers. As a result, the network bonding of the pulp fibers is strengthened, and the occurrence of fluff can be efficiently suppressed. Moreover, the surface treating agent containing the polyacrylamide of molecular weight 50,000-500,000 is easy to adjust the viscosity, and is excellent in the permeability into the inside of a paper base material. In addition, polyacrylamide having a molecular weight of 50,000 to 300,000 is particularly preferable as the surface treating agent used in the present invention because of its high permeability into a paper substrate.

It is preferable that the surface treating agent used by this invention contains styrene maleic acid copolymer resin or olefin maleic acid copolymer resin, in order to improve adhesiveness with a cover tape and to raise the strength of the earth surface. Styrene maleic acid copolymer resin and olefin maleic acid copolymer resin have both a hydrophobic group and a hydrophilic group and form a covering layer on the surface of the paper substrate by coating it on the surface of the earth and penetrate into the paper substrate layer. Carboxylic acid groups, which are hydrophilic groups, form hydrogen bonds with pulse fibers and form cross-linked states between fibers, thereby greatly improving the bond strength between fibers. By improving the bond strength between the fibers, the resistance at the time of peeling off the cover tape from the ground surface is improved, thereby enhancing the peel strength and preventing the fibers from fluffing.

Moreover, it is preferable that the glass transition temperature of styrene maleic acid copolymer resin and olefin maleic acid copolymer resin is 10-50 degreeC. When the glass transition temperature is less than 10 ° C, fibers of styrene-maleic acid copolymer resin and / or olefin-maleic acid copolymer resin are formed by forming a crosslinked state between the pulp fibers at the adhesion temperature when the cover tape is attached. Coupling force may be insufficient. In addition, when the glass transition temperature of the copolymer resin exceeds 50 ° C., the crosslinked product of the pulp fibers and the copolymer resin becomes too hard, and the ground surface is broken by the stress when peeled off from the cover tape adhesive layer land. Lint may occur on the part.

In the present invention, by appropriately adjusting the coating amount or impregnation amount of styrene-maleic acid copolymer resin or olefin-maleic acid copolymer resin, fluffing can be suppressed, and the adhesive strength between the cover tape and the earth can be obtained at a desired level. When the styrene maleic acid copolymer resin or the olefin maleic acid copolymer resin is mixed and applied to the surface treatment agent, the solid content ratio with the water-soluble polymer can be appropriately adjusted, but the styrene maleic acid copolymer resin or the olefin maleic acid air is used. It is preferable that the application amount or impregnation amount of copolymer resin exists in the range of 0.01-0.10 g / m <^2> . If the coating amount or impregnation amount of styrene maleic acid copolymer resin or olefinic maleic acid copolymer resin exceeds 0.10 g / m ² , the effect may be saturated, and if it is less than 0.01 g / m ² , the effect may be It may not be expressed clearly.

In the chip-like electronic component housing of the present invention, as a means for applying or impregnating a surface treatment agent on the surface of the earth, for example, a bar coater, a blade coater, an air knife coater Rod coater, gate roll coater, roll coater such as sizepress or calender coater, bill blade coater, bell-barpa Coater (Bel-Bapa coater) etc. can be used. Among them, the size press and the calender coater can penetrate the surface treatment agent deeply into the paper substrate by nip pressure, and thus are preferably used in the present invention.

The kind of raw material pulp for forming the paper substrate for chip type electronic component storage device of the present invention is not particularly limited as long as it can improve the permeability of the surface treating agent and adjust the smoothness of the surface within a specific range. That is, as the paper substrate forming pulp, for example, chemical pulp (leafwood, softwood), mechanical pulp, old paper pulp, non-wood fiber pulp, synthetic pulp and the like can be used. These pulps may be used singly or in combination of several kinds.

In the present invention, it is important to penetrate the surface treatment agent into the paper substrate up to a penetration depth of more than 50 mu m from the surface thereof, and a paper substrate formed using the above-mentioned various pulp can be used as long as the penetration depth exceeds 50 mu m. However, in order to make the gap structure of the surface layer of the paper substrate uniform and to make the penetration of the surface treating agent quick and uniform, it is preferable to use a paper substrate formed of broad-leaved bleached kraft pulp (LBKP). In the conventional land, a paper substrate containing about 30% of conifer bleached kraft pulp is used. However, in the present invention, the conifer bleached kraft pulp has a wide fiber width and prevents the smooth penetration of the surface treatment agent. It is preferable to use a paper base material of% or less, more preferably a paper base material containing no conifer bleached kraft pulp.

In order to improve the permeability of the surface treatment agent on the surface of the paper substrate for land, the ratio of L1 / L2 of lumen width (L1) / fiber width (L2) to the broadleaf bleached kraft pulp (LBKP) included in the surface layer is It is preferable that it is a pulp fiber of 0.40 or less. The lower the L1 / L2 ratio is, the more uniform the dimensional dimension of the pulp fibers becomes, and as a result, the gap between the pulp fibers forming the network becomes uniform, and the permeability of the surface treatment agent can be improved. If pulp fibers having an L1 / L2 ratio greater than 0.4 are contained in the paper substrate, the pulp fibers having a wider fiber width may prevent the penetration of the surface treatment agent. On the other hand, pulp fibers with a high L1 / L2 ratio are generally considered to have strong interfiber bonds and poor lint, which is a tendency when no surface treatment agent is used, and when the surface treatment agent is applied as in the present invention. Since the effect of improving the bonding strength of the pulp fibers by the surface treatment agent is remarkably high, the effect of enhancing the bonding strength between the fibers and the anti- fluff effect by using the pulp fibers having high L1 / L2 is weak. In addition, when the L1 / L2 ratio is 0.40 or less, the elastic modulus of the paper substrate surface layer is increased, and the peeling strength when the cover tape is peeled off from such a paper substrate is appropriate. As pulp having an L1 / L2 value of 0.40 or less, eucalyptus wood and acacia pulp may be used, and eucalyptus wood includes Grandis, Saligna, globulus material, and the like. And acacia ash includes meransii ash. The pulp produced in this kind has a content of short fibers (called a fine powder) having a number average fiber length of 0.1 mm or less by measuring the fiber length distribution of Kayanisa, which is 10% or less. Small is also effective for promoting penetration of surface treatment agents.

There is no particular limitation on the manufacturing apparatus and manufacturing conditions for manufacturing the chip-shaped electronic component accommodating device of the present invention, and by using a conventionally known manufacturing apparatus, it is possible to manufacture the product of the present invention by selecting suitable manufacturing conditions. For example, using a papermaking machine or a papermaking machine, the multi-layered paper substrate for land of the present invention can be papered by a multi-layer superpolymerization method, and the above-mentioned internal additive method is used for the surface layer. Or desired additives can be added by the external method by a coater.

Various internal additives can be added to the multilayered paper base material used for this invention as needed. For example, natural and synthetic internal additives for papermaking, such as rosin-based sizing agents, alkylketene dimers, alkenyl anhydrides and the like, and various intensifiers, Yeosu yield improvers, polyamide polyamine epichlorohydrin, and the like. Water-repellents, antifoaming agents, fillers such as talc, dyes and the like.

In addition, in order to improve the adhesiveness to the bottom tape on the back surface of the paper substrate and the anti-slip effect in the earth of the present invention, polyvinyl alcohol, starch, polyacrylamide, acrylic resin, styrene-butadiene resin, At least one selected from styrene-isoprene-based resin, polyester-based resin, ethylene-vinyl acetate-based resin, vinyl acetate-vinyl alcohol-based resin, urethane-based resin and the like may be appropriately applied. Moreover, as a coating means of the said back coating agent, a bar coater, a blade coater, an air knife coater, a rod coater, a roll coater (for example, a gate roll coater, a size press, a calendar coater, etc.), a bill blade coater, etc. , Or a bell-barpa coater can be used.

The basis weight of the chip-shaped electronic component accommodating base of the present invention is determined according to the dimensions of the chip-type electronic component accommodated in the mount, and it is generally preferred to be about 200 to 1000 g / m ² . As a papermaking method of a paper base material having a basis weight within such a range, it is preferable to use a multilayer paper making it easy to adapt to a desired basis weight. It is preferable that the surface layer which permeates the surface treating agent containing a water-soluble polymer in the earth of this invention is formed in the basis weight in 50-150g / m <^2> range.

(Example)

The invention is described in detail in accordance with the following examples. However, the scope of the present invention is not limited by these. In addition, the numerical value which shows mix | blending, a density | concentration, etc. is a numerical value based on the mass of solid content or an active ingredient. In addition, in all the examples, the paper freted was subjected to pretreatment according to the description of JIS P8111, and then the following matters were measured. The measurement conditions of these items are as follows.

<Method of Measuring Surface Penetration Depth (1)>

A surface treating agent containing 2% of a fluorescent dye (Kahahor PBS Liquid, manufactured by Nihon Kayaku Co., Ltd.) was applied to the ground using a predetermined method, and the surface treating agent in the cross-section of the ground was fluorescence-colored, and the penetration depth was measured under a microscope. It was.

<Method for Measuring Penetration Depth of Surface Treatment Agent (2)>

Vertical sections of the samples were prepared by ultramicrotomy, and the obtained sections were measured by brown rice ATR imaging. Spotlight 300 (available from Perkin Elmer) as a brown rice ATR imaging device, Ge crystal used, resolution 8 cm ^-1 , pixel size square 1.56 µm, integration count twice, measurement wavelength area 4000-680 cm ^-1 , measurement area 200 The penetration depth of the surface treating agent was measured under the condition of 占 150 占 퐉 (128 占 96 pixels).

<Method of Measuring Surface Penetration Depth (3)>

A vertical section of the sample was prepared with a vertical slicer, and 10 µl of iodine / acetic acid acetone solution (0.1% iodine, saturated boric acid) was dropped on the cross section, and color development was observed, and the penetration depth of polyvinyl alcohol was measured.

<Measurement depth of surface treatment agent (4)>

A vertical section of the sample was prepared with a vertical slicer, 1% iodine solution was placed in a beaker, and the cross section was faced downward on the opening surface of the beaker and heated to 100 ° C. At this time, the color depth of the cross section was observed and the penetration depth of starch was measured.

<Smoothness measurement condition>

Using a two-dimensional surface roughness gauge (Surcoder SE-3C, manufactured by Kenkyu-sho, Kosaka, Japan), the centerline average surface roughness Ra of the published paper substrate or the recessed opening side surface (surface in contact with the cover tape) of the sheet was measured. .

<Measuring viscosity>

The viscosity of the surface treating agent was measured using a type B viscometer. The type B viscometer can express the viscosity of a liquid by measuring the viscous resistance torque of the liquid acting on a cylinder / disk when the cylinder or disk is rotated in the liquid.

<Measurement of peeling strength>

The board | substrate which accommodates a chip-shaped electronic component was cut | disconnected in the shape of a tape of 8 mm width, and the pocket recessed part corresponding to condenser chip size 0603 was formed by press molding according to the Japan Electronic Information Technology Industry Association standard JEITA ET-7103. Coextrusion laminate film of Nitto Denko Co., Ltd. cover tape (No.318H-14A (trademark), polyethylene terephthalate (PET) and ethylene vinyl acetate ester copolymer (EVA)) as cover tape: width 5.25mm, thickness 53㎛ ), Using a heat seal (trademark: NST-35) manufactured by Nitto Kogyo Co., Ltd., using a cover tape under a condition of a heat seal temperature of 155 ° C and a heat seal pressure of 1.5 MPa and 3800 takt time according to the sample. The cover tape was heat-sealed on the ground surface in a rail shape of 0.4 mm in width and 3.0 mm in interval from 0.5 mm inward from the covered side edge. Subsequently, after about 1 hour, the peel strength of the ground surface and the cover tape was measured by a method (peel speed 300 mm / min, measurement time 12 seconds, 10 specimens n) in accordance with JIS C 0806-3. The average value of the measured values was calculated | required.

<Lint Prevention>

Visually confirm the state of occurrence of fluff in the heat seal after measuring the peel strength.

4: There was no fluff on the observation surface.

3: 1-3 fluffs were observed on the observation surface.

2: 4-8 fluffs were observed on the observation surface.

1: Fluff was observed throughout the observation surface.

Examples 1 and 2

In each of Examples 1 and 2, the surface layer, the middle layer, and the double layer of the paper substrate were formed from different pulp. That is, 100% of LBKP was beaten for surface layer, and pulp of 400 ml of Canadian standard type Yeosu was prepared. At this time, the L1 / L2 ratio was 0.34. For the middle layer, the mixture was beaten with a blend of 20% NBKP and 80% LBKP, and a pulp of 350 ml of Canadian standard type Yeosu was prepared. A sulfuric acid band was added to each pulp slurry to adjust the pH to 6.0, and 0.3% of polyacrylamide (Arakawa Kagaku Kogyo, Polystron 1250) was added as an internal anti-improving agent. The basis weight of the pulp slurry to become each stage Glauber's salt to the surface layer of 100g / m ^2, the intermediate 200g / m ^2, and Second calender to prepare a 50g / m ^2, and propelled by a second polymerization, is installed on the paper machine to the three-layer sheet thus obtained After the smoothing treatment, a coating solution containing a surface treatment agent made of polyacrylamide (Arakawa Kagaku Kogyo Co., Polymer Set-512 (trademark), molecular weight 200,000) was used in Example 1 at a temperature of 60 ° C. and a surface treatment agent concentration. 3.6% and a viscosity of 6 mPa · s were prepared. In Example 2, a surface treatment agent concentration of 5.0% and a viscosity of 8 mPa · s were prepared, and the coating solution was applied to the base paper. The coating amount was 0.72 g / m ^{2 in} Example 1, 1.00 g / m ² in Example ² , and the paper substrates for chip-shaped electronic component housings having a basis weight of 350 g / m ² and a thickness of 0.42 mm in both Examples 1 and 2. . At this time, the penetration depth (penetration depth measuring method (2)) of the surface treatment agent was 63 micrometers in Example 1, and 52 micrometers in Example 2. Fluorescent dye (Kayahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was blended with 2% of the surface treating agent coating liquid as described above, and the penetration depth measured by fluorescence was measured. In Example 2, the thickness was 55 m. In addition, the surface center line average roughness Ra of the obtained paper base material was 3.35 micrometers in Example 1, and was 3.22 micrometers in Example 2. As shown in FIG.

In each of Examples 1 and 2, the obtained paper substrate was cut into a tape shape having a width of 8 mm, and simultaneously formed the following chip type electronic component accommodating recesses and earth feed round holes (transmission holes) according to JIS C 0806-3. The chip-shaped electronic component storage mount was manufactured.

(1) formation of storage recesses

Formation of recesses: An embossing machine (manufactured by Nippon Automating Machine, Model AC505S) and a die (Nihon Automerching Machine, Model 0603) were used.

Concave shape dimension: CD direction: 0.66mm

                  MD direction: 0.36mm

                  Depth: Square, press pocket with bottom of 0.35 mm

(2) Circular through hole for earth movement: Through hole with a diameter of 1.55 mm

Example 3

In the same manner as in Examples 1 and 2, a chip-shaped electronic component storage mount having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, the surface coating agent coating liquid is polyacrylamide (Arakawa Kagaku Kogyo Co., Polymer Set-512 (trademark), molecular weight 200,000), and styrene-maleic acid copolymer resin (Arakawa Kagaku Kogyo Co., Polymerron-382 ( Trademark)) was mixed at a solid content mass ratio of 100: 4, the surface treatment agent coating liquid was adjusted to a temperature of 60 DEG C, a surface treatment agent concentration of 4.8%, and a viscosity of 7 mPa · s, and this was applied to the base paper. At this time, the coating amount was 0.92 g / m <^{2> of} polyacrylamide solid content and 0.04 g / m <^2> of styrene-maleic acid copolymer resin solid content. The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 77 micrometers. 2% of a fluorescent dye (Kahahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, and the measured value of the penetration depth was 80 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 3.41 micrometers.

Example 4

In the same manner as in Example 3, a chip type electronic component accommodating mount was manufactured. However, instead of styrene-maleic acid copolymer resin, an olefin maleic acid copolymer resin (Arakawa Kagaku Kogyo, Polymerron-482 (trademark)) is used as the surface treating agent coating liquid, and the temperature is applied to the surface treating agent coating liquid. A coating liquid having a temperature of 60 ° C., a surface treatment agent concentration of 46%, and a viscosity of 7 mPa · s was used. At this time, the coating amount was 0.89 g / m ² for the polyacrylamide and 0.04 g / m ² for the olefin maleic acid copolymer resin. The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 72 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark), manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 75 µm. In addition, the center line average roughness Ra of the obtained paper base material was 3.40 micrometers.

Example 5

In the same manner as in Example 3, a chip type electronic component accommodating mount was manufactured. However, polyvinyl alcohol (PVA117 made by Claressa) and styrene-maleic acid copolymer resin (made by Arakawa Kagaku Kogyo, Polymerron-382 (trademark)) were applied to the surface treating agent coating solution. Using the mixture of 4, using the surface treating agent coating liquid, the coating liquid of temperature 60 degreeC, the surface treating agent density | concentration 4.5%, and a viscosity of 7 mPa * s was produced, and this was apply | coated to the said base paper. At this time, the coating amount was 0.86 g / m ^{2 for} polyvinyl alcohol and 0.04 g / m ² for styrene-maleic acid copolymer resin. The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 73 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark), manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 75 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 3.16 micrometers.

Example 6

In the same manner as in Example 1, a chip-shaped electronic component storage mount having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, using polyvinyl alcohol (CVA Corporation PVA117 (trademark)) as a surface treating agent for coating liquid, the coating liquid of temperature 60 degreeC, polyvinyl alcohol concentration 3.7%, and a viscosity of 7 mPa * s was prepared, and this was apply | coated to the base paper. . At this time, the coating amount was 0.75 g / m ² with respect to polyvinyl alcohol. The penetration depth of the surface treatment agent was measured by the measuring method (2), and the penetration depth was 55 micrometers. In addition, the center line average roughness Ra of the obtained paper base material surface was 3.30 micrometers.

Example 7

In the same manner as in Example 1, a chip-shaped electronic component storage mount having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, using a starch (Oji Co., Ltd., Oji Ace K (trademark)) as a surface treatment agent, the coating liquid of color temperature 60 degreeC, starch concentration 4.2%, and a viscosity of 7 mPa * s was prepared, and this was apply | coated to the base paper. . At this time, the coating amount was 0.70 g / m ² with respect to the starch. It was 53 micrometers when the penetration depth was measured by the measuring method (4). In addition, the center line average roughness Ra of the obtained paper base material surface was 3.25 micrometers.

Comparative Example 1

In the same manner as in Example 2, a chip type electronic component accommodating mount was manufactured. However, 100% of LBKP different from the LBKP used in Example 2 was beaten, and 400 ml of surface standard pulp of Canadian standard Yeosu was prepared. At this time, the L1 / L2 ratio was 0.45. The coating amount of the surface treating agent was 0.95 g / m ² . The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 38 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 40 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 2.93 micrometers.

Comparative Example 2

In the same manner as in Example 1, a chip type electronic component accommodating mount was manufactured. However, using a polyacrylamide (Arakawa Kagaku Kogyo Co., Polymer Set-512 (trademark), molecular weight 200,000) as a surface treatment agent, the coating liquid of temperature 20 degreeC, polyacrylamide concentration 3.6%, and a viscosity of 11 mPa * s was used. It produced and apply | coated to the base paper. The coating amount was 0.60 g / m ² . The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 37 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 40 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 2.80 micrometers.

Comparative Example 3

In the same manner as in Example 3, a chip type electronic component accommodating mount was manufactured. However, in preparing the pulp for surface layer, 100% of LBKP different from Example 3 was beaten and 400 ml of Canadian standard type free water was prepared. At this time, the L1 / L2 ratio was 0.45. Polyacrylamide (Arakawa Kagaku Kogyo Co., Polymer Set-512 (trademark), molecular weight 200,000) and styrene maleic acid copolymer resin (Arakawa Kagaku Kogyo Co., Polymerron-382 (trademark)) as surface treatment agents And the mixture was used at a solid content ratio of 100: 4 to prepare a coating solution having a temperature of 60 ° C., a surface treatment agent concentration of 4.8%, and a viscosity of 7 mPa · s, which was applied to a base paper. The coating amount at this time was 0.90 g / m ² with respect to polyacrylamide, and 0.04 g / m ² with respect to styrene-maleic acid copolymer resin. The penetration depth (penetration depth measuring method (2)) of this surface treating agent was 45 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 48 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 2.89 micrometers.

Comparative Example 4

In the same manner as in Example 3, a chip type electronic component accommodating mount was manufactured. However, polyacrylamide (Arakawa Kagaku Kogyo Co., Polymer Set-512 (trademark), molecular weight 200,000) and styrene maleic acid copolymer resin (Arakawa Kagaku Kogyo Co., Polymerron-382 (trademark)) as surface treating agents ), A coating solution having a surface treatment agent concentration of 6.0% and a viscosity of 11 mPa · s was prepared using a mixture of a solid content ratio of 100: 4, and this was applied to a base paper. The coating amount at this time was 1.11 g / m ² with respect to polyacrylamide, and 0.04 g / m ² with respect to styrene-maleic acid copolymer resin. The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 38 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark) manufactured by Nihon Kayaku Co., Ltd.) was added to the coating solution for the surface treatment agent as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 40 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 2.78 micrometers.

Comparative Example 5

The surface layer, the middle layer, and the double layer of the paper base were formed from different pulp. That is, for the surface layer, NBKP 30% and LBKP 70% were mixed and beaten, and pulp having 400 ml of Canadian standard freeness was used. At this time, the L1 / L2 ratio of LBKP was 0.34. For the middle layer, pulp with a Canadian standard freeness of 350 ml was used in a combination of 20% NBKP, 20% LBKP, 20% fine paper and 40% newspaper. For the second layer, pulp having a Canadian standard freeness of 350 ml was prepared by combining NBKP 25%, LBKP 25%, and newspaper paper 50%. The sulfuric acid band was added to the pulp slurry for each layer, the pH value was adjusted to 6.0, and 0.3% of polyacrylamide (Arakawa Kagaku Kogyo, Polystron 1250) was added as an internal strength enhancer. After each obtained pulp slurry was monolayered paper machine, the surface layer 100g / m ² , the middle layer 200g / m ² , and the double layer 500g / m ² were combined to form a base paper, and after this, a smoothing treatment was performed using a calender installed on the paper machine. Polyacrylamide (Arakawa Kagaku Kogyo, PS117, molecular weight 400,000) and styrene maleic acid copolymer resin (Arakawa Kagaku Kogyo, Polymerron-382 (trademark)) are mixed in a ratio of 100: 2 as a surface treatment agent. The coating liquid having a coating liquid temperature of 20 ° C., a surface treatment agent concentration of 4.8%, and a viscosity of 11 mPa · s was prepared using the same, and this was applied to a base paper. The coating amount at this time was 0.88 g / m ² with respect to polyacrylamide and 0.02 g / m ² with respect to styrene-maleic acid resin. The penetration depth (penetration depth measuring method (2)) of the surface treating agent at this time was 42 micrometers. When 2% of a fluorescent dye (Kahahor PBS Liquid (trademark), manufactured by Nihon Kayaku Co., Ltd.) was added to the coating agent coating solution as described above, and the penetration depth by fluorescence was measured, the measured value of the penetration depth was 45 µm. In addition, the center line average roughness Ra of the obtained paper base material surface was 2.97 micrometers.

Table 1 shows the results of measuring the L1 / L2 ratio, the concentration of the surface treatment agent, the viscosity, the penetration depth, the centerline average roughness (Ra), the smoothness, the peeling strength and the fluff occurrence state of the paper substrates of the Examples and Comparative Examples.

In Table 1, PAA is polyacrylamide, SM is styrene-maleic acid copolymer resin, OM is olefin-maleic acid copolymer resin, PVA is polyvinyl alcohol, and L1 / L2 is a broadleaf bleached kraft pulp. It is the ratio of lumen width L1 / fiber width L2.

As apparent from Table 1, it was confirmed that the chip-shaped electronic component storage strips of Examples 1 to 7 according to the present invention have a feature that no fluff occurs even though the peel strength is strong. When the cover tape for closing the opening of the electronic component accommodating part is peeled off therefrom, the chip-shaped electronic component accommodating base of the present invention has no or little fluff, and thus the chip electronic component accommodated in the recess is There is an effect that the problem of clogging of the suction nozzle by the fluff does not occur when the chip is taken out by the mounter without being contaminated.

Since the chip-shaped electronic component storage board of the present invention does not contaminate the electronic components by the fluff generated therefrom and does not block the suction nozzle of the mounter, it has a high practical effect.

Claims (5)

A chip-shaped electronic component storage mount having a paper substrate and a plurality of recesses formed in the paper substrate for accommodating the chip electronic component, The paper substrate has a multi-layered cardboard structure including a surface layer, a middle layer and a two layer, and a surface treatment agent containing a water-soluble polymer penetrates into the paper substrate beyond a depth of 50 μm from the opening side surface of the recess, and the paper substrate The center line average roughness Ra of the said recess opening side surface of the said chip-shaped electronic component storage board | substrate characterized by the above-mentioned. The method of claim 1, And the surface treatment agent has a viscosity adjusted to 10 mPa · s or less and is applied to the paper substrate with a dry coating amount of less than 1.1 g / m ² . The method according to claim 1 or 2, The chip type electronic component storage mount of which the water-soluble polymer contained in the said surface treating agent is at least 1 sort (s) chosen from polyvinyl alcohol, starch, and polyacrylamide. The method according to claim 1 or 2, The said surface treating agent contains a styrene maleic acid copolymer resin or an olefin maleic acid copolymer resin with the said water-soluble polymer, The chip type electronic component storage mount. The method of claim 1, The pulp fibers forming the surface layer of the paper base are broadleaf kraft pulp, wherein the lumen width (L1) / fiber width (L2) ratio is 0.4 or less.